Vertical probe head

Abstract

The invention relates to a vertical probe head, comprising: a probe; an upper cover plate module; a lower cover plate module; each probe guide hole penetrates through the upper cover plate module and the lower cover plate module in the longitudinal direction, and each needle point part can be arranged in the corresponding probe guide hole in the lower cover plate module in a penetrating mode; the lower cover plate module comprises a first lower cover plate unit and a second lower cover plate unit which are fixedly arranged, the first lower cover plate unit is located on the upper side of the second lower cover plate unit, and each probe guide hole comprises a first guide hole formed in the first lower cover plate unit and a second guide hole formed in the second lower cover plate unit; wherein the first guide hole and the second guide hole are communicated up and down and are selectively arranged in a staggered manner in the transverse direction, so that the needle point part penetrating through the first guide hole and the second guide hole can be restrained in the transverse direction. According to the scheme, the position accuracy of the needle tip can be effectively improved, and deflection of the needle tip part of the probe is controlled.

Description

Technical Field

[0001] The present invention relates to the technical field of probe cards, and in particular to a vertical probe head. Background Art

[0002] As we all know, in the CP test before chip packaging, vertical probe heads are often used to test the electrical performance of the internal circuits of the chip. A common vertical probe head structure currently allows the probe to pass through the guide holes of the upper and lower cover plates and remain slidable, and controls the bending of the probe through the relative misalignment of the guide holes. During the test, the contact tip of the probe drives the needle tip part of the probe to slide in the guide hole under the push of the chip test point, and the needle arm part produces elastic bending. Under the bending force, the contact tip of the needle tip part and the contact tail end of the needle tail part stably contact the test point on the chip and the C4 point on the probe card board respectively, thus turning on the test circuit. Due to the gap between the probe and the guide hole, the contact tip of the probe will produce lateral deviation (such as the attached Figure 17 The change in the contact tip position will affect the contact accuracy and reliability between the contact tip and the chip test point. Summary of the Invention

[0003] The purpose of the present application is to provide a vertical probe head with a controllable contact tip position of a probe, so as to solve the problem of the contact tip position deflecting when the needle tip portion of the probe slides in a guide hole.

[0004] To this end, the present application provides a vertical probe head, comprising: a plurality of probes, each of the probes extending longitudinally and having a needle tip portion, a needle tail portion, and a needle arm portion located at the needle tail portion of the needle tip portion, the needle tip portion having a contact tip for contacting the device to be tested during testing, and each of the probes being able to bend and deform the needle arm portion when a load is applied thereto; an upper cover module; a lower cover module; and a plurality of probe guide holes, each of the probe guide holes respectively penetrating the upper cover module and the lower cover module longitudinally, and each of the needle tip portions being able to pass through the corresponding probe guide holes located on the lower cover module. and making the contact tip extend downward from the probe guide hole; wherein, the lower cover module includes a first lower cover unit and a second lower cover unit that are fixedly arranged, the first lower cover unit is located on the upper side of the second lower cover unit, and each of the probe guide holes includes a first guide hole arranged on the first lower cover unit and a second guide hole arranged on the second lower cover unit; wherein, the first guide hole and the second guide hole are connected vertically and can be optionally staggered in the lateral direction, so that the needle tip part passing through the first guide hole and the second guide hole can be constrained along the lateral direction.

[0005] The technical solution of the present application provides lateral constraint on the needle tip portion of the probe by controlling the relative misalignment of the first and second guide holes of the first and second lower cover plate units, which can reduce the lateral deflection of the contact tip and ensure that the position of the contact tip relative to the chip test point remains unchanged during the process of sliding the needle tip portion of the probe in the guide hole of the probe, thereby improving the test accuracy and reliability of the probe head.

[0006] In some preferred embodiments, the first lower cover unit is provided with a plurality of first positioning holes, and the second lower cover unit is provided with a plurality of second positioning holes, and the plurality of first positioning holes and the plurality of second positioning holes correspond one to one and constitute a plurality of positioning pin holes for positioning pins to be inserted therein.

[0007] In some preferred embodiments, among the several positioning pin holes, the first positioning hole and the corresponding second positioning pin hole in at least one of the positioning pin holes are coaxially arranged, and the first positioning hole and the corresponding second positioning pin hole in at least one of the positioning pin holes are staggered in the transverse direction.

[0008] In some preferred embodiments, the first positioning holes and the corresponding second positioning holes in the plurality of positioning pin holes are all staggered in the transverse direction and the amounts of their staggering are not exactly the same.

[0009] In some preferred embodiments, the first lower cover plate unit includes a fixed first lower cover plate and a first lower cover plate pad; in the first lower cover plate unit, the aperture of the first positioning hole located on the first lower cover plate is smaller than the aperture of the first pin hole located on the first lower cover plate pad; the second lower cover plate unit includes a fixed second lower cover plate and a second lower cover plate pad; in the second lower cover plate unit, the aperture of the second positioning hole located on the second lower cover plate is smaller than the aperture of the second positioning hole located on the second lower cover plate pad.

[0010] In some preferred embodiments, the first lower cover plate unit is provided with a first lower cover plate glass sheet with first scale lines, and the second lower cover plate unit is provided with a second lower cover plate glass sheet with second scale lines. The first lower cover plate glass sheet and the second lower cover plate glass sheet are bonded together and configured to indicate the relative offset between the first guide hole and the second guide hole in the lateral direction by the relative position of the first scale lines and the second scale lines thereon. In these embodiments, by providing glass sheets with scale lines on the first and second lower cover plate units of the lower cover plate template, the scale lines are used to indicate the relative position of the first and second lower cover plate units in the lateral direction during assembly, thereby improving assembly accuracy and precisely controlling the relative offset between the first and second lower guide holes.

[0011] In some preferred embodiments, the first lower cover unit and / or the upper cover unit are provided with light-transmitting holes for observing the first and second scale lines from the outside.

[0012] In some preferred embodiments, the first lower cover glass sheet and the second lower cover glass sheet each have an upper surface and a lower surface relative to each other; wherein, one of the upper surface and the lower surface is a scale line surface provided with the first or second scale line, and the other surface is a transparent blank surface; the corresponding scale line surfaces of the first lower cover glass sheet and the second lower cover glass sheet are bonded together, and the corresponding transparent blank surfaces face the light-transmitting hole.

[0013] In some preferred embodiments, the probe guide hole located on the upper cover plate module and the probe guide hole located on the lower cover plate module are staggered in the transverse direction, and the relative staggered amount of the probe guide hole located on the upper cover plate module and the probe guide hole located on the lower cover plate module in the transverse direction is greater than the relative staggered amount of the first guide hole and the second guide hole in the transverse direction.

[0014] In some preferred embodiments, the upper cover module includes a first upper cover unit and a second upper cover unit that are fixedly arranged, the first upper cover unit is located on the upper side of the second upper cover unit, and each of the probe guide holes includes a third guide hole arranged on the first upper cover unit and a fourth guide hole arranged on the second upper cover unit; wherein the third guide hole and the fourth guide hole are connected vertically and are staggered in the transverse direction, so that the needle tail part passing through the third guide hole and the fourth guide hole can be constrained along the transverse direction.

[0015] In some preferred embodiments, a dislocation direction of the second guide hole relative to the first guide hole in the transverse direction is opposite to a dislocation direction of the fourth guide hole relative to the third guide hole in the transverse direction.

[0016] In some preferred embodiments, the vertical probe head also includes: an intermediate support member, the upper cover module and the lower cover module are respectively fixed on the upper and lower side surfaces of the intermediate support member, and the middle part of the intermediate support member is provided with a groove running through the upper and lower surfaces, and the size range of the groove is larger than the distribution range of the several probe guide holes.

[0017] Other advantages of the present application will be described in detail in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional schematic diagram of a vertical probe head according to an embodiment of the present application;

[0019] Figure 2 for Figure 1 A bottom view of the vertical probe head shown in FIG;

[0020] Figure 3 for Figure 1 An exploded view of the vertical probe head shown in FIG; wherein the fastening screws are omitted;

[0021] Figure 4 This is a three-dimensional schematic diagram of a first lower cover glass sheet according to an embodiment of the present application;

[0022] Figure 5 This is a three-dimensional schematic diagram of a second lower cover glass sheet according to an embodiment of the present application;

[0023] Figure 6 for Figure 2 A partial cross-sectional view of the lower cover module at CC;

[0024] Figure 7 A schematic three-dimensional diagram of a probe according to an embodiment of the present application;

[0025] Figure 8 This is a schematic plan view of a first upper cover plate according to an embodiment of the present application;

[0026] Figure 9 This is a schematic plan view of the first upper cover plate cushion layer according to one embodiment of the present application;

[0027] Figure 10 This is a schematic plan view of a second upper cover plate according to an embodiment of the present application;

[0028] Figure 11 This is a schematic plan view of the second upper cover plate cushion layer according to one embodiment of the present application;

[0029] Figure 12 This is a schematic plan view of a first lower cover plate according to an embodiment of the present application;

[0030] Figure 13 This is a schematic plan view of the first lower cover plate cushion layer according to one embodiment of the present application;

[0031] Figure 14 This is a schematic plan view of the second lower cover plate according to an embodiment of the present application;

[0032] Figure 15 This is a schematic plan view of the second lower cover plate cushion layer according to one embodiment of the present application;

[0033] Figure 16 This is a schematic diagram of a single probe in an assembled state, which is inserted into the first upper cover plate, the second upper cover plate, the first lower cover plate, and the second lower cover plate, and the first and second lower guide holes are not misaligned;

[0034] Figure 17 for Figure 16 An enlarged schematic diagram at F;

[0035] Figure 18 This is a schematic diagram of a single probe in an assembled state, which penetrates the first upper cover plate, the second upper cover plate, the first lower cover plate, and the second lower cover plate, and the first and second lower guide holes are misaligned;

[0036] Figure 19 for Figure 18 An enlarged schematic diagram at F;

[0037] Figure 20 for Figure 18 Enlarged schematic diagram at P;

[0038] Figure 21 for Figure 4 A bottom view of the first lower cover glass sheet;

[0039] Figure 22 for Figure 5 A schematic top view of the second lower cover glass sheet;

[0040] Figure 23 for Figure 4 and Figure 5 Schematic diagram of the first and second lower cover glass sheets aligned;

[0041] Figure 24 for Figure 4 and Figure 5 Schematic diagram of the first and second lower cover glass sheets in the misaligned state.

[0042] The component numbers in the accompanying drawings are as follows:

[0043] 900, probe head;

[0044] 10. Upper cover module; 101. First upper cover unit; 102. Second upper cover unit; 11. First upper cover; 12. Second upper cover; 13. Second upper cover pad; 14. Second upper cover pad; 131. Square groove; 141. Square groove;

[0045] 20. Lower cover module; 201. First lower cover unit; 202. Second lower cover unit; 21. First lower cover; 22. Second lower cover; 23. First lower cover pad; 24. Second lower cover pad; 25. First lower cover glass sheet; 26. Second lower cover glass sheet; 211. First receiving slot; 241. Second receiving slot; 231. First light transmission hole; 221. Second light transmission hole; 232. Square slot; 242. Square slot; 251. Upper surface; 252. Lower surface; 250. Scale line; 261. Upper surface; 262. Lower surface; 260. Scale line;

[0046] 30. Intermediate support member; 31. Square groove; 32. Through hole;

[0047] 40. Several probes; 41. Needle tip; 42. Needle tail; 43. Needle arm; 411. Contact tip;

[0048] 50. Probe guide hole; 51. Guide hole; 52. Guide hole; 53. Guide hole; 54. Guide hole;

[0049] 60. Positioning pin hole; 61. Positioning hole; 62. Positioning hole; 63. Positioning hole; 64. Positioning hole; 65. Positioning hole; 66. Positioning hole; 67. Positioning hole; 68. Positioning hole; 69. Positioning hole;

[0050] 70. Fastening screw hole; 79. Fastening screw hole. DETAILED DESCRIPTION

[0051] The technical solution of this application will be described in detail below with reference to the accompanying drawings.

[0052] In the drawings of the following embodiments, the sizes of the components and the size ratios between the components are only used as illustrative examples and cannot be used to limit the present invention. Unless otherwise clearly indicated, the singular "one" or "a" and "several" should be deemed to include the plural. The terms "comprising", "including", "having" and the like are used to specify the features and components stated thereafter and do not exclude the existence of other additional features and components. The term "and / or" is used to indicate any or all combinations of one or more related enumerated items. When terms such as "first" and "second" are used to describe components, the purpose is not to limit the components being described, but only to distinguish the components being described.

[0053] See also Figure 1 、 Figure 2 and Figure 3 , which shows a vertical probe head 900 provided by a preferred embodiment of the present invention. The probe head 900 mainly includes: an upper cover module 10, a lower cover module 20, an intermediate support member 30 and a plurality of probes 40.

[0054] The probe head 900 is provided with several groups of probe guide holes 50 that pass through the upper cover module 10, the lower cover module 20 and the intermediate support member 30, as well as multiple positioning pin holes 60 and multiple fastening screw holes 70 for cooperating with positioning pins and screws to position and fix the upper cover module 10, the lower cover module 20 and the intermediate support member 30.

[0055] In this embodiment, the plurality of positioning pin holes 60 and the plurality of fastening screw holes 70 include a series of positioning holes 69 and a plurality of fastening screw holes 79 provided on the intermediate support member 30, which can be used to coordinately position and secure the upper and lower cover modules 10, 20. A square slot 31 is provided in the middle of the intermediate support member 30, the size of which is larger than the distribution range of the probe guide holes 50 on the upper and lower cover modules 10, 20, so as to allow the probe 40 to pass therethrough. The edge of the intermediate support member 30 is also provided with a circle of through holes 32 for securing the intermediate support member 30 to the board and structural components of the probe card with screws. Since the board and structural components of the probe card themselves are not within the scope of the present invention, they are not described here in detail.

[0056] The upper cover plate module 10 includes a first upper cover plate 11 , a second upper cover plate 12 , a second upper cover plate cushion layer 13 and a second upper cover plate cushion layer 14 .

[0057] In the upper cover module 10, the first upper cover pad 13 and the first upper cover 11 are bonded together to form a first upper cover unit 101 of a one-layer cover structure. The second upper cover pad 14 and the second upper cover 12 are bonded together to form a second upper cover unit 102 of a one-layer cover structure.

[0058] The first upper cover plate unit 101 and the second upper cover plate unit 102 together form the upper cover plate module 10 and are secured to the upper surface of the intermediate support member 30 via screws (not shown) inserted into the fastening screw holes 70. Square grooves 131 and 141 are provided in the middle of the first upper cover plate pad 13 and the second upper cover plate pad 14. Like the square groove 31, the square grooves 131 and 141 have a size range that is larger than the distribution range of the probe guide holes 50 and also allow the probe 40 to pass through them.

[0059] The lower cover module 20 includes a first lower cover 21 , a second lower cover 22 , a first lower cover pad 23 , a second lower cover pad 24 , a pair of first lower cover glass sheets 25 , and a pair of second lower cover glass sheets 26 .

[0060] In the lower cover module 20, the first lower cover 21, the first lower cover backing layer 23, and the pair of first lower cover glass sheets 25 are bonded together to form a single-layered first lower cover unit 201. The pair of first lower cover glass sheets 25 are disposed within a pair of square first receiving grooves 211 disposed diagonally on the first lower cover 21. The thickness of the first lower cover glass sheets 25 is less than that of the first lower cover 21, so that after bonding, the first lower cover glass sheets 25 do not protrude from the first lower cover 21, thereby preventing interference with the second lower cover backing layer 24.

[0061] In the lower cover module 20, the second lower cover 22, the second lower cover backing 24, and a pair of second lower cover glass sheets 26 are bonded together to form a single-layer cover structure, forming a second lower cover unit 202. The pair of second lower cover glass sheets 26 are positioned within a pair of square second receiving grooves 241 disposed diagonally on the upper surface of the second lower cover backing 24. The thickness of the second lower cover glass sheets 26 is less than that of the second lower cover backing 24. After bonding, the second lower cover glass sheets 26 do not protrude upward from the second lower cover backing 24, thereby preventing interference with the first lower cover 22.

[0062] A pair of first light-transmitting holes 231 are defined on the upper surface of the first lower cover plate cushion layer 23, facing the location of the first lower cover plate glass sheet 25. The first light-transmitting holes 231 are smaller than the size of the first lower cover plate glass sheet 25. A pair of second light-transmitting holes 221 are defined on the upper surface of the second lower cover plate 22, facing the location of the second lower cover plate glass sheet 26. The second light-transmitting holes 221 are smaller than the size of the second lower cover plate glass sheet 26.

[0063] Square grooves 232 and 242 are respectively provided in the middle of the first lower cover plate pad 23 and the second lower upper cover plate pad 24. The size range of the square grooves 232 and 242 is larger than the distribution range of the probe guide hole 50, and is used for the probe 40 to pass through them.

[0064] The first lower cover unit 201 and the second lower cover unit 202 are fixed to the lower surface of the intermediate support member 30 by screws (not shown) inserted into the fastening screw holes 70 , and are opposite to the upper cover module 10 .

[0065] like Figure 4 , which shows a first lower cover glass sheet 25 provided in a preferred embodiment of the present invention. The first lower cover glass sheet 25 has an upper surface 251 and a lower surface 252 opposite to each other. The lower surface 252 is provided with scale lines 250; the upper surface 251 is a transparent blank surface.

[0066] like Figure 5 , which shows a second lower cover glass sheet 26 provided in a preferred embodiment of the present invention. The second lower cover glass sheet 26 also has an upper surface 261 and a lower surface 262 opposite to each other. The upper surface 261 of the second lower cover glass sheet 26 is provided with scale lines 260, while the lower surface 262 is a transparent blank surface.

[0067] Combine Figure 3 、 Figure 6As shown, after the first lower cover plate unit 201 and the second lower cover plate unit 202 are assembled, the pair of first lower cover plate glass sheets 25 are respectively accommodated in the pair of first receiving grooves 211, and the upper surfaces 251 of the first lower cover plate glass sheets 25 are bonded to the first lower cover plate cushion layer 23. The pair of second lower cover plate glass sheets 26 are respectively accommodated in the pair of second receiving grooves 211, and the lower surfaces 262 of the second lower cover plate glass sheets 26 are bonded to the second lower cover plate 22. The upper surfaces 261 of the second lower cover plate glass sheets 26 face the lower surface 252 of the first lower cover plate glass sheet 25, the scale lines on the two glass sheets are close to each other, and the transparent blank surfaces on the two glass sheets face the first light transmission holes 231 and the second light transmission holes 221, respectively.

[0068] The upper and lower cover plates and the upper and lower cover plate pads described above are usually made of ceramic sheets with a thickness of 0.15-0.5 mm. The cover plate and the corresponding cover plate pad in each cover plate unit can be fixed by conventional ceramic adhesive.

[0069] like Figure 7 As shown, the probe 40 extends longitudinally and includes a tip portion 41, a tail portion 42, and an arm portion 43 located between the tip portion 41 and the tail portion 42. The tip portion 41 has a contact tip 411 for contacting a device under test during testing. The arm portion 43 is capable of bending and deforming in the longitudinal direction when a load is applied to the probe 40.

[0070] Combine Figure 3 、 Figure 8-15 As shown, in this embodiment, the plurality of probe guide holes 50 include a guide hole 51 located on the first upper cover plate 11 , a guide hole 52 located on the second upper cover plate 11 , a guide hole 53 located on the first lower cover plate 21 , and a guide hole 54 located on the second lower cover plate 22 .

[0071] The plurality of positioning pin holes 60 also include a positioning hole 61 located on the first upper cover plate 11, a positioning hole 62 located on the first upper cover plate pad 13, a positioning hole 63 located on the second upper cover plate 13, a positioning hole 64 located on the second upper cover plate pad 13, a positioning hole 65 located on the first lower cover plate 21, a positioning hole 66 located on the first lower cover plate pad 23, a positioning hole 67 located on the second lower cover plate 22, and a positioning hole 68 located on the second lower cover plate pad 24.

[0072] Each of the lower and upper cover plates and the upper and lower cover plate pads is provided with a plurality of fastening screw holes 70. By screwing screws into these fastening screw holes 70, each cover plate unit in the upper and lower cover plate modules and the intermediate support component 30 can be fixed together.

[0073] When the upper and lower cover modules 10 and 20 are respectively fixed to the upper and lower surfaces of the intermediate support member 30, the probe guide holes 51, 52, 53, and 54 extend vertically through the middle and allow the probe 40 to pass therethrough. The positioning holes 61, 63, 62, 64, 69, 65, 66, locating pin holes 68, and 67 extend vertically through the middle.

[0074] The dimensions of guide holes 51, 52, 53, and 54 are all larger than the cross-sectional dimensions of probes 40 to ensure that probes 40 can pass through these probe guide holes on the four cover plates. The locations of the probe guide holes 50 correspond one-to-one with the test points on the actual chip, and the number of probe guide holes 50 ranges from a few hundred to tens of thousands. Typically, the size and shape of the probe guide holes 50 on a probe head 900 are identical.

[0075] Among the multiple locating pin holes 60, the diameter of each locating hole on each cover layer is larger than the corresponding locating hole diameter of the cover layer to which it is bonded. Specifically, the diameter of locating hole 63 is larger than that of locating hole 61, the diameter of locating hole 64 is larger than that of locating hole 62, the diameter of locating hole 66 is larger than that of locating hole 65, and the diameter of locating hole 68 is larger than that of locating hole 67. This sizing design can prevent misalignment of locating holes caused by bonding errors, which can prevent the locating pin from being inserted. Correspondingly, the diameter of locating hole 69 on the intermediate support member 30 is larger than the diameter of each locating hole in all cover layers.

[0076] In the first upper cover plate 11, the second upper cover plate 12, the first lower cover plate 13, and the second lower cover plate 14 of this embodiment, the positions of the positioning holes on each layer and the probe guide holes thereon are set with a certain deviation; in this way, when the upper and lower cover plate modules 10, 20 and the intermediate support member 30 are positioned by the positioning pins, the probe guide holes on each layer of the cover plate will be correspondingly misaligned, thereby applying lateral constraints to the probe in the lateral direction.

[0077] like Figure 16-20 As shown, in this embodiment, the guide hole 53 on the first lower cover plate 21 and the guide hole 54 on the second lower cover plate 22 are vertically connected and can be coaxially arranged (such as Figure 16 、 Figure 17 As shown), you can also choose to stagger the arrangement in the transverse direction (as shown Figure 18 、 Figure 20 When the guide holes 53 and the guide holes 54 are staggered in the transverse direction, it is possible to constrain the needle tip 41 passing through the guide holes 53 and the guide holes 54 in the transverse direction.

[0078] like Figure 19As shown, in this embodiment, the guide hole 51 on the first upper cover plate 11 and the guide hole 52 on the second upper cover plate 12 are vertically connected and are arranged in a transversely offset manner. Preferably, the transverse offset direction of the second guide hole 54 relative to the guide hole 53 is opposite to the transverse offset direction of the guide hole 52 relative to the guide hole 51.

[0079] In this example, the overall misalignment between the probe guide holes of the upper cover module 10 and the lower cover module 20 is much greater than the misalignment between the probe guide holes between the two layers of cover units inside the upper and lower cover modules; that is, the overall misalignment between the probe guide holes of the upper cover module 10 and the lower cover module 22 is much greater than the misalignment between the guide holes 51 and 52, and between the guide holes 53 and 54.

[0080] Continue as Figure 2 As shown, each group of positioning pin holes 60 on the first upper cover plate 11 and the second lower cover plate 22 is provided with a corresponding number. Positioning pin holes 60 with different numbers have different position deviation values ​​from the probe guide hole 50. By using different groups of positioning pin holes 60 for positioning and assembly, different misalignment amounts of the probe guide holes can be achieved, thereby adjusting the degree of constraint of the probe 40 along the lateral direction. For example: using the "0" number positioning pin hole 60 for assembly, the guide holes of the four layers of probes are completely coaxially aligned, and the misalignment amount of the probe guide holes is 0. At this time, it is suitable for pin assembly. Insert the probe into the four layers of guide holes, as shown in FIG. Figure 18 As shown; if the "1", "2", and "3" positioning pin holes 60 are used for assembly, the four-layer probe guide holes are misaligned, which is suitable for lateral constraints on the probes after the pin insertion is completed, such as Figure 20 shown.

[0081] Furthermore, in order to increase the degree of constraint on the probe tip 41 and reduce the deflection during the contact process between the tip 41 and the chip, a position deviation is also set between the positioning hole 65 of the first lower cover plate 21 and the positioning hole 67 of the second lower cover plate 22, which can achieve the misalignment of the guide hole 53 of the first lower cover plate 21 and the guide hole 54 of the second lower cover plate 22. It should be noted here that if the relative misalignment between the probe guide holes of the first lower cover plate 21 and the second lower cover plate 22 is too large, it may cause the probe to bend or break; if the relative misalignment is too small, the constraint on the probe tip is insufficient and deflection still exists; therefore, the position deviation of the positioning holes between the first lower cover plate 21 and the second lower cover plate 22 cannot be too large, and the positioning accuracy is required to be very precise. However, the matching accuracy of traditional positioning pin holes is difficult to guarantee. If the matching clearance is too large, the accuracy is insufficient. If the matching clearance is too small, assembly is difficult and it may even cause the cover plate to crack.

[0082] In this example, the tail portion 42 of the probe 40 is always in contact with point C4 on the probe card, while the contact tip 411 of the tip portion 41 can slide up and down under the influence of the chip test point. Because the probe guide holes of the first lower cover plate 21 and the second lower cover plate 22 are staggered, when the contact tip 411 of the probe tip 41 is pushed upward by the chip test point, the staggered arrangement of the guide holes 53 and the guide holes 54 in the horizontal direction can achieve lateral restraint on the probe tip 41, effectively eliminating lateral deviation of the contact tip 411.

[0083] Combine Figure 5 As shown, the pair of first light-transmitting holes 231 on the first lower cover plate cushion layer 23 are aligned with the scale lines 250 on the first lower cover plate glass sheet 25; similarly, the pair of second light-transmitting holes 232 on the second lower cover plate 22 are aligned with the scale lines 260 on the second lower cover plate glass sheet 26; after the lower cover plate module 20 is assembled, the scale lines 250 and 260 of the first lower cover plate glass sheet 25 and the second lower cover plate glass sheet 26 are opposite to each other, and the misalignment of the positioning holes of the first lower cover plate and the second lower cover plate can be read according to the deviation of the scale lines.

[0084] like Figure 21 、 Figure 22 As shown, the scale lines 250 on the first lower cover glass 25 and the scale lines 260 on the second lower cover glass 26 are arranged in a cross configuration. The scale lines on the horizontal lines are symmetrical left and right, and the scale lines on the vertical lines are symmetrical up and down. To improve measurement accuracy, the scale lines 260 on the second lower cover glass 26 are not aligned with the scale lines 250 on the first lower cover glass 25. As shown in the figure, the scale lines on the second lower cover glass 26 are 5 μm smaller than those on the first lower cover glass 25.

[0085] like Figure 23 、 Figure 24 As shown, after the lower cover module 20 is assembled, by reading the alignment of the n1th horizontal scale line and the n2th vertical scale line on the two glass sheets 25 and 26, it can be known that the misalignment between the L1 lower cover and the L2 lower cover is 5*n1 um in the horizontal direction and 5*n2 um in the vertical direction. Based on this principle, in actual products, different scale line divisions and division differences can be defined to achieve different measurement accuracies. Figure 23 As shown, the horizontal and vertical lines on the two glass sheets 25 and 26 are completely aligned, and it can be read that the misalignment of the positioning holes of the first lower cover plate and the second lower cover plate is 0 in both the horizontal and vertical directions. Figure 24 As shown, the horizontal and vertical lines on the two glass sheets 25 and 26 are misaligned, and it can be read that the misalignment of the positioning holes of the first lower cover plate and the second lower cover plate is 5 um in the horizontal direction and 5 um in the vertical direction.

[0086] The following describes the assembly process of the upper cover module 10 and the lower cover module 20:

[0087] First, the first upper cover plate pad 13 and the first upper cover plate 11 are bonded together, the second upper cover plate pad 14 and the second upper cover plate 12 are bonded together, the first lower cover plate pad 23, the first lower cover plate 21 and the two first lower cover plate glass sheets 25 are bonded together, and the second lower cover plate pad 24, the second lower cover plate 22 and the two second lower cover plate glass sheets 26 are bonded together.

[0088] Next, the bonded first upper cover unit 101, the second upper cover unit 102, the first lower cover unit 201, and the second upper cover unit 201 are stacked in order and positioned using the "0" positioning pin hole 60. Then, the upper cover module 10 and the lower cover module 20 are fixed to the intermediate support member 30 by inserting screws into the fastening screw holes 70. At this time, the guide holes constituting the probe guide hole 50 are all coaxially arranged. Then, a probe 40 is inserted into each probe guide hole 50. For details, see Figure 16 、 Figure 17 shown.

[0089] After the probe 40 pin is assembled, loosen the fixing screws and switch to other numbered (such as "1", "2", "3") positioning pin hole 60 combinations according to actual needs for positioning. Different numbered positioning pin hole 60 combinations can achieve different probe guide hole misalignment amounts, thereby achieving different degrees of lateral constraint on the probe 40, especially achieving lateral constraint on the probe tip 41 in the lateral direction; for details, please refer to Figure 18 、 Figure 19 、 Figure 20 shown.

[0090] In an embodiment of the present application, the upper and lower cover plate modules can also be provided with a greater number of upper and lower cover plate units, especially in the lower cover plate module, all schemes that can construct probe guide holes that are displaced in the lateral direction are within the protection of the present application, or the first lower cover plate unit and the second lower cover plate unit are integrated into an integral lower cover plate unit and provided with a displaced probe guide hole.

[0091] The above embodiments are merely exemplary, and those skilled in the art may make equivalent replacements or improvements within the scope of the claims. In addition to the exemplary embodiments shown and described herein, other embodiments are also within the scope of this information.

Claims

1. A vertical probe head comprising: A plurality of probes, each of the probes extending longitudinally and having a tip portion, a tail portion, and an arm portion located at the tail portion of the tip portion, the tip portion having a contact tip for contacting a device under test during testing, and each of the probes being capable of bending and deforming the arm portion when a load is applied thereto; Upper cover module; Lower cover module; as well as A plurality of probe guide holes, each of which passes through the upper cover module and the lower cover module in the longitudinal direction, and each of which can be inserted into the corresponding probe guide hole on the lower cover module so that the contact tip extends downward from the probe guide hole; characterized in that: The lower cover module includes a first lower cover unit and a second lower cover unit that are fixedly arranged, the first lower cover unit is located on the upper side of the second lower cover unit, and each of the probe guide holes includes a first guide hole arranged on the first lower cover unit and a second guide hole arranged on the second lower cover unit; wherein, the first guide hole and the second guide hole are connected vertically and can be optionally staggered in the transverse direction, so that the needle tip part passing through the first guide hole and the second guide hole can be constrained along the transverse direction.

2. The vertical probe head according to claim 1, characterized in that The first lower cover unit is provided with a plurality of first positioning holes, and the second lower cover unit is provided with a plurality of second positioning holes. The plurality of first positioning holes and the plurality of second positioning holes correspond one to one and constitute a plurality of positioning pin holes for positioning pins to be inserted therein.

3. The vertical probe head according to claim 2, characterized in that Among the plurality of positioning pin holes, the first positioning hole and the corresponding second positioning pin hole in at least one positioning pin hole are coaxially arranged, and the first positioning hole and the corresponding second positioning pin hole in at least one positioning pin hole are staggered in the transverse direction.

4. The vertical probe head according to claim 3, wherein: The first positioning holes and the corresponding second positioning holes in the plurality of positioning pin holes are all staggered in the transverse direction, and the amounts of their staggering are not completely the same.

5. The vertical probe head according to claim 2, wherein: The first lower cover unit includes a fixed first lower cover and a first lower cover pad; in the first lower cover unit, the aperture of the first positioning hole located on the first lower cover is smaller than the aperture of the first pin hole located on the first lower cover pad; the second lower cover unit includes a fixed second lower cover and a second lower cover pad; in the second lower cover unit, the aperture of the second positioning hole located on the second lower cover is smaller than the aperture of the second positioning hole located on the second lower cover pad.

6. The vertical probe head according to claim 1, wherein: A first lower cover glass sheet with first scale lines is provided on the first lower cover unit, and a second lower cover glass sheet with second scale lines is provided on the second lower cover unit. The first lower cover glass sheet and the second lower cover glass sheet are bonded together and are constructed so as to indicate the relative misalignment amount between the first guide hole and the second guide hole in the lateral direction by the relative position of the first scale lines and the second scale lines thereon.

7. The vertical probe head according to claim 6, wherein: The first lower cover unit and / or the upper cover unit are provided with light-transmitting holes for observing the first and second scale lines from the outside.

8. The vertical probe head according to claim 7, wherein: The first lower cover glass sheet and the second lower cover glass sheet each have an upper surface and a lower surface opposite to each other; wherein, one of the upper surface and the lower surface is a scale line surface provided with the first or second scale line, and the other surface is a transparent blank surface; the corresponding scale line surfaces of the first lower cover glass sheet and the second lower cover glass sheet are bonded together, and the corresponding transparent blank surfaces face the light transmission hole.

9. The vertical probe head according to claim 1, wherein: The probe guide hole located on the upper cover plate module and the probe guide hole located on the lower cover plate module are staggered in the lateral direction, and the relative staggered amount of the probe guide hole located on the upper cover plate module and the probe guide hole located on the lower cover plate module in the lateral direction is greater than the relative staggered amount of the first guide hole and the second guide hole in the lateral direction.

10. The vertical probe head according to claim 9, wherein: The upper cover module includes a first upper cover unit and a second upper cover unit that are fixedly arranged, the first upper cover unit is located on the upper side of the second upper cover unit, and each of the probe guide holes includes a third guide hole arranged on the first upper cover unit and a fourth guide hole arranged on the second upper cover unit; wherein the third guide hole and the fourth guide hole are connected vertically and are staggered in the transverse direction, so that the needle tail part passing through the third guide hole and the fourth guide hole can be constrained along the transverse direction.

11. The vertical probe head according to claim 10, wherein: A dislocation direction of the second guide hole relative to the first guide hole in the transverse direction is opposite to a dislocation direction of the fourth guide hole relative to the third guide hole in the transverse direction.

12. The vertical probe head according to claim 1, wherein: Also includes: The intermediate support member, the upper cover module and the lower cover module are respectively fixed on the upper and lower side surfaces of the intermediate support member, and the middle part of the intermediate support member is provided with a groove running through the upper and lower surfaces, and the size range of the groove is larger than the distribution range of the several probe guide holes.

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