Mini led circuit board etching liquid immersion etching device

Abstract

The application discloses a kind of miniLED circuit board etching liquid immersion etching device, it is related to etching field, including bottom plate, the mounting bracket is slidably connected on the bottom plate by sliding assembly, the mounting plate is rotatably connected to the mounting bracket, the motor is fixedly connected on the mounting bracket, for rotating mounting plate;Several clamps are rotatably connected on the mounting plate, and the circuit board is clamped on the clamp, the swing assembly is fixedly connected on the mounting bracket, and the circuit board can be rotated when the mounting plate is rotated and cooperates with swing assembly.It is beneficial to have effect in that clamp cooperates with unfolding assembly, when mounting plate is rotated to specified angle, can automatically unfold clamping plate, and it is convenient to place circuit board, and the angle of circuit board that is raised can prevent from sliding when not clamped, after mounting plate reversely rotates and separates from unfolding assembly, clamp automatically clamps circuit board, and this design improves the convenience of feeding.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of etching technology, in particular to a miniLED circuit board etching liquid immersion etching device. BACKGROUND

[0002] In the field of miniLED circuit board manufacturing, etching process is a key link to form fine circuit patterns. At present, in the operation of clamping and taking down the circuit board, the existing technology mostly adopts manual mechanical clamps. The specific operation steps are complicated: when loading, the operator needs to manually open the clamp first, then carefully place the miniLED circuit board on the clamping part of the clamp, and then adjust the clamping force of the clamp one by one through tightening bolts, buckles and other ways to ensure the fixation of the circuit board. This process not only takes a long time, but also may cause deformation or damage of the circuit board due to uneven clamping force. After etching is completed, it is also troublesome to take down the circuit board. Some devices try to use electric clamps. However, electric clamps have obvious cost disadvantages. Electric clamps need to be equipped with motors, sensors, controllers and other electronic components, which have high procurement cost.

[0003] In addition, during the etching process, the movement form of the circuit board in the etching liquid is single, usually only static soaking or simple horizontal movement, which makes the contact between the etching liquid and the surface of the circuit board insufficient, and uneven etching phenomenon is easy to occur, which cannot meet the high precision and high reliability etching requirements of miniLED circuit board. SUMMARY

[0004] The purpose of the present application is to provide a miniLED circuit board etching liquid immersion etching device to solve the above problems, as described below.

[0005] To achieve the above purpose, the present application provides the following technical solutions:

[0006] The miniLED circuit board etching liquid immersion etching device provided by the present application comprises a bottom plate, a mounting frame is slidably connected to the bottom plate through a sliding assembly, the mounting frame is rotatably connected to a mounting plate, a motor is fixedly connected to the mounting frame for rotating the mounting plate;

[0007] A plurality of clamps are rotatably connected to the mounting plate, the clamps clamping the circuit board, a swing assembly is fixedly connected to the mounting frame, and the mounting plate can rotate the circuit board in cooperation with the swing assembly;

[0008] The clamp comprises two clamping plates close to each other, an unfolding assembly is fixedly connected to the mounting plate, and the mounting plate drives the circuit board to rotate to an angle greater than the horizontal angle, and the two clamping plates are separated from each other in cooperation with the unfolding assembly.

[0009] The above-mentioned miniLED circuit board etching solution is used to immerse the etching device. The motor rotates the mounting plate. After the mounting plate rotates to a specified angle, with the cooperation of the unfolding component, all the clamping plates of the fixture can be unfolded. At this time, the circuit board can be placed between the two clamping plates. At this time, the angle of the circuit board is raised. Therefore, even if the fixture does not clamp the circuit board, the circuit board will not slide down from the fixture. After the motor rotates the mounting plate in the opposite direction and detaches from the unfolding component, the fixture can clamp the circuit board.

[0010] The circuit board is moved above the etching solution tank by the mounting bracket. The motor rotates the mounting plate, immersing the circuit board in the etching solution tank. The motor and the mounting plate work together to drive the circuit board to swing back and forth in the etching solution tank, stirring the solution. As the circuit board swings with the mounting plate, it works with the swinging component, and the clamp can rotate back and forth, so that the circuit board can repeatedly contact the solution while swinging back and forth.

[0011] Preferably, the base plate is fixedly connected to an etching solution tank and an ultrasonic cleaning tank, and the circuit board corresponds to the etching solution tank and the ultrasonic cleaning tank.

[0012] Preferably, the sliding assembly includes a first sliding groove and a second sliding groove formed on both sides of the base plate. The depth direction of the first sliding groove is perpendicular to and connected to the second sliding groove. The mounting frame is an inverted U-shape. The two sides of the mounting frame are respectively fitted with the two first sliding grooves with a clearance. A guide block is slidably connected in the second sliding groove. The guide block is fixedly connected to the mounting frame.

[0013] Preferably, the mounting bracket is threaded with bolts, the ends of which correspond to the side of the etching solution tank or ultrasonic cleaning tank.

[0014] Preferably, a rotating shaft is fixedly connected to both sides of the mounting plate, and the two rotating shafts are rotatably connected to the mounting plate. The motor output shaft is fixedly connected to the end of either rotating shaft.

[0015] Preferably, the clamp includes a fixed sleeve rotatably connected to a mounting plate. A rectangular rod is fixedly connected inside the fixed sleeve, with its length direction along the diameter of the fixed sleeve. Two movable plates are slidably connected to the rectangular rod. The bottom of the fixed sleeve is open, and the movable plates pass through the bottom of the fixed sleeve and are fixedly connected to clamping plates. A tension spring is fitted on the surface of the rectangular rod, with its two ends fixedly connected to the two movable plates respectively. Two springs are fitted on the surface of the rectangular rod, with their two ends fixedly connected to the inner wall of the fixed sleeve and the movable plates respectively.

[0016] Preferably, the unfolding assembly includes a vertical rod that passes through the top of the fixed sleeve and is slidably connected to the top of the fixed sleeve. A top block is fixedly connected to one end of the vertical rod that is inserted into the fixed sleeve. The top block corresponds to two movable plates. Inclined surfaces are provided on both sides of the top block to push the two movable plates away from each other.

[0017] Preferably, a pressure plate is rotatably connected to the top of the fixed sleeve, and the bottom of the pressure plate contacts the upper end of the vertical rod. Several limiting rods corresponding to the pressure plate are fixedly connected to the mounting plate.

[0018] Preferably, the top of the fixed sleeve is fixedly connected to two fixed plates, and a pin is rotatably connected between the two fixed plates. A pressure plate is fixedly connected to the pin, and a torsion spring is sleeved on the surface of the pin. The two ends of the torsion spring are fixedly connected to the pressure plate and the fixed plate, respectively. The pin is lower than the top of the vertical rod.

[0019] Preferably, the swing assembly includes a torsion spring sleeved on the surface of the clamp, with both ends of the torsion spring fixedly connected to the clamp and the mounting plate, respectively. An L-shaped rod is fixedly connected to the surface of the clamp, and a plurality of fixed rods are fixedly connected to the mounting frame. The fixed rods are vertically arranged and correspond to the horizontal bar of the L-shaped rod.

[0020] The beneficial effects are:

[0021] 1. The clamp and unfolding assembly work together to automatically unfold the clamp when the mounting plate is rotated to a specified angle, which facilitates the placement of the circuit board. The upward angle of the circuit board can prevent it from slipping off if it is not clamped. After the mounting plate rotates in the opposite direction and detaches from the unfolding assembly, the clamp automatically clamps the circuit board. This design improves the convenience of loading.

[0022] 2. The mounting bracket, motor and oscillating component work together to enable the circuit board to not only oscillate and stir the solution in the etching solution, but also to rotate itself during the oscillation process. This greatly increases the contact frequency and contact area between the circuit board and the etching solution, significantly improves etching uniformity and etching efficiency, and ensures the etching quality of the miniLED circuit board.

[0023] 3. The device integrates an etching solution tank and an ultrasonic cleaning tank, and uses a sliding component to allow the mounting bracket to slide between the two. Combined with the motor to control the rotation of the mounting plate, it can improve the efficiency of the circuit board from etching to cleaning.

[0024] 4. This device operates primarily through mechanical linkage, eliminating the need for electric clamps and complex electronic control systems. This avoids the problem of electronic components being easily damaged in corrosive environments, greatly improving the stability and durability of the device. Simultaneously, it reduces the costs of purchasing, installing, debugging, and maintaining electronic components, making it cheaper than electric devices. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0027] Figure 2 This is a front view structural diagram of the present invention;

[0028] Figure 3 This is a schematic diagram of the three-dimensional cross-sectional structure of the base plate of the present invention;

[0029] Figure 4 This is a schematic diagram of the circuit board of the present invention swinging to a horizontal state;

[0030] Figure 5 This is a three-dimensional structural diagram of the mounting bracket of the present invention;

[0031] Figure 6 This is the present invention. Figure 5 Enlarged structural diagram at point A in the middle;

[0032] Figure 7 This is a schematic diagram of the three-dimensional cross-sectional structure of the fixing sleeve of the present invention;

[0033] Figure 8 This is a schematic diagram of the three-dimensional structure of the fixing sleeve of the present invention.

[0034] The annotations in the attached figures are explained as follows:

[0035] 1. Base plate; 2. Etching solution tank; 3. Ultrasonic cleaning tank; 4. Sliding assembly; 5. Mounting bracket; 6. Mounting plate; 7. Motor; 8. Clamp; 9. Circuit board; 10. Slide 1; 11. Slide 2; 12. Guide block; 13. Bolt; 14. Rotating shaft; 15. Torsion spring 1; 16. Swing assembly; 17. Unfolding assembly; 18. Fixing rod; 19. L-shaped rod; 20. Rectangular rod; 21. Tension spring; 22. Spring; 23. Movable plate; 24. Clamping plate; 25. Top block; 26. Curved surface; 27. Vertical rod; 28. Pressure plate; 29. ​​Limiting rod; 30. Pin; 31. Fixing plate; 32. Torsion spring 2; 33. Fixing sleeve. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0037] See Figures 1-8 As shown, the present invention provides a miniLED circuit board etching solution immersion etching device, including a base plate 1, a mounting frame 5 slidably connected to the base plate 1 via a sliding component 4, a mounting plate 6 rotatably connected to the mounting frame 5, and a motor 7 fixedly connected to the mounting frame 5 for rotating the mounting plate 6.

[0038] A number of clamps 8 are rotatably connected to the mounting plate 6, and the circuit board 9 is clamped on the clamps 8. The swing assembly 16 is fixedly connected to the mounting frame 5. When the mounting plate 6 rotates, it can rotate the circuit board 9 by cooperating with the swing assembly 16.

[0039] The clamp 8 includes two clamping plates 24 that are close to each other. An unfolding component 17 is fixedly connected to the mounting plate 6. When the mounting plate 6 drives the circuit board 9 to rotate to an angle greater than the horizontal angle, it cooperates with the unfolding component 17 to make the two clamping plates 24 move away from each other and detach from the circuit board 9.

[0040] As an optional implementation, the base plate 1 is fixedly connected to the etching solution tank 2 and the ultrasonic cleaning tank 3, with the circuit board 9 corresponding to both. The guide block 12 in the sliding assembly 4 slides within the slide groove 11, causing the mounting bracket 5 to move horizontally above the etching solution tank 2. After cleaning, the motor 7 rotates in the reverse direction, removing the circuit board 9 from the cleaning tank. The motor 7 drives the mounting plate 6 to rotate downwards, immersing the circuit board 9 in the cleaning solution. The ultrasonic generator is activated, using high-frequency vibration to remove residual etching solution and impurities from the circuit board surface. The mounting plate 6 can be slightly oscillated to enhance the cleaning effect.

[0041] A liquid level sensor and a photoelectric sensor are installed at the bottom of the etching solution tank 2. When an abnormal liquid level change or circuit board image is detected, the machine will stop immediately and an alarm will be triggered to prevent the circuit board 9 from slipping off.

[0042] The sliding assembly 4 includes a first slide groove 10 and a second slide groove 11 on both sides of the base plate 1. The depth direction of the first slide groove 10 is perpendicular to and connected to the second slide groove 11. The mounting frame 5 is an inverted U-shape. The two sides of the mounting frame 5 are respectively fitted with the two first slide grooves 10 with clearance. A guide block 12 is slidably connected in the second slide groove 11. The guide block 12 is fixedly connected to the mounting frame 5. The sliding assembly 4 can be manually driven or electrically driven, such as a linear motor.

[0043] The mounting bracket 5 is threaded with bolts 13. The end of bolt 13 corresponds to the side of the etching solution tank 2 or the ultrasonic cleaning tank 3. Rotate bolt 13 so that its end abuts against the side of the etching solution tank 2 to fix the position of the mounting bracket 5.

[0044] Both sides of the mounting plate 6 are fixedly connected to rotating shafts 14, and the two rotating shafts 14 are rotatably connected to the mounting plate 6. The output shaft of the motor 7 is fixedly connected to the end of any one of the rotating shafts 14.

[0045] The clamp 8 includes a fixed sleeve 33, which is rotatably connected to the mounting plate 6. A rectangular rod 20 is fixedly connected inside the fixed sleeve 33. The length of the rectangular rod 20 is set along the diameter of the fixed sleeve 33. Two movable plates 23 are slidably connected to the rectangular rod 20. The bottom of the fixed sleeve 33 is open. The movable plates 23 pass through the bottom of the fixed sleeve 33 and are fixedly connected to a clamping plate 24. A tension spring 21 is sleeved on the surface of the rectangular rod 20. The two ends of the tension spring 21 are fixedly connected to the two movable plates 23 respectively. Two springs 22 are sleeved on the surface of the rectangular rod 20. The two ends of the springs 22 are fixedly connected to the inner wall of the fixed sleeve 33 and the movable plates 23 respectively.

[0046] The tension spring 21 is sleeved on the surface of the rectangular rod 20, and its two ends are connected to the two movable plates 23 respectively, providing a pulling force to bring the two movable plates 23 closer to each other; the spring 22 is also sleeved on the surface of the rectangular rod 20, and its two ends are connected to the inner wall of the fixed sleeve 33 and the movable plate 23 respectively, playing the role of assisting in reset and adjusting the clamping force.

[0047] The clamp 8 employs a combination structure of two elastic elements: a tension spring 21 and a spring 22. The tension spring 21 connects to two movable plates 23 at both ends, primarily providing lateral contraction force to pull the clamping plate 24 towards the center. One end of the spring 22 is connected to the inner wall of the fixed sleeve 33, while the other end acts on the movable plate 23, assisting the tension spring 21 in enhancing the clamping effect while also providing cushioning and fine-tuning of the clamping force. Working together, the two elements generate a stable and substantial clamping force when the clamping plate 24 is closed, firmly securing the circuit board 9.

[0048] During the device research and development and production phases, static clamping force tests were conducted on fixture 8. Standard test plates of different weights, sizes, and shapes were placed in fixture 8, and the maximum tensile and pushing forces that the clamping plates 24 could withstand after clamping were measured to ensure that the clamping force met the design requirements and had a certain safety margin. Dynamic simulation tests were conducted on fixture 8 to simulate the actual working conditions of circuit board 9 during the etching process. Fixture 8 with circuit board 9 mounted was placed in simulated etching solution tank 2, and the mounting plate 6 was driven by motor 7 to reciprocate and rotate, while the changes in clamping force of clamping plates 24 and the fixation status of circuit board 9 were monitored. Repeated tests were conducted to verify that fixture 8 could maintain sufficient clamping force under dynamic conditions to ensure the stable fixation of circuit board 9.

[0049] When no external force is applied, the elastic force of the tension spring 21 and the spring 22 causes the two clamping plates 24 to move closer together and be in a clamped state. When it is necessary to place the circuit board 9, under the cooperation of the external force and the unfolding assembly, the movable plate 23 overcomes the elastic force of the tension spring 21 and the spring 22 and slides on the rectangular rod 20, causing the clamping plates 24 to move away from each other and open the clamp 8; when the external force disappears, the tension spring 21 and the spring 22 return to their original positions, pulling the movable plate 23 to drive the clamping plates 24 to clamp the circuit board 9, thereby achieving stable clamping of the circuit board 9.

[0050] The unfolding component 17 includes a vertical rod 27, which passes through the top of the fixed sleeve 33 and is slidably connected to the top of the fixed sleeve 33. A top block 25 is fixedly connected to one end of the vertical rod 27 inserted into the fixed sleeve 33. The top block 25 corresponds to two movable plates 23. Both sides of the top block 25 are provided with inclined surfaces to push the two movable plates 23 away from each other.

[0051] The top of the fixed sleeve 33 is rotatably connected to a pressure plate 28, and the bottom of the pressure plate 28 contacts the upper end of the vertical rod 27. Several limiting rods 29 corresponding to the pressure plate 28 are fixedly connected to the mounting plate 6.

[0052] When the mounting plate 6 rotates to the designated angle, the pressure plate 28 is blocked by the limiting rod 29. At this time, the pressure plate 28 will push the vertical rod 27, and the vertical rod 27 will drive the top block 25 to descend. After the inclined surfaces on both sides of the top block 25 come into contact with the movable plate 23, as the top block 25 continues to descend, the inclined surfaces generate a horizontal component force, which pushes the two movable plates 23 to slide on the rectangular rod 20, overcoming the elastic force of the tension spring 21 and the spring 22, and causing the two clamping plates 24 to move away from each other.

[0053] The top of the fixed sleeve 33 is fixedly connected to two fixed plates 31, and a pin 30 is rotatably connected between the two fixed plates 31. A pressure plate 28 is fixedly connected to the pin 30, and a torsion spring 32 is sleeved on the surface of the pin 30. The two ends of the torsion spring 32 are fixedly connected to the pressure plate 28 and the fixed plate 31 respectively. The pin 30 is lower than the top of the vertical rod 27.

[0054] The swing assembly 16 includes a torsion spring 15 sleeved on the surface of the clamp 8. The two ends of the torsion spring 15 are fixedly connected to the clamp 8 and the mounting plate 6 respectively. An L-shaped rod 19 is fixedly connected to the surface of the clamp 8. Several fixing rods 18 are fixedly connected to the mounting frame 5. The fixing rods 18 are vertically arranged and correspond to the horizontal bar of the L-shaped rod 19.

[0055] The L-shaped rod 19 on the surface of the fixture 8 interacts with the fixed rod 18 on the mounting bracket 5. When the mounting plate 6 drives the circuit board 9 to swing, the crossbar of the L-shaped rod 19 contacts the fixed rod 18 and is subjected to force, causing the fixture 8 to overcome the elastic force of the torsion spring 15 and reciprocate on the mounting plate 6. This allows the circuit board 9 to reciprocate while swinging back and forth, increasing the contact frequency and contact area between the circuit board 9 and the etching solution, improving etching uniformity and efficiency. A polyurethane buffer pad is added at the contact end between the L-shaped rod 19 and the fixed rod 18 to reduce the impact force of collision.

[0056] With the above structure, the mounting plate 6 is rotated by the motor 7. After the mounting plate 6 is rotated to a specified angle, with the cooperation of the unfolding component 17, all the clamping plates 24 of the clamp 8 can be unfolded. At that time, the circuit board 9 can be placed between the two clamping plates 24. At this time, the angle of the circuit board 9 is raised. Therefore, even if the clamp 8 does not clamp the circuit board 9, the circuit board 9 will not slide down from the clamp 8. After the mounting plate 6 is rotated in the opposite direction by the motor 7 and is released from the unfolding component 17, the clamp 8 can clamp the circuit board 9.

[0057] The circuit board 9 is moved above the etching solution tank 2 by the mounting bracket 5. The mounting plate 6 is rotated by the motor 7, so that the circuit board 9 is immersed in the etching solution in the etching solution tank 2. The motor 7 and the mounting plate 6 work together to drive the circuit board 9 to swing back and forth in the etching solution tank 2, stirring the solution. As the circuit board 9 swings with the mounting plate 6, it works with the swing component 16, and the clamp 8 can rotate back and forth, so that the circuit board 9 swings back and forth and rotates back and forth at the same time, so that the circuit board 9 repeatedly contacts the solution.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A miniLED circuit board etching solution immersion etching device, characterized in that: Includes a base plate (1), on which a mounting bracket (5) is slidably connected via a sliding assembly (4), and a mounting plate (6) is rotatably connected to the mounting bracket (5). A motor (7) is fixedly connected to the mounting bracket (5) for rotating the mounting plate (6). A plurality of clamps (8) are rotatably connected to the mounting plate (6), and the clamps (8) hold the circuit board (9). A swing assembly (16) is fixedly connected to the mounting frame (5). When the mounting plate (6) rotates, it cooperates with the swing assembly (16) to rotate the circuit board (9). The clamp (8) includes two clamping plates (24) close to each other. An unfolding component (17) is fixedly connected to the mounting plate (6). When the mounting plate (6) drives the circuit board (9) to rotate to a greater than horizontal angle, it cooperates with the unfolding component (17) to make the two clamping plates (24) move away from each other and detach from the circuit board (9). The clamp (8) includes a fixed sleeve (33), which is rotatably connected to the mounting plate (6). A rectangular rod (20) is fixedly connected inside the fixed sleeve (33). The length of the rectangular rod (20) is set along the diameter of the fixed sleeve (33). Two movable plates (23) are slidably connected on the rectangular rod (20). The bottom of the fixed sleeve (33) is open. The movable plates (23) pass through the bottom of the fixed sleeve (33) and are fixedly connected to a clamping plate (24). A tension spring (21) is sleeved on the surface of the rectangular rod (20). The two ends of the tension spring (21) are fixedly connected to the two movable plates (23) respectively. Two springs (22) are sleeved on the surface of the rectangular rod (20). The two ends of the springs (22) are fixedly connected to the inner wall of the fixed sleeve (33) and the movable plates (23) respectively. The unfolding assembly (17) includes a vertical rod (27), which passes through the top of the fixed sleeve (33) and is slidably connected to the top of the fixed sleeve (33). A top block (25) is fixedly connected to one end of the vertical rod (27) inserted into the fixed sleeve (33). The top block (25) corresponds to the two movable plates (23). Both sides of the top block (25) are provided with inclined surfaces to push the two movable plates (23) away from each other.

2. The miniLED circuit board etching solution immersion etching device according to claim 1, characterized in that: The base plate (1) is fixedly connected to an etching solution tank (2) and an ultrasonic cleaning tank (3), and the circuit board (9) corresponds to the etching solution tank (2) and the ultrasonic cleaning tank (3).

3. The miniLED circuit board etching solution immersion etching device according to claim 1, characterized in that: The sliding assembly (4) includes a first sliding groove (10) and a second sliding groove (11) on both sides of the base plate (1). The depth direction of the first sliding groove (10) is perpendicular to and connected to the second sliding groove (11). The mounting bracket (5) is an inverted U-shape. The two sides of the mounting bracket (5) are respectively fitted with the two first sliding grooves (10) with a clearance. A guide block (12) is slidably connected in the second sliding groove (11). The guide block (12) is fixedly connected to the mounting bracket (5).

4. The miniLED circuit board etching solution immersion etching device according to claim 3, characterized in that: The mounting bracket (5) is threaded with bolts (13), the ends of which correspond to the side of the etching solution tank (2) or the ultrasonic cleaning tank (3).

5. The miniLED circuit board etching solution immersion etching device according to claim 1, characterized in that: The mounting plate (6) has two rotating shafts (14) fixedly connected to both sides. The two rotating shafts (14) are rotatably connected to the mounting plate (6). The output shaft of the motor (7) is fixedly connected to the end of any one of the rotating shafts (14).

6. The miniLED circuit board etching solution immersion etching device according to claim 1, characterized in that: The top of the fixed sleeve (33) is rotatably connected to a pressure plate (28), and the bottom of the pressure plate (28) is in contact with the upper end of the vertical rod (27). Several limiting rods (29) corresponding to the pressure plate (28) are fixedly connected on the mounting plate (6).

7. The miniLED circuit board etching solution immersion etching apparatus according to claim 6, characterized in that: The top of the fixed sleeve (33) is fixedly connected to two fixed plates (31), and a pin (30) is rotatably connected between the two fixed plates (31). A pressure plate (28) is fixedly connected to the pin (30), and a torsion spring (32) is sleeved on the surface of the pin (30). The two ends of the torsion spring (32) are fixedly connected to the pressure plate (28) and the fixed plate (31) respectively. The pin (30) is lower than the top of the vertical rod (27).

8. The miniLED circuit board etching solution immersion etching device according to claim 1, characterized in that: The swing assembly (16) includes a torsion spring (15) sleeved on the surface of the clamp (8). The two ends of the torsion spring (15) are fixedly connected to the clamp (8) and the mounting plate (6) respectively. An L-shaped rod (19) is fixedly connected to the surface of the clamp (8). Several fixed rods (18) are fixedly connected to the mounting frame (5). The fixed rods (18) are vertically arranged and correspond to the horizontal bar of the L-shaped rod (19).

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