Magnetic device and electronic equipment and preparation method thereof

Abstract

The invention relates to the technical field of magnetic devices, and discloses a magnetic device and electronic equipment and a preparation method thereof, the magnetic device comprises a magnetic core, a primary coil and a secondary coil, the magnetic core comprises an outer iron core and an inner iron core, the outer iron core is provided with a first surface and a second surface which are opposite, and the outer iron core is provided with a through hole penetrating from the first surface to the second surface; the inner iron core is located in the through hole, the inner iron core is provided with a third surface facing the same direction as the first surface, the primary coil is arranged on the inner iron core in a sleeved mode, the primary coil is provided with a first pin part, the first pin part abuts against the third surface, the secondary coil is arranged on the primary coil in a sleeved mode, the secondary coil is provided with a second pin part, and the second pin part abuts against the first surface. According to the magnetic device, the electronic equipment and the preparation method of the magnetic device, the magnetic device, the electronic equipment and the preparation method of the magnetic device, the preparation process of the magnetic device is simple, and the yield is high.

Description

Technical Field

[0001] The present invention relates to the technical field of magnetic devices, and in particular to a magnetic device and an electronic device thereof, and a preparation method thereof. Background Art

[0002] In related technologies, trans-inductor voltage regulators (TLVRs) are primarily categorized into two types, depending on their manufacturing methods: assembled TLVRs and one-piece molded TLVRs. Assembled TLVRs require glue to assemble the coil and magnetic core, resulting in less compactness, lower density, and poorer performance. Therefore, one-piece molded TLVRs have become the mainstream in the industry.

[0003] The existing one-piece TLVR production process primarily involves pressing the T-core, assembling the coil, adding powder, and then pressing. The pressed core wraps around the coil, and the core typically needs to be ground to expose the coil leads. This complex manufacturing process also easily leads to poor coil withstand voltage during grinding, resulting in a low yield rate. Summary of the Invention

[0004] The embodiment of the present invention discloses a magnetic device, an electronic device thereof, and a preparation method thereof. The preparation process of the magnetic device is relatively simple and the yield rate is high.

[0005] In the first aspect, an embodiment of the present invention discloses a magnetic device, including a magnetic core, a primary coil and a secondary coil, the magnetic core including an outer iron core and an inner iron core, the outer iron core having a first surface and a second surface relative to each other, the outer iron core being provided with a through hole extending from the first surface to the second surface, the inner iron core being integrally formed in the through hole, the inner iron core having a third surface facing the same direction as the first surface, the primary coil being sleeved on the inner iron core, the primary coil having a first pin portion, the first pin portion abutting the third surface, the secondary coil being sleeved on the primary coil, the secondary coil having a second pin portion, the second pin portion abutting the first surface.

[0006] As an optional embodiment, in an embodiment of the present invention, the outer core includes a first magnet, a first insulating layer and a second insulating layer. The first insulating layer is arranged at one end of the first magnet, and the surface of the first insulating layer facing away from the first magnet is the first surface. The second insulating layer is arranged at one end of the first magnet facing away from the first insulating layer, and the surface of the second insulating layer facing away from the first magnet is the second surface.

[0007] As an optional implementation manner, in an embodiment of the present invention, the thickness of the first insulating layer is t1, 0.2 mm ≤ t1 ≤ 1.5 mm.

[0008] As an optional implementation, in an embodiment of the present invention, the thickness of the second insulating layer is t2, 0.2 mm ≤ t2 ≤ 1.5 mm.

[0009] As an optional implementation, in an embodiment of the present invention, the inner core includes a second magnet and a third insulating layer, the third insulating layer is provided at one end of the second magnet, and the surface of the third insulating layer facing away from the second magnet is the third surface.

[0010] As an optional implementation, in an embodiment of the present invention, the thickness of the third insulating layer is t3, 0.2 mm ≤ t3 ≤ 1.5 mm.

[0011] As an optional implementation, in an embodiment of the present invention, along the penetration direction of the through hole, the height of the first pin portion is h1, 0.05mm≤h1≤0.2mm, and / or the height of the second pin portion is h2, 0.05mm≤h2≤0.2mm.

[0012] In a second aspect, an embodiment of the present invention discloses an electronic device, which includes the magnetic device according to the first aspect.

[0013] In a second aspect, an embodiment of the present invention discloses a method for preparing a magnetic device, comprising:

[0014] a prefabricated outer core having a through hole extending through a first surface and a second surface opposite to the outer core;

[0015] a prefabricated inner core, wherein the inner core has a third surface facing the same direction as the first surface;

[0016] A prefabricated primary coil having a first leg portion;

[0017] A prefabricated secondary coil having a second pin portion;

[0018] Positioning and assembling the outer iron core, the inner iron core, the primary coil, and the secondary coil, wherein the inner iron core is located in the through hole, the primary coil is sleeved on the inner iron core, the first pin portion abuts against the third surface, the secondary coil is sleeved on the primary coil, and the second pin portion abuts against the first surface;

[0019] The positioned and assembled outer iron core, the inner iron core, the primary coil, and the secondary coil are hot pressed to form the outer iron core and the inner iron core into a magnetic core.

[0020] As an optional embodiment, in an embodiment of the present invention, the positioning and assembling of the outer iron core, the inner iron core, the primary coil, and the secondary coil, wherein the inner iron core is located in the through hole, the primary coil is sleeved on the inner iron core, the first pin portion abuts against the third surface, the secondary coil is sleeved on the primary coil, and the second pin portion abuts against the first surface, includes:

[0021] placing the secondary coil in the through hole, with the second pin portion abutting against the first surface;

[0022] The primary coil is sleeved on the inner core, and the first pin portion abuts against the third surface;

[0023] The primary coil and the inner iron core are placed integrally in the through hole, and the secondary coil is sleeved on the primary coil.

[0024] As an optional implementation, in an embodiment of the present invention, the assembly gap of placing the secondary coil in the through hole is a1, 0.05mm≤a1≤0.2mm, and / or the assembly gap of placing the primary coil in the inner iron core is a2, 0.05mm≤a2≤0.2mm.

[0025] As an optional implementation, in an embodiment of the present invention, the prefabricated outer core has a through hole, and the through hole passes through the first surface and the second surface opposite to each other of the outer core, including:

[0026] Providing a first magnet, wherein the first magnet has through holes passing through both ends of the first magnet;

[0027] forming a first insulating layer at one end of the first magnet, wherein a surface of the first insulating layer facing away from the first magnet is the first surface;

[0028] A second insulating layer is formed at one end of the first magnet facing away from the first insulating layer, and a surface of the second insulating layer facing away from the first magnet is the second surface.

[0029] As an optional implementation, in an embodiment of the present invention, the thickness of the first insulating layer is t1, 0.2 mm ≤ t1 ≤ 1.5 mm, and / or the thickness of the second insulating layer is t2, 0.2 mm ≤ t2 ≤ 1.5 mm.

[0030] As an optional implementation, in an embodiment of the present invention, the prefabricated inner core has a third surface facing the same direction as the first surface, and includes:

[0031] providing a second magnet;

[0032] forming a third insulating layer at one end of the second magnet, wherein a surface of the third insulating layer facing away from the second magnet is the third surface;

[0033] The thickness of the third insulating layer is t3, 0.2 mm ≤ t3 ≤ 1.5 mm.

[0034] As an optional implementation, in an embodiment of the present invention, along the penetration direction of the through hole, the height of the first pin portion is h1, 0.05mm≤h1≤0.2mm, and / or the height of the second pin portion is h2, 0.05mm≤h2≤0.2mm.

[0035] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0036] In an embodiment of the present invention, the outer iron core of the magnetic core is provided with a through hole extending from the first surface to the second surface, and the through hole is integrally formed with an inner iron core, so that the primary coil is sleeved by the inner iron core, so that the first pin portion of the primary coil abuts against the third surface, and the secondary coil is sleeved on the primary coil, and the second pin portion of the secondary coil abuts against the first surface. In this way, after the outer iron core and the inner iron core are integrally formed, the formed magnetic core will not block the first pin portion and the second pin portion. The first pin portion and the second pin portion are directly exposed, and there is no need to grind the magnetic core. This can simplify the preparation process of the magnetic device and avoid the occurrence of poor voltage resistance of the primary coil and the secondary coil due to grinding. The yield rate of the magnetic device is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 This is a schematic structural diagram of a magnetic device disclosed in Example 1 of the present invention;

[0039] Figure 2 This is a schematic diagram of the exploded structure of a magnetic device disclosed in Example 1 of the present invention;

[0040] Figure 3 is a schematic diagram of the exploded structure of a magnetic device disclosed in the first embodiment of the present invention from another perspective;

[0041] Figure 4 This is a schematic structural diagram of an outer iron core disclosed in Embodiment 1 of the present invention;

[0042] Figure 5 This is a structural schematic diagram of an outer iron core disclosed in the first embodiment of the present invention from another perspective;

[0043] Figure 6 This is a schematic structural diagram of an inner iron core disclosed in the first embodiment of the present invention;

[0044] Figure 7 This is a structural schematic diagram of an inner iron core disclosed in the first embodiment of the present invention from another perspective;

[0045] Figure 8 is a schematic diagram of the exploded structure of a magnetic device disclosed in the first embodiment of the present invention from another perspective;

[0046] Figure 9 This is a simplified structural diagram of an electronic device disclosed in Embodiment 2 of the present invention;

[0047] Figure 10 1 is a flow chart of a method for preparing a magnetic device disclosed in Embodiment 3 of the present invention;

[0048] Figure 11 This is a schematic structural diagram of the assembly of the outer iron core and the secondary coil disclosed in the third embodiment of the present invention;

[0049] Figure 12 It is a structural diagram of the assembly of the inner iron core and the primary coil disclosed in the third embodiment of the present invention.

[0050] Description of main reference numerals

[0051] 100. Magnetic device; 10. Magnetic core; 11. Outer core; 11a. First surface; 11b. Second surface; 11c. Through hole; 111. First magnet; 112. First insulating layer; 112a. Recess; 113. Second insulating layer; 12. Inner core; 12a. Third surface; 121. Second magnet; 122. Third insulating layer; 20. Primary coil; 20a. First pin portion; 30. Secondary coil; 30a. Second pin portion; 200. Electronic device. DETAILED DESCRIPTION

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0053] In the present invention, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0054] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0055] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0056] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0057] The invention discloses a magnetic device and an electronic device thereof, and a preparation method thereof. The preparation process of the magnetic device is relatively simple and the yield rate is high.

[0058] Example 1

[0059] See also Figures 1 to 3, is a structural schematic diagram of a magnetic device 100 provided in a first embodiment of the present invention, the magnetic device 100 includes a magnetic core 10, a primary coil 20 and a secondary coil 30, the magnetic core 10 includes an outer iron core 11 and an inner iron core 12, the outer iron core 11 has a first surface 11a and a second surface 11b opposite to each other, the outer iron core 11 is provided with a through hole 11c extending from the first surface 11a to the second surface 11b, the inner iron core 12 is integrally formed in the through hole 11c, the inner iron core 12 has a third surface 12a facing the same direction as the first surface 11a, the primary coil 20 is sleeved on the inner iron core 12, the primary coil 20 has a first pin portion 20a, the first pin portion 20a abuts the third surface 12a, the secondary coil 30 is sleeved on the primary coil 20, the secondary coil 30 has a second pin portion 30a, and the second pin portion 30a abuts the first surface 11a.

[0060] In this embodiment, the outer iron core 11 of the magnetic core 10 is provided with a through hole 11c extending from the first surface 11a to the second surface 11b, and the through hole 11c is integrally formed with the inner iron core 12, so that the primary coil 20 is sleeved by the inner iron core 12, so that the first pin portion 20a of the primary coil 20 abuts against the third surface 12a, and the secondary coil 30 is sleeved on the primary coil 20, and the second pin portion 30a of the secondary coil 30 abuts against the first surface 11a. In this way, after the outer iron core 11 and the inner iron core 12 are integrally formed, the formed magnetic core 10 will not block the first pin portion 20a and the second pin portion 30a. The first pin portion 20a and the second pin portion 30a are directly exposed, and there is no need to grind the magnetic core 10. This can simplify the preparation process of the magnetic device 100 and avoid the occurrence of poor withstand voltage of the primary coil 20 and the secondary coil 30 caused by grinding. The yield rate of the magnetic device 100 is high.

[0061] Optionally, taking the primary coil 20 as an example, the number of the primary coil 20 may be one or more, which is not specifically limited in this embodiment. Figure 1 and Figure 2 As shown, the number of the primary coils 20 is two, and the magnetic device 100 is a two-phase electrode.

[0062] In some other embodiments, the number of the primary coil 20 and the secondary coil 30 may be one, and the magnetic device 100 is a single-phase electrode; when the number of the primary coil 20 and the secondary coil 30 is three, the magnetic device 100 is a three-phase electrode.

[0063] In some embodiments, such as Figure 4As shown, outer core 11 includes a first magnet 111, a first insulating layer 112, and a second insulating layer 113. First insulating layer 112 is provided at one end of first magnet 111, with the surface of first insulating layer 112 facing away from first magnet 111 being first surface 11a. Second insulating layer 113 is provided at the end of first magnet 111 facing away from first insulating layer 112, with the surface of second insulating layer 113 facing away from first magnet 111 being second surface 11b. Thus, by providing first insulating layer 112 and second insulating layer 113, first magnet 111 and secondary coil 30 are isolated, thereby preventing contact and conduction between secondary coil 30 and first magnet 111, and thus preventing poor withstand voltage, especially after secondary coil 30 has been stripped and electroplated.

[0064] For example, the first insulating layer 112 has a recessed portion 112a, and the second lead portion 30a is located in the recessed portion 112a. Thus, the recessed portion 112a provides positioning for the second lead portion 30a, thereby improving the assembly accuracy of the secondary coil 30 and the magnetic core 10 during the manufacture of the magnetic device 100. Furthermore, after manufacture, the bonding strength between the secondary coil 30 and the magnetic core 10 is enhanced.

[0065] For example, Figure 5 As shown, the thickness of the first insulating layer 112 is t1, and 0.2 mm ≤ t1 ≤ 1.5 mm. If the thickness t1 of the first insulating layer 112 is less than 0.2 mm, the thickness t1 of the first insulating layer 112 is small, the insulation effect is poor, and when the voltage is high, the secondary coil 30 is easily conductive with the first magnet 111. If the thickness t1 of the first insulating layer 112 is greater than 1.5 mm, the thickness t1 of the first insulating layer 112 is large. When the overall height of the magnetic device 100 is limited, the height of the first magnet 111 is small, the magnetic field of the magnetic device 100 is weak, and the inductance is small. Therefore, the thickness t1 of the first insulating layer 112 can be 0.2 mm ≤ t1 ≤ 1.5 mm. The insulation effect of the first insulating layer 112 is good, the risk of conductive connection between the secondary coil 30 and the first magnet 111 when the voltage is high is low, and when the overall height of the magnetic device 100 is limited, the height of the first magnet 111 is large, the magnetic field of the magnetic device 100 is strong, and the inductance is large.

[0066] Furthermore, the thickness t1 of the first insulating layer 112 may be 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, etc., which is not specifically limited in this embodiment.

[0067] For example, the thickness of the second insulating layer 113 is t2, and 0.2 mm ≤ t2 ≤ 1.5 mm. If the thickness t2 of the second insulating layer 113 is less than 0.2 mm, the thickness t2 of the second insulating layer 113 is small, the insulation effect is poor, and when the voltage is high, the secondary coil 30 is easily conductive with the first magnet 111. If the thickness t2 of the second insulating layer 113 is greater than 1.5 mm, the thickness t2 of the second insulating layer 113 is large. When the overall height of the magnetic device 100 is limited, the height of the second magnet 121 is small, the magnetic field of the magnetic device 100 is weak, and the inductance is small. Therefore, the thickness t2 of the second insulating layer 113 can be 0.2 mm ≤ t2 ≤ 1.5 mm. The second insulating layer 113 has a better insulation effect and a lower risk of conductive connection between the secondary coil 30 and the second magnet 121 when the voltage is high. Moreover, when the overall height of the magnetic device 100 is limited, the height of the second magnet 121 is large, the magnetic field of the magnetic device 100 is strong, and the inductance is large.

[0068] Furthermore, the thickness t2 of the second insulating layer 113 may be 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, etc., which is not specifically limited in this embodiment.

[0069] In some embodiments, such as Figure 6 As shown, the inner core 12 includes a second magnet 121 and a third insulating layer 122. The third insulating layer 122 is provided at one end of the second magnet 121. The surface of the third insulating layer 122 facing away from the second magnet 121 is a third surface 12a. Thus, the third insulating layer 122 isolates the second magnet 121 from the primary coil 20, thereby preventing contact and conduction between the primary coil 20 and the second magnet 121, thereby preventing poor withstand voltage, especially after the primary coil 20 has been stripped and electroplated.

[0070] For example, Figure 7As shown, the thickness of the third insulating layer 122 is t3, and 0.2 mm ≤ t3 ≤ 1.5 mm. If the thickness t3 of the third insulating layer 122 is less than 0.2 mm, the thickness t3 of the third insulating layer 122 is small, the insulation effect is poor, and when the voltage is high, the primary coil 20 is easily conductively connected to the second magnet 121. If the thickness t3 of the third insulating layer 122 is greater than 1.5 mm, the thickness t3 of the third insulating layer 122 is large. When the overall height of the magnetic device 100 is limited, the height of the second magnet 121 is small, the magnetic field of the magnetic device 100 is weak, and the inductance is small. Therefore, the thickness t3 of the third insulating layer 122 can be 0.2 mm ≤ t3 ≤ 1.5 mm. The insulation effect of the third insulating layer 122 is good, the risk of conductively connecting the primary coil 20 and the second magnet 121 when the voltage is high is low, and when the overall height of the magnetic device 100 is limited, the height of the second magnet 121 is large, the magnetic field of the magnetic device 100 is strong, and the inductance is large.

[0071] Furthermore, the thickness t3 of the third insulating layer 122 may be 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, etc., which is not specifically limited in this embodiment.

[0072] Combine Figure 5 and Figure 7 Taking the magnetic device 100 of this embodiment as an example, various dimensional parameters of the outer core 11 and the inner core 12 are tested, and the experimental data are shown in Table 1 below. Figure 5 The overall height h1 and overall width d1 of the outer core 11 are shown in FIG. Figure 7 The overall height h2 and overall width d2 of the inner core 12 are shown:

[0073]

[0074] The withstand voltage test requires that the magnetic device 100 must reach a voltage of at least 70V within 0.3s, provided that the leakage current does not exceed 0.5mA. Furthermore, the inductance of the magnetic device 100 must be at least 45nH.

[0075] According to Table 1, Figure 5 and Figure 7 It can be seen that when the thickness t1 of the first insulating layer 112 of the magnetic device 100, the thickness t2 of the second insulating layer 113, and the thickness t3 of the third insulating layer 122 fall between 0.2mm and 1.5mm, the magnetic device 100 meets the withstand voltage test requirements and has a relatively high inductance value, which can reach above 45nH. However, when the thickness is less than 0.2mm, the magnetic device 100, although the inductance value can reach above 45nH, does not meet the withstand voltage test requirements. When the thickness is greater than 1.5mm, the magnetic device 100 meets the withstand voltage test requirements, but the inductance value cannot reach above 45nH.

[0076] For example, Figure 8 As shown, along the through-hole 11c, the height of the first pin portion 20a is h1, with a range of 0.05 mm ≤ h1 ≤ 0.2 mm. If the height h1 of the first pin portion 20a is less than 0.05 mm, the conductive performance of the first pin portion 20a is weak, and the reliability of the first pin portion 20a's contact and electrical connection with the external circuit is low. If the height h1 of the first pin portion 20a is greater than 0.2 mm, then, given the limited overall height of the magnetic device 100, the height of the inner core 12 is reduced, the magnetic field of the magnetic device 100 is weak, and the inductance is low. Therefore, the height h1 of the first pin portion 20a can be 0.05 mm ≤ h1 ≤ 0.2 mm, which provides a strong conductive performance of the first pin portion 20a and a high reliability of the first pin portion 20a's contact and electrical connection with the external circuit. If the height of the magnetic device 100 is limited, the height of the inner core 12 is increased, the magnetic field of the magnetic device 100 is strong, and the inductance is high.

[0077] Furthermore, the height h1 of the first lead portion 20 a may be 0.05 mm, 0.07 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc., which is not specifically limited in this embodiment.

[0078] For example, along the through-hole 11c, the height of the second pin portion 30a is h2, where 0.05 mm ≤ h2 ≤ 0.2 mm. If the height h2 of the second pin portion 30a is less than 0.05 mm, the conductive performance of the second pin portion 30a is weak, and the reliability of the second pin portion 30a's contact and conduction with the external circuit is low. If the height h2 of the second pin portion 30a is greater than 0.2 mm, then if the overall height of the magnetic device 100 is limited, the height of the outer core 11 is small, the magnetic field of the magnetic device 100 is weak, and the inductance is low. Therefore, the height h2 of the second pin portion 30a can be 0.05 mm ≤ h2 ≤ 0.2 mm, which can enhance the conductive performance of the second pin portion 30a and enhance the reliability of the second pin portion 30a's contact and conduction with the external circuit. If the overall height of the magnetic device 100 is limited, the height of the outer core 11 is large, the magnetic field of the magnetic device 100 is strong, and the inductance is high.

[0079] Furthermore, the height h2 of the second lead portion 30 a may be 0.05 mm, 0.07 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc., which is not specifically limited in this embodiment.

[0080] To facilitate electrical connection between the magnetic device 100 and external circuits or other electronic components, the first lead portion 20a facing away from the third surface 12a is flush with the second lead portion 30a facing away from the first surface 11a.

[0081] The first embodiment of the present invention provides a magnetic device 100, in which the outer iron core 11 of the magnetic core 10 is provided with a through hole 11c extending from the first surface 11a to the second surface 11b, and the through hole 11c is integrally formed with an inner iron core 12, so that the primary coil 20 is sleeved by the inner iron core 12, so that the first pin portion 20a of the primary coil 20 abuts against the third surface 12a, and the secondary coil 30 is sleeved on the primary coil 20, and the second pin portion 30a of the secondary coil 30 abuts against the first surface 11a. In this way, after the outer iron core 11 and the inner iron core 12 are integrally formed, the formed magnetic core 10 will not block the first pin portion 20a and the second pin portion 30a. The first pin portion 20a and the second pin portion 30a are directly exposed, and there is no need to grind the magnetic core 10. This can simplify the preparation process of the magnetic device 100 and avoid the occurrence of poor withstand voltage of the primary coil 20 and the secondary coil 30 caused by grinding. The yield rate of the magnetic device 100 is high.

[0082] Example 2

[0083] See also Figure 9 , which is a schematic structural diagram of an electronic device 200 provided in the second embodiment of the present invention. The electronic device 200 includes the magnetic device 100 in the first embodiment.

[0084] The first embodiment of the present invention provides an electronic device 200 , wherein the manufacturing process of the magnetic device 100 is relatively simple and the yield rate is relatively high.

[0085] Example 3

[0086] See also Figure 10 , which is a flow chart of a method for preparing a magnetic device 100 according to the third embodiment of the present invention. The structure of the magnetic device 100 prepared by the third embodiment is as follows Figure 1 and Figure 2 As shown, the preparation method comprises the following steps:

[0087] 301 . Prefabricate an outer core 11 . The outer core 11 has a through hole 11 c . The through hole 11 c penetrates the first surface 11 a and the second surface 11 b opposite to each other.

[0088] Optionally, step 301 may include: providing a first magnet 111, the first magnet 111 having a through hole 11c running through both ends thereof, forming a first insulating layer 112 at one end of the first magnet 111, the surface of the first insulating layer 112 facing away from the first magnet 111 being a first surface 11a, and forming a second insulating layer 113 at one end of the first magnet 111 facing away from the first insulating layer 112, the surface of the second insulating layer 113 facing away from the first magnet 111 being a second surface 11b.

[0089] The process of implementing step 301 can be referred to Figure 4 .like Figure 4 As shown, Figure 4 A first magnetic body 111 formed with a first insulating layer 112 and a second insulating layer 113 is shown.

[0090] Optionally, the order of forming the first insulating layer 112 and the second insulating layer 113 on the first magnetic body 111 is not limited to a specific order. That is, the first insulating layer 112 and the second insulating layer 113 can be formed simultaneously, or the first insulating layer 112 can be formed first and then the second insulating layer 113, or the second insulating layer 113 can be formed first and then the first insulating layer 112. This embodiment does not specifically limit this. Preferably, the first insulating layer 112 and the second insulating layer 113 can be formed simultaneously. In this way, preparation time can be saved and the preparation efficiency of the magnetic device 100 can be improved.

[0091] 303. Prefabricate the inner core 12. The inner core 12 has a third surface 12a facing the same direction as the first surface 11a.

[0092] Optionally, step 303 may include: providing a second magnet 121 , forming a third insulating layer 122 at one end of the second magnet 121 , wherein a surface of the third insulating layer 122 facing away from the second magnet 121 is a third surface 12 a .

[0093] The process of implementing step 303 can be referred to Figure 6 .like Figure 6 As shown, Figure 6 The second magnetic body 121 formed with the third insulating layer 122 is shown.

[0094] Optionally,

[0095] 305. Prefabricate the primary coil 20, wherein the primary coil 20 has a first pin portion 20a.

[0096] 307 . Prefabricate the secondary coil 30 , wherein the secondary coil 30 has a second leg portion 30 a .

[0097] Steps 301, 303, 305, and 307 are not limited to a specific order. That is, steps 301, 303, 305, and 307 can be performed simultaneously, or steps 301, 303, 305, and 307 can be performed sequentially. This is not specifically limited in this embodiment. Preferably, steps 301, 303, 305, and 307 can be performed simultaneously. This can save preparation time and improve the preparation efficiency of magnetic device 100100.

[0098] 309. Position and assemble the outer iron core 11, the inner iron core 12, the primary coil 20 and the secondary coil 30. The inner iron core 12 is located in the through hole 11c. The primary coil 20 is sleeved on the inner iron core 12, and the first pin portion 20a abuts against the third surface 12a. The secondary coil 30 is sleeved on the primary coil 20, and the second pin portion 30a abuts against the first surface 11a.

[0099] Optionally, step 301 may include: placing the secondary coil 30 in the through hole 11c, with the second pin portion 30a abutting the first surface 11a, sleeved the primary coil 20 on the inner iron core 12, with the first pin portion 20a abutting the third surface 12a, placing the primary coil 20 and the inner iron core 12 as a whole in the through hole 11c, and sleeved the secondary coil 30 on the primary coil 20.

[0100] Optionally, the order of placing the secondary coil 30 in the through hole 11c and the primary coil 20 on the inner core 12 is not limited to a specific order. That is, the secondary coil 30 can be placed in the through hole 11c and the primary coil 20 can be on the inner core 12 at the same time, or the secondary coil 30 can be placed in the through hole 11c first and then the primary coil 20 can be on the inner core 12, or the primary coil 20 can be on the inner core 12 first and then the secondary coil 30 can be placed in the through hole 11c. This embodiment does not specifically limit this. Preferably, the secondary coil 30 can be placed in the through hole 11c and the primary coil 20 can be on the inner core 12 at the same time. This can save preparation time and improve the preparation efficiency of the magnetic device 100.

[0101] For example, Figure 11 As shown, the secondary coil 30 is placed in the through hole 11 c with an assembly gap a1, 0.05 mm ≤ a1 ≤ 0.2 mm.

[0102] The assembly gap a1 refers to the distance between the outer dimensions of the secondary coil 30 and the inner diameter of the through hole 11 c .

[0103] If the assembly gap a1 for placing the secondary coil 30 in the through-hole 11c is less than 0.05mm, the assembly gap a1 is small, and it is more difficult to place the secondary coil 30 in the through-hole 11c. If the assembly gap a1 for placing the secondary coil 30 in the through-hole 11c is greater than 0.2mm, the assembly gap a1 is large, and after implementing step 311, the structure of the magnetic device 100 is not compact enough, the density is low, and the performance is poor. Therefore, the assembly gap a1 for placing the secondary coil 30 in the through-hole 11c can be 0.05mm≤a1≤0.2mm, and it is less difficult to place the secondary coil 30 in the through-hole 11c. After implementing step 311, the structure of the magnetic device 100 is more compact, the density is higher, and the performance is better.

[0104] Furthermore, the assembly gap a1 for placing the secondary coil 30 in the through hole 11 c may be 0.05 mm, 0.07 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc., which is not specifically limited in this embodiment.

[0105] For example, Figure 12 As shown, the assembly gap between the primary coil 20 and the inner core 12 is a2, and 0.05mm≤a2≤0.2mm.

[0106] The assembly gap a2 refers to the single-side distance between the inner ring size of the primary coil 30 and the outer size of the inner core 12 .

[0107] If the assembly gap a2 for sleeves of the primary coil 20 on the inner core 12 is less than 0.05 mm, the assembly gap a2 is relatively small, and sleeves of the primary coil 20 on the inner core 12 are more difficult. If the assembly gap a2 for sleeves of the primary coil 20 on the inner core 12 is greater than 0.2 mm, the assembly gap a2 is relatively large, and after step 311 is implemented, the structure of the magnetic device 100 is not compact enough, the density is low, and the performance is poor. Therefore, the assembly gap a2 for sleeves of the primary coil 20 on the inner core 12 can be 0.05 mm ≤ a2 ≤ 0.2 mm, and sleeves of the primary coil 20 on the inner core 12 are less difficult. After step 311 is implemented, the structure of the magnetic device 100 is relatively compact, the density is high, and the performance is better.

[0108] Furthermore, the assembly gap a2 between the primary coil 20 and the inner core 12 may be 0.05 mm, 0.07 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc., which is not specifically limited in this embodiment.

[0109] 311 . The positioned and assembled outer iron core 11 , inner iron core 12 , primary coil 20 and secondary coil 30 are hot pressed to form the outer iron core 11 and the inner iron core 12 into a magnetic core 10 .

[0110] The third embodiment of the present invention provides a method for preparing a magnetic device 100 . The preparation process of the magnetic device 100 prepared by the preparation method is relatively simple, and the yield rate is relatively high.

[0111] The above is a detailed introduction to a magnetic device and its electronic device and preparation method disclosed in the embodiment of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the magnetic device and its electronic device, preparation method and its core idea of ​​the present invention; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation of the present invention.

Claims

1. A magnetic device, characterized in that: include: A magnetic core comprising an outer core and an inner core, the outer core having a first surface and a second surface opposite to each other, the outer core being provided with a through hole extending from the first surface to the second surface, the inner core being integrally formed within the through hole, and the inner core having a third surface facing the same direction as the first surface; a primary coil, the primary coil being sleeved on the inner core, the primary coil having a first pin portion, the first pin portion being in contact with the third surface; as well as The secondary coil is sleeved on the primary coil and has a second pin portion, and the second pin portion abuts against the first surface.

2. The magnetic device according to claim 1, characterized in that The outer core includes a first magnet, a first insulating layer and a second insulating layer. The first insulating layer is arranged at one end of the first magnet, and the surface of the first insulating layer facing away from the first magnet is the first surface. The second insulating layer is arranged at one end of the first magnet facing away from the first insulating layer, and the surface of the second insulating layer facing away from the first magnet is the second surface.

3. The magnetic device according to claim 2, characterized in that The thickness of the first insulating layer is t1, 0.2 mm ≤ t1 ≤ 1.5 mm.

4. The magnetic device according to claim 2, characterized in that The thickness of the second insulating layer is t2, 0.2 mm ≤ t2 ≤ 1.5 mm.

5. The magnetic device according to any one of claims 1 to 4, characterized in that: The inner core includes a second magnet and a third insulating layer. The third insulating layer is provided at one end of the second magnet, and a surface of the third insulating layer facing away from the second magnet is the third surface.

6. The magnetic device according to claim 5, characterized in that The thickness of the third insulating layer is t3, 0.2 mm ≤ t3 ≤ 1.5 mm.

7. The magnetic device according to any one of claims 1 to 4, characterized in that: Along the penetrating direction of the through hole, the height of the first pin portion is h1, 0.05 mm ≤ h1 ≤ 0.2 mm, and / or the height of the second pin portion is h2, 0.05 mm ≤ h2 ≤ 0.2 mm.

8. An electronic device, characterized in that: The magnetic device comprises the magnetic device according to any one of claims 1 to 7.

9. A method for preparing a magnetic device, characterized in that: include: a prefabricated outer core having a through hole extending through a first surface and a second surface opposite to the outer core; a prefabricated inner core, wherein the inner core has a third surface facing the same direction as the first surface; A prefabricated primary coil having a first leg portion; A prefabricated secondary coil having a second pin portion; Positioning and assembling the outer iron core, the inner iron core, the primary coil, and the secondary coil, wherein the inner iron core is located in the through hole, the primary coil is sleeved on the inner iron core, the first pin portion abuts against the third surface, the secondary coil is sleeved on the primary coil, and the second pin portion abuts against the first surface; The positioned and assembled outer iron core, the inner iron core, the primary coil, and the secondary coil are hot pressed to form the outer iron core and the inner iron core into a magnetic core.

10. The preparation method according to claim 9, characterized in that The positioning assembly of the outer iron core, the inner iron core, the primary coil, and the secondary coil, wherein the inner iron core is located in the through hole, the primary coil is sleeved on the inner iron core, the first pin portion abuts against the third surface, the secondary coil is sleeved on the primary coil, and the second pin portion abuts against the first surface, includes: placing the secondary coil in the through hole, with the second pin portion abutting against the first surface; The primary coil is sleeved on the inner core, and the first pin portion abuts against the third surface; The primary coil and the inner iron core are placed integrally in the through hole, and the secondary coil is sleeved on the primary coil.

11. The preparation method according to claim 10, characterized in that: The secondary coil is placed in the through hole with an assembly gap of a1, 0.05mm≤a1≤0.2mm, and / or the primary coil is sleeved on the inner iron core with an assembly gap of a2, 0.05mm≤a2≤0.2mm.

12. The preparation method according to any one of claims 9 to 11, characterized in that: The prefabricated outer core, wherein the outer core has a through hole, the through hole passing through the first surface and the second surface opposite to each other of the outer core, comprises: Providing a first magnet, wherein the first magnet has through holes passing through both ends of the first magnet; forming a first insulating layer at one end of the first magnet, wherein a surface of the first insulating layer facing away from the first magnet is the first surface; A second insulating layer is formed at one end of the first magnet facing away from the first insulating layer, and a surface of the second insulating layer facing away from the first magnet is the second surface.

13. The preparation method according to claim 12, characterized in that The thickness of the first insulating layer is t1, 0.2 mm ≤ t1 ≤ 1.5 mm, and / or the thickness of the second insulating layer is t2, 0.2 mm ≤ t2 ≤ 1.5 mm.

14. The preparation method according to any one of claims 9 to 11, characterized in that: The prefabricated inner core has a third surface facing the same direction as the first surface, comprising: providing a second magnet; forming a third insulating layer at one end of the second magnet, wherein a surface of the third insulating layer facing away from the second magnet is the third surface; The thickness of the third insulating layer is t3, 0.2 mm ≤ t3 ≤ 1.5 mm.

15. The preparation method according to any one of claims 9 to 11, characterized in that: Along the penetrating direction of the through hole, the height of the first pin portion is h1, 0.05 mm ≤ h1 ≤ 0.2 mm, and / or the height of the second pin portion is h2, 0.05 mm ≤ h2 ≤ 0.2 mm.

Images