Integrated direct-current temperature controller and temperature control system

Abstract

The invention relates to the technical field of temperature control, and particularly discloses an integrated direct-current temperature controller and a temperature control system.The integrated direct-current temperature controller integrates a temperature control module, a temperature acquisition module, an output module and an uplink interface module in an outer shell to form a whole. The temperature control module, the temperature acquisition module and the output module need wiring operation due to mutual independence of the temperature control module, the temperature acquisition module and the output module in the prior art, field wiring difficulty and maintenance difficulty are reduced, a field installation process is simplified, meanwhile, the three modules are directly integrated in one shell, independent use of one shell is avoided, the size is greatly reduced, and the cost is reduced. And adaptation to the environment with limited space is facilitated. In addition, through mutual cooperation of the temperature control module, the temperature acquisition module and the output module, output of the direct-current power supply is achieved, and power is supplied to equipment needing the direct-current power supply.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control, and in particular to an integrated direct current temperature controller and a temperature control system. Background Art

[0002] In industrial production, the temperature control system is mainly used to detect and adjust the temperature of a specific environment. It senses temperature changes through temperature sensors and transmits data to the control unit. The control unit compares the difference between the actual temperature and the target temperature according to the preset temperature range, and controls the power on and off of the heating element through the execution unit to keep the temperature of the specific environment within the set temperature range.

[0003] Refer to a temperature control system and industrial oven disclosed in Chinese patent CN117812860B. In this system, when used, a corresponding number of power regulators are provided based on the number of heating elements in the operating environment, and each heating element is connected to a load terminal. When there is only one power regulator, the power regulator is directly connected to the power adapter for communication. When there are multiple power regulators, the multiple power regulators are connected to each other in sequence, and the power regulators of adjacent power adapters are connected to the power adapter for signal communication. This allows one power adapter to simultaneously control multiple power regulators. The power adapter is also connected to a temperature control host for communication. The temperature acquisition component transmits real-time temperature information to the temperature control host. The temperature control host compares the received real-time temperature information with a preset target temperature and sends a command to the power adapter based on the comparison result. After receiving the command, the power adapter sends a power on / off command to the power regulator control chip of the corresponding power regulator. The power regulator control chip in the power regulator controls the corresponding thyristor to turn on and off according to the command transmitted by the power adapter, thereby controlling the power on and off of the heating element connected to the thyristor. However, the temperature control system in the above-mentioned Chinese patent has a temperature control host, a power regulator component, and a temperature acquisition component, which are all independent entities. On-site wiring and maintenance are difficult, and they also take up a lot of space. For some environments with limited space, it is not conducive to the placement of the temperature control system. In addition, the temperature control system in the above-mentioned Chinese patent is mainly used for equipment that requires AC power supply and is not applicable to equipment that requires DC power supply. Summary of the Invention

[0004] The present invention aims to solve the technical problems existing in the above-mentioned prior art and provide an integrated DC temperature controller, which reduces the difficulty of on-site wiring and maintenance, reduces the size to adapt to environments with limited space, and is suitable for use in equipment that requires a DC power supply; the present invention also provides a temperature control system with the integrated DC temperature controller.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The integrated DC temperature controller of the present invention comprises an outer shell, wherein a temperature control module, a DC output module, a temperature acquisition module and an uplink interface module are arranged in the outer shell;

[0007] The temperature acquisition module is used to collect temperature data of the temperature detection device and send the collected temperature data to the temperature control module;

[0008] The output module includes a DC drive circuit and an output terminal provided on the outer shell. The DC drive circuit is electrically connected to the temperature control module and the output terminal, respectively, and is used to receive an output power adjustment instruction sent by the temperature control module and adjust the power of the corresponding channel of the output terminal according to the output power adjustment instruction to control the heating temperature of the heating element.

[0009] The temperature control module is used to receive the temperature data sent by the temperature acquisition module, generate an output power adjustment instruction according to the temperature data, and send the output power adjustment instruction to the DC drive circuit of the output module;

[0010] The uplink interface module is electrically connected to the temperature control module and is used to realize communication between the temperature control module and the host computer.

[0011] The integrated DC temperature controller described in the present invention integrates a temperature control module, a temperature acquisition module, an output module, and an uplink interface module into a single housing, forming a single unit. During on-site installation, this eliminates the wiring required by the prior art due to the independent operation of the temperature control module, temperature acquisition module, and output module, reducing the difficulty of on-site wiring and maintenance, and simplifying the on-site installation process. Furthermore, by directly integrating the three components into a single housing, rather than requiring separate housings for each, the device significantly reduces its size and is more adaptable to environments with limited space. Furthermore, through the collaboration of the temperature control module, temperature acquisition module, and output module, a DC power supply can be output to power devices requiring DC power.

[0012] Furthermore, the DC drive circuit includes a MOSFET driver chip U1, which is electrically connected to the temperature control module through a positive input pin. The DC drive circuit also includes a resistor R1, a resistor R2, a MOS tube Q1 and a diode D1. One end of the resistor R1 is electrically connected to the output pin of the MOSFET driver chip U1, and the other end is electrically connected to the inverting input pin of the MOSFET driver chip U1. The gate of the MOS tube Q1 is electrically connected to the output pin of the MOSFET driver chip U1, the source of the MOS tube Q1 is electrically connected to one end of the resistor R2, and the other end of the resistor R2 is electrically connected to the inverting input pin of the MOSFET driver chip U1. The diode D1 is anti-parallel to both ends of the resistor R2, and the output end of the MOS tube Q1 is electrically connected to the output terminal.

[0013] Furthermore, the output module also includes a first filtering circuit, which includes capacitors C1, C2, C3, and C4. The capacitors C1, C2, C3, and C4 are connected in parallel, and one end of the parallel circuit formed by the capacitors C1, C2, C3, and C4 in parallel is grounded, and the other end provides power for the MOSFET driver chip U1.

[0014] Furthermore, the integrated DC temperature controller also includes a current detection circuit, which includes a current detection amplifier chip U2, a voltage comparator chip U3, a resistor R3 and a capacitor C5; one end of the resistor R3 is electrically connected to the output pin of the current detection amplifier chip U2, and the other end is electrically connected to one end of the capacitor C5 and the temperature control module respectively, and the other end of the capacitor C5 is grounded, the positive input pin of the current detection amplifier chip U2 is electrically connected to the output node O1 of the drain of the MOS tube Q1, the output pin of the voltage comparator chip U3 is electrically connected to the temperature control module, the inverting input pin of the voltage comparator chip U3 is electrically connected to the output pin of the current detection amplifier chip U2, and the positive input pin of the voltage comparator chip U3 is electrically connected to the reference voltage generation circuit.

[0015] Furthermore, the reference voltage generating circuit includes a resistor R4, a resistor R5, a resistor R6 and a capacitor C6. The resistors R4, R5 and R6 are connected in series as one, and one end of the series circuit formed by the resistors R4, R5 and R6 is grounded, and the other end is electrically connected to the power supply. The capacitor C6 is connected in parallel with the resistor R6, and the parallel circuit formed by the resistor R6 and the capacitor C6 in parallel is electrically connected to the non-inverting input pin of the voltage comparator chip U3.

[0016] Furthermore, the temperature acquisition module includes a first isolation chip, a converter chip, a temperature acquisition circuit and an input terminal, the temperature acquisition circuit is electrically connected to the input terminal and the converter chip, the converter chip is electrically connected to the first isolation chip, and the first isolation chip is electrically connected to the temperature control module; the temperature acquisition circuit includes a TVS tube, a resistor R7, a resistor R8, a resistor R9, a resistor R10 and a second filtering circuit, one end of the resistor R7 is electrically connected to the input terminal, the TVS tube and one end of the resistor R8, the other end of the resistor R7 is electrically connected to the second filtering circuit, one end of the resistor R9 is electrically connected to the input terminal, the TVS tube and one end of the resistor R10, the other end of the resistor R9 is electrically connected to the second filtering circuit, and the second filtering circuit is electrically connected to the converter chip.

[0017] Furthermore, the uplink interface module includes a network chip, a network transformer, and an Ethernet interface. The Ethernet interface is provided on the outer surface of the housing, and the Ethernet interface, the network transformer, and the network chip are electrically connected in sequence. The network chip is also electrically connected to the temperature control module.

[0018] Alternatively, the uplink interface module includes a second isolation chip, a first RS485 interface chip and a first RS485 interface terminal, the first RS485 interface terminal is arranged on the outer surface of the shell, and the first RS485 interface terminal, the first RS485 interface chip and the second isolation chip are electrically connected in sequence, and the second isolation chip is also electrically connected to the temperature control module.

[0019] Furthermore, the integrated DC thermostat further includes a downlink interface module. When there are multiple integrated DC thermostats, the downlink interface on the previous integrated DC thermostat is electrically connected to the uplink interface on the next integrated DC thermostat.

[0020] Furthermore, the downlink interface module includes a second RS485 interface terminal, a second RS485 interface chip and a third isolation chip. The second RS485 interface terminal is arranged on the outer surface of the outer shell, and the second RS485 interface terminal, the second RS485 interface chip and the third isolation chip are electrically connected in sequence. The third isolation chip is also electrically connected to the temperature control module.

[0021] The temperature control system of the present invention comprises a host computer and one or more integrated DC temperature controllers as described above; all integrated DC temperature controllers are electrically connected to the host computer via an uplink interface module;

[0022] Alternatively, it further includes at least one lower host and at least one lower slave, wherein the lower host or the lower slave is the above-mentioned integrated DC temperature controller, the lower host is electrically connected to the upper host through an uplink interface module, and the lower host and the adjacent lower slave or two adjacent lower slaves are electrically connected to each other through the uplink interface module and the downlink interface module;

[0023] At least one heating element is electrically connected to the output terminal of the integrated DC temperature controller; and at least one temperature detection device is electrically connected to the input terminal of the integrated DC temperature controller.

[0024] The temperature control system of the present invention, because it includes the aforementioned integrated DC thermostat, facilitates wiring and maintenance, is compact, and occupies minimal space. Furthermore, by networking multiple integrated DC thermostats with a host computer and between multiple integrated DC thermostats, data from more temperature detection devices can be collected and the heating temperatures of more heating elements can be adjusted, resulting in more precise temperature control. Furthermore, the temperature control system of the present invention, because it includes the aforementioned integrated DC thermostat, possesses all the beneficial technical effects it brings, which will not be elaborated upon here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals indicate the same parts throughout the accompanying drawings, and the drawings are not drawn to scale with actual size. The emphasis is on illustrating the subject matter of the present invention.

[0026] Figure 1 It is a three-dimensional diagram of the integrated DC temperature controller of the present invention.

[0027] Figure 2 This is a principle block diagram of the integrated DC temperature controller of the present invention.

[0028] Figure 3 This is a schematic diagram of the DC drive circuit structure.

[0029] Figure 4 Schematic diagram of the structure of the first filtering circuit.

[0030] Figure 5 Schematic diagram of the current detection circuit structure.

[0031] Figure 6 This is a schematic diagram of the temperature acquisition circuit structure.

[0032] Figure 7 This is the first embodiment of the networking application of an integrated DC temperature controller.

[0033] Figure 8 This is the second embodiment of the networking application of the integrated DC temperature controller. DETAILED DESCRIPTION

[0034] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings.

[0035] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and integrated therewith, or there may be an intermediate element. The terms "mounted", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] The present invention specifically provides an embodiment of an integrated DC temperature controller, see Figure 1 and 2, including an outer shell 3, in which a temperature control module, a DC output module, a temperature acquisition module and an uplink interface module are arranged; wherein the temperature acquisition module is used to collect temperature data of the temperature detection device and send the collected temperature data to the temperature control module, and the temperature detection device can be a thermocouple, etc. The output module includes a DC drive circuit and an output terminal 1 arranged on the outer shell 3, and the DC drive circuit is electrically connected to the temperature control module and the output terminal 1 respectively, and is used to receive an output power adjustment instruction sent by the temperature control module, and adjust the power of the corresponding channel of the output terminal 1 according to the output power adjustment instruction to control the heating temperature of the heating element; the output terminal 1 can be a multi-channel output terminal, such as a four-channel output terminal or an eight-channel output terminal, etc., depending on the number of actually connected loads. It should be noted that the number of actually connected loads can be equal to or less than the number of channels of the output terminal 1, but cannot be greater than the number of channels of the output terminal 1. The temperature control module is used to receive the temperature data sent by the temperature acquisition module, form an output power adjustment instruction based on the temperature data, and send the output power adjustment instruction to the DC drive circuit of the output module; the temperature control module can be an MCU, the temperature control module receives the temperature data collected by any channel of the temperature acquisition module, obtains the MV value after PID calculation, and controls the power output of the corresponding channel of the output module according to the MV value to control the temperature of the heating element connected to the corresponding channel of the output module to achieve the purpose of constant temperature control; the temperature control module periodically (such as 10ms) collects the temperature data on the corresponding channel, calculates the MV value of the current cycle through PID based on the deviation between the set value and the measured value, and then converts the MV value into a PWM duty cycle (for example, through a 1000Hz timer), and controls the power adjustment of the corresponding channel of the output module, thereby achieving precise output control. The uplink interface module is electrically connected to the temperature control module and is used to realize communication between the temperature control module and the host computer, see Figure 1 In this embodiment, the uplink interface module is arranged on the top surface of the outer shell 3. Through the uplink interface module, the integrated DC temperature controller can be connected to the host computer. The so-called "connection" can be an electrical connection or a signal connection. When an electrical connection is adopted, a twisted pair cable or an RJ45 cable can be used to electrically connect to the host computer, or an RS485 cable can be used to electrically connect to the host computer. The host computer can be a PLC, etc., so that the staff can control the integrated DC temperature controller through the host computer.

[0038] The integrated DC temperature controller in this embodiment integrates the temperature control module, temperature acquisition module, output module, and uplink interface module within a single housing 3, forming a single unit. During on-site installation, this eliminates the wiring required by the prior art due to the independent operation of the temperature control module, temperature acquisition module, and output module. This reduces the difficulty of on-site wiring and maintenance, and simplifies the on-site installation process. Furthermore, by directly integrating the three components within a single housing 3, rather than requiring separate housings for each, the device significantly reduces its size and is more adaptable to environments with limited space. Furthermore, through the collaboration of the temperature control module, temperature acquisition module, and output module, a DC power supply is achieved, thereby powering devices requiring DC power.

[0039] In the preferred embodiment, see Figure 3 The DC drive circuit includes a MOSFET driver chip U1, which is electrically connected to the temperature control module via the non-inverting input pin IN+. The DC drive circuit also includes a resistor R1, a resistor R2, a MOS transistor Q1, and a diode D1. One end of the resistor R1 is electrically connected to the output pin Out of the MOSFET driver chip U1, and the other end is electrically connected to the inverting input pin IN- of the MOSFET driver chip U1. The gate of the MOS transistor Q1 is electrically connected to the output pin Out of the MOSFET driver chip U1. The source of the MOS transistor Q1 is electrically connected to one end of the resistor R2, and the other end of the resistor R2 is electrically connected to the inverting input pin IN- of the MOSFET driver chip U1. The diode D1 is connected in anti-parallel to both ends of the resistor R2. The output end OUT1 of the MOS transistor Q1 is electrically connected to the output terminal 1. Through the above circuit structure, a DC power supply can be provided to the load, and the above DC drive circuit can efficiently control the MOS transistor Q1. There can be multiple DC drive circuits as above, each of which is electrically connected to the temperature control module and controlled individually by the temperature control module. In addition, each DC drive circuit is also electrically connected to a channel of the output terminal 1 to control the temperature of the load on the channel.

[0040] In the preferred embodiment, see Figure 4 The output module also includes a first filter circuit, which includes capacitors C1, C2, C3, and C4. Capacitors C1, C2, C3, and C4 are connected in parallel, and one end of the parallel circuit formed by capacitors C1, C2, C3, and C4 is grounded, while the other end provides power to the MOSFET driver chip U1. The first filter circuit suppresses power supply noise, ensuring stable power supply to the MOSFET driver chip U1. When there are multiple DC drive circuits, each DC drive circuit is electrically connected to the first filter circuit.

[0041] In the preferred embodiment, see Figure 5The integrated DC temperature controller also includes a current detection circuit, which includes a current detection amplifier chip U2, a voltage comparator chip U3, a resistor R3 and a capacitor C5; one end of the resistor R3 is electrically connected to the output pin OUT of the current detection amplifier chip U2, and the other end is electrically connected to one end of the capacitor C5 and the temperature control module respectively. The other end of the capacitor C5 is grounded, the non-inverting input pin IN+ of the current detection amplifier chip U2 is electrically connected to the output node O1 of the drain of the MOS tube Q1, the output pin OUT1 of the voltage comparator chip U3 is electrically connected to the temperature control module, the inverting input pin IN1- of the voltage comparator chip U3 is electrically connected to the output pin OUT of the current detection amplifier chip U2, and the non-inverting input pin IN1+ of the voltage comparator chip U3 is electrically connected to the reference voltage generation circuit. The current detection amplifier chip U2 converts and amplifies the input current signal into a voltage signal, and the voltage comparator chip U3 compares the amplified current signal with a reference voltage to determine whether the circuit is overcurrent and prevent damage due to overcurrent. At the same time, capacitor C5 suppresses power supply and signal noise, ensuring the stability of the detection signal and reference voltage, thereby improving circuit reliability. The above current detection circuit achieves accurate current monitoring and overcurrent protection through the detection-amplification-comparison-protection process. Furthermore, resistor R3 in the above current detection circuit acts as a current limiter, preventing abnormally large currents from directly impacting the current detection amplifier chip U2, avoiding chip damage and ensuring circuit reliability. Multiple current detection circuits can be arranged in parallel, corresponding one-to-one with the number of channels of output terminal 1, to facilitate current detection on the corresponding channels. When the current value detected by the current detection circuit in the corresponding channel is greater than the preset current value, an interrupt signal is generated and sent to the temperature control module. The temperature control module controls the corresponding channel to shut down for a certain period of time and then reopen it according to the terminal signal. There may be multiple voltage comparator chips U3 , and each voltage comparator chip U3 may be electrically connected to two current detection amplifier chips U2 .

[0042] In the preferred embodiment, see Figure 5 The reference voltage generating circuit includes a resistor R4, a resistor R5, a resistor R6 and a capacitor C6. The resistors R4, R5 and R6 are connected in series as one, and one end of the series circuit formed by the resistors R4, R5 and R6 is grounded, and the other end is electrically connected to the power supply. The capacitor C6 is connected in parallel with the resistor R6, and the parallel circuit formed by the resistor R6 and the capacitor C6 in parallel is electrically connected to the non-inverting input pin IN1+ of the voltage comparator chip U3.

[0043] In the preferred embodiment, see Figure 6The temperature acquisition module includes a first isolation chip, a converter chip, a temperature acquisition circuit, and input terminal 2. The temperature acquisition circuit is electrically connected to input terminal 2 and the converter chip, which is electrically connected to the first isolation chip, which is electrically connected to the temperature control module. The temperature acquisition circuit includes a TVS diode VD1, resistors R7, R8, R9, R10, and a second filter circuit. One end of resistor R7 is electrically connected to input terminal 2, TVS diode VD1, and one end of resistor R8, respectively. The other end of resistor R7 is electrically connected to the second filter circuit. One end of resistor R9 is electrically connected to input terminal 2, TVS diode VD1, and one end of resistor R10, respectively. The other end of resistor R9 is electrically connected to the second filter circuit, which is electrically connected to the converter chip. The temperature acquisition module with the above structure can accurately collect temperature data. Input terminal 2 can be a multi-channel input terminal, such as a four-channel input terminal or an eight-channel input terminal. There can be multiple temperature acquisition circuits, each of which is electrically connected to any channel of input terminal 2. The number of temperature acquisition circuits depends on the number of temperature detection devices. All temperature acquisition circuits are set in parallel. The temperature control module can collect temperature data on all channels in a round-robin manner, or it can collect temperature data on any channel as required. The first isolation chip is an analog chip that ensures circuit safety. The first isolation chip can achieve electrical isolation and ensure accurate, stable, and reliable signal transmission. Figure 1 In this embodiment, input terminal 2 is disposed on the surface of outer shell 3. In this embodiment, the second filtering circuit includes capacitors C7, C8, and C9. Capacitors C8 and C9 are connected in series, and the series circuit formed by the two is connected in parallel with capacitor C7 to form a second filtering circuit. The second filtering circuit suppresses noise from the input signal, ensuring more accurate collected temperature data.

[0044] In the preferred embodiment, see Figure 2This embodiment provides two implementation methods of the uplink interface module. Implementation method 1: The uplink interface module includes a network chip, a network transformer, and an Ethernet interface 4. The Ethernet interface is provided on the outer surface of the outer shell 3, and the Ethernet interface, network transformer, and network chip are electrically connected in sequence. The network chip is also electrically connected to the temperature control module. Through the structure of the above uplink interface module, it is possible to isolate external dangerous voltages and protect the temperature control module. The signal quality is optimized to ensure excellent signal transmission quality between the temperature control module and the host computer, and to suppress interference and loss. Implementation method 2: The uplink interface module includes a second isolation chip, a first RS485 interface chip, and a first RS485 interface terminal. The first RS485 interface terminal is provided on the outer surface of the outer shell 3, and the first RS485 interface terminal, the first RS485 interface chip, and the second isolation chip are electrically connected in sequence. The second isolation chip is also electrically connected to the temperature control module. Through the structure of the above uplink interface module, it is possible to isolate external dangerous energy, protect the internal circuit of the integrated DC temperature controller, suppress interference, and ensure stable communication over long distances and in complex environments.

[0045] In the preferred embodiment, see Figure 1-2 In addition, the integrated DC thermostat further includes a downstream interface module. When there are multiple integrated DC thermostats, the downstream interface on the preceding integrated DC thermostat is electrically connected to the upstream interface on the succeeding integrated DC thermostat. This facilitates network expansion of multiple integrated DC thermostats, enabling temperature collection and control at more collection points.

[0046] In the preferred embodiment, see Figure 1-2 The downlink interface module includes a second RS485 interface terminal 5, a second RS485 interface chip, and a third isolation chip. The second RS485 interface terminal 5 is disposed on the outer surface of the outer shell 3 and is electrically connected to each other in sequence. The third isolation chip is also electrically connected to the temperature control module. This structure of the downlink interface module isolates external hazardous energy, protects the internal circuits of the integrated DC thermostat, suppresses interference, and ensures stable communication over long distances and in complex environments.

[0047] In the preferred embodiment, see Figure 2 The integrated DC temperature controller also includes an LED status indicator, which is electrically connected to the temperature control module and is used to indicate signal input, output, and status. The LED status indicator is located on the surface of the outer shell 3. The integrated DC temperature controller also includes a debugging interface 7 and a DIP switch 6, both of which are electrically connected to the temperature control module. The DIP switch 6 in this embodiment is a four-position DIP switch, which is used to set the station number to control the expansion module. The debugging interface 7 in the present invention is used to debug the temperature control module or burn the program.

[0048] The present invention also specifically provides an embodiment of a temperature control system, including a host computer and one or more integrated DC temperature controllers as described above; all integrated DC temperature controllers are electrically connected to the host computer via an uplink interface module; see Figure 7 , the figure shows five integrated DC temperature controllers, two of which are connected to switches via Ethernet, and the switches are further connected to a host computer (such as a PLC) via Ethernet, while the remaining three integrated DC temperature controllers are electrically connected to the host computer via RS485 lines. At this time, the five integrated DC temperature controllers can all be used as independent hosts for temperature control and PID calculation; or, further comprising at least one lower host and at least one lower slave, the lower host or the lower slave being the above-mentioned integrated DC temperature controller, the lower host being electrically connected to the host computer via an upstream interface module, the lower host and the adjacent lower slave or two adjacent lower slaves being electrically connected via an upstream interface module and a downstream interface module; see Figure 8 The figure shows four integrated DC thermostats, one of which serves as a lower-level master, and the remaining integrated DC thermostats serve as lower-level slaves. The upstream interface module of the integrated DC thermostat serving as the lower-level master is connected to a switch via Ethernet, while the downstream interface module is connected to the upstream interface module of an adjacent integrated DC thermostat serving as a lower-level slave via an RS485 line. The switch is connected to the master via Ethernet, and adjacent integrated DC thermostats serving as lower-level slaves are connected to each other via RS485 lines via the upstream and downstream interface modules, thereby implementing a master-to-slave cascade expansion network. In this case, the lower-level master has PID calculation capabilities, while the lower-level slaves do not. The lower-level slaves can be controlled by the lower-level master. At least one heating element is electrically connected to the output terminal 1 of the integrated DC thermostat, and at least one temperature detection device is electrically connected to the input terminal 2 of the integrated DC thermostat.

[0049] Because this temperature control system includes the aforementioned integrated DC thermostat, wiring and maintenance are more convenient, and it is compact and space-saving. Furthermore, by networking multiple integrated DC thermostats with a host computer and between multiple integrated DC thermostats, data from more temperature detection devices can be collected and the heating temperatures of more heating elements can be adjusted, resulting in more precise temperature control. Furthermore, the temperature control system of the present invention, because it includes the aforementioned integrated DC thermostat, possesses all the beneficial technical effects it brings, which will not be elaborated on here.

[0050] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0051] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0052] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An integrated DC temperature controller, characterized in that: It includes an outer shell, in which a temperature control module, a DC output module, a temperature acquisition module and an uplink interface module are arranged; The temperature acquisition module is used to collect temperature data of the temperature detection device and send the collected temperature data to the temperature control module; The output module includes a DC drive circuit and an output terminal provided on the outer shell. The DC drive circuit is electrically connected to the temperature control module and the output terminal, respectively, and is used to receive an output power adjustment instruction sent by the temperature control module and adjust the power of the corresponding channel of the output terminal according to the output power adjustment instruction to control the heating temperature of the heating element. The temperature control module is used to receive the temperature data sent by the temperature acquisition module, generate an output power adjustment instruction according to the temperature data, and send the output power adjustment instruction to the DC drive circuit of the output module; The uplink interface module is electrically connected to the temperature control module and is used to realize communication between the temperature control module and the host computer.

2. The integrated DC temperature controller according to claim 1, characterized in that: The DC drive circuit includes a MOSFET driver chip U1, which is electrically connected to the temperature control module through a non-phase input pin. The DC drive circuit also includes a resistor R1, a resistor R2, a MOS transistor Q1, and a diode D1. One end of the resistor R1 is electrically connected to the output pin of the MOSFET driver chip U1, and the other end is electrically connected to the inverting input pin of the MOSFET driver chip U1. The gate of the MOS transistor Q1 is electrically connected to the output pin of the MOSFET driver chip U1, the source of the MOS transistor Q1 is electrically connected to one end of the resistor R2, and the other end of the resistor R2 is electrically connected to the inverting input pin of the MOSFET driver chip U1. The diode D1 is anti-parallel connected to both ends of the resistor R2, and the output end of the MOS transistor Q1 is electrically connected to the output terminal.

3. The integrated DC temperature controller according to claim 2, characterized in that: The output module also includes a first filtering circuit, which includes capacitors C1, C2, C3, and C4. The capacitors C1, C2, C3, and C4 are connected in parallel, and one end of the parallel circuit formed by the capacitors C1, C2, C3, and C4 is grounded, and the other end provides power for the MOSFET driver chip U1.

4. The integrated DC temperature controller according to claim 2, characterized in that: The integrated DC temperature controller also includes a current detection circuit, which includes a current detection amplifier chip U2, a voltage comparator chip U3, a resistor R3 and a capacitor C5; one end of the resistor R3 is electrically connected to the output pin of the current detection amplifier chip U2, and the other end is electrically connected to one end of the capacitor C5 and the temperature control module respectively, and the other end of the capacitor C5 is grounded. The positive input pin of the current detection amplifier chip U2 is electrically connected to the output node O1 of the drain of the MOS tube Q1, the output pin of the voltage comparator chip U3 is electrically connected to the temperature control module, the inverting input pin of the voltage comparator chip U3 is electrically connected to the output pin of the current detection amplifier chip U2, and the positive input pin of the voltage comparator chip U3 is electrically connected to the reference voltage generation circuit.

5. The integrated DC temperature controller according to claim 4, characterized in that: The reference voltage generating circuit includes a resistor R4, a resistor R5, a resistor R6 and a capacitor C6. The resistors R4, R5 and R6 are connected in series as one, and one end of the series circuit formed by the resistors R4, R5 and R6 is grounded, and the other end is electrically connected to the power supply. The capacitor C6 is connected in parallel with the resistor R6, and the parallel circuit formed by the resistor R6 and the capacitor C6 in parallel is electrically connected to the non-inverting input pin of the voltage comparator chip U3.

6. The integrated DC temperature controller according to claim 1, characterized in that: The temperature acquisition module includes a first isolation chip, a converter chip, a temperature acquisition circuit and an input terminal. The temperature acquisition circuit is electrically connected to the input terminal and the converter chip, respectively. The converter chip is electrically connected to the first isolation chip, and the first isolation chip is electrically connected to the temperature control module. The temperature acquisition circuit includes a TVS tube, a resistor R7, a resistor R8, a resistor R9, a resistor R10 and a second filter circuit. One end of the resistor R7 is electrically connected to the input terminal, the TVS tube and one end of the resistor R8, respectively. The other end of the resistor R7 is electrically connected to the second filter circuit. One end of the resistor R9 is electrically connected to the input terminal, the TVS tube and one end of the resistor R10, respectively. The other end of the resistor R9 is electrically connected to the second filter circuit, and the second filter circuit is electrically connected to the converter chip.

7. The integrated DC temperature controller according to claim 1, characterized in that: The uplink interface module includes a network chip, a network transformer and an Ethernet interface. The Ethernet interface is arranged on the outer surface of the housing, and the Ethernet interface, the network transformer and the network chip are electrically connected in sequence. The network chip is also electrically connected to the temperature control module. Alternatively, the uplink interface module includes a second isolation chip, a first RS485 interface chip and a first RS485 interface terminal, the first RS485 interface terminal is arranged on the outer surface of the shell, and the first RS485 interface terminal, the first RS485 interface chip and the second isolation chip are electrically connected in sequence, and the second isolation chip is also electrically connected to the temperature control module.

8. The integrated DC temperature controller according to claim 1, characterized in that: The integrated DC thermostat further includes a downlink interface module. When there are multiple integrated DC thermostats, the downlink interface on the previous integrated DC thermostat is electrically connected to the uplink interface on the next integrated DC thermostat.

9. The integrated DC temperature controller according to claim 8, characterized in that: The downlink interface module includes a second RS485 interface terminal, a second RS485 interface chip and a third isolation chip. The second RS485 interface terminal is arranged on the outer surface of the outer shell, and the second RS485 interface terminal, the second RS485 interface chip and the third isolation chip are electrically connected in sequence. The third isolation chip is also electrically connected to the temperature control module.

10. A temperature control system, comprising a host computer, characterized in that: Also includes one or more integrated DC temperature controllers according to any one of claims 1 to 9; all integrated DC temperature controllers are electrically connected to the host computer via an uplink interface module; Alternatively, the system further comprises at least one lower host and at least one lower slave, wherein the lower host or the lower slave is the integrated DC temperature controller according to any one of claims 1 to 9, the lower host is electrically connected to the upper host via an uplink interface module, and the lower host and an adjacent lower slave, or two adjacent lower slaves, are electrically connected via an uplink interface module and a downlink interface module; At least one heating element is electrically connected to the output terminal of the integrated DC temperature controller; and at least one temperature detection device is electrically connected to the input terminal of the integrated DC temperature controller.

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