Filling method of filling glue of ball grid array packaging chip and filling assembly thereof

Abstract

The invention discloses a filling glue filling method and a filling assembly of a ball grid array packaging chip in the technical field of electronic packaging, and aims to solve the problem that the filling glue filling method and the filling assembly have difficulty in accurately and quantitatively filling the ball grid array packaging chip in the prior art. The method comprises the steps that the posture of a base plate is controlled to block and limit a filling area through gravity and solidification, overflowing to an unnecessary area is prevented, the coverage rate is high, meanwhile, the problem of air holes caused by uneven gravity distribution is solved, and the purpose of accurately and quantitatively filling glue is achieved. In addition, the problems of cavities and serious glue overflow in the filling process are avoided, the mechanical performance and thermal cycle reliability of welding spots are improved, the failure rate of the substrate and the chip is reduced, and the overall quality and reliability of products are improved. The waste of filling materials is effectively reduced, and the production cost is reduced.

Description

Technical Field

[0001] The invention relates to a method for filling a ball grid array package chip with filling glue and a filling component thereof, belonging to the technical field of electronic packaging. Background Art

[0002] In the field of modern electronic packaging, BGABall Grid Array (BGABall Grid Array) packaging technology has become one of the mainstream solutions due to its unique advantages.

[0003] Conventional BGA underfill typically fills the entire BGA surface, not just the solder joints. This whole-surface filling approach presents the following issues: 1. Only the areas surrounding the solder joints truly require filler material to enhance performance, but conventional underfill is not limited to the solder joints, but rather fills the entire BGA surface, resulting in a significant waste of filler material. 2. For underfill in limited areas, the fill area cannot be precisely controlled, which can easily lead to filler material overflowing into unwanted areas, impacting the chip's performance. 3. Due to process limitations, it is difficult to precisely fill the specified area with filler material, and it is difficult to guarantee the accuracy of the fill amount.

[0004] In summary, the existing filling glue filling method and its filling assembly are difficult to accurately and quantitatively fill the ball grid array package chip. Summary of the Invention

[0005] The purpose of the present application is to overcome the deficiencies in the prior art and to provide a method for accurately and quantitatively filling a ball grid array package chip with a filling glue and a filling component thereof.

[0006] To achieve the above objectives, this application is implemented using the following technical solutions: In a first aspect, the present application provides a method for filling a ball grid array package chip with a filler, comprising: Obtain the substrate on which the chip has been packaged; Adjusting the substrate posture so that the packaging surface between the substrate and the chip is parallel to the gravity line, and the area to be filled is located at the lowest point of gravity on the packaging surface; Using the first glue to form a solidified enclosure that semi-surrounds the area to be filled; Filling the area to be filled with filling glue through the opening of the curing enclosure; After the filling glue is cured, the curing blockage is removed.

[0007] In some embodiments of the first aspect of the present application, the first glue is UV light curing glue; The removing of the solidified blocking after the filling glue is solidified includes: using tweezers to remove the solidified blocking after the filling glue is solidified, and further wiping with a cleaning agent to remove residues of the solidified blocking.

[0008] In some embodiments of the first aspect of the present application, including, Dividing the area to be filled into a plurality of sub-areas to be filled according to the distance from the side of the chip; Establishing a one-to-one correspondence between the chip side and the sub-area to be filled; The substrate posture is adjusted so that each sub-area to be filled is located at the lowest point of gravity on the packaging surface in turn, and the first glue is used to form a solidified blockage on the chip side and adjacent edge corresponding to each sub-area to be filled, wherein the height of the solidified blockage on the adjacent edge matches the height of the corresponding sub-area to be filled.

[0009] In some embodiments of the first aspect of the present application, the use of the first glue to form a solidified containment that semi-surrounds the area to be filled includes: Using the first glue to form a cured plugging seal in a first gap between a side edge of the chip and an adjacent edge thereof and the substrate; Alternatively, a tooling that matches the side of the chip is obtained, and the tooling is used to seal the first gap between the side of the chip and its adjacent side and the substrate, and the first glue forms a solidified enclosure connecting the tooling and the substrate.

[0010] In some embodiments of the first aspect of the present application, filling the area to be filled with a filling glue through the opening of the solidified enclosure includes: The area to be filled is divided according to the density of solder joints, and the filling glue is filled in the order of high to low solder joint density.

[0011] In some embodiments of the first aspect of the present application, the adjusting the posture of the substrate so that the packaging surface between the substrate and the chip is parallel to the gravity line, and the area to be filled is located at the lowest point of gravity on the packaging surface, further comprising: Get an adjustable immobilization splint; Adjusting the spacing of the adjustable fixing clamps to be larger than the base plate; After a portion of the substrate with adjusted posture is placed into the adjustable fixing clamps, the spacing between the adjustable fixing clamps is adjusted to clamp the substrate.

[0012] In some embodiments of the first aspect of the present application, the filling of the area to be filled with the filling glue through the opening of the solidification containment includes using an air-controlled filling glue hose to perform pulse filling at certain time intervals.

[0013] In some embodiments of the first aspect of the present application, the filling of the area to be filled with filling glue through the opening of the solidified enclosure also includes placing a detectable floating object in the area to be filled away from one end of the air-controlled filling glue tube, and stopping the filling of the filling glue according to the positional relationship between the position of the detectable floating object and the area to be filled.

[0014] In a second aspect, the present application further provides a filling assembly that can be used in the method for filling the ball grid array package chip with filling glue as described in any embodiment of the first aspect, characterized in that it includes: an adjustable fixing clamp, used for clamping the substrate to fix the posture of the substrate; A tooling, matching the side size of the chip, used to block the first gap between the side of the chip and its adjacent side and the substrate; the tooling is made of transparent acrylic; a first glue for forming a solidified containment that semi-surrounds the area to be filled; A filling rubber hose is used to fill the area to be filled with filling rubber through the opening of the curing enclosure.

[0015] In some embodiments of the second aspect of the present application, a fixed base is further included, wherein the fixed base and the adjustable fixed splint are connected by bolts, and the fixed base and the adjustable fixed splint can be used to clamp the substrate, and the bolts are used to adjust the distance between the fixed base and the adjustable fixed splint; flexible pads are attached to the working surfaces of the fixed base and the adjustable fixed splint for clamping the substrate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present application provides a method for filling ball grid array packaged chips with adhesive and a filling assembly thereof. This method manipulates the substrate's posture to limit the filling area using gravity and solidification containment, preventing overflow into unnecessary areas. This high coverage rate also eliminates air voids caused by uneven gravity distribution, achieving the goal of precise and quantitative glue filling. This method also avoids the generation of voids and serious adhesive overflow during the filling process, improves the mechanical properties and thermal cycle reliability of the solder joints, reduces the failure rate of the substrate and chip, and enhances the overall quality and reliability of the product. This effectively reduces waste of filling material and lowers production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present application or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 is a cross-sectional view of a substrate for chip packaging using a ball grid array packaging process; Figure 2 2 is a schematic structural diagram of the filling assembly and the substrate when the filling method provided in this embodiment is implemented to fill the sub-area B to be filled without using tooling; Figure 3 yes Figure 2 Semi-perspective front view of Figure 4 This is a structural diagram of a filling assembly and a substrate when the filling method provided by the present embodiment is implemented using a tool; Figure 5 This is a flowchart of the steps of the method for filling the ball grid array package chip with filler provided in this embodiment; In the figure: 1. Filling hose; 2. Base plate; 3. Chip; 4. Glue; 5. Flexible pad; 6. Fixed base; 7. Adjustable fixing splint; 8. Bolt; 9. Tooling; 10. Area to be filled; 11. Chip signal processing area; 12. Signal receiving window.

[0019] Description of the accompanying drawings: For ease of understanding, Figure 3 The solder joints of the areas A and B to be filled are processed in perspective. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the present application / the present application's embodiments to clearly and completely describe the technical solutions of the present application / the present application's embodiments. Obviously, the described embodiments are only part of the embodiments of the present application / the present application, and not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present application / the present application, its application, or use. Example 1

[0021] This embodiment provides a method for filling a ball grid array package chip with a filler, so as to solve the problem in the prior art of difficulty in accurately and quantitatively filling a ball grid array package chip.

[0022] refer to Figure 1 This is a typical ball grid array packaged chip. Chip 3 is packaged on substrate 2 via a ball grid array. The ball grid array is mainly distributed in areas A and B on both sides of chip 3. Areas A and B are the areas to be filled 10. The areas to be filled are filled with adhesive to improve strength. However, the chip signal processing area 11 located between areas A and B cannot be covered by the adhesive because the corresponding signal receiving window 12 cannot be covered by the adhesive. Therefore, the chip signal processing area 11 needs to be filled. Traditional filling methods will cause the entire contact surface of chip 3 with substrate 2 to be filled, and it is impossible to achieve precise quantitative filling.

[0023] refer to Figures 2 to 4 The structure shown, and Figure 5 The steps shown in the figure, the method for filling the ball grid array package chip with filling glue provided in this embodiment includes: Get Figure 1 The substrate 2 shown has been packaged with the chip 3; Adjust the substrate 2 posture to meet two requirements: 1. Make the packaging surface between the substrate 2 and the chip 3 parallel to the gravity line, that is, Figure 1 、 Figure 2 and Figure 3 As shown in the vertical direction, 2. the area to be filled 10 is located at the lowest point of gravity on the packaging surface; this is conducive to the filling glue flowing evenly to the area to be filled 10 and avoiding other positions; A first glue is used to form a solidified enclosure 4 that semi-encloses the area to be filled 10; the purpose of the first glue in this step is not to act as a filling glue, but to form an area that can temporarily accommodate the filling glue through the solidified / semi-solidified solidified enclosure 4. Since the solidified enclosure 4 is semi-enclosed by the first glue, the solidified enclosure 4 can be set with reference to the shape of the filling area 10 to ensure that the filling glue accurately fills only the area to be filled 10; and the solidified enclosure 4 also reserves an opening for filling with the filling glue. It is not difficult for those skilled in the art to see that since the opening of the solidified enclosure 4 deviates from the direction of gravity, the semi-enclosed structure can work together with gravity to constrain the aggregation shape and external placement of the filling glue.

[0024] Fill the area 10 to be filled with filler glue through the opening of the curing block 4; the filling area 10 defines the filling range and serves as an operation reference to prevent overfilling. Excess filler glue may overflow from the gap to alert the operator. After the filling glue loses its fluidity, remove the curing blockage; the filling glue is generally heated to 120℃ for heat curing, and the heating time is 10min-15min, depending on the different types of filling glue; the loss of fluidity includes curing or semi-curing of the filling glue.

[0025] The filling method provided in Example 1 manipulates the posture of substrate 2 to utilize gravity and curing containment 4 to limit the filling area, preventing overflow into unnecessary areas. This method achieves high coverage while also eliminating air voids caused by uneven gravity distribution, achieving precise and quantitative glue filling. This method also avoids the generation of voids and serious glue overflow during the filling process, improves the mechanical properties and thermal cycling reliability of the solder joint, reduces the failure rate of substrate 2 and chip 3, and enhances the overall quality and reliability of the product. This method effectively reduces filler material waste and lowers production costs. Example 2

[0026] This embodiment provides a method for filling a ball grid array package chip with a filler. This embodiment is optimized based on the first embodiment to improve the technical effect and refine the technical solution. For details not fully described in this embodiment, please refer to the first embodiment.

[0027] As one embodiment, the first glue is UV light-curing glue, and the UV light-curing glue is dropped on the place where the curing blockage 4 needs to be formed, such as the gap between the chip 3 and the substrate 2. The UV light-curing glue has a certain liquid viscosity and can adhere to the gap, and is cured after being irradiated with ultraviolet light. When it is necessary to remove the curing blockage 4, since there may be other sensitive devices on the substrate 2, it is not easy to completely clean it with a cleaning agent, and after the filling glue is cured, the chip 3 is effectively bonded to the substrate 2 at the position of the curing blockage 4. Therefore, you can first use tweezers to remove the curing blockage 4, dip it in the cleaning agent and further wipe to remove the residue of the curing blockage 4. The cleaning agent can be acetone or alcohol, and is dipped with a cotton swab.

[0028] As one embodiment, the first glue may also be thermosetting glue, and the first glue droplets are placed where the solidified containment 4 is required to be formed and then heated and solidified in an oven.

[0029] refer to Figure 1 , a typical chip 3 using ball grid array packaging, generally the solder joints are arranged on the side, the central functional area does not have solder joints and should avoid filling with glue. As one embodiment, Figure 1 In the figure, the solder joints are gathered on both sides of AB, and the area to be filled 10 includes the sub-area to be filled A and the sub-area to be filled B. The side A corresponds to the sub-area to be filled A, and the side B corresponds to the sub-area to be filled B. Figure 3 , adjust the substrate 2 so that the sub-area to be filled B is at the lowest point of gravity. Use the first glue to form an upward-opening solidified plug 4 on the side B corresponding to the sub-area to be filled B and on the adjacent edges at both ends of the side B. The height of the solidified plug 4 exactly corresponds to the height of the sub-area to be filled B. The filling range can just cover the solder joints on the side B and avoid the chip signal processing area 11. After the sub-area to be filled B is solidified and the solidified plug 4 on the side B is removed, adjust the substrate 2 in the same way so that the sub-area to be filled A is at the lowest point of gravity. No further details will be given until the glue filling of sub-areas A and B is completed.

[0030] This embodiment only shows the Figure 1 The operation scheme of the middle chip 3 and the distribution of other solder joints can refer to this embodiment and will not be described in detail here.

[0031] As one example, refer to Figure 2 As mentioned in the first embodiment, the first glue is used to form a solidified containment 4 that half surrounds the area to be filled 10, including: A first glue is used to form a solidified blockage 4 that can seal the first gap between the side edge of the chip 3 and its adjacent edge and the substrate 2; that is, the solidified blockage 4 is directly constructed between the substrate 2 and the chip 3. This solution saves time and effort, but has certain requirements on the solidification speed of the first glue, and there is a probability of accidentally damaging the chip 3 when removing the solidified blockage 4.

[0032] As one example, refer to Figure 4 As mentioned in the first embodiment, the first glue is used to form a solidified blockage 4 that semi-encloses the area to be filled 10, and the method also includes obtaining a tool 9 that matches the side of the chip 3, using the tool 9 to seal the first gap between the side of the chip 3 and its adjacent sides and the substrate 2, and the first glue forming a solidified blockage 4 connecting the tool 9 and the substrate 2. The tool 9 is generally interference fit with the side of the chip 3 to slightly clamp the chip 3. Compared with the previous solution, the first gap is blocked by the solidified blockage 4 instead of the tool 9. In this solution, the solidified blockage 4 is mainly used to fix the tool 9 on the substrate 2, and has a certain function of sealing the small gap between the tool 9 and the substrate 2. When removing the solidified blockage 4, it is almost entirely performed on the side of the tool 9 facing away from the chip 3, reducing the probability of accidentally damaging the chip 3.

[0033] The tooling 9 is preferably made of a transparent acrylic material, which is convenient for observing the distribution of the filling glue and is not easy to bond with the filling glue. If the first glue is a thermosetting glue, the tooling 9 is preferably made of a high-temperature resistant transparent acrylic material.

[0034] As one embodiment, the filling of the to-be-filled area 10 with the filling glue through the opening of the solidified containment 4 mentioned in the first embodiment includes: The area to be filled 10 is divided according to the density of solder joints, and the filling glue is filled in the order of high solder joint density to low solder joint density.

[0035] This approach utilizes the capillary action of the filling glue between the solder joints, first filling the glue from the high-density solder joint area, and then spreading the filling glue along the dense solder joints, avoiding areas without solder joints or with very low solder joint density, ensuring the accuracy of the glue filling and preventing the glue from spreading to the chip signal processing area 11.

[0036] When the high-density area of ​​the solder joint is filled with glue, a part of the low-density area of ​​the solder joint will be filled. After the high-density area of ​​the solder joint is filled with glue, the remaining low-density area is filled through more delicate operations.

[0037] As one embodiment, the packaging surface between the substrate 2 and the chip 3 is similar to Figure 2 and Figure 4 It is difficult to be parallel to the gravity line in that way, so an adjustable fixed clamp 7 can be obtained; the spacing of the adjustable fixed clamp 7 is adjusted to be larger than the substrate 2; a part of the substrate 2 with adjusted posture is placed in the adjustable fixed clamp 7 and then the spacing of the adjustable fixed clamp 7 is adjusted to clamp the substrate 2.

[0038] Generally, the substrate 2 is placed in the adjustable fixing clamp 7 with the clamped part on the chip 3 facing downwards. The adjustable fixing clamp 7 can be designed to be split, and the adjustable fixing clamp 7 and the fixed base 6 are connected by bolts 8. By adjusting the bolts 8, the distance between the adjustable fixing clamp 7 and the fixed base 6 can be adjusted. At the same time, a flexible pad 5 is attached to the surface of the adjustable fixing clamp 7 and the fixed base 6 to prevent damage to the devices on the substrate 2.

[0039] As one embodiment, a method of filling the to-be-filled area 10 with filler through the opening of the curing block 4 includes using a pneumatic filling hose to pulse-fill at regular intervals. Pneumatic filling hoses are generally mechanically controlled and more precise than manual operation. Pulse-filling facilitates observation of the to-be-filled area after each filling to ensure that it is fully filled.

[0040] As one of the embodiments, the filling of the area to be filled 10 with filling glue through the opening of the solidified containment 4 mentioned in the first embodiment also includes placing a detectable floating object at the end of the air-controlled filling hose in the area to be filled 10, that is, the floating method, and stopping the filling of the filling glue according to the positional relationship between the position of the detectable floating object and the area to be filled 10. For example, a tiny hollow ball is placed in the sub-area to be filled, and as the filling glue pulse is injected into the sub-area to be filled, the position of the tiny hollow ball in the sub-area to be filled is observed through the transparent acrylic tooling 9, and the glue filling on that side is stopped when the tiny hollow ball reaches the upper limit of the height of the weld on that side or reaches the upper limit of the height of the solidified containment 4. Considering that the glue has a certain viscosity, the detectable floating object should be placed in the sub-area to be filled at the end away from the air-controlled filling hose to ensure that the weld at the end farthest from the filling hose can also be filled. In addition, the floating method can also be used to visually evaluate the filling speed of the glue.

[0041] As one embodiment, the detectable floating object may be a hollow metal ball, and its position may be detected by magnetic induction.

[0042] On the basis of Example 1, Example 2 uses UV light-curing glue as the first glue, which meets the requirement of second-level curing to form a curing blockage 4, and utilizes the pulse filling of the air-controlled filling hose and detectable floating objects to control the glue filling process, thereby realizing closed-loop quantitative control and further improving the filling accuracy; actively utilizing the capillary effect of the solder joint to reduce the number of fillings, thereby reducing the possibility of filling errors; the transparent acrylic tooling 9 facilitates visual observation and research, and the adjustable design and flexible contact surface of the adjustable fixing splint 7 can protect other components on the substrate 2, and also improve the adaptability to different models of substrates 2. Example 3

[0043] This embodiment provides a filling component, which can be applied to the filling glue filling method of the ball grid array package chip provided in Embodiment 1 or 2 to solve the corresponding technical problems.

[0044] Similarly, for the usage method and effects of the filling component provided in this embodiment, reference can be made to Embodiments 1 and 2, which will not be elaborated here.

[0045] Refer to Figures 2 to 4 , the filling component provided in this embodiment includes An adjustable fixing clamping plate 7, which is used to clamp the substrate 2 to fix the posture of the substrate 2; A tooling 9, which matches the side dimension of the chip 3. The tooling 9 is used to block the first gap between the side of the chip 3 and its adjacent side and the substrate 2; A first glue, which is used to form a cured enclosure 4 that semi-surrounds the待填充区域10; A filling glue tube 1, which is used to fill the filling glue into the待填充区域10 through the opening of the cured enclosure 4.

[0046] During use, adjust the posture of the substrate 2 as described in Embodiment 1 or 2, and then use the adjustable fixing clamping plate 7 to clamp the substrate 2 with the adjusted posture. Directly use the first glue to form a cured enclosure 4 that semi-surrounds the待填充区域10, or use the tooling 9 to form a cured enclosure 4 that semi-surrounds the待填充区域10; then use the filling glue tube 1 to fill the glue in the待填充区域10. After the filling glue is basically cured, remove the cured enclosure 4; repeat the above steps until all the packaging surfaces where the solder joints are located are filled, and the filled substrate 2 is obtained.

[0047] And the tooling 9 is preferably made of transparent acrylic material, which is convenient for observing the filling process.

[0048] As one of the embodiments, refer to Figures 2 to 4 , the filling component further includes a fixed base 6. The fixed base 6 and the adjustable fixing clamping plate 7 are connected by a bolt 8. The fixed base 6 and the adjustable fixing clamping plate 7 can be used to clamp the substrate 2, and the bolt 8 is used to adjust the distance between the fixed base 6 and the adjustable fixing clamping plate 7; the working surfaces of the fixed base 6 and the adjustable fixing clamping plate 7 for clamping the substrate 2 are both provided with flexible pads 5. First, the flexible pad 5 itself can prevent the clamping force from damaging the components on the substrate 2. Second, the adjustable clamping force and clamping width design are convenient for adapting to substrates 2 with different thicknesses and different vulnerabilities.

[0049] As one of the embodiments, the two sides of the tooling 9 are used to block the first gap, and the two sides are connected by a connecting plate, and the whole tends to be a "凵"-shaped buckle. Flexible materials can also be filled on both sides of the tooling 9 to seal the first gap.

[0050] It should be noted that the text contains some placeholders like "待填充区域10" which might need to be further clarified or replaced with the correct specific terms according to the actual context.The filler assembly provided in this embodiment features a transparent acrylic tooling 9 that facilitates visual observation and research. The adjustable design and flexible contact surface of the adjustable fixing clamp 7 protect other components on the substrate 2 and improve adaptability to different substrate models. This also avoids the serious problems of voids and adhesive overflow during the filling process, improves the mechanical properties and thermal cycling reliability of the solder joints, reduces the failure rate of the substrate 2 and chip 3, and enhances the overall quality and reliability of the product. This effectively reduces filler material waste and lowers production costs.

[0051] In the above embodiments, the flexible material may be rubber.

[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0053] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "provided in", "provided with", "located in", "installed", "set", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood based on specific circumstances. "Hinged" includes "rotational connection".

[0054] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for filling a ball grid array package chip with a filler, characterized in that: include, Obtaining a substrate (2) on which a chip (3) has been packaged; Adjusting the posture of the substrate (2) so that the packaging surface between the substrate (2) and the chip (3) is parallel to the gravity line, and the area to be filled (10) is located at the lowest point of gravity on the packaging surface; Using a first glue to form a solidified enclosure (4) that half surrounds the area to be filled (10); Filling the area to be filled (10) with filling glue through the opening of the curing enclosure (4); After the filling glue is cured, the curing blockage (4) is removed.

2. The method for filling a ball grid array package chip with a filler according to claim 1, wherein: The first glue is UV light curing glue; The method of removing the solidified containment (4) after the filling glue is solidified includes: using tweezers to remove the solidified containment (4) after the filling glue is solidified, and further wiping with a cleaning agent to remove the residue of the solidified containment (4).

3. The method for filling a ball grid array package chip with a filler according to claim 1, characterized in that it comprises: Dividing the area to be filled (10) into a plurality of sub-areas to be filled according to the distance from the side of the chip (3); Establishing a one-to-one correspondence between the side of the chip (3) and the sub-area to be filled; The posture of the substrate (2) is adjusted so that each sub-area to be filled is located at the lowest point of gravity of the packaging surface in turn, and the first glue is used to form a solidification blockage (4) on the side of the chip (3) corresponding to each sub-area to be filled and its adjacent side, wherein the height of the solidification blockage (4) on the adjacent side matches the height of the corresponding sub-area to be filled.

4. The method for filling a ball grid array package chip with a filler according to claim 3, wherein: The method of using the first glue to form a solidified enclosure (4) that semi-surrounds the area to be filled (10) comprises: Using the first glue to form a solidified enclosure (4) capable of sealing the first gap between the side edge of the chip (3) and its adjacent edge and the substrate (2); Alternatively, a tool (9) matching the side of the chip (3) is obtained, and the tool (9) is used to seal the first gap between the side of the chip (3) and its adjacent side and the substrate (2), and the first glue forms a solidified enclosure (4) connecting the tool (9) and the substrate (2).

5. The method for filling a ball grid array package chip with a filler according to claim 1, wherein: The filling of the area to be filled (10) with the filling glue through the opening of the solidification enclosure (4) includes: The area to be filled (10) is divided according to the density of the solder joints, and the filling glue is filled in the order of the solder joint density from high to low.

6. The method for filling a ball grid array package chip with filler according to claim 1, wherein: The step of adjusting the posture of the substrate (2) so that the packaging surface between the substrate (2) and the chip (3) is parallel to the gravity line and the area to be filled (10) is located at the lowest point of gravity on the packaging surface further includes: Obtaining an adjustable fixation splint (7); Adjusting the spacing of the adjustable fixing clamps (7) to be larger than that of the base plate (2); After a portion of the substrate (2) with adjusted posture is placed into the adjustable fixing clamp (7), the spacing between the adjustable fixing clamp (7) is adjusted to clamp the substrate (2).

7. The method for filling a ball grid array package chip with filler according to claim 1, wherein: The filling of the area to be filled (10) with the filling glue through the opening of the solidification containment (4) includes using an air-controlled filling glue hose to perform pulse filling at certain time intervals.

8. The method for filling a ball grid array package chip with filler according to claim 7, wherein: The filling of the area to be filled (10) with the filling glue through the opening of the solidified containment (4) also includes placing a detectable floating object in the area to be filled (10) away from one end of the air-controlled filling glue tube, and stopping the filling of the filling glue according to the positional relationship between the position of the detectable floating object and the area to be filled (10).

9. A filling assembly that can be used in the method for filling a ball grid array package chip according to any one of claims 1 to 8, characterized in that: include, An adjustable fixing clamp (7) for clamping the substrate (2) to fix the posture of the substrate (2); A tool (9) matches the side size of the chip (3), and the tool (9) is used to block the first gap between the side of the chip (3) and its adjacent side and the substrate (2); the tool (9) is made of transparent acrylic material; A first glue for forming a solidified enclosure (4) that semi-surrounds the area to be filled (10); A filling rubber hose (1) is used to fill the area to be filled (10) with filling rubber through the opening of the curing block (4).

10. The filling assembly according to claim 9, characterized in that: It also includes a fixed base (6), the fixed base (6) and the adjustable fixed splint (7) are connected by bolts (8), the fixed base (6) and the adjustable fixed splint (7) can be used to clamp the substrate (2), and the bolts (8) are used to adjust the distance between the fixed base (6) and the adjustable fixed splint (7); the working surfaces of the fixed base (6) and the adjustable fixed splint (7) for clamping the substrate (2) are both provided with flexible pads (5).

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