Heat exchange flow channel, silicon carbide spiral heat exchanger and working method of silicon carbide spiral heat exchanger

Abstract

The invention belongs to the technical field of heat exchange equipment, and particularly relates to a heat exchange runner, a silicon carbide spiral heat exchanger and a working method of the silicon carbide spiral heat exchanger. The first side groove forms a material runner, a first port is formed in the periphery of the first side groove, and a second port is formed in the circle center; the second side groove forms a heat exchange medium runner, a heat exchange medium inlet is formed in the circle center of the second side groove, and a heat exchange medium outlet is formed in the periphery of the second side groove; wherein the material flow channels and the heat exchange medium flow channels are arranged at intervals in the direction perpendicular to the base body, and the cross sections of the two flow channels are arranged at intervals to jointly form a continuous S-shaped staggered heat exchange section structure.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat exchange equipment, and in particular relates to a heat exchange channel, a silicon carbide spiral heat exchanger and a working method thereof. Background Art

[0002] In the fields of petrochemicals, pharmaceuticals, food processing, etc., heat exchange equipment is a core process unit, and its heat exchange efficiency directly affects production energy consumption and product quality. Traditional heat exchangers generally adopt shell and tube or plate structures. When it is necessary to increase the material flow rate, traditional shell and tube / plate heat exchangers generally adopt the method of "extending the pipeline or adding parallel branches". The method of extending the pipeline has the following defects: the heat exchange medium of the heat exchanger enters the entire chamber from a single inlet, and there are pressure drops and temperature changes when flowing through different positions. After the pipeline is extended, the heat exchange intensity of the material in the pipeline near the inlet is high, and the heat exchange effect is poor away from the inlet, resulting in uneven heat exchange of the material. The method of adding parallel branches will lead to uneven distribution of flow resistance in the cavity of the shell, resulting in a rush flow effect: the heat exchange efficiency is high in the parts with fast flow rate, and the heat exchange efficiency is low in the parts with slow flow rate.

[0003] Therefore, how to increase the material flow rate of the heat exchanger while avoiding uneven heat exchange of the material is a technical problem that technical personnel in this field urgently need to solve.

[0004] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the Invention

[0005] The embodiments of the present disclosure provide at least a heat exchange channel, a silicon carbide spiral heat exchanger, and a working method thereof.

[0006] In a first aspect, an embodiment of the present disclosure provides a heat exchange channel, comprising: A base body, both sides of which are provided with spiral grooves; The first side groove constitutes a material flow channel, a first port is provided on its periphery, and a second port is provided at the center; The second side groove forms a heat exchange medium flow channel, a heat exchange medium inlet is provided at the center of the circle, and a heat exchange medium outlet is provided at the periphery; The material flow channel and the heat exchange medium flow channel are arranged at intervals in a direction perpendicular to the substrate, and the cross sections of the two flow channels together form a continuous S-shaped staggered heat exchange cross-sectional structure due to the interval arrangement.

[0007] In an optional embodiment, the substrate is made of silicon carbide, and the thickness of the interlayer between the material flow channel and the heat exchange medium flow channel is 3-10 mm.

[0008] In a second aspect, the present disclosure further provides a silicon carbide spiral heat exchanger, comprising: The heat exchange channel; and a housing in which at least one heat exchange unit is disposed; The heat exchange unit comprises a pair of base bodies, a first partition plate is provided between the two base bodies, and a first through hole is provided at the center of the first partition plate; The first through hole penetrates the second port of the adjacent substrate, and the material flow channels of the adjacent substrates are connected in series through the first through hole; A second partition is provided between the bases of adjacent heat exchange units, and a second through hole is provided at an edge of the second partition; The second through hole penetrates the first port of the adjacent base body, and the material flow channels of the adjacent heat exchange units are connected in series through the second through hole; The main heat exchange medium channel passes through the first partition plate and the second partition plate and is communicated with the heat exchange medium inlet of each substrate, so that the heat exchange medium channels of each substrate are connected in parallel.

[0009] In an optional embodiment, the base body is tightly fitted with the adjacent first and second partition plates, so that the material flow channel and the heat exchange medium flow channel form a sealed pipeline with only two ends open between the base body and the partition plates.

[0010] In an optional embodiment, there is an interlayer space between the shell and the base; and a heat exchange medium output main pipe is provided on the shell; The interlayer space is communicated with the heat exchange medium output main pipe.

[0011] In an optional embodiment, a flange is provided on the outer wall of the housing, and cover plates are provided on both sides of the housing, and threaded holes corresponding to positions are provided on the cover plates and the flange; The cover plate is matched with the threaded holes through locking bolts, nuts and tightly fits with the bases on both sides of the shell.

[0012] In an optional embodiment, a heat exchange medium inlet pipe and a material inlet pipe are provided on the cover plate at the shell inlet, and a material outlet pipe is provided on the cover plate at the shell tail end; and The heat exchange medium inlet pipe passes through the cover plate and is connected to the heat exchange medium main channel; The material liquid inlet pipe passes through the cover plate and is connected to the first port of the head end base; The material liquid outlet pipe passes through the cover plate and is communicated with the first port of the tail end base.

[0013] In a third aspect, the present disclosure also provides a method for operating a heat exchange channel, including: Injecting material into the material flow channel from the first port, so that the material flows from the periphery along the spiral material flow channel to the second port at the center; Injecting a heat exchange medium into the heat exchange medium flow channel from the heat exchange medium inlet, so that the heat exchange medium flows from the center of the circle along the spiral heat exchange medium flow channel to the heat exchange medium outlet at the periphery; During the flow of materials and heat exchange medium, heat exchange is performed through the interlayer.

[0014] In a fourth aspect, the present disclosure also provides a method for operating a silicon carbide spiral heat exchanger, comprising: Inject the material into the first port on the periphery of the base at the head end through the material liquid inlet pipe; Inject the heat exchange medium into the heat exchange medium main channel through the heat exchange medium inlet pipe; The material flows from the periphery to the center along the spiral material flow channel. The heat exchange medium enters the heat exchange medium inlet at the center of the circle from the heat exchange medium main channel and flows toward the periphery along the spiral heat exchange medium flow channel. During this process, the material and the heat exchange medium exchange heat through the interlayer. When the material flows out from the second port of the base, the heat exchange process is considered to be completed. The material flows from the second port at the center of the first end substrate into the next stage substrate through the first through hole, and the heat exchange medium enters the heat exchange medium inlet of each stage substrate in parallel from the heat exchange medium main channel, repeating the above heat exchange process; The material flows out from the material flow channel of the tail end base, and the heat exchange medium is discharged from the heat exchange medium outlet on the periphery of each level of the base to the interlayer space, and finally flows out from the heat exchange medium output main pipe.

[0015] In an optional embodiment, the flow velocity V1 of the material in the material flow channel and the flow velocity V2 of the heat exchange medium in the heat exchange medium flow channel satisfy: 0.5 ≤ V1 / V2 ≤ 0.8; Wherein, when the material is a high-viscosity fluid, V1 / V2 takes a lower limit of 0.5; when the material is a low-viscosity fluid, V1 / V2 takes an upper limit of 0.8; and, The high-viscosity material is a medium with a dynamic viscosity of ≥100 mPa·s, and the low-viscosity material is a medium with a dynamic viscosity of ≤10 mPa·s.

[0016] The beneficial effect of the present invention is that the silicon carbide spiral heat exchanger is provided with a heat exchange unit in the shell, and the multiple heat exchange units and the pair of bases in the heat exchange unit are connected in series. The front and back sides of the base are respectively provided with spiral material flow channels and heat exchange medium flow channels, and the two flow channels realize heat exchange through the interlayer between them. Based on the above structure, the silicon carbide spiral heat exchanger can increase the flow rate of the heat exchanger material by simultaneously increasing the number of spiral turns of the spiral material flow channel and the heat exchange medium flow channel or increasing the number of heat exchange units in series. Since the heat exchange medium flow channels of each base are independent parallel pipelines, the heat exchange medium inlet temperature is consistent and there is no cross-interference, which ensures the heat source stability of each heat exchange unit; in addition, the material undergoes a completely consistent spiral flow channel structure in each base, and its heat exchange area with the heat exchange medium remains constant, and the flow resistance of the heat exchange medium flow channel and the material flow channel is relatively stable, thereby avoiding the phenomenon of uneven material heat exchange.

[0017] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objects and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A three-dimensional diagram of a heat exchange channel provided in an embodiment of the present disclosure; Figure 2 A cross-sectional view of a heat exchange channel provided in an embodiment of the present disclosure; Figure 3 A cross-sectional view from the front of a silicon carbide spiral heat exchanger provided in an embodiment of the present disclosure; Figure 4 A cross-sectional view from a side perspective of a silicon carbide spiral heat exchanger provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the assembly of an inner base and a first partition plate of a silicon carbide spiral heat exchanger provided in an embodiment of the present disclosure; Figure 6A schematic diagram of the assembly of an inner base and a first partition of a silicon carbide spiral heat exchanger provided in an embodiment of the present disclosure.

[0021] In the picture: 100. Base; 110. Material flow channel; 111. First port; 112. Second port; 120. Heat exchange medium flow channel; 121. Heat exchange medium inlet; 122. Heat exchange medium outlet; 130. Interlayer; 200. Shell; 210. Interlayer space; 220. Heat exchange medium output main pipe; 230. Flange; 300. Heat exchange unit; 400. First partition; 410. First through hole; 500. Second partition; 510. Second through hole; 600. Heat exchange medium main flow channel; 700. Cover; 710. Threaded hole; 720. Locking bolt; 730. Nut; 740. Heat exchange medium inlet pipe; 750. Material inlet pipe; 760. Material outlet pipe. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0024] As used herein, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." when following a list of elements modify the entire list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0026] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a", "an" and "the" may also be intended to include plural forms, unless otherwise clearly indicated herein. The terms "comprise", "include" and "have" are inclusive and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the particular order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0027] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0028] Research has revealed shortcomings in existing technologies: Traditional heat exchangers generally use shell-and-tube or plate structures. When increasing material flow, traditional shell-and-tube / plate heat exchangers generally adopt the method of "extending the pipeline or adding parallel branches." The extended pipeline method has the following drawbacks: the heat exchange medium of the heat exchanger enters the entire chamber from a single inlet, and there are pressure drops and temperature changes when flowing through different positions. After the pipeline is extended, the heat exchange intensity of the material in the pipeline near the inlet is high, and the heat exchange effect is poor away from the inlet, resulting in uneven heat exchange of the material. The method of adding parallel branches will lead to uneven distribution of flow resistance in the chamber of the shell, resulting in a rush flow effect: the heat exchange efficiency is high in areas with fast flow rate, and the heat exchange efficiency is low in areas with slow flow rate.

[0029] Based on the above research, the embodiments of the present disclosure provide a heat exchange flow channel, a silicon carbide spiral heat exchanger and a working method thereof. The heat exchange unit in the silicon carbide spiral heat exchanger includes a spiral material flow channel and a heat exchange medium flow channel. The material flow channel is connected in series, and the heat exchange medium flow channel is connected in parallel. By increasing the number of turns of the spiral material flow channel and the heat exchange medium flow channel or increasing the number of heat exchange units in series, the material flow rate is increased. The heat exchange medium flow channels connected in parallel avoid the temperature cross-talk of the heat exchange medium and the phenomenon of uneven material heat exchange, thereby solving the above problems.

[0030] The defects in the above solutions are the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure in this article should be the contributions made by the inventors to the present disclosure during the disclosure process.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0032] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0033] See also Figure 1 and Figure 2The embodiment of the present disclosure provides a heat exchange flow channel, comprising: a base 100, with spiral grooves provided on both sides thereof. The grooves on the first side constitute a spiral material flow channel 110, with a first port 111 provided on the periphery thereof and a second port 112 provided at the center thereof. Material is adapted to flow from the first port 111 on the periphery along the material flow channel 110 to the second port 112 at the center thereof. The grooves on the second side constitute a spiral heat exchange medium flow channel 120, with a heat exchange medium inlet 121 provided at the center thereof and a heat exchange medium outlet 122 provided at the periphery thereof. Heat exchange medium is adapted to flow from the heat exchange medium inlet 121 at the center thereof along the heat exchange medium flow channel 120 to the heat exchange medium outlet 122 at the periphery thereof. The material flow channel 110 and the heat exchange medium flow channel 120 are arranged at intervals in a direction perpendicular to the base 100. The cross sections of the two flow channels, due to the intervals, together constitute a continuous S-shaped staggered heat exchange cross-sectional structure. Interlayer 130 is spaced apart between material flow channel 110 and heat exchange medium flow channel 120. During the flow of material and heat exchange medium, heat exchange occurs through interlayer 130. To increase the material flow rate, simply increase the number of spiral turns of both the spiral material flow channel 110 and the heat exchange medium flow channel 120. The material in the base 100 exchanges heat with the heat exchange medium through interlayer 130. The heat exchange area of ​​interlayer 130 remains constant, and the flow resistance of the heat exchange medium in the heat exchange medium flow channel 120 is stable, eliminating the rush flow effect and thus avoiding uneven material heat exchange.

[0034] See also Figure 1 In some embodiments, the material of the substrate 100 is silicon carbide. The thermal conductivity of silicon carbide is better than that of commonly used heat exchanger materials such as stainless steel or titanium alloy, and can significantly improve the heat transfer efficiency of the interlayer 130. The thickness of the interlayer 130 is 3-10 mm, preferably 5 mm.

[0035] See also Figure 3 Some embodiments further provide a silicon carbide spiral heat exchanger, comprising: the heat exchange passages of the aforementioned embodiments; and a housing 200, within which is disposed at least one heat exchange unit 300. The heat exchange unit 300 comprises a pair of substrates 100, with a first partition 400 disposed between the two substrates 100, and a first through-hole 410 disposed at the center of the first partition 400. The first through-hole 410 extends through the second port 112 of adjacent substrates 100, and the material flow passages 110 of adjacent substrates 100 are connected in series via the first through-hole 410. A second partition 500 is disposed between the substrates 100 of adjacent heat exchange units 300, and a second through-hole 510 is disposed at the edge of the second partition 500. The second through-hole 510 extends through the first port 111 of adjacent substrates 100, and the material flow passages 110 of adjacent heat exchange units 300 are connected in series via the second through-hole 510. By increasing the number of heat exchange units 300 connected in series, the flow rate of the heat exchanger material can be increased.

[0036] Continue to see Figure 3 , the material flow path is as follows Figure 3 As indicated by arrow F2, the material enters from the first port 111 on the periphery of the head-end substrate 100, flows along the spiral material flow channel 110 toward the center of the circle to the second port 112. Furthermore, the material flows through the first through-hole 410 to the central inlet (i.e., the second port 112) of the second-stage substrate 100. Within the second-stage substrate 100, the material changes its flow from the center of the circle toward the periphery, ultimately flowing out of the first port 111 of the second-stage substrate 100 and then connecting to the adjacent heat exchange unit 300 in series through the second through-hole 510 of the second partition 500. The material circulates this flow path within the adjacent heat exchange units 300, ultimately flowing out of the first port 111 of the tail-end substrate 100.

[0037] Continue to see Figure 3 The center of the base 100 is provided with a heat exchange medium main channel 600, which passes through the first partition plate 400 and the second partition plate 500 and communicates with the heat exchange medium inlet 121 of each base 100, so that the heat exchange medium flow channels 120 of each base 100 are connected in parallel. Figure 3 As indicated by arrow F1, the heat exchange medium enters the heat exchange medium inlet 121 at the center of each substrate 100 through the heat exchange medium main channel 600, flows along the heat exchange medium flow channel 120 from the center to the periphery, and exits through the heat exchange medium outlet 122. Because the heat exchange medium flow channels 120 of each substrate 100 are independent parallel pipelines, the heat exchange medium inlet 121 has a consistent temperature without cross-interference, ensuring the stability of the heat source of each heat exchange unit 300 and avoiding uneven heat exchange caused by temperature fluctuations between the heat exchange media.

[0038] See also Figure 5 and Figure 6 In some embodiments, the base 100 is tightly fitted with the adjacent first and second separators 400 and 500, so that the material flow channel 110 and the heat exchange medium flow channel 120 form sealed channels with only two ends open between the base 100 and the separators. This tightly fitted sealed channel forces the fluid to flow in a spiral path, preventing cross-flow.

[0039] See also Figure 3 and Figure 4 In some embodiments, a mezzanine space exists between the housing 200 and the base 100. A heat exchange medium output manifold 220 is provided on the housing 200. The mezzanine space is connected to the heat exchange medium output manifold 220. The heat exchange medium in each base 100 flows from the center to the periphery along the heat exchange medium flow channel 120, flows out through the heat exchange medium outlet 122, enters the mezzanine space, and is finally discharged through the heat exchange medium output manifold 220.

[0040] Continue to see Figure 3In some embodiments, a flange 230 is provided on the outer wall of the shell 200, and a cover plate 700 is provided on both sides of the shell 200. Corresponding threaded holes 710 are provided on the cover plate 700 and the flange 230; the cover plate 700 is matched with the threaded holes 710 through locking bolts 720 and nuts 730, and is tightly fitted with the head end base 100 and the tail end base 100 on both sides of the shell 200 respectively.

[0041] Continue to see Figure 3 In some embodiments, a heat exchange medium inlet pipe 740 and a material inlet pipe 750 are provided on the cover plate 700 located at the entrance of the shell 200, and a material outlet pipe 760 is provided on the cover plate 700 located at the rear end of the shell 200; the heat exchange medium inlet pipe 740 passes through the cover plate 700 and is connected to the heat exchange medium main channel 600; the material inlet pipe 750 passes through the cover plate 700 and is connected to the first port 111 of the head end base 100; the material outlet pipe 760 passes through the cover plate 700 and is connected to the first port 111 of the rear end base 100.

[0042] See also Figure 1 and Figure 2 Some embodiments further provide a working method of a heat exchange channel, including: injecting material from a first port 111 into the material channel 110, so that the material flows from the periphery along the spiral material channel 110 to the second port 112 at the center of the circle; injecting a heat exchange medium from a heat exchange medium inlet 121 into the heat exchange medium channel 120, so that the heat exchange medium flows from the center of the circle along the spiral heat exchange medium channel 120 to the heat exchange medium outlet 122 at the periphery; during the flow of the material and the heat exchange medium, heat exchange is performed through the interlayer 130.

[0043] See also Figure 3 Some embodiments further provide a method for operating a silicon carbide spiral heat exchanger, comprising: injecting material into the first port 111 on the periphery of the head end substrate 100 through the material inlet pipe 750; injecting heat exchange medium into the heat exchange medium main channel 600 through the heat exchange medium inlet pipe 740; the material flows from the periphery toward the center along the spiral material flow channel 110, and the heat exchange medium enters the heat exchange medium inlet 121 at the center of the circle from the heat exchange medium main channel 600, and flows toward the periphery along the spiral heat exchange medium flow channel 120. During this process, the material and the heat exchange medium are mixed through the interlayer 130. Heat exchange, when the material flows out from the second port 112 of the substrate, a heat exchange process is considered to be completed; the material flows from the second port 112 at the center of the first end substrate 100 into the next level substrate 100 through the first through hole 410, and the heat exchange medium enters the heat exchange medium inlet 121 of each level substrate 100 in parallel from the heat exchange medium main channel 600, and the above heat exchange process is repeated; the material flows out from the material flow channel 110 of the rear end substrate 100, and the heat exchange medium is discharged from the heat exchange medium outlet 122 on the periphery of each level substrate 100 to the interlayer space, and finally flows out from the heat exchange medium output main pipe 220.

[0044] Continue to see Figure 2 In some embodiments, the material flow velocity V1 in the material flow channel 110 and the heat exchange medium flow velocity V2 in the heat exchange medium flow channel 120 satisfy the following relationship: 0.5 ≤ V1 / V2 ≤ 0.8. For high-viscosity fluids, V1 / V2 has a lower limit of 0.5; for low-viscosity fluids, V1 / V2 has an upper limit of 0.8. Furthermore, high-viscosity fluids have a dynamic viscosity of 100 mPa·s or higher, while low-viscosity fluids have a dynamic viscosity of 10 mPa·s or lower. High-viscosity fluids have a thicker boundary layer; reducing their flow velocity can enhance heat penetration and improve heat exchange efficiency.

[0045] In summary, the present silicon carbide spiral heat exchanger comprises heat exchange units 300 disposed within a housing 200. Multiple heat exchange units 300, as well as a pair of substrates 100 within each heat exchange unit 300, are connected in series. Spiral material flow channels 110 and heat exchange medium flow channels 120 are spaced apart on the front and back surfaces of the substrates 100, respectively. Heat exchange is achieved through an interlayer 130 between the two channels. Based on this structure, the present silicon carbide spiral heat exchanger can increase the flow rate of the heat exchanger material by simultaneously increasing the number of spiral turns of the spiral material flow channels 110 and the heat exchange medium flow channels 120, or by increasing the number of heat exchange units 300 connected in series. Since the heat exchange medium flow channel 120 of each matrix 100 is an independent parallel pipeline, the temperature of the heat exchange medium inlet 121 is consistent and there is no cross-interference, which ensures the stability of the heat source of each heat exchange unit 300; in addition, the material experiences a completely consistent spiral flow channel structure in each matrix 100, and the heat exchange area with the heat exchange medium remains constant, and the flow resistance of the heat exchange medium flow channel 120 and the material flow channel 110 is relatively stable, thereby avoiding the phenomenon of uneven heat exchange of the material.

[0046] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0047] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0048] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0049] In the above discussion, unless otherwise indicated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0050] With the above-described preferred embodiments of the present invention as inspiration, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A heat exchange channel, characterized in that: include: A base body (100) having spiral grooves on both sides thereof; The first side groove constitutes a material flow channel (110), a first port (111) is provided on its outer periphery, and a second port (112) is provided at the center; The second side groove forms a heat exchange medium flow channel (120), a heat exchange medium inlet (121) is provided at the center of the circle, and a heat exchange medium outlet (122) is provided at the periphery; The material flow channel (110) and the heat exchange medium flow channel (120) are arranged at intervals in a direction perpendicular to the base (100), and the cross sections of the two flow channels together form a continuous S-shaped staggered heat exchange cross-sectional structure due to the interval arrangement.

2. The heat exchange channel according to claim 1, wherein: The material of the substrate (100) is silicon carbide, and the thickness of the interlayer (130) between the material flow channel (110) and the heat exchange medium flow channel (120) is 3-10 mm.

3. A silicon carbide spiral heat exchanger, characterized in that: include: The heat exchange channel according to claim 1 or 2; as well as, a housing (200) having at least one heat exchange unit (300) disposed therein; The heat exchange unit (300) comprises a pair of base bodies (100), a first partition (400) is provided between the two base bodies (100), and a first through hole (410) is provided at the center of the first partition (400); The first through hole (410) penetrates the second port (112) of the adjacent substrate (100), and the material flow channels (110) of the adjacent substrates (100) are connected in series via the first through hole (410); A second partition plate (500) is provided between the base bodies (100) of adjacent heat exchange units (300), and a second through hole (510) is provided at an edge of the second partition plate (500); The second through hole (510) penetrates the first port (111) of the adjacent base body (100), and the material flow channels (110) of the adjacent heat exchange units (300) are connected in series via the second through hole (510); The heat exchange medium main channel (600) passes through the first partition plate (400) and the second partition plate (500) and is connected to the heat exchange medium inlet (121) of each substrate (100), so that the heat exchange medium flow channels (120) of each substrate (100) are connected in parallel.

4. The silicon carbide spiral heat exchanger according to claim 3, characterized in that: The base (100) is tightly fitted with the adjacent first partition (400) and second partition (500), so that the material flow channel (110) and the heat exchange medium flow channel (120) form a sealed pipeline with only two ends open between the base (100) and the partition.

5. The silicon carbide spiral heat exchanger according to claim 3, characterized in that: There is an interlayer space (210) between the shell (200) and the base (100); and a heat exchange medium output main pipe (220) is provided on the shell (200); The interlayer space (210) is in communication with the heat exchange medium output main pipe (220).

6. The silicon carbide spiral heat exchanger according to claim 3, characterized in that: The outer wall of the housing (200) is provided with a flange (230), and cover plates (700) are further provided on both sides of the housing (200), and threaded holes (710) are provided on the cover plates (700) and the flange (230) at corresponding positions; The cover plate (700) is matched with the threaded hole (710) through the locking bolt (720), the nut (730), and is tightly fitted with the base (100) on both sides of the shell (200).

7. The silicon carbide spiral heat exchanger according to claim 6, characterized in that: A heat exchange medium inlet pipe (740) and a material inlet pipe (750) are provided on the cover plate (700) located at the inlet of the shell (200), and a material outlet pipe (760) is provided on the cover plate (700) located at the rear end of the shell (200); and, The heat exchange medium liquid inlet pipe (740) passes through the cover plate (700) and is in communication with the heat exchange medium main channel (600); The material liquid inlet pipe (750) passes through the cover plate (700) and is in communication with the first port (111) of the head end base (100); The material liquid outlet pipe (760) passes through the cover plate (700) and is in communication with the first port (111) of the tail end base (100).

8. A method for operating a heat exchange channel according to claim 1 or 2, characterized in that: include: Injecting material from the first port (111) into the material flow channel (110), so that the material flows from the periphery along the spiral material flow channel (110) to the second port (112) at the center; Injecting a heat exchange medium from the heat exchange medium inlet (121) into the heat exchange medium flow channel (120), so that the heat exchange medium flows from the center of the circle along the spiral heat exchange medium flow channel (120) to the heat exchange medium outlet (122) at the periphery; During the flow of materials and heat exchange medium, heat exchange is performed through the interlayer (130).

9. A method for operating a silicon carbide spiral heat exchanger, characterized in that: include: Injecting material into the first port (111) on the periphery of the head end base (100) through the material liquid inlet pipe (750); Injecting the heat exchange medium into the heat exchange medium main channel (600) through the heat exchange medium liquid inlet pipe (740); The material flows from the periphery toward the center of the circle along the spiral material flow channel (110), and the heat exchange medium enters the heat exchange medium inlet (121) at the center of the circle from the heat exchange medium main flow channel (600), and flows toward the periphery along the spiral heat exchange medium flow channel (120). During this process, the material and the heat exchange medium exchange heat through the interlayer (130). When the material flows out from the second port (112) of the base, it is considered that a heat exchange process is completed; The material flows from the second port (112) at the center of the first end substrate (100) through the first through hole (410) into the next stage substrate (100), and the heat exchange medium enters the heat exchange medium inlet (121) of each stage substrate (100) in parallel from the heat exchange medium main channel (600), repeating the above heat exchange process; The material flows out from the material flow channel (110) of the tail end base (100), and the heat exchange medium is discharged from the heat exchange medium outlet (122) on the periphery of each level of the base (100) to the interlayer space (210), and finally flows out from the heat exchange medium output main pipe (220).

10. The working method according to claim 9, characterized in that: The flow velocity V1 of the material in the material flow channel (110) and the flow velocity V2 of the heat exchange medium in the heat exchange medium flow channel (120) satisfy: 0.5 ≤ V1 / V2 ≤ 0.8; Wherein, when the material is a high-viscosity fluid, V1 / V2 takes a lower limit of 0.5; when the material is a low-viscosity fluid, V1 / V2 takes an upper limit of 0.8; and, The high-viscosity material is a medium with a dynamic viscosity of ≥100 mPa·s, and the low-viscosity material is a medium with a dynamic viscosity of ≤10 mPa·s.

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