Semiconductor testing device

Abstract

The invention provides a semiconductor testing device which comprises a workbench, the workbench is located right above a testing lower die and provided with a testing assembly through a mounting rack, the testing assembly comprises a driving mechanism and a floating testing mechanism, and the driving mechanism vertically penetrates through the mounting rack from top to bottom and then is connected with the floating testing mechanism; the floating test mechanism comprises a pressing plate assembly and a buffering assembly, the pressing plate assembly is connected to the bottom end of the buffering assembly, the buffering assembly comprises a mounting plate, a buffering piece and a floating assembly, a buffering cavity is defined in the buffering piece through an elastic piece, the top end of the floating assembly is embedded in the buffering piece, and the bottom end of the floating assembly is connected to the pressing plate assembly; the mounting plate forms an air channel communicated with the buffer cavity. When the pressing plate assembly abuts against the chip contained in the test lower die, the top end of the floating assembly ascends in the buffer piece and makes contact with the elastic piece. The invention is used for solving the problems that a buffer structure between a pressing plate and a driving mechanism in the prior art is relatively complex, and the production and detection efficiency of chips is affected due to the need of frequent replacement and maintenance.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production testing, and in particular to a semiconductor testing device. Background Art

[0002] Before a chip is put into use, its performance needs to be tested. A three-temperature tester is a device used to test semiconductor chips or related components in different temperature environments. It simulates low, room, and high temperatures to evaluate the chip's performance and lifespan under various operating conditions. This ensures that the chip maintains stable performance under various temperature fluctuations in actual applications after packaging and sale. Specifically, the chip is placed in a chip fixture, and the three-temperature tester's lifting pressure plate presses against the chip surface, transferring heat to the chip through the pressure plate to simulate the ambient temperature.

[0003] The pressure plate of the three-temperature tester is driven by a drive mechanism (such as a cylinder) to vertically lift and lower to press against the upper surface of the chip. Due to the different sizes, volumes and precision of the chips, the downward pressure forces they can withstand are different. Pressing down on the chip with a consistent force may cause damage to the chip. In order to avoid the problem of the chip being damaged by the downward pressure, the pressure plate needs to be equipped with a buffer structure to avoid damage to the chip. In the prior art, the buffer structure usually includes a guide rod and a spring. The compression and extension of the spring have a buffering effect. In order to maintain a uniform buffering effect on all parts of the pressure plate, it is necessary to evenly set no less than two springs between the drive mechanism and the pressure plate. First, due to the limitations of the spring's own structure, it can only achieve the effect of vertical expansion and contraction when used in conjunction with the guide rod. However, the introduction of the guide rod will increase the complexity of the buffer structure. Furthermore, the spring is limited by its own fatigue and its service life is relatively limited. It needs to be replaced and maintained more frequently, which in turn affects the production and testing efficiency of the chip.

[0004] In view of this, it is necessary to improve the existing semiconductor testing equipment to solve the above problems. It should be noted that the above introduction to the background technology is only for the convenience of providing a clear and complete description of the technical solutions of this application and facilitating the understanding of those skilled in the art. Simply because these solutions are described in the background technology section of this application, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to disclose a semiconductor testing device to solve the problem in the prior art that the buffer structure between the pressure plate and the driving mechanism is relatively complex and requires relatively frequent replacement and maintenance, which affects the production and detection efficiency of the chip.

[0006] To achieve the above objectives, the present invention provides a semiconductor testing device, comprising: a workbench, the workbench being provided with a test lower mold for accommodating a chip, the workbench being located directly above the test lower mold, a test assembly being provided via a mounting frame, the test assembly comprising a drive mechanism and a floating test mechanism, the drive mechanism vertically passing through the mounting frame from top to bottom and then connected to the floating test mechanism; The floating test mechanism includes a pressure plate assembly and a buffer assembly. The top end of the buffer assembly is connected to the driving mechanism, and the pressure plate assembly is connected to the bottom end of the buffer assembly. The buffer assembly includes a mounting plate, a buffer member, and a floating assembly. The buffer member is surrounded by an elastic member to form a buffer cavity. The top end of the floating assembly is embedded in the buffer member and the bottom end is connected to the pressure plate assembly. The mounting plate forms an air path communicating with the buffer cavity. When the pressing plate assembly presses against the chip contained in the test lower mold, the top end of the floating assembly rises in the buffer component and contacts the elastic component.

[0007] As a further improvement of the present invention, the buffer member includes a first mounting block and a second mounting block, a cavity is enclosed between the first mounting block and the second mounting block, the elastic member is formed as a sheet and is clamped between the first mounting block and the second mounting block, the first mounting block is fixed to the mounting plate, and the buffer cavity is formed by separating the internal space of the cavity and enclosed by the first mounting block and the elastic member; The floating assembly includes a connecting seat and a movable block, the connecting seat is fixedly connected to the upper surface of the pressure plate assembly, the bottom end of the movable block is fixedly connected to the connecting seat, the top end of the movable block passes through the bottom wall of the second mounting block and is located in the cavity, and a protrusion is formed on the side wall of one end of the movable block passing through the cavity, and the protrusion overlaps the bottom wall of the cavity surrounded by the second mounting block.

[0008] As a further improvement of the present invention, the floating test mechanism further comprises a heat insulation plate, the top wall of the heat insulation plate is fixedly connected to the connecting seat, the top surface of the connecting seat is provided with an annular positioning groove, and the top end of the movable block is embedded in the positioning groove and fixed; The bottom surface of the heat insulation plate is connected to the pressure plate assembly. The pressure plate assembly includes a first plate body and a second plate body. The first plate body and the second plate body enclose a temperature regulating liquid path.

[0009] As a further improvement of the present invention, the temperature-control liquid path is formed on the upper surface of the second plate body, and the temperature-control liquid path spirally extends from the center point of the second plate body to a position close to the side wall of the second plate body, and the first plate body covers the upper surface of the second plate body to seal the temperature-control liquid path; The second plate body forms a liquid through hole connected to the temperature regulating liquid circuit, the mounting plate forms a liquid channel and the top surface and side surface of the mounting plate respectively form a first hole position and a second hole position of the liquid channel, and the second hole position is connected to the liquid through hole through a hose.

[0010] As a further improvement of the present invention, the air path is formed in the mounting plate along the length direction, the top wall of the first mounting block forms an air inlet hole, the air inlet hole and the air path are interconnected, and the gas enters the buffer cavity through the air path and the air inlet hole. The elastic part is selected as a silicone sheet, and the top edge of the movable block is formed as a rounded chamfer.

[0011] As a further improvement of the present invention, the mounting frame includes a guide plate and two sets of support rods, the two support rods are distributed on both sides of the workbench in the length direction of the test lower mold, and the guide plate is fixed to the top ends of the two support rods; The driving mechanism includes a driving motor, a transmission mechanism and a lifting device. The lifting device passes through the guide plate and is connected to the floating testing mechanism. The driving motor drives the transmission mechanism to drive the floating testing mechanism to move in a direction perpendicular to the plane where the workbench is located.

[0012] As a further improvement of the present invention, the lifting device includes a lifting column and a screw, the screw is axially inserted into the lifting column, and the lifting column is threadedly engaged with the screw; The transmission mechanism includes a driving wheel and a driven wheel, the driving end of the driving motor is coaxially fixed to the driving wheel, a transmission belt is wound between the driving wheel and the driven wheel, and the driven wheel is coaxially fixed to the screw; The lifting column passes through the guide plate vertically downward and is connected to the floating test mechanism. The side wall of the lifting column is provided with a guide rail along the height direction. The guide plate has a guide groove adapted to the guide rail and slides relatively therewith.

[0013] As a further improvement of the present invention, the top wall of the guide plate is vertically fixed with a distance measuring mechanism, and the distance measuring mechanism includes a mounting rod and a first sensor and a second sensor connected to the mounting rod. The side wall of the lifting column is fixed with a baffle, and the baffle is lifted and lowered back and forth in the sensing area of ​​the first sensor and the second sensor.

[0014] As a further improvement of the present invention, the test lower mold is detachably connected to the workbench, the top wall of the test lower mold forms a positioning pin, and the lower surface of the second plate is detachably connected to a test fixture adapted to the test lower mold.

[0015] As a further improvement of the present invention, a pressure sensor is provided between the lifting column and the floating testing mechanism.

[0016] Compared to the prior art, the present invention has the following advantages: a buffer assembly comprising a mounting plate and a buffer member of the floating test mechanism is fixed, and a buffer cavity is formed within the buffer member by an elastic member. The top end of the floating assembly, which is connected to the pressure plate assembly, is inserted into the buffer member. Gas is injected into the buffer cavity via an air path formed in the mounting plate. When the pressure plate assembly is pressed down until it contacts the chip placed on the test lower mold, the floating assembly is subjected to an upward force, causing the elastic member to undergo a certain elastic deformation. The gas injected into the buffer cavity, in conjunction with the elastic member, forms a buffer air chamber between the floating assembly and the buffer member, effectively reducing the pressure applied by the pressure plate assembly to the chip surface compared to conventional rigid structures. Furthermore, by injecting gas into the buffer cavity formed by the elastic member and the buffer member, a gas bag with a buffering effect is formed. While providing a good buffering effect, only the elastic member itself needs to be replaced and maintained to maintain the normal working condition of the floating test mechanism as a whole. This effectively simplifies the buffer structure and reduces the risk of damage to the buffer structure affecting chip testing and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural diagram illustrating an assembly method of a floating test mechanism and a workbench in a semiconductor test device according to the present invention; Figure 2 is a cross-sectional schematic diagram illustrating the coordination relationship between the driving mechanism and the floating testing mechanism in the present invention; Figure 3 This is a schematic diagram of the specific structure of the floating test mechanism in the present invention; Figure 4 for Figure 3 Schematic diagram of the cross section along FF direction; Figure 5 It is a partial schematic diagram for reflecting the specific structure of the driving mechanism in the present invention; Figure 6 It is a partial schematic diagram for illustrating the cooperation relationship between the driving mechanism and the guide plate in the present invention; Figure 7 for Figure 2 Enlarged view of part A in the middle; Figure 8 for Figure 4 Enlarged view of part B in the middle. DETAILED DESCRIPTION

[0018] The present invention is described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are all within the scope of protection of the present invention.

[0019] Ginseng Figures 1 to 8 FIG. 4 shows a semiconductor testing device disclosed herein. Compared to the prior art, the floating test mechanism 4 includes a buffer assembly 5. The buffer assembly 5 comprises a mounting plate 51 and a buffer member 52, which are fixed. The buffer member 52 defines a buffer cavity 524 within the buffer member 52 via an elastic member 523. The top end of the floating assembly 53, connected to the pressure plate assembly 41, is inserted into the buffer member 52. Gas is injected into the buffer cavity 524 via an air passage 513 formed in the mounting plate 51. When the pressure plate assembly 41 is pressed down until it contacts a chip (not shown) placed on the lower test mold 2, the floating assembly 53 is subjected to the force, which causes the elastic member 523 to rise, causing a certain degree of elastic deformation. The gas injected into the buffer cavity 524, in conjunction with the elastic member 523, forms a buffer air chamber between the floating assembly 53 and the buffer member 52. This effectively reduces the pressure applied by the pressure plate assembly 41 on the chip surface compared to conventional rigid structures. Furthermore, an air bag with a buffering effect is formed by introducing gas into the buffer cavity 524 surrounded by the elastic member 523 and the buffer member 52. While having a good buffering effect, only the elastic member 523 itself needs to be replaced and maintained to maintain the overall normal working state of the floating test mechanism 4. Compared with the prior art that uses a spring to achieve a buffering effect on the pressure plate, it effectively simplifies the buffer structure while reducing the occurrence of situations where the damage to the buffer structure affects the detection and production efficiency of the chip.

[0020] Ginseng Figures 1 to 8 As shown, the present invention provides a semiconductor testing device, including: a workbench 1, the workbench 1 is provided with a test lower mold 2 for accommodating a chip (not shown), the workbench 1 is located directly above the test lower mold 2, and a test assembly is set through a mounting frame 3, the test assembly includes a driving mechanism 6 and a floating test mechanism 4, the driving mechanism 6 vertically passes through the mounting frame 3 from top to bottom and is connected to the floating test mechanism 4; the floating test mechanism 4 includes a pressure plate assembly 41 and a buffer assembly 5, the top of the buffer assembly 5 is connected to the driving mechanism 6, the pressure plate assembly 41 is connected to the bottom of the buffer assembly 5, the buffer assembly 5 includes a mounting plate 51, a buffer part 52 and a floating assembly 53, a buffer cavity 524 is formed in the buffer part 52 by an elastic part 523, the top of the floating assembly 53 is embedded in the buffer part 52 and the bottom end is connected to the pressure plate assembly 41; the mounting plate 51 forms an air path 513 connected to the buffer cavity 524, and when the pressure plate assembly 41 presses against the chip accommodated in the test lower mold 2, the top of the floating assembly 53 contacts the elastic part 523.

[0021] Ginseng Figures 3 to 8As shown, the buffer member 52 includes a first mounting block 521 and a second mounting block 522, and a cavity is formed between the first mounting block 521 and the second mounting block 522. The elastic member 523 is formed as a sheet member and is clamped between the first mounting block 521 and the second mounting block 522. The first mounting block 521 is fixed to the mounting plate 51, and the buffer cavity 524 is formed by separating the internal space of the cavity and is formed by the first mounting block 521 and the elastic member 523; the floating assembly 53 includes a connecting seat 531 and a movable block 532, the connecting seat 531 is fixed to the upper surface of the pressure plate assembly 41, and the bottom end of the movable block 532 is fixed to the connecting seat 531, and the top end of the movable block 532 passes through the bottom wall of the second mounting block 522 and is located in the cavity. A protrusion 5321 is formed on the side wall of one end of the movable block 532 passing through the cavity, and the protrusion 5321 overlaps the bottom wall of the cavity surrounded by the second mounting block 522.

[0022] Specific reference Figure 7 As shown, the test lower mold 2 is detachably connected to the workbench 1. The top wall of the test lower mold 2 forms a positioning pin 21. The lower surface of the pressure plate assembly 41 is detachably connected to a test fixture (not shown) that is compatible with the test lower mold 2. Specifically, the test lower mold 2 is provided with a receiving port 24 for placing the chip. Figure 7 The illustrated test lower mold 2 has only one receiving opening 24, so the test fixture mounted on the lower surface of the pressure plate assembly 41 is suitable for the test lower mold 2 with a single receiving opening 24. When a chip needs to be tested, the chip is placed in the receiving opening 24, and the drive mechanism 6 drives the floating test mechanism 4 to move downward as a whole until the test fixture connected to the lower surface of the pressure plate assembly 41 contacts the chip surface. As the test fixture contacts the chip, the movable block 532 is subjected to an upward force from the pressure plate assembly 41 as a whole. The protrusion 5321 at the top of the movable block 532, which penetrates the second mounting block 522, tends to move upward within the cavity and contact the elastic member 523. The buffer cavity 524 formed by the elastic member 523 and the first mounting block 521, which is inflated to form a cushioning airbag, continues to move downward, applying downward pressure to the protrusion 5321 of the movable block 532, thereby controlling the pressure applied by the pressure plate assembly 41 on the chip surface to prevent damage to the chip due to excessive downward pressure.

[0023] Ginseng Figures 3 to 8 As shown, the air path 513 is formed in the mounting plate 51 along the length direction, and the top wall of the first mounting block 521 forms an air inlet 525, which is connected to the air path 513. The gas flows into the buffer cavity 524 through the air path 513 and the air inlet 525. The elastic member 523 is optionally a silicone sheet, and the top edge of the movable block 532 is formed as a rounded chamfer. Figure 4 and Figure 8As shown, in this embodiment, the bottom wall of the first mounting block 521 and the top wall of the second mounting block 522 are in contact with each other. An elastic member 523, optionally a silicone sheet, is sandwiched between the first and second mounting blocks 521, 522, and a groove (not labeled) formed with the bottom wall of the first mounting block 521 forms a buffer chamber 524. It should be noted that the air inlet (not labeled) of the air path 513 is formed on a sidewall perpendicular to the length of the mounting plate 51. After entering the air path 513, gas flows through the air inlet 525 into the buffer chamber 524. More specifically, the amount of gas entering the buffer chamber 524 is automatically adjustable. When the driving mechanism 6 drives the floating test mechanism 4 downward until the pressure plate assembly 41 contacts the chip, an interaction force is generated between the top of the movable block 532 and the elastic member 523, which forms an airbag. This effectively controls the pressure applied by the pressure plate assembly 41 to the chip, preventing damage to the chip due to excessive pressure.

[0024] Ginseng Figures 3 to 8 As shown, the floating test mechanism 4 also includes a heat insulation plate 42, the top wall of the heat insulation plate 42 is fixedly connected to the connecting seat 531, the top surface of the connecting seat 531 is provided with a ring-shaped positioning groove 5311, and the bottom end of the movable block 532 is embedded in the positioning groove 5311 and fixed; the bottom surface of the heat insulation plate 42 is connected to the pressure plate assembly 41, and the pressure plate assembly 41 includes a first plate body 411 and a second plate body 412, and the first plate body 411 and the second plate body 412 enclose a temperature control liquid path 413. A temperature-regulating liquid path 413 is formed on the upper surface of the second plate 412 . The temperature-regulating liquid path 413 spirally extends from the center point of the second plate 412 to the side wall near the second plate 412 . The first plate 411 covers the upper surface of the second plate 412 to seal the temperature-regulating liquid path 413 . The second plate 412 defines a liquid through hole 414 communicating with the temperature-regulating liquid path 413 . The mounting plate 51 forms a liquid channel (not labeled) with a first hole 511 and a second hole 512 of the liquid channel formed on the top and side surfaces of the mounting plate 51 , respectively. The second hole 512 is connected to the liquid through hole 414 via a hose (not shown).

[0025] It should be noted that liquids with inconsistent temperatures are introduced into the temperature-regulating liquid path 413 formed in the pressure plate assembly 41 to change the temperature of the pressure plate assembly 41. When the pressure plate assembly 41 is pressed down to contact the chip, it simulates the different temperatures of the chip's working environment. Furthermore, in conjunction with the first hole 511 and the second hole 512 formed on the mounting plate 51, a hose (not shown) is first connected to the first hole 511 to pass through the liquid path, and then flows into the temperature-regulating liquid path 413 through the second hole 512 and the liquid path through-hole 414 through the hose (not shown). In this embodiment, the temperature-regulating liquid path 413 is formed in a spiral posture on the upper surface of the second plate body 412, so that the temperature-regulating liquid introduced into the temperature-regulating liquid path 413 can evenly cool the second plate body 412. Specifically, in combination with Figure 3 and Figure 4 As shown, the floating test mechanism 4 in this embodiment specifically includes a mounting plate 51, two sets of pressure plate assemblies 41, two sets of buffers 52 and floating assemblies 53, and then the heat insulation plate 42 is set into two sets corresponding to the floating assemblies 53 and the pressure plate assemblies 41. Combined with the above, it can be seen that the lower surface of the second plate body 412 of the pressure plate assembly 41 in this embodiment can be detachably connected to the test fixture, and cooperate with Figure 7 The test lower mold 2 shown has a single receiving opening 24. Optionally, a test fixture compatible with the test lower mold 2 can be detachably connected to the lower surfaces of both sets of pressure plate assemblies 41. Furthermore, when the test lower mold 2 has two or four receiving openings 24, the test fixture connected to the pressure plate assemblies 41 can be one or two corresponding sets of pressure plate assemblies 41, as long as they are compatible with the test lower mold 2.

[0026] It should be noted that the test lower mold 2 has a positioning block 23. The workbench 1 has an opening (not marked) for installing the test lower mold 2. The test lower mold 2 is placed from bottom to top at the edge of the top surface and fits in with the lower surface of the workbench 1. At this time, the positioning block 23 passes through the corresponding position of the workbench 1 and is fixed to the workbench 1 by bolts or other connecting parts. Figure 7 The lower test mold 2 is shown with a temperature-controlled liquid path 22. When a chip is placed in the receiving port 24, liquids of varying temperatures are introduced into the temperature-controlled liquid path 22 to simulate the varying operating temperatures of the chip. This further enhances temperature regulation during the bonding of the platen assembly 41 to the chip. Furthermore, after the current batch of chips is tested, the liquid is withdrawn from the temperature-controlled liquid path 413 via the first hole 511 and then reintroduced into the temperature-controlled liquid path 413 for the next chip test.

[0027] Ginseng Figure 1 and Figure 2 as well as Figure 5 and Figure 6 As shown, the mounting frame 3 includes a guide plate 31 and two groups of support rods 32. The two groups of support rods 32 are distributed on both sides of the workbench 1 in the length direction of the test lower mold 2. The guide plate 31 is fixed to the top of the two support rods 32; the driving mechanism 6 includes a driving motor 61, a transmission mechanism 62 and a lifting device (not marked). The lifting device passes through the guide plate 31 and is connected to the floating test mechanism 4. The driving motor 61 drives the transmission mechanism 62 to drive the floating test mechanism 4 to move in a direction perpendicular to the plane of the workbench 1.

[0028] Ginseng Figure 5 and Figure 6As shown, the lifting device includes a lifting column 631 and a screw 632. The screw 632 is axially inserted into the lifting column 631, and the lifting column 631 and the screw 632 are threadedly engaged. The transmission mechanism 62 includes a driving wheel 621 and a driven wheel 622. The driving end of the drive motor 61 is coaxially fixed to the driving wheel 621. A transmission belt 623 is wound between the driving wheel 621 and the driven wheel 622. The driven wheel 622 is coaxially fixed to the screw 632. The lifting column 631 passes vertically downward through the guide plate 31 and is connected to the floating test mechanism 4. The side wall of the lifting column 631 is provided with a guide rail 633 along the height direction. The guide plate 31 has a guide groove 311 that adapts to the guide rail 633 and slides relative to it. A pressure sensor 43 is provided between the lifting column 631 and the floating test mechanism 4. Specifically, the pressure sensor 43 is connected between the mounting plate 51 and the lifting column 631.

[0029] It should be noted that the top wall of the guide plate 31 is vertically mounted with a support plate 34, and the support plate 34 is used to assemble a drive motor 61 and a transmission mechanism 62. Specifically, the drive motor 61 is mounted on the lower surface of the support plate 34, and the driving wheel 621 and the driven wheel 622 are assembled on the upper surface of the support plate 34. The driving wheel 621 is coaxially fixed with the driving end of the drive motor 61 passing through the support plate 34, and the screw 632 passes vertically upward from the bottom of the support plate 34 and is coaxially fixed with the driven wheel 622. By controlling the forward and reverse rotation of the drive motor 61 to control the driven wheel 622, the screw 632 is driven to rotate forward and reverse, thereby controlling the lifting column 631 threadedly matched with the screw 632 to rise or fall relative to the guide plate 31. Figure 5 As shown, the support plate 34 is fixedly connected to the bearing 341, and the screw 632 passes through the bearing 341 to achieve a rotational fit relative to the support plate 34. Furthermore, in this embodiment, the interior of the lifting column 631 is hollowed out along the axial direction, and the outer wall of the lifting column 631 is enclosed by four mutually perpendicular side walls. Two guide rails 633 are provided and symmetrically arranged on opposite sides of the lifting column 631. This design effectively improves the lifting stability of the lifting column 631.

[0030] Ginseng Figure 5 and Figure 6As shown, the top wall of the guide plate 31 is vertically fixed with a distance measuring mechanism 33. The distance measuring mechanism 33 includes a mounting rod 333 and a first sensor 331 and a second sensor 332 connected to the mounting rod 333. A baffle 634 is fixed to the sidewall of a lifting column 631, which reciprocates within the sensing area of ​​the first sensor 331 and the second sensor 332. It should be noted that in this embodiment, the first sensor 331 and the second sensor 332 are infrared sensors. The distance between the first sensor 331 and the second sensor 332 defines the height range within which the lifting column 631 can drive the floating test mechanism 4. Furthermore, the pressure sensor 43 connected between the floating test mechanism 4 and the lifting column 631 can firstly provide feedback before chip testing on the pressure that the chip will be subjected to from the floating test mechanism 4. If the pressure exceeds the pressure range that the chip can withstand, the lifting range of the lifting column 631 can be adjusted, that is, the installation height of the second sensor 332 on the mounting rod 333 can be adjusted. Secondly, the pressure sensor 43 can monitor the pressure applied to the chip in real time during chip testing, further preventing damage to the chip due to excessive pressure.

[0031] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0032] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0033] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor testing device, characterized in that: include: A workbench, wherein the workbench is provided with a test lower mold for accommodating the chip, and the workbench is located directly above the test lower mold and a test assembly is arranged through a mounting frame. The test assembly includes a driving mechanism and a floating test mechanism, and the driving mechanism vertically passes through the mounting frame from top to bottom and is connected to the floating test mechanism; The floating test mechanism includes a pressure plate assembly and a buffer assembly. The top end of the buffer assembly is connected to the driving mechanism, and the pressure plate assembly is connected to the bottom end of the buffer assembly. The buffer assembly includes a mounting plate, a buffer member, and a floating assembly. The buffer member is surrounded by an elastic member to form a buffer cavity. The top end of the floating assembly is embedded in the buffer member and the bottom end is connected to the pressure plate assembly. The mounting plate forms an air path communicating with the buffer cavity. When the pressing plate assembly presses against the chip contained in the test lower mold, the top end of the floating assembly rises in the buffer component and contacts the elastic component.

2. The semiconductor testing device according to claim 1, wherein: The buffer member includes a first mounting block and a second mounting block, wherein a cavity is formed between the first mounting block and the second mounting block, the elastic member is formed as a sheet and is clamped between the first mounting block and the second mounting block, the first mounting block is fixed to the mounting plate, and the buffer cavity is formed by separating the internal space of the cavity and enclosed by the first mounting block and the elastic member; The floating assembly includes a connecting seat and a movable block, the connecting seat is fixedly connected to the upper surface of the pressure plate assembly, the bottom end of the movable block is fixedly connected to the connecting seat, the top end of the movable block passes through the bottom wall of the second mounting block and is located in the cavity, and a protrusion is formed on the side wall of one end of the movable block passing through the cavity, and the protrusion overlaps the bottom wall of the cavity surrounded by the second mounting block.

3. The semiconductor testing device according to claim 2, wherein: The floating test mechanism further includes a heat insulation plate, the top wall of the heat insulation plate is fixedly connected to the connecting seat, the top surface of the connecting seat is provided with a ring-shaped positioning groove, and the top end of the movable block is embedded in the positioning groove and fixed; The bottom surface of the heat insulation plate is connected to the pressure plate assembly. The pressure plate assembly includes a first plate body and a second plate body. The first plate body and the second plate body enclose a temperature regulating liquid path.

4. The semiconductor testing device according to claim 3, wherein: The temperature-control liquid path is formed on the upper surface of the second plate body, and the temperature-control liquid path spirally extends from the center point of the second plate body to the side wall close to the second plate body. The first plate body covers the upper surface of the second plate body to seal the temperature-control liquid path; The second plate body forms a liquid through hole connected to the temperature regulating liquid circuit, the mounting plate forms a liquid channel and the top surface and side surface of the mounting plate respectively form a first hole position and a second hole position of the liquid channel, and the second hole position is connected to the liquid through hole through a hose.

5. The semiconductor testing device according to claim 2, wherein: The air path is formed in the mounting plate along the length direction, and an air inlet is formed on the top wall of the first mounting block. The air inlet and the air path are interconnected, and the gas enters the buffer cavity through the air path and the air inlet. The elastic member is selected as a silicone sheet, and the top edge of the movable block is formed as a rounded chamfer. The semiconductor testing device according to claim 1 , wherein: The mounting frame includes a guide plate and two sets of support rods, the two support rods are distributed on both sides of the workbench in the length direction of the test lower mold, and the guide plate is fixed to the top ends of the two support rods; The driving mechanism includes a driving motor, a transmission mechanism and a lifting device. The lifting device passes through the guide plate and is connected to the floating testing mechanism. The driving motor drives the transmission mechanism to drive the floating testing mechanism to move in a direction perpendicular to the plane where the workbench is located.

7. The semiconductor testing device according to claim 6, wherein: The lifting device includes a lifting column and a screw, wherein the screw is axially inserted into the lifting column, and the lifting column is threadedly engaged with the screw; The transmission mechanism includes a driving wheel and a driven wheel, the driving end of the driving motor is coaxially fixed to the driving wheel, a transmission belt is wound between the driving wheel and the driven wheel, and the driven wheel is coaxially fixed to the screw; The lifting column passes through the guide plate vertically downward and is connected to the floating test mechanism. The side wall of the lifting column is provided with a guide rail along the height direction. The guide plate has a guide groove adapted to the guide rail and slides relatively therewith.

8. The semiconductor testing device according to claim 7, wherein: The top wall of the guide plate is vertically fixed with a distance measuring mechanism, which includes a mounting rod and a first sensor and a second sensor connected to the mounting rod. The side wall of the lifting column is fixed with a baffle, which reciprocates in the sensing area of ​​the first sensor and the second sensor.

9. The semiconductor testing device according to claim 4, wherein: The test lower mold is detachably connected to the workbench, a top wall of the test lower mold forms a positioning pin, and the lower surface of the second plate is detachably connected to a test fixture adapted to the test lower mold.

10. The semiconductor testing device according to claim 8, wherein A pressure sensor is provided between the lifting column and the floating testing mechanism.

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