A patch device for semiconductor chip processing

Abstract

The application discloses a patch device for semiconductor chip processing and relates to the technical field of chip processing. The PCB board is placed on the placing rack, the clamping plate is driven to clamp the upper and lower sides of the PCB board through the rotation of the threaded rod, after clamping is completed, the surface of the PCB board is covered with solder paste through the front and back movement of the paste brushing plate, the shovel knife is moved simultaneously with the movement of the paste brushing plate, the shovel knife is first moved backward, the impurities on the surface of the PCB board are scraped off through the backward movement of the shovel knife, the PCB board may be contaminated with dust, debris and other impurities during the production process, the shovel knife can effectively remove these impurities, and the solder paste is coated and leveled when the shovel knife is moved forward, the uneven places on the surface of the PCB board can be scraped flat through the shovel knife, the situation that the thickness of the solder paste is inconsistent is avoided, the stirring rod is rotated when the solder paste tank is moved, the air in the solder paste can be discharged, the solder resist volatilization is reduced, and the problem of tin balls caused by air condensation is avoided.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, specifically to a chip mounting apparatus for semiconductor chip processing. Background Technology

[0002] Semiconductor chip fabrication mounting equipment, also known as a chip mounter, is one of the key pieces of equipment in the semiconductor manufacturing process. Its main function is to precisely mount tiny electronic components onto printed circuit boards (PCBs) or other substrates. The development of this equipment stems from the semiconductor industry's demand for high precision, high efficiency, and high reliability.

[0003] Patent publication number CN222214133U relates to the field of chip processing technology and discloses a chip mounting device for semiconductor chip processing. The device includes a base, on the surface of which a chip mounting assembly is disposed. The assembly includes a column fixedly connected to the surface of the base. A groove is formed on the side wall of the column, and a crossbeam is slidably connected inside the groove. A chip mounting head is fixedly connected to the bottom surface of the crossbeam. Two sets of crossbeams are symmetrically arranged and connected by a bidirectional threaded rod. An air pump is fixedly connected to the surface of the crossbeam, and nozzles are fixedly connected to both sides of the crossbeam. The nozzles are fixedly connected to the output end of the air pump via hoses. In this patent, a motor drives the bidirectional threaded rod to rotate, causing the two sets of crossbeams to move towards each other and bringing the two sets of chip mounting heads into contact with the bottom and surface of the semiconductor chip. This allows for simultaneous processing of both sides of the semiconductor chip, improving work efficiency.

[0004] The aforementioned patent describes the simultaneous processing of both sides of a semiconductor chip to improve work efficiency. However, the current equipment has the following problems: dust inevitably adheres to the surface of the PCB board before the adhesive is applied, which affects the adhesive application effect. Furthermore, the thickness of the solder paste coating may be inconsistent, which can lead to insufficient solder in some solder joints and excessive solder in others during the soldering process. Solder joints with insufficient solder may result in weak soldering. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a chip mounting apparatus for semiconductor chip processing, which solves the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor chip fabrication mounting apparatus, comprising a base frame, wherein a cylinder is disposed on the surface of the base frame for mounting chips onto a PCB board, comprising:

[0007] The mounting bracket is fixedly installed at the output end of the cylinder;

[0008] Solder paste container, the solder paste container being slidably mounted on the surface of the mounting bracket;

[0009] An eccentric rod, which is rotatably mounted on the surface of the fixed frame;

[0010] A connecting rod, one side of which is rotatably mounted on the surface of an eccentric rod, and the other side of which is rotatably mounted on the circumferential surface of a solder paste container;

[0011] A paste application board, which is fixedly installed at the bottom of the solder paste container;

[0012] A toothed rack, which is fixedly installed on the inner wall of a fixed frame;

[0013] A gear, rotatably mounted on the top of a solder paste container, meshing with a rack and pinion;

[0014] A stirring rod, which is fixedly mounted on the bottom of the gear;

[0015] The placement rack is rotatably mounted on the surface of the base frame;

[0016] A threaded rod, which is rotatably mounted on the inner wall of the placement frame;

[0017] The clamping plate is threaded onto the circumferential surface of the threaded rod. By placing the PCB board on the placement rack, the rotation of the threaded rod drives the clamping plate to clamp the upper and lower sides of the board.

[0018] According to the above technical solution, the paste brush plate is connected to the solder paste container. A brush is provided at the bottom of the paste brush plate. The eccentric rod is driven by a motor to rotate, which in turn drives the connecting rod to rotate. The rotation of the connecting rod causes the solder paste container to slide back and forth. The sliding of the solder paste container causes the paste brush plate to move. By injecting solder paste into the paste brush plate, the solder paste adheres to the brush. The back and forth movement causes the surface of the PCB board to be covered with solder paste.

[0019] According to the above technical solution, the coating device further includes a scraper and a rotating rod. The scraper is fixedly installed on the rear side of the paste-coating plate, and the rotating rod is rotatably installed on the inner wall of the base frame. The rotating rod is connected to the placement frame via a No. 1 belt. The scraper moves while the paste-coating plate moves.

[0020] The base frame is equipped with a patch mounting device for mounting chips onto the bottom of the PCB board and a feeding device for automatically feeding the chips.

[0021] According to the above technical solution, the patch device includes a positioning rod and a positioning plate. The positioning rod is fixedly installed on the circumferential surface of the rotating rod, and the positioning plate is fixedly installed on the surface of the positioning rod. The inner wall of the positioning plate is provided with a rubber pad. When placing the PCB board, the PCB board is centered by contacting it with the positioning plate.

[0022] According to the above technical solution, the patching device further includes an electric push rod and a patching plate. The fixed end of the electric push rod is fixedly installed on the top of the base frame, and the patching plate is fixedly installed on the output end of the electric push rod with the coating surface at the bottom. At this time, the patching plate is loaded and moved upward by the output end of the electric push rod to patch the bottom of the PCB board.

[0023] According to the above technical solution, the patch device further includes an elastic telescopic rod, a support plate, and a brake rod. The fixed end of the elastic telescopic rod is fixedly installed on the top of the base frame, the support plate is fixedly installed on the movable end of the elastic telescopic rod, and the brake rod is fixedly installed on the movable end of the elastic telescopic rod. When the PCB board rotates, it drives the support plate to move downward, causing the output end of the elastic telescopic rod to be compressed. The output end of the elastic telescopic rod causes the brake rod to move, thereby achieving self-adaptation of the support mechanism.

[0024] According to the above technical solution, the feeding device includes a component box, a push plate, and a connecting rod. The component box is fixedly installed on the top of the base frame, the push plate is slidably installed on the surface of the component box, one side of the connecting rod is rotatably installed on the surface of the brake rod, and the other side of the connecting rod is rotatably installed on the surface of the push plate. By adding components into the component box, the connecting rod moves downward through the brake rod, and the movement of the connecting rod causes the push plate to move forward.

[0025] According to the above technical solution, the feeding device further includes an electric cylinder, a drive wheel, a first receiving gear, a second receiving gear, and a buffer button. The fixed end of the electric cylinder is fixedly installed on the surface of the push plate near the component box. The movement of the push plate drives the electric cylinder to move, and at the same time drives the first receiving gear to move. The first receiving gear contacts the drive wheel, causing the second receiving gear to move backward. After reaching the designated position, the output end of the electric cylinder pushes the component towards the position of the mounting plate. The drive wheel is rotatably installed on the surface of the component box. The first receiving gear is slidably installed on the inner wall of the component box, and the second receiving gear is slidably installed on the inner wall of the component box. The first receiving gear meshes with the drive wheel, and the second receiving gear meshes with the drive wheel. The buffer button is rotatably installed on the inner wall of the component box. When the next component loses the support of the second receiving gear, it falls to the top of the first receiving gear for support. The buffer button cushions the fall. A first spring is provided between the buffer button and the component box, and the first spring resets the buffer button.

[0026] This invention provides a chip mounting apparatus for semiconductor chip fabrication. It offers the following advantages:

[0027] (1) In this invention, by setting up a coating device, the PCB board is placed on a placement rack, and the screw rod rotates to drive the clamping plate to clamp the upper and lower sides. After clamping, the surface of the PCB board is covered with solder paste by moving the paste brush back and forth. While the paste brush moves, the scraper moves. The scraper first moves backward and scrapes away the impurities on the surface of the PCB board. The PCB board may be contaminated with dust, debris and other impurities during the production process. Using the scraper to clean can effectively remove these impurities. When moving forward, the solder paste is applied and smoothed. The scraper can smooth the uneven parts on the surface of the PCB board to avoid inconsistent solder paste thickness, thereby improving the consistency and reliability of soldering. When the solder paste can moves, the stirring rod rotates to expel the air inside the solder paste, reduce the evaporation of solder resist, and avoid the problem of solder balls caused by air condensation.

[0028] (2) In this invention, by setting up the patch device, when placing the PCB board, the position of the PCB board is centered by making it contact with the positioning plate, which makes it easier to operate in the subsequent patching process. After the PCB board is rotated, the positioning rod is used to center its position again. At this time, the coating surface is at the bottom. At this time, the output end of the electric push rod drives the patching plate to move upward after loading and patching the bottom of the PCB board. When the PCB board is coated, the support plate supports the bottom of the PCB board, making the coating and patching process more stable. When the PCB board is rotated, the support plate is driven to move downward, which compresses the output end of the elastic telescopic rod. The output end of the elastic telescopic rod causes the brake rod to move. In this way, the self-adaptation of the support mechanism is achieved.

[0029] (3) In this invention, by setting up a feeding device, by adding components into the component box, in the initial state, there is a component on the top of the receiving toothed rod two. After the push plate reaches the designated position, the component is pushed to the position of the patch plate by the output end of the electric cylinder, so that the component is pushed to the inner wall of the patch plate. The automatic feeding system can ensure the accurate placement of the PCB board and avoid the deviation and damage that may occur in manual feeding, thereby improving the quality and consistency of the product. At this time, the next component loses the support of the receiving toothed rod two and falls to the top of the receiving toothed rod one for support. When the component falls, it is buffered by the buffer button to prevent physical damage to the component. Without buffering, direct impact to the hard surface may cause cracks or damage to the PCB board, or damage to the components on the board. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the position structure of the rotating rod and the placement frame of the present invention;

[0032] Figure 3 This is a schematic diagram showing the position and structure of the clamping mechanism and coating device of the present invention;

[0033] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of section A in the middle;

[0034] Figure 5 This is a schematic diagram showing the position and structure of the connecting rod and solder paste container in this invention;

[0035] Figure 6 This is a schematic diagram of the positional structure of the positioning plate and the support plate of the present invention;

[0036] Figure 7 This is a schematic diagram of the position and structure of the connecting rod and brake rod of the present invention;

[0037] Figure 8 This is a schematic diagram of the position structure of the push plate and drive wheel of the present invention.

[0038] In the diagram: 1. Base frame; 2. Fixing frame; 3. Solder paste container; 4. Eccentric rod; 5. Connecting rod; 6. Paste brush; 7. Scraper; 8. Gear rack; 9. Gear; 10. Stirring rod; 11. Placement rack; 12. Threaded rod; 13. Clamping plate; 14. Rotating rod; 20. Positioning rod; 21. Positioning plate; 22. Electric push rod; 23. Patch plate; 24. Elastic telescopic rod; 25. Support plate; 26. Brake rod; 30. Component box; 31. Push plate; 32. Linkage rod; 33. Electric cylinder; 34. Drive wheel; 35. Receiving gear rack one; 36. Receiving gear rack two; 37. Buffer button. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figures 1-6 One embodiment of the present invention is: a semiconductor chip processing mounting apparatus, including a base frame 1, wherein a cylinder is disposed on the surface of the base frame 1 for mounting chips onto a PCB board, comprising:

[0041] Fixture 2 is fixedly installed at the output end of the cylinder;

[0042] Solder paste container 3 is slidably mounted on the surface of the mounting bracket 2;

[0043] Eccentric rod 4 is rotatably mounted on the surface of fixed frame 2;

[0044] Connecting rod 5, one side of connecting rod 5 is rotatably mounted on the surface of eccentric rod 4, and the other side of connecting rod 5 is rotatably mounted on the circumferential surface of solder paste can 3;

[0045] The paste application plate 6 is fixedly installed at the bottom of the solder paste container 3;

[0046] The toothed frame 8 is fixedly installed on the inner wall of the fixed frame 2;

[0047] Gear 9 is rotatably mounted on the top of solder paste can 3, and gear 9 meshes with rack and pinion 8;

[0048] The stirring rod 10 is fixedly installed at the bottom of the gear 9. During the stirring process, the stirring rod 10 can expel the air inside the solder paste, reduce the evaporation of solder resist, and avoid the problem of solder balls caused by air condensation.

[0049] Placement rack 11 is rotatably mounted on the surface of base frame 1;

[0050] Threaded rod 12 is rotatably mounted on the inner wall of the placement frame 11;

[0051] Clamping plate 13 is threaded onto the circumferential surface of threaded rod 12.

[0052] The solder paste plate 6 is connected to the solder paste container 3. A brush is provided at the bottom of the solder paste plate 6. By injecting solder paste into the solder paste plate 6, the solder paste adheres to the brush.

[0053] The coating device also includes a scraper 7 and a rotating rod 14. The scraper 7 is fixedly installed on the rear side of the paste application board 6, and the rotating rod 14 is rotatably installed on the inner wall of the base frame 1. The rotating rod 14 is connected to the placement frame 11 via a belt. When moving forward, it applies and smooths the solder paste. The scraper 7 can smooth out the uneven areas on the PCB board surface, ensuring that the solder paste can be evenly applied to the pads, avoiding inconsistent solder paste thickness, thereby improving the consistency and reliability of soldering.

[0054] In this embodiment, the PCB board is placed on the placement rack 11, and the screw rod 12 rotates to clamp the upper and lower sides of the board. After clamping, the output end of the cylinder drives the fixing frame 2 to descend. When it reaches the designated position, the motor drives the eccentric rod 4 to rotate, which in turn drives the connecting rod 5 to rotate. The rotation of the connecting rod 5 causes the solder paste container 3 to slide back and forth. The sliding of the solder paste container 3 moves the solder paste brush 6, injecting solder paste into the brush so that the solder paste adheres to the brush. The back and forth movement covers the surface of the PCB board with solder paste. The movement of the brush 6 simultaneously moves the scraper 7. The scraper 7 first moves backward, scraping away impurities from the surface of the PCB board. During the production process, the PCB board may be contaminated with dust, debris, and other impurities. Cleaning with the scraper 7 can effectively remove these impurities. To prevent impurities from mixing into the solder paste and affecting soldering quality, the spatula 7 smooths out uneven areas on the PCB surface as it moves forward, ensuring that the solder paste is evenly applied to the pads and avoiding inconsistent solder paste thickness, thereby improving the consistency and reliability of soldering. As the solder paste container 3 moves, it drives the gear 9 to move, which in turn contacts the gear rack 8, causing the gear 9 to rotate. The rotation of the gear 9 causes the stirring rod 10 to rotate, which in turn removes air from the inside of the solder paste, reducing solder resist evaporation and preventing solder ball problems caused by air condensation. After one side of the PCB is coated, the motor drives the placement rack 11 to rotate, causing the PCB to rotate so that the other side can be coated. While the placement rack 11 is rotating, the first belt drives the rotating rod 14 to rotate.

[0055] Please see Figures 1-8 Based on the above embodiments, in another embodiment of the present invention, the top of the base frame 1 is provided with a patching device for patching the bottom of the PCB board and a feeding device for automatically feeding the patch. The patching device includes a positioning rod 20 and a positioning plate 21. The positioning rod 20 is fixedly installed on the circumferential surface of the rotating rod 14, and the positioning plate 21 is fixedly installed on the surface of the positioning rod 20. The inner wall of the positioning plate 21 is provided with a rubber pad so that the position of the PCB board is centered, making it easier to operate in the subsequent patching process.

[0056] The placement device also includes an electric push rod 22 and a placement plate 23. The fixed end of the electric push rod 22 is fixedly installed on the top of the base frame 1, and the placement plate 23 is fixedly installed on the output end of the electric push rod 22 to place the components on the bottom of the PCB board.

[0057] The mounting device also includes a flexible telescopic rod 24, a support plate 25, and a brake rod 26. The fixed end of the flexible telescopic rod 24 is fixedly installed on the top of the base frame 1, the support plate 25 is fixedly installed on the movable end of the flexible telescopic rod 24, and the brake rod 26 is fixedly installed on the movable end of the flexible telescopic rod 24. The support plate 25 supports the bottom of the PCB board, making the coating and mounting process more stable.

[0058] The feeding device includes a component box 30, a push plate 31, and a connecting rod 32. The component box 30 is fixedly installed on the top of the base frame 1. The push plate 31 is slidably installed on the surface of the component box 30. One side of the connecting rod 32 is rotatably installed on the surface of the brake rod 26, and the other side of the connecting rod 32 is rotatably installed on the surface of the push plate 31. The automatic feeding system can ensure the accurate placement of components, avoid deviations and damages that may occur during manual feeding, thereby improving the quality and consistency of the products.

[0059] The feeding device also includes an electric cylinder 33, a drive wheel 34, a receiving gear 35, a receiving gear 36, and a buffer button 37. The fixed end of the electric cylinder 33 is fixedly installed on the surface of the push plate 31 near the component box 30. The drive wheel 34 is rotatably installed on the surface of the component box 30. The receiving gear 35 is slidably installed on the inner wall of the component box 30. The receiving gear 36 is slidably installed on the inner wall of the component box 30. The receiving gear 35 meshes with the drive wheel 34. The receiving gear 36 meshes with the drive wheel 34. The buffer button 37 is rotatably installed on the inner wall of the component box 30. When the component falls, the buffer button 37 buffers the component to prevent physical damage. Without buffering, direct impact to a hard surface may cause cracks or damage to the PCB board or the components on the board. A first spring is provided between the buffer button 37 and the component box 30. The buffer button 37 is reset by the first spring.

[0060] In this embodiment, when placing the PCB board, its position is centered by contacting the positioning plate 21, making it easier to operate in the subsequent mounting process. When the PCB board rotates, the rotating rod 14 rotates, driving the positioning rod 20 to rotate. The rotation of the positioning rod 20 causes the positioning plate 21 to disengage from the PCB board and reset to center its position after the PCB board has rotated. At this time, the coating surface is at the bottom. Then, the output end of the electric push rod 22 drives the mounting plate 23 to move upward after loading and to mount the PCB board to the bottom. During the coating process, the support plate 25 supports the bottom of the PCB board, making the coating and mounting process more stable. When the PCB board rotates, the support plate 25 moves downward, causing the output end of the elastic telescopic rod 24 to be compressed. The output end of the elastic telescopic rod 24 causes the brake rod 26 to move. In this way, the self-adaptation of the support mechanism is achieved.

[0061] By adding components into the component box 30, initially, there is a component on the top of the receiving rack 36. The brake rod 26 moves downward and the linkage rod 32 moves, causing the push plate 31 to move forward. The push plate 31 moves and drives the electric cylinder 33 to move, which in turn drives the receiving rack 35 to move. The receiving rack 35 contacts the drive wheel 34, causing the receiving rack 36 to move backward. After reaching the designated position, the output end of the electric cylinder 33 pushes the component towards the position of the surface mount plate 23, pushing the component to the inner wall of the surface mount plate 23. The automatic feeding system can ensure the accurate placement of components, avoiding the deviation and damage that may occur with manual feeding, thereby improving the quality and consistency of the product. At this time, the next component loses the support of the receiving rack 36 and falls to the top of the receiving rack 35 for support. When the component falls, it is cushioned by the buffer button 37 to prevent physical damage to the component. Without cushioning, direct impact with a hard surface may cause cracks or damage to the PCB board, or damage to the components on the board.

[0062] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip mounting apparatus for semiconductor chip processing, comprising a base frame (1), wherein a cylinder is disposed on the surface of the base frame (1), characterized in that, Used for mounting components on PCB boards, including: Fixture (2), which is fixedly installed at the output end of the cylinder; Solder paste container (3), said solder paste container (3) is slidably mounted on the surface of the fixing frame (2); An eccentric rod (4) is rotatably mounted on the surface of the fixed frame (2); Connecting rod (5), one side of the connecting rod (5) is rotatably mounted on the surface of the eccentric rod (4), and the other side of the connecting rod (5) is rotatably mounted on the circumferential surface of the solder paste can (3); A paste application board (6) is fixedly installed at the bottom of the solder paste container (3); The toothed frame (8) is fixedly installed on the inner wall of the fixed frame (2); Gear (9), which is rotatably mounted on the top of solder paste can (3), meshing with rack and pinion (8); A stirring rod (10) is fixedly mounted on the bottom of the gear (9); A placement rack (11) is rotatably mounted on the surface of the base frame (1); A threaded rod (12) is rotatably mounted on the inner wall of the placement frame (11); A clamping plate (13) is threaded onto the circumferential surface of a threaded rod (12); The coating device also includes a scraper (7) and a rotating rod (14). The scraper (7) is fixedly installed on the rear side of the paste board (6), and the rotating rod (14) is rotatably installed on the inner wall of the base frame (1). The rotating rod (14) is connected to the placement frame (11) via a No. 1 belt. The base frame (1) is provided with a patching device for patching the bottom of the PCB board and a feeding device for automatically feeding the patch. The patching device includes a positioning rod (20) and a positioning plate (21). The positioning rod (20) is fixedly installed on the circumferential surface of the rotating rod (14), and the positioning plate (21) is fixedly installed on the surface of the positioning rod (20). The inner wall of the positioning plate (21) is provided with a rubber pad. The patching device also includes an electric push rod (22) and a patching plate (23). The fixed end of the electric push rod (22) is fixedly installed on the top of the base frame (1), and the patching plate (23) is fixedly installed on the output end of the electric push rod (22). The paste brush plate (6) is connected to the solder paste container (3), and a brush is provided at the bottom of the paste brush plate (6); The patching device also includes an elastic telescopic rod (24), a support plate (25), and a brake rod (26). The fixed end of the elastic telescopic rod (24) is fixedly installed on the top of the base frame (1), the support plate (25) is fixedly installed on the movable end of the elastic telescopic rod (24), and the brake rod (26) is fixedly installed on the movable end of the elastic telescopic rod (24).

Images