Microwave chip module test clamp device
By designing the heat dissipation, limiting and fixing mechanisms of the microwave chip module test fixture, the problem of untimely heat dissipation during chip testing is solved, rapid cooling and stable fixation are achieved, and test accuracy and efficiency are improved.
Patent Information
- Application Number
- CN202510765077.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-10
- Publication Date
- 2025-09-12
AI Technical Summary
The heat generated by the microwave chip module during testing is not dissipated in time, causing the high temperature to change circuit parameters, affecting signal delay, increasing noise or causing logical misjudgment.
A microwave chip module test fixture was designed, consisting of a heat dissipation mechanism, a limiting mechanism, and a fixing mechanism. The heat dissipation mechanism detects the chip temperature through a temperature sensor, activating a circulating water pump and fan for rapid cooling. The limiting mechanism secures chips of varying sizes using a bidirectional ball screw and a clamping mechanism. The fixing mechanism secures the base using sockets and pins.
It achieves rapid cooling and heat dissipation of microwave chip modules, ensures test accuracy and reliability, adapts to the fixation of chips of different sizes and models, prevents displacement, and improves test efficiency.
Smart Images

Figure CN120629873A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of chip module testing, in particular to a microwave chip module testing fixture device. Background Art
[0002] With the rapid development of technologies such as 5G communications, radar detection, and satellite navigation, the core role of microwave chip modules in high-frequency signal processing has become increasingly prominent. These chips typically operate in the GHz and even millimeter-wave frequency bands, placing extremely high demands on the accuracy and efficiency of their performance testing. Microwave chip modules are typically secured and tested using test fixtures.
[0003] A Chinese patent with publication number CN115877047A discloses a microwave chip testing fixture device, including: a pallet for carrying a printed circuit board, the pallet including multiple panels, the number of which is the same as the number of printed circuit boards; a box frame for carrying the pallet, the box frame being a semi-enclosed boxed structure, the bottom of the box frame being provided with first through holes, the number of which is the same as the number of panels; a pressure sensor, the pressure sensor being arranged in the first through hole, the pressure sensor being in contact with the panel; a pressure regulating device, adjusting the contact pressure between the pressure sensor and the panel through the first through hole; by changing the overall pallet to be composed of multiple panels, the device greatly adapts to the application of multi-section printed circuit boards in the detection of microwave chips; at the same time, the existing mode of contact between the microwave chip pins and the printed circuit board through spring pins, special-shaped pins or conductive paper is changed, so that the microwave chip pins are in direct and good contact with the printed circuit board, better ensuring the reliable repeatability and reliable life of the chip test.
[0004] In the current existing technology, the reliability of chip testing is better guaranteed by ensuring direct and good contact between the microwave chip pins and the printed circuit board. However, the chip module needs to be powered on during testing, which generates heat during the power-on process. If the heat is not dissipated in time, the high temperature will change the circuit parameters, resulting in signal delays, increased noise or logical misjudgment.
[0005] To this end, the present invention provides a microwave chip module testing fixture device. Summary of the Invention
[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.
[0007] The technical solution adopted by the present invention to solve the technical problem is: a microwave chip module test fixture device according to the present invention comprises:
[0008] base;
[0009] A base is provided at one end fixedly connected to the top of the base;
[0010] There are two sets of limiting mechanisms, both of which are located on the top of the base and are used to fix the microwave chip module. The base is electrically connected to the microwave chip module;
[0011] A heat dissipation mechanism is provided inside the base;
[0012] The heat dissipation mechanism includes a cooling pipe, a circulating water pump, a cooling box and a fan; a cavity is opened inside the base, a cooling pipe is fixedly installed on the top inner wall of the cavity, and two fans are fixedly installed on the bottom inner wall of the cavity; the cooling pipe is spiral-shaped, one end of the cooling pipe is provided with a circulating water pump, the other end of the cooling pipe is connected and fixedly connected to the cooling box, and a connecting pipe is provided between the cooling box and the circulating water pump; a plurality of exhaust holes are opened on the top of the base in a linear arrangement; the bottom of the cooling box is connected and fixedly connected to a liquid inlet pipe, the bottom of the liquid inlet pipe extends flush with the bottom of the base; a plug is installed at the bottom of the liquid inlet pipe; two temperature sensors are provided at the bottom of the microwave chip module.
[0013] Preferably, the limiting mechanism includes four fixed plates, and two bidirectional ball screws are rotatably connected between the two fixed plates on the same side through bearings, and two movable frames are symmetrically threaded on the two bidirectional ball screws. Two guide rods are fixed between the two fixed plates on the same side, and the movable frames slide on the two guide rods; one end of one of the bidirectional ball screws is fixed with a rotating block, and the other ends of the two bidirectional ball screws are provided with a linkage mechanism; and a clamping mechanism is provided on the movable frame.
[0014] Preferably, the linkage mechanism includes a tensioning wheel fixedly connected to one end of two bidirectional ball screws, the tensioning wheel is arranged at the end away from the rotary block, and a belt is sleeved between the two tensioning wheels.
[0015] Preferably, the clamping mechanisms include a top plate fixed to the top of the movable frame, a threaded rod is threadedly connected to the top of the threaded rod, a handle is fixed to the top of the threaded rod, and a pressure plate is rotatably connected to the bottom of the threaded rod through a bearing; an anti-slip pad is fixed to the bottom of the pressure plate; a bottom plate is fixed to the side wall of the movable frame, and a rubber pad is fixed to the top of the bottom plate; a pressure sensor is embedded in the middle of the bottom plate.
[0016] Preferably, a guide rail is fixed to one end of the top of the base, and the base is slidably connected to the guide rail. A plurality of jacks are provided on the side wall of the base close to the limiting mechanism, and a fixing mechanism is provided on the other side wall of the base.
[0017] Preferably, the fixing mechanism includes a first mounting plate and a second mounting plate fixed to the side wall of the base, and the first mounting plate and the second mounting plate are slidably connected with a plug post, and a handle is rotatably connected to the side wall of the base through a pin shaft, and the bottom of the handle is fixed with a cam block, and the cam block cooperates with the top of the plug post; a plurality of slots are provided on the top of the base, and the slots all cooperate with the plug post; a spring is provided on the outer side of the plug post, and the bottom of the spring is fixed to the top of the second mounting plate, and the top of the spring is fixed to the outer side protrusion of the plug post.
[0018] Preferably, side panels are fixed to the side walls of the two bottom plates close to the base, and temperature sensors are fixed to the bottoms of the side panels. The tops of the temperature sensors are flush with the tops of the rubber pads, and the temperature sensors are electrically connected to the circulating water pump and the fan respectively.
[0019] Preferably, two vertical rods are fixed to the top of the pressure plate, and the vertical rods are slidably connected to the top plate.
[0020] The beneficial effects of the present invention are as follows:
[0021] 1. The microwave chip module test fixture device described in the present invention is provided with a heat dissipation mechanism. During the power-on test, the temperature sensor detects that the temperature at the bottom of the chip module is higher than a certain threshold. The temperature sensor transmits the temperature signal to the system, and the system controls the circulation water pump and the fan to turn on. The circulating water pump circulates the coolant in the cooling box in the cooling pipe, and then the fan blows the cold air through the exhaust hole onto the microwave chip module to cool the microwave chip module, thereby realizing the function of rapid cooling and heat dissipation of the microwave chip module.
[0022] 2. The microwave chip module testing fixture device described in the present invention is configured by setting a limit mechanism; by rotating the rotary block, the rotary block drives the connected bidirectional ball screw to rotate, the bidirectional ball screw drives the tensioning wheel to rotate, the tensioning wheel drives another tensioning wheel to rotate through a belt, and the other tensioning wheel drives the connected bidirectional ball screw to rotate, thereby realizing the synchronous rotation of the two bidirectional ball screws, and the two bidirectional ball screws drive the connected movable frame to move synchronously in different directions, thereby realizing the fixation of microwave chip modules of different sizes.
[0023] 3. The microwave chip module test fixture device described in the present invention is configured by setting a fixing mechanism; the base is moved to different positions according to different models of microwave chip modules, and then the handle is turned downward. During the rotation of the handle, the cam block drives the compression pin. At this time, the spring is compressed and the pin moves downward to the slot, thereby fixing the pin and the base, thereby fixing the base and preventing displacement during detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The present invention will be further described below with reference to the accompanying drawings.
[0025] Figure 1 is a perspective view of the present invention;
[0026] Figure 2 is a cross-sectional view of the base in the present invention;
[0027] Figure 3 It is a structural schematic diagram of the cooling pipe in the present invention;
[0028] Figure 4 It is a structural diagram of the limiting mechanism in the present invention;
[0029] Figure 5 It is a structural schematic diagram of the pressure plate of the present invention;
[0030] Figure 6 It is a structural schematic diagram of the base in the present invention;
[0031] Figure 7 This is a schematic diagram of the exploded structure of the plug post and the spring in the present invention;
[0032] In the figure: 1. Base; 11. Exhaust hole; 12. Cooling pipe; 13. Circulating water pump; 14. Cooling box; 15. Fan; 16. Liquid inlet pipe; 17. Plug; 2. Fixed plate; 21. Mobile frame; 211. Bottom plate; 212. Top plate; 213. Pressing plate; 214. Threaded rod; 215. Vertical rod; 216. Pressure sensor; 217. Side plate; 218. Temperature sensor; 219. Handle; 22. Bidirectional ball screw; 23. Guide rod; 24. Rotary block; 25. Tensioner; 26. Belt; 3. Base; 31. Socket; 32. Guide rail; 33. Slot; 34. First mounting plate; 341. Second mounting plate; 342. Column; 343. Spring; 344. Handle; 345. Cam block. DETAILED DESCRIPTION
[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.
[0034] like Figures 1 to 3As shown, a microwave chip module test fixture device according to an embodiment of the present invention includes: a base 1; a base 3, a base 3 is provided at one end fixedly connected to the top of the base 1; a limiting mechanism is provided with two groups, both of which are provided at the top of the base 1, for fixing the microwave chip module, and the base 3 is electrically connected to the microwave chip module; a heat dissipation mechanism is provided inside the base 1; the heat dissipation mechanism includes a cooling pipe 12, a circulating water pump 13, a cooling box 14 and a fan 15; a cavity is opened inside the base 1, a cooling pipe 12 is fixedly installed on the top inner wall of the cavity, and a cooling pipe 12 is fixedly installed on the bottom inner wall of the cavity. Two fans 15 are fixedly installed; the cooling pipe 12 is spiral-shaped, and a circulating water pump 13 is provided at one end of the cooling pipe 12, and the other end of the cooling pipe 12 is connected and fixedly connected to a cooling box 14, and a connecting pipe is provided between the cooling box 14 and the circulating water pump 13; a plurality of exhaust holes 11 are linearly arranged on the top of the base 1; the bottom of the cooling box 14 is connected and fixedly connected to a liquid inlet pipe 16, and the bottom of the liquid inlet pipe 16 extends flush with the bottom of the base 1; a plug 17 is installed at the bottom of the liquid inlet pipe 16; two temperature sensors 218 are provided at the bottom of the microwave chip module.
[0035] With the rapid development of technologies such as 5G communications, radar detection, and satellite navigation, the core role of microwave chip modules in high-frequency signal processing has become increasingly prominent. These chips typically operate in the GHz and even millimeter-wave frequency bands, placing extremely high demands on the accuracy and efficiency of their performance testing. However, chip module testing requires power supply testing, which generates heat during power-up. If this heat is not dissipated promptly, the high temperature can alter circuit parameters, leading to signal delays, increased noise, or even logical misjudgments.
[0036] When the heat dissipation mechanism provided by the present invention is in use, during the power-on test, the temperature sensor 218 detects that the temperature at the bottom of the chip module is higher than a certain threshold value, and the temperature signal is transmitted to the system through the temperature sensor 218. The system controls the circulating water pump 13 and the fan 15 to turn on, and the coolant in the cooling box 14 is circulated in the cooling pipe 12 by the circulating water pump 13, and then the cold air is blown onto the microwave chip module through the exhaust hole 11 by the fan 15, which is used to cool the microwave chip module and realize the function of rapid cooling and heat dissipation of the microwave chip module; it is necessary to regularly input coolant into the cooling box 14 through the liquid inlet pipe 16 to facilitate the continuous heat dissipation work.
[0037] like Figure 1 and Figure 4As shown, the limiting mechanism includes four fixed plates 2, and the two fixed plates 2 on the same side are rotatably connected with a bidirectional ball screw 22 through a bearing, and the two bidirectional ball screws 22 are symmetrically threaded with two movable frames 21, and the two fixed plates 2 on the same side are fixed with two guide rods 23, and the movable frames 21 slide on the two guide rods 23; one end of one of the bidirectional ball screws 22 is fixed with a rotary block 24, and the other ends of the two bidirectional ball screws 22 are provided with a linkage mechanism; and a clamping mechanism is provided on the movable frames 21.
[0038] The limiting mechanism provided by the present invention is used to limit and fix microwave chip modules of different sizes when in use. When limiting is required, the rotary block 24 is rotated to drive the connected bidirectional ball screw 22 to rotate. The bidirectional ball screw 22 drives another bidirectional ball screw 22 to rotate through a linkage mechanism. The two bidirectional ball screws 22 drive the connected movable frame 21 to move synchronously in different directions, thereby fixing microwave chip modules of different sizes.
[0039] like Figure 4 As shown, the linkage mechanism includes a tensioning wheel 25 fixed to one end of two bidirectional ball screws 22 . The tensioning wheel 25 is arranged at one end away from the rotary block 24 , and a belt 26 is sleeved between the two tensioning wheels 25 .
[0040] The linkage mechanism provided by the present invention is used to ensure the synchronous rotation of the two bidirectional ball screws 22 when in use. By rotating the rotary block 24, the rotary block 24 drives the connected bidirectional ball screw 22 to rotate, and the bidirectional ball screw 22 drives the tensioning pulley 25 to rotate. The tensioning pulley 25 drives another tensioning pulley 25 to rotate via the belt 26, and the other tensioning pulley 25 drives the connected bidirectional ball screw 22 to rotate, thereby achieving the synchronous rotation of the two bidirectional ball screws 22. The tensioning pulley 25 is adjusted to maintain sufficient tension in the belt 26. Insufficient tension will cause slippage, while excessive tension will increase bearing wear.
[0041] like Figure 4 and Figure 5 As shown, the clamping mechanism includes a top plate 212 fixedly connected to the top of the movable frame 21, a threaded rod 214 is threadedly connected to the top of the threaded rod 214, a handle 219 is fixed to the top of the threaded rod 214, and a pressure plate 213 is rotatably connected to the bottom of the threaded rod 214 through a bearing; the bottom of the pressure plate 213 is fixedly connected to an anti-slip pad; a bottom plate 211 is fixedly connected to the side wall of the movable frame 21, and a rubber pad is fixedly connected to the top of the bottom plate 211; a pressure sensor 216 is embedded in the middle of the bottom plate 211.
[0042] The clamping mechanism provided by the present invention is used to clamp and fix the microwave chip module when in use. By rotating the handle 219, the handle 219 drives the threaded rod 214 to rotate, and the threaded rod 214 drives the pressure plate 213 to move upward or downward until the anti-slip pad and the rubber pad are respectively in close contact with the microwave chip module, and the pressure does not exceed the pressure value set by the pressure sensor 216.
[0043] like Figure 1 As shown, a guide rail 32 is fixed to one end of the top of the base 1, and the base 3 is slidably connected to the guide rail 32. A plurality of insertion holes 31 are provided on the side wall of the base 3 close to the limiting mechanism, and a fixing mechanism is provided on the other side wall of the base 3.
[0044] The base 3 provided by the present invention is used to electrically connect with the microwave chip module when in use. The base 3 is provided with holes 31 with different apertures for plugging with microwave chip modules of different sizes; the guide rails 32 are provided to move the base 3 to different positions.
[0045] like Figure 1 、 Figure 6 and Figure 7 As shown, the fixing mechanism includes a first mounting plate 34 and a second mounting plate 341 fixed to the side wall of the base 3, and the first mounting plate 34 and the second mounting plate 341 are slidably connected with a plug post 342, and a handle 344 is rotatably connected to the side wall of the base 3 through a pin shaft, and the bottom of the handle 344 is fixed with a cam block 345, and the cam block 345 cooperates with the top of the plug post 342; a plurality of slots 33 are provided on the top of the base 1, and the slots 33 are all matched with the plug post 342; a spring 343 is sleeved on the outer side of the plug post 342, and the bottom of the spring 343 is fixed to the top of the second mounting plate 341, and the top of the spring 343 is fixed to the outer protrusion of the plug post 342.
[0046] When the fixing mechanism provided by the present invention is in use, the base 3 is moved to different positions according to different types of microwave chip modules, and then the handle 344 is turned downward. During the rotation of the handle 344, the cam block 345 drives the compression pin 342. At this time, the spring 343 is compressed, and the pin 342 moves downward to the slot 33, thereby fixing the pin 342 and the base 3, and achieving fixation of the base 3 to prevent displacement during detection. When it is necessary to move, the handle 344 is turned upward, and the cam block 345 is driven to rotate upward by the handle 344 to release the pressure on the pin 342. Under the action of the spring 343, the pin 342 bounces upward, and the pin 342 leaves the slot 33, thereby releasing the fixation of the pin 342 and the base 3, making it easy to quickly replace and fix the position of the base 3.
[0047] like Figure 5As shown, side panels 217 are fixed to the side walls of the two bottom plates 211 close to the base 3, and temperature sensors 218 are fixed to the bottoms of the side panels 217. The tops of the temperature sensors 218 are flush with the tops of the rubber pads, and the temperature sensors 218 are electrically connected to the circulating water pump 13 and the fan 15, respectively.
[0048] The temperature sensor 218 provided by the present invention is used to monitor the temperature of the microwave chip module when in use. The temperature sensor 218 detects that the temperature at the bottom of the chip module is higher than a certain threshold. The temperature signal is transmitted to the system through the temperature sensor 218, and the system controls the circulation water pump 13 and the fan 15 to turn on to cool the microwave chip module.
[0049] like Figure 5 As shown, two vertical rods 215 are fixed to the top of the pressing plate 213 , and the vertical rods 215 are slidably connected to the top plate 212 .
[0050] When the vertical rod 215 provided by the present invention is in use, the pressing plate 213 drives the vertical rod 215 to slide during the movement of the pressing plate 213 , and the vertical rod 215 limits the pressing plate 213 from moving in the vertical direction.
[0051] Working principle: During the power-on test, the temperature sensor 218 detects that the temperature at the bottom of the chip module is higher than a certain threshold. The temperature sensor 218 transmits the temperature signal to the system, and the system controls the circulating water pump 13 and the fan 15 to turn on. The circulating water pump 13 circulates the coolant in the cooling box 14 in the cooling pipe 12, and then the fan 15 blows the cold air through the exhaust hole 11 onto the microwave chip module to cool the microwave chip module and realize the function of rapid cooling and heat dissipation of the microwave chip module.
[0052] When limiting is required, by rotating the rotary block 24, the rotary block 24 drives the connected bidirectional ball screw 22 to rotate, the bidirectional ball screw 22 drives the tensioning wheel 25 to rotate, the tensioning wheel 25 drives another tensioning wheel 25 to rotate through the belt 26, and the other tensioning wheel 25 drives the connected bidirectional ball screw 22 to rotate, thereby achieving the synchronous rotation of the two bidirectional ball screws 22, and the two bidirectional ball screws 22 drive the connected movable frame 21 to move synchronously in different directions, so as to achieve the fixation of microwave chip modules of different sizes. By rotating the handle 219, the handle 219 drives the threaded rod 214 to rotate, and the threaded rod 214 drives the pressure plate 213 to move upward or downward until the anti-slip pad and the rubber pad are respectively in close contact with the microwave chip module, and the pressure does not exceed the pressure value set by the pressure sensor 216.
[0053] When in use, the base 3 is used to be electrically connected to the microwave chip module. Sockets 31 of different apertures are provided on the base 3 for plugging with microwave chip modules of different sizes. The guide rails 32 are provided to move the base 3 to different positions. The base 3 is moved to different positions according to different models of microwave chip modules. Then, by turning the handle 344 downward, the cam block 345 drives the pressure pin 342 during the rotation of the handle 344. At this time, the spring 343 is compressed, and the pin 342 moves downward to the slot 33, thereby fixing the pin 342 and the base 3 to achieve fixation of the base 3 and prevent displacement during detection. When it needs to be moved, the handle 344 is turned upward, and the cam block 345 is driven to rotate upward by the handle 344, contacting the pressure on the pin 342. Under the action of the spring 343, the pin 342 bounces upward and leaves the slot 33, thereby releasing the fixation of the pin 342 and the base 3, facilitating quick replacement and fixing the position of the base 3.
[0054] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.
Claims
1. A microwave chip module test fixture device, comprising: Base (1); A base (3) is provided at one end fixedly connected to the top of the base (1); There are two sets of limiting mechanisms, both of which are arranged on the top of the base (1) and are used to fix the microwave chip module. The base (3) is electrically connected to the microwave chip module; A heat dissipation mechanism is arranged inside the base (1); Its characteristics are: The heat dissipation mechanism comprises a cooling pipe (12), a circulating water pump (13), a cooling box (14) and a fan (15); a cavity is provided inside the base (1), a cooling pipe (12) is fixedly installed on the top inner wall of the cavity, and two fans (15) are fixedly installed on the bottom inner wall of the cavity; the cooling pipe (12) is spiral-shaped, one end of the cooling pipe (12) is provided with a circulating water pump (13), the other end of the cooling pipe (12) is connected and fixedly connected to the cooling box (14), and a connecting pipe is provided between the cooling box (14) and the circulating water pump (13); a plurality of exhaust holes (11) are linearly arranged on the top of the base (1); the bottom of the cooling box (14) is connected and fixedly connected to a liquid inlet pipe (16), and the bottom of the liquid inlet pipe (16) extends flush with the bottom of the base (1); a plug (17) is installed at the bottom of the liquid inlet pipe (16); and two temperature sensors (218) are provided at the bottom of the microwave chip module.
2. A microwave chip module test fixture device according to claim 1, characterized in that: The limiting mechanism comprises four fixed plates (2), two fixed plates (2) on the same side are rotatably connected with a bidirectional ball screw (22) via a bearing, two movable frames (21) are symmetrically threaded on the bidirectional ball screw (22), two guide rods (23) are fixedly connected between the two fixed plates (2) on the same side, and the movable frames (21) slide on the two guide rods (23); one end of one of the bidirectional ball screws (22) is fixedly connected with a rotary block (24), and the other ends of the two bidirectional ball screws (22) are provided with a linkage mechanism; and a clamping mechanism is provided on the movable frame (21).
3. A microwave chip module test fixture device according to claim 2, characterized in that: The linkage mechanism comprises a tensioning wheel (25) fixedly connected to one end of two bidirectional ball screws (22), the tensioning wheel (25) being arranged at one end away from the rotary block (24), and a belt (26) being sleeved between the two tensioning wheels (25).
4. A microwave chip module test fixture device according to claim 3, characterized in that: The clamping mechanisms each comprise a top plate (212) fixedly connected to the top of the mobile frame (21); a threaded rod (214) is threadedly connected to the top of the threaded rod (214); a handle (219) is fixedly connected to the top of the threaded rod (214); and a pressure plate (213) is rotatably connected to the bottom of the threaded rod (214) via a bearing; an anti-slip pad is fixedly connected to the bottom of the pressure plate (213); a bottom plate (211) is fixedly connected to the side wall of the mobile frame (21); a rubber pad is fixedly connected to the top of the bottom plate (211); and a pressure sensor (216) is embedded in the middle of the bottom plate (211).
5. The microwave chip module test fixture device according to claim 4, characterized in that: A guide rail (32) is fixedly connected to one end of the top of the base (1), and the base (3) is slidably connected to the guide rail (32). A plurality of insertion holes (31) are provided on a side wall of the base (3) close to the limiting mechanism, and a fixing mechanism is provided on the other side wall of the base (3).
6. The microwave chip module test fixture device according to claim 5, characterized in that: The fixing mechanism includes a first mounting plate (34) and a second mounting plate (341) fixed on the side wall of the base (3), the first mounting plate (34) and the second mounting plate (341) are slidably connected with a plug post (342), the side wall of the base (3) is rotatably connected with a handle (344), the bottom of the handle (344) is fixed with a cam block (345), and the cam block (345) cooperates with the top of the plug post (342); a plurality of slots (33) are provided on the top of the base (1), and the slots (33) are all matched with the plug post (342); a spring (343) is sleeved on the outer side of the plug post (342), the bottom of the spring (343) is fixed to the top of the second mounting plate (341), and the top of the spring (343) is fixed to the outer protrusion of the plug post (342).
7. The microwave chip module test fixture device according to claim 6, characterized in that: Side panels (217) are fixedly connected to the side walls of the two bottom plates (211) close to the base (3), and temperature sensors (218) are fixedly connected to the bottoms of the side panels (217). The tops of the temperature sensors (218) are flush with the tops of the rubber pads, and the temperature sensors (218) are electrically connected to the circulating water pump (13) and the fan (15), respectively.
8. The microwave chip module test fixture device according to claim 7, characterized in that: The top of each of the pressure plates (213) is fixedly connected to two vertical rods (215), and each of the vertical rods (215) is slidably connected to the top plate (212).
Citation Information
Patent Citations
Microwave chip test clamp device
CN115877047A
