Automatic chip pressing equipment and pressing control method thereof

Abstract

The invention provides automatic chip pressing equipment and a pressing control method thereof.The automatic chip pressing equipment comprises a rack, a bearing table, a pressing device and a control system, the bearing table is installed on the rack, the pressing device is located above the bearing table, the pressing device comprises a pressing mechanism and an adjusting mechanism, the pressing mechanism comprises a fixing plate, a pressing plate and a buffer unit, and the adjusting mechanism is located above the fixing plate. The buffer unit comprises a plurality of springs arranged between the fixing plate and the pressing plate, a first pressure sensor is arranged between each spring and the pressing plate, or a first pressure sensor is arranged between each spring and the fixing plate. The control system controls the adjusting mechanism to adjust and control the pressing force of the pressing plate at the springs according to detection signals of the first pressure sensors. The invention further provides a pressing control method of the automatic chip pressing equipment. The automatic chip pressing equipment can achieve dynamic compensation of pressing force when the spring fails in the pressing test process.

Description

Technical Field

[0001] The present invention relates to the technical field of chip pressing test, and in particular to an automatic chip pressing device and a pressing control method of the automatic chip pressing device. Background Art

[0002] Chip pressing test is a crucial step in the chip manufacturing and packaging process. Its main function is to verify the connection quality between the chip and the substrate, lead frame or other carriers, to ensure that the chip can work stably and meet the design performance requirements. Existing chip pressing tests are usually completed by automatic chip pressing equipment. Existing automatic chip pressing equipment includes a frame, a pressing device, a carrier, a driving device and a control system. The pressing device includes a connecting frame and a pressing mechanism. The connecting frame is slidably connected to the frame in the height direction of the frame. The carrier is installed on the frame and is located below the pressing mechanism. The driving device is installed on the frame and connected to the connecting frame. The driving device is used to drive the pressing device to move toward the carrier, so that the pressing mechanism cooperates with the carrier to apply pressing force to the chip to ensure that the test can be carried out stably. The control system is used to control the driving device to perform related driving actions. Among them, the pressing mechanism includes a fixed plate, a pressure plate and a spring assembly. The fixed plate is connected to the connecting frame. The spring assembly is arranged between the fixed plate and the pressure plate, so that when the pressing mechanism presses the chip, the spring assembly can play a role of buffering and shock absorption to protect the chip, and can enable the pressure plate to apply uniform pressure to the chip during the pressing process. Furthermore, it also enables the chip pressing test to have thickness adaptive capabilities for the chip.

[0003] However, during the operation of the chip automatic pressing equipment, the spring will be repeatedly compressed and released, so that the spring may fail at a certain point in time; and since the existing chip automatic pressing equipment does not have a response mechanism to deal with it, when a spring fails, when the subsequent pressing plate presses the chip, the pressing plate is prone to overpressure at the failed spring, which will lead to The existence of warping or warping tendency makes the flatness of the pressure plate not meet the standard, reduces the pressing accuracy, and also makes the pressing force of the pressure plate on the chip unbalanced, which can easily cause local overvoltage or undervoltage of the chip, thereby damaging the chip. Summary of the Invention

[0004] In order to solve the above problems, the first object of the present invention is to provide an automatic chip pressing device that can realize dynamic compensation of the pressing force when the spring fails.

[0005] A second object of the present invention is to provide a chip automatic pressing control method.

[0006] In order to achieve the first purpose of the present invention, the present invention provides a chip automatic pressing equipment, including a frame, a carrier platform, a pressing device and a control system, the carrier platform is installed on the frame, and the pressing device is located above the carrier platform, wherein the pressing device includes a pressing mechanism and an adjustment mechanism, the pressing mechanism includes a fixed plate, a pressure plate and a buffer unit, the buffer unit includes a plurality of springs arranged between the fixed plate and the pressure plate, a first pressure sensor is provided between each spring and the pressure plate, or a first pressure sensor is provided between each spring and the fixed plate, during the pressing operation, the control system controls the adjustment mechanism according to the detection signal of each first pressure sensor to adjust the pressing force of the pressure plate at each spring.

[0007] As can be seen from the above, a first pressure sensor is configured for each spring to detect its elastic force, and cooperate with the adjustment mechanism so that when a spring fails during the pressing process of the pressing device on the chip, the control system can promptly control the adjustment mechanism to adjust the pressing force of each spring at the pressure plate according to the feedback of each first pressure sensor, thereby avoiding the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to spring failure, ensuring that the overall force of the chip is balanced when pressed, reducing the chance of chip damage, and also preventing slightly failed springs from aggravating the failure rate and / or preventing other springs in normal state from aggravating the failure rate.

[0008] A preferred solution is that the adjustment mechanism includes a plurality of linear actuators, the plurality of linear actuators correspond one-to-one to the plurality of springs and the plurality of first pressure sensors, and the linear actuators are arranged at the corresponding springs.

[0009] As can be seen from the above, each spring is equipped with an independently controllable linear actuator. When a spring fails, each linear actuator can accurately adjust the pressing force of the pressure plate at each spring according to the pressure value of the failed spring to ensure that the pressure plate can apply a balanced pressing force to the chip, avoiding damage to the chip due to excessive local force.

[0010] A further solution is that the housing of the linear actuator is fixedly connected to the frame, and the driving end of the linear actuator is fixedly connected to the fixing plate.

[0011] As can be seen from the above, this design enables the adjustment mechanism to not only adjust the pressing force of the pressure plate at each spring according to the failed spring, but also drive the pressing mechanism to press and release relative to the chip and control the pressing mechanism to apply a set pressing force to the chip.

[0012] Another further solution is that the chip automatic pressing equipment also includes a driving device and a sliding frame. The driving device is installed on the frame and electrically connected to the control system. The sliding frame is slidably connected to the frame. The sliding frame is connected between the driving end of the driving device and the fixed plate. The housing of the linear actuator is fixedly connected to the fixed plate and / or the sliding frame, and the driving end of the linear actuator is fixedly connected to the pressure plate.

[0013] As can be seen from the above, the pressing mechanism applies a set pressing force to the chip through the cooperation of the drive device and the sliding frame, while the adjustment mechanism is mainly used to adjust the pressing force of the pressure plate at each spring. This design helps the adjustment mechanism to more accurately adjust the pressing force of the pressure plate at each spring, reducing the requirements for the linear actuator.

[0014] Another preferred solution is that the chip automatic pressing equipment also includes a driving device and a sliding frame, the driving device is installed on the frame and electrically connected to the control system, the sliding frame is slidably connected to the frame, and the sliding frame is connected between the driving end of the driving device and the fixed plate; the spring is made of shape memory alloy, and the adjustment mechanism includes multiple stimulation modules, and the multiple stimulation modules correspond one-to-one to the multiple springs and the multiple first pressure sensors; the stimulation module is a heater, and the heater can heat the corresponding spring, or the stimulation module is an electrode group, and the electrode group includes two conductive electrodes electrically connected to the corresponding spring.

[0015] As can be seen from the above, the pressing mechanism applies a set pressing force to the chip through the cooperation of the driving device and the sliding frame. Since the spring is made of shape memory alloy, when the spring fails, the stimulation module can be used to stimulate the spring, thereby prompting the spring to return to its original state, and then the spring restores its buffering performance, ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process.

[0016] A further solution is that the chip automatic pressing equipment also includes a laser rangefinder and a temperature probe. The laser rangefinder is electrically connected to the control system. The laser rangefinder is used to measure the flatness of the chip placement part of the carrier. The temperature probe is installed on the pressing plate and is electrically connected to the control system.

[0017] As can be seen from the above, the configuration of the laser rangefinder to detect the chip placement part ensures that the flatness of the chip placement part meets the pressing requirements, thereby further preventing the chip from being damaged during the pressing process due to uneven force; the setting of the temperature probe makes it convenient for users and control systems to timely understand the chip temperature changes when performing high and low temperature tests on the chip.

[0018] Another further solution is that the chip automatic pressing equipment also includes a second pressure sensor and a pressure buffer pad, the second pressure sensor is connected between the sliding frame and the driving device, the second pressure sensor is electrically connected to the control system, and the pressure buffer pad is connected between the second pressure sensor and the driving device.

[0019] As can be seen from the above, when the source of the set pressing force applied by the pressing mechanism to the chip is the driving device, by setting up a second pressure sensor, the control system and the user can understand the magnitude of the pressing force in real time; and the pressure buffer pad can buffer the pressure applied by the driving device to avoid damage to the sliding frame, chip, etc.

[0020] In order to achieve the second purpose of the present invention, the present invention provides a pressing control method for a chip automatic pressing device, wherein the chip automatic pressing device is the above-mentioned chip automatic pressing device, and the pressing control method includes: obtaining the spring pressure value detected by each first pressure sensor, and judging whether the corresponding spring fails according to each spring pressure value; if a spring fails, adjusting the pushing force of each linear actuator according to the spring pressure value of the failed spring.

[0021] As can be seen from the above, through the pressing control method provided by the present invention, when a spring fails, the chip automatic pressing equipment can automatically adjust the pressing force of each spring at the pressure plate through the adjustment mechanism, thereby avoiding the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to spring failure, ensuring that the overall force is balanced when the chip is pressed, reducing the chance of chip damage, and at the same time preventing slightly failed springs from aggravating the failure rate and / or preventing other springs in normal state from aggravating the failure rate.

[0022] A further solution is that the buffer unit includes four springs, which are arranged in a rectangular row, and the number of linear actuators is equal to the number of springs; the step of adjusting the pushing force of each linear actuator according to the spring pressure value of the failed spring includes: calculating a compensation amount, where the compensation amount is the arithmetic mean of the spring pressure values ​​of the other three non-failed springs minus the spring pressure value of the failed spring; if the compensation amount is less than a preset threshold, adjusting the pushing force of two linear actuators arranged non-diagonally with the failed spring according to the compensation amount, so that the pushing force of the two linear actuators is greater than the pushing force of the other two linear actuators; if the compensation amount is greater than or equal to the preset threshold, adjusting the pushing force of the linear actuator corresponding to the failed spring according to the compensation amount, so that the pushing force of the linear actuator is less than the pushing force of the other three linear actuators.

[0023] As can be seen from the above, by setting the number of springs, it can meet the chip testing requirements, achieve excellent buffering effect, and reduce equipment costs and control difficulty. Based on the distribution setting of the springs, different dynamic compensation schemes are provided according to the failure degree of the failed springs, which can slow down the failure rate of slightly failed springs and extend the service life of normal springs. At the same time, it can also prevent chip damage caused by uneven force and inaccurate test results.

[0024] In order to achieve the second purpose of the present invention, the present invention also provides a pressing control method for a chip automatic pressing device, wherein the chip automatic pressing device is the above-mentioned chip automatic pressing device, and the pressing control method includes: obtaining the spring pressure value detected by each first pressure sensor, and judging whether the corresponding spring is failed according to each spring pressure value; if a spring fails, controlling the stimulation module corresponding to the failed spring to stimulate the failed spring, so that the failed spring returns to its original state.

[0025] As can be seen from the above, the pressing control method provided by the present invention is based on a spring made of shape memory alloy. When the spring fails, the spring can be stimulated by the stimulation module, thereby prompting the spring to return to its original state, and then the spring to restore its buffering performance, ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of the first embodiment of the chip automatic pressing equipment of the present invention.

[0027] Figure 2 This is a schematic structural diagram of the first embodiment of the chip automatic pressing equipment of the present invention after omitting some components.

[0028] Figure 3 This is a schematic structural diagram of the second embodiment of the first embodiment of the chip automatic pressing device of the present invention after omitting some components.

[0029] Figure 4 It is a cross-sectional schematic diagram of the third embodiment of the first embodiment of the chip automatic pressing equipment of the present invention with some components omitted.

[0030] Figure 5 This is a schematic structural diagram of the second embodiment of the chip automatic pressing equipment of the present invention after omitting some components.

[0031] Figure 6 This is a schematic structural diagram of the second embodiment of the chip automatic pressing device of the present invention after omitting some components.

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0033] First embodiment of chip automatic pressing equipment Reference Figure 1 The chip automatic pressing device 100 includes a frame 1, a carrier 2, a pressing device 3, a driving device 4, a sliding frame 5, a temperature probe 6, a second pressure sensor 7, a pressure buffer pad 8 and a control system 9.

[0034] The carrier 2 is mounted on the frame 1. It provides space for the chip and positions it. It then cooperates with the pressing device 3 to secure the chip and apply a predetermined pressing force to it during the press-fit test. The carrier 2 includes a chip placement plate 21, support columns 22, a support group 23, and a base plate 24. The chip placement plate 21 is typically a PCB board, which is electrically connected to the control system 9. During the chip press-fit test, the chip-related parameters are fed back to the control system 9, allowing the control system 9 to determine whether the chip is qualified based on the fed-back parameters.

[0035] The support columns 22 are connected between the base plate 24 and the chip placement plate 21 to ensure the overall strength of the carrier 2 and facilitate the installation of the support group 23. The base plate 24 is fixedly mounted on the frame 1. The support group 23 is arranged between the chip placement plate 21 and the base plate 24, wherein the support group 23 is located below the chip placement portion 211 of the chip placement plate 21. When the pressing device 3 applies a pressing force to the chip, it ensures that the pressing force on the chip meets the test requirements and that stable communication is established between the chip and the chip placement plate 21. In addition, it can enhance the structural strength of the chip placement plate 21 at the chip placement portion 211, preventing the chip and the chip placement portion 211 from being offset during the pressing test, and preventing damage to the chip and / or the chip placement plate 21.

[0036] In some embodiments, the chip automatic pressing device 100 is also provided with a laser rangefinder, which is mounted on the frame 1 and electrically connected to the control system 9. The laser rangefinder is used to measure the flatness of the chip placement portion 211 of the chip placement plate 21 to ensure that the flatness of the chip placement portion 211 meets the pressing requirements, thereby preventing the chip from being damaged due to uneven force during the pressing process. Preferably, the height difference at the four corners of the chip placement portion 211 corresponding to the chip is less than or equal to 5 microns. Furthermore, before each chip pressing test, the chip automatic pressing device 100 first detects the flatness of the chip placement portion 211 using a laser rangefinder, and when the flatness of the chip placement portion 211 does not meet the flatness requirements, an alarm is issued through the display screen of the control system 9 and / or the sound and / or light alarm provided in the chip automatic pressing device 100, thereby reminding the user to adjust the chip placement plate 21 in time.

[0037] The pressing device 3 is arranged above the supporting platform 2, and is combined with Figures 2 to 4 The pressing device 3 includes a pressing mechanism 31 and an adjusting mechanism 32. The pressing mechanism 31 includes a fixed plate 311, a pressing plate 312, a buffer unit 313, and a first pressure sensor 314. Since the chip automatic pressing device 100 of this embodiment is provided with a driving device 4 and a sliding frame 5, the fixed plate 311 in this embodiment is connected to the sliding frame 5.

[0038] The pressing plate 312 is movable relative to the fixed plate 311 in the pressing direction of the pressing device 3. The sliding connection between the pressing plate 312 and the fixed plate 311 is conventional and will not be described in detail here. A buffer unit 313 is provided between the fixed plate 311 and the pressing plate 312 to relieve and buffer pressure during the pressing test, thereby evenly balancing the forces on the chip during the pressing test and preventing damage.

[0039] The buffer unit 313 includes a plurality of springs 3131, and the plurality of springs 3131 are arranged between the fixed plate 311 and the pressure plate 312; for example, in this embodiment, the number of springs 3131 is four, and the four springs 3131 are distributed in a rectangular array, wherein the fixed plate 311 and the pressure plate 312 both have a four-corner structure similar to a rectangle, and the four springs 3131 correspond one-to-one to the four corners of the pressure plate 312, so that one spring 3131 is arranged close to a corner of the pressure plate 312.

[0040] Furthermore, the bottom of the pressure plate 312 has a pressing portion 3121, so that the pressure plate 312 contacts the chip through the pressing portion 3121 and applies a pressing force to the chip. The pressing portion 3121 is in the shape of a rectangular block, and four springs 3131 are provided at the four corners of the rectangular block to better ensure the balance of pressure on the chip.

[0041] Furthermore, in this embodiment, the first pressure sensors 314 are disposed between the springs 3131 and the pressure plate 312. The number of first pressure sensors 314 is equal to the number of springs 3131, such that a first pressure sensor 314 is disposed between each spring 3131 and the pressure plate 312. The first pressure sensors 314 are configured to cyclically detect the elastic force of the springs 3131 connected thereto according to a predetermined detection cycle and provide feedback to the control system 9. This allows the control system 9 to determine whether the corresponding spring 3131 has failed based on the detection signal fed back by each first pressure sensor 314. It will be appreciated that in other embodiments, the first pressure sensors 314 may also be disposed between the springs 3131 and the fixed plate 311.

[0042] When the spring 3131 fails, the pressure plate 312 in the area where the failed spring is located loses its elastic support during the chip pressing process. Therefore, the pressure at the position of the failed spring will be directly transmitted by the driving force of the connecting plate 52 (as in the present embodiment, the pressure at the position of the failed spring is directly transmitted by the downward driving force transmitted by the driving device 4), thereby causing a sudden increase in local pressure (i.e., the area where the failed spring is located); at this time, since the pressure on the chip at the failed spring is greater than the pressure on other normal springs 3131, the chip and / or the chip placement plate 21 are prone to over-pressure in the area where the failed spring is located, which can easily lead to problems such as breakage, solder joint crushing, and circuit layer damage.

[0043] To address this issue, the present invention uses an adjustment mechanism 32 to dynamically compensate for failed springs during the pressing process. This ensures that even after a spring 3131 fails, the pressing device 3 can still ensure that the pressure plate 312 applies balanced pressure to the chip, preventing damage to the chip. Furthermore, the adjustment mechanism 32 can also slow the failure rate of spring 3131 when the spring 3131 fails only slightly, thereby extending the service life of spring 3131 (for this purpose, see the first embodiment of the pressing control method described below). It can be seen that during the pressing operation, the control system 9 controls the adjustment mechanism 32 to adjust the pressing force of the pressure plate 312 on each spring 3131 based on the detection signals from each first pressure sensor 314.

[0044] In this embodiment, the adjustment mechanism 32 includes a plurality of linear actuators 321. Each linear actuator 321 corresponds to a plurality of springs 3131 and a plurality of first pressure sensors 314. Each linear actuator 321 is located at a corresponding spring 3131, thereby facilitating adjustment of the pressing force of the pressure plate 312 at each spring 3131 based on the failure of the spring 3131. In other words, in this embodiment, there are four linear actuators 321. By assigning an independently controllable linear actuator 321 to each spring 3131, if a spring 3131 fails, each linear actuator 321 can precisely adjust the pressing force of the pressure plate 312 at each spring 3131 based on the pressure value of the failed spring. This ensures that the pressure plate 312 applies a balanced pressing force to the chip, preventing damage to the chip due to excessive localized force.

[0045] In this embodiment, the linear actuator 321 is a pneumatic cylinder. Those skilled in the art are well aware that, given a constant elongation, the pressing force can be adjusted by adjusting the air pressure. It is understood that in some embodiments, the linear actuator 321 may also be a servo electric cylinder, a hydraulic cylinder, or other types of linear actuator 321. These linear actuators 321 can all meet the requirement for differential force control at the same elongation.

[0046] Because this embodiment includes a drive device 4 and a slide frame 5, the pressing force applied by the pressure plate 312 to the chip is primarily provided by the drive device 4. Consequently, the housing of the linear actuator 321 is fixedly connected to the fixed plate 311 and / or the slide frame 5, while the driving end of the linear actuator 321 is fixedly connected to the pressure plate 312. Thus, in this embodiment, the pressing mechanism 31 applies the set pressing force to the chip via the cooperation of the drive device 4 and the slide frame 5. Therefore, the adjustment mechanism 32 is primarily used to adjust the pressing force of the pressure plate 312 at each spring 3131. This design allows the adjustment mechanism 32 to more accurately adjust the pressing force of the pressure plate 312 at each spring 3131 (compared to fine-tuning the pressing force of the linear actuator 321 at the upper limit of the maximum pressing force, adjusting the pressing force only at the lower upper limit of the pressing force is more precise and easier to control), thus reducing the requirements placed on the linear actuator 321.

[0047] The sliding frame 5 includes a plurality of sliding columns 51 and a connecting plate 52. The plurality of sliding columns 51 are connected between the connecting plate 52 and the fixed plate 311 of the pressing mechanism 31. The number of sliding columns 51 is preferably equal to the number of linear actuators 321. For example, in the present embodiment, the number of sliding columns 51 is four, so that one sliding column 51 is provided at one spring 3131. Preferably, the sliding column 51 can be a hollow cylinder. On the one hand, it can reduce the weight of the sliding frame 5. On the other hand, the hollow interior of the sliding column 51 can be used to accommodate the linear actuator 321, thereby making the size selection range of the linear actuator 321 wider, avoiding the need to design a linear actuator 321 of a specific size due to the small spacing between the fixed plate 311 and the pressing plate 312. At the same time, it also makes the optional types of the linear actuator 321 wider, avoiding the problem that some types of linear actuators 321 cannot be manufactured due to the small spacing between the fixed plate 311 and the pressing plate 312.

[0048] The connecting plate 52 is used to connect to the driving end of the driving device 4, allowing the driving device 4 to drive the pressing device 3 to move via the sliding frame 5. On the other hand, the connecting plate 52 cooperates with the fixed plate 311 to enhance the overall structural strength of the connecting frame and support the multiple sliding columns 51. The sliding columns 51 are slidably connected to the frame 1 along the pressing direction of the pressing device 3.

[0049] The drive device 4 preferably employs a hydraulic-pneumatic device, which offers the advantages of low cost, high cleanliness, rapid response, and high safety. The drive device 4 is connected to a control system 9 for control and operation thereof. A second pressure sensor 7 is connected between the connecting plate 52 and the drive end of the drive device 4 and is electrically connected to the control system 9. The second pressure sensor 7 is used to detect the pushing force provided by the drive device 4 (i.e., the pressing force required for chip pressing tests), ensuring that the chip is pressed under the set pressing force. This also prevents abnormal pushing force from the drive device 4, thus protecting the chip.

[0050] The pressure buffer pad 8 is connected between the second pressure sensor 7 and the driving end of the driving device 4. The pressure buffer pad 8 is used to buffer the pushing force applied by the driving device 4 during the pressing process to avoid damaging the sliding frame 5, the chip, etc.

[0051] The temperature probe 6 is mounted on the pressure plate 312 and is electrically connected to the control system 9. The temperature probe 6 allows the user and the control system 9 to promptly monitor chip temperature changes during high and low temperature testing. A cable connects the temperature probe 6 and the control system 9. To prevent the pressure mechanism 31 from shifting and damaging the temperature probe 6 due to vertical movement, a connecting tube 61 is provided between the temperature probe 6 and the control system 9 to accommodate the cable. A connecting tube bracket 11 is provided on the rack 1 to limit and secure the connecting tube 61.

[0052] In addition, the control system 9 may include a built-in AI module to record the pressure feedback from each spring 3131 at each pressing node, and to learn and analyze the historical pressure data of each spring 3131 through a set training program. This allows the AI ​​module to predict the life of the spring 3131, thereby triggering the adjustment mechanism 32 to perform maintenance or adjustment on the spring 3131 in advance, thereby avoiding sudden failure of the spring 3131. In addition, after learning the historical pressure changes of each spring 3131, the AI ​​module can also predict the failure trend of each spring 3131 based on the historical pressure data of each spring 3131, thereby enabling the adjustment mechanism 32 to perform pre-compensation processing in advance, such as performing buffering adjustments during the aging stage of the spring 3131. For example, if the AI ​​module discovers that the parameters of the spring 3131 are abnormal, it can provide adjustment suggestions for the pressing test based on the learning and analysis results, such as reducing the pressing speed by 10% to extend the life of the spring 3131.

[0053] In summary, it can be seen that by configuring a first pressure sensor 314 for each spring 3131 to detect the pressure of the spring 3131, and cooperating with the adjustment mechanism 32, when a spring 3131 fails during the chip pressing process of the pressing device 3, the control system 9 can timely control the adjustment mechanism 32 to adjust the pressing force of each spring 3131 at the pressure plate 312 according to the feedback of each first pressure sensor 314, so as to dynamically compensate for the pressing force of the failed spring, thereby avoiding the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to the failure of the spring 3131, ensuring that the overall force of the chip is balanced when being pressed, reducing the chance of chip damage, and at the same time preventing slightly failed springs from aggravating the failure rate and / or preventing other springs 3131 in normal state from aggravating the failure rate.

[0054] For example, based on the distribution of springs 3131 in this embodiment, when a spring 3131 experiences a minor failure, the control system 9 calculates a compensation amount and, based on the compensation amount, adjusts the linear actuators 321 corresponding to the two normally functioning springs 3131 adjacent to the failed spring (i.e., the two springs 3131 disposed non-diagonally with the failed spring), thereby ensuring that the pushing force of these two linear actuators 321 is greater than the pushing force of the remaining two linear actuators 321 (i.e., the linear actuator 321 corresponding to the failed spring and the linear actuator 321 corresponding to the springs 3131 disposed on the same diagonal as the failed spring). When a spring 3131 experiences a major failure, the control system 9 calculates a compensation amount and, based on the compensation amount, adjusts the linear actuator 321 corresponding to the failed spring.

[0055] Second embodiment of chip automatic pressing equipment The difference between this embodiment and the first embodiment of the chip automatic pressing equipment is that, in this embodiment: The driving device 4, the sliding frame 5, the second pressure sensor 7 and the pressure buffer pad 8 provided in the first embodiment of the chip automatic pressing device are cancelled; and Figure 5 and Figure 6 As shown, the housing of the linear actuator 321A of the adjustment mechanism 32A is fixedly connected to the frame, and the driving end of the linear actuator 321A is fixedly connected to the fixed plate 311. To ensure the structural strength of the linear actuator 321A, the adjustment mechanism 32A also includes a fixed base 322, and each linear actuator 321A is connected to the fixed base 322.

[0056] In this embodiment, in addition to adjusting the pressing force of the pressure plate at each spring according to the failed spring, each linear actuator 321A of the adjustment mechanism 32A also has the function of the above-mentioned driving device 4, that is, the adjustment mechanism 32A also drives the pressing mechanism 31 to press and release relative to the chip and controls the pressing mechanism 31 to apply a preset pressing force to the chip.

[0057] The above design can reduce the number of devices of the chip automatic pressing equipment, simplify the structure of the chip automatic pressing equipment and reduce the production cost.

[0058] Third embodiment of chip automatic pressing equipment The difference between this embodiment and the first embodiment of the chip automatic pressing equipment lies in the voltage regulating mechanism. Specifically, in this embodiment: The voltage regulating mechanism no longer includes multiple linear actuators, but includes multiple stimulation modules; and the springs in this embodiment are made of shape memory alloy, and the multiple stimulation modules correspond one-to-one to the multiple springs.

[0059] As an optional solution, the stimulation module can be a heater, so that the heater can be controlled by the control system to heat the corresponding spring to restore the spring to its initial state.

[0060] As another optional solution, the stimulation module may be an electrode group, which includes two conductive electrodes electrically connected to corresponding springs. The two conductive electrodes are preferably connected at both ends of the springs. The electrode group can be controlled by a control system to apply voltage to the corresponding springs, thereby restoring the springs to their initial state.

[0061] By setting up the pressure regulating mechanism of this embodiment, when a spring fails, the spring can be stimulated by the stimulation module. Since the spring is made of shape memory alloy, the spring returns to its initial state after being stimulated, thereby restoring the spring from the failed state to the normal state.

[0062] It can be seen that the pressing mechanism applies the set pressing force to the chip through the cooperation of the driving device and the sliding frame. Since the spring is made of shape memory alloy, when the spring fails, the stimulation module can be used to stimulate the spring, thereby prompting the spring to return to its original state, and then the spring restores its buffering performance, ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process.

[0063] It should be noted that in some embodiments, the pressure regulating mechanism may include multiple linear actuators and multiple stimulation modules. In this case, the multiple linear actuators can be arranged in the same manner as described in the first or second embodiments of the automatic chip lamination equipment, and the multiple stimulation modules can be arranged in the same manner as described in this embodiment. This allows the multiple linear actuators and the multiple stimulation modules to complement each other, thereby making the maintenance of the automatic chip lamination equipment more convenient. It is understood that when the multiple linear actuators are arranged in the manner described in the second embodiment of the automatic chip lamination equipment, the drive device, slide frame, second pressure sensor, and pressure buffer pad can be eliminated.

[0064] First embodiment of the pressing control method The pressing control method of this embodiment is applied to the chip automatic pressing device described in the first embodiment or the second embodiment of the chip automatic pressing device. The pressing control method includes: If the automatic chip lamination equipment is equipped with a drive device, the drive device is controlled to drive the lamination mechanism via a sliding frame toward the chip placed on the chip placement plate, and a detection signal fed back by the second pressure sensor is obtained. The drive device is then regulated to drive the lamination mechanism according to a preset pushing force. If the automatic chip lamination equipment is not equipped with a drive device, the adjustment mechanism is controlled to drive the lamination mechanism toward the chip placed on the chip placement plate, and the adjustment mechanism is regulated to drive the lamination mechanism according to the preset pushing force.

[0065] After the pressure plate contacts the chip, the spring pressure values ​​detected by each first pressure sensor are obtained, and whether the corresponding spring has failed is determined based on each spring pressure value; if a spring fails, the pushing force of each linear actuator is adjusted based on the spring pressure value of the failed spring.

[0066] The step of adjusting the pushing force of each linear actuator according to the spring pressure value of the failed spring includes: Calculate compensation amount , compensation amount The compensation value is the arithmetic mean of the spring pressure values ​​of the other three non-failed springs minus the spring pressure value of the failed spring. For example, after a spring fails, its elastic force usually decreases or loses its elasticity. Assuming that the spring pressure value of the failed spring is F2, the spring pressure values ​​of the other three non-failed springs are F1, F3, and F4 respectively. At this time, the compensation value is .

[0067] Next, determine the compensation amount Is it less than the preset threshold? If the compensation amount If it is less than the preset threshold, the compensation amount Adjust the pushing force of the two linear actuators that are non-diagonally arranged with respect to the failure spring (this can be done by increasing or decreasing the pushing force of the driving end of the linear actuator while maintaining the same elongation of each linear actuator) so that the pushing force of the two linear actuators is greater than that of the other two linear actuators.

[0068] For example, if the spring pressure value of the spring that is set diagonally to the failed spring (corresponding to the spring pressure value F2) is F1, then when performing pressure balance compensation, the compensation amount The force is added to the two linear actuators that are not diagonally arranged with the failure spring, so that the pushing force of the two linear actuators is greater than the pushing force of the other two linear actuators (i.e., the linear actuator corresponding to the failure spring and the linear actuator corresponding to the spring on the diagonal line with the failure spring). When it is less than the preset threshold, it means that the spring is slightly failed. Therefore, the spring pressure value at the failed spring during the pressing process will not be too large compared to the spring pressure values ​​of other normal springs. By increasing the pressure at the two corners of the pressure plate adjacent to the failed spring (the normal spring can be used for buffering and pressure relief to avoid excessive local pressing force), the pressing requirements can be met. The purpose of not applying pressure to the corners opposite to the failed spring is to avoid aggravating the uneven distribution of pressing force and causing test failure and / or chip damage. It can be seen that when the spring is slightly failed, compensation is not directly applied to the corner where the failed spring is located, which can avoid the aging of the failed spring from aggravating the failure reaction (delaying aging, and at this time there is no need to replace or repair the failed spring).

[0069] If the compensation is greater than or equal to the preset threshold, then the compensation amount Adjust the pushing force of the linear actuator corresponding to the failure spring so that the pushing force of the linear actuator corresponding to the failure spring is smaller than the pushing forces of the other three linear actuators. When it is greater than or equal to the preset threshold, it means that the spring has seriously failed. If the pushing force of the corresponding linear actuator is not reduced at this time, the pressing force of the pressure plate at the failed spring will be greater than the pressing force of other parts, which will cause the pressing force distribution to be uneven, the chip is easily damaged, and the accuracy of the test results is affected. Among them, when the spring fails seriously, by reducing the pushing force of the corresponding linear actuator, the buffering and pressure relief functions lost by the failed spring are replaced and compensated in turn, so that the pressing force in the area where the failed spring is located during the pressing process is consistent with the pressing force of other parts or within the required difference, thereby balancing the pressing force on the chip. When the chip automatic pressing equipment completes the current pressing test, the control system can alarm the user through a display screen, sound and / or light alarm, etc., to remind the user to replace the seriously failed spring.

[0070] It should be noted that during the chip pressing test, there are usually two pressing stages, one is the dynamic process stage, and the other is the equilibrium state stage. Among them, the regulation of the adjustment mechanism intervenes in the dynamic process stage. During this process, the pressing mechanism initially contacts the chip and needs to use the buffer unit to relieve pressure and buffer to avoid hard impact on the chip. When the pressing mechanism moves to the preset position relative to the chip, the dynamic process stage is basically over. Each first pressure sensor can re-check the spring pressure value at each spring. If the pressure value at the failed spring still does not meet the requirements, it can be adjusted again through the adjustment mechanism.

[0071] It should be noted here that: During the dynamic process stage, if the chip automatic pressing equipment uses the pushing force of the driving device as the source of the pressing force, then in the process of the driving device driving the pressing mechanism to apply the pressing force to the chip, if the spring fails, the adjustment mechanism will intervene to perform dynamic compensation of the pressing force; in the equilibrium state stage, the (control system) controls the driving device through feedback from the second pressure sensor to maintain the preset pushing force until the end of the pressing test.

[0072] If the chip automatic pressing equipment is not equipped with a driving device, a sliding frame, a second pressure sensor and a pressure buffer pad, etc., then in the process of the driving device driving the pressing mechanism to apply a pressing force to the chip, the adjusting mechanism controls the pressing mechanism to apply a pressing force to the chip, and if the spring fails in this process, the cylinder of the adjusting mechanism dynamically compensates for the pressing force. In the equilibrium state stage, the (control system) controls the adjusting mechanism through the first pressure sensor or an additional pressure sensor (used to detect the pressing force applied to the chip) to maintain the preset pushing force until the end of the pressing test.

[0073] Furthermore, if a spring fails during the press-fit test, the control system records the failure time and compensation parameters, generates a log, and can alert the user via a display screen, audible, and / or visual alarm. The AI ​​module records the pressure feedback from each spring at each press-fit node during the press-fit test and, through a pre-set training program, learns and analyzes the historical pressure data for each spring. This allows the AI ​​module to predict the spring's lifespan, triggering maintenance or adjustments to the spring's adjustment mechanism in advance to prevent sudden spring failure. Furthermore, after learning the historical pressure changes of each spring, the AI ​​module can also predict the failure trend of each spring based on its historical pressure data, enabling the adjustment mechanism to perform pre-compensation measures in advance, such as buffering adjustments during the spring's aging phase. For example, if the AI ​​module detects an abnormality in a spring's parameters, it can provide press-fit test adjustment recommendations based on the learning and analysis results, such as reducing the press-fit speed by 10% to extend the spring's lifespan. Furthermore, the control system can display relevant pressure and temperature data on the display screen.

[0074] Second embodiment of the pressing control method The pressing control method of this embodiment is applied to the chip automatic pressing device described in the third embodiment of the above-mentioned chip automatic pressing device. The pressing control method includes: Obtaining the spring pressure value detected by each of the first pressure sensors, and determining whether the corresponding spring has failed according to each of the spring pressure values; If one of the springs fails, the stimulation module corresponding to the failed spring is controlled to stimulate the failed spring so that the failed spring returns to its original state.

[0075] Among them, if the adjustment mechanism does not include a linear actuator, the chip automatic pressing equipment is provided with a driving device, a second pressure sensor, etc., and the driving device drives the pressing mechanism to move toward the chip placed on the chip placement plate. At the same time, by obtaining the detection signal feedback from the second pressure sensor, the driving device is adjusted to drive the pressing device according to the preset pushing force.

[0076] If the adjustment mechanism also includes multiple linear actuators, and the adjustment mechanism is only used as a dynamic compensation for the pressing force (consistent with the role of the linear actuator in the first embodiment of the chip automatic pressing equipment), the chip automatic pressing equipment is provided with a driving device, a second pressure sensor, etc., and the driving device drives the pressing mechanism to move toward the chip placed on the chip placement plate. At the same time, by obtaining the detection signal feedback from the second pressure sensor, the driving device is adjusted to drive the pressing device according to the preset pushing force.

[0077] If the adjustment mechanism also includes multiple linear actuators, and the adjustment mechanism is not only used as a dynamic compensation for the pressing force, but also used to control the pressing mechanism to apply a preset pressing force to the chip (the function of the linear actuator in the second embodiment of the chip automatic pressing equipment is the same), then the chip automatic pressing equipment no longer has to be equipped with a drive device, a sliding frame, a second pressure sensor and a pressure buffer pad, etc.; the pressing mechanism is driven to move toward the chip placed on the chip placement plate by controlling the adjustment mechanism, and the adjustment mechanism is controlled to drive the pressing mechanism according to the preset pushing force.

[0078] Among them, if the adjustment mechanism also includes a linear actuator, a stimulation module, etc., it can better perform dynamic compensation for the pressing force when the spring fails, and improve the service life and maintenance convenience of the chip automatic pressing equipment. At the same time, it can also reduce the risk of compensation not meeting the requirements when only the stimulation module is set.

[0079] Finally, it should be emphasized that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Chip automatic pressing equipment, including a frame, a carrier, a pressing device and a control system, wherein the carrier is mounted on the frame and the pressing device is located above the carrier, characterized in that: The pressing device comprises: A pressing mechanism, the pressing mechanism comprising a fixed plate, a pressing plate, and a buffer unit, the buffer unit comprising a plurality of springs arranged between the fixed plate and the pressing plate, a first pressure sensor being provided between each of the springs and the pressing plate, or a first pressure sensor being provided between each of the springs and the fixed plate; The regulating mechanism controls the regulating mechanism to adjust the pressing force of the pressing plate at each of the springs according to the detection signals of each of the first pressure sensors during the pressing operation.

2. The chip automatic pressing equipment according to claim 1, characterized in that: The adjustment mechanism includes a plurality of linear actuators, and the plurality of linear actuators correspond one-to-one to the plurality of springs and the plurality of first pressure sensors. The linear actuators are arranged at the corresponding springs.

3. The chip automatic pressing equipment according to claim 2, characterized in that: The housing of the linear actuator is fixedly connected to the frame, and the driving end of the linear actuator is fixedly connected to the fixing plate.

4. The chip automatic pressing equipment according to claim 2, characterized in that: The chip automatic pressing equipment also includes: a driving device, the driving device being mounted on the frame and electrically connected to the control system; A sliding frame, wherein the sliding frame is slidably connected to the frame, the sliding frame is connected between the driving end of the driving device and the fixed plate, the housing of the linear actuator is fixedly connected to the fixed plate and / or the sliding frame, and the driving end of the linear actuator is fixedly connected to the pressure plate.

5. The chip automatic pressing equipment according to claim 1, characterized in that: The chip automatic pressing device further includes a driving device and a sliding frame, wherein the driving device is mounted on the frame and electrically connected to the control system, the sliding frame is slidably connected to the frame, and the sliding frame is connected between the driving end of the driving device and the fixed plate; The spring is made of shape memory alloy, and the adjustment mechanism includes a plurality of stimulation modules, and the plurality of stimulation modules correspond one to one with the plurality of springs and the plurality of first pressure sensors; The stimulation module is a heater, which can heat the corresponding spring, or The stimulation module is an electrode group, and the electrode group includes two conductive electrodes electrically connected to the corresponding springs.

6. The chip automatic pressing device according to any one of claims 1 to 5, characterized in that: The chip automatic pressing equipment also includes: A laser rangefinder, electrically connected to the control system, for measuring the flatness of the chip placement portion of the carrier; A temperature probe is mounted on the pressure plate and is electrically connected to the control system.

7. The automatic chip pressing device according to claim 4 or 5, characterized in that: The chip automatic pressing equipment also includes: a second pressure sensor, the second pressure sensor being connected between the sliding frame and the driving device, the second pressure sensor being electrically connected to the control system; A pressure buffer pad is connected between the second pressure sensor and the driving device.

8. A chip automatic pressing device pressing control method, characterized in that: The chip automatic pressing device is the chip automatic pressing device according to any one of claims 2 to 4 above, and the pressing control method includes: Obtaining the spring pressure value detected by each of the first pressure sensors, and determining whether the corresponding spring has failed according to each of the spring pressure values; If one of the springs fails, the pushing force of each of the linear actuators is adjusted according to the spring pressure value of the failed spring.

9. The pressing control method according to claim 8, characterized in that: The buffer unit includes four springs, which are arranged in a rectangular row, and the number of the linear actuators is equal to the number of the springs; The step of adjusting the pushing force of each of the linear actuators according to the spring pressure value of the failure spring comprises: Calculating a compensation amount, the compensation amount being the arithmetic mean of the spring pressure values ​​of the other three non-failed springs minus the spring pressure value of the failed spring; If the compensation amount is less than a preset threshold, adjusting the pushing forces of the two linear actuators that are non-diagonally arranged with respect to the failure spring according to the compensation amount so that the pushing forces of the two linear actuators are greater than the pushing forces of the other two linear actuators; If the compensation amount is greater than or equal to the preset threshold, the pushing force of the linear actuator corresponding to the failure spring is adjusted according to the compensation amount, so that the pushing force of the linear actuator is smaller than the pushing forces of the other three linear actuators.

10. A chip automatic pressing device pressing control method, characterized in that: The chip automatic pressing device is the chip automatic pressing device according to claim 5, and the pressing control method includes: Obtaining the spring pressure value detected by each of the first pressure sensors, and determining whether the corresponding spring has failed according to each of the spring pressure values; If one of the springs fails, the stimulation module corresponding to the failed spring is controlled to stimulate the failed spring so that the failed spring returns to its original state.

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