PCB conveying and transferring device with electroplating quality detection function

Abstract

The invention discloses a PCB conveying and transferring device with an electroplating quality detection function, and belongs to the technical field of PCB machining, the PCB conveying and transferring device comprises two double-layer conveying frames and two limiting conveying mechanisms used for limiting and placing PCBs, each limiting conveying mechanism comprises four right-angle bases, and the side walls of every two adjacent right-angle bases are jointly connected through a two-way telescopic rod. Through the arrangement of the pressure measurement assembly, a soft rubber pad, a building block base plate and a liquid conduction building block type pressure sensing system can be utilized to rapidly and visually test the copper nodule or depression condition at the bottom of the blind hole, the efficiency is higher than that of traditional X-ray detection, and the test misjudgment condition is also avoided; the air in the blind hole can be brought out by utilizing the inverted hopper cover to move outwards, and the vacuum pump is matched to assist in vacuumizing, so that the residual oxygen rate in the blind hole is reduced, the resin fluidity in a vacuum environment is greatly improved, and the defect of bubbles or cavities possibly occurring in the hole plugging process is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a PCB board conveying and transferring device with an electroplating quality detection function. Background Art

[0002] A multilayer PCB is a composite structure consisting of multiple conductive layers alternately stacked with an insulating medium. Commonly found in modern electronic devices, blind vias are drilled in the PCB to increase wiring density and space utilization. These vias are holes that extend from an outer layer (such as the top or bottom layer) of the PCB to one or more inner layers but do not penetrate the entire board.

[0003] After blind vias are processed on PCBs, the inner walls of the vias are typically electroplated to ensure that the vertical channels between the inner and outer layers of the PCB are conductive. However, poor plating solution flow during the electroplating process can easily result in no copper deposits or thin copper plating at the bottom of disconnected vias, resulting in an open circuit at the bottom of the vias. Furthermore, excessively thick copper plating at the bottom of the vias, touching adjacent layers, can also cause a short circuit. Furthermore, after blind via plating is completed, the vias are typically plugged with an epoxy resin base before the surface of the PCB is coated with solder mask. If the plugged area of ​​the blind vias is uneven, the subsequent solder mask will not fully adhere to the PCB, leading to a decrease in the electrical performance of the PCB. Therefore, a PCB conveying and transfer device with electroplating quality detection function is proposed. Summary of the Invention

[0004] The purpose of the present invention is to solve the problems in the prior art and to propose a PCB board conveying and transferring device with electroplating quality detection function.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A PCB board conveying and transfer device with a plating quality inspection function includes two double-layer conveyor racks and two limited conveying mechanisms for limiting the placement of PCB boards. The limited conveying structure includes four right-angle seats, and the side walls of two adjacent right-angle seats are connected together by a two-way telescopic rod. The two-way telescopic rod on one side perpendicular to the conveying direction of the double-layer conveyor rack is connected to a diving control plate via a mobile matching frame, and the two-way telescopic rod on the other side perpendicular to the conveying direction of the double-layer conveyor rack is connected to a translation control plate via a mobile matching frame. The translation control plate and the diving control plate are respectively arranged on the two limited conveying mechanisms; A lifting seat is provided on the outer side of the double-layer conveying frame, and the bottom end of the lifting seat is connected to a standard pressure plate through a plurality of lifting rods, and the bottom end of the standard pressure plate is connected to a plurality of resin storage chambers, and the bottom end of the resin storage chamber is rotatably connected to two mounting seats through a steering seat, one side of the mounting seat is connected to a driving motor, and the output end of the driving motor is connected to a pressed-in threaded rod through a gear assembly, and the outer side wall of the bottom end of the pressed-in threaded rod is connected to a plurality of inverted bucket covers, and the bottom end of the pressed-in threaded rod is connected to a pressure measuring assembly for detecting the electroplating condition of the bottom of the blind hole on the PCB board, and the other side of the mounting seat is connected to a grinding wheel through a flattening motor drive, and a reversing film seat is provided on the outer side of the double-layer conveying frame, and the bottom end of the reversing film seat is connected to a film limiting assembly for assisting the solder mask film.

[0006] Preferably, the right-angle seat is movably assembled on the upper surface of the double-layer conveyor rack, the translation control plate and the diving control plate are fixedly assembled on the lower surfaces of the two double-layer conveyor racks respectively, and the double-layer conveyor rack is provided with a docking notch at the reversing film seat.

[0007] Preferably, a horizontally arranged electric control guide groove is provided on the translation control plate, and an electric control guide groove with an arc-shaped downward depression in the middle is provided on the diving control plate.

[0008] Preferably, the gear assembly consists of a control gear and a rotating gear ring, the output end of the drive motor is fixedly connected to the control gear through a drive shaft, the control gear is meshed with the rotating gear ring, and the inner side wall of the rotating gear ring is fixedly connected to the rotating ring.

[0009] Preferably, a knob is fixedly connected to the inner side wall of the rotating ring, and the knob is slidingly connected to the inner side wall of the spiral groove pressed into the threaded rod. The rotating ring is rotatably connected to the storage bucket through a guide tube, and the guide tube is fixedly connected to the steering seat through a mounting seat. A conductive metal ring is provided on the edge of the inverted bucket cover for testing the electrical performance of the blind hole of the PCB board.

[0010] Preferably, the bottom end of the resin storage chamber is communicated with the cover hole ring through a flow pipe, a vacuum pump is provided on the flow guide pipe, and the bottom end of the storage hopper is rotatably connected to a sealing swivel.

[0011] Preferably, a positioning ring is provided inside the sealing swivel, and the positioning ring is rotatably connected to the sealing partition blades through a plurality of pins, and the inner side wall of the sealing swivel is rotatably connected to the pins through a plurality of arc-shaped push rods.

[0012] Preferably, the pressure measurement assembly includes a soft rubber pad and a plurality of building block pads, the plurality of building block pads are placed in a through hole opened on the soft rubber pad, the top of the soft rubber pad is connected to a sensing plate through a conversion plate, the conversion plate is provided with a plurality of conversion holes arranged opposite to the through holes, the conversion holes are filled with liquid, and the sensing plate is provided with a plurality of pressure sensing elements.

[0013] Preferably, the film limiting assembly includes a film pressing impeller and multiple lifting suction cups. The bottom end of the reversing film sticking seat is connected to the film pressing impeller through a control motor. The lifting suction cup is fixedly connected to the bottom end of the reversing film sticking seat. A film storage frame is provided below the lifting suction cup located on the outside.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. This solution uses a pressure testing component to quickly and intuitively detect copper nodules or depressions at the bottom of blind holes using a soft rubber pad, a building block pad, and a liquid-conducting building block pressure sensing system. This is more efficient than traditional X-ray detection and avoids misjudgment.

[0015] 2. This solution uses an inverted bucket cover to move outward to remove air from the blind hole, and then uses a vacuum pump to assist in vacuuming, thereby reducing the residual oxygen rate in the blind hole and greatly improving the fluidity of the resin under vacuum, thus avoiding bubbles or voids that may occur in the plugging process.

[0016] 3. This solution uses a film-limiting component to generate a vortex airflow from a film pressing impeller to control the lamination of the film material on the PCB. Compared with the current manual lamination, it can greatly avoid defects such as wrinkles or bubbles. When grabbing the film material, the airflow output by the film pressing impeller will press the film material tightly in the film storage frame, preventing the film material from being wrinkled before absorption and affecting subsequent lamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 2 This is an assembly diagram of the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 3 This is a structural schematic diagram of the bottom of the double-layer conveyor frame of the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is a schematic diagram of the structure of the translation control board and the diving control board in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 6 This is a schematic diagram of the structure on both sides of the resin storage chamber in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 7 This is a schematic diagram of the structure of the gear assembly in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 8 This is a structural schematic diagram of the position of the sealing partition blade in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 9 This is a schematic structural diagram of the pressure measuring assembly in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention; Figure 10 This is a structural schematic diagram of the film limiting component in the PCB board conveying and transferring device with electroplating quality detection function proposed by the present invention.

[0018] In the figure: 1. Double-layer conveyor rack; 2. Right-angle seat; 3. Two-way telescopic rod; 4. Mobile matching frame; 5. Translation control board; 6. Dive control board; 7. Standard pressure plate; 8. Resin storage chamber; 9. Steering seat; 10. Drive motor; 11. Control gear; 12. Rotation gear ring; 13. Rotation ring; 14. Press-in threaded rod; 15. Inverted bucket cover; 16. Induction plate; 17. Soft rubber pad; 18. Building block pad; 19. Conversion plate; 20. Vacuum pump; 21. Storage bucket; 22. Flow tube; 23. Cover hole ring; 24. Sealing swivel; 25. Arc push rod; 26. Pin shaft; 27. Positioning ring; 28. Sealing partition blade; 29. ​​Smoothing motor; 30. Grinding wheel; 31. Reversing film seat; 32. Film storage frame; 33. Film pressing impeller; 34. Lifting suction cup; 35. Knob. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention in specific circumstances.

[0022] Example, see Figures 1 to 10 , a PCB board conveying and transferring device with electroplating quality detection function includes two double-layer conveying racks 1 and two limited conveying mechanisms for limiting the placement of PCB boards. The limited conveying structure includes four right-angle seats 2. The side walls of two adjacent right-angle seats 2 are connected together by a two-way telescopic rod 3. The two-way telescopic rod 3 on one side perpendicular to the conveying direction of the double-layer conveying rack 1 is connected to a diving control board 6 through a mobile matching frame 4. The two-way telescopic rod 3 on the other side perpendicular to the conveying direction of the double-layer conveying rack 1 is connected to a translation control board 5 through a mobile matching frame 4. The translation control board 5 and the diving control board 6 are respectively arranged on the two limited conveying mechanisms; Furthermore, the right-angle seat 2 is movably assembled on the upper surface of the double-layer conveyor frame 1, and the translation control board 5 and the diving control board 6 are respectively fixedly assembled on the lower surfaces of the two double-layer conveyor frames 1. The double-layer conveyor frame 1 is provided with a docking notch at the reversing film-applying seat 31, the translation control board 5 is provided with a horizontally arranged electric control guide groove, and the diving control board 6 is provided with an electric control guide groove with a downwardly concave arc in the middle; It should be noted that: during the processing, the two movable matching frames 4 are respectively controlled to slide in the electrically controlled guide grooves of the translation control plate 5 and the diving control plate 6. Then, during the movement, the limited conveying mechanism located on the diving control plate 6 will move downward when it moves to the recessed position, while the limited conveying mechanism on the translation control plate 5 will maintain horizontal conveying, so that the two limited conveying mechanisms move up and down staggered to exchange positions; The benefits mentioned above are: PCB boards on different inspection surfaces can be moved to the opposite inspection line to achieve interactive inspection, making the inspection more synchronous and efficient; A lifting seat is provided on the outside of the double-layer conveyor frame 1. The bottom end of the lifting seat is connected to a standard pressing plate 7 through a plurality of lifting rods. The bottom end of the standard pressing plate 7 is connected to a plurality of resin storage chambers 8. The bottom end of the resin storage chamber 8 is rotatably connected to two mounting seats through a steering seat 9. One side of the mounting seat is connected to a driving motor 10. The output end of the driving motor 10 is connected to a pressed-in threaded rod 14 through a gear assembly. The outer side wall of the bottom end of the pressed-in threaded rod 14 is connected to a plurality of inverted bucket covers 15. The bottom end of the pressed-in threaded rod 14 is connected to a pressure measuring component for detecting the electroplating condition of the bottom of the blind hole on the PCB board; Furthermore, the gear assembly consists of a control gear 11 and a rotating gear ring 12. The output end of the drive motor 10 is fixedly connected to the control gear 11 through a drive shaft. The control gear 11 is meshed with the rotating gear ring 12. The inner wall of the rotating gear ring 12 is fixedly connected to the rotating ring 13. The inner wall of the rotating ring 13 is fixedly connected with a knob 35. The knob 35 is slidingly connected to the inner wall of the spiral groove pressed into the threaded rod 14. The rotating ring 13 is rotatably connected to the storage bucket 21 through a guide tube. The guide tube is fixedly connected to the steering seat 9 through a mounting seat. The bottom end of the resin storage chamber 8 is connected to the cover hole ring 23 through a flow tube 22. A conductive metal ring for testing the electrical performance of the blind hole of the PCB board is provided on the edge of the inverted bucket cover 15. , a vacuum pump 20 is provided on the guide tube, and a sealing swivel 24 is rotatably connected to the bottom end of the receiving hopper 21. A positioning ring 27 is provided in the sealing swivel 24. The positioning ring 27 is rotatably connected to the sealing partition blade 28 through multiple pins 26. The inner wall of the sealing swivel 24 is rotatably connected to the pins 26 through multiple arc-shaped push rods 25. The pressure measurement component includes a soft rubber pad 17 and multiple building block pads 18. The multiple building block pads 18 are placed in the through holes opened on the soft rubber pad 17. The top of the soft rubber pad 17 is connected to the sensing plate 16 through the conversion plate 19. The conversion plate 19 is provided with multiple conversion holes arranged opposite to the through holes. Liquid is filled in the conversion holes, and multiple pressure sensing elements are provided on the sensing plate 16; It should be noted that: the side of the multi-layer PCB board with the blind hole after electroplating is facing upward, and the corner of the multi-layer PCB board is placed in the right-angle seat 2, and the contraction trend of the bidirectional telescopic rod 3 is used to firmly limit the multi-layer PCB board. After the multi-layer PCB board moves to the bottom of the standard pressing plate 7 along with the limited conveying mechanism and stops, the standard pressing plate 7 will drive multiple resin storage chambers 8 and the components thereon to move downward together (the standard pressing plate 7 is the standard molding plate size of the corresponding multi-layer PCB board, and the position of the resin storage chamber 8 thereon corresponds to the position of the blind hole one by one. At the same time, in the existing circuit board processing technology, in order to avoid stress damage caused by concentrated drilling, the design intervals of each blind hole are usually larger). During the downward movement, the soft rubber pad 17 on the bottom end of the pressed-in threaded rod 14 will be pressed to the blind hole. At the bottom of the hole, if the bottom of the blind hole is evenly plated, multiple building block pads 18 at the bottom of the soft rubber pad 17 will be pressurized synchronously. If the bottom of the blind hole is unevenly plated with copper nodules or depressions in the previous electroplating process, some building block pads 18 at the bottom of the soft rubber pad 17 will have local differences, thereby transmitting the pressure of the building block pads 18 to the pressure monitoring area on the sensor plate 16 through the liquid in the conversion hole in the conversion plate 19, so that the background can quickly judge the electroplating conditions of the bottom of each blind hole of the PCB board based on these test data, and ensure the quality of the board entering the subsequent processing. The conductive metal ring on the inverted bucket cover 15 is electrically connected to the inner wall of the blind hole. In this process, the board circuit connected to the bottom of the blind hole forms a test loop to test whether the conductive performance of the blind hole is normal; After the inspection is completed, the driving motor 10 is started to drive the control gear 11 to rotate. The rotation of the control gear 11 will drive the meshing rotating gear ring 12 to rotate synchronously. The rotation of the rotating gear ring 12 will drive the rotating gear ring 13 to rotate, thereby controlling the knob 35 on the inner wall of the rotating gear ring 13 to slide in the spiral groove of the pressed threaded rod 14. The sliding of the rotating knob 35 in the spiral groove will apply an axial extrusion force to the pressed threaded rod 14, and the pressed threaded rod 14 will continuously move outward from the hole. In the process of movement, the inverted bucket cover 15 pressed on the inner wall of the blind hole will generate sliding friction with the inner wall of the blind hole during the outward movement. In the process of friction and sliding, it is easy to remove the dirt that may exist on the inner wall of the blind hole (the inverted bucket cover 15 and the inner wall of the blind hole after electroplating are both smooth surfaces to avoid damage to the electroplating layer on the inner wall of the blind hole). After the bottom of the pressed threaded rod 14 enters the storage bucket 21, the control The sealing swivel 24 rotates a certain angle, and the rotation of the sealing swivel 24 will synchronously drive the multiple arc-shaped push rods 25 to rotate in an arc. The movement of the arc-shaped push rods 25 will drive the sealing partition blades 28 to rotate on the positioning ring 27, so that the multiple sealing partition blades 28 gather together to seal the top of the cover hole ring 23. Then, the resin in the resin storage chamber 8 is controlled to be pressed into the cover hole ring 23 through the flow tube 22 (the resin storage chamber 8 drives the resin flow through the external pressurized driving structure. This is an existing technical means and will not be described in detail here). The resin entering the cover hole ring 23 flows downward and continuously flows into the blind hole of the plate for plugging. Before this, the outward movement of the soft rubber pad 17 and the inverted bucket cover 15 will bring out the air in the blind hole of the plate. The vacuum pump 20 assists in extracting the air brought out of the hole to ensure that the blind hole of the plate is in a relatively vacuum state, and then the resin enters the blind hole to plug the hole; The above advantages are: bubbles or voids can be avoided during the plugging process, ensuring the effectiveness of the plugging process. Subsequently, the grinding wheel 30 is controlled to rotate above the blind hole to grind away the resin protruding from the blind hole, ensuring that the surface of the blind hole and the plate are flat after plugging, facilitating the subsequent solder mask application process, making the overall processing more efficient. The mounting seat on the other side is connected to a grinding wheel 30 through a grinding motor 29. A reversing film mounting seat 31 is provided on the outside of the double-layer conveyor frame 1. The bottom end of the reversing film mounting seat 31 is connected to a film limiting component for assisting solder mask mounting. Furthermore, the film limiting assembly includes a film pressing impeller 33 and a plurality of lifting suction cups 34. The bottom end of the reversing film sticking seat 31 is connected to the film pressing impeller 33 through a control motor. The lifting suction cups 34 are fixedly connected to the bottom end of the reversing film sticking seat 31. A film storage frame 32 is provided below the lifting suction cups 34 on the outside. It should be noted that: the PCB board to be plugged is moved to the bottom of the reversing film-sticking seat 31 and then stops, allowing the lifting suction cup 34 to stick the sucked film material to the surface of the circuit board. During this process, the film-sticking impeller 33 in the middle will output a vortex airflow, blowing along the center of the film material to the edge to avoid bubbles during the film-sticking process. When grabbing the film material, the airflow output by the film-sticking impeller 33 will press the film material tightly into the film storage frame 32; The benefits mentioned above are: this can prevent the film from being wrinkled before being sucked, making the film picking up and laminating more convenient and efficient. Compared with the current manual lamination, the effect and efficiency of the film lamination are greatly improved; When the present invention is in use, the side of the electroplated multi-layer PCB board with the blind holes is facing upward, and the corner of the multi-layer PCB board is placed in the right-angle seat 2. The multi-layer PCB board is firmly limited by the contraction trend of the bidirectional telescopic rod 3. After the multi-layer PCB board moves to the bottom of the standard pressing plate 7 along with the limited conveying mechanism and stops, the standard pressing plate 7 will drive multiple resin storage chambers 8 and the components thereon to move downward together (the standard pressing plate 7 is the standard molding plate size of the corresponding multi-layer PCB board, and the position of the resin storage chamber 8 thereon corresponds to the position of the blind hole one by one. At the same time, in the existing circuit board processing technology, in order to avoid stress damage caused by concentrated drilling, the design intervals of each blind hole are usually larger). During the downward movement, the soft rubber pad 17 pressed into the bottom end of the threaded rod 14 will be pressed to If the bottom of the blind hole is evenly plated, multiple building block pads 18 at the bottom of the soft rubber pad 17 will be pressurized synchronously. If the bottom of the blind hole is unevenly plated with copper nodules or depressions in the previous electroplating process, some building block pads 18 at the bottom of the soft rubber pad 17 will have local differences, so that the pressure of the building block pads 18 is transmitted to the pressure monitoring area on the sensor plate 16 through the liquid in the conversion hole in the conversion plate 19, so that the background can quickly judge the electroplating conditions of the bottom of each blind hole of the PCB board based on these test data, and ensure the quality of the board entering the subsequent processing. The conductive metal ring on the inverted bucket cover 15 is electrically connected to the inner wall of the blind hole. In this process, the board circuit connected to the bottom of the blind hole forms a test loop to test whether the conductive performance of the blind hole is normal. After the inspection is completed, the drive motor 10 is started to drive the control gear 11 to rotate. The rotation of the control gear 11 will drive the meshing rotating gear ring 12 to rotate synchronously. The rotation of the rotating gear ring 12 will drive the rotating ring 13 to rotate, thereby controlling the knob 35 on the inner wall of the rotating ring 13 to slide in the spiral groove of the pressed threaded rod 14. The sliding of the rotating knob 35 in the spiral groove will exert an axial extrusion force on the pressed threaded rod 14, and the pressed threaded rod 14 will continuously move outward from the hole. During the movement, the inverted bucket cover 15 pressed on the inner wall of the blind hole will generate sliding friction with the inner wall of the blind hole during the outward movement. During the friction and outward sliding process, it is convenient to remove any dirt that may exist on the inner wall of the blind hole (the inverted bucket cover 15 and the inner wall of the blind hole after electroplating are both smooth surfaces to avoid damage to the electroplating layer on the inner wall of the blind hole). After the bottom of the pressed threaded rod 14 enters the receiving bucket 21, the sealing rotating ring 24 is controlled to rotate a certain angle. The rotation of the sealing rotating ring 24 will synchronously drive multiple arc pushers The rod 25 rotates in an arc, and the movement of the arc push rod 25 drives the sealing partition blade 28 to rotate on the positioning ring 27, so that the multiple sealing partition blades 28 gather together to seal the top of the cover hole ring 23, and then the resin in the resin storage chamber 8 is controlled to be pressed into the cover hole ring 23 through the flow tube 22. The resin in the cover hole ring 23 flows downward and continuously flows into the blind hole of the plate for plugging. Before this, the outward movement of the soft rubber pad 17 and the inverted bucket cover 15 will bring out the air in the blind hole of the plate. The vacuum pump 20 assists in extracting the air brought out of the hole to ensure that the blind hole of the plate is in a relatively vacuum state. Then, the resin enters the blind hole to plug the hole, which can avoid the occurrence of bubbles or voids during the plugging process and ensure the effectiveness of the plugging process. Subsequently, the grinding wheel 30 is controlled to rotate to the top of the blind hole to grind and remove the resin protruding from the blind hole to ensure that the surface of the blind hole after plugging is smooth with the plate, which is convenient for the subsequent film application during the solder mask process, making the overall processing more efficient. During the processing, the two mobile matching frames 4 are controlled to slide in the electrically controlled guide grooves of the translation control plate 5 and the diving control plate 6 respectively. During the movement, the limited conveying mechanism located on the diving control plate 6 will move downward when it moves to the recessed position, while the limited conveying mechanism on the translation control plate 5 will maintain horizontal conveying. The two limited conveying mechanisms are staggered and moved up and down to exchange positions. In this way, PCB plates on different detection surfaces can be moved to the relative detection lines, realizing interactive detection, so that the detection can be carried out more synchronously and efficiently. The PCB board with the hole plugging completed moves to the bottom of the reversing film sticking seat 31 and stops, allowing the lifting suction cup 34 to stick the sucked film material to the surface of the circuit board. During this process, the film pressing impeller 33 in the middle will output a vortex airflow, blowing along the center of the film material to the edge to avoid bubbles in the process of film sticking. When grabbing the film material, the airflow output by the film pressing impeller 33 will press the film material tightly in the film storage frame 32, so as to avoid the film material from being wrinkled before being sucked, making the picking up and sticking of the film material more convenient and efficient, and greatly improving the effect and efficiency of film sticking compared to the current manual film sticking.

[0023] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A PCB board conveying and transferring device with a plating quality detection function, comprising two double-layer conveying racks (1) and two limiting conveying mechanisms for limiting the placement of PCB boards, characterized in that: The limited conveying structure includes four right-angle seats (2), the side walls of two adjacent right-angle seats (2) are connected together by a bidirectional telescopic rod (3), the bidirectional telescopic rod (3) on one side perpendicular to the conveying direction of the double-layer conveying frame (1) is connected to a diving control plate (6) through a movable matching frame (4), and the bidirectional telescopic rod (3) on the other side perpendicular to the conveying direction of the double-layer conveying frame (1) is connected to a translation control plate (5) through a movable matching frame (4), and the translation control plate (5) and the diving control plate (6) are respectively arranged on two limited conveying mechanisms; The double-layer conveying frame (1) is provided with a hanging seat on the outside, and the bottom end of the hanging seat is connected to a standard pressing plate (7) through a plurality of lifting rods, and the bottom end of the standard pressing plate (7) is connected to a plurality of resin storage chambers (8), and the bottom end of the resin storage chamber (8) is rotatably connected to two mounting seats through a steering seat (9). One side of the mounting seat is connected to a driving motor (10), and the output end of the driving motor (10) is connected to a press-in threaded rod (14) through a gear assembly. The outer side wall of the bottom end of the press-in threaded rod (14) is connected to a plurality of inverted bucket covers (15), and the bottom end of the press-in threaded rod (14) is connected to a pressure measuring assembly for detecting the electroplating condition of the bottom of the blind hole on the PCB board. The mounting seat on the other side is connected to a grinding wheel (30) driven by a flattening motor (29). The double-layer conveying frame (1) is provided with a reversing film mounting seat (31) on the outside, and the bottom end of the reversing film mounting seat (31) is connected to a film limiting assembly for assisting the solder mask mounting.

2. The PCB conveying and transferring device with electroplating quality detection function according to claim 1 is characterized in that: The right-angle seat (2) is movably mounted on the upper surface of the double-layer conveyor frame (1), and the translation control plate (5) and the diving control plate (6) are respectively fixedly mounted on the lower surfaces of the two double-layer conveyor frames (1). The double-layer conveyor frame (1) is provided with a docking notch at the reversing film-sticking seat (31).

3. The PCB conveying and transferring device with electroplating quality detection function according to claim 1 is characterized in that: The translation control plate (5) is provided with a horizontally arranged electric control guide groove, and the diving control plate (6) is provided with an electric control guide groove which is concave downward in the middle and arranged in an arc shape.

4. The PCB conveying and transferring device with electroplating quality detection function according to claim 1 is characterized in that: The gear assembly consists of a control gear (11) and a rotating gear ring (12); the output end of the drive motor (10) is fixedly connected to the control gear (11) via a drive shaft; the control gear (11) is meshed with the rotating gear ring (12); and the inner side wall of the rotating gear ring (12) is fixedly connected to the rotating ring (13).

5. The PCB conveying and transferring device with electroplating quality detection function according to claim 4 is characterized in that: The inner side wall of the rotating ring (13) is fixedly connected to a knob (35), and the knob (35) is slidably connected to the inner side wall of the spiral groove on the pressed threaded rod (14). The rotating ring (13) is rotatably connected to the storage bucket (21) through a guide tube, and the guide tube is fixedly connected to the steering seat (9) through a mounting seat. A conductive metal ring for testing the electrical performance of the blind hole of the PCB board is provided on the edge of the inverted bucket cover (15).

6. The PCB conveying and transferring device with electroplating quality detection function according to claim 5, characterized in that: The bottom end of the resin storage chamber (8) is communicated with the cover hole ring (23) through a flow pipe (22), a vacuum pump (20) is provided on the flow guide pipe, and the bottom end of the storage hopper (21) is rotatably connected to a sealing swivel (24).

7. The PCB conveying and transferring device with electroplating quality detection function according to claim 6, characterized in that: A positioning ring (27) is provided inside the sealing rotating ring (24), and the positioning ring (27) is rotatably connected to the sealing partition blade (28) through a plurality of pins (26). The inner side wall of the sealing rotating ring (24) is rotatably connected to the pins (26) through a plurality of arc-shaped push rods (25).

8. The PCB conveying and transferring device with electroplating quality detection function according to claim 1, characterized in that: The pressure measuring assembly includes a soft rubber pad (17) and a plurality of building block pads (18), wherein the plurality of building block pads (18) are placed in a through hole provided on the soft rubber pad (17), and the top end of the soft rubber pad (17) is connected to a sensing plate (16) via a conversion plate (19), wherein the conversion plate (19) is provided with a plurality of conversion holes arranged opposite to the through holes, wherein the conversion holes are filled with liquid, and the sensing plate (16) is provided with a plurality of pressure sensing elements.

9. The PCB conveying and transferring device with electroplating quality detection function according to claim 1, characterized in that: The film limiting assembly includes a film pressing impeller (33) and a plurality of lifting suction cups (34). The bottom end of the reversing film sticking seat (31) is connected to the film pressing impeller (33) via a control motor. The lifting suction cups (34) are fixedly connected to the bottom end of the reversing film sticking seat (31). A film storage frame (32) is provided below the lifting suction cups (34) on the outside.

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