Integrated composite phase change liquid cooling heat dissipation bottom plate and manufacturing method thereof

Abstract

The invention provides an integrated composite phase change liquid cooling heat dissipation bottom plate and a manufacturing method thereof, the integrated composite phase change liquid cooling heat dissipation bottom plate comprises a first packaging plate, a heat dissipation function plate and a second packaging plate which are pressed together, the heat dissipation function plate and the second packaging plate are integrated with a composite heat dissipation cavity, the heat dissipation function plate is located between the first packaging plate and the second packaging plate, and heat transfer fluid flows in the composite heat dissipation cavity; and at least one surface, in contact with the first packaging plate and the second packaging plate, of the heat dissipation function plate is provided with a composite heat dissipation cavity. The composite heat dissipation cavity is integrated in the heat dissipation bottom plate to form an integrated structure, so that the structure of the heat dissipation bottom plate is simplified, the size is reduced, the cost is reduced, and the heat dissipation efficiency and reliability are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor module packaging technology, and in particular to an integrated composite phase-change liquid-cooled heat dissipation base plate and a manufacturing method thereof. Background Art

[0002] Power semiconductor devices are core components for achieving power conversion and control. They need to withstand high voltage, high current and generate large power losses when working. The lost energy will be converted into heat energy. Integrating multiple power semiconductor devices / chips into a package according to the typical power electronic circuit topology structure forms a power semiconductor module package. The heat of the power semiconductor module is mainly concentrated in the power semiconductor chip. Therefore, a good heat dissipation design is required to dissipate the heat quickly and effectively to the surrounding environment to avoid damage due to excessive temperature.

[0003] The heat dissipation base plate structure corresponding to existing power semiconductor modules is usually made of solid metal (copper or aluminum silicon carbide AlSiC) plate with a thickness of 3mm~8mm. It is divided into a flat base plate indirect heat dissipation structure and a direct cooling heat dissipation structure with integrated Pin-Fin (pin-fin heat dissipation structure). The flat base plate indirect heat dissipation structure forms thermal contact through pressure connection of the radiator and requires the introduction of thermal interface material (such as thermal grease) between the flat base plate and the heat dissipation to dissipate heat. The direct cooling heat dissipation structure is pressure-connected to the heat sink and introduced into the sealing ring to form a sealed cavity. The cooling liquid flows through the cavity under the action of the pump driving force and conducts convection exchange with the Pin-Fin surface to remove heat.

[0004] Whether it is a flat base plate indirect heat dissipation structure or a direct cooling heat dissipation structure, the existing solid metal base plate has insufficient lateral heat transfer capacity. When the power module is working, the heat source is mainly concentrated at the power chip, but the area of ​​the heat dissipation base plate is usually more than 3 to 5 times the area of ​​the semiconductor power chip, resulting in low utilization of the effective heat dissipation area of ​​the heat dissipation base plate. The heat dissipation method mainly relies on vertical heat conduction and the heat convection rate of the external radiator, resulting in increased thermal resistance (that is, vertical thermal resistance is inversely proportional to the effective heat transfer area). In other words, the effective heat dissipation area utilization rate of the heat dissipation base plate in the existing technology is low, the heat dissipation effect is poor and the cost is high. Summary of the Invention

[0005] In view of this, the purpose of the present application is to provide at least an integrated composite phase change liquid cooling heat dissipation base plate and its manufacturing method, by integrating a composite heat dissipation cavity inside the heat dissipation base plate to form an integrated structure and adding a heat transfer fluid in the heat dissipation cavity. Compared with the traditional indirect cooling base plate structure, the external radiator or water tank is eliminated, and the convection cooling and lateral heat dissipation structure are integrated to simplify the structure and reduce the volume. Compared with the traditional direct cooling base plate structure, the thermal resistance is significantly reduced and the cost is greatly reduced. The composite heat dissipation cavity is used to expand the heat transfer direction from the heat source monomer to the entire heat dissipation base plate, thereby improving the heat dissipation efficiency and reliability.

[0006] This application mainly includes the following aspects: In the first aspect, an embodiment of the present application provides an integrated composite phase-change liquid-cooled heat dissipation base plate, which includes a first packaging plate pressed together, a heat dissipation functional plate with an integrated composite heat dissipation cavity, and a second packaging plate. The heat dissipation functional plate is located between the first packaging plate and the second packaging plate, and a heat transfer fluid flows in the composite heat dissipation cavity; at least one side of the heat dissipation functional plate that contacts the first packaging plate and the second packaging plate is provided with a composite heat dissipation cavity.

[0007] In one possible embodiment, the composite heat dissipation cavity includes a first heat dissipation cavity, which is arranged on the side where the heat dissipation functional plate contacts the first packaging plate; a heat transfer fluid injection structure is provided on the exposed side of the first packaging plate opposite to the first heat dissipation cavity; and the first heat dissipation cavity adopts a pulsating heat pipe cooling method.

[0008] In a possible embodiment, the composite heat dissipation cavity also includes a second heat dissipation cavity, which is arranged on the side where the heat dissipation functional plate contacts the second packaging plate; the exposed side of the second packaging plate opposite to the second heat dissipation cavity is provided with two oppositely distributed flow grooves, which are connected to the second heat dissipation cavity, and the second heat dissipation cavity adopts convection cooling.

[0009] In one possible embodiment, the flow groove includes a groove portion and a pipe mouth portion that are integrally connected, the groove portion is connected to the second heat dissipation cavity, and the pipe mouth portion is connected to the external circulating liquid. The flow groove includes a groove portion and a pipe mouth portion that are integrally connected, the groove portion is connected to the second heat dissipation cavity, and the pipe mouth portion is connected to the external circulating liquid. The composite heat dissipation cavity adopts a coiled or geometrically connected cavity structure.

[0010] In the second aspect, the embodiment of the present application also provides a method for manufacturing an integrated composite phase change liquid cooling heat sink base plate, the method comprising: using a punching processing equipment to punch out a first given material sheet metal, a second given material sheet metal and a third given material sheet metal according to a given heat sink size, to obtain a punched first package blank, a heat sink blank and a second package blank; applying a given cleaning agent to clean and dry the first package blank, the heat sink blank and the second package blank according to a preset cleaning process, to obtain a processed first package blank, a heat sink blank and a second package blank; and performing a cleaning process on the processed first package blank, the processed heat sink blank and the processed second package blank. Perform pre-processing in different ways to obtain a pre-processed first packaging board, a pre-processed heat dissipation functional board, and a pre-processed second packaging board; stack the pre-processed first packaging board, the pre-processed heat dissipation functional board, and the pre-processed second packaging board and perform high-temperature welding to form an integrated heat dissipation base plate to be processed, wherein the pre-processed heat dissipation functional board is located between the pre-processed first packaging board and the pre-processed second packaging board; use punching processing equipment to punch out the integrated heat dissipation base plate to be processed according to a given heat dissipation plate size to obtain a finished integrated heat dissipation base plate; add mounting holes at given positions on the finished integrated heat dissipation base plate and clean it to obtain an integrated composite phase change liquid cooling heat dissipation base plate as provided in any of the above embodiments.

[0011] In one possible embodiment, the process of pre-processing the processed first packaging blank includes: spraying high-viscosity stretching oil on the entire processed first packaging blank to obtain a first blank to be stretched, wherein the proposed extraction position is sprayed multiple times until a preset number of times is reached, and the proposed extraction position is the area to be stretched to form a coolant injection structure; stretching the first blank to be stretched multiple times in a manner of gradually shortening the stretching diameter to form a coolant injection structure to obtain the first packaging structure after stretching; performing post-correction processing on the first packaging structure after stretching to obtain a pre-processed first packaging board, wherein the post-correction processing at least includes flatness correction, flange edge removal, cleaning and electrolytic polishing.

[0012] In one possible embodiment, the first packaging structure after stretching is obtained in the following manner: the first blank to be stretched is placed in the stamping die, wherein the proposed withdrawal position is aligned with the concave portion corresponding to the withdrawal stamping die; the convex portion of the first withdrawal stamping punch is aligned with the proposed withdrawal position of the first blank to be stretched; the first withdrawal stamping punch is controlled to perform the first stretching and stamping on the first blank to be stretched at a first given stamping speed and a first given pressure to obtain the first stretched blank, and the stamping time is the first preset time; the first withdrawal stamping punch is replaced with a second withdrawal stamping punch, and the convex portion of the second withdrawal stamping punch is aligned with the center of the groove formed by the first stretching and stamping, and the second withdrawal stamping punch is controlled to perform the first stretching and stamping on the first blank to be stretched at a second given stamping speed and a second given pressure. The blank is stretched and stamped for the second time to obtain a second stretched blank, and the stamping time is the second preset time; the second draw-out stamping punch is replaced with the third draw-out stamping punch, and the convex part of the third draw-out stamping punch is aligned with the center of the groove formed by the first stretching and stamping, and the third draw-out stamping punch is controlled to perform the final stamping on the second stretched blank at a third given stamping speed and a second given pressure until the third draw-out stamping punch penetrates the second stretched blank to obtain the first packaging structure after stretching, wherein the concave diameter of the draw-out stamping die is larger than the convex diameter of the first draw-out stamping punch, the convex diameter of the first draw-out stamping punch is larger than the convex diameter of the second draw-out stamping punch, and the convex diameter of the second draw-out stamping punch is larger than the convex diameter of the third draw-out stamping punch.

[0013] In one possible embodiment, before performing post-correction processing on the first packaging structure after the stretching processing, the method also includes: determining whether the stretching height corresponding to the coolant injection structure reaches a given height; if the stretching height corresponding to the coolant injection structure does not reach the given height, welding a metal pipe of the same size as the top of the coolant injection structure on the top of the coolant injection structure, and the welding length of the metal pipe is the difference between the given height and the stretching height corresponding to the coolant injection structure.

[0014] In one possible embodiment, the process of pre-processing the processed heat sink blank includes: on the target surface where the composite heat sink cavity needs to be set on the heat sink blank after cleaning and drying, processing is performed according to a given processing depth to form the required cavity structure to obtain the processed heat sink blank; using a given cleaning agent to clean the processed heat sink functional plate according to a preset cleaning process to obtain a pre-processed heat sink functional plate.

[0015] In one possible embodiment, the process of pre-processing the processed second packaging blank includes: spraying high-viscosity stretching oil on the processed second packaging blank as a whole to obtain a second blank to be stretched, wherein the proposed stamping position is sprayed multiple times until a preset number of times is reached, and the proposed stamping position is the flow groove processing position; placing the second blank to be stretched in the stamping die, so that the flow groove processing position is aligned with the concave portion of the stamping die; aligning the flow groove punch with the flow groove processing position, and controlling the flow groove punch to stretch and stamp the second blank to be stretched at a fourth given stamping speed and a fourth given pressure to obtain a first stretched blank with a groove portion, and the stamping time is a third preset time; welding a given nozzle portion to the groove portion formed by stretching to obtain a second packaging structure; applying a given cleaning agent to process the second packaging structure according to a preset cleaning process to obtain a pre-processed second packaging board.

[0016] Structurally, the present application is beneficial in that: 1. This application integrates a composite heat dissipation cavity into a heat dissipation base plate, and presses it with two packaging plates to form an integrated structure, eliminating the external radiator or water tank connected to the traditional heat dissipation base plate, streamlining the heat dissipation structure, reducing the volume, and significantly reducing the heat dissipation cost for the power module.

[0017] 2. The integrated phase-change liquid-cooled heat dissipation base provided in the present application adopts a heat dissipation mechanism of a composite heat dissipation cavity and cooling liquid heat circulation, eliminates thermal conductive interface materials, greatly reduces thermal resistance, reduces material and process costs and improves reliability. At the same time, the convection of the fluid flowing in and out of the second cavity channel is used to significantly increase the heat exchange area and efficiency, achieve rapid heat dissipation, and improve heat dissipation efficiency. The cooling liquid in the cavity adopts a pulsating heat pipe cooling method to achieve hot pressure circulation flow in the first cavity, and expand the heat transfer direction from the vertical direction of the heat source monomer to the entire heat dissipation base, thereby improving the lateral heat dissipation capacity and the utilization rate of idle resources of the base, while reducing the risk of semiconductor power chips on the applied power module being burned due to excessive temperature, thereby improving the reliability of the module product.

[0018] 3. The present application sets flow grooves and corresponding nozzles in the second packaging plate of the heat dissipation function plate, and cooperates with the second heat dissipation cavity to enable the external coolant to flow quickly inside and outside to take away the heat of the power module, thereby improving the heat dissipation efficiency. At the same time, it cooperates with the composite heat dissipation cavity to further accelerate heat dissipation, reduce thermal resistance, avoid heat accumulation, significantly reduce the temperature of the power module, and effectively improve the reliability of the power module.

[0019] 4. The integrated phase-change liquid cooling base plate provided in this application can significantly reduce the temperature difference inside the power module, especially between the chip heat sources, effectively reduce the hot spot effect, facilitate the current sharing between parallel semiconductor power chips, and improve the overall reliability of the power module. At the same time, it is small in size and light in weight, suitable for the compact design of high-power density power semiconductor modules, and the installation method is flexible without specific direction requirements, adapting to different application scenarios.

[0020] 5. The heat dissipation base plate provided by the present application adopts an integrated design, which avoids the leakage problem caused by the insufficient pressing between the metal base plate and the radiator or sink in the traditional heat dissipation floor. There is no risk of leakage, and no bending curvature is required, which greatly reduces the difficulty of base plate processing and power module manufacturing, and is conducive to improving the production qualification rate; at the same time, the base plate of the present application does not need to reserve a curvature, and the integrated design avoids the problems of thick solder layer, large thermal resistance and voids caused by excessive curvature of the base plate processing, as well as the problems of high interface thermal resistance, poor sealing and leakage caused by excessive curvature of the base plate processing, and aggravated material deformation when the thermal expansion coefficient of the original ceramic substrate and the power base plate are inconsistent, resulting in rapid rupture of the ceramic substrate and failure. The risk of high interface thermal resistance or welding slippage is further reduced, and the integrated structure has low installation stress, avoiding the problems caused by high installation stress between the metal base plate and the radiator or sink.

[0021] In terms of technology, the present application is beneficial in that: 1. By separating the sheet metal of a given material, the first packaging plate, the heat dissipation function plate and the second packaging plate that form the integrated phase change liquid cooling base plate are processed separately to ensure the qualification rate and precision of each component and improve the product production yield.

[0022] 2. During the processing of the package board, the welding cost is reduced through the stretching process, which reduces the cost while ensuring the consistency of each component.

[0023] 3. The processing of the first packaging board, the heat dissipation functional board and the second packaging board of the present application can be carried out simultaneously, which can shorten the process production cycle.

[0024] 4. This application does not require pre-bending treatment. In the power module manufacturing process, welding is performed directly without the assistance of other jigs (for example, see "CN116275368A"). While improving reliability, it greatly reduces manufacturing costs and is conducive to industrial implementation and coordinated development.

[0025] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 An exploded view of an integrated composite phase-change liquid cooling heat dissipation base plate provided in an embodiment of the present application is shown; Figure 2 A three-dimensional diagram of an integrated composite phase-change liquid cooling heat dissipation base plate provided in an embodiment of the present application is shown; Figure 3 One of the schematic diagrams of a coiled heat dissipation cavity applicable to a first heat dissipation cavity / a second heat dissipation cavity provided in an embodiment of the present application is shown; Figure 4 A second schematic diagram of a coiled heat dissipation cavity suitable for a first heat dissipation cavity / a second heat dissipation cavity provided in an embodiment of the present application is shown; Figure 5 One of the schematic diagrams of a geometrically connected heat dissipation cavity applicable to a first heat dissipation cavity / a second heat dissipation cavity provided in an embodiment of the present application is shown; Figure 6 A second schematic diagram of a geometrically connected heat dissipation cavity suitable for a first heat dissipation cavity / a second heat dissipation cavity provided in an embodiment of the present application is shown; Figure 7 A schematic diagram of a non-connected heat dissipation cavity suitable for a second heat dissipation cavity provided in an embodiment of the present application is shown; Figure 8 A schematic diagram showing the flow of cooling liquid in a composite heat dissipation cavity provided by an embodiment of the present application is shown; Figure 9 A flow chart showing a method for manufacturing an integrated composite phase-change liquid cooling heat dissipation base plate provided in an embodiment of the present application is shown; Figure 10 A flowchart of a manufacturing process of a primary processing first packaging board provided by an embodiment of the present application is shown; Figure 11 A flowchart of a manufacturing process of a preliminary heat dissipation functional plate provided by an embodiment of the present application is shown; Figure 12 A flowchart of a manufacturing process of a primary-processed second packaging board provided by an embodiment of the present application is shown; Figure 13 A top view of a second package blank provided in an embodiment of the present application is shown.

[0028] 11 - first packaging board, 12 - heat dissipation functional board, 13 - second packaging board, 14 - composite heat dissipation cavity, 15 - heat transfer fluid injection structure, 16 - flow groove, 160 - groove portion, 161 - pipe mouth portion, 20 - mounting hole. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of illustration and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowcharts can be implemented out of sequence, and steps without logical context can be reversed or implemented simultaneously. In addition, those skilled in the art, under the guidance of the contents of this application, can add one or more other operations to the flowchart, or remove one or more operations from the flowchart.

[0030] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0031] The heat dissipation base plate structure corresponding to existing power semiconductor modules is usually made of solid metal (copper or aluminum silicon carbide AlSiC) plate with a thickness of 3mm~8mm. It is generally divided into a flat base plate indirect heat dissipation structure and an integrated Pin-Fin direct cooling heat dissipation structure.

[0032] The flat-bottom plate indirect heat dissipation structure includes a flat-bottom heat dissipation substrate and a liquid cooling plate. The flat-bottom heat dissipation substrate and the liquid cooling plate form thermal contact through pressure connection, and a thermal interface material (such as thermal grease) needs to be introduced between the flat-bottom heat dissipation substrate and the liquid cooling plate to reduce thermal resistance. The liquid cooling plate flows through the coolant. When applied to the power module, its heat dissipation path is semiconductor power chip---flat-bottom heat dissipation substrate---thermal grease---liquid cooling plate---coolant.

[0033] The direct cooling heat dissipation structure includes a Pin-Fin heat dissipation substrate and a liquid cooling structure with a heat dissipation water tank. The Pin-Fin heat dissipation substrate is pressure-connected to the heat dissipation water tank and introduced into a sealing ring to form a sealed cavity. Due to the Pin-Fin structure, no thermal grease is required. When applied to the power module, its heat dissipation path is semiconductor power chip---Pin-Fin heat dissipation substrate---cooling liquid.

[0034] In summary, the heat dissipation base plate structure provided by the prior art has at least the following disadvantages: 1. For the flat-bottom indirect heat dissipation structure, it is necessary to introduce thermal grease between the flat-bottom heat dissipation substrate and the liquid cooling plate. The resulting heat dissipation structure is not only complex, bulky, and costly, but also has high thermal resistance, high thickness sensitivity, difficult coating process control, and is easily damaged during assembly. It is prone to aging under long-term high temperature operation, and the thermal resistance gradually increases, reducing the ultimate heat dissipation efficiency and reliability of the power module.

[0035] 2. For the direct cooling heat dissipation structure, it introduces Pin-Fin and direct convection with the coolant to dissipate heat to improve the heat dissipation efficiency. However, the Pin-Fin heat dissipation substrate is expensive and the process is complicated. At the same time, this method requires a well-sealed space between the heat dissipation structure and the cooling flow groove to prevent the coolant from flowing out and causing water leakage in the system, which may cause hidden dangers. However, the working environment of existing power modules is complex, especially automotive-grade power modules, which are accompanied by high pressure, high temperature, and high vibration during operation. As a result, after long-term operation, the sealed connection between the power module base plate and the cooling flow groove becomes loose, and the system reliability is greatly reduced, posing a major safety hazard.

[0036] 3. Whether it is a flat base plate indirect heat dissipation structure or a direct cooling heat dissipation structure, the solid metal base plate has insufficient lateral heat transfer capacity, and the heat source is mainly concentrated at the chip. Heat dissipation usually relies on vertical heat transfer. The area of ​​the heat dissipation base plate is usually more than 3 to 5 times the area of ​​the semiconductor power chip, resulting in low utilization of the effective heat dissipation area of ​​the heat dissipation base plate. The traditional idea is to increase the lateral heat transfer of the power semiconductor chip by increasing the thickness of the heat dissipation base plate to increase the effective heat dissipation area. However, the increase in the thickness of the heat dissipation base plate will cause the vertical heat transfer of the power semiconductor chip to increase the thermal resistance (that is, the vertical thermal resistance is inversely proportional to the effective heat transfer area). In other words, the effective heat dissipation area utilization rate of the heat dissipation base plate in the existing technology is low, the heat dissipation effect is poor and the cost is high.

[0037] 4. In traditional heat dissipation methods, appropriate mounting pressure is required between the metal baseplate and the heat sink or cooling water tank to ensure optimal thermal contact, reduce interfacial thermal resistance, and enhance sealing. This requires the finished metal baseplate of the power module to have a certain curvature (see "CN103794571A"). This curvature is in the opposite direction of the bending deformation caused by welding. Therefore, to reduce thermal resistance and improve the heat dissipation efficiency of the semiconductor metal module, the metal baseplate cannot be flat before welding and a curvature must be reserved to compensate for bending. However, the pre-processing curvature requires high precision and is difficult to process. Too large a curvature leads to thick solder layers that are prone to voids and high mounting stress, which can easily cause severe deformation or fracture of the metal baseplate. Too small a curvature leads to high interfacial thermal resistance, poor sealing and leakage, and exacerbated material deformation caused by the mismatch in thermal expansion coefficients between the original ceramic substrate and the power baseplate, causing the ceramic substrate to rapidly crack and fail. These problems affect heat dissipation efficiency and reduce the reliability of the power module.

[0038] 5. The heat dissipation capacity of the traditional Pin-Fin heat sink mainly depends on the heat conduction area of ​​the heat sink at the bottom. At the same time, its heat conduction method is mainly vertical heat conduction from chip to base plate to heat sink. The overall heat is easily accumulated inside the power module, and the convection heat exchange efficiency with the outside is low.

[0039] Based on this, the embodiment of the present application provides an integrated composite phase-change liquid-cooled heat sink. By integrating a composite heat sink cavity into the heat sink to form an integrated structure and adding a heat transfer fluid into the heat sink cavity, compared with traditional indirect cooling and direct cooling baseplate structures, the external radiator or water tank is eliminated, the structure is simplified and the volume is reduced, which greatly reduces the cost. In addition, the composite heat sink cavity is used to expand the heat transfer direction from the area around the heat source unit to the entire heat sink, thereby expanding the lateral heat conduction capacity and heat dissipation efficiency, and improving reliability. The details are as follows: See also Figure 1 , Figure 1 FIG1 shows an exploded view of an integrated composite phase change liquid cooling heat dissipation base plate provided in an embodiment of the present application. Figure 1 As shown, the integrated composite phase-change liquid-cooled heat dissipation base plate provided in the embodiment of the present application includes a first packaging plate 11, a heat dissipation functional plate 12 with an integrated composite heat dissipation cavity 14, and a second packaging plate 13 pressed together. The heat dissipation functional plate 12 is located between the first packaging plate 11 and the second packaging plate 13. A heat transfer fluid flows in the composite heat dissipation cavity 14. At least one side of the heat dissipation functional plate 12 that contacts the first packaging plate 11 and the second packaging plate 13 is provided with a composite heat dissipation cavity 14.

[0040] In a preferred embodiment, the composite heat dissipation cavity includes a first heat dissipation cavity, which is arranged on the side where the heat dissipation functional plate 12 contacts the first packaging plate 11. The exposed side of the first packaging plate 11 opposite to the first heat dissipation cavity is provided with a heat transfer fluid injection structure 15, and the first heat dissipation cavity adopts a pulsating heat pipe cooling method.

[0041] The first packaging board 11 , the heat dissipation functional board 12 and the second packaging board 13 are all provided with mounting holes 20 .

[0042] Specifically, a vacuum structure is formed between the first heat dissipation cavity and the first packaging plate 11, and heat transfer fluid is injected through the heat transfer fluid injection structure 15 to a depth of 1 / 3-9 / 10 of the total length of the first heat dissipation cavity. When the integrated composite phase-change liquid-cooled heat dissipation baseplate of the present application is packaged to form a power module and is in operation, the heat generated by the power chip causes a thermal pressure difference to form within the first heat dissipation cavity, which in turn causes the heat transfer fluid to spread the heat laterally along the cavity, thereby increasing the heat dissipation area, heat dissipation baseplate utilization, and heat dissipation efficiency.

[0043] In a preferred embodiment, the composite heat dissipation cavity further includes a second heat dissipation cavity, which is provided on a surface where the heat dissipation functional plate 12 contacts the second packaging plate 13 .

[0044] The exposed side of the second packaging plate 13 that contacts the second heat dissipation cavity is provided with two opposing flow grooves. The flow grooves are connected to the second heat dissipation cavity, which utilizes convection cooling. Specifically, the flow grooves include an integrally connected groove portion and a nozzle portion. The groove portion is connected to the second heat dissipation cavity, and the nozzle portion is connected to an external heat transfer fluid. When the integrated composite phase-change liquid-cooled heat dissipation baseplate of the present application is packaged to form a power module and is in operation, the heat generated by the power chip is directly dissipated through the transverse convection flow of the heat transfer fluid circulating inside and outside the second heat dissipation cavity, thereby improving the heat dissipation area, heat dissipation baseplate utilization, and heat dissipation efficiency.

[0045] In a specific embodiment, the integrated composite phase change liquid cooling heat dissipation base provided by the present application includes a composite heat dissipation cavity integrated therein, which is provided on the heat dissipation function plate 12 and on the contact surface in contact with the first packaging plate 11 (such as Figure 1 ), or provided on the contact surface of the heat dissipation functional plate 12 and in contact with the second packaging plate 13 ( Figure 1 not shown).

[0046] In another optional embodiment provided by the present application, the composite heat dissipation cavity includes two, one of which is provided on the heat dissipation functional plate 12 and on the contact surface in contact with the first packaging plate 11 (such as Figure 1 ), another composite heat dissipation cavity is provided on the heat dissipation functional plate 12, on the contact surface with the second packaging plate ( Figure 1 not shown).

[0047] In order to further improve the heat dissipation performance of the integrated composite phase change liquid cooling heat dissipation base plate and improve the heat dissipation capacity of the power module using the integrated composite phase change liquid cooling heat dissipation base plate, the present application preferably sets a composite heat dissipation cavity on the top surface (i.e., the contact surface in contact with the first packaging board 11) and the bottom surface (the contact surface in contact with the second packaging board 13) of the heat dissipation function board.

[0048] Preferably, the two long sides of the composite heat dissipation cavity provided by the present application are respectively close to the two long sides of the heat dissipation functional plate, and the two wide sides of the composite heat dissipation cavity are respectively close to the two wide sides of the heat dissipation functional plate (such as Figure 1 ), which can ensure that the heat concentrated at the semiconductor power chip can be diffused laterally, that is, the utilization rate of the effective heat dissipation area of ​​the integrated phase-change liquid cooling base plate is improved, and the heat dissipation efficiency of the integrated composite phase-change liquid cooling base plate for the semiconductor power chip is improved without increasing the thickness of the heat dissipation base plate (to avoid increasing thermal resistance).

[0049] Also, see Figure 2 , Figure 2 FIG1 shows a three-dimensional diagram of an integrated composite phase change liquid cooling heat dissipation base plate provided by an embodiment of the present application. Figure 2 As shown, compared with the indirect heat dissipation structure of the flat base plate, the present application directly integrates the composite heat dissipation cavity inside the heat dissipation base plate, avoiding the introduction of thermal grease and the technical problems such as increased thermal resistance, increased thickness sensitivity, difficulty in controlling the coating process, and easy damage during assembly due to the introduction of thermal conductive interface materials. The volume of the entire heat dissipation base plate is simplified, the cost of the heat dissipation base plate is reduced, and the heat dissipation efficiency and reliability are greatly improved.

[0050] Furthermore, in the traditional heat dissipation base plate solution, a bending arc needs to be reserved on the metal base plate to facilitate the subsequent pressing between the radiator or cooling water tank. The pre-processing arc has high precision requirements and is difficult to process. If the arc is too large, the solder layer will be thick and prone to voids and high installation stress, which can easily cause serious deformation or fracture of the metal base plate. If the arc is too small, it will lead to high interface thermal resistance, poor sealing and leakage, and aggravated material deformation when the thermal expansion coefficients of the original ceramic substrate and the power base plate are inconsistent, resulting in rapid rupture of the ceramic substrate and failure, which affect the heat dissipation efficiency and reduce the reliability of the power module.

[0051] The present application integrates and packages the composite heat dissipation cavity inside the heat dissipation base plate and directly adopts an integrated structure, thereby avoiding the step of pressing the metal base plate with the radiator or water sink in the traditional solution, and there is no need to pre-process the arc of the metal base plate. Therefore, the integrated composite phase change liquid cooling heat dissipation base plate provided by the present application not only has a thin weld layer, good welding quality, small residual stress, and low leakage risk, but also increases reliability.

[0052] In a preferred embodiment, the composite heat dissipation cavity adopts a coiled or geometrically connected cavity structure. It should be noted that the coiled or geometrically connected cavity structure used in the composite heat dissipation cavity described in this application is only an example structure, and its shape is not limited. For example, it can also be a spiral or roller type. This application does not impose a fixed restriction on the cavity structure.

[0053] A heat transfer fluid flows in the composite heat dissipation cavity.

[0054] Preferably, see Figure 3 , Figure 3 FIG1 shows one of the schematic diagrams of a coiled heat dissipation cavity applicable to the first heat dissipation cavity / the second heat dissipation cavity provided in an embodiment of the present application. Figure 4 , Figure 4 FIG2 shows a second schematic diagram of a coiled heat dissipation cavity suitable for the first heat dissipation cavity / the second heat dissipation cavity provided in an embodiment of the present application. Figure 3 As shown, the entire composite heat dissipation cavity mainly forms a corresponding serpentine coiled structure along the horizontal X direction of the heat dissipation functional plate, such as Figure 4 As shown, the entire composite cavity mainly forms a corresponding serpentine coiled structure along the horizontal Y direction of the heat dissipation functional plate. Figure 3 and Figure 4 What are shown are only two examples of coiled composite heat dissipation cavities, and this application does not impose any specific restrictions on the coiling method of the cavity.

[0055] See also Figure 5 , Figure 5 FIG1 shows one of the geometrically connected heat dissipation cavities for the first heat dissipation cavity and the second heat dissipation cavity provided in the embodiment of the present application. Figure 6 , Figure 6 FIG2 shows a second schematic diagram of a geometrically connected composite heat dissipation cavity suitable for a first heat dissipation cavity / a second heat dissipation cavity provided in an embodiment of the present application. Figure 5 As shown, the entire composite heat dissipation cavity mainly adopts a connected strip cavity arranged in parallel along the horizontal X direction of the heat dissipation functional plate to form Figure 5 The geometrically connected structure shown, such as Figure 6 As shown, the entire composite heat dissipation cavity mainly adopts a connected cavity arranged along the horizontal X direction and the horizontal Y direction of the heat dissipation functional plate to form Figure 6 The geometrically connected structure shown, Figure 5~Figure 6 What are shown are only two examples of geometrically connected composite heat dissipation cavities. The present application does not impose any specific limitation on the geometric distribution method used to form the connected composite heat dissipation cavity.

[0056] See also Figure 7 , Figure 7 FIG. 1 shows a schematic diagram of a non-connected heat dissipation cavity suitable for a second heat dissipation cavity provided in an embodiment of the present application. Figure 7 As shown, the entire composite heat dissipation cavity is mainly formed by several non-connected strip cavities arranged in parallel along the horizontal Y direction of the heat dissipation functional plate. The adjacent strip cavities are separated by a convex structure to form Figure 7 The non-connected heat dissipation cavity is shown.

[0057] Specifically, the present application does not impose any specific restrictions on the structure corresponding to the composite heat dissipation cavity in the integrated composite phase-change liquid-cooled heat dissipation base plate, which can be determined according to actual needs.

[0058] In a specific embodiment, for the case where two composite heat dissipation cavities are integrated in an integrated composite phase change liquid cooling heat dissipation base plate, the two composite heat dissipation cavities can be the same or different and can be set according to actual needs while meeting the respective requirements of the two composite heat dissipation cavities. For example, the first heat dissipation cavity can be set as follows Figures 3 to 6 The cavity structure shown, the second heat dissipation cavity can be set as follows Figures 3 to 7 The cavity structure shown here is not specifically limited.

[0059] Specifically, the composite heat dissipation cavity of the present application preferably adopts a cooling method that combines microchannel cooling with pulsating heat pipe cooling. For example, the first heat dissipation cavity of the present application and the first packaging plate are vacuum-formed into a cavity structure, forming a phase-change cavity pipe heat transfer structure similar to a pulsating heat pipe. The interior is evacuated and filled with a portion of cooling liquid. Under the action of surface tension, the cooling liquid forms randomly alternating liquid columns and gas plugs in the pipe. When the pulsating heat pipe is working, the liquid columns and gas plugs expand, compress, and transform into each other due to heat absorption / exotherm, forming an oscillating pulsating flow, thereby achieving heat transfer and diffusing the heat laterally to the entire heat dissipation base plate.

[0060] Illustratively, the second heat dissipation cavity of the present application is connected to the second packaging plate to form a microchannel cooling structure, and the second packaging plate is connected to the outside through a pipe mouth, forming internal and external heat transfer fluid cooling channels, and efficient cooling is achieved through internal and external flow convection heat exchange of the heat transfer fluid in the channel, which significantly increases the heat exchange area and greatly improves the heat exchange efficiency.

[0061] In the first heat dissipation cavity, the heat transfer fluid is a combination of liquid and gas, forming corresponding liquid injections and gas columns in the heat dissipation cavity, wherein the corresponding liquids include cooling water, liquid metal, etc. In the second heat dissipation cavity, the heat transfer fluid is cooling water, oil or cold air.

[0062] In a preferred embodiment, the first heat dissipation cavity has a width of 1 mm-2 mm and a depth of 0.5 mm-1 mm, the second heat dissipation cavity has a width of 0.2 mm-2 mm and a depth of 0.1 mm-1 mm, the packaging board has a thickness of 1 mm-3 mm, and the heat dissipation functional board has a thickness of 5 mm-8 mm.

[0063] Preferably, the packaging plates (including the first packaging plate and the second packaging plate) and the heat dissipation function plate are made of any one of aluminum, aluminum alloy, copper, and copper alloy.

[0064] See also Figure 8 , Figure 8 FIG1 shows a schematic diagram of the flow of cooling liquid in a composite heat dissipation cavity provided by an embodiment of the present application. Figure 8 The cavity structure shown is applicable to the first heat dissipation cavity and the second heat dissipation cavity. In this application, after the integrated composite phase change liquid cooling heat dissipation base plate is formed, for the first heat dissipation cavity: The first heat dissipation cavity is evacuated to maintain a vacuum and sealed state, and the heat transfer fluid is poured into the first heat dissipation cavity using the heat transfer fluid injection structure 15 on the first packaging board 11. The pouring process is incomplete pouring, and preferably the heat transfer fluid is poured to 1 / 3 (one third) - 9 / 10 (nine tenths) of the overall length of the first heat dissipation cavity, so as to form alternatingly distributed gas columns and liquid columns in the first heat dissipation cavity. In this way, the first heat dissipation cavity can be placed in a pulsating heat pipe phase change (liquid-gas) mode. In this way, during operation, the heat generated by the power chip is quickly diffused to the entire heat dissipation base plate under the action of the oscillation and pulsation of the gas columns and liquid columns in the first heat dissipation cavity, thereby increasing the effective heat dissipation area of ​​the heat dissipation base plate, thereby achieving the purpose of improving the heat dissipation efficiency.

[0065] In a preferred embodiment, two oppositely distributed flow grooves 16 are provided on the exposed side of the second packaging board 13 opposite to the second heat dissipation cavity. The flow grooves 16 are connected to the second heat dissipation cavity, and the second heat dissipation cavity adopts convection cooling.

[0066] like Figure 1 As shown, each flow groove 16 includes a groove portion 160 and a pipe mouth portion 161 that are connected in an integral manner. The groove portion 160 is connected to the second heat dissipation cavity, and the pipe mouth portion 161 is connected to the external heat transfer fluid.

[0067] Specifically, the two flow grooves are arranged near the two long sides or the two wide sides of the integrated composite phase change liquid cooling heat dissipation base plate, and the flow grooves are located below the composite heat dissipation cavity and can be connected to the composite heat dissipation cavity position. In one example, for the second heat dissipation cavity, if it adopts Figures 3 to 6 The coiled heat dissipation cavity or the geometrically connected heat dissipation cavity shown in the figure has no specific limitation on the direction of the flow grooves. They can be arranged oppositely along the horizontal X direction or along the horizontal Y direction. If the second heat dissipation cavity adopts Figure 7 In the non-connected structure shown in FIG, the flow direction of the heat transfer fluid in the flow groove needs to be ensured to be perpendicular to the flow direction of the heat transfer fluid in the composite cavity. Figure 7 For example, if the flow direction of the heat transfer fluid in the non-connected cavity is along the horizontal X direction, the flow groove is set perpendicular to the horizontal X direction. Only in this case can the fluid in the flow groove bring the heat in each non-connected cavity to the outside to complete the heat dissipation. In a specific embodiment, after the integrated composite phase-change liquid cooling heat dissipation base plate is formed, for the second heat dissipation cavity: It is connected to the heat transfer fluid in the second heat dissipation cavity through the groove part 160 corresponding to the flow groove 16, and performs convection heat dissipation on the heat after horizontal heat conduction through the first heat dissipation cavity, and transfers the heat to the outside through the pipe mouth parts corresponding to the two flow grooves 16 to increase the heat conduction efficiency through heat convection.

[0068] Based on this, the composite heat dissipation cavity provided in this application adopts a cooling method that combines phase change technology and thermal convection technology. Specifically, the first heat dissipation cavity is used to laterally diffuse the heat generated by the power chip when the power module is working, and the second heat dissipation cavity adopts thermal convection technology to dissipate the heat after laterally diffusing through the first heat dissipation cavity to the outside through the flow groove 16. In this process, the composite heat dissipation cavity structure realizes rapid heat dissipation, so that the heat transfer direction is expanded from the surrounding of the heat source monomer to the entire heat dissipation base plate, thereby improving the heat dissipation efficiency, while reducing the risk of the semiconductor power chip on the applied power module burning due to excessive temperature, thereby improving the reliability of the module product.

[0069] Compared with traditional heat dissipation base plates, the integrated composite phase change liquid cooling heat dissipation base plate provided in this application has faster and more uniform heat dissipation. At the same time, when it is not working in a high-temperature environment, when the temperature is too high, the cooling liquid in the cavity can also undergo external hot pressure circulation to maintain the constant temperature of the power module, alleviate the risk of failure of the power module power chip, and effectively extend the service life of the power module.

[0070] An embodiment of the present application further provides a power module, which uses a phase-change liquid-cooled heat dissipation base plate provided by any of the above-mentioned embodiments.

[0071] See also Figure 9 , Figure 9 The flowchart of the manufacturing method of an integrated composite phase change liquid cooling heat dissipation base plate provided by the embodiment of the present application is shown. Figure 9 As shown, the method provided by this application includes the following steps: S100: Using a punching processing device to punch out the sheet metal of the first given material, the sheet metal of the second given material, and the sheet metal of the third given material according to the given heat sink size, to obtain a punched first package blank, a heat sink blank, and a second package blank.

[0072] S200 , using a given cleaning agent to clean and dry the first package blank, the heat sink blank, and the second package blank according to a preset cleaning process, to obtain the processed first package blank, the heat sink blank, and the second package blank.

[0073] S300 , performing different pre-processing methods on the processed first package blank, the processed heat dissipation plate blank, and the processed second package blank to obtain a pre-processed first package board, a pre-processed heat dissipation function board, and a pre-processed second package board.

[0074] S400 , stacking the pre-processed first packaging board, the pre-processed heat dissipation function board, and the pre-processed second packaging board and performing high-temperature welding to form an integrated heat dissipation base plate to be processed.

[0075] The primary processing heat dissipation function board is located between the primary processing first packaging board and the primary processing second packaging board.

[0076] S500: using a punching processing device to punch out the integrated heat dissipation base plate to be processed according to a given heat dissipation plate size to obtain a finely processed integrated heat dissipation base plate.

[0077] S600. Add mounting holes at given positions on the finely machined integrated heat dissipation base plate and clean the base plate to obtain an integrated composite phase change liquid cooling heat dissipation base plate.

[0078] In a preferred embodiment, in step S100, the given heat sink plate size includes a first given size corresponding to the first packaging plate (the size includes length, width and height), a second given size corresponding to the heat dissipation functional plate, and a third given size corresponding to the second packaging plate. The punching processing equipment is a laser device or a cutting device. The laser device or the cutting device is used to punch out the first given material sheet metal according to the first given size to obtain a first packaging blank. The laser device or the cutting device is used to punch out the second given material sheet metal according to the second given size to obtain a heat sink blank. The laser device or the cutting device is used to punch out the third given material sheet metal according to the third given size to obtain a second packaging blank. The given material may be an aluminum alloy.

[0079] In step S200, a cleaning agent including an alkaline degreasing agent and anhydrous alcohol is provided, and a first package blank after cleaning and drying is obtained by the following method: The first package blank is placed in an alkaline degreasing agent at 50-70° C. and ultrasonically cleaned at a frequency of 20 kHz-25 kHz for 5-10 minutes. The ultrasonically cleaned first package blank is then placed in 99.9% anhydrous alcohol for cleaning at 3 kHz-5 minutes. The first package blank is then taken out and placed in a hot air circulation oven for drying. Specifically, the cleaned first package blank is baked at a temperature of 100-120° C. for 5-10 minutes to obtain the cleaned and dried first package blank.

[0080] The cleaning and drying process of the heat sink blank and the second package blank is similar to that of the first package blank, and will not be described in detail here.

[0081] In a preferred embodiment, see Figure 10 , Figure 10 The flowchart of the manufacturing process of the first package board provided by the embodiment of the present application is shown. Figure 10 As shown, in step 300, the process of pre-processing the processed first package blank includes: S3100 , spraying high-viscosity stretching oil on the entire processed first packaging blank to obtain a first blank to be stretched.

[0082] The proposed extraction port position is sprayed multiple times until a preset number of times is reached, and the proposed extraction port position is an area to be stretched to form a coolant injection structure.

[0083] S3110, forming a coolant injection structure by stretching the first blank to be stretched multiple times in a manner of gradually shortening the stretching diameter, and obtaining a first packaging structure after stretching.

[0084] S3120 , performing post-correction processing on the first packaging structure after the stretching processing to obtain a pre-processed first packaging board.

[0085] The post-processing includes at least flatness correction, flange edge removal, cleaning and electrolytic polishing. In the specific implementation, in step S3100, the high-viscosity stretching oil can be selected from chlorinated paraffin oil containing extreme pressure additives, and each surface of the dried gold first package blank is sprayed with high-viscosity stretching oil at least once, and the high-viscosity stretching oil is sprayed at least 3 to 5 times at the intended extraction position to reduce friction and mold wear between the first package blank and the extraction stamping mold.

[0086] In a preferred embodiment, step S3110 includes: The first blank to be stretched is placed in the stamping die, wherein the intended withdrawal position is aligned with the corresponding concave part of the withdrawal stamping die, and the convex part of the first withdrawal stamping punch is aligned with the intended withdrawal position of the first blank to be stretched, and the first withdrawal stamping punch is controlled to perform the first stretching and stamping on the first blank to be stretched at a first given stamping speed (10mm / s~20mm / s) and a first given pressure (20%~30% of the yield strength of the first given material sheet metal) to obtain the first stretched blank, and the stamping time is the first preset time (2 minutes~3 minutes).

[0087] Replace the first draw-out stamping punch with the second draw-out stamping punch, align the convex part of the second draw-out stamping punch with the center of the groove formed by the first stretching and stamping, and control the second draw-out stamping punch to perform a second stretching and stamping on the first stretched blank at a second given stamping speed (5mm / s~8mm / s) and a second given pressure (20%~30% of the yield strength of the first given material sheet metal) to obtain a second stretched blank. The stamping time is the second preset time (1 minute~2 minutes).

[0088] Replace the second draw-out stamping punch with the third draw-out stamping punch, align the convex part of the third draw-out stamping punch with the center of the groove formed by the first stretching stamping, and control the third draw-out stamping punch to perform the final stamping on the second stretched blank at a third given stamping speed (3mm / s~8mm / s) and a second given pressure (20%~30% of the yield strength of the first given material sheet metal) until the third draw-out stamping punch penetrates the second stretched blank to obtain the first packaging structure after stretching.

[0089] Preferably, the concave diameter R of the recessed stamping die is greater than the convex diameter r1 of the first recessed stamping punch, greater than the convex diameter r2 of the second recessed stamping punch, and greater than the convex diameter r3 of the third recessed stamping punch.

[0090] In a specific embodiment, the difference between the concave diameter R of the draw-out stamping die and the convex diameter r1 of the first draw-out stamping punch is R-r1∈[1.1D1, 1.5D1], where D1 represents the given thickness corresponding to the first packaging board. In this application, D preferably ranges from 1 mm to 3 mm.

[0091] Preferably, the convex diameter r2 of the second draw-out stamping punch is 0.75 r1~0.8 r1, and the convex diameter r3 of the third draw-out stamping punch is 0.35 r1~0.5 r1. In this application, the convex diameter of the second draw-out stamping punch is preferably 0.75 r1, and the convex diameter of the third draw-out stamping punch is preferably 0.5 r1.

[0092] In a preferred embodiment, before step S3120, the manufacturing method provided by the present application further includes: Determine whether the stretching height corresponding to the coolant injection structure formed by stretching reaches a given height. If the stretching height corresponding to the coolant injection structure does not reach the given height, weld a metal pipe with the same diameter as the corresponding diameter of the top of the coolant injection structure (i.e., the convex diameter r3 of the third withdrawal punch) on the top of the coolant injection structure. The welding length of the metal pipe is the difference between the given height and the stretching height corresponding to the coolant injection structure. If the stretching height corresponding to the coolant injection structure reaches the given height, directly end the stretching of the coolant injection structure. In a preferred embodiment, step S3120 includes: The first package structure after stretching is placed in a given finishing mold to correct the bottom flatness, and then the flange edge is removed by laser equipment to ensure the flatness of the port to form a finished first package board. The finished first package board is placed in an alkaline degreasing agent at 50°C~70°C, and ultrasonically cleaned at a frequency of 20kHz~25kHz for 5min~10min (minutes). After that, it is taken out and placed in 99.9% anhydrous alcohol for cleaning for 3min~5min, and then placed in a hot air circulation oven and baked at a temperature of 100°C~120°C for 5min~10min. After being completely dried, it is electrolytically polished to improve the heat dissipation surface area and corrosion resistance to obtain a pre-processed first package board.

[0093] return Figure 9 , see Figure 11 , Figure 11 The flowchart of the manufacturing process of the heat dissipation function board provided by the embodiment of the present application is shown. Figure 11 As shown, in step 300, the process of pre-processing the processed heat sink blank includes: S3200: On the target surface where the composite heat dissipation cavity needs to be set after the cleaning and drying treatment of the heat dissipation plate blank, the required cavity structure is formed according to a given processing depth to obtain the processed heat dissipation plate blank.

[0094] S3210: Using a given cleaning agent to clean the processed heat dissipation functional board according to a preset cleaning process to obtain a pre-processed heat dissipation functional board.

[0095] In a specific embodiment, step S3200 includes: The cleaned and dried heat sink blank is placed on a milling machine and fixed, and the required cavity structure (e.g. Figures 3 to 7 Any cavity structure), where the given processing depth is 1 / 3 D2~1 / 4D2, and D2 is the thickness of the heat sink blank.

[0096] In another specific embodiment, in the case where composite heat dissipation cavities are set on both the top and bottom surfaces of the heat dissipation plate blank, the top and bottom surfaces are processed separately according to the different cavity structure requirements of the composite heat dissipation cavity, and the processing thickness of the top and bottom surfaces is the same.

[0097] In a specific embodiment, the given cleaning agent and the preset cleaning process in step S3210 are the same as the cleaning and drying process given above, and will not be described in detail here.

[0098] In a preferred embodiment, see Figure 12 , Figure 12 FIG. 1 shows a flowchart of a manufacturing process of a primary processing second packaging board provided by an embodiment of the present application. Figure 12 As shown, in step 300, the process of pre-processing the processed second package blank includes: S3300 , spraying high-viscosity stretching oil on the entire processed second packaging blank to obtain a second blank to be stretched.

[0099] The simulated stamping position is sprayed multiple times until a preset number of times is reached, and the simulated stamping position is a flow groove processing position.

[0100] S3310, placing the second blank to be stretched in the stamping die, so that the flow groove processing position is aligned with the concave part of the stamping die.

[0101] S3320, aligning the flow groove punch with the flow groove processing position, controlling the flow groove punch to perform stretching and punching on the second to-be-stretched blank at a fourth given punching speed and a fourth given pressure, to obtain a first stretched blank formed with a groove portion.

[0102] In step S3320, the stamping time is the third preset time.

[0103] S3330. Weld the given nozzle portion to the groove portion formed by stretching to obtain a second packaging structure.

[0104] S3340: Apply a given cleaning agent to process the second packaging structure according to a preset cleaning process to obtain a pre-processed second packaging board.

[0105] For an example, see Figure 13 , Figure 13 The embodiment of the present application provides a top view of a second package blank. In step S3300, each surface of the second package blank after cleaning and drying is sprayed with high viscosity stretching oil at least once. Figure 13 Spray high-viscosity stretching oil at least 3 to 5 times at the intended stamping position shown in the figure to reduce friction between the blank and the stamping mold and mold wear.

[0106] In steps S3320 to S3330, the second packaged blank sprayed with high-viscosity stretching oil is placed in the stamping die corresponding to the groove part, and the intended stamping position is aligned with the concave part of the stamping die. The flow groove punch is controlled to perform stretching and stamping on the second blank to be stretched at a fourth given stamping speed (1 mm / s-10 mm / s) and a fourth given pressure (20%-30% of the yield strength of the given material) to obtain a first stretched blank formed with a groove part. The stamping time is the third preset time (1 min-3 min).

[0107] Among them, the diameter of the stamping die is R, the corresponding diameter of the flow groove punch is r4, R>r4 and R-r4∈[1.1D3, 1.5D3], D3 is the given thickness of the second packaging plate, and D3 in this application is preferably 1 mm-3 mm.

[0108] In step S3340, the radius of the given tube mouth is the same as the radius of the groove part. The given tube mouth is welded to the corresponding groove part by solder in a vacuum high temperature environment of 500℃-600℃, and cooled after 30 minutes to obtain a second packaging structure.

[0109] In step S3350, the preset cleaning process is the same as described above and will not be described in detail here.

[0110] return Figure 9 , step S400 includes: After the pre-processed first packaging board, the pre-processed heat dissipation functional board, and the pre-processed second packaging board are stacked, they are placed in a high-temperature welding furnace, vacuum-welded for 30 minutes to 45 minutes at a temperature of 500°C to 750°C, and then cooled to obtain an integrated heat dissipation base plate to be processed.

[0111] In step S500, in order to ensure the processing accuracy of the integrated heat dissipation base plate, the integrated heat dissipation base plate to be processed is placed in a laser device or a cutting device, and the blank is punched out according to the overall size requirements corresponding to the integrated heat dissipation base plate to form a finely processed integrated heat dissipation base plate.

[0112] Preferably, in step S600, the finely processed integrated heat dissipation base plate is fixedly placed on a milling machine, and a through hole is drilled at a corresponding position of the finely processed integrated heat dissipation base plate by a punching device to form a Figure 1 and Figure 2 Mounting holes as shown.

[0113] Further, after the drilling is completed, the above-mentioned given cleaning agent and the preset cleaning process are used to clean and dry the finely processed integrated heat dissipation base plate after drilling again to form the present application. Figure 1~Figure 2 Provides an integrated composite phase-change liquid cooling baseplate.

[0114] Based on the same application concept, the embodiment of the present application also provides an integrated phase change liquid cooling heat dissipation base plate manufacturing device corresponding to the manufacturing method of the integrated phase change liquid cooling heat dissipation base plate provided in the above embodiment. Since the principle of solving the problem by the device in the embodiment of the present application is similar to the manufacturing method of the integrated phase change liquid cooling heat dissipation base plate in the above embodiment of the present application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0115] The device includes: The first punching module is used to punch out the first given material sheet metal, the second given material sheet metal and the third given material sheet metal according to the given heat sink size using punching processing equipment to obtain the punched first packaging blank, the heat sink blank and the second packaging blank.

[0116] The first cleaning and drying module is used to use a given cleaning agent to clean and dry the first package blank, the heat sink blank and the second package blank according to a preset cleaning process to obtain the processed first package blank, the heat sink blank and the second package blank.

[0117] The pre-processing module is used to perform different pre-processing methods on the processed first packaging blank, the processed heat dissipation plate blank and the processed second packaging blank to obtain the initially processed first packaging board, the initially processed heat dissipation function board and the initially processed second packaging board.

[0118] An integrated molding module is used to stack the pre-processed first packaging board, the pre-processed heat dissipation functional board, and the pre-processed second packaging board and then perform high-temperature welding to form an integrated heat dissipation base plate to be processed, wherein the pre-processed heat dissipation functional board is located between the pre-processed first packaging board and the pre-processed second packaging board.

[0119] The second punching module is used to punch out the integrated heat dissipation base plate to be processed according to a given heat dissipation plate size using a punching processing device to obtain a finely processed integrated heat dissipation base plate.

[0120] The second cleaning and drying module is used to add mounting holes at given positions of the finely machined integrated heat dissipation base plate and clean the same to obtain an integrated composite phase change liquid cooling heat dissipation base plate.

[0121] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An integrated composite phase change liquid cooling heat dissipation base plate, characterized in that: It includes a first packaging board pressed together, a heat dissipation function board with an integrated composite heat dissipation cavity, and a second packaging board, The heat dissipation functional plate is located between the first packaging plate and the second packaging plate, and a heat transfer fluid flows in the composite heat dissipation cavity; At least one surface of the heat dissipation functional plate that contacts the first packaging plate and the second packaging plate is provided with a composite heat dissipation cavity.

2. The integrated composite phase-change liquid cooling heat dissipation base plate according to claim 1, characterized in that: The composite heat dissipation cavity includes a first heat dissipation cavity, which is provided on the side where the heat dissipation function plate contacts the first packaging plate; a heat transfer fluid injection structure is provided on the exposed side of the first packaging plate opposite to the first heat dissipation cavity; The first heat dissipation cavity adopts a pulsating heat pipe cooling method.

3. The integrated composite phase-change liquid cooling heat dissipation base plate according to any one of claims 1-2, characterized in that: The composite heat dissipation cavity further includes a second heat dissipation cavity, which is arranged on a side where the heat dissipation functional plate contacts the second packaging plate; The exposed side of the second packaging board in contact with the second heat dissipation cavity is provided with two oppositely distributed flow grooves, the flow grooves are connected to the second heat dissipation cavity, and the second heat dissipation cavity adopts convection cooling.

4. The integrated composite phase-change liquid cooling heat dissipation base plate according to claim 3, characterized in that: The flow groove includes an integrally connected groove portion and a pipe mouth portion, the groove portion is connected to the second heat dissipation cavity, and the pipe mouth portion is connected to the external circulating liquid. The composite heat dissipation cavity adopts a coiled or geometrically connected cavity structure.

5. A method for manufacturing an integrated composite phase-change liquid cooling heat dissipation base plate, characterized in that: The method comprises: Using a punching processing device to punch out the sheet metal of the first given material, the sheet metal of the second given material, and the sheet metal of the third given material according to the given heat sink size, to obtain a punched first package blank, a heat sink blank, and a second package blank; Applying a given cleaning agent to clean and dry the first package blank, the heat sink blank, and the second package blank according to a preset cleaning process to obtain the treated first package blank, the heat sink blank, and the second package blank; Performing different pre-processing methods on the processed first package blank, the processed heat dissipation plate blank, and the processed second package blank to obtain a pre-processed first package board, a pre-processed heat dissipation function board, and a pre-processed second package board; The pre-processed first packaging board, the pre-processed heat dissipation functional board, and the pre-processed second packaging board are stacked and then high-temperature welded to form an integrated heat dissipation base plate to be processed, wherein the pre-processed heat dissipation functional board is located between the pre-processed first packaging board and the pre-processed second packaging board; Using a punching processing device to punch out the to-be-processed integrated heat dissipation base plate according to a given heat dissipation plate size to obtain a finely processed integrated heat dissipation base plate; Mounting holes are added at given positions of the finely machined integrated heat dissipation base plate and cleaned to obtain the integrated composite phase-change liquid-cooled heat dissipation base plate as claimed in any one of claims 1 to 4.

6. The method according to claim 5, characterized in that The process of pre-processing the processed first package blank includes: The processed first package blank is sprayed with high-viscosity stretching oil to obtain a first blank to be stretched, wherein the spraying is repeated multiple times until a preset number of times is reached at the intended extraction port position, where the intended extraction port position is the area to be stretched to form a coolant injection structure; Stretching the first blank to be stretched multiple times in a manner of gradually shortening the stretching diameter to form a coolant injection structure, thereby obtaining a first packaging structure after stretching; The first package structure after the stretching process is subjected to a post-correction process to obtain a pre-processed first package plate, wherein the post-correction process at least includes flatness correction, flange edge removal, cleaning and electrolytic polishing.

7. The method according to claim 6, characterized in that The first package structure after stretching is obtained by the following method: Placing the first blank to be stretched in a stamping die, wherein the proposed withdrawal position is aligned with the corresponding concave portion of the withdrawal stamping die; Aligning the convex portion of the first punching punch with the intended punching position of the first blank to be stretched; Controlling the first withdrawing punch to perform a first stretching punch on the first blank to be stretched at a first given punching speed and a first given pressure to obtain a first stretched blank, wherein the punching time is a first preset time; The first punching die with a second punching die with a recessed portion is replaced with a second punching die with a recessed portion, and the convex portion of the second punching die is aligned with the center of the groove formed by the first stretching and stamping. The second punching die is controlled to perform a second stretching and stamping on the first stretch blank at a second given stamping speed and a second given pressure to obtain a second stretch blank. The stamping time is a second preset time. The second draw-out punch is replaced with a third draw-out punch, and the convex portion of the third draw-out punch is aligned with the center of the groove formed by the first stretching and stamping. The third draw-out punch is controlled to perform a final stamping on the second stretch blank at a third given stamping speed and a second given pressure until the third draw-out punch penetrates the second stretch blank, thereby obtaining a first packaging structure after stretching. Among them, the concave diameter of the draw-out stamping die is larger than the convex diameter of the first draw-out stamping punch, the convex diameter of the first draw-out stamping punch is larger than the convex diameter of the second draw-out stamping punch, and the convex diameter of the second draw-out stamping punch is larger than the convex diameter of the third draw-out stamping punch.

8. The method according to claim 6, characterized in that Before performing a post-correction process on the first package structure after the stretching process, the method further includes: Determine whether the stretching height corresponding to the coolant injection structure reaches a given height; If the stretching height corresponding to the coolant injection structure does not reach the given height, a metal pipe of the same size as the top of the coolant injection structure is welded on the top of the coolant injection structure, and the welding length of the metal pipe is the difference between the given height and the stretching height corresponding to the coolant injection structure.

9. The method according to claim 5, characterized in that The process of pre-processing the processed heat sink blank includes: On the target surface where the composite heat dissipation cavity is to be set on the heat dissipation plate blank after cleaning and drying, the required cavity structure is formed according to a given processing depth to obtain the processed heat dissipation plate blank; The processed heat dissipation functional board is cleaned by applying a given cleaning agent according to a preset cleaning process to obtain a pre-processed heat dissipation functional board.

10. The method according to claim 5, characterized in that The process of pre-processing the processed second package blank includes: The processed second packaging blank is sprayed with high-viscosity stretching oil to obtain a second blank to be stretched, wherein the intended stamping position is sprayed multiple times until a preset number of times is reached, and the intended stamping position is a flow groove processing position; Place the second blank to be stretched in the stamping die so that the flow groove processing position is aligned with the concave part of the stamping die; Aligning the flow groove punch with the flow groove processing position, controlling the flow groove punch to perform stretching and punching on the second to-be-stretched blank at a fourth given punching speed and a fourth given pressure to obtain a first stretched blank having a groove portion formed thereon, wherein the punching time is a third preset time; welding the given nozzle portion to the groove portion formed by stretching to obtain a second packaging structure; The second packaging structure is processed using a given cleaning agent according to a preset cleaning process to obtain a pre-processed second packaging board.

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