Semiconductor wafer scribing machine with protection function

Abstract

The invention provides a semiconductor wafer scribing machine with a protection function, and relates to the field of semiconductor equipment manufacturing, and the semiconductor wafer scribing machine comprises a scribing main body, an edge wiping baffle plate, a cutting part, a processing pedestal, a scribing protection plate, a connection protection plate, a protection plate connection mechanism, and a scribing protection mechanism. The edge wiping baffle is fixedly connected to the right end face of the scribing piece body. The cutting component is slidably connected to the inner end face of the scribing piece body. The machining base is slidably connected to the inner end face of the scribing piece body. The scribing protection plate rotates on the front end surface of the scribing main body; the connecting protection plate is rotationally arranged on the front end surface of the scribing main body; the protective plate connecting mechanism is arranged on the scribing protective plate; and the scribing protection mechanism is arranged in the scribing main body. The scribing protective plate and the connecting protective plate are mounted and dismounted through the protective plate connecting mechanism, and the safety of personnel using the scribing machine is guaranteed through the scribing protective mechanism. The problem that after a worker opens a protective plate, a cutting blade hurts the worker, and therefore the worker is hurt is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment manufacturing, and in particular to a semiconductor wafer dicing machine with a protective function. Background Art

[0002] Semiconductor devices are electronic devices with specific functions. When manufacturing semiconductor devices, wafers are needed to produce chips. When manufacturing semiconductor wafers, a dicing machine is needed to place the wafer inside the dicing machine. The cutting blade inside the dicing machine accurately cuts the wafer. After the cutting is completed, the staff will take the wafer for subsequent processing.

[0003] According to CN201810532880.5, the present invention belongs to the field of semiconductor production technology, specifically a semiconductor wafer dicing machine, including a workbench, a suction cup, a vacuum generator and a cutting knife, the workbench is provided with a vacuum generator; the suction cup is installed on the workbench; the suction cup is used to adsorb the wafer; a cutting knife is provided above the suction cup; and an adjustment device is also included; the adjustment device is installed on the adsorption hole of the suction cup, and the adjustment device is used to adjust the adsorption area of ​​the adsorption hole. The present invention changes the size of the adsorption hole by providing an adjustment device to avoid insufficient adsorption force caused by the adsorption hole being too small, causing cutting damage and affecting the quality of the wafer; by providing a connecting hole on one side of the adsorption hole, a dredging block is slidably installed in the connecting hole, and when the adsorption hole is vacuumed, the external air pressure pushes the dredging block to move into the adsorption hole. After the wafer cutting is completed, the dredging block returns under the action of the spring, alleviating the clogging of the adsorption hole by cutting dust.

[0004] However, the dicing machine generally protects the working area with a guard plate structure. When using the dicing machine to cut the wafer, the worker opens the guard plate, places the wafer inside the working area, and then closes the guard plate. When the cutting blade moves to the wafer position, the cutting blade rotates at high speed to cut the wafer. When the worker finds that the wafer is cut incorrectly, the worker is likely to directly open the guard plate to operate the wafer. When the cutting blade rotates at high speed, the worker is likely to come into contact with the cutting blade, which can easily cause the cutting blade to injure the worker, thereby causing injury to the worker. Summary of the Invention

[0005] In view of this, the present invention provides a semiconductor wafer dicing machine with a protective function, which has a cutting part. When the cutting part cuts the wafer, the dicing guard plate and the connecting guard plate cannot be rotated open, thereby avoiding the problem that the staff opens the baffle when the cutting part is running, causing the cutting part to injure the staff, thereby ensuring the safety of the staff when using the dicing machine.

[0006] The present invention provides a purpose and function of a semiconductor wafer dicing machine with a protective function, specifically comprising: a dicing body, an edge rubbing baffle, a control component, a cutting component, a processing base, a dicing guard plate, a connecting guard plate, a protective slider, a guard plate connecting mechanism and a dicing protection mechanism; the edge rubbing baffle is fixedly connected to the middle position of the right end face of the dicing body, and the edge rubbing baffle is a transparent polyvinyl chloride rectangular structure; the control component is fixedly connected to the upper side of the front end face of the dicing body; the cutting component is slidably connected to the upper side of the inner end face of the dicing body; the processing base is slidably connected to the lower side of the inner end face of the dicing body, and the cutting component slides on the upper side of the processing base; the dicing guard plate rotates on the right side of the front end face of the dicing body, and the dicing guard plate is a transparent polyvinyl chloride L-shaped plate structure; the connecting guard plate rotates on the left side of the front end face of the dicing body, and the connecting guard plate is a transparent polyvinyl chloride rectangular structure, and the dicing guard plate is located on the right side of the connecting guard plate; the protective slider is slidably connected to the upper inner side of the front end face of the dicing body; the guard plate connecting mechanism is arranged on the dicing guard plate and the connecting guard plate; the dicing protection mechanism is arranged inside the dicing body.

[0007] Furthermore, the guard plate connecting mechanism includes: a guard plate rotating shaft and a guard plate torsion spring; the guard plate rotating shaft is rotatably connected to the inside of the right end face of the dicing body, and the middle position of the guard plate rotating shaft is fixedly connected to the dicing guard plate; the guard plate torsion spring is fixedly connected to the upper side of the inside of the dicing body, and the guard plate rotating shaft and the guard plate torsion spring are elastically connected.

[0008] Furthermore, the guard plate connection mechanism also includes: alignment slots and alignment protrusions; there are multiple groups of alignment slots, and the multiple groups of alignment slots are respectively opened on the left side of the front end surface of the slicing guard plate; there are multiple groups of alignment protrusions, and the multiple groups of alignment protrusions are fixedly connected to the right end surface of the connecting guard plate, and the multiple groups of alignment slots are respectively plugged into the multiple groups of alignment protrusions.

[0009] Furthermore, the guard plate connecting mechanism also includes: a connecting groove, a connecting slider and a connecting spring; the connecting groove is opened on the lower side of the front end surface of the dicing guard plate; the connecting slider is slidably connected to the inside of the dicing guard plate, and the connecting slider slides inside the connecting groove; there are two groups of connecting springs, and the two groups of connecting springs are respectively fixedly connected to the upper and lower sides of the inside of the dicing guard plate, and the two groups of connecting springs are respectively elastically connected to the right end surface of the connecting slider.

[0010] Furthermore, the guard plate connection mechanism also includes: connecting sockets and connecting pins; there are two groups of connecting sockets, and the two groups of connecting sockets are respectively opened on the right end surfaces of the alignment protrusions on the upper and lower sides; there are two groups of connecting pins, and the two groups of connecting pins are respectively fixedly connected to the upper and lower sides of the left end surface of the connecting slider, and the two groups of connecting sockets are respectively plugged into the two groups of connecting pins.

[0011] Furthermore, the scribing protection mechanism includes: a scribing rack, a scribing shaft and a scribing gear; the scribing rack is fixedly connected to the upper side of the front end surface of the cutting component, and the scribing rack slides on the upper side inside the scribing body; the scribing shaft is rotatably connected to the rear side inside the scribing body; the scribing gear is coaxially fixedly connected to the right side of the scribing shaft, and the scribing rack and the scribing gear are meshed together to form a gear rack transmission mechanism.

[0012] Furthermore, the scribing protection mechanism also includes: a scribing pulley, a protective transmission belt, a protective rotating shaft and a protective pulley; the scribing pulley is coaxially fixedly connected to the left side of the scribing rotating shaft; the protective rotating shaft is rotatably connected to the front side of the inside of the scribing body; the protective pulley is coaxially fixedly connected to the right side of the protective rotating shaft; the protective transmission belt is transmission-connected to the scribing pulley and the outer end face of the protective pulley.

[0013] Furthermore, the slicing protection mechanism also includes: a changing gear, a protective gear and a protective rack; the changing gear is coaxially fixedly connected to the left side of the protective rotating shaft; the protective gear is rotatably connected to the front side of the inside of the slicing body, and the changing gear and the protective gear are meshed to form a gear transmission mechanism; the protective rack is slidably connected to the front side of the inside of the slicing body, and the protective rack is fixedly connected to the rear end face of the protective slider, and the protective gear and the protective rack are meshed to form a gear rack transmission mechanism.

[0014] Furthermore, the slicing protection mechanism also includes: a protective socket and a protective pin; the protective socket is opened on the upper end surface of the connecting guard plate; the protective pin is fixedly connected to the lower end surface of the protective slider, and the protective socket and the protective pin are plug-connected. Beneficial effects

[0015] The present invention adopts a guard plate connecting mechanism to realize that the scribing guard plate and the connecting guard plate protect the working area of ​​the scribing machine. The elastic force of the guard plate torsion spring drives the scribing guard plate and the connecting guard plate to always protect the front side of the working area of ​​the scribing machine, avoiding the working area being exposed to the outside and causing the cutting parts to injure the staff or the water inside to splash out. The scribing guard plate and the connecting guard plate can be disassembled according to actual needs.

[0016] In addition, by adopting the dicing protection mechanism, when the cutting component cuts the wafer, the protection pin is inserted into the protection socket, and the dicing guard plate and the connecting guard plate cannot be rotated open, avoiding the problem that the staff opens the baffle when the cutting component is running, causing the cutting component to injure the staff, ensuring the safety of the staff when using the dicing machine. When the cutting component is cutting the wafer, if the cutting component is damaged and cannot be moved, the staff can disassemble the dicing guard plate and the connecting guard plate to maintain the cutting component, making it convenient for the staff to use the dicing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0018] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0019] In the attached figure: Figure 1 It is a schematic structural diagram of a front view of a dicing machine according to an embodiment of the present invention.

[0020] Figure 2 It is a schematic diagram of the internal structure of a dicing machine according to an embodiment of the present invention.

[0021] Figure 3 It is a structural diagram of the internal transmission of the dicing machine according to an embodiment of the present invention.

[0022] Figure 4 It is a schematic structural diagram of the overall guard plate connection mechanism of an embodiment of the present invention.

[0023] Figure 5 It is a schematic structural diagram of the disassembled guard plate connection mechanism of an embodiment of the present invention.

[0024] Figure 6 It is a structural diagram of the internal transmission of the guard plate connecting mechanism of an embodiment of the present invention.

[0025] Figure 7 It is a structural diagram of the overall transmission inside the dicing protection mechanism of an embodiment of the present invention.

[0026] Figure 8 It is a structural schematic diagram of the rear-side transmission of the dicing protection mechanism of an embodiment of the present invention.

[0027] Figure 9 It is a structural schematic diagram of the front-side transmission of the scribe protection mechanism of an embodiment of the present invention.

[0028] Reference Signs List 1. Slicing body; 2. Edge baffle; 3. Control component; 4. Cutting component; 401. Slicing rack; 5. Processing base; 6. Slicing guard; 601. Alignment slot; 602. Connecting bend slot; 7. Connecting guard; 701. Alignment bump; 702. Connecting socket; 703. Protective socket; 8. Guard shaft; 801. Guard torsion spring; 9. Connecting slider; 901. Connecting spring; 902. Connecting pin; 10. Slicing shaft; 1001. Slicing gear; 1002. Slicing pulley; 11. Protective transmission belt; 12. Protective shaft; 1201. Protective pulley; 1202. Changing gear; 13. Protective gear; 14. Protective slider; 1401. Protective rack; 1402. Protective pin. DETAILED DESCRIPTION

[0029] Example 1 Please refer to Figures 1 to 6 As shown: The present invention provides a semiconductor wafer dicing machine with a protective function, comprising a dicing body 1, an edge baffle 2, a control component 3, a cutting component 4, a processing base 5, a dicing guard plate 6, a connecting guard plate 7, a protective slider 14 and a guard plate connecting mechanism; the edge baffle 2 is fixedly connected to the middle position of the right end face of the dicing body 1, and the edge baffle 2 is a transparent polyvinyl chloride rectangular structure; the control component 3 is fixedly connected to the upper side of the front end face of the dicing body 1; the cutting component 4 is slidably connected to the upper side of the inner end face of the dicing body 1; the processing base 5 is slidably connected to the lower side of the inner end face of the dicing body 1, and the cutting component 4 slides on the upper side of the processing base 5; the dicing guard plate 6 rotates on the right side of the front end face of the dicing body 1, and the dicing guard plate 6 is a transparent polyvinyl chloride L-shaped plate structure; the connecting guard plate 7 rotates on the left side of the front end face of the dicing body 1, and the connecting guard plate 7 is a transparent polyvinyl chloride rectangular structure. The dicing guard plate 6 is located on the right side of the connecting guard plate 7; the protective slider 14 is slidably connected to the upper side of the inner front end face of the dicing body 1; the guard plate connecting mechanism is provided on the dicing guard plate 6 and the connecting guard plate 7.

[0030] Among them, the guard plate connection mechanism includes: a guard plate shaft 8 and a guard plate torsion spring 801; the guard plate shaft 8 is rotatably connected to the inside of the right end face of the dicing body 1, and the middle position of the guard plate shaft 8 is fixedly connected to the dicing guard plate 6; the guard plate torsion spring 801 is fixedly connected to the upper side of the inside of the dicing body 1, and the guard plate shaft 8 and the guard plate torsion spring 801 are elastically connected. During use, when the staff bends the dicing guard plate 6 to rotate, the guard plate shaft 8 is driven to rotate, and the rotation of the guard plate shaft 8 drives the guard plate torsion spring 801 to extend and retract, and the elastic force of the guard plate torsion spring 801 drives the dicing guard plate 6 to rotate to a closed state.

[0031] Among them, the guard plate connection mechanism also includes: alignment slots 601 and alignment protrusions 701; there are multiple groups of alignment slots 601, and multiple groups of alignment slots 601 are respectively opened on the left side of the front end face of the dicing guard plate 6; there are multiple groups of alignment protrusions 701, and multiple groups of alignment protrusions 701 are fixedly connected to the right end face of the connecting guard plate 7, and multiple groups of alignment slots 601 are respectively plugged and connected to multiple groups of alignment protrusions 701. During use, when the dicing guard plate 6 and the connecting guard plate 7 are connected together, when the connecting guard plate 7 moves to the position of the dicing guard plate 6, it drives the alignment protrusions 701 to the position of the alignment slots 601, and the alignment protrusions 701 are inserted into the alignment slots 601.

[0032] Among them, the guard plate connection mechanism also includes: a connecting bend groove 602, a connecting slider 9 and a connecting spring 901; the connecting bend groove 602 is opened on the lower side of the front end surface of the dicing guard plate 6; the connecting slider 9 is slidably connected to the inside of the dicing guard plate 6, and the connecting slider 9 slides inside the connecting bend groove 602; there are two groups of connecting springs 901, and the two groups of connecting springs 901 are respectively fixedly connected to the upper and lower sides of the inside of the dicing guard plate 6, and the two groups of connecting springs 901 are elastically connected to the right end surface of the connecting slider 9. During use, the staff inserts the tool into the connecting bend groove 602, bends the connecting slider 9 to slide, and the sliding of the connecting slider 9 drives the connecting spring 901 to extend and retract, and the elastic force of the connecting spring 901 drives the connecting slider 9 to slide and reset.

[0033] Among them, the guard plate connecting mechanism also includes: connecting sockets 702 and connecting pins 902; there are two groups of connecting sockets 702, and the two groups of connecting sockets 702 are respectively opened on the right end faces of the alignment protrusions 701 on the upper and lower sides; there are two groups of connecting pins 902, and the two groups of connecting pins 902 are respectively fixedly connected to the upper and lower sides of the left end face of the connecting slider 9, and the two groups of connecting sockets 702 are respectively plugged into the two groups of connecting pins 902. During use, the connecting slider 9 slides to drive the connecting pins 902 to slide, and the connecting pins 902 slide into the inside of the connecting sockets 702, thereby fixing the connecting guard plate 7 on the dicing guard plate 6, and the dicing guard plate 6 drives the connecting guard plate 7 to rotate when the dicing machine rotates.

[0034] Specific usage and function of the first embodiment of the present invention: During the use of the present invention, when the staff bends the scribing guard plate 6 to rotate, the guard plate shaft 8 is driven to rotate, and the rotation of the guard plate shaft 8 drives the guard plate torsion spring 801 to expand and contract, and the elastic force of the guard plate torsion spring 801 drives the scribing guard plate 6 to rotate in a closed state. When the scribing guard plate 6 and the connecting guard plate 7 are connected together, when the connecting guard plate 7 moves to the position of the scribing guard plate 6, it drives the alignment protrusion 701 to the position of the alignment slot 601, and the alignment protrusion 701 is inserted into the alignment slot 601. The staff will The tool is inserted into the connecting bend groove 602, and the connecting slider 9 is driven to slide. The sliding of the connecting slider 9 drives the connecting spring 901 to extend and retract. The elastic force of the connecting spring 901 drives the connecting slider 9 to slide and reset. The sliding of the connecting slider 9 drives the connecting pin 902 to slide. The connecting pin 902 slides and is inserted into the connecting socket 702, thereby fixing the connecting guard plate 7 on the dicing guard plate 6. When the dicing machine rotates, the dicing guard plate 6 drives the connecting guard plate 7 to rotate, so that the dicing guard plate 6 and the connecting guard plate 7 can be connected and disassembled according to actual usage. Example 2

[0035] Based on Example 1, please refer to Figures 7 to 9 As shown: The present invention provides a semiconductor wafer dicing machine with a protective function, which also includes a dicing protection mechanism. The dicing protection mechanism is arranged inside the dicing body 1, and the dicing protection mechanism includes: a dicing rack 401, a dicing shaft 10 and a dicing gear 1001; the dicing rack 401 is fixedly connected to the upper side of the front end surface of the cutting component 4, and the dicing rack 401 slides on the upper side inside the dicing body 1; the dicing shaft 10 is rotatably connected to the rear side inside the dicing body 1; the dicing gear 1001 is coaxially fixedly connected to the right side of the dicing shaft 10, and the dicing rack 401 and the dicing gear 1001 are meshed to form a gear rack transmission mechanism. During use, when the cutting component 4 slides, it drives the dicing rack 401 to slide, and the sliding of the dicing rack 401 drives the meshed dicing gear 1001 to rotate, and the rotation of the dicing gear 1001 drives the dicing shaft 10 to rotate.

[0036] Among them, the scribing protection mechanism also includes: a scribing pulley 1002, a protective transmission belt 11, a protective rotating shaft 12 and a protective pulley 1201; the scribing pulley 1002 is coaxially fixedly connected to the left side of the scribing rotating shaft 10; the protective rotating shaft 12 is rotatably connected to the front side of the inner part of the scribing body 1; the protective pulley 1201 is coaxially fixedly connected to the right side of the protective rotating shaft 12; the protective transmission belt 11 is transmission-connected to the outer end faces of the scribing pulley 1002 and the protective pulley 1201. During use, the scribing rotating shaft 10 rotates to drive the scribing pulley 1002 to rotate, the scribing pulley 1002 rotates to drive the protective transmission belt 11 to transmit, the protective transmission belt 11 transmits to drive the protective pulley 1201 to rotate, and the protective pulley 1201 rotates to drive the protective rotating shaft 12.

[0037] Among them, the slicing protection mechanism also includes: a changing gear 1202, a protective gear 13 and a protective rack 1401; the changing gear 1202 is coaxially fixedly connected to the left side of the protective rotating shaft 12; the protective gear 13 is rotatably connected to the front side of the inside of the slicing body 1, and the changing gear 1202 and the protective gear 13 are meshed to form a gear transmission mechanism; the protective rack 1401 is slidably connected to the front side of the inside of the slicing body 1, and the protective rack 1401 is fixedly connected to the rear end face of the protective slider 14, and the protective gear 13 and the protective rack 1401 are meshed to form a gear rack transmission mechanism. During use, the protection rotating shaft 12 rotates to drive the changing gear 1202 to rotate, the changing gear 1202 rotates to drive the meshed protective gear 13 to rotate, the protective gear 13 rotates to drive the meshed protective rack 1401 to slide, and the sliding of the protective rack 1401 drives the protective slider 14 to slide.

[0038] Among them, the dicing protection mechanism also includes: a protective socket 703 and a protective pin 1402; the protective socket 703 is opened on the upper end face of the connecting guard plate 7; the protective pin 1402 is fixedly connected to the lower end face of the protective slider 14, and the protective socket 703 and the protective pin 1402 are plugged into each other. During use, the sliding of the protective slider 14 drives the sliding of the protective pin 1402, and the protective pin 1402 slides and is inserted into the inside of the protective socket 703. When the dicing machine cuts the semiconductor wafer, the dicing guard plate 6 and the connecting guard plate 7 cannot be opened.

[0039] The specific usage and function of the second embodiment of the present invention: During the use of the present invention, when the cutting component 4 slides, it drives the scribing rack 401 to slide, and the sliding of the scribing rack 401 drives the meshing scribing gear 1001 to rotate, and the rotation of the scribing gear 1001 drives the scribing shaft 10 to rotate, and the rotation of the scribing shaft 10 drives the scribing pulley 1002 to rotate, and the rotation of the scribing pulley 1002 drives the protection transmission belt 11 to drive, and the protection transmission belt 11 drives the protection pulley 1201 to rotate, and the protection pulley 1201 drives the protection shaft 12 to rotate, and the protection shaft 12 rotates to drive the direction change The gear 1202 rotates, and the direction-changing gear 1202 rotates to drive the meshing protective gear 13 to rotate. The rotation of the protective gear 13 drives the meshing protective rack 1401 to slide. The sliding of the protective rack 1401 drives the protective slider 14 to slide. The sliding of the protective slider 14 drives the protective pin 1402 to slide. The protective pin 1402 slides and is inserted into the protective socket 703. When the dicing machine cuts the semiconductor wafer, the dicing guard plate 6 and the connecting guard plate 7 cannot be opened, so that the staff cannot put their hands into the dicing machine when the dicing machine is processing the wafer, thereby ensuring the safety of the staff.

Claims

1. A semiconductor wafer dicing machine with a protective function, comprising: A slicing body (1), an edge baffle (2), a control component (3), a cutting component (4), a processing base (5), a slicing guard plate (6), a connecting guard plate (7), a protective slider (14), a guard plate connecting mechanism and a slicing protection mechanism; the edge baffle (2) is fixedly connected to the middle position of the right end face of the slicing body (1), and the edge baffle (2) is a transparent polyvinyl chloride rectangular structure; it is characterized in that the control component (3) is fixedly connected to the upper side of the front end face of the slicing body (1); the cutting component (4) is slidably connected to the upper side of the inner end face of the slicing body (1); the processing base (5) is slidably connected to the inner end face of the slicing body (1) The cutting part (4) slides on the upper side of the processing base (5); the dicing guard plate (6) rotates on the right side of the front end face of the dicing body (1), and the dicing guard plate (6) is a transparent polyvinyl chloride L-shaped plate structure; the connecting guard plate (7) rotates on the left side of the front end face of the dicing body (1), and the connecting guard plate (7) is a transparent polyvinyl chloride rectangular structure, and the dicing guard plate (6) is located on the right side of the connecting guard plate (7); the protective slider (14) is slidably connected to the upper side of the inner front end face of the dicing body (1); the guard plate connecting mechanism is arranged on the dicing guard plate (6) and the connecting guard plate (7); and the dicing protection mechanism is arranged inside the dicing body (1).

2. A semiconductor wafer dicing machine with a protective function as claimed in claim 1, characterized in that: The guard plate connection mechanism comprises: a guard plate rotating shaft (8) and a guard plate torsion spring (801); the guard plate rotating shaft (8) is rotatably connected to the inside of the right end surface of the dicing body (1), and the middle position of the guard plate rotating shaft (8) is fixedly connected to the dicing guard plate (6); the guard plate torsion spring (801) is fixedly connected to the upper side of the inside of the dicing body (1), and the guard plate rotating shaft (8) and the guard plate torsion spring (801) are elastically connected.

3. A semiconductor wafer dicing machine with a protective function as claimed in claim 1, characterized in that: The guard plate connection mechanism further comprises: an alignment slot (601) and an alignment protrusion (701); the alignment slot (601) is provided in a plurality of groups, and the plurality of alignment slots (601) are respectively opened on the left side of the front end surface of the dicing guard plate (6); the alignment protrusion (701) is provided in a plurality of groups, and the plurality of alignment protrusions (701) are fixedly connected to the right end surface of the connecting guard plate (7), and the plurality of alignment slots (601) are respectively plug-connected to the plurality of alignment protrusions (701).

4. A semiconductor wafer dicing machine with a protective function as claimed in claim 1, characterized in that: The guard plate connection mechanism further comprises: a connecting breaking groove (602), a connecting slider (9) and a connecting spring (901); the connecting breaking groove (602) is provided on the lower side of the front end surface of the dicing guard plate (6); the connecting slider (9) is slidably connected inside the dicing guard plate (6), and the connecting slider (9) slides inside the connecting breaking groove (602); the connecting spring (901) is provided in two groups, and the two groups of connecting springs (901) are respectively fixedly connected to the upper and lower sides inside the dicing guard plate (6), and the two groups of connecting springs (901) are respectively elastically connected to the right end surface of the connecting slider (9).

5. A semiconductor wafer dicing machine with a protective function as claimed in claim 4, characterized in that: The guard plate connection mechanism further comprises: a connection socket (702) and a connection pin (902); the connection socket (702) is provided in two groups, and the two groups of connection sockets (702) are respectively opened on the right end surfaces of the alignment protrusion (701) on the upper and lower sides; the connection pin (902) is provided in two groups, and the two groups of connection pins (902) are respectively fixedly connected to the upper and lower sides of the left end surface of the connecting slider (9), and the two groups of connection sockets (702) are plug-connected to the two groups of connection pins (902).

6. A semiconductor wafer dicing machine with a protective function as claimed in claim 1, characterized in that: The dicing protection mechanism comprises: a dicing rack (401), a dicing shaft (10) and a dicing gear (1001); the dicing rack (401) is fixedly connected to the upper side of the front end surface of the cutting component (4), and the dicing rack (401) slides on the upper side of the inside of the dicing body (1); the dicing shaft (10) is rotatably connected to the rear side of the inside of the dicing body (1); the dicing gear (1001) is coaxially fixedly connected to the right side of the dicing shaft (10), and the dicing rack (401) and the dicing gear (1001) are meshed to form a gear rack transmission mechanism.

7. A semiconductor wafer dicing machine with a protective function as claimed in claim 6, characterized in that: The scribing protection mechanism further comprises: a scribing pulley (1002), a protective transmission belt (11), a protective rotating shaft (12) and a protective pulley (1201); the scribing pulley (1002) is coaxially fixedly connected to the left side of the scribing rotating shaft (10); the protective rotating shaft (12) is rotatably connected to the front side of the interior of the scribing body (1); the protective pulley (1201) is coaxially fixedly connected to the right side of the protective rotating shaft (12); and the protective transmission belt (11) is transmission-connected to the outer end surfaces of the scribing pulley (1002) and the protective pulley (1201).

8. A semiconductor wafer dicing machine with a protective function as claimed in claim 7, characterized in that: The dicing protection mechanism further comprises: a direction-changing gear (1202), a protection gear (13) and a protection rack (1401); the direction-changing gear (1202) is coaxially fixedly connected to the left side of the protection rotating shaft (12); the protection gear (13) is rotatably connected to the front side of the interior of the dicing body (1), and the direction-changing gear (1202) and the protection gear (13) are meshed to form a gear transmission mechanism; the protection rack (1401) is slidably connected to the front side of the interior of the dicing body (1), and the protection rack (1401) is fixedly connected to the rear end face of the protection slider (14), and the protection gear (13) and the protection rack (1401) are meshed to form a gear rack transmission mechanism.

9. A semiconductor wafer dicing machine with a protective function as claimed in claim 8, characterized in that: The slicing protection mechanism further comprises: a protection socket (703) and a protection pin (1402); the protection socket (703) is provided on the upper end surface of the connecting guard plate (7); the protection pin (1402) is fixedly connected to the lower end surface of the protection slider (14), and the protection socket (703) and the protection pin (1402) are plug-connected.

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