Intelligent electronic component automatic test system

Abstract

The invention relates to the technical field of test systems, in particular to an intelligent electronic component automatic test system which comprises a test device, a test bearing mechanism is arranged in the test device, the test bearing mechanism is matched with an electronic component to test the electronic component, a device bearing assembly is arranged on the test bearing mechanism, and the device bearing assembly is matched with the electronic component. The electronic component is supported through the device bearing assembly, the position adjusting mechanism and the device fixing assembly are installed on the test bearing mechanism, the position adjusting mechanism adjusts the position of the electronic component so that the electronic component can be accurately positioned, and when the electronic component is tested, the electronic component can be accurately fixed through the device fixing assembly. A worker only needs to place the electronic component on the device bearing plate without precise installation operation, automatic fixation of the electronic component and insertion of the pins of the electronic component can be realized by pushing the test bearing table into the test device, synchronous fixation of a plurality of samples can be realized, the fixing efficiency is high, and the test efficiency is high. And the damage to the pins caused by human factors is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of testing systems, in particular to an intelligent electronic component automatic testing system. Background Art

[0002] Thermal cycling testing is an important part of the reliability testing of intelligent electronic components. By simulating a temperature change environment, the stability of their mechanical and electrical properties can be evaluated. In thermal cycling testing, fixing electronic components is an important step, mainly to ensure the stability of components during the test and the accuracy of test results. That is, in thermal cycling testing, rapid changes in temperature may cause components to expand and contract thermally. If the position of components changes during the test, it may lead to inconsistent and non-repeatable test results. Fixing components can simulate their installation status in actual applications, making the test conditions closer to the actual use environment. When fixing electronic components, workers often need to fix the electronic component samples one by one, which is not only troublesome but also inefficient. In order to ensure the most realistic installation state, jacks are often provided to match the pins on the electronic components, and the size of the jacks and pins are adapted. This requires workers to pay special attention to avoid damaging the pins when plugging them in, further affecting the installation efficiency of components. Summary of the Invention

[0003] The object of the present invention is to provide an intelligent electronic component automatic testing system to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: An intelligent electronic component automatic testing system includes a testing device, wherein the testing device is provided with a test carrying mechanism, and the test carrying mechanism cooperates with the electronic component to test the electronic component; The test carrying mechanism is provided with a device carrying assembly, which supports the electronic components through the device carrying assembly, and the test carrying mechanism is installed with a position adjustment mechanism and a device fixing assembly; The position adjustment mechanism adjusts the position of the electronic components to enable them to be accurately positioned; The device fixing assembly cooperates with the position adjustment mechanism to fix the electronic components.

[0005] Preferably, the test carrying mechanism includes a test carrier, a displacement carrier bar and an ejection frame. The test carrier is movably mounted on the test device. The displacement carrier bar is connected to the test carrier and can lock the test carrier.

[0006] Preferably, the ejector rack is mounted on the test platform, and the test platform can be unlocked by the ejector rack.

[0007] Preferably, the device carrying assembly is a movable carrier bar, so the movable carrier bar is connected to the displacement carrier bar, and the displacement carrier bar drives the movable carrier bar to move up and down.

[0008] Preferably, the movable carrier is movably connected to the test platform, and the test platform can drive the movable carrier to move synchronously.

[0009] Preferably, the position adjustment mechanism includes a movable support bar, a connecting strip plate and a limiting push rod, and when the movable carrier bar moves downward, it drives the movable support bar to move toward the electronic component.

[0010] Preferably, when the movable carrier bar moves downward, it also drives the limiting push rod to move toward the electronic component, and the position of the electronic component is adjusted from both ends through the cooperation between the movable carrier bar and the limiting push rod.

[0011] Preferably, the movable support bar is connected to the connecting strip plate, and when the movable support bar moves, it drives the connecting strip plate to rotate, thereby allowing the connecting strip plate to adjust the position of the electronic component from both sides.

[0012] Preferably, the device fixing assembly includes a gravity frame and a lower pressure carrier. When the movable carrier moves downward, the gravity frame is driven to rotate, so that the gravity frame drives the lower pressure carrier to move downward relative to the movable carrier.

[0013] Preferably, the lower pressure carrier presses on the electronic components to press and fix the electronic components from above.

[0014] Compared with the prior art, the present invention has the following advantages: 1. When testing electronic components, workers only need to place them on the component carrier. There is no need to perform precise installation operations. Pushing the test carrier into the test device can automatically fix the electronic components and plug in their pins. This is very convenient and can achieve simultaneous fixation of multiple samples with high fixation efficiency and will not cause damage to the pins due to human factors.

[0015] 2. When the test platform moves into the interior of the test device, it will drive the movable carrier bar to move downward. As the movable carrier bar moves downward, it will also drive the movable support bar and the limit push rod to move, thereby pushing the electronic components to adjust their positions. At the same time, as the movable support bar moves, it will drive the rotating top plate to rotate, and the position of the electronic components can also be adjusted under the action of the rotating top plate, that is, the electronic components can be accurately positioned on the movable carrier bar to prepare for the insertion of the pins.

[0016] 3. As the movable carrier moves further downward, the gravity frame will rotate, which in turn can drive the lower pressure carrier to move downward relative to the movable carrier, so that it presses on the electronic components to achieve complete fixation of the electronic components. At the same time, it will also drive the pins on the electronic components to be smoothly and accurately inserted into the pin matching holes, and no manual operation is required when removing them, fully ensuring the safety of the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the test device assembly.

[0018] Figure 2 Schematic diagram of the assembly of the test device and the test platform.

[0019] Figure 3 Schematic diagram of the test device.

[0020] Figure 4 A first-person perspective diagram of the test platform assembly.

[0021] Figure 5 A second-view diagram of the test platform assembly.

[0022] Figure 6 Schematic diagram of the test platform structure.

[0023] Figure 7 A first-person perspective diagram of the mobile carrier assembly.

[0024] Figure 8 A second-view diagram of the mobile carrier assembly.

[0025] Figure 9 It is a structural diagram of the mobile carrier.

[0026] Figure 10 Exploded view of the joining strip assembly.

[0027] Figure 11 Schematic diagram of the gravity frame structure.

[0028] In the figure: 1. test device; 11. intracavity bearing block; 12. bearing block matching hole; 13. intracavity bearing rod; 2. test carrier; 21. supporting convex block; 22. supporting guide hole; 23. movable bearing hole; 24. locking bearing hole; 25. simulation protrusion; 26. pin matching hole; 27. matching boss; 28. matching vertical bar; 281. matching inclined bar; 29. ​​lower supporting frame; 3. displacement carrying bar; 31. limiting carrying rod; 32. bearing driving bar; 33. bearing socket; 34. locking rod; 35. connecting rod; 4. ejector frame; 41. operating rod; 42. ejector rod; 5. movable carrying bar; 51. movable sleeve hole; 52. lower inserting bearing rod; 53. device carrier plate; 54. first matching channel; 55. second matching channel; 56. upper convex plate; 561. Mounting socket; 57. Load-bearing column; 571. Upper top plate; 58. External protrusion; 581. Limiting groove; 582. Load-bearing through hole; 59. Lower protrusion; 591. Supporting column; 592. Limiting end plate; 6. Moving support bar; 61. Pushing plate; 62. Load-bearing support rod; 63. Connecting support rod; 64. First spring; 65. Connecting load block; 66. Matching rod; 7. Connecting strip plate; 71. Sleeve connecting hole; 72. Extension plate; 73. Matching connecting column; 74. Rotating top plate; 75. Rotating support hole; 76. Matching connecting hole; 8. Limiting top rod; 81. Second spring; 82. Limiting top plate; 83. Matching load block; 9. Gravity frame; 91. Load-bearing rotating hole; 92. Connecting channel; 93. Lower pressure load frame; 94. Connecting column. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] The present invention provides a technical solution: like Figure 1 and Figure 2 As shown, an intelligent electronic component automatic testing system includes a testing device 1, in which a test carrying mechanism is provided. The test carrying mechanism cooperates with electronic components to test the electronic components. A device carrying assembly is provided on the test carrying mechanism to support the electronic components through the device carrying assembly. A position adjustment mechanism and a device fixing assembly are installed on the test carrying mechanism. The position adjustment mechanism adjusts the position of the electronic components to enable them to be accurately positioned. The device fixing assembly cooperates with the position adjustment mechanism to fix the electronic components.

[0031] like Figure 3As shown, the test device 1 is symmetrically fixed with an intra-cavity support block 11 , a support block matching hole 12 is opened on the intra-cavity support block 11 , and an intra-cavity support rod 13 is fixedly provided on the intra-cavity support block 11 .

[0032] The test carrying mechanism includes a test carrier 2, a displacement carrier bar 3 and an ejector rack 4. The test carrier 2 is movably installed on the test device 1. The displacement carrier bar 3 is connected to the test carrier 2 and can lock the test carrier 2. The ejector rack 4 is installed on the test carrier 2 and can unlock the test carrier 2 through the ejector rack 4.

[0033] like Figure 2 、 Figure 4 、 Figure 5 and Figure 6 As shown, a supporting protrusion 21 is fixedly provided on the test platform 2, a supporting guide hole 22 is provided on the supporting protrusion 21, a movable bearing hole 23 is symmetrically provided on the test platform 2, an intracavity bearing rod 13 is inserted in the movable bearing hole 23, and locking holes 24 are respectively provided at both ends of the test platform 2, and the locking holes 24 at both ends respectively lock the test platform 2 when it is in different positions, a number of simulation protrusions 25 are fixedly provided on the test platform 2, a pin matching hole 26 is provided on the simulation protrusion 25, a matching boss 27 is fixedly provided on the test platform 2 next to the simulation protrusion 25, a matching vertical bar 28 is also fixedly provided on the test platform 2 next to the matching boss 27, and a matching inclined strip 281 is symmetrically provided on the matching vertical bar 28, and a lower supporting base frame 29 is fixedly provided at the lower end of the test platform 2.

[0034] A limiting load rod 31 is symmetrically fixed on the displacement load bar 3, and the limiting load rod 31 is inserted in the matching hole 12 of the bearing block, and a load-bearing driving bar 32 is fixed on the upper end of the limiting load rod 31. A load-bearing socket 33 is provided on the load-bearing driving bar 32, and a locking rod 34 is inserted in the load-bearing socket 33. The locking rod 34 cooperates with the locking hole 24 to fix the test platform 2. A connecting rod 35 is symmetrically hinged on the displacement load bar 3, and the other end of the connecting rod 35 is hinged to the test platform 2.

[0035] An operating rod 41 and an ejection rod 42 are fixedly provided on the ejection frame 4. The ejection rod 42 is inserted into the locking hole 24 from the lower side of the locking hole 24. The ejection frame 4 is in contact with the lower supporting frame 29 before it moves upward.

[0036] like Figure 4 、 Figure 5 、 Figure 8 and Figure 9 As shown, the device carrying assembly is a movable carrier bar 5 , so the movable carrier bar 5 is connected to the displacement carrier bar 3 , and the displacement carrier bar 3 drives the movable carrier bar 5 to move up and down.

[0037] The movable carrier bar 5 is symmetrically provided with movable sleeve holes 51, and the movable sleeve holes 51 are inserted into the bearing driving bar 32. The movable carrier bar 5 is fixedly provided with a lower inserting rod 52, and the lower inserting rod 52 is inserted into the supporting guide hole 22. A plurality of device support plates 53 are fixedly provided on the movable carrier bar 5, and a first matching channel 54 and a second matching channel 55 are provided on the device support plate 53. An upper convex plate 56 is fixedly provided on the device support plate 53 between the first matching channel 54 and the second matching channel 55. An installation socket 561 is provided, and supporting columns 57 are symmetrically fixed on both sides of the second matching channel 55, and an upper top plate 571 is fixed on the supporting columns 57. External protrusions 58 are also symmetrically fixed on both sides of the device support plate 53, and a limiting groove 581 and a supporting through hole 582 are provided on the external protrusions 58. A lower protrusion 59 is fixed on the lower end of the device support plate 53, and supporting columns 591 are symmetrically fixed on both sides of the lower protrusion 59, and a limiting end plate 592 is fixed on the supporting columns 591.

[0038] The movable carrier bar 5 is movably connected to the test platform 2 , and the test platform 2 can drive the movable carrier bar 5 to move synchronously.

[0039] like Figure 6 、 Figure 7 、 Figure 10 and Figure 11 As shown, the position adjustment mechanism includes a movable support bar 6, a connecting strip plate 7 and a limiting push rod 8. When the movable carrier bar 5 moves downward, it drives the movable support bar 6 to move toward the electronic components.

[0040] A push plate 61 is fixedly provided on the mobile support bar 6, and a load-bearing rod 62 is symmetrically fixedly provided on both sides of the push plate 61. A connecting rod 63 is also symmetrically fixedly provided on the mobile support bar 6. The connecting rod 63 is inserted into the load-bearing through hole 582. A first spring 64 is sleeved on the connecting rod 63. The two ends of the first spring 64 are respectively fixed on the mobile support bar 6 and the outer protrusion 58. The other end of the connecting rod 63 is fixedly provided with a connecting load block 65. A matching rod 66 is fixedly provided on the connecting load block 65. The matching rod 66 is in contact with the matching inclined surface 281 on the matching vertical bar 28 near one end of the mobile carrier bar 5.

[0041] like Figure 4 、 Figure 6 and Figure 7As shown, when the movable carrier bar 5 moves downward, it also drives the limiting push rod 8 to move toward the direction of the electronic components. The position of the electronic components is adjusted from both ends through the cooperation between the movable support bar 6 and the limiting push rod 8. The limiting push rod 8 is inserted into the mounting socket 561 on the upper convex plate 56. One end of the limiting push rod 8 is fixedly provided with a limiting top plate 82, and the other end is fixedly provided with a matching carrier block 83. The matching carrier block 83 contacts the matching inclined surface 281 on the matching vertical bar 28 away from the end of the movable carrier bar 5. The limiting push rod 8 is also sleeved with a second spring 81, and the two ends of the second spring 81 are respectively fixed on the matching carrier block 83 and the upper convex plate 56.

[0042] like Figure 7 and Figure 10 As shown, the movable support bar 6 is connected to the connecting strip 7. When the movable support bar 6 moves, it will drive the connecting strip 7 to rotate, thereby allowing the connecting strip 7 to adjust its position from both sides of the electronic component. A sleeve connecting hole 71 is provided at one end of the connecting strip 7, and a load-bearing support rod 62 is inserted into the sleeve connecting hole 71. The other end of the connecting strip 7 is symmetrically fixed with an extension plate 72, and a matching connecting column 73 is fixed between the extension plates 72. The matching connecting column 73 is connected to a rotating top plate 74. A rotating bearing hole 75 is provided on the rotating top plate 74, and a load-bearing column 57 is inserted into the rotating bearing hole 75. The rotating top plate 74 is also provided with a matching connecting hole 76, and a matching connecting column 73 is inserted into the matching connecting hole 76.

[0043] like Figure 8 and Figure 11 As shown, the device fixing assembly includes a gravity frame 9 and a lower pressure carrier 93. When the movable carrier bar 5 moves downward, it will drive the gravity frame 9 to rotate, so that the gravity frame 9 drives the lower pressure carrier 93 to move downward relative to the movable carrier bar 5. The lower pressure carrier 93 presses on the electronic components and presses and fixes them from above. The gravity frame 9 is located below the device support plate 53. The gravity frame 9 is symmetrically provided with load-bearing rotation holes 91, and the load-bearing rotation holes 91 are inserted with support columns 591, and the gravity frame 9 is also symmetrically provided with connecting channels 92. The connecting channels 92 are connected to the lower pressure carrier 93, and the lower pressure carrier 93 is inserted in the limiting groove 581, and the lower end of the lower pressure carrier 93 is symmetrically fixed with connecting columns 94, which are inserted in the connecting channel 92, and the connecting columns 94 are in contact with the inner wall of the connecting channel 92.

[0044] When testing electronic components, they are placed on the component carrier 53 so that the pins pass through the second matching channel 55. There is no need for staff to fix them, only to perform the placement operation, which is more convenient and quick. After placing the electronic components, the ejector frame 4 is pulled upward by the operating rod 41, so that the ejector rod 42 ejects the locking rod 34 inserted in the locking hole 24, so that the test carrier 2 is in an unlocked state, and the test carrier 2 can be pushed to move inside the test device 1, and the ejector frame 4 is released to move it downward until the test carrier 2 moves to the working point. At this time, the locking rod 34 is aligned with the other locking hole 24, so that under the action of gravity, the locking rod 34 will be inserted into the locking hole 24 aligned with it. The locking hole 24 is used to fix the test carrier 2. When the test carrier 2 moves into the interior of the test device 1, the connecting rod 35 drives the displacement carrier 3 to move downward. As the displacement carrier 3 moves downward, it drives the movable carrier 5 downward. As the movable carrier 5 moves downward, the matching inclined surface 281 at one end of the matching vertical bar 28 drives the matching rod 66 to move in the direction of the movable carrier 5. This can drive the push plate 61 to move and push the electronic component from one end. At the same time, the matching inclined surface 281 at the other end of the matching vertical bar 28 pushes the matching carrier block 83 to move away from the movable carrier 5, so that the limiting top plate 82 is aligned with the electronic component from the other end. When the movable support bar 6 moves, it will push the rotating top plate 74 to rotate under the action of the matching connecting column 73, so that the electronic component can be pushed from both sides under the action of the rotating top plate 74. In this way, the position of the electronic component can be adjusted under the cooperation of the pushing plate 61, the limiting top plate 82 and the rotating top plate 74, so that it can be positioned accurately and finally limited by the pushing plate 61, the limiting top plate 82 and the rotating top plate 74. When the position of the electronic component is adjusted, the pins on the electronic component are aligned with the pin matching holes 26 on the simulation protrusion 25. As the movable carrier bar 5 moves further downward, the gravity frame 9 will contact the matching boss 27, so that under the restriction of the matching boss 27, the electronic component can be adjusted. The end of the gravity frame 9 connected to the lower pressure carrier 93 will be driven to rotate downward. As the gravity frame 9 rotates, it will drive the lower pressure carrier 93 to move downward, so that the lower pressure carrier 93 is pressed on the electronic components to achieve complete fixation of the electronic components. At the same time, as the movable carrier bar 5 moves downward, the pins on the electronic components will be plugged into the pin matching holes 26 to complete the pin insertion. No manual operation is required in the whole process, which is very convenient and can achieve synchronous fixation of multiple samples with high efficiency. It also avoids the phenomenon of pin damage caused by manual operation. When the test is completed, the ejection frame 4 is moved upward again to make the locking rod 34 move upward to unlock the test carrier 2, and then the test carrier 2 can be pulled to the outside of the test device 1.As the test platform 2 moves outward, it drives the movable carrier bar 5 upward. Gravity then causes the gravity frame 9 to rotate in the opposite direction, driving the lower pressure carrier 93 upward to release the electronic components. Simultaneously, the first spring 64 and the second spring 81 respectively reset the movable support bar 6 and the limit push rod 8, thereby completely releasing the electronic components and allowing them to be quickly removed. At this point, the pins have already moved out of the pin mating holes 26, and the components used to adjust and fix the position of the electronic components are also located away from the electronic components, allowing them to be quickly and conveniently removed.

[0045] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent electronic component automatic testing system, comprising a testing device, characterized in that: The test device is provided with a test carrying mechanism, and the test carrying mechanism cooperates with the electronic components to test the electronic components; The test carrying mechanism is provided with a device carrying assembly, which supports the electronic components through the device carrying assembly, and the test carrying mechanism is installed with a position adjustment mechanism and a device fixing assembly; The position adjustment mechanism adjusts the position of the electronic components to enable them to be accurately positioned; The device fixing assembly cooperates with the position adjustment mechanism to fix the electronic components.

2. The intelligent electronic component automatic testing system according to claim 1, characterized in that: The test carrying mechanism includes a test carrier, a displacement carrier bar and an ejection frame. The test carrier is movably installed on the test device. The displacement carrier bar is connected to the test carrier and can lock the test carrier.

3. The intelligent electronic component automatic testing system according to claim 2, characterized in that: The ejector frame is mounted on the test platform, and the test platform can be unlocked by the ejector frame.

4. The intelligent electronic component automatic testing system according to claim 3, characterized in that: The device carrying assembly is a movable carrier bar, so the movable carrier bar is connected to the variable position carrier bar, and the variable position carrier bar drives the movable carrier bar to move up and down.

5. The intelligent electronic component automatic testing system according to claim 4, characterized in that: The movable carrier is movably connected to the test platform, and the test platform can drive the movable carrier to move synchronously.

6. The intelligent electronic component automatic testing system according to claim 5, characterized in that: The position adjustment mechanism includes a movable support bar, a connecting strip plate and a limiting push rod. When the movable carrier bar moves downward, it drives the movable support bar to move toward the direction of the electronic component.

7. The intelligent electronic component automatic testing system according to claim 6, characterized in that: When the movable carrier bar moves downward, it also drives the limiting push rod to move toward the electronic component. Through the cooperation between the movable carrier bar and the limiting push rod, the position of the electronic component is adjusted from both ends.

8. The intelligent electronic component automatic testing system according to claim 7, characterized in that: The movable support bar is connected to the connecting strip plate. When the movable support bar moves, it drives the connecting strip plate to rotate, thereby allowing the connecting strip plate to adjust the position of the electronic component from both sides.

9. The intelligent electronic component automatic testing system according to claim 8, characterized in that: The device fixing assembly includes a gravity frame and a lower pressure carrier. When the movable carrier moves downward, the gravity frame is driven to rotate, so that the gravity frame drives the lower pressure carrier to move downward relative to the movable carrier.

10. The intelligent electronic component automatic testing system according to claim 9, characterized in that: The lower pressure carrier presses on the electronic components to press and fix the electronic components from above.

Images