IGBT module structure

Abstract

The invention relates to an IGBT (Insulated Gate Bipolar Translator) module structure, which comprises a sealing cover, and the bottom of the sealing cover is fixedly connected with a cooling plate; the surface of the cooling plate is fixedly connected with a substrate; the surface of the substrate is fixedly connected with a plurality of I-GBT (Insulated Gate Bipolar Transistor) chips; the bottom of the cooling plate is fixedly connected with a radiator; a plurality of radiating fins are fixedly connected to the bottom of the radiator; a shell is arranged at the bottom of the radiator; the two sides of the shell are arranged in an inclined mode, and an air cooling module is fixedly installed on the inclined face. Exhaust outlets are formed in the two sides of the shell; a plurality of inserting rods are symmetrically and fixedly connected to the top of the shell, and slotted holes corresponding to the inserting rods are formed in the bottom of the radiator; through the cooperation of the shell and the air cooling module, when the radiator dissipates heat of the module, the air cooling module can generate cooling airflow on the surfaces of the heat dissipation fins to forcibly exchange heat, and then the heat dissipation effect of the radiator on the module is improved.

Description

Technical Field

[0001] The present invention relates to the field of IGBT technology, and in particular to an IGBT module structure. Background Art

[0002] IGBTs, or insulated-gate bipolar transistors, are fully controlled, voltage-driven, composite power semiconductor devices composed of BJTs (bipolar junction transistors) and MOSs (insulated-gate field-effect transistors). They combine the advantages of MOSFETs' high input impedance and GTRs' low on-state voltage drop. IGBT power modules, based on IGBTs, are widely used in servo motors, inverters, and variable-frequency home appliances.

[0003] In the existing technology, IGBT modules are generally directly connected to the heat sink, and the heat generated by the IGBT chip is transferred to the heat sink in the form of heat conduction for heat dissipation. It is found in use and observation that this form of heat dissipation relies only on natural convection for cooling and heat dissipation, and the heat dissipation efficiency is low. When the IGBT power is large or the working time is long, it is difficult to meet its cooling needs.

[0004] Therefore, an IGBT module structure is proposed to address the above problems. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem in the prior art that a simple heat sink has low heat dissipation efficiency and is unable to meet the cooling requirements of the IGBT.

[0006] In order to solve the above technical problems, the present invention provides an IGBT module structure, including a cover, a cooling plate fixedly connected to the bottom of the cover; a substrate fixedly connected to the surface of the cooling plate; a plurality of IGBT chips fixedly connected to the surface of the substrate; a radiator fixedly connected to the bottom of the cooling plate; a plurality of cooling fins fixedly connected to the bottom of the radiator; a shell provided at the bottom of the radiator; the two sides of the shell are inclined, and an air-cooling module is fixedly installed on the inclined surface; exhaust ports are provided on both sides of the shell; through the cooperation of the shell and the air-cooling module, when the radiator dissipates heat to the module, the air-cooling module can generate cooling airflow on the surface of the cooling fins to force heat exchange, thereby improving the heat dissipation effect of the radiator on the module.

[0007] In one embodiment of the present invention, a plurality of plug rods are symmetrically fixed to the top of the shell, and a slot corresponding to the plug rod is provided at the bottom of the radiator; a connecting frame is fixed to both sides of the radiator; a first pull rod is provided through the inner wall of the connecting frame and is slidably connected; a connecting plate is fixed to the end of the first pull rod; a pair of springs are fixed between one side of the connecting plate and the inner wall of the connecting frame; a plurality of fixing rods are fixed to the other side of the connecting plate; the fixing rods and the plug rods are correspondingly arranged, and a slot corresponding to the fixing rod is provided on the surface of the plug rod; the fixing rod can be driven in and out of the plug rod by pulling the first pull rod, so as to realize rapid installation and disassembly of the device to the shell, so that it can meet various usage and production requirements.

[0008] In one embodiment of the present invention, a plurality of thermobimetallic elements are fixedly connected to the outer wall of the fixing rod, and the thermobimetallic elements are arranged in a circumferential array. By arranging the thermobimetallic elements, the thermobimetallic elements are in a contracted state in the initial state, that is, they are located inside the fixing rod. When the module is working, heat is conducted to the radiator. When the temperature inside the radiator rises, the heat is also transferred to the thermobimetallic elements. The thermobimetallic elements expand after being heated to fill the connection between the fixing rod and the insertion rod, thereby driving the fixing rod and the insertion rod to an interference fit, thereby improving the stability of the housing when it is installed on the surface of the radiator.

[0009] In one embodiment of the present invention, a second pull rod is provided through the surface of the connecting frame and is slidably connected thereto; a pair of fixing holes are provided on the surface of the first pull rod; the fixing holes and the second pull rod are provided in correspondence; by providing the fixing holes and the second pull rod, taking the disassembly of the shell as an example, the second pull rod is first pulled out of the fixing hole, and then the first pull rod is pulled to pull the fixing rod out of the insertion rod, and then the second pull rod can be loosened so that the fixing hole is inserted into the other fixing hole. At this time, the first pull rod on one side is in a disengaged state and is temporarily fixed. The above operation is repeated to temporarily fix the other first pull rod, and then the shell can be removed from the surface of the radiator, reducing the need to pull the first pull rod for a long time when disassembling or installing the shell. At the same time, such a setting can be completed by one person, reducing the reliance on excessive manpower when installing and disassembling the shell.

[0010] In one embodiment of the present invention, a sliding frame is fixedly connected to the surface of the connecting frame; a slider is symmetrically fixed to the end of the second pull rod, and the slider and the sliding frame are slidably connected; a support groove is opened on the surface of the sliding frame; the support groove and the slider are correspondingly arranged; by setting the sliding frame, after the second pull rod is slid out of the first pull rod, the second pull rod can be continuously pulled to slide the slider out of the sliding frame, and then the second pull rod can be rotated 90° to align one of the sliders with the support groove, and then the second pull rod can be placed on the top of the sliding frame, and then the first pull rod can be operated. This arrangement can further reduce the situation where the pulling time required for operating the second pull rod is longer.

[0011] In one embodiment of the present invention, multiple rows of protrusions are symmetrically fixed to the outer wall of the heat dissipation fin; the protrusions in each row are staggered and have increasing sizes; by arranging the protrusions, when the cooling airflow generated by the air-cooling module reaches the surface of the heat dissipation fin, on the one hand, the protrusions can increase the heat exchange area between the heat dissipation fin and the airflow, and on the other hand, the mutual obstruction effect between the protrusions that are staggered and have increasing sizes will be minimized, thereby increasing the heat exchange area between the protrusions at the bottom and the airflow.

[0012] In one embodiment of the present invention, the air cooling module includes a plurality of first mesh plates; the first mesh plates are fixedly mounted on the surface of the shell; one side of the first mesh plate is rotatably connected to a rotating shaft, and a plurality of blades are fixedly connected to the outer wall of the rotating shaft; the end of the rotating shaft is fixedly connected to a flow diffuser, and the flow diffuser is arranged in a trumpet shape; when the air cooling module is working, the rotating shaft can rotate under the action of a motor, which is not shown in the figure. When the rotating shaft rotates, airflow is generated through the centrifugal action of the blades, and the airflow passes through the flow diffuser when flowing. Since the flow diffuser is a trumpet-shaped structure, it can diffuse the airflow, thereby expanding the flow range of the airflow, and thereby improving the cooling effect of the airflow on the heat dissipation fins.

[0013] In one embodiment of the present invention, a plurality of air ducts are fixedly connected to the outer wall of the diffuser plate; the air ducts are arranged in an arc shape; by setting the air ducts, the air ducts can forcibly guide the airflow on the surface of the diffuser plate, thereby making the flow direction of the airflow passing through the diffuser plate more turbulent, thereby further expanding the flow range of the airflow.

[0014] In one embodiment of the present invention, a second mesh plate is provided at the air outlets on both sides of the shell; the surface of the second mesh plate is a porous structure; by providing the second mesh plate, when the air flow inside the shell is discharged from the air outlet, it will also pass through the second mesh plate and be filtered to remove impurities, thereby reducing the interference of impurities carried in the air flow on the external environment.

[0015] In one embodiment of the present invention, a pair of Velcro strips are symmetrically fixed on both sides of the shell; the second mesh plate is located between the pair of Velcro strips; by setting the Velcro strips, the inner side of the second mesh plate and the surface of the Velcro strips can be correspondingly provided with a hook surface and a fleece surface to achieve rapid installation and removal of the second mesh plate, making it convenient for the device to replace or clean the second mesh plate.

[0016] The above technical solution of the present invention has the following advantages over the prior art:

[0017] 1. The IGBT module structure described in the present invention, through the cooperation of the housing and the air-cooling module, enables the air-cooling module to generate cooling airflow on the surface of the heat dissipating fins to force heat exchange when the radiator dissipates heat from the module, thereby improving the heat dissipation effect of the radiator on the module.

[0018] 2. The IGBT module structure described in the present invention can drive the fixing rod in and out of the insertion rod by pulling the first pull rod, so as to realize the rapid installation and removal of the device to the shell, so as to meet various usage and production requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 Schematic diagram of the structure of the shell in the present invention;

[0022] Figure 3 Schematic diagram of the structure of the substrate in the present invention;

[0023] Figure 4 Schematic diagram of the structure of the radiator in the present invention;

[0024] Figure 5 Schematic diagram of the structure of the first pull rod in the present invention;

[0025] Figure 6 Schematic diagram of the structure of the fixing rod in the present invention;

[0026] Figure 7 It is a structural schematic diagram of the flow diffusion plate in the present invention.

[0027] Explanation of the reference numerals in the specification: 1. Cover; 12. Radiator; 13. Base plate; 131. Cooling plate; 14. IGBT chip; 15. Heat sink; 16. Housing; 17. Air-cooled module; 2. Insert rod; 22. Connecting frame; 23. First pull rod; 24. Connecting plate; 25. Spring; 26. Fixing rod; 3. Thermo-bimetallic element; 4. Fixing hole; 42. Second pull rod; 5. Sliding frame; 52. Slider; 53. Support groove; 6. Bump; 7. First mesh plate; 72. Rotating shaft; 73. Diffuser; 8. Air duct; 9. Second mesh plate; 10. Velcro. DETAILED DESCRIPTION

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0029] Reference Figures 1 to 7As shown, an IGBT module structure of the present invention includes a cover 1, a cooling plate 131 is fixedly connected to the bottom of the cover 1; a base plate 13 is fixedly connected to the surface of the cooling plate 131; a plurality of IGBT chips 14 are fixedly connected to the surface of the base plate 13; a heat sink 12 is fixedly connected to the bottom of the cooling plate 131; a plurality of heat dissipation fins 15 are fixedly connected to the bottom of the heat sink 12; a shell 16 is provided at the bottom of the heat sink 12; both sides of the shell 16 are inclined, and an air cooling module 17 is fixedly installed on the inclined surface; Exhaust vents are provided on both sides of the housing 16. When the module is assembled, the IGBT chip 14 is welded to the surface of the substrate 13 through a copper bridge. The substrate 13 and the cooling plate 131 are fixed by welding. The cover 1 and the cooling plate 131 are locked by bolts. The surface of the substrate 13 is encapsulated with silicone to dissipate heat and protect the IGBT chip 14. The cooling plate 131 and the radiator 12 are also bolted. At the same time, the gap between the cooling plate 131 and the radiator 12 is filled with thermal grease to increase the cooling The heat exchange area between the plate 131 and the radiator 12, the rest of the module structure can be set in the same way as in the prior art, and will not be repeated here. When the module is tested or used, the shell 16 can be installed on the radiator 12 and the air cooling module 17 can be connected to the power supply. When the module is working, the IGBT chip 14 will dissipate heat, and the heat will be transferred to the radiator 12 through the substrate 13 and the cooling plate 131. The radiator 12 will transfer the heat to the surface of the heat dissipating fins 15 and dissipate the heat through heat exchange between the heat dissipating fins 15 and the air. At the same time, when the module is working, the air cooling module 17 will also be energized and generate active cooling airflow, which can be blown to the heat dissipating fins 15 on the surface of the radiator 12 to force heat exchange on the surface of the heat dissipating fins 15, thereby cooling the IGBT chip 14 in the substrate 13; through the cooperation of the shell 16 and the air cooling module 17, when the radiator 12 dissipates heat to the module, the air cooling module 17 can generate cooling airflow on the surface of the heat dissipating fins 15 to force heat exchange, thereby improving the heat dissipation effect of the radiator 12 on the module.A plurality of plug rods 2 are symmetrically fixed to the top of the shell 16, and slots corresponding to the plug rods 2 are provided at the bottom of the radiator 12; connecting frames 22 are fixed to both sides of the radiator 12; a first pull rod 23 is provided through the inner wall of the connecting frame 22 and is slidably connected; a connecting plate 24 is fixed to the end of the first pull rod 23; a pair of springs 25 are fixed between one side of the connecting plate 24 and the inner wall of the connecting frame 22; a plurality of fixing rods 26 are fixed to the other side of the connecting plate 24; the fixing rods 26 and the plug rods 2 are correspondingly provided, and slots corresponding to the fixing rods 26 are provided on the surface of the plug rods 2; when the shell 16 is installed, the first pull rods 23 on both sides can be pulled in advance so that the connecting plate 24 can be fixed with the fixing rods 26. The fixed rod 26 slides out of the radiator 12, and the spring 25 is in a compressed state. Then the insertion rod 2 on the shell 16 can be aligned with the slot on the surface of the radiator 12 and installed. Then the first pull rod 23 is loosened, causing the connecting plate 24 to reset under the elastic force of the spring 25 and allowing the fixed rod 26 to pass through the radiator 12 and the insertion rod 2 to engage and install the shell 16, thereby achieving rapid installation of the shell 16. Repeating the above operation can quickly disassemble the shell 16, which is convenient for installing and disassembling the shell 16 when testing the module; by pulling the first pull rod 23, the fixed rod 26 can be driven in and out of the insertion rod 2 to achieve rapid installation and disassembly of the shell 16 by the device, so that it can meet various usage and production requirements.

[0030] Reference Figure 5 and Figure 6 As shown, a plurality of plug rods 2 are symmetrically fixed to the top of the shell 16, and slots corresponding to the plug rods 2 are opened at the bottom of the radiator 12; connecting frames 22 are fixed to both sides of the radiator 12; a first pull rod 23 is provided through the inner wall of the connecting frame 22 and is slidably connected; a connecting plate 24 is fixed to the end of the first pull rod 23; a pair of springs 25 are fixed between one side of the connecting plate 24 and the inner wall of the connecting frame 22; a plurality of fixing rods 26 are fixed to the other side of the connecting plate 24; the fixing rods 26 and the plug rods 2 are correspondingly arranged, and slots corresponding to the fixing rods 26 are opened on the surface of the plug rods 2; when the shell 16 is installed, the first pull rods 23 on both sides can be pulled in advance so that the connecting plate 24 can be brought As the fixing rod 26 slides out of the radiator 12, the spring 25 will be in a compressed state. Then the insertion rod 2 on the shell 16 can be aligned with the slot on the surface of the radiator 12 and installed. Then the first pull rod 23 is loosened, causing the connecting plate 24 to reset under the elastic force of the spring 25 and allowing the fixing rod 26 to pass through the radiator 12 and the insertion rod 2, so as to engage and install the shell 16, thereby achieving rapid installation of the shell 16. Repeating the above operation can quickly disassemble the shell 16, which is convenient for installing and disassembling the shell 16 when testing the module; by pulling the first pull rod 23, the fixing rod 26 can be driven in and out of the insertion rod 2, so as to achieve rapid installation and disassembly of the shell 16 by the device, so that it can meet various usage and production requirements.

[0031] Reference Figure 6As shown, a plurality of thermobimetallic elements 3 are fixed to the outer wall of the fixing rod 26, and the thermobimetallic elements 3 are arranged in a circumferential array; by setting the thermobimetallic elements 3, the thermobimetallic elements 3 are in a contracted state in the initial state, that is, they are located inside the fixing rod 26. When the module is working, heat is conducted to the radiator 12. When the temperature inside the radiator 12 rises, the heat is also transferred to the thermobimetallic elements 3. The thermobimetallic elements 3 expand after being heated to fill the connection between the fixing rod 26 and the insertion rod 2, thereby driving the fixing rod 26 and the insertion rod 2 to be interference fit, thereby improving the stability of the shell 16 when it is installed on the surface of the radiator 12.

[0032] Reference Figure 6 As shown, a second pull rod 42 is provided on the surface of the connecting frame 22 and is slidably connected thereto; a pair of fixing holes 4 are provided on the surface of the first pull rod 23; the fixing holes 4 and the second pull rod 42 are correspondingly provided; by providing the fixing holes 4 and the second pull rod 42, taking the disassembly of the shell 16 as an example, the second pull rod 42 is first pulled out from the fixing hole 4, and then the first pull rod 23 is pulled to pull the fixing rod 26 out of the insertion rod 2, and then the second pull rod 42 can be loosened so that the fixing hole 4 is inserted into the other fixing hole 4. At this time, the first pull rod 23 on one side is in a disengaged state and is temporarily fixed. Repeat the above operation to temporarily fix the other first pull rod 23, and then the shell 16 can be removed from the surface of the radiator 12, reducing the need to pull the first pull rod 23 for a long time when disassembling or installing the shell 16. At the same time, such a setting can be completed by one person, reducing the reliance on excessive manpower when installing and disassembling the shell 16.

[0033] Reference Figure 6 As shown, a sliding frame 5 is fixedly connected to the surface of the connecting frame 22; a slider 52 is symmetrically fixed to the end of the second pull rod 42, and the slider 52 and the sliding frame 5 are slidably connected; a support groove 53 is opened on the surface of the sliding frame 5; the support groove 53 and the slider 52 are correspondingly arranged; by setting the sliding frame 5, after the second pull rod 42 is slid out of the first pull rod 23, the second pull rod 42 can be continuously pulled to slide the slider 52 out of the sliding frame 5, and then the second pull rod 42 can be rotated 90° to align one of the sliders 52 with the support groove 53, and then the second pull rod 42 can be placed on the top of the sliding frame 5, and then the first pull rod 23 can be operated. This arrangement can further reduce the situation where the pulling time required for the second pull rod 42 is longer when operating.

[0034] Reference Figure 4 and Figure 5As shown, the outer wall of the heat dissipation fin 15 is symmetrically fixed with multiple rows of protrusions 6; the protrusions 6 in each row are staggered and the sizes are set in increasing order; by arranging the protrusions 6, when the cooling airflow generated by the air-cooling module 17 reaches the surface of the heat dissipation fin 15, on the one hand, the protrusions 6 can increase the heat exchange area between the heat dissipation fin 15 and the airflow, and on the other hand, the mutual obstruction effect between the protrusions 6 that are staggered and increase in size will be reduced to a minimum, thereby increasing the heat exchange area between the protrusions 6 at the bottom and the airflow.

[0035] Reference Figure 4 and Figure 7 As shown, the air cooling module 17 includes multiple first mesh plates 7; the first mesh plates 7 are fixedly mounted on the surface of the shell 16; one side of the first mesh plate 7 is rotatably connected to a rotating shaft 72, and a plurality of blades are fixedly connected to the outer wall of the rotating shaft 72; the end of the rotating shaft 72 is fixedly connected to a diffuser plate 73, and the diffuser plate 73 is horn-shaped; when the air cooling module 17 is working, the rotating shaft 72 can rotate under the action of a motor, which is not shown in the figure. When the rotating shaft 72 rotates, airflow is generated through the centrifugal action of the blades, and the airflow passes through the diffuser plate 73 when flowing. Since the diffuser plate 73 is a horn-shaped structure, it can diffuse the airflow when it flows, thereby expanding the flow range of the airflow, thereby improving the cooling effect of the airflow on the heat dissipation fins 15.

[0036] Reference Figure 7 As shown, a plurality of air ducts 8 are fixedly connected to the outer wall of the diffuser plate 73; the air ducts 8 are arranged in an arc shape; by setting the air ducts 8, the air ducts 8 can forcibly guide the airflow on the surface of the diffuser plate 73, thereby making the flow direction of the airflow passing through the diffuser plate 73 more turbulent, thereby further expanding the flow range of the airflow.

[0037] Reference Figures 1 to 4 As shown, the exhaust ports on both sides of the shell 16 are provided with a second mesh plate 9; the surface of the second mesh plate 9 is a porous structure; by providing the second mesh plate 9, when the air flow inside the shell 16 is discharged from the exhaust port, it will also pass through the second mesh plate 9 and be filtered and removed, thereby reducing the interference of impurities carried in the air flow on the external environment.

[0038] Reference Figures 1 to 4 As shown, a pair of Velcro strips 10 are symmetrically fixed on both sides of the shell 16; the second mesh plate 9 is located between the pair of Velcro strips 10; by setting the Velcro strips 10, the inner side of the second mesh plate 9 and the surface of the Velcro strips 10 can be correspondingly provided with hook surfaces and fleece surfaces to achieve rapid installation and removal of the second mesh plate 9, making it convenient for the device to replace or clean the second mesh plate 9.

[0039] Working principle: When the module is assembled, the IGBT chip 14 is welded to the surface of the substrate 13 through a copper bridge. The substrate 13 and the cooling plate 131 are welded and fixed. The cover 1 and the cooling plate 131 are locked at the corners by bolts. The surface of the substrate 13 is encapsulated with silicone to dissipate heat and protect the IGBT chip 14. The cooling plate 131 and the radiator 12 are also bolted. At the same time, the gap between the cooling plate 131 and the radiator 12 is filled with thermal grease to increase the heat exchange area between the cooling plate 131 and the radiator 12. The rest of the module structure can be set in the same way as in the prior art and will not be repeated here. As described above, when the module is tested or used, the housing 16 can be installed on the radiator 12 and the air cooling module 17 can be connected to the power supply. When the module is working, the IGBT chip 14 will dissipate heat, and the heat will be transferred to the radiator 12 through the substrate 13 and the cooling plate 131. The radiator 12 will transfer the heat to the surface of the heat dissipation fins 15 and dissipate the heat through heat exchange between the heat dissipation fins 15 and the air. At the same time, when the module is working, the air cooling module 17 will also be powered on and generate active cooling airflow. The airflow can be blown to the heat dissipation fins 15 on the surface of the radiator 12 to force heat exchange on the surface of the heat dissipation fins 15, thereby The IGBT chip 14 in the substrate 13 is cooled; when the shell 16 is installed, the first pull rods 23 on both sides can be pulled in advance so that the connecting plate 24 slides out of the radiator 12 with the fixing rod 26, and the spring 25 will be in a compressed state. Then the insertion rod 2 on the shell 16 can be aligned with the slot on the surface of the radiator 12 and installed. Then, the first pull rod 23 is released, so that the connecting plate 24 is reset under the elastic force of the spring 25 and the fixing rod 26 passes through the radiator 12 and the insertion rod 2, so as to engage and install the shell 16, thereby realizing the rapid installation of the shell 16. The above operation can be repeated to install the shell 16 is quickly disassembled, which facilitates the installation and removal of the housing 16 when testing the module; by providing a thermal bimetallic element 3, the thermal bimetallic element 3 is in a contracted state in the initial state, that is, it is located inside the fixing rod 26. When the module is working, it conducts heat to the radiator 12. When the temperature inside the radiator 12 rises, it also transfers heat to the thermal bimetallic element 3. The thermal bimetallic element 3 expands after being heated to fill the connection between the fixing rod 26 and the insertion rod 2, thereby driving the fixing rod 26 and the insertion rod 2 to an interference fit, thereby improving the stability of the housing 16 when it is installed on the surface of the radiator 12;By setting the fixing hole 4 and the second pull rod 42, taking the disassembly of the shell 16 as an example, first pull the second pull rod 42 out of the fixing hole 4, then pull the first pull rod 23 to pull the fixing rod 26 out of the insertion rod 2, and then loosen the second pull rod 42 so that the fixing hole 4 is inserted into the other fixing hole 4. At this time, the first pull rod 23 on one side is in a disengaged state and is temporarily fixed. Repeat the above operation to temporarily fix the other first pull rod 23. Then the shell 16 can be removed from the surface of the radiator 12, reducing the need to pull the first pull rod 23 for a long time when disassembling or installing the shell 16. At the same time, this setting can be completed by one person. The operation is completed, reducing the reliance on excessive manual labor when installing and removing the shell 16; by providing the sliding frame 5, after the second pull rod 42 is slid out of the first pull rod 23, the second pull rod 42 can be continuously pulled to slide the slider 52 out of the sliding frame 5, and then the second pull rod 42 can be rotated 90 degrees to align one of the sliders 52 with the support groove 53, and then the second pull rod 42 can be placed on the top of the sliding frame 5, and then the first pull rod 23 can be operated. This setting can further reduce the need for a long time to pull the second pull rod 42 when operating; by providing the protrusion 6, the cooling airflow generated by the air cooling module 17 reaches the surface of the heat sink 15 When the heat dissipation module 17 is in operation, the rotating shaft 72 can rotate under the action of the motor, which is not shown in the figure. When the rotating shaft 72 rotates, the centrifugal action of the blades will generate airflow, and the airflow will pass through the diffuser 73 when it flows. Since the diffuser 73 is a trumpet-shaped structure, it can expand the airflow when it flows, thereby expanding the flow range of the airflow and improving the cooling effect of the airflow on the heat dissipation fins 15. The air duct 8 forcibly guides the airflow on the surface of the diffuser 73, thereby making the airflow through the diffuser 73 more turbulent, thereby further expanding the flow range of the airflow. The second mesh plate 9 is provided so that the airflow inside the housing 16 will also pass through the second mesh plate 9 and be filtered when it is discharged from the exhaust port, thereby reducing the interference of impurities carried in the airflow with the external environment. The hook surface and the surface of the Velcro 10 can be correspondingly provided on the inner side of the second mesh plate 9 and the Velcro 10, so that the second mesh plate 9 can be quickly installed and removed, and the device can easily replace or clean the second mesh plate 9.

[0040] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An IGBT module structure, comprising a cover (1), characterized in that: The bottom of the cover (1) is fixedly connected to a cooling plate (131); the surface of the cooling plate (131) is fixedly connected to a substrate (13); the surface of the substrate (13) is fixedly connected to a plurality of IGBT chips (14); the bottom of the cooling plate (131) is fixedly connected to a radiator (12); the bottom of the radiator (12) is fixedly connected to a plurality of heat dissipation fins (15); the bottom of the radiator (12) is provided with a shell (16); both sides of the shell (16) are inclined, and an air cooling module (17) is fixedly installed on the inclined surface; both sides of the shell (16) are provided with exhaust ports.

2. The IGBT module structure according to claim 1, characterized in that: A plurality of plug rods (2) are symmetrically fixed to the top of the shell (16), and a slot corresponding to the plug rod (2) is provided at the bottom of the radiator (12); a connecting frame (22) is fixed to both sides of the radiator (12); a first pull rod (23) is provided through the inner wall of the connecting frame (22) and is slidably connected; a connecting plate (24) is fixed to the end of the first pull rod (23); a pair of springs (25) are fixed between one side of the connecting plate (24) and the inner wall of the connecting frame (22); a plurality of fixing rods (26) are fixed to the other side of the connecting plate (24); the fixing rods (26) and the plug rods (2) are correspondingly arranged, and a slot corresponding to the fixing rods (26) is provided on the surface of the plug rod (2).

3. The IGBT module structure according to claim 2, characterized in that: A plurality of thermal bimetallic elements (3) are fixedly connected to the outer wall of the fixing rod (26), and the thermal bimetallic elements (3) are arranged in a circumferential array.

4. The IGBT module structure according to claim 3, characterized in that: A second pull rod (42) is provided through the surface of the connecting frame (22) and is slidably connected thereto; a pair of fixing holes (4) are provided on the surface of the first pull rod (23); the fixing holes (4) and the second pull rod (42) are correspondingly provided.

5. The IGBT module structure according to claim 4, characterized in that: The surface of the connecting frame (22) is fixedly connected to a sliding frame (5); the end of the second pull rod (42) is symmetrically fixedly connected to a slider (52), and the slider (52) and the sliding frame (5) are slidably connected; the surface of the sliding frame (5) is provided with a supporting groove (53); the supporting groove (53) and the slider (52) are correspondingly arranged.

6. The IGBT module structure according to claim 5, characterized in that: Multiple rows of protrusions (6) are symmetrically fixed to the outer wall of the heat dissipation fin (15); the protrusions (6) in each row are staggered and have increasing sizes.

7. The IGBT module structure according to claim 6, characterized in that: The air cooling module (17) includes a plurality of first mesh plates (7); the first mesh plates (7) are fixedly mounted on the surface of the housing (16); one side of the first mesh plate (7) is rotatably connected to a rotating shaft (72), and a plurality of blades are fixedly connected to the outer wall of the rotating shaft (72); a flow diffuser (73) is fixedly connected to the end of the rotating shaft (72), and the flow diffuser (73) is arranged in a trumpet shape.

8. The IGBT module structure according to claim 7, characterized in that: A plurality of air ducts (8) are fixedly connected to the outer wall of the flow diffusion plate (73); the air ducts (8) are arranged in an arc shape.

9. The IGBT module structure according to claim 8, characterized in that: The air outlets on both sides of the shell (16) are each provided with a second mesh plate (9); the surface of the second mesh plate (9) is a porous structure.

10. The IGBT module structure according to claim 9, characterized in that: A pair of Velcro strips (10) are symmetrically fixed to both sides of the housing (16); the second mesh plate (9) is located between the pair of Velcro strips (10).

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