A dual fluid nozzle and substrate processing apparatus

Abstract

The application discloses a double-fluid nozzle and a substrate processing device. The double-fluid nozzle comprises a liquid outlet body, a first buffer arranged on a first extension, a plurality of flow channels arranged on the first buffer, and a shell with a liquid outlet, which is sleeved on the liquid outlet body. The inner wall of the shell, the end of the liquid outlet body, the end of the first buffer, and the side wall of the first extension form a buffer space, which is used for gathering the fluid in the second pipeline to slow down the flow rate. The substrate processing device comprises the double-fluid nozzle, a supporting part, and a supply part. The supporting part is used for supporting a wafer. The double-fluid nozzle sprays fluid to the wafer. The supply part comprises a supply device, a first supply pipeline, and a second supply pipeline. One end of the first supply pipeline is communicated with the supply device, and the other end is communicated with the first pipeline. One end of the second supply pipeline is communicated with the supply device, and the other end is communicated with the second pipeline. The application can increase the droplet formation speed and reduce the damage to the wafer surface.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a double-fluid nozzle and a substrate processing apparatus. BACKGROUND

[0002] In the manufacturing process of semiconductor devices, a double-fluid nozzle is often used to clean the surface of a wafer. The double-fluid nozzle uses a liquid droplet jet formed by mixing gas and liquid to impact the surface of the wafer, and the impurities such as particles attached to the surface of the wafer are physically removed by the kinetic energy of the liquid droplets. Compared with brushing and ultrasonic cleaning, the double-fluid nozzle causes less damage to the surface of the substrate, and is therefore widely used in cleaning substrates with fine patterns.

[0003] To increase the effective removal rate of particles on the surface of the substrate, one can first consider increasing the gas flow rate input to the double-fluid nozzle to increase the volume median diameter of the liquid droplets ejected from the double-fluid nozzle. However, when the input gas flow rate is increased, the velocity of the formed liquid droplets increases, causing increased damage to the patterns on the surface of the substrate and reduced yield.

[0004] Therefore, it is necessary to provide a new double-fluid nozzle and a substrate processing apparatus to solve the above problems existing in the prior art. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a double-fluid nozzle and a substrate processing apparatus capable of increasing the formation speed of liquid droplets while reducing damage to the surface of the wafer.

[0006] To solve the above technical problem, according to an embodiment of the present application, a double-fluid nozzle is provided, comprising a liquid outlet body, the end of the liquid outlet body having a first extension; a first pipeline and a second pipeline are formed on the liquid outlet body, the first pipeline penetrating through the liquid outlet body and the first extension, and the second pipeline penetrating through the liquid outlet body;

[0007] a first buffer member is arranged on the outer wall of the first extension, and a plurality of flow-through channels are formed on the first buffer member;

[0008] a housing having a liquid outlet, the housing being sleeved on the liquid outlet body, and the inner wall of the housing abutting against the side wall of the first buffer member; the inner wall of the housing, the end of the liquid outlet body, the end of the first buffer member, and the side wall of the first extension surround a buffer space, the buffer space being in communication with the second pipeline, the buffer space being used to accumulate the fluid in the second pipeline to slow down the flow rate, and the fluid in the buffer space mixes with the liquid of the first pipeline after flowing through the flow-through channels and is discharged through the liquid outlet.

[0009] A substrate processing apparatus comprises a double-fluid nozzle, a carrying part, and a supply part.

[0010] The bearing part is used for bearing a wafer;

[0011] The double-fluid nozzle is arranged corresponding to the bearing part to spray fluid to the wafer on the bearing part;

[0012] The supply part comprises a supply device, a first supply pipeline and a second supply pipeline, one end of the first supply pipeline is communicated with the supply device, and the other end is communicated with the first pipeline; one end of the second supply pipeline is communicated with the supply device, and the other end is communicated with the second pipeline.

[0013] By adopting the above technical scheme, the first buffer member is arranged on the double-fluid nozzle, the gas flowing through the second pipeline directly contacts the first buffer member, and is discharged through the flow passage on the first buffer member, so that the flow rate of the fluid flowing through the second pipeline and the impact force on the wafer surface are reduced. Meanwhile, the buffer space is formed between the shell and the liquid outlet body, the fluid flowing through the second pipeline first enters the buffer space, the buffer space has a certain buffering effect, cooperates with the first buffer member, reduces the flow rate of the fluid flowing through the second pipeline and the impact force on the wafer, and thus the damage to the pattern on the wafer surface is reduced.

[0014] According to the embodiment of the present application, the bottom of the first buffer member is provided with a converging ring groove, and the flow passage is communicated with the converging ring groove, so that the fluid in the plurality of flow passages converges in the converging ring groove and is discharged through the liquid outlet.

[0015] According to the embodiment of the present application, the bottom of the first buffer member has a first boss, the first boss has a first plane and a first inclined surface, and the two ends of the first inclined surface respectively extend to the first plane and the side wall of the first buffer member; the first plane is used to open the converging ring groove, and the first inclined surface abuts against the inner wall of the shell.

[0016] The flow passage penetrates the first plane and the first inclined surface, so that part of the fluid is blocked by the shell and then enters the converging ring groove.

[0017] According to the embodiment of the present application, the top of the first buffer member has a second boss, the second boss has a second plane and a second inclined surface, and the two ends of the second inclined surface respectively extend to the second plane and the side wall of the first buffer member; one side of the flow passage penetrates the side wall of the first buffer member, and the other side extends to the second plane, so that the flow passage is arranged obliquely.

[0018] According to the embodiment of the present application, the top of the flow channel penetrates the second slope; the flow channel comprises a first wall, which is arranged obliquely and extends from the second planar edge to the first planar middle part, so that fluid enters the flow channel from the second slope, part of the fluid in the flow channel enters the converging ring groove from the top of the converging ring groove, and part of the fluid enters the converging ring groove from the side of the converging ring groove.

[0019] According to the embodiment of the present application, the inner wall of the shell comprises a first vertical section, an oblique section and a second vertical section; the interval between the first vertical section and the side wall of the first extension is defined as a first interval, and the interval between the second vertical section and the side wall of the first extension is defined as a second interval; the first interval is greater than the second interval; the oblique section is arranged obliquely and connects the first vertical section and the second vertical section, and is used to block fluid to slow down the flow rate of the fluid.

[0020] According to the embodiment of the present application, a second buffer is further included, which is arranged on the side wall of the first extension, and a third interval is provided between the second buffer and the first vertical section to pass fluid; the top wall of the second buffer is arranged obliquely, so that the fluid flowing through the second pipeline is blocked by the second buffer and flows to the third interval; the fluid flowing through the third interval is blocked by the oblique section and flows to the flow channel.

[0021] According to the embodiment of the present application, a second buffer is further included, which is arranged on the side wall of the first extension, and the side wall of the second buffer is attached to the first vertical section; a plurality of buffer holes are provided on the second buffer to pass fluid.

[0022] According to the embodiment of the present application, a control part is further included, which comprises:

[0023] A lifting mechanism is connected with the double-fluid nozzle to drive the double-fluid nozzle to move;

[0024] A rotating mechanism is connected with the bearing part to drive the bearing part to rotate. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a sectional view of a main body of a double-fluid nozzle according to an embodiment of the present application;

[0026] Figure 2 It is a sectional view of a main body of a double-fluid nozzle according to an embodiment of the present application; Figure 1 It is an enlarged view of part A in the middle;

[0027] Figure 3 It is a partial sectional view of a structure when a buffer hole is arranged on a second buffer according to an embodiment of the present application;

[0028] Figure 4 A first buffer body structure schematic view of an embodiment of the present application;

[0029] Figure 5 A first buffer body structure bottom view of an embodiment of the present application;

[0030] Figure 6 A first buffer flow channel first wall inclination direction schematic view of an embodiment of the present application;

[0031] Figure 7 A substrate processing device body structure schematic view of an embodiment of the present application.

[0032] Reference signs:

[0033] 100, liquid outlet body; 110, first extension; 120, first pipeline; 130, second pipeline; 140, buffer space; 200, first buffer; 210, flow channel; 211, first wall; 220, converging ring groove; 230, first boss; 231, first plane; 232, first inclined surface; 240, second boss; 241, second plane; 242, second inclined surface; 300, shell; 310, liquid outlet; 320, first vertical section; 330, inclined section; 340, second vertical section; 400, second buffer; 410, buffer hole; 500, bearing part; 510, support; 520, bearing; 600, supply device; 610, first supply pipeline; 620, second supply pipeline; 630, first supply; 640, second supply; 700, lifting mechanism; 800, rotating mechanism. DETAILED DESCRIPTION

[0034] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as their common meanings to those of ordinary skill in the art to which the present application belongs. The words such as “comprise” and similar words used herein mean that the elements or objects before the words encompass the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0035] The accompanying drawings are referred to, and Figures 1-7 The specific embodiments of the present application are further described in detail.

[0036] Embodiments of the present application provide a double-fluid nozzle for wafer processing, wherein the double-fluid nozzle is used for spraying a chemical liquid to a wafer surface during wafer processing, and the double-fluid nozzle comprises a liquid outlet body 100, an end of the liquid outlet body 100 is provided with a first extension 110; a first pipeline 120 and a second pipeline 130 are arranged on the liquid outlet body 100, the first pipeline 120 penetrates through the liquid outlet body 100 and the first extension 110, and the second pipeline 130 penetrates through the liquid outlet body 100;

[0037] A first buffer 200 is arranged on an outer wall of the first extension 110, and a plurality of flow-through channels 210 are arranged on the first buffer 200;

[0038] A shell 300 is provided with a liquid outlet 310, the shell 300 is sleeved on the liquid outlet body 100, and an inner wall of the shell 300 abuts against a side wall of the first buffer 200; an inner wall of the shell 300, an end of the liquid outlet body 100, an end of the first buffer 200 and a side wall of the first extension 110 surround to form a buffer space 140, the buffer space 140 is communicated with the second pipeline 130, the buffer space 140 is used for gathering fluid in the second pipeline 130 to slow down the flow rate, the fluid in the buffer space 140 is mixed with the liquid in the first pipeline 120 after flowing through the flow-through channels 210, and is discharged through the liquid outlet 310.

[0039] In some embodiments, the end of the liquid outlet body 100 is provided with the first extension 110, wherein a cross section of the liquid outlet body 100 can be circular or polygonal, which is not limited herein, and only a circular cross section is taken as an example; a cross section of the first extension 110 can be circular or polygonal, which is not limited herein, and only a circular cross section is taken as an example; the liquid outlet body 100 and the first extension 110 are coaxially arranged, and a connection mode between the liquid outlet body 100 and the first extension 110 can be adhesion, welding or one-piece forming, which is not limited herein, and fixed connection between the liquid outlet body 100 and the first extension 110 is taken as a main mode.

[0040] In some embodiments, the first pipeline 120 penetrates the liquid outlet body 100 and the first extension 110 along the axial direction of the liquid outlet body 100, with one end for liquid inlet and the other end for liquid outlet; in this case, the end of the first pipeline 120 for liquid inlet is defined as the top end of the liquid outlet body 100, and the end of the first pipeline 120 for liquid outlet is defined as the bottom end of the liquid outlet body 100; at the same time, the first pipeline 120 is coaxially arranged with the liquid outlet body 100, so that the first pipeline 120 can penetrate the liquid outlet body 100 and the first extension 110 at the same time; the axial line of the second pipeline 130 is parallel to the axial line of the first pipeline 120, and at the same time, the second pipeline 130 is eccentrically arranged on the liquid outlet body 100, so that the second pipeline 130 can only penetrate the liquid outlet body 100; since the first pipeline 120 and the second pipeline 130 are parallel, the liquid inlet ends of both are located at the top end of the liquid outlet body 100, so that when the liquid inlet is connected by a pipeline, the pipeline can be directly connected to the top end of the liquid outlet body 100, instead of being connected to the side wall of the liquid outlet body 100, thereby saving installation space.

[0041] In some embodiments, the outer wall of the first extension 110 is provided with a first buffer 200, which can be arranged by bonding, clamping or one-piece forming, etc., and is not limited here, as long as the first buffer 200 and the first extension 110 do not move relative to each other. A plurality of flow-through channels 210 are formed in the first buffer 200, which can pass through the fluid.

[0042] In some embodiments, the double-fluid nozzle further comprises a housing 300, which is sleeved on the bottom end of the liquid outlet body 100, and the bottom end of the housing 300 has a liquid outlet 310, so that the fluid flowing through the liquid outlet body 100 can be discharged through the liquid outlet 310. Specifically, the inner wall of the housing 300 abuts against the inner wall of the first buffer 200, so that the inner wall of the housing 300, the end of the liquid outlet body 100, the end of the first buffer 200 and the side wall of the first extension 110 surround to form a buffer space 140. That is, the fluid flowing through the first pipeline 120 is directly discharged through the liquid outlet 310, and the fluid flowing through the second pipeline 130 first enters the buffer space 140, and then flows through the flow-through channels 210 and is discharged through the liquid outlet 310. Among them, the fluid can be gathered in the buffer space 140, so as to slow down the flow rate. More specifically, the fluid flowing through the first pipeline 120 is liquid, and the fluid flowing through the second pipeline 130 is gas. By reducing the flow rate of the gas in the buffer space 140, the flow rate of the gas discharged from the liquid outlet 310 is reduced, so as to reduce the impact of the gas on the surface of the wafer.

[0043] The bottom of the first buffer 200 is provided with a converging ring groove 220, and the flow-through channels 210 are in communication with the converging ring groove 220, so that the fluid in the plurality of flow-through channels 210 converges in the converging ring groove 220 and is discharged through the liquid outlet 310.

[0044] In some embodiments, the bottom of the first buffer 200 is provided with a converging ring groove 220, and the flow passage 210 communicates with the converging ring groove 220, so that the fluid in the plurality of flow passages 210 can converge in the converging ring groove 220, thereby further reducing the flow rate of the fluid, and after the fluid converges in the converging ring groove 220, the fluid is closer to the first pipeline 120, thereby facilitating the mixing of the fluid flowing through the second pipeline 130 and the fluid flowing through the first pipeline 120.

[0045] The bottom of the first buffer 200 is provided with a first boss 230, the first boss 230 has a first plane 231 and a first inclined surface 232, and the two ends of the first inclined surface 232 respectively extend to the first plane 231 and the side wall of the first buffer 200; the first plane 231 is used to open the converging ring groove 220, and the first inclined surface 232 abuts against the inner wall of the shell 300.

[0046] The flow passage 210 penetrates the first plane 231 and the first inclined surface 232, so that part of the fluid is blocked by the shell 300 and enters the converging ring groove 220.

[0047] In some embodiments, the cross section of the first buffer 200 can be circular or polygonal, and is mainly abutted against the inner wall of the shell 300. Here, the cross section of the first buffer 200 is taken as an example of a circle; the bottom of the first buffer 200 is provided with a first boss 230, wherein the first boss 230 has a first plane 231 and a first inclined surface 232, so that the bottom of the first buffer 200 is inclined from the side wall to the middle part; the converging ring groove 220 is opened on the first plane 231, and the converging ring groove 220 and the first buffer 200 are coaxially arranged; and the first inclined surface 232 abuts against the inner wall of the shell 300.

[0048] In some specific embodiments, the flow passage 210 penetrates the first plane 231 and the first inclined surface 232, so that the flow passage 210 communicates with the side wall of the converging ring groove 220, that is, the fluid flowing through the flow passage 210 can enter the converging ring groove 220 from the side of the converging ring groove 220. More specifically, in order to enable the fluid to enter the converging ring groove 220 from the side of the converging ring groove 220, the first inclined surface 232 is arranged to abut against the inner wall of the shell 300, and since the first inclined surface 232 is arranged to be inclined, the inner wall of the shell 300 abutting against the first inclined surface 232 is also arranged to be inclined. The fluid flows downward in the flow passage 210, and the inner wall of the shell 300 has a guiding effect on the fluid, so that the fluid enters the converging ring groove 220 from the side of the converging ring groove 220, thereby further reducing the flow rate of the fluid flowing through the second pipeline 130.

[0049] The top of the first buffer 200 has a second boss 240, the second boss 240 has a second flat surface 241 and a second inclined surface 242, two ends of the second inclined surface 242 extend to the second flat surface 241 and the sidewall of the first buffer 200 respectively; one side of the flow channel 210 penetrates the sidewall of the first buffer 200, and the other side extends to the second flat surface 241, so that the flow channel 210 is arranged obliquely.

[0050] In some embodiments, the top of the first buffer 200 has a second boss 240, the second boss 240 has a second flat surface 241 and a second inclined surface 242, so that the top of the first buffer 200 is inclined from the sidewall of the first buffer 200 to the middle part. Wherein, one side of the flow channel 210 penetrates the sidewall of the first buffer 200, and the other side extends to the edge of the second flat surface 241; at the same time, the flow channel 210 has an included angle with the radial direction of the first buffer 200, so that the flow channel 210 is arranged obliquely, which can be understood as that, in the top view or bottom view of the first buffer 200, the flow channel 210 is distributed in an umbrella shape. Therefore, the fluid entering the converging ring groove 220 through the side of the converging ring groove 220 will move circumferentially in the converging ring groove 220 under the restriction of the inclined flow channel 210 and the inner wall of the shell 300, thereby further reducing the flow rate of the fluid.

[0051] The top of the flow channel 210 penetrates the second inclined surface 242; the flow channel 210 includes a first wall 211, the first wall 211 is arranged obliquely and extends from the edge of the second flat surface 241 to the middle part of the first flat surface 231, so that the fluid enters the flow channel 210 from the second inclined surface 242, part of the fluid in the flow channel 210 enters the converging ring groove 220 from the top of the converging ring groove 220, and part of the fluid enters the converging ring groove 220 from the side of the converging ring groove 220.

[0052] In some embodiments, the top of the flow channel 210 penetrates the second inclined surface 242, and at the same time, due to the abutment between the sidewall of the first buffer 200 and the inner wall of the shell 300, the flow channel 210 extends to the edge of the second flat surface 241, so that the fluid in the buffer space 140 enters the flow channel 210 through the second inclined surface 242.

[0053] In some specific embodiments, the flow channel 210 includes a first wall 211, a second wall and a third wall, since the flow channel 210 penetrates the first slope 232, the second slope 242 and the side wall of the first buffer 200, the flow channel 210 only includes the above three side walls, wherein the second wall and the third wall are oppositely arranged, and the first wall 211 is connected to the second wall and the third wall, respectively, and the first wall 211 is oppositely arranged with the side wall of the first buffer 200. More specifically, the first wall 211 is obliquely arranged and extends from the edge of the second plane 241 to the middle of the first plane 231, so that the flow channel 210 penetrates the top wall of the converging ring groove 220; in the process of the fluid in the flow channel 210 entering the converging ring groove 220, part of the fluid enters the converging ring groove 220 from the side of the converging ring groove 220, and the remaining part of the fluid enters the converging ring groove 220 from the top of the converging ring groove 220, thereby facilitating the mixing of the fluids in the plurality of flow channels 210 entering the converging ring groove 220.

[0054] The inner wall of the shell 300 includes a first vertical section 320, an inclined section 330 and a second vertical section 340; the interval between the first vertical section 320 and the side wall of the first extension 110 is defined as a first interval, and the interval between the second vertical section 340 and the side wall of the first extension 110 is defined as a second interval; the first interval is greater than the second interval; the inclined section 330 is obliquely arranged and connects the first vertical section 320 and the second vertical section 340, and the inclined section 330 is used to block the fluid to slow down the flow rate of the fluid.

[0055] In some embodiments, the inner wall of the shell 300 includes the first vertical section 320, the inclined section 330 and the second vertical section 340 in sequence from top to bottom; for the convenience of description, it is defined herein that the interval between the first vertical section 320 and the side wall of the first extension 110 is a first interval, and the interval between the second vertical section 340 and the side wall of the first extension 110 is a second interval; wherein the first interval is greater than the second interval, that is, the second vertical section 340 is closer to the first extension 110.

[0056] In some specific embodiments, the inclined section 330 connects the first vertical section 320 and the second vertical section 340, so that the inclined section 330 is obliquely arranged, wherein the inclined section 330 is arranged for the second pipeline 130, so that the fluid flowing through the second pipeline 130 can impact on the inclined section 330 to reduce the flow rate of the fluid, and since the inclined section 330 is obliquely arranged, the inclined section 330 has a guiding effect, so that the fluid can flow to the second interval, thereby making the fluid flow out after flowing through the flow channel 210.

[0057] The double-fluid nozzle further comprises a second buffer 400 arranged on the side wall of the first extension 110, and a third gap is formed between the second buffer 400 and the first vertical section 320 for passing the fluid; the top wall of the second buffer 400 is arranged in an inclined manner, so that the fluid flowing through the second pipeline 130 is blocked by the second buffer 400 and then flows to the third gap; the fluid flowing through the third gap is blocked by the inclined section 330 and then flows to the flow-through passage 210.

[0058] In some embodiments, the double-fluid nozzle can further comprise a second buffer 400. Specifically, when the double-fluid nozzle comprises the second buffer 400, the second buffer 400 is arranged on the side wall of the first extension 110, which can be arranged in a clamping, bonding or one-piece manner, and the arrangement manner is not limited herein, and the second buffer 400 can be mainly arranged on the side wall of the first extension 110. A third gap is formed between the side wall of the second buffer 400 and the first vertical section 320 for passing the fluid.

[0059] In some specific embodiments, the outlet of the second pipeline 130 is arranged opposite to the second buffer 400, so that the fluid flowing through the second pipeline 130 first impacts the surface of the second buffer 400, thereby reducing the impact force and flow rate of the fluid flowing through the second pipeline 130.

[0060] In some more specific embodiments, the top wall of the second buffer 400 is arranged in an inclined manner, and the top wall of the second buffer 400 is inclined from the middle part of the second buffer 400 to the edge, so that the middle part of the second buffer 400 is higher than the edge; the fluid flowing through the second pipeline 130 impacts the top wall of the second buffer 400, and the top wall of the second buffer 400 is arranged in an inclined manner, so that the top wall of the second buffer 400 also has a flow guiding effect, and can guide the fluid in contact with the top wall of the second buffer 400 to the third gap; that is, the fluid flowing through the second pipeline 130 first enters the buffer space 140, contacts the top wall of the second buffer 400 in the buffer space 140, and then contacts the inclined section 330 through the third gap under the guidance of the top wall of the second buffer 400, and finally flows through the flow-through passage 210 and is discharged through the liquid outlet 310.

[0061] The double-fluid nozzle further comprises a second buffer 400 arranged on the side wall of the first extension 110, and the side wall of the second buffer 400 is attached to the first vertical section 320; a plurality of buffer holes 410 are formed through the second buffer 400 for passing the fluid.

[0062] In some embodiments, the inner wall of the second buffer 400 is arranged on the side wall of the first extension 110, and the outer wall is attached to the first vertical section 320, and the second buffer 400 is further provided with a buffer hole 410 penetrating the second buffer 400 along the axial direction of the liquid outlet body 100.

[0063] In some specific embodiments, the buffer hole 410 on the second buffer 400 is provided with a plurality of buffer holes 410, and the plurality of buffer holes 410 are distributed circumferentially on the second buffer 400; after the fluid flowing through the second pipeline 130 contacts the top wall of the second buffer 400, the fluid flows down through the buffer hole 410, so as to further adjust the flow rate and impact force of the fluid flowing through the second pipeline 130.

[0064] The embodiments of the present application also disclose a substrate processing device for processing a wafer. Specifically, the substrate processing device is used for cleaning the wafer. Specifically, the substrate processing device comprises the above-mentioned double-fluid nozzle, a carrying part 500 and a supply part;

[0065] The carrying part 500 is used for carrying the wafer;

[0066] The double-fluid nozzle is arranged corresponding to the carrying part 500, and is used for spraying the fluid to the wafer on the carrying part 500;

[0067] The supply part comprises a supply device 600, a first supply pipeline 610 and a second supply pipeline 620. One end of the first supply pipeline 610 is in communication with the supply device 600, and the other end is in communication with the first pipeline 120. One end of the second supply pipeline 620 is in communication with the supply device 600, and the other end is in communication with the second pipeline 130.

[0068] In some embodiments, the substrate processing device comprises the carrying part 500, wherein the carrying part 500 comprises a support 510 and a carrier 520. The support 510 is fixedly arranged and can be arranged on the ground or other positions capable of carrying, so as to ensure that the carrying part 500 is mainly stable. The carrier 520 is connected with the support 510, and the connection mode can be adhesion, clamping or integral forming, which is not limited herein. The support 510 can stably support the carrier 520, and the carrier 520 is used for carrying the wafer.

[0069] In some specific embodiments, the nozzle is arranged corresponding to the carrying part 500. Specifically, the nozzle is arranged corresponding to the carrier 520 of the carrying part 500. Since the wafer can be placed on the carrier 520, after the wafer is placed on the carrier 520, the wafer is arranged between the double-fluid nozzle and the carrier 520, so that the double-fluid nozzle can spray the fluid to the wafer.

[0070] In some more specific embodiments, the supplying part comprises a supplying device 600, a first supplying pipe 610 and a second supplying pipe 620; wherein the supplying device 600 comprises a first supplying member 630 and a second supplying member 640; one end of the first supplying pipe 610 is communicated with the first supplying member 630 and the other end is communicated with the first pipe 120; one end of the second supplying pipe 620 is communicated with the second supplying member 640 and the other end is communicated with the second pipe 130. Specifically, one end of the first supplying pipe 610 is communicated with the first supplying member 630 and the other end is communicated with the first pipe 120; one end of the second supplying pipe 620 is communicated with the second supplying member 640 and the other end is communicated with the second pipe 130. Wherein, the first supplying member 630 is used for supplying liquid and the second supplying member 640 is used for supplying gas, so that the liquid can enter into the first pipe 120 through the first supplying pipe 610 and the gas can enter into the second pipe 130 through the second supplying pipe 620, in order to clean the wafer. In some more specific embodiments, the supporting member 520 is a rotary chuck, which is a prior art and will not be described here.

[0071] The substrate processing apparatus further comprises a control part, the control part comprising:

[0072] The lifting mechanism 700 is connected with the dual-fluid nozzle to drive the dual-fluid nozzle to move;

[0073] The rotating mechanism 800 is connected with the supporting part 500 to drive the supporting part 500 to rotate.

[0074] In some embodiments, the substrate processing apparatus further comprises a control part, the control part comprising the lifting mechanism 700 and the rotating mechanism 800, wherein the lifting mechanism 700 is used for controlling and adjusting the position of the dual-fluid nozzle in the vertical direction to adjust the distance between the dual-fluid nozzle and the end surface of the supporting part 500; the rotating mechanism 800 is used for driving the supporting part 500 to rotate, thereby driving the wafer to rotate, so as to facilitate the wafer cleaning process.

[0075] In some specific embodiments, the lifting mechanism 700 is connected with the dual-fluid nozzle, and the connection mode can be bonding, clamping or bolt fixing, etc., which is not limited here, and the lifting mechanism 700 can mainly drive the dual-fluid nozzle to rise or fall in the vertical direction or move in the horizontal direction. More specifically, the lifting mechanism 700 can be an electric cylinder or a pneumatic cylinder, or other devices capable of driving the dual-fluid nozzle to move, which is not limited here, and the lifting mechanism 700 can mainly drive the dual-fluid nozzle to move.

[0076] In some specific embodiments, the rotating mechanism 800 is connected with the supporting part 500, and the connection mode can be bonding, clamping or bolt fixing, etc., which is not limited here, and the rotating mechanism 800 can mainly drive the supporting part 500 to rotate. It is a prior art and will not be described here.

[0077] In some more specific embodiments, the dual-fluid nozzle supplies liquid droplets having a volume median diameter of 22 microns or less, and more preferably a volume median diameter of about 15 microns. This is to achieve an excellent particle removal rate. When the gas flow rate is 30-35 L / min, the volume median diameter of the liquid droplets is about 15 microns, and when the gas flow rate is 20-22 L / min, the volume median diameter of the liquid droplets is about 22 microns. The liquid flowing through the first pipe 120 can be carbon dioxide solution, pure water, ammonia solution, hydrogen peroxide solution, or a mixture of water and hydrogen peroxide. The gas sprayed from the dual-fluid nozzle forms a circular ring surrounding the liquid outlet under the restriction of the converging ring groove 220. In this case, the outer diameter of the gas spray outlet of the circular ring is preferably 2.5 mm or more and 3.3 mm or less. The width of the circular ring is preferably 0.1 mm or more and 0.3 mm or less.

[0078] In some more specific embodiments, the second supply 640 supplies gas to the second pipe 130 at a flow rate of 10 L / min or more and 40 L / min or less. In actual use, different flow rates are used for different process nodes to ensure the lowest possible damage to the substrate pattern while achieving the best particle removal effect.

[0079] In some more specific embodiments, the distance between the dual-fluid nozzle and the wafer surface is 5-10 mm when the dual-fluid nozzle supplies the liquid droplets of the above-mentioned treatment liquid to the wafer, so that the volume median diameter of the liquid droplets on the substrate surface can be maintained at a higher level. More specifically, the liquid droplets can be inhibited or prevented from contacting and integrating with each other to become larger droplets when they reach the substrate surface from the dual-fluid nozzle.

[0080] In some more specific embodiments, the first supply pipe 610 and the second supply pipe 620 are each provided with a control valve. The valve on the first supply pipe 610 is used to control the on-off of the first supply pipe 610 and adjust the flow rate of the first supply pipe 610. The valve on the second supply pipe 620 is used to control the on-off of the second supply pipe 620 and adjust the flow rate of the second supply pipe 620. This is a prior art and will not be described here.

[0081] The implementation principle of the double-fluid nozzle and the substrate processing device is as follows: a wafer is placed on the bearing part 500, the interval between the double-fluid nozzle and the bearing part 500 is adjusted through the lifting mechanism 700, when the interval is appropriate, the double-fluid nozzle is controlled to spray fluid, and meanwhile, the first buffer 200 and the second buffer 400 are arranged in the double-fluid nozzle, so that the impact force of the gas flowing through the double-fluid nozzle on the wafer surface is weakened, thereby reducing the damage to the wafer surface; when the surface of the wafer is cleaned, the wafer arranged on the bearing part 520 is rotated through the rotating mechanism 800, and the lifting mechanism 700 drives the double-fluid nozzle to move in the vertical direction or the horizontal direction, so as to clean the wafer. The double-fluid nozzle provided by the application has smaller particle size than the traditional double-fluid nozzle under the same flow, the gas flow is 30-35 L / min, the droplet volume median diameter is about 15 microns, the cleaning effect is better under the more advanced process node of 28 nm or less, and the cleaning effect is excellent only when the gas flow is 20-22 L / min under the mature process node (28 nm or more), the droplet volume median diameter reaches 22 microns, the damage to the pattern is smaller under low flow, and the yield is higher. Meanwhile, the gas and liquid of the double-fluid nozzle are in the same direction, the gas inlet pipe and the liquid inlet pipe can be placed in the support arm, the use space is reduced, and the problems of complex pipeline and inconvenience are solved.

[0082] Although the embodiments of the present application have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to the embodiments. However, it should be understood that such modifications and changes all fall within the scope and spirit of the present application described in the claims. Moreover, the present application described herein can have other embodiments, and can be implemented or realized in various ways.

Claims

1. A dual-fluid nozzle, characterized in that, The device includes a liquid outlet body (100), the end of which has a first extension (110); the liquid outlet body (100) is provided with a first pipe (120) and a second pipe (130), the first pipe (120) passing through the liquid outlet body (100) and the first extension (110), and the second pipe (130) passing through the liquid outlet body (100); A first buffer (200) is disposed on the outer wall of the first extension (110); the first buffer (200) is provided with a plurality of flow channels (210); A housing (300) has a liquid outlet (310). The housing (300) is fitted onto the liquid outlet body (100), and the inner wall of the housing (300) abuts against the side wall of the first buffer member (200). The inner wall of the housing (300), the end of the liquid outlet body (100), the end of the first buffer member (200), and the side wall of the first extension (110) surround to form a buffer space (140). The buffer space (140) is connected to the second pipeline (130). The buffer space (140) is used to collect the fluid in the second pipeline (130) to slow down the flow rate. The fluid in the buffer space (140) flows through the flow channel (210) and mixes with the liquid in the first pipeline (120), and is discharged through the liquid outlet (310). The bottom of the first buffer (200) is provided with a converging annular groove (220), and the flow channel (210) is connected to the converging annular groove (220) so that the fluid in the multiple flow channels (210) converges in the converging annular groove (220) and is discharged through the liquid outlet (310); The bottom of the first buffer member (200) has a first boss (230), the first boss (230) has a first plane (231) and a first inclined surface (232), the two ends of the first inclined surface (232) extend to the first plane (231) and the side wall of the first buffer member (200) respectively; the first plane (231) is used to form the converging annular groove (220), and the first inclined surface (232) abuts against the inner wall of the housing (300); The flow channel (210) penetrates the first plane (231) and the first inclined surface (232) so that some fluid is blocked by the housing (300) and enters the converging annular groove (220).

2. The dual-fluid nozzle according to claim 1, characterized in that, The first buffer (200) has a second boss (240) on its top. The second boss (240) has a second plane (241) and a second inclined surface (242). The two ends of the second inclined surface (242) extend to the second plane (241) and the side wall of the first buffer (200), respectively. One side of the flow channel (210) penetrates the side wall of the first buffer (200), and the other side extends to the second plane (241), so that the flow channel (210) is inclined.

3. The dual-fluid nozzle according to claim 2, characterized in that, The top of the flow channel (210) extends through the second inclined surface (242); the flow channel (210) includes a first wall (211), which is inclined and extends from the edge of the second plane (241) to the middle of the first plane (231) so that fluid enters the flow channel (210) from the second inclined surface (242), and part of the fluid in the flow channel (210) enters the converging annular groove (220) from the top of the converging annular groove (220), and part of the fluid enters the converging annular groove (220) from the side of the converging annular groove (220).

4. The dual-fluid nozzle according to claim 1, characterized in that, The inner wall of the housing (300) includes a first vertical section (320), an inclined section (330), and a second vertical section (340); the distance between the first vertical section (320) and the side wall of the first extension (110) is defined as a first distance, and the distance between the second vertical section (340) and the side wall of the first extension (110) is defined as a second distance; the first distance is greater than the second distance; the inclined section (330) is inclined and connects the first vertical section (320) and the second vertical section (340), and the inclined section (330) is used to block the fluid to slow down the flow rate of the fluid.

5. The dual-fluid nozzle according to claim 4, characterized in that, It also includes a second buffer (400), which is disposed on the side wall of the first extension (110), and there is a third gap between the second buffer (400) and the first vertical section (320) to allow fluid to pass through; the top wall of the second buffer (400) is inclined so that the fluid flowing through the second pipe (130) is blocked by the second buffer (400) and flows to the third gap; after flowing through the third gap, it is blocked by the inclined section (330) and flows to the flow channel (210).

6. The dual-fluid nozzle according to claim 4, characterized in that, It also includes a second buffer (400), which is disposed on the side wall of the first extension (110), and the side wall of the second buffer (400) is attached to the first vertical section (320); a plurality of buffer holes (410) are provided through the second buffer (400) to allow fluid to pass through.

7. A substrate processing apparatus, characterized in that, Includes the dual-fluid nozzle, the carrier portion (500), and the supply portion as described in any one of claims 1-6; The carrier portion (500) is used to carry the wafer; The dual-fluid nozzle is disposed corresponding to the support portion (500) to eject fluid onto the wafer on the support portion (500); The supply section includes a supply device (600), a first supply pipeline (610), and a second supply pipeline (620). One end of the first supply pipeline (610) is connected to the supply device (600), and the other end is connected to the first pipeline (120). One end of the second supply pipeline (620) is connected to the supply device (600), and the other end is connected to the second pipeline (130).

8. The substrate processing apparatus according to claim 7, characterized in that, It also includes a control section, which includes: A lifting mechanism (700) is connected to the dual-fluid nozzle to drive the dual-fluid nozzle to move; A rotating mechanism (800) is connected to the bearing portion (500) to drive the bearing portion (500) to rotate.

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