Optical module

Abstract

In the optical module provided by the invention, the light receiving part is arranged below the light emitting part, and the light receiving part supports and is connected with the light emitting part. The backlight detection assembly is arranged on the electric connector so as to fully utilize the electric connector to realize optical power detection of the laser assembly. The laser assembly is in routing connection with the first connecting surface and then is electrically connected with the first bonding pad group through the third connecting surface and the first flexible circuit board in sequence, and the backlight detector assembly is in routing connection with the second connecting surface and then is electrically connected with the second bonding pad group through the fourth connecting surface and the second flexible circuit board in sequence. The first bonding pad set is located on the side, close to the electric connector, of the first driver, the distance for the first driver to transmit the high-frequency signals to the laser assembly can be effectively controlled, and the transmission quality of the high-frequency signals can be guaranteed conveniently. According to the optical module provided by the invention, the utilization rate of the space in the shell of the optical module can be improved, and the transmission quality of a high-frequency signal can be ensured, so that the requirement of arranging multiple transmission channels in the optical module can be met.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0003] Currently, to increase the transmission rate of optical modules, multiple transmission channels are set up in optical modules. In other words, the transmission capacity is increased through multi-channel design. However, as the number of transmission channels in optical modules increases, the number of components involved will also increase, which places higher requirements on the packaging of optical modules. Summary of the Invention

[0004] The embodiments of the present disclosure provide an optical module, which facilitates setting up multiple transmission channels within the optical module.

[0005] The present disclosure provides an optical module, comprising:

[0006] A circuit board is provided with a first driver on the top surface, a gold finger is provided on the surface of the end portion, a first pad group is provided on one side of the first driver, a second pad group is provided on the other side of the first driver, and the second pad group is close to the gold finger; the first driver is electrically connected to the first pad group;

[0007] A first light emitting component is located at one end of the circuit board;

[0008] a second light emitting component, located at one end of the circuit board and at a side of the first light emitting component;

[0009] a first light receiving component, located below the first light emitting component and supporting and connecting the first light emitting component;

[0010] a second light receiving component, located below the second light emitting component and supporting and connecting the second light emitting component;

[0011] Wherein, the first light emitting component includes:

[0012] A first shell having a first through hole formed at one end and an opening formed at the other end;

[0013] a laser assembly, located in the first housing, for generating an optical signal;

[0014] a first upper cover, covering and connecting the first shell;

[0015] An electrical connector is embedded in the opening; one end of the electrical connector extends into the inner cavity of the first shell, and the other end of the electrical connector is located outside the first shell; a first connection surface and a second connection surface are formed at one end of the electrical connector, and the second connection surface is located above the first connection surface; a third connection surface and a fourth connection surface are formed at the other end of the electrical connector, and the third connection surface is located above the fourth connection surface; the first connection surface and the third connection surface are located on the same layer of the electrical connector; the first connection surface is located on the backlight side of the laser assembly, and the first connection surface is connected to the laser assembly by wire bonding;

[0016] A backlight detection component is provided on the first connection surface, and the backlight detection component is connected to the second connection surface by wire bonding;

[0017] a first flexible circuit board, one end of which is welded to the third connection surface, and the other end of which is welded to the first pad group; the laser assembly is electrically connected to the first driver via the first connection surface, the third connection surface, and the first flexible circuit board in sequence;

[0018] A second flexible circuit board has one end welded to the fourth connection surface and the other end welded to the second pad group; the backlight detection component is electrically connected to the second pad group via the second connection surface, the fourth connection surface and the second flexible circuit board in sequence.

[0019] In the optical module provided by the embodiment of the present disclosure, the backlight detection assembly is arranged on the electrical connector to make full use of the electrical connector to realize the optical power detection of the laser assembly. The laser assembly is connected to the first connection surface by wiring, and then electrically connected to the first pad group through the third connection surface and the first flexible circuit board in sequence. The backlight detector assembly is connected to the second connection surface by wiring, and then electrically connected to the second pad group through the fourth connection surface and the second flexible circuit board in sequence. The first pad group is located on the side of the first driver close to the electrical connector, which can effectively control the distance of the high-frequency signal transmitted from the first driver to the laser assembly, so as to ensure the transmission quality of the high-frequency signal. In this way, the optical module provided by the present disclosure can improve the utilization rate of the space inside the shell of the optical module, and can also ensure the transmission quality of the high-frequency signal, so as to adapt to the demand of setting multiple transmission channels in the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0021] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0022] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0023] Figure 3 A schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 5A Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0026] Figure 5B Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0027] Figure 6A A schematic structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0028] Figure 6B This is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0029] Figure 6C A cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure;

[0030] Figure 6D A partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure Figure 1 ;

[0031] Figure 6E A partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure Figure 2 ;

[0032] Figure 6F A schematic structural diagram of an electrical connector provided according to some embodiments of the present disclosure;

[0033] Figure 6G A partially enlarged view of an electrical connector provided according to some embodiments of the present disclosure;

[0034] Figure 6H is a schematic cross-sectional view of an electrical connector provided according to some embodiments of the present disclosure;

[0035] Figure 7A diagram showing a state of use of a TEC according to some embodiments of the present disclosure;

[0036] Figure 8 A schematic structural diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0037] Figure 9A A schematic structural diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0038] Figure 9B This is an exploded schematic diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0039] Figure 9C This is a structural schematic diagram of a second housing provided according to some embodiments of the present disclosure;

[0040] Figure 9D A diagram showing a second housing in use according to some embodiments of the present disclosure;

[0041] Figure 9E is a cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure;

[0042] Figure 9F A schematic structural diagram of a second upper cover provided according to some embodiments of the present disclosure;

[0043] Figure 10A A schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0044] Figure 10B A partial schematic diagram of another optical module provided according to some embodiments of the present disclosure;

[0045] Figure 10C A schematic structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0046] Figure 10D This is a schematic structural diagram of a second flexible circuit board provided according to some embodiments of the present disclosure;

[0047] Figure 11A A schematic diagram of a fiber coil support according to some embodiments of the present disclosure Figure 1 ;

[0048] Figure 11B A schematic diagram of a fiber coil support according to some embodiments of the present disclosure Figure 2 ;

[0049] Figure 11C A schematic diagram of an assembly of a fiber coil support and a circuit board according to some embodiments of the present disclosure;

[0050] Figure 12A A schematic diagram of the structure of a second fiber coil support provided according to some embodiments of the present disclosure Figure 1 ;

[0051] Figure 12B A schematic diagram of the structure of a second fiber coil support provided according to some embodiments of the present disclosure Figure 2 ;

[0052] Figure 13 A schematic diagram of a partial structure of a lower housing provided according to some embodiments of the present disclosure;

[0053] Figure 14A Schematic diagram of the assembly of a second fiber coil support provided according to some embodiments of the present disclosure;

[0054] Figure 14B This is a cross-sectional view of a second fiber coil support in use according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0055] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0056] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0057] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0058] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0059] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0060] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0061] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0062] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0063] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0064] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0065] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0066] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0067] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 Schematic diagram of an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 , a light emitting component 400 , and a light receiving component 500 disposed in the shell.

[0068] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0069] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0070] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates 2012 are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0071] The direction of the line connecting the two openings 203 and 204 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 The opening 204 is also located at the end of the optical module 200 ( Figure 3 Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200. Opening 203 is an electrical port, through which the gold fingers of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 204 is an optical port, configured to receive optical fiber 101, thereby connecting optical fiber 101 to optical emitting component 400 and / or optical receiving component 500 in optical module 200.

[0072] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, during the assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0073] In some embodiments, the upper shell 201 and the lower shell 202 can be selected as needed, and can generally be made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0074] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0075] Exemplarily, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0076] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LIAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0077] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0078] The circuit board 300 also includes a gold finger formed on its end surface. The gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and is connected to the electrical connector in the cage 106 through the gold finger. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The top surface of the circuit board 300 is shown in the figure. It can also be located on the upper and lower surfaces of the circuit board 300 to accommodate applications requiring a large number of pins. The gold fingers are configured to establish electrical connections with the host computer to facilitate power supply, grounding, I2C signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement them.

[0079] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0080] In some embodiments, the light emitting component 400 and the light receiving component 500 may be located at one end of the circuit board 300 and outside the circuit board 300. Of course, in the embodiment of the present disclosure, the light emitting component 400 or the light receiving component 500 may be located on the circuit board 300.

[0081] In some embodiments, optical module 200 may include a first optical transmission assembly, which is used to connect an external optical fiber and optical emitting component 400 to transmit the optical signal generated by optical emitting component 400 to the external optical fiber. The first optical transmission assembly includes a first optical fiber adapter, a first optical fiber, and a second optical fiber adapter. One end of the first optical fiber is connected to the first optical fiber adapter, and the other end of the first optical fiber is connected to the second optical fiber adapter. The first optical fiber adapter is fixed to the optical port of optical module 200, and the second optical fiber adapter is used to connect to optical emitting component 400.

[0082] In some embodiments, the optical module 200 may include a second optical transmission assembly, which is used to connect the external optical fiber and the optical receiving component 500 to transmit the optical signal input by the external optical fiber to the optical receiving component 500. The second optical transmission assembly includes a third optical fiber adapter, a second optical fiber, and a fourth optical fiber adapter. One end of the second optical fiber is connected to the third optical fiber adapter, and the other end of the second optical fiber is connected to the fourth optical fiber adapter. The third optical fiber adapter is fixed to the optical port of the optical module 200, and the fourth optical fiber adapter is used to connect to the optical receiving component 500.

[0083] In some embodiments, the length of the first optical fiber and the second optical fiber is greater than the length of the optical module 200, such as the length of the first optical fiber and the second optical fiber is 2-3 times the length of the optical module 200, to facilitate the assembly of the optical emitting component 400, the optical receiving component 500, etc.

[0084] In some embodiments, the optical module 200 may include a fiber coiling bracket 700, which is located inside the housing. Exemplarily, the fiber coiling bracket 700 is connected to the circuit board 300 to support the connection of the fiber coiling bracket 700 through the circuit board 300. Of course, in the embodiment of the present disclosure, the fiber coiling bracket 700 may also be fixedly connected to the lower housing 202 and located near the optical port of the optical module. The fiber coiling bracket 700 is used to coil the first optical fiber and / or the second optical fiber to straighten the first optical fiber and the second optical fiber, which can not only facilitate the damage of the first optical fiber and the second optical fiber during the assembly process of the optical module, but also facilitate the avoidance of transitional bending of the first optical fiber and the second optical fiber, thereby ensuring the transmission quality of the optical signal.

[0085] In some embodiments, the optical module 200 may include a first fiber coiling support 700a and a second fiber coiling support 700b. The first fiber coiling support 700a is located between the end of the optical emitting component 400 and the electrical port of the optical module, while the second fiber coiling support 700b is located between the front end of the optical emitting component 400 and the optical port of the optical module. Exemplarily, the circuit board 300 supports and connects to the first fiber coiling support 700a, while the base plate 2021 supports and connects to the second fiber coiling support 700b. The first fiber coiling support 700a and the second fiber coiling support 700b cooperate to coil the first optical fiber and / or the second optical fiber, thereby more neatly organizing the first and second optical fibers.

[0086] Figure 5A Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 5B Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 2 In some embodiments, the optical module 200 may include a first light emitting component 400a and a second light emitting component 400b, which are located on the side of the same end of the circuit board 300 and outside the circuit board 300. The first light emitting component 400a and the second light emitting component 400b may be electrically connected to the circuit board 300 via a flexible circuit board. For example, the first light emitting component 400a and the second light emitting component 400b are electrically connected to the top surface of the circuit board 300 via the flexible circuit board.

[0087] In some embodiments, the first light emitting part 400 a and the second light emitting part 400 b may be disposed side by side along a width direction of the optical module 200 .

[0088] In some embodiments, the optical module 200 may include a first light receiving component 500a and a second light receiving component 500b. The first light receiving component 500a and the second light receiving component 500b may be electrically connected to the circuit board 300 via a flexible circuit board. For example, the first light receiving component 500a and the second light receiving component 500b are electrically connected to the bottom surface of the circuit board 300 via the flexible circuit board.

[0089] In some embodiments, the first light receiving part 500 a and the second light receiving part 500 b may be disposed side by side along a width direction of the optical module 200 .

[0090] In some embodiments, the first light emitting component 400a is positioned on the first light receiving component 500a, and the second light emitting component 400b is positioned on the second light receiving component 500b, so that the first light emitting component 400a and the first light receiving component 500a are stacked one above the other, and the second light emitting component 400b and the second light receiving component 500b are stacked one above the other. The light emitting component 400 and the light receiving component 500 have different heights, and stacking the light emitting component 400 and the light receiving component 500 makes full use of the space inside the housing.

[0091] In some embodiments, the optical module 200 may include a first flexible circuit board 301a and a second flexible circuit board 302a, one end of the first flexible circuit board 301a and one end of the second flexible circuit board 302a are respectively connected to the first light emitting component 400a, and the other end of the first flexible circuit board 301a and the other end of the second flexible circuit board 302a are respectively connected to the circuit board 300.

[0092] In some embodiments, the optical module 200 may include a first flexible circuit board 301b and a second flexible circuit board 302b, one end of the first flexible circuit board 301b and one end of the second flexible circuit board 302b are respectively connected to the second light emitting component 400b, and the other end of the first flexible circuit board 301b and the other end of the second flexible circuit board 302b are respectively connected to the circuit board 300.

[0093] In some embodiments, a first driver 320 and a second driver 330 may be provided on the top surface of the circuit board 300, with the first driver 320 being close to the first light emitting component 400a, and the second driver 330 being close to the second light emitting component 400b. Of course, in the embodiment of the present disclosure, the first driver 320 and the second driver 330 may be packaged into one driver, with the driver being close to the first light emitting component 400a and the second light emitting component 400b.

[0094] In some embodiments, the first driver 320 and the second driver 330 may be connected to the upper housing 201 via thermal pads or thermal adhesive, respectively, so as to transfer heat from the first driver 320 and the second driver 330 to the upper housing 201 .

[0095] In some embodiments, the first flexible circuit board 301a is used to transmit high-frequency signals, and the first flexible circuit board 301b is used to transmit high-frequency signals. The other end of the first flexible circuit board 301a extends to the side of the first driver 320, and the other end of the first flexible circuit board 301b extends to the side of the second driver 330. The first driver 320 is electrically connected to the first light emitting component 400a through the first flexible circuit board 301a to transmit high-frequency signals to the first light emitting component 400a through the first flexible circuit board 301a; the second driver 330 is electrically connected to the second light emitting component 400b through the first flexible circuit board 301b to transmit high-frequency signals to the second light emitting component 400b through the first flexible circuit board 301b.

[0096] In some embodiments, the optical module 200 may include a third flexible circuit board 303a and a third flexible circuit board 303b. One end of the third flexible circuit board 303a is electrically connected to the first light receiving component 500a, one end of the third flexible circuit board 303b is electrically connected to the second light receiving component 500b, and the other ends of the third flexible circuit board 303a and the other ends of the third flexible circuit board 303b are respectively connected to the circuit board 300.

[0097] In some embodiments, a first CDR 340 and a second CDR 350 may be provided on the bottom surface of the circuit board 300, with the first CDR 340 positioned adjacent to the first light receiving element 500a and the second CDR 350 positioned adjacent to the second light receiving element 500b. In the disclosed embodiment, the first and second CDRs 340 and 350 may be packaged as a single CDR, positioned adjacent to the first and second light receiving elements 500a and 500b. The first and second CDRs 340 and 350 may integrate limiting amplification processing. In the disclosed embodiment, a first and second LIA may also be provided on the circuit board 300, with the first LIA positioned adjacent to the first light receiving element 500a and the second LIA positioned adjacent to the second light receiving element 500b.

[0098] In some embodiments, the first light receiving component 500a is electrically connected to the first CDR340 through the third flexible circuit board 303a, so that the high-frequency signal output by the first light receiving component 500a is transmitted to the first CDR340 through the third flexible circuit board 303a; the second light receiving component 500b is electrically connected to the second CDR350 through the third flexible circuit board 303b, so that the high-frequency signal output by the second light receiving component 500b is transmitted to the second CDR350 through the third flexible circuit board 303b.

[0099] In some embodiments, gold fingers 310 are respectively provided on the top and bottom surfaces of the end portion of the circuit board 300 .

[0100] In some embodiments, the bottom surface of the circuit board 300 may be provided with an MCU 360, which is located beside the gold finger 310. For example, the MCU 360 is not located in the projection area of ​​the first driver 320 and the second driver 330 on the bottom surface of the circuit board 300.

[0101] Figure 6A Schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 6A FIG. 4 shows a structure of a light emitting component 400. The structures of the first light emitting component 400a and the second light emitting component 400b can refer to the structure of the light emitting component 400. Figure 6A As shown, the optical emitting component 400 includes a first housing 410 and a first upper cover 420. The first upper cover 420 covers and connects to the first housing 410. One end of the first upper cover 420 is connected to the first optical transmission assembly 800a, and the other end of the first housing 410 is provided with an electrical connector 430. For example, the other end of the first housing 410 is provided with an opening, and the electrical connector 430 is embedded in the opening. In some embodiments, the first upper cover 420 is sealed to the first housing 410.

[0102] In some embodiments, the optical emitting component 400 also includes a connecting component 440, one end of the connecting component 440 is connected to the first optical transmission component 800a, and the other end of the connecting component 440 is connected to the first shell 410, and the optical signal output from the first shell 410 is transmitted to the first optical transmission component 800a after passing through the connecting component 440.

[0103] In some embodiments, the first optical transmission component 800a includes a first optical fiber adapter 810, a first optical fiber 820 and a second optical fiber adapter 830, one end of the first optical fiber 820 is connected to the first optical fiber adapter 810, the other end of the first optical fiber 820 is connected to the second optical fiber adapter 830, and the light input end of the second optical fiber adapter 830 is connected to the connection component 440.

[0104] Figure 6B is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 6C sectional view of a light emitting component according to some embodiments of the present disclosure. Figure 6B and Figure 6C As shown, a first through hole 411 is provided at one end of the first shell 410 . The first through hole 411 is connected to the inner cavity of the first shell 410 . The first through hole 411 is used to output an optical signal.

[0105] In some embodiments, a light window 412 is disposed in the first through hole 411. The light window 412 may be sealed and connected to the first through hole 411. For example, the light window 412 may be tilted in the first through hole 411. The tilt angle of the light window 412 is 6-10 degrees.

[0106] In some embodiments, the connecting assembly 440 includes a lens holder 441 and a connecting sleeve 442. One end of the connecting sleeve 442 is connected to the second fiber optic adapter 830, and the other end of the connecting sleeve 442 is connected to one end of the lens holder 441. The other end of the lens holder 441 is connected to the first housing 410.

[0107] In some embodiments, a converging lens 443 is provided in the lens holder 441 , and the converging lens 443 is used to converge the optical signal output from the first shell 410 so that the optical signal is converged and transmitted to the second optical fiber adapter 830 to improve the coupling efficiency of the optical signal to the second optical fiber adapter 830 .

[0108] In some embodiments, a second through hole 4411 is formed in the lens holder 441, the second through hole 4411 communicating with the first through hole 411, and the converging lens 443 is embedded in the second through hole 4411. Exemplarily, the central axis of the second through hole 4411 is parallel to the central axis of the first through hole 411, and the optical axis of the converging lens 443 is parallel to the central axis of the second through hole 4411.

[0109] In some embodiments, a third through hole 4421 is formed in the connecting sleeve 442 , and the third through hole 4421 is connected to the second through hole 4411 . Exemplarily, the optical axis of the third through hole 4421 is parallel to the central axis of the second through hole 4411 .

[0110] In some embodiments, the light input end of the second fiber optic adapter 830 is embedded in the third through hole 4421. An isolator 840 is disposed in the second fiber optic adapter 830. The isolator 840 is located on the output light path of the converging lens 443. The isolator 840 is used to prevent the reflected light signal from being transmitted back in the direction of the converging lens 443.

[0111] In some embodiments, a laser assembly 450 is disposed within the first housing 410 . The laser assembly 450 is configured to generate an optical signal. For example, the laser assembly 450 may include one or more laser chips, each of which may generate multiple optical signals. For example, the laser assembly 450 may include four laser chips, enabling the laser assembly 450 to generate four optical signals.

[0112] In some embodiments, a thermoelectric cooler (TEC) 460 may be disposed within the first housing 410. The bottom of the TEC 460 is connected to the bottom plate of the first housing 410, and the top of the TEC 460 is supported and connected to the laser assembly 450. For example, a first base 461 is disposed on the top of the TEC 460, and the laser assembly 450 is disposed on the first base 461.

[0113] In some embodiments, a collimating lens assembly 470 may be disposed within the first housing 410. The collimating lens assembly 470 is located in the output optical path of the laser assembly 450 and is used to collimate the optical signal generated by the laser assembly 450. For example, the collimating lens assembly 470 may include one or more collimating lenses. For example, the collimating lens assembly 470 may include four collimating lenses, which are correspondingly disposed in the output optical paths of the four laser chips. The collimating lens assembly 470 may be disposed on the first base 461.

[0114] In some embodiments, a wavelength division multiplexing (WDM) assembly 480 may be disposed within first housing 410 and positioned in the optical path of the output of laser assembly 450. WDM assembly 480 is configured to wavelength-division multiplex the multiple optical signals generated by laser assembly 450 into a single optical signal. The optical signal output by WDM assembly 480 is transmitted to first through-hole 411.

[0115] In some embodiments, a second base 481 may be disposed within the first housing 410. The top of the second base 481 supports and connects to the wavelength division multiplexing assembly 480. The bottom of the second base 481 may be fixedly connected to the bottom plate of the first housing 410. When coupling and assembling the wavelength division multiplexing assembly 480, the wavelength division multiplexing assembly 480 can be first assembled onto the second base 481, allowing the second base 481 to support and drive the wavelength division multiplexing assembly 480. Once the wavelength division multiplexing assembly 480 is positioned correctly, the second base 481 is fixedly connected to the first housing 410.

[0116] Figure 6D A partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure Figure 1 , Figure 6E A partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure Figure 2 .like Figure 6C-6E As shown, in some embodiments, an opening 413 is defined in the sidewall at the other end of the first housing 410. This opening 413 extends to the bottom plate of the first housing 410, allowing the bottom plate of the first housing 410 to securely support the bottom of the electrical connector 430. The top of the opening 413 is connected to the top of the electrical connector 430. One end of the electrical connector 430 is located within the first housing 410, while the other end is located outside the first housing 410. One end of the electrical connector 430 is used to electrically connect to the laser assembly 450, etc., while the other end of the electrical connector 430 is used to electrically connect to the flexible printed circuit board. The use of the electrical connector 430 in the optical emitting component 400 facilitates ensuring the airtight packaging of the optical emitting component 400, making it suitable for use in the industrial temperature range of -40 to 85°C.

[0117] In some embodiments, a backlight detection assembly 490 may be disposed within the first housing 410. The backlight detection assembly 490 is located on the backlight side of the laser assembly 450 and is configured to receive backlight from the laser assembly 450 to detect the intensity of the optical signal generated by the laser assembly 450. The backlight detection assembly 490 may be disposed on the electrical connector 430 for attachment thereto; alternatively, the backlight detection assembly 490 may be connected to the first housing 410 for attachment thereto.

[0118] In some embodiments, a first connection surface 431 is formed at one end of the electrical connector 430, and a plurality of pads are formed on the first connection surface 431. The laser assembly 450 can be wire bonded to the pads on the first connection surface 431. The first connection surface 431 can also fix and support the backlight detection assembly 490.

[0119] In some embodiments, the backlight detection assembly 490 includes a backlight substrate 491 and a backlight detector 492. The backlight detector 492 is disposed on the backlight substrate 491, which is connected to the first connection surface 431. The backlight detector 492 is disposed on the backlight side of the laser in the laser assembly 450 to receive the backlight of the corresponding laser.

[0120] In some embodiments, the backlight detection assembly 490 may include multiple backlight substrates 491, each of which is provided with multiple backlight detectors 492. For example, the backlight detection assembly 490 includes a first backlight substrate 491a and a second backlight substrate 491b, with two backlight detectors 492 provided on the first backlight substrate 491a and two backlight detectors 492 provided on the second backlight substrate 491b. This facilitates the overall assembly of the backlight detection assembly 490 and ensures the coupling efficiency of the backlight detection assembly 490 to the laser backlight in the laser assembly 450.

[0121] In some embodiments, a second connection surface 432 may be formed at one end of the electrical connector 430. The second connection surface 432 is located above the side of the first connection surface 431 and has a plurality of pads formed on the second connection surface 432. The backlight detection assembly 490 is wire-bonded to the pads on the second connection surface 432.

[0122] In some embodiments, a third connection surface 433 may be formed at the other end of the electrical connector 430, with a plurality of solder pads formed on the third connection surface 433. The third connection surface 433 is soldered to the first flexible printed circuit board 301. For example, the third connection surface 433 and the first connection surface 431 may be located on the same layer of the electrical connector 430, so that the electrical connection between the solder pads on the third connection surface 433 and the solder pads on the first connection surface 431 does not pass through vias, thereby reducing the loss of high-frequency signals caused by the vias.

[0123] Figure 6FFIG. 1 is a schematic diagram of the structure of an electrical connector according to some embodiments of the present disclosure. Figure 6F As shown, in some embodiments, a fourth connection surface 434 may be formed at the other end of the electrical connector 430, and the fourth connection surface 434 is located below the third connection surface 433. A plurality of pads are formed on the fourth connection surface 434, and the fourth connection surface 434 is connected to the second flexible circuit board 302. Exemplarily, the pads on the fourth connection surface 434 are electrically connected to the pads on the second connection surface 432 through vias.

[0124] Figure 6G This is a partially enlarged view of an electrical connector provided according to some embodiments of the present disclosure. Figure 6G The internal structure of an electrical connector is shown. Figure 6G As shown, in some embodiments, a first routing surface 435 is formed inside the electrical connector 430. The first routing surface 435 extends from the first connection surface 431 to the third connection surface 433 to connect the first connection surface 431 and the third connection surface 433. Circuit traces are formed on the first routing surface 435, and the circuit traces are used to connect the pads on the first connection surface 431 and the pads on the third connection surface 433.

[0125] In some embodiments, a first high-frequency trace group 4351 and a second high-frequency trace group 4352 are formed on the first trace surface 435. One end of the first high-frequency trace group 4351 is connected to the high-frequency pad on the first trace surface 435, and the other end of the first high-frequency trace group 4351 is connected to the high-frequency pad on the third connection surface 433. One end of the second high-frequency trace group 4352 is connected to the high-frequency pad on the first trace surface 435, and the other end of the second high-frequency trace group 4352 is connected to the high-frequency pad on the third connection surface 433.

[0126] In some embodiments, a via 436 is formed in the electrical connector 430, and the via 436 passes through the first routing surface 435. For example, a via 436 is provided on the side of the first high-frequency routing group 4351, a via 436 is provided on the side of the second high-frequency routing group 4352, and a via 436 is provided between the first high-frequency routing group 4351 and the second high-frequency routing group 4352.

[0127] Figure 6H is a cross-sectional schematic diagram of an electrical connector provided according to some embodiments of the present disclosure. Figure 6H FIG. 1 shows a circuit routing from the second connection surface to the fourth connection surface. Figure 6HAs shown, the interior of electrical connector 430 is formed with a second routing surface 437 and a third routing surface 438. The second routing surface 437 is located in the direction of extension of the second connection surface 432, and the third routing surface 438 is located in the direction of extension of the fourth connection surface 434. Circuit traces are formed on the second routing surface 437 and the third routing surface 438, respectively. The top of via 436 extends to the second routing surface 437, so that the top of via 436 is connected to the circuit board trace on the second routing surface 437; the bottom of via 436 extends to the third routing surface 438, so that the bottom of via 436 is connected to the circuit board trace on the third routing surface 438, thereby achieving electrical connection between the pads on the second connection surface 432 and the pads on the fourth connection surface 434.

[0128] Figure 7 FIG. 1 is a diagram showing a state of use of a TEC according to some embodiments of the present disclosure. Figure 7 As described above, a first solder pad 462 and a second solder pad 463 are formed on the first base 461. The first solder pad 462 and the second solder pad 463 are located on the side of the laser assembly 450. A thermistor 464 is mounted on the first solder pad 462 and is wired to the second solder pad 463. The first solder pad 462 and the second solder pad 463 are respectively wired to the electrical connector 430, for example, the first solder pad 462 and the second solder pad 463 are respectively wired to the solder pads on the first connection surface 431.

[0129] In some embodiments, the TEC 460 includes a first electrode 4601 and a second electrode 4602 , which are located on one side of the first base 461 . The first electrode 4601 and the second electrode 4602 are respectively connected to pads on the first connection surface 431 by wire bonding.

[0130] In some embodiments, first solder pad 462 and second solder pad 463 are located at the edge of the top of the other side of first base 461 to provide ample space for the laser in laser assembly 450. Of course, in the embodiment of the present disclosure, first solder pad 462 and second solder pad 463 may be located between two adjacent lasers in laser assembly 450.

[0131] Figure 8 FIG. 1 is a schematic structural diagram of another light emitting component provided according to some embodiments of the present disclosure. Figure 8As shown, in some embodiments, the first flexible circuit board 301 is provided with a first extension plate 3011, which is used to extend the first flexible circuit board 301; the second flexible circuit board 302 is provided with a second extension plate 3021, which is used to extend the second flexible circuit board 302. The first extension plate 3011 and the second extension plate 3021 are used to facilitate the connection of the light emitting component 400 with the testing equipment, etc. After the light emitting component 400 is tested, the first extension plate 3011 and the second extension plate 3021 are cut away.

[0132] Figure 9A is a structural schematic diagram of a light receiving component provided according to some embodiments of the present disclosure, Figure 9B is an exploded schematic diagram of a light receiving component provided according to some embodiments of the present disclosure, Figure 9A and Figure 9B FIG. 5 shows a structure of a light receiving component 500. The structures of the first light receiving component 500a and the second light receiving component 500b can refer to the structure of the light receiving component 500. Figure 9A and Figure 9B As shown, the optical receiving component 500 includes a second housing 510 and a second upper cover 520, which covers and connects the second housing 510. The cavity formed by the second housing 510 and the second upper cover 520 is used to accommodate components such as lenses and optical receiving components for transmitting and receiving optical signals.

[0133] In some embodiments, the second optical transmission component 800b includes a third optical fiber adapter 850, a second optical fiber 860 and a fourth optical fiber adapter 870, one end of the second optical fiber 860 is connected to the third optical fiber adapter 850, the other end of the second optical fiber 860 is connected to one end of the fourth optical fiber adapter 870, and the other end of the fourth optical fiber adapter 870 is connected to the second shell 510.

[0134] In some embodiments, one end of the third flexible circuit board 303 extends into the second housing 510. Of course, in the embodiment of the present disclosure, an electrical connector may be provided on the second housing 510, and the third flexible circuit board 303 is soldered to the electrical connector.

[0135] Figure 9C Schematic diagram of the structure of a second shell provided according to some embodiments of the present disclosure. Figure 9D This is a diagram of a second housing in use according to some embodiments of the present disclosure. Figure 9E sectional view of a light receiving component according to some embodiments of the present disclosure. Figure 9C-9E As shown, a fourth through hole 511 is formed at one end of the second housing 510 , and the fourth through hole 511 communicates with the inner cavity of the second housing 510 . The other end of the fourth optical fiber adapter 870 is embedded in and connected to the fourth through hole 511 .

[0136] In some embodiments, the light-emitting end face of the fourth fiber optic adapter 870 extends into the second housing 510. Exemplarily, the light-emitting end face of the fourth fiber optic adapter 870 is inclined, meaning that the light-emitting end face is not perpendicular to the optical axis of the fourth fiber optic adapter 870. This inclined light-emitting end face effectively prevents optical signals incident from the light-emitting end face from being transmitted along the optical axis of the fourth fiber optic adapter 870, thereby reducing crosstalk between the incident light signals and the optical signals input through the second optical transmission assembly 800b. Exemplarily, the tilt angle of the light-emitting end face is 4-10°, such as 4-7°.

[0137] In some embodiments, a notch 512 is formed at the other end of the second housing 510. The notch 512 extends from the top of the second housing 510 to the bottom of the second housing 510. One end of the third flexible circuit board 303 is inserted into the notch 512, which facilitates placement of one end of the third flexible circuit board 303 within the second housing 510.

[0138] In some embodiments, a first stepped surface 513 may be formed on the bottom plate of the second housing 510. The first stepped surface 513 supports the bottom surface of one end of the third flexible circuit board 303. For example, a reinforcing sheet 3031 is provided on the bottom surface of one end of the third flexible circuit board 303. The top surface of the reinforcing sheet 3031 is connected to the bottom surface of the third flexible circuit board 303, and the bottom surface of the reinforcing sheet 3031 is connected to the first stepped surface 513. The reinforcing sheet 3031 is used to reinforce the third flexible circuit board 303, thereby increasing its strength and facilitating its securement. The reinforcing sheet 3031 may be made of steel, for example.

[0139] In some embodiments, a first limiting platform 518 and a second limiting platform 519 may be formed on the first stepped surface 513, and the first limiting platform 518 and the second limiting platform 519 are connected to the third flexible circuit board 303. For example, the first limiting platform 518 is located at an edge of one side of the first stepped surface 513, and the second limiting platform 519 is located at an edge of the other side of the first stepped surface 513. The first limiting platform 518 and the second limiting platform 519 are connected to the side wall of the second housing 510.

[0140] In some embodiments, a second stepped surface 515 may be formed on the bottom plate of the second housing 510, and the second stepped surface 515 supports and connects to the light receiving assembly 530. The light receiving assembly 530 is used to receive light signals and convert them into photocurrent. Exemplarily, the light receiving assembly 530 may include one or more photodetectors, and the multiple photodetectors can receive multiple light signals. The light receiving assembly 530 may include four photodetectors, so that the light receiving assembly 530 can receive four light signals.

[0141] In some embodiments, the second stepped surface 515 is positioned lower than the first stepped surface 513, forming a recess on the second stepped surface 515. A third base 540 is disposed on the second stepped surface 515. The bottom of the third base 540 is connected to the first stepped surface 513, and the top of the third base 540 supports and connects to the light receiving assembly 530. The third base 540 can be made of materials such as ceramic or tungsten copper.

[0142] In some embodiments, a transimpedance amplifier 550 is further disposed on top of the third base 540. The transimpedance amplifier 550 is located between the optical receiving assembly 530 and the end of the third flexible printed circuit board 303. The optical receiving assembly 530 is wired to the transimpedance amplifier 550, which is in turn wired to the third flexible printed circuit board 303. The edge of the third flexible printed circuit board 303 can be located to the side of the transimpedance amplifier 550, facilitating control of the length between the transimpedance amplifier 550 and the third flexible printed circuit board 303 for transmitting high-frequency signals.

[0143] In some embodiments, a copper clad layer is formed on the top surface of the third base 540, and the transimpedance amplifier 550 is mounted on the surface of the third base 540. The ground pad on the transimpedance amplifier 550 can be connected to the copper clad on the surface of the third base 540 by bonding, and the copper clad on the surface of the third base 540 is connected to the ground on the third flexible circuit board 303 by bonding.

[0144] In some embodiments, a matching resistor or a matching capacitor may be provided on the third base 540 , and the matching resistor or the matching capacitor may be wired to connect to the transimpedance amplifier 550 .

[0145] In some embodiments, a third stepped surface 516 may be formed on the bottom plate of the second housing 510, and a wavelength division multiplexing (WDM) assembly 560 is disposed on the third stepped surface 516. The light input port of the WDM assembly 560 is located on the side of the fourth through hole 511. The WDM assembly 560 receives the optical signal output by the fourth optical fiber adapter 870, splits a single optical signal comprising multiple wavelengths into multiple beams, and transmits the signals toward the optical receiving assembly 530. For example, the optical signal output by the fourth optical fiber adapter 870 comprises four wavelengths, and the WDM assembly 560 may split the single optical signal into four beams for output, each beam comprising one wavelength.

[0146] In some embodiments, the optical receiving component 500 may include an optical deflection assembly 570, which is located on the output optical path from the WDM component 560 to the optical receiving component 530. The optical axis of the optical signal output by the WDM component 560 is parallel to the third step surface 516, while the receiving optical axis of the photodetector in the optical receiving component 530 is perpendicular to the third step surface 516. The optical deflection assembly 570 can change the propagation direction of the optical signal output by the WDM component 560 to facilitate the photodetector in the optical receiving component 530 to receive the optical signal.

[0147] In some embodiments, the optical deflection assembly 570 includes a deflection prism 571 and a converging lens array 572. The converging lens array 572 is located in the output optical path of the wavelength division multiplexing assembly 560. The light-incident side of the deflection prism 571 is connected to the deflection prism 571, and the reflecting surface of the deflection prism 571 is located above the optical receiving assembly 530. The optical signal output by the wavelength division multiplexing assembly 560 is transmitted to the converging lens array 572, converged by the converging lens array 572, and transmitted to the deflection prism 571. Then, it is reflected by the reflecting surface of the deflection prism 571 and transmitted to the optical receiving assembly 530.

[0148] In some embodiments, a fourth stepped surface 517 may be formed on the bottom plate of the second housing 510. The fourth stepped surface 517 is located between the third stepped surface 516 and the second stepped surface 515, and the fourth stepped surface 517 is located higher than the second stepped surface 515. The fourth stepped surface 517 supports and connects the bottom of the converging lens array 572, and the converging lens array 572 is located at the edge of the fourth stepped surface 517, so that the turning prism 571 is suspended above the light receiving assembly 530.

[0149] In some embodiments, a collimating lens 580 may be disposed on the third step surface 516 and located between the WDM component 560 and the fourth through hole 511. The collimating lens 580 collimates the optical signal output by the fourth optical fiber adapter 870 to ensure coupling efficiency of the optical signal to the WDM component 560.

[0150] Figure 9F Schematic diagram of the structure of a second upper cover provided according to some embodiments of the present disclosure. Figure 9E and Figure 9F As shown, the second upper cover 520 may include a cover body 521 and a side panel 522. The side panel 522 is located at the end of the cover body 521, and the top of the side panel 522 is connected to the cover body 521. The bottom of the cover body 521 is connected to the top of the second housing 510, and the side panel 522 is located within the notch 512. The bottom of the side panel 522 can be connected to the third flexible circuit board 303. The second upper cover 520, combined with the second housing 510 in the above embodiment, can effectively reduce the thickness of the light receiving component 500, for example, reducing the thickness of the light receiving component 500 from 5.5 mm to 2.9 mm, making it easier for the light receiving component 500 and the light emitting component 400 to be stacked on top of each other within the housing.

[0151] In some embodiments, the second upper cover 520 may include a pressing plate 523 connected to the bottom of the side plate 522. For example, the ends of the pressing plate 523 are connected to the side plate 522, and the bottom surface of the pressing plate 523 contacts the top surface of the third flexible circuit board 303 to strengthen the fixation of the third flexible circuit board 303.

[0152] In some embodiments, a relief portion 5211 is formed on the cover body 521. The relief portion 5211 is formed by partially recessing the cover body 521 toward the bottom surface of the cover body 521. The relief portion 5211 is used to avoid the connecting assembly 440 so that the light emitting component 400 and the light receiving component 500 can be stacked on top of each other.

[0153] Figure 10A Schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. Figure 10B This is a partial schematic diagram of another optical module provided according to some embodiments of the present disclosure. In some embodiments, the first light receiving component 500a is stacked relative to the first light emitting component 400a, and the second light receiving component 500b is stacked relative to the second light emitting component 400b, with the bottom plates of the first housings of the first light emitting component 400a and the second light emitting component 400b facing the cover plate 2011, and the bottom plates of the second housings of the second light receiving component 500b and the second light receiving component 500b facing the bottom plate 2021. Exemplarily, the second upper cover 520a of the first light receiving component 500a supports and connects to the first upper cover 420a of the first light emitting component 400a. In this way, it is convenient to transfer the heat on the first light emitting component 400a and the second light emitting component 400b to the upper shell 201, and it is convenient to transfer the heat on the first light receiving component 500a and the second light receiving component 500b to the lower shell 202, thereby reducing the thermal crosstalk between the first light receiving component 500a and the first light emitting component 400a, and reducing the crosstalk between the second light receiving component 500b and the second light receiving component 500b.

[0154] Figure 10C Schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure. Figure 10C As shown, a first pad group 304 and a second pad group 305 may be provided on the circuit board 300. The first pad group 304 is located on one side of the first driver 320 and between the first light emitting component 400a and the first driver 320. The second pad group 305 is located on the other side of the first driver 320 and is close to the gold finger 310.

[0155] In some embodiments, the first flexible circuit board 301a is electrically connected to the first pad group 304, and the second flexible circuit board 302a is electrically connected to the second pad group 305. This helps reduce the transmission distance of the high-frequency signal output by the first driver 320 to the first light emitting component 400a, thereby ensuring the transmission quality of the high-frequency signal.

[0156] In some embodiments, a third pad group 306 and a fourth pad group 307 may be provided on the circuit board 300. The third pad group 306 is located on one side of the second driver 330 and between the second light emitting component 400b and the second driver 330. The fourth pad group 307 is located on the other side of the second driver 330 and is close to the gold finger 310.

[0157] In some embodiments, the first flexible circuit board 301b is electrically connected to the third pad group 306, and the second flexible circuit board 302b is electrically connected to the fourth pad group 307. This helps to reduce the transmission distance of the high-frequency signal output by the second driver 330 to the second light emitting component 400b, thereby ensuring the transmission quality of the high-frequency signal.

[0158] In some embodiments, a gap is provided between the first driver 320 and the second driver 330, and the middle portion of the second flexible circuit board 302a passes through the gap. Of course, in the embodiment of the present disclosure, the middle portion of the second flexible circuit board 302a may also pass through the gap between the first driver 320 and the lower side plate 2022.

[0159] In some embodiments, there is a gap between the second driver 330 and the lower plate 2022, and the second flexible circuit board 302b passes through the gap. Of course, in the embodiment of the present disclosure, the middle portion of the second flexible circuit board 302b can also pass through the gap between the first driver 320 and the second driver 330.

[0160] Figure 10D FIG. 1 is a schematic structural diagram of a second flexible circuit board provided according to some embodiments of the present disclosure. Figure 10D As shown, the second flexible circuit board 302 may include a first connection portion 3022 having a plurality of pads formed thereon for soldering and connecting the electrical connector 430. For example, the center axis of the first connection portion 3022 extends along the length direction of the circuit board 300.

[0161] In some embodiments, the second flexible circuit board 302 may include a second connection portion 3026 , on which a plurality of solder pads are formed, so as to be connected to the second solder pad group 305 or the fourth solder pad group 307 by soldering.

[0162] In some embodiments, the central axis of the second connecting portion 3026 extends along the width direction of the circuit board 300. This facilitates the use of space on the circuit board 300.

[0163] In some embodiments, the second flexible circuit board 302 may include a first transition portion 3023 having a relatively large width at one end and a relatively small width at the other end. One end of the first transition portion 3023 is connected to the first connecting portion 3022, and the first transition portion 3023 is configured to gradually reduce the width of the second flexible circuit board 302. For example, the central axis of the first transition portion 3023 extends along the length of the circuit board 300.

[0164] In some embodiments, the second flexible circuit board 302 may include a first extension portion 3025. One end of the first extension portion 3025 is connected to the first transition portion 3023, and the other end of the first extension portion 3025 is connected to a side of the second connection portion 3026. The first extension portion 3025 is used to connect the first transition portion 3023 to the second connection portion 3026. Exemplarily, the central axis of the first extension portion 3025 extends along the length of the circuit board 300.

[0165] In some embodiments, the first extension portion 3025 has a relatively long length to facilitate placement of the second flexible circuit board 302 within the cavity; for example, the first extension portion 3025 can extend from one side of the first driver 320 to the other side of the first driver 320. For example, the first extension portion 3025 can extend through the gap between the first driver 320 and the second driver 330, or through the gap between the second driver 330 and the lower plate 2022.

[0166] In some embodiments, the second flexible circuit board 302 may include a second transition portion 3024. One end of the second transition portion 3024 is connected to one end of the first transition portion 3023, and the other end of the second transition portion 3024 is connected to one end of the first extension portion 3025. The central axis of the second transition portion 3024 is angled with the length of the circuit board 300, so that the second transition portion 3024 is tilted relative to the length of the circuit board 300, facilitating the extension of the second flexible circuit board 302 toward the gap between the first driver 320 and the second driver 330.

[0167] Figure 11A A schematic diagram of the structure of a first fiber coil support provided according to some embodiments of the present disclosure Figure 1 , Figure 11B A schematic diagram of the structure of a first fiber coil support provided according to some embodiments of the present disclosure Figure 2 , Figure 11C FIG1 is a schematic diagram of an assembly of a first fiber coil support and a circuit board according to some embodiments of the present disclosure. Figures 11A-11CAs shown, the first fiber tray support 700a includes a fiber tray body 710, a first baffle 720, and a second baffle 730. The side edges of the first baffle 720 are connected to the bottom of the fiber tray body 710 via a first connecting plate 740, forming a first coiling cavity 741 between the side edges of the first baffle 720 and the side edges of the fiber tray body 710. The first connecting plate 740 supports the first optical fiber, etc., and the first baffle 720 and the fiber tray body 710 block the first optical fiber, etc., thereby confining the first optical fiber, etc., within the first coiling cavity 741. The side edges of the second baffle 730 are connected to the bottom of the fiber tray body 710 via a second connecting plate 750, forming a second coiling cavity 751 between the side edges of the second baffle 730 and the side edges of the fiber tray body 710. The second connecting plate 750 supports the first optical fiber, etc., and the second baffle 730 and the fiber tray body 710 block the first optical fiber, etc., thereby confining the first optical fiber, etc., within the second coiling cavity 751.

[0168] The fiber coil body 710 is located above the circuit board 300 and has a predetermined distance from the top surface of the circuit board 300 to prevent interference with components on the top surface of the circuit board 300. The first connecting plate 740 and the second connecting plate 750 are located above the sides of the circuit board 300, respectively, to minimize their impact on the layout of the top surface of the circuit board 300.

[0169] In some embodiments, the fiber tray body 710 may include a fiber tray side plate 711, the bottom of which is connected to the first connecting plate 740 and the second connecting plate 750. The fiber tray side plate 711 can guide the bending of the first and second optical fibers. Exemplarily, the fiber tray side plate 711 is a curved plate to facilitate controlling the curvature of the first and second optical fibers, effectively reducing excessive bending of the first and second optical fibers.

[0170] In some embodiments, the fiber tray body 710 may include a reinforcement plate 712 located inside the fiber tray side plate 711 to increase the strength of the fiber tray body 710. The side edges of the reinforcement plate 712 connect to the top of the inside of the fiber tray side plate 711. The thickness of the reinforcement plate 712 is less than the height of the fiber tray side plate 711, thereby reducing the overall weight of the fiber tray body 710.

[0171] In some embodiments, the first baffle 720 may extend along the length of the circuit board 300 , with one end of the first baffle 720 away from the gold finger 310 and the other end of the first baffle 720 close to the gold finger. The side edge of the other end of the first baffle 720 may be connected to the first connecting plate 740 .

[0172] In some embodiments, a first limiting plate 721 may be formed on the inner side of one end of the first baffle 720, and the first limiting plate 721 may be suspended above the circuit board 300. The first limiting plate 721 is used to assist in limiting the position of the first optical fiber, etc., and to help prevent the first optical fiber, etc. from escaping from the first fiber coiling support 700a.

[0173] In some embodiments, a first support column 722 may be formed below one end of the first baffle 720 , and the bottom of the first support column 722 is connected to the top surface of the circuit board 300 , so that the circuit board 300 is supported and connected to the first fiber tray bracket 700 a through the first support column 722 .

[0174] In some embodiments, a second support column 723 may be formed below the other end of the first baffle 720 , and the bottom of the second support column 723 is connected to the top surface of the circuit board 300 , so that the circuit board 300 is supported and connected to the first fiber coil bracket 700a through the second support column 723 .

[0175] In some embodiments, a first hook 724 may be formed below the first baffle 720, and the first hook 724 engages with a side edge of the circuit board 300. For example, a first fixing opening 3001 is formed on the side edge of the circuit board 300, and the first hook 724 engages within the first fixing opening 3001. The first hook 724 may be located between the first support column 722 and the second support column 723.

[0176] In some embodiments, the second baffle 730 may extend along the length of the circuit board 300 , with one end of the second baffle 730 away from the gold finger 310 and the other end of the second baffle 730 close to the gold finger. The side edge of the other end of the second baffle 730 may be connected to the second connecting plate 750 .

[0177] In some embodiments, a second limiting plate 731 is formed on the inner side of one end of the second baffle 730. The second limiting plate 731 can be suspended above the circuit board 300. For example, the second limiting plate 731 can be positioned opposite the first limiting plate 721. The second limiting plate 731 is used to assist in limiting the position of the first optical fiber, etc., and to help prevent the first optical fiber, etc. from escaping from the first fiber coiling support 700a.

[0178] In some embodiments, a third support column 732 may be formed below one end of the second baffle 730 , and the bottom of the third support column 732 is connected to the top surface of the circuit board 300 , so that the circuit board 300 is supported and connected to the first fiber tray bracket 700 a through the third support column 732 .

[0179] In some embodiments, a fourth support column 733 may be formed below the other end of the second baffle 730 , and the bottom of the fourth support column 733 is connected to the top surface of the circuit board 300 , so that the circuit board 300 is supported and connected to the first fiber coil bracket 700a through the fourth support column 733 .

[0180] In some embodiments, a second hook 734 may be formed below the second baffle 730, and the second hook 734 engages with the side of the circuit board 300. For example, a second fixing opening 3002 is formed on the side of the circuit board 300, and the second hook 734 engages with the second fixing opening 3002. The second hook 734 may be located between the third support column 732 and the fourth support column 733.

[0181] In some embodiments, the first fiber tray support 700a may include a fiber bundle 713 located on a side of the fiber tray side plate 711 and connected to the top of the fiber tray side plate 711. The fiber bundle 713 is used to bundle the first optical fiber, etc., on the side of the fiber tray side plate 711.

[0182] In some embodiments, the first fiber coil support 700a may include a plurality of fiber bundles 713 disposed on the side of the fiber coil side plate 711 and located between the other end of the first baffle 720 and the other end of the second baffle 730. For example, two fiber bundles 713 are disposed on the side of the fiber coil side plate 711.

[0183] In some embodiments, the first support column 722, the second support column 723, and the first hook 724 are connected to the edge of one side of the circuit board 300, and the third support column 732, the fourth support column 733, and the second hook 734 are connected to the edge of the other side of the circuit board 300. The first baffle 720 extends along the upper edge of one side of the circuit board 300, and the second baffle 730 extends along the upper edge of the other side of the circuit board 300. The first baffle 720 is positioned close to and extends along the lower side plate of one side of the lower housing 202, and the second baffle 730 is positioned close to and extends along the lower side plate of the other side of the lower housing 202, thereby reducing the impact of the first fiber coil bracket 700a installed in the housing on the internal space utilization.

[0184] Figure 12A A schematic diagram of the structure of a second fiber coil support provided according to some embodiments of the present disclosure Figure 1 , Figure 12B A schematic diagram of the structure of a second fiber coil support provided according to some embodiments of the present disclosure Figure 2 .like Figure 12A and Figure 12B As shown, the second fiber tray support 700b may include a third connecting plate 760, a fourth connecting plate 770, and a bridge plate 780. One end of the bridge plate 780 is connected to the third connecting plate 760, and the other end of the bridge plate 780 is connected to the fourth connecting plate 770. The third connecting plate 760 and the fourth connecting plate 770 are used to limit the first optical fiber, the second optical fiber, etc.

[0185] In some embodiments, a third limiting plate 761 is formed at the top of one end of the third connecting plate 760 and extends toward the fourth connecting plate 770. The third limiting plate 761 is used to limit the height of the first optical fiber, etc., along the optical module. Exemplarily, the extension direction of the third limiting plate 761 is perpendicular or approximately perpendicular to the length of the optical module. The other end of the third connecting plate 760 is connected to one end of the bridging plate 780.

[0186] In some embodiments, a fourth limiting plate 771 is formed at the top of one end of the fourth connecting plate 770 and extends toward the third connecting plate 760. The fourth limiting plate 771 is used to limit the height of the first optical fiber, etc., in the optical module. Exemplarily, the fourth limiting plate 771 extends perpendicular or approximately perpendicular to the length of the optical module. The other end of the fourth limiting plate 771 is connected to one end of the bridging plate 780.

[0187] In some embodiments, the bridging plate 780 includes a bridging body 781, a first bridging portion 782, and a second bridging portion 783. One end of the first bridging portion 782 is connected to the other end of the third connecting plate 760, and the other end of the first bridging portion 782 is connected to one end of the bridging body 781. One end of the second bridging portion 783 is connected to the other end of the fourth connecting plate 770, and the other end of the second bridging portion 783 is connected to the other end of the bridging body 781.

[0188] In some embodiments, one end of the first bridge portion 782 is connected to the top of the inner side of the other end of the third connecting plate 760, so that the outer side of the first bridge portion 782 and the outer side of the other end of the third connecting plate 760 have space for the first optical fiber etc. to pass through.

[0189] In some embodiments, one end of the second bridge portion 783 is connected to the top of the inner side of the other end of the fourth connecting plate 770 , and the outer side of the second bridge portion 783 and the outer side of the other end of the second bridge portion 783 have space for the first optical fiber etc. to pass through.

[0190] In some embodiments, the bridging body 781 is formed with a first avoidance hole 7811 and a second avoidance hole 7812. The first avoidance hole 7811 is used to avoid the first light emitting component 400a, and the second avoidance hole 7812 is used to avoid the second light emitting component 400b. The connecting bracket of the first light emitting component 400a spans within the first avoidance hole 7811, and the connecting bracket of the second light emitting component 400b spans the second avoidance hole 7812. The side edges of the bridging body 781 can limit the first and second light emitting components 400a, 400b.

[0191] In some embodiments, the second fiber coil support 700b may include a fixing plate 790 connected to the bridging plate 780. The fixing plate 790 is used to connect the second fiber coil support 700b to the lower housing 202. For example, one end of the fixing plate 790 is formed with a fixing hole 791 for connection to the lower housing 202 through the fixing hole 791; the other end of the fixing plate 790 is connected to the bridging body 781.

[0192] In some embodiments, the other end of the fixing plate 790 is connected to the lower portion of the bridging body 781 , and the connection between the fixing plate 790 and the bridging body 781 is located between the first avoidance hole 7811 and the second avoidance hole 7812 .

[0193] In some embodiments, a reinforcing plate 792 is formed at the other end of the fixing plate 790 , and the reinforcing plate 792 strengthens the connection between the fixing plate 790 and the bridging body 781 .

[0194] Figure 13 Schematic diagram of a partial structure of a lower shell provided according to some embodiments of the present disclosure. Figure 13 As shown, a first fixing seat 2023 may be formed on the bottom plate 2021, and the first fixing seat 2023 protrudes from the top surface of the bottom plate 2021. The first fixing seat 2023 is used to support and connect the fixing plate 790. In some embodiments, a fixing column 2024 is formed on the top of the first fixing seat 2023, and the fixing column 2024 is connected to the fixing hole 791.

[0195] In some embodiments, a second fixing seat 2025 may be formed on the bottom plate 2021, and the second fixing seat 2025 protrudes from the top surface of the bottom plate 2021. The sidewalls of the second fixing seat 2025 are used to limit the connection between the light emitting component 400 and the light receiving component 500.

[0196] In some embodiments, a positioning seat 2026 is formed on the inner wall of the lower side plate 2022 . The positioning seat 2026 is used to assist in positioning the light receiving component 500 so as to facilitate positioning when the light receiving component 500 is assembled.

[0197] Figure 14A The figure is a schematic diagram of assembling a second fiber coil support according to some embodiments of the present disclosure. Figure 14B This is a cross-sectional view of a second fiber coil support in use according to some embodiments of the present disclosure. Figure 14A and Figure 14B As shown, the fixing post 2024 is embedded in the fixing hole 791. The top of the first fixing seat 2023 supports one end of the fixing plate 790; the first light receiving component 500a and the like support the other end. When the upper housing 201 is closed and connected to the lower housing 202, the cover plate 2011 of the upper housing 201 presses against the top of the bridging body 781, securing the second fiber tray bracket 700b within the cavity.

[0198] In some embodiments, the outer side of the third connecting plate 760 is close to the lower side plate 2022 on one side of the upper shell 201, and the outer side of the first bridging portion 782 forms a gap with the lower side plate 2022. The first optical fiber passes through the gap to cooperate with the third limiting plate 761 to wind the first optical fiber.

[0199] In some embodiments, the outer side of the fourth connecting plate 770 is close to the lower side plate 2022 on the other side of the upper shell 201, and the outer side of the second bridging portion 783 forms a gap with the lower side plate 2022. The first optical fiber, etc. passes through the gap to cooperate with the fourth limiting plate 771 to wind the first optical fiber, etc.

[0200] In some embodiments, the second fixing base 2025 is located on the side of the first light emitting component 400a, the first light receiving component 500a, etc., and the sidewalls of the second fixing base 2025 abut the first light emitting component 400a, the first light receiving component 500a, etc. to limit the length of the optical module. The second fixing base 2025 cooperates with the second fiber coiling bracket 700b to fix the first light emitting component 400a, the first light receiving component 500a, etc. along the length of the optical module, thereby more firmly securing the first light emitting component 400a, the first light receiving component 500a, etc. within the cavity.

[0201] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: A circuit board is provided with a first driver on the top surface, a gold finger is provided on the surface of the end portion, a first pad group is provided on one side of the first driver, a second pad group is provided on the other side of the first driver, and the second pad group is close to the gold finger; The first driver is electrically connected to the first pad group; A first light emitting component is located at one end of the circuit board; a second light emitting component, located at one end of the circuit board and at a side of the first light emitting component; a first light receiving component, located below the first light emitting component and supporting and connecting the first light emitting component; a second light receiving component, located below the second light emitting component and supporting and connecting the second light emitting component; Wherein, the first light emitting component includes: A first shell having a first through hole formed at one end and an opening formed at the other end; a laser assembly, located in the first housing, for generating an optical signal; a first upper cover, covering and connecting the first shell; An electrical connector is embedded in the opening; one end of the electrical connector extends into the inner cavity of the first shell, and the other end of the electrical connector is located outside the first shell; a first connection surface and a second connection surface are formed at one end of the electrical connector, and the second connection surface is located above the first connection surface; a third connection surface and a fourth connection surface are formed at the other end of the electrical connector, and the third connection surface is located above the fourth connection surface; the first connection surface and the third connection surface are located on the same layer of the electrical connector; the first connection surface is located on the backlight side of the laser assembly, and the first connection surface is connected to the laser assembly by wire bonding; A backlight detection component is provided on the first connection surface, and the backlight detection component is connected to the second connection surface by wire bonding; a first flexible circuit board, one end of which is welded to the third connection surface, and the other end of which is welded to the first pad group; the laser assembly is electrically connected to the first driver via the first connection surface, the third connection surface, and the first flexible circuit board in sequence; A second flexible circuit board has one end welded to the fourth connection surface and the other end welded to the second pad group; the backlight detection component is electrically connected to the second pad group via the second connection surface, the fourth connection surface and the second flexible circuit board in sequence.

2. The optical module according to claim 1, wherein The light emitting component further comprises: A connecting assembly includes a lens holder and a connecting sleeve, wherein a second through hole is formed in the lens holder; one end of the lens holder is connected to the connecting sleeve, and the other end of the lens holder is connected to the first housing, and the second through hole is connected to the first through hole; a converging lens is disposed in the second through hole; The optical module further includes: A first transmission component includes a first optical fiber adapter, a first optical fiber, and a second optical fiber adapter connected in sequence, wherein the first optical fiber adapter is located at the optical port of the optical module, and the second optical fiber adapter is connected to the connecting sleeve; TEC, located on a side of the electrical connector; A first base is provided on the top of the TEC, and the first base supports and connects the laser assembly; a first soldering pad and a second soldering pad are formed on the side of the laser assembly; a thermistor is mounted on the first soldering pad, and the thermistor is connected to the second soldering pad by wires, and the first soldering pad and the second soldering pad are respectively connected to the electrical connector by wires.

3. The optical module according to claim 1, wherein: The first light receiving component includes: The second shell has a fourth through hole formed at one end and a notch formed at the other end; A second upper cover, comprising a cover body and side panels, wherein the top of the side panels are connected to the cover body; the second upper cover is connected to the second shell, the cover body is connected to the top of the second shell, and the side panels are located in the notch; the cover body supports and connects to the first upper cover; a light receiving assembly, located in a cavity formed by the second housing and the second upper cover; The optical module further includes: The second transmission component includes a third optical fiber adapter, a second optical fiber, and a fourth optical fiber adapter connected in sequence, wherein the third optical fiber adapter is located at the optical port of the optical module, and the fourth optical fiber adapter is embedded and connected to the fourth through hole; One end of the third flexible circuit board extends into the second shell and is fixedly connected to the second shell. The third flexible circuit board is electrically connected to the light receiving component.

4. The optical module according to claim 1, wherein: A first routing surface, a second routing surface, and a third routing surface are formed inside the electrical connector; the first routing surface extends from the first connection surface to the third connection surface, the second routing surface is coplanar with the second connection surface, and the third routing surface is coplanar with the fourth connection surface; A high-frequency routing group is formed on the first routing surface, one end of the high-frequency routing group is connected to the high-frequency pad on the first connection surface, and the other end of the high-frequency routing group is connected to the high-frequency pad on the third connection surface; A via is formed in the electrical connector, and the via passes through the side of the high-frequency routing group; circuit routing is formed on the second routing surface and the third routing surface respectively; the top of the via is connected to the circuit routing on the second routing surface, and the bottom of the via is connected to the circuit routing on the third routing surface, so as to electrically connect the pad on the second connection surface and the pad on the fourth connection surface through the via.

5. The optical module according to claim 1, wherein: A second driver is further provided on the top surface of the circuit board, and the second driver is located on the side of the first driver, with a gap between the first driver and the second driver; The second flexible circuit board includes a first connecting portion, a first transition portion, a second transition portion, a first extending portion, and a second connecting portion connected in sequence, and a side edge of an end portion of the first extending portion is connected to a side edge of the second connecting portion; A pad is formed on the first connection portion and is connected to the fourth connection surface by welding; and a pad is formed on the second connection portion and is connected to the second pad group by welding; The width of one end of the first transition portion is greater than the width of the other end of the first transition portion. The extension direction of the second transition portion is inclined relative to the extension direction of the first transition portion. The first extension portion passes through the gap.

6. The optical module according to claim 2, wherein: The first transmission component further includes an isolator, which is located at the light input end of the second optical fiber adapter; A third through hole is formed on the connecting sleeve, the third through hole is connected to the second through hole, and the light input end of the second optical fiber adapter is embedded in the third through hole; A light window is provided in the first through hole, the light window is sealed and connected to the first through hole, and the light window is not perpendicular to the central axis of the first through hole; The backlight detection assembly includes a backlight substrate and a plurality of backlight detectors; The backlight detector is arranged on the top surface of the backlight substrate, and the bottom surface of the backlight substrate is connected to the first connecting surface.

7. The optical module according to claim 3, wherein: The second upper cover further comprises a pressing plate, the end of the pressing plate is connected to the bottom of the side plate, and the bottom surface of the pressing plate is connected to the circuit board; A reinforcing sheet is provided at the bottom of one end of the third flexible circuit board, the top surface of the reinforcing sheet is connected to the bottom surface of the third flexible circuit board, and the bottom surface of the reinforcing sheet is connected to the bottom plate of the second shell; The first light receiving component further includes a third base, the bottom of the third base is connected to the bottom plate of the second housing, and the third base supports and connects the light receiving assembly; A copper clad layer is formed on the top surface of the third base, a transimpedance amplifier is mounted on the copper clad layer, and the transimpedance amplifier is located at the edge of the third flexible circuit board. The transimpedance amplifier is connected to the third base and the third flexible circuit board by wire bonding.

8. The optical module according to claim 2, wherein: The optical module further includes a first fiber tray support, the first fiber tray support being connected to the circuit board; wherein the first fiber tray support includes a fiber tray body, a first baffle and a second baffle; The side edge of the end portion of the first baffle is connected to the bottom of the fiber coil body through a first connecting plate, and the first baffle, the first connecting plate and the side edge of the fiber coil body form a first coiling cavity; The side of the second baffle end is connected to the bottom of the fiber coil body through a second connecting plate. The second baffle, the second connecting plate and the side of the fiber coil body form a second winding cavity; the first optical fiber passes through the first winding cavity and the second winding cavity.

9. The optical module according to claim 2, wherein: The first transmission component further includes an isolator, which is located at the light input end of the second optical fiber adapter; A third through hole is formed on the connecting sleeve, the third through hole is connected to the second through hole, and the light input end of the second optical fiber adapter is embedded in the third through hole; A light window is provided in the first through hole, the light window is sealed and connected to the first through hole, and the light window is not perpendicular to the central axis of the first through hole; The backlight detection assembly includes a backlight substrate and a plurality of backlight detectors; The backlight detector is arranged on the top surface of the backlight substrate, and the bottom surface of the backlight substrate is connected to the first connecting surface.

10. The optical module according to claim 8, wherein: The optical module also includes a second fiber tray bracket, which includes a third connecting plate, a fourth connecting plate, a bridging plate and a fixing plate; the bridging plate includes a bridging body, a first bridging portion and a second bridging portion; one end of the first bridging portion is connected to the top of the inner side of the third connecting plate, and the other end of the first bridging portion is connected to one end of the bridging body; one end of the second bridging portion is connected to the top of the inner side of the fourth connecting plate, and the other end of the second bridging portion is connected to the other end of the bridging body; the fixing plate is connected to the bridging body; A third limiting plate is formed on the top of one end of the third connecting plate, and a fourth limiting plate is formed on the fourth connecting plate. The third limiting plate, the first bridging portion, the fourth limiting plate, and the second bridging portion limit the first optical fiber; the side edge of the bridging plate abuts against the side edge of the first housing; A first fixing seat and a second fixing seat are formed on the lower housing of the optical module. The first fixing seat supports and connects to the fixing plate, and a side wall of the second fixing seat abuts against a side edge of the electrical connector.

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