Signal acquisition device and semiconductor test equipment

Abstract

The invention relates to the technical field of semiconductor testing, and provides a signal acquisition device and semiconductor testing equipment. The signal acquisition device comprises a test circuit board, a carrying disc and an acquisition assembly, wherein the carrying disc is provided with a bearing part for limiting a tested module; the acquisition assembly comprises a first acquisition probe and a second acquisition probe, each of the first acquisition probe and the second acquisition probe comprises a crimping end and a transmission end, the two transmission ends are connected to the test circuit board in parallel, and the end parts of the two crimping ends are oppositely arranged. According to the signal acquisition device provided by the invention, the first acquisition probe and the second acquisition probe which are oppositely arranged at an interval are respectively in crimping fit with the two opposite side walls of the pin to form dual protection, so that the risk of misjudgment caused by poor contact between the probes and the pin is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a signal acquisition device and semiconductor testing equipment. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor), also known as the insulated gate bipolar transistor, is a high-performance, fully controlled, composite power semiconductor device. During IGBT testing, a probe is placed in contact with the IGBT's pins to collect electrical signals for reactive power aging testing.

[0003] However, because IGBT reactive power aging tests are typically conducted in high-temperature and high-humidity environments, oxidation of the IGBT pins can occur, leading to the formation of an oxide layer on the pin surface. This oxide layer can cause poor contact between the probe and the pin, leading to the risk of misjudgment. Summary of the Invention

[0004] Based on this, it is necessary to provide a signal acquisition device, in which the first acquisition probe and the second acquisition probe are arranged relatively and spaced apart and respectively pressed into engagement with the opposite side walls of the pin to form double protection, thereby reducing the risk of misjudgment caused by poor contact between the probe and the pin.

[0005] A signal acquisition device includes a test circuit board, a carrier and an acquisition component, wherein the carrier is provided with a bearing portion for limiting the position of a module under test; the acquisition component includes a first acquisition probe and a second acquisition probe, both of which include a crimping end and a transmission end, the two transmission ends are connected in parallel to the test circuit board, and the ends of the two crimping ends are arranged opposite to each other.

[0006] As can be understood, since the two transmission terminals are connected in parallel to the test circuit board, this is equivalent to the first and second acquisition probes being connected in parallel to the test circuit board. The first and second acquisition probes can be positioned relative to each other via their corresponding crimping terminals, thereby facilitating crimping and mating with the two side walls opposite the pins, thereby transmitting the detection signal through the transmission terminals to the test circuit board. This arrangement is equivalent to using the first and second acquisition probes for double protection. Even if one of the acquisition probes fails to make contact with the pin, the acquisition signal can be transmitted through the other acquisition probe, reducing the risk of misjudgment.

[0007] In some embodiments, at least one of the crimping ends is provided with a piercing portion.

[0008] In some embodiments, the acquisition component further includes a conductive structure, and the transmission end of the first acquisition probe and / or the second acquisition probe is connected to the conductive structure and is connected to the test circuit board through the conductive structure.

[0009] In some embodiments, the conductive structure includes a conductive bar and a conductive probe, the conductive bar is provided on the carrier and is conductively connected to the first acquisition probe or the second acquisition probe; one end of the conductive probe is connected to the test circuit board, and the other end can be crimped to the conductive bar.

[0010] In some embodiments, a diameter of the conductive probe is larger than a diameter of the first collection probe and a diameter of the second collection probe.

[0011] In some embodiments, the end of the conductive probe facing the conductive bar is provided with a plurality of signal collecting portions spaced apart along the circumference thereof.

[0012] In some embodiments, the carrier is provided with an assembly groove near the carrying portion, and the conductive bar is at least partially accommodated in the assembly groove; the collection component further includes a fastening structure, which is connected to the conductive bar and the carrier, and is used to lock the conductive bar to the carrier.

[0013] In some embodiments, the acquisition components are provided in multiple groups and are arranged at intervals along a first direction, where the first direction is the pin arrangement direction on the module under test.

[0014] In some embodiments, the carrier is provided with a plurality of terminal support blocks at the edge of the carrying portion, and the plurality of terminal support blocks are arranged at intervals along the circumference of the carrying portion.

[0015] The present application also provides a semiconductor testing device for testing semiconductor power modules, comprising a host computer and the above-mentioned signal acquisition device, wherein a test circuit board in the signal acquisition device is electrically connected to the host computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A partial schematic diagram of a signal acquisition device provided in one embodiment of the present application carrying a module under test;

[0018] Figure 2 A partial schematic diagram of a signal acquisition device provided in one embodiment of the present application;

[0019] Figure 3A partial cross-sectional view of a signal acquisition device provided in one embodiment of the present application;

[0020] Figure 4 for Figure 3 A partial enlarged view of point A in the middle;

[0021] Figure 5 A partial cross-sectional view of a signal acquisition device provided in one embodiment of the present application carrying a module under test;

[0022] Figure 6 for Figure 5 A partial enlarged view of point B in the middle;

[0023] Figure 7 A partial schematic diagram of a signal acquisition device provided in another embodiment of the present application;

[0024] Figure 8 for Figure 7 A partial enlarged view of point C in the middle.

[0025] Figure numerals: 10, carrier plate; 20, acquisition assembly; 21, first acquisition probe; 22, second acquisition probe; 23, conduction structure; 24, fastening structure; 100, signal acquisition device; 101, carrier portion; 102, assembly groove; 103, gasket; 104, partition; 105, terminal support block; 200, module under test; 201, crimping terminal; 202, transmission terminal; 203, piercing portion; 210, terminal; 211, positive terminal; 212, negative terminal; 213, three-phase terminal; 22 0. Pin; 221. Top of pin; 222. Bottom of pin; 231. Conductive bar; 232. Conductive probe; 241. Pressure plate; 242. Fastener; 243. Locating pin; 1011. Through hole; 1012. Carrying platform; 1051. Positive terminal support block; 1052. Negative terminal support block; 1053. Three-phase terminal support block; 2011. First crimping end; 2012. Second crimping end; 2021. First transmission end; 2022. Second transmission end; 2321. Signal acquisition unit. DETAILED DESCRIPTION

[0026] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0027] It should be noted that when a component is referred to as being "fixed to" or "provided on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0029] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0031] With the increasing demand for semiconductor power modules, the variety of semiconductor power modules is increasing. Considering the safety of semiconductor power modules, the pins are often plated. However, this plating can degrade the solderability of the pins. For example, certain plating layers may segregate during the pre-soldering heat treatment, or form an overly thick or brittle intermetallic layer in the welded section, severely impacting the mechanical strength and reliability of the solder joint. Plating also significantly increases the resistance of the pins when in contact with external connectors, PCB pads, or busbars, resulting in additional power loss and heat generation. Furthermore, uneven plating can lead to localized oxidation on the pins, leading to localized overheating. Furthermore, plating requires a more complex electroplating process with stricter process requirements, as well as certain material performance requirements, which in turn increases plating costs.

[0032] While fully plated pins present the aforementioned issues, using bare copper as pins during reactive power aging testing of semiconductor power modules is prone to oxidation, as reactive power aging testing requires high temperature and high humidity. This can lead to an oxide layer deposited on the pin surface. This oxide layer can cause poor contact between the probe and the pin, leading to the risk of misjudgment and severely impacting test accuracy.

[0033] To address this issue, one embodiment of the present application provides a signal acquisition device. This device utilizes first and second acquisition probes, which are spaced apart and arranged oppositely, to press-fit against opposing side walls of a pin, providing dual protection. This reduces the risk of misjudgment due to poor contact between the probes and the pin. This signal acquisition device is described in detail below.

[0034] See also Figures 1 to 6 Exemplarily, the signal acquisition device 100 includes a test circuit board, a carrier plate 10, and an acquisition assembly 20. The carrier plate 10 has a support portion 101 for positioning the module under test 200. The acquisition assembly 20 includes a first acquisition probe 21 and a second acquisition probe 22, both of which include a crimping end 201 and a transmission end 202. The two transmission ends 202 are connected in parallel to the test circuit board, and the ends of the two crimping ends 201 are arranged opposite each other.

[0035] The first acquisition probe 21 corresponds to the first crimping end 2011 and the first transmission end 2021, and the second acquisition probe 22 corresponds to the second crimping end 2012 and the second transmission end 2022. The first transmission end 2021 and the second transmission end 2022 are both electrically connected to the test circuit board, and are both used to contact the pin 220. During testing, the first crimping end 2011 and the second crimping end 2012 can collect the electrical signal from the pin 220 and transmit it to the test circuit board via the first transmission end 2021 and the second transmission end 2022, respectively. Since the first transmission end 2021 and the second transmission end 2022 are both connected in parallel to the test circuit board, this is equivalent to the first acquisition probe 21 and the second acquisition probe 22 being connected in parallel to the test circuit board. This allows the test circuit board to receive two test signals, and poor contact in either path will not affect the reception of the test signal in the other path. Furthermore, because the ends of the first crimping end 2011 and the second crimping end 2012 are disposed opposite each other, they can be crimped and engaged with opposite side walls of the pin 220 of the module under test 200. For example, the pin 220 has a first side wall and a second side wall disposed opposite each other along its thickness direction, the first crimping end 2011 is crimped and engaged with the first side wall, and the second crimping end 2012 is crimped and engaged with the second side wall.

[0036] That is, the first acquisition probe 21 and the second acquisition probe 22 are used to respectively acquire test signals from two different side walls of the pin 220 and transmit them to the test circuit board. The test circuit board can then judge the performance of the module under test 200 based on the two test signals. That is, the first acquisition probe 21 and the second acquisition probe 22 are used to respectively acquire signals from two sides of the same pin, forming a double protection. If both contacts are good, the two acquired signals are theoretically the same. However, if one of them has poor contact with the pin 220, resulting in the failure to receive the corresponding test signal or an erroneous test signal, the test judgment can be made based on the test signal of the other, effectively avoiding the risk of test failure or misjudgment caused by poor contact between one of the probes and the pin. In addition, the carrying portion 101 on the carrier 10 can accurately limit the module under test 200, ensuring the stability and accuracy of the module under test 200 during the test process, further effectively improving test efficiency and accuracy.

[0037] When the signal acquisition device 100 is used in a reactive power aging test of a semiconductor power module, the semiconductor power module is placed and restrained within the carrier 101. The first acquisition probe 21 and the second acquisition probe 22 are respectively pressed against two vertically opposing side walls of the pin 220: the pin top 221 and the pin bottom 222. If an oxide layer appears on the pin top 221, the test signal collected by the acquisition probe engaging the pin bottom 222 can be used for judgment, thereby reducing the risk of false positives.

[0038] During reactive burn-in testing of semiconductor power modules, the carrier plate 10 is typically placed on a water-cooled plate to dissipate heat generated by the semiconductor power module during testing, reducing the risk of failure due to overheating and protecting the semiconductor power module from damage. Therefore, the bottom 222 of the pins is more susceptible to oxidation than the top 221 of the pins. Therefore, a plating layer can be applied to the bottom 222 of the pins, while leaving the top 221 bare copper. This facilitates soldering, signal transmission, and other aspects of the semiconductor power module during subsequent use.

[0039] See also Figure 5 and Figure 6 Therefore, when testing semiconductor power modules, one of the first and second acquisition probes 21 and 22 can be pressed against the plated copper on the pin bottom 222 to collect one test signal, while the other can be pressed against the bare copper on the pin top 221 to collect another test signal. If an oxide layer forms on the pin top 221, affecting test accuracy, the test signal from the pin bottom 222 can be used, reducing the risk of misjudgment.

[0040] like Figures 3 to 6 As shown, in some specific embodiments, the thickness direction of the carrier 10 is the Z-axis direction, i.e., the vertical direction. The first acquisition probe 21 and the second acquisition probe 22 are arranged opposite and spaced apart along the thickness direction of the carrier 10, so that the ends of their corresponding crimping terminals 201 are positioned opposite each other, thereby enabling respective test signal acquisition. In this case, the first transmission terminal 2021 is located at the end of the first crimping terminal 2011 facing away from the second crimping terminal 2012, and the second transmission terminal 2022 is located at the end of the second crimping terminal 2012 facing away from the first crimping terminal 2011.

[0041] For example, the first acquisition probe 21 is positioned above the second acquisition probe 22 and can also move relative to the second acquisition probe 22 along the Z-axis. Before acquisition, the first acquisition probe 21 is spaced apart from the second acquisition probe 22 along the Z-axis, facilitating placement of the module under test 200 on the carrier 10. When the module under test 200 is positioned on the carrier 101, the bottom 222 of the pins of the module under test 200 contacts the second acquisition probe 22, which then moves downward along the Z-axis to approach the top 221 of the pins.

[0042] Alternatively, the first collection probe 21 and the second collection probe 22 can both move relative to the carrier 10 along the Z-axis direction to move closer to or farther from the pin top 221 and the pin bottom 222. This is merely an example.

[0043] See also Figures 3 to 6 In some embodiments, at least one crimping end 201 is provided with a piercing portion 203 .

[0044] For example, the first acquisition probe 21 can be crimped onto the pin top 221 via a first crimping end 2011, while the second acquisition probe 22 can be crimped onto the pin bottom 222 via a second crimping end 2012. The first crimping end 2011 is provided with a piercing portion 203, which facilitates piercing the oxide layer on the pin top 221, thereby allowing direct contact with the bare copper. Furthermore, since the pin bottom 222 is provided with a plating layer, the second crimping end 2012 does not need to be provided with a piercing portion 203. The second crimping end 2012 directly crimps the plating layer, ensuring test signal acquisition without damaging the plating layer and preventing oxidation of the pin bottom 222 during testing. The second crimping end 2012 has a spherical end with a smooth surface, reducing wear on the plating layer.

[0045] Alternatively, both the end of the first crimping end 2011 and the end of the second crimping end 2012 are provided with a piercing portion 203. In this case, the two piercing portions 203 can respectively pierce the oxide layer on the pin 220 of the module under test 200 to ensure normal collection of the test signal.

[0046] The piercing portion 203 includes a plurality of conical spikes arranged at intervals along the circumference of the crimping end 201 to improve the piercing effect.

[0047] like Figure 1 and Figure 2 As shown, in some embodiments, multiple groups of acquisition components 20 are provided and spaced apart along a first direction, which corresponds to the arrangement direction of the pins 220 on the module under test 200. As will be appreciated, the module under test 200 typically has multiple spaced apart pins 220, each of which can be used for reactive power aging testing. Therefore, by utilizing multiple groups of acquisition components 20 arranged along the arrangement direction of the pins 220 on the module under test 200, each pin 220 can be tested, or selectively pressed into engagement with some of the pins 220 to achieve testing.

[0048] like Figure 1 and Figure 2As shown, in some specific embodiments, the carrier 10 is provided with a plurality of bearing parts 101 spaced apart or arranged adjacently along a first direction, and each bearing part 101 corresponds to limiting a module under test 200. The bearing part 101 includes a through hole 1011 and a bearing platform 1012 provided at the hole wall of the through hole 1011. The upper surface of the bearing platform 1012 is lower than the upper surface of the carrier 10. The bearing platform 1012 and the hole wall of the through hole 1011 are jointly arranged to form a groove for limiting the module under test 200. The through hole 1011 corresponding to each bearing part 101 can be provided independently, or the adjacent sides of any two adjacent through holes 1011 can be connected. A gasket 103 is provided on the upper surface of the bearing platform 1012 corresponding to each bearing part 101 to reduce the wear of the module under test 200 when overlapping. The gasket 103 can be a rubber gasket, a silicone gasket, etc.

[0049] The projection of the carrier 10 along the Z-axis is a rectangle. The width of the carrier 10 is along the Y-axis, and the length of the carrier 10 is along the X-axis, which is the arrangement direction of the pins 220 .

[0050] Each carrying portion 101 is correspondingly provided with a plurality of collection components 20 spaced apart along the first direction.

[0051] In other words, the carrier 10 is provided with multiple supporting portions 101 spaced apart or arranged adjacently along the first direction, and each supporting portion 101 is provided with multiple sets of acquisition components 20 spaced apart along the first direction. This allows for simultaneous crimping testing of multiple pins 220 of multiple modules under test 200, improving test efficiency.

[0052] See also Figures 1 to 4 In some embodiments, the acquisition assembly 20 further includes a conductive structure 23. The transmission ends 202 of the first acquisition probe 21 and / or the second acquisition probe 22 are connected to the conductive structure 23, and the conductive structure 23 is used to connect the first acquisition probe 21 and the second acquisition probe 22 to the test circuit board. In other words, the first acquisition probe 21 and the second acquisition probe 22 do not need to be directly connected to the test circuit board. Instead, they connect to the test circuit board through the conductive structure 23 connected to their corresponding transmission ends 202. This arrangement simplifies the structure of the first acquisition probe 21 and the second acquisition probe 22. For example, both need only be formed into a columnar structure, reducing manufacturing costs. It also increases the assembly flexibility of the acquisition assembly 20, eliminating the need for restricting the placement of the first acquisition probe 21 and the second acquisition probe 22.

[0053] In actual use, the test circuit board is supported by the base and mounted above the carrier 10. Because the first and second acquisition probes 21 and 22 are positioned opposite each other, the second acquisition probes 22 cannot directly connect to the test circuit board. In this case, the conductive structure 23 serves as a connection intermediate between the second acquisition probes 22 and the test circuit board. If the acquisition assembly 20 comprises multiple groups, each group of second acquisition probes 22 is connected to a corresponding conductive structure 23.

[0054] Alternatively, when the test circuit board is arranged on a side close to the second collection probe 22 , the first collection probe body is connected to the test circuit board through the conductive structure 23 .

[0055] The conductive structure 23 may be one or more conductive elements, such as conductive sheets, conductive columns or conductive springs, which can effectively transmit the electrical signals of the first acquisition probe 21 and / or the second acquisition probe 22 to the test circuit board.

[0056] Please continue reading Figures 1 to 4 In some embodiments, the conductive structure 23 includes a conductive bar 231 and a conductive probe 232. The conductive bar 231 is provided on the carrier 10 and is conductively connected to the first acquisition probe 21 or the second acquisition probe 22; one end of the conductive probe 232 is connected to the test circuit board, and the other end can be crimped with the conductive bar 231.

[0057] The conductive bar 231 is a slender strip-shaped structure made of a conductive material, such as a slender sheet. The conductive bar 231 is laid and fixed on the carrier 10 to ensure the reliability and stability of the press-fit with the conductive probe 232. The conductive bar 231 can achieve a reliable electrical connection with the first acquisition probe 21 or the second acquisition probe 22 through welding, riveting, or other conductive connection methods, which facilitates the smooth transmission of the electrical signal received from the acquisition probe to the conductive bar 231. One end of the conductive probe 232 is fixed to the test circuit board, for example, by welding or other fixed connection structure, and the other end is press-fitted with the conductive bar 231.

[0058] In actual use, the first acquisition probe 21 and the conductive probe 232 are both fixed to the test circuit board, the second acquisition probe 22 and the conductive bar 231 are both fixed to the carrier 10, and the conductive bar 231 is connected to the second transmission end 2022 of the second acquisition probe 22. When testing is required, the base supporting the test circuit board moves downward along the Z-axis, and the first acquisition probe 21 and the conductive probe 232 are moved synchronously, thereby causing the first acquisition probe 21 to press-fit with the pin top 221, and the conductive probe 232 to press-fit with the conductive bar 231. The electrical signal collected by the first acquisition probe 21 is directly transmitted to the test circuit board, and the electrical signal collected by the second acquisition probe 22 is transmitted to the test circuit board through the cooperation of the conductive bar 231 and the conductive probe 232.

[0059] That is to say, the conductive strip 231 can be used to transfer the electrical signal transmission path of the second acquisition probe 22 arranged along the Z-axis direction to the horizontal direction. For example, when the length of the conductive strip 231 extends along the Y-axis direction, the electrical signal transmission path can be transferred to the Y-axis direction. Moreover, by arranging the conductive probe 232 along the Z-axis direction, the electrical signal transmission path in the Y-axis direction is transferred to the Z-axis direction, and then transmitted to the test circuit board above. Therefore, such a setting can meet the needs of signal acquisition and processing in different complex test scenarios by changing and optimizing the electrical signal transmission path to avoid interference with other structures. In addition, electrical signal transmission can be met only through the cooperation of the conductive strip 231 and the conductive probe 232, and the structure is simple and easy to manufacture and maintain.

[0060] like Figure 4 As shown, in some embodiments, the diameter of the conductive probe 232 is larger than the diameters of the first and second acquisition probes 21, 22. It is understandable that, precisely because the first and second acquisition probes 21, 22 still need to make direct contact with the module under test 200 during testing, their diameters can be set relatively small to ensure sufficient contact with the pins 220 and avoid damage to the pins 220. The conductive probe 232 is only used for electrical signal transmission and does not directly contact the module under test 200. Therefore, the diameter can be appropriately increased to ensure sufficient contact with the conductive bar 231, improving the connection stability and electrical conductivity of the conductive bar 231.

[0061] The conductive bar 231 is made of copper, such as pure copper or beryllium copper, and is surface-treated to form a coating, such as nickel, silver, or gold, to minimize the presence of an oxide layer. The conductive probe 232 can utilize a 1.5 mm probe tip, but can also utilize 1.6 mm, 1.8 mm, or other diameters, for example. This is merely an example.

[0062] Furthermore, the second collection probe 22 may also be made of a beryllium copper shrapnel. Since the second collection probe 22 is connected to the conductive bar 231 , it only needs to ensure reliable contact with the pin bottom 222 and transmit the electrical signal to the conductive bar 231 .

[0063] like Figure 4 As shown, the end of the conductive probe 232 facing the conductive bar 231 is further provided with a plurality of signal collection portions 2321 spaced apart along its circumference. This arrangement not only increases the contact area for signal collection, improving the efficiency and accuracy of signal collection, but also disperses the crimping pressure to a certain extent, protecting the conductive bar 231 from excessive wear and extending its service life.

[0064] See also Figure 3 、 Figure 4 、 Figure 7 and Figure 8 In some embodiments, the carrier 10 is provided with an assembly slot 102 near the bearing portion 101, and the conductive bar 231 is at least partially accommodated in the assembly slot 102. In other words, the assembly slot 102 serves as a position limiter for the assembly of the conductive bar 231, minimizing the risk of the conductive bar 231 shaking or shifting during the crimping test, thereby ensuring stable and accurate signal transmission. The walls of the assembly slot 102 can be convex or concave to provide a structure for limiting the position of the conductive bar 231, thereby improving assembly reliability.

[0065] like Figure 7 and Figure 8 As shown, in some embodiments, the mounting slots 102 are located near the edge of the carrier portion 101. When multiple collection assemblies 20 are provided, the carrier 10 is provided with multiple mounting slots 102 spaced apart along the X-axis, with partitions 104 positioned between any two adjacent mounting slots 102 to prevent contact between any two adjacent conductive bars 231. Alternatively, the carrier 10 may be provided with multiple partitions 104 spaced apart along the X-axis at the locations where the conductive bars 231 are mounted, with a mounting slot 102 positioned between any two adjacent partitions 104.

[0066] Please continue reading Figure 3 、 Figure 4 、 Figure 7 and Figure 8 Furthermore, the acquisition assembly 20 also includes a fastening structure 24, which is connected to the conductive bar 231 and the carrier 10 and is used to lock the conductive bar 231 to the carrier 10. In other words, based on the aforementioned assembly slot 102, the fastening structure 24 is also provided to form a double fixation, further enhancing the reliability of the fixation of the conductive bar 231 to the carrier 10. This allows the conductive bar 231 to maintain the continuity and stability of signal transmission even in the face of external interference such as vibration and impact, thereby improving the reliability and accuracy of the test.

[0067] In some specific embodiments, the fastening structure 24 includes a pressure plate 241 and a fastener 242. The pressure plate 241 is pressed against the side of the conductive bar 231 protruding from the corresponding assembly slot 102 in each conductive structure 23. The fastener 242 passes through the pressure plate 241 and is connected to the carrier 10. The fastener 242 does not need to directly contact the conductive bar 231. Instead, the fastener 242 limits the pressure applied to the conductive bar 231 when the pressure plate 241 is locked relative to the carrier 10. This ensures that the conductive bar 231 is securely fastened while also providing improved protection. Furthermore, the surface contact and position-limiting contact between the pressure plate 241 and the conductive bar 231 facilitates adjustment of the assembly position of the conductive bar 231. Adjustment is accomplished by simply loosening the fastener 242. Furthermore, the provision of the pressure plate 241 provides a moderate cushioning effect on the conductive bar 231 while ensuring the pressure-limited position of the conductive bar 231, preventing damage caused by overtightening.

[0068] When each carrying portion 101 corresponds to multiple groups of collection components 20 , the conductive bars 231 in each group of collection components 20 can be pressed and limited by the same pressing plate 241 , thereby simplifying the structure.

[0069] The fasteners 242 can be screws that securely connect to the carrier 10, ensuring that signal transmission is not affected by loosening during long-term use. The fastening structure 24 also includes a positioning pin 243, which is used to position the conductive strip 231 on the carrier 10, further improving assembly reliability.

[0070] like Figure 4 As shown, in some specific embodiments, an assembly through hole is provided at one end of the conductive bar 231 away from the conductive probe 232 along the Y-axis direction, and the conductive bar 231 can be sleeved on the corresponding second collection probe 22 through the assembly through hole, and the bottom of the second collection probe 22 is fixed to the carrier 10 by screws to ensure connection reliability.

[0071] See also Figure 1 、 Figure 2 and Figure 7 In some embodiments, the carrier 10 is provided with a plurality of terminal support blocks 105 at the edge of the carrying portion 101 , and the plurality of terminal support blocks 105 are arranged at intervals along the circumference of the carrying portion 101 .

[0072] As can be understood, the module under test 200 includes a main body (not shown) and terminals 210. The main body supports and is limited to the load-bearing portion 101. The terminals 210 can be supported on the terminal support block 105 to ensure the reliability of the position limit of the module under test 200 and to prevent deformation of the terminals 210 during the crimping process. The terminals 210 include a positive terminal 211, a negative terminal 212, and a three-phase terminal 213. The positive terminal 211 corresponds to the positive terminal support block 1051, the negative terminal 212 corresponds to the negative terminal support block 1052, and the three-phase terminal 213 corresponds to the three-phase terminal support block 1053. Each terminal support block 105 is fixedly connected to the carrier 10 by screws. It is also possible to compensate for the height difference of the terminals 210 by adding a gasket 103 to the terminal support block 105.

[0073] See also Figures 1 to 6 The present application also provides a semiconductor testing device for testing semiconductor power modules, comprising a host computer and the aforementioned signal acquisition device 100, wherein a test circuit board in the signal acquisition device 100 is electrically connected to the host computer. A first acquisition probe 21 is press-fitted with the top of the pin 221 to acquire a test signal and transmit it to the test circuit board. A second acquisition probe 22 is press-fitted with the bottom of the pin 222 to acquire another test signal and transmit it to the test circuit board via a conductive structure 23. After the test circuit board acquires at least one of the two test signals, it can feed back a signal for reactive aging testing to the host computer.

[0074] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A signal acquisition device, characterized in that: include: Test circuit boards; A carrier plate (10) provided with a carrier portion (101) for limiting the position of the module under test (200); The acquisition component (20) comprises a first acquisition probe (21) and a second acquisition probe (22), both of which comprise a crimping end (201) and a transmission end (202), the two transmission ends (202) being connected in parallel to the test circuit board, and the ends of the two crimping ends (201) being arranged opposite to each other.

2. The signal acquisition device according to claim 1, characterized in that: At least one of the crimping ends (201) is provided with a piercing portion (203).

3. The signal acquisition device according to claim 1, characterized in that: The acquisition component (20) further comprises a conducting structure (23), and the transmission end (202) of the first acquisition probe (21) and / or the second acquisition probe (22) is connected to the conducting structure (23), and is connected to the test circuit board via the conducting structure (23).

4. The signal acquisition device according to claim 3, characterized in that: The conductive structure (23) includes: A conductive strip (231) is provided on the carrier (10) and is conductively connected to the first collection probe (21) or the second collection probe (22); A conducting probe (232) has one end connected to the test circuit board and the other end capable of being press-fitted with the conducting bar (231).

5. The signal acquisition device according to claim 4, characterized in that: The diameter of the conducting probe (232) is larger than the diameter of the first collecting probe (21) and the diameter of the second collecting probe (22).

6. The signal acquisition device according to claim 4, characterized in that: The end of the conducting probe (232) facing the conducting bar (231) is provided with a plurality of signal collecting parts (2321) arranged at intervals along the circumference of the conducting probe (232).

7. The signal acquisition device according to claim 4, characterized in that: The carrier plate (10) is provided with an assembly groove (102) near the carrying portion (101), and the conductive strip (231) is at least partially accommodated in the assembly groove (102); The acquisition assembly (20) further comprises a fastening structure (24), wherein the fastening structure (24) is connected to the conductive bar (231) and the carrier (10) and is used to lock the conductive bar (231) to the carrier (10).

8. The signal acquisition device according to claim 1 or claim 3, characterized in that: The acquisition components (20) are provided in multiple groups and are arranged at intervals along a first direction, wherein the first direction is the direction in which the pins on the module under test are arranged.

9. The signal acquisition device according to claim 1, characterized in that: The carrier (10) is provided with a plurality of terminal support blocks (105) at the edge of the carrier portion (101), and the plurality of terminal support blocks (105) are arranged at intervals along the circumference of the carrier portion (101).

10. A semiconductor testing device for testing a semiconductor power module, characterized in that: The device comprises a host computer and the signal acquisition device according to any one of claims 1 to 9, wherein the test circuit board in the signal acquisition device is electrically connected to the host computer.

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