Module for flipping substrates in vacuum

Abstract

The invention provides an apparatus and method for flipping a substrate in vacuum between PVD sputter on each side to improve throughput. In some embodiments disclosed herein, a module for a processing system for flipping a substrate in a vacuum is provided. The module includes a clamp assembly for securing the substrate, a motor assembly coupled to the substrate clamp assembly for rotating the clamp assembly, a lift bar assembly, and a lift bar actuator for raising and lowering the lift bar assembly.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to apparatus and methods for processing substrates in electronic component manufacturing systems, and more particularly, to apparatus and methods for flipping a substrate in a vacuum between deposition processes performed on opposing sides of the substrate. Background Art

[0002] Substrate processing in electronic component manufacturing often involves performing deposition processes on both sides of the substrate. However, processing chambers are typically designed to deposit material on only one surface at a time, such as the top or bottom surface of the substrate. Therefore, it is often necessary to flip or reorient the substrate relative to the chamber between deposition processes.

[0003] This is a particular challenge when processing large-area substrates, such as panels. For example, a common panel size might be 600mm by 600mm. Common panel materials include Ajinomoto build-up film (ABF), copper-clad laminate (CCL), top polymer panels, and glass. Due to the large surface area of ​​the polymer material on the panel, the panel absorbs a large amount of moisture. Therefore, to achieve good contact resistance, very effective degassing is required to remove all outgassing and remove contaminants from the panel.

[0004] To perform PVD sputtering on both sides of a substrate / panel, conventional designs remove the substrate / panel from the vacuum chamber and flip it over in the atmosphere. Upon removal from the vacuum chamber, additional degassing is required to remove any moisture absorbed by the substrate / panel. Since degassing can take tens of minutes, for example, approximately 40 minutes in some cases, this additional degassing operation can negatively impact panel yields.

[0005] Attempts have been made to mount the substrate / panel vertically in the PVD chamber to allow sputtering from both sides simultaneously. However, with this approach, the substrate / panel is not actively cooled and undesirable arcing can occur, damaging the panel.

[0006] Therefore, there is a need in the art for apparatus and methods for flipping a substrate in vacuum between deposition steps performed on each side of the panel. Summary of the Invention

[0007] The embodiments described herein generally relate to double-sided physical vapor deposition (PVD) sputtering of substrates in electronic component manufacturing processes. More specifically, the embodiments described herein provide apparatus and methods for flipping a substrate in a vacuum between PVD sputtering on each side.

[0008] In one embodiment, a module of a processing system includes a fixture assembly capable of securing a substrate. The fixture assembly includes a first plate, a second plate parallel to the first plate, and the second plate is movably coupled to the first plate in a direction perpendicular to a major plane of the first plate. The fixture assembly also includes a plurality of guide blocks, a plurality of finger frame assemblies coupled to the guide blocks, a motor assembly coupled to the fixture assembly, an actuator coupled to a lift plate, and a plurality of sensors.

[0009] In another embodiment, a processing system includes a deposition chamber, a transfer chamber coupled to the deposition chamber, and a load lock chamber coupled to the transfer chamber. The load lock chamber includes a module. The module includes a fixture assembly. The fixture assembly includes a first plate, a second plate parallel to the first plate, the second plate movably coupled to the first plate in a direction perpendicular to a major plane of the first plate, a plurality of guide blocks, and a plurality of finger frame assemblies coupled to the plurality of guide blocks. The fixture assembly also includes a stopper and a plurality of sensors.

[0010] In another embodiment, a method for rotating a substrate includes raising a lifter plate to open a clamp assembly and receive the substrate, wherein the lifter plate is coupled to an actuator. Receiving the substrate on a plurality of lifters, wherein the plurality of lifters are coupled to the lifter plate. Sensing the substrate with one of a plurality of sensors. Lowering the lifter plate to close the clamp assembly. Rotating the substrate in a vacuum and raising the lifter plate to open the clamp assembly and support the substrate with the lifters. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Thus, the manner in which the above-described features of the present invention can be understood in detail, and while the present invention has been briefly described above, a more detailed description of the present invention can be obtained by reference to its embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, as other equally effective embodiments may be admitted.

[0012] Figure 1 is a schematic top view of an exemplary substrate processing system according to certain embodiments.

[0013] Figure 2 is a diagram showing a method of flipping a substrate in a vacuum using a flipper module according to certain embodiments.

[0014] Figure 3A According to some embodiments, a flipper module is included Figure 1 Schematic top isometric view of a portion of a substrate processing system.

[0015] Figure 3B According to some embodiments, a flipper module is included Figure 1 Schematic top isometric view of a portion of a substrate processing system.

[0016] Figure 4A is a partial side cross-sectional view of a flipper module in a closed position according to certain embodiments.

[0017] Figure 4B is a partial side cross-sectional view of a flipper module in a closed position according to certain embodiments.

[0018] Figure 5A is a partial side cross-sectional view of a flipper module in an open position according to certain embodiments.

[0019] Figure 5B is a partially exploded view of a clamp assembly according to certain embodiments.

[0020] Figure 5C is a cross-sectional view of a clamp assembly according to certain embodiments.

[0021] Figure 6A is a detailed perspective view of a substrate supported by lift pins, according to certain embodiments.

[0022] Figure 6B is a detailed perspective view of a guide block and substrate support element according to certain embodiments.

[0023] Figure 6C is a detailed perspective view of a guide block and a substrate support member securing a substrate according to certain embodiments.

[0024] Figure 6D is a top view of a clamp assembly that contacts a stopper according to certain embodiments.

[0025] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0026] Embodiments described herein generally relate to double-sided physical vapor deposition (PVD) processes performed on substrates in electronic component manufacturing systems. More specifically, embodiments described herein provide apparatus and methods for flipping a substrate in a vacuum between PVD processes (such as sputtering) on ​​each side of the substrate.

[0027] Compared to the traditional method of removing the substrate from the vacuum and flipping it in the atmosphere, the embodiments described in this case can deposit materials on both sides of the substrate without removing the substrate from the vacuum. Performing this process in the vacuum eliminates the need for additional degassing operations and improves throughput.

[0028] The embodiments described herein enable deposition of material on both sides of a substrate without holding the substrate vertically. Performing the sputtering process on a substrate that is flat and horizontally placed on a substrate support element allows for active cooling and prevents undesirable arcing.

[0029] The embodiments described herein provide an apparatus for flipping substrates in a vacuum within a load lock chamber without increasing the footprint of existing or new processing systems. In addition to conventional substrates, the embodiments described herein are also capable of flipping large area substrates in a vacuum.

[0030] Exemplary Substrate Processing System

[0031] Figure 1 is a schematic top view of an exemplary substrate processing system 100 (also referred to as a "processing platform") according to certain embodiments. In certain embodiments, the substrate processing system 100 is specifically configured for processing large area substrates. As used herein, the term "panel" can refer to a large area substrate that can be used to form a component package or a large panel display. In some device packaging examples, a "panel" can include a large surface area substrate that includes a polymer material disposed on a structural core. The substrate processing system 100 generally includes an equipment front end module (EFEM) 102 for loading substrates into the processing system 100, a first load lock chamber 104 coupled to the EFEM 102, a transfer chamber 106 coupled to the first load lock chamber 104, and a plurality of other chambers coupled to the transfer chamber 106, as described in detail below. Proceeding counterclockwise from the first load lock chamber 104 around the transfer chamber 106, the processing system 100 includes a first dedicated degas chamber 108, a first pre-clean chamber 110, a first deposition chamber 112, a second pre-clean chamber 114, a second deposition chamber 116, a second dedicated degas chamber 118, and a second load lock chamber 120. The second load lock chamber 120 includes a flipper module for flipping substrates in a vacuum, as described in more detail below. In some embodiments, a turbomolecular pump coupled to the second load lock chamber 120 is used to create the vacuum. However, other types of vacuum pumps are also contemplated. In some embodiments, the transfer chamber 106 and each chamber coupled to the transfer chamber 106 is in a vacuum. As used herein, the term "vacuum" may refer to a vacuum of less than about 10 -2 However, some high vacuum systems may have pressures below 10 -7 Pa operates under pressure.

[0032] In certain embodiments, the system controller 126 (also referred to herein as a processing chamber controller) includes a central processing unit (CPU) 127, memory 128, and support circuitry 129. The system controller 126 is used to control the processing sequence when processing substrates 122, including the substrate transfer and substrate flipping methods described herein. The CPU 127 is a general-purpose computer processor configured for use in an industrial environment and is used to control the processing system 100 and its associated subprocessors. The memory 128, as described herein, is typically non-volatile memory and may include random access memory (RAM), read-only memory (ROM), a magnetic or hard disk drive, or other suitable forms of local or remote digital storage. The support circuitry 129 is typically coupled to the CPU 127 and may include cache, clock circuitry, input / output subsystems, power supplies, and combinations thereof. Software instructions (i.e., software programs) and data may be programmed and stored within the memory 128 to instruct the processors within the CPU 127. The software programs, readable by the CPU 127 within the system controller 126, determine which tasks are to be performed by the components within the processing system 100. Typically, a software program readable by the CPU 127 in the system controller 126 includes program code that, when executed by the processor (CPU 127), performs tasks associated with the processing and substrate transfer schemes described herein. The software program may include instructions for controlling various hardware and electronic components within the processing system 100 so that the methods described herein can be performed. In one embodiment, the program includes one or more instructions for performing the method of flipping a substrate described herein.

[0033] In some embodiments, substrates are loaded into the processing system 100 through a door (also known as a "slit valve") in the first load lock chamber 104 and unloaded from the processing system 100 through a door in the second load lock chamber 120. In some embodiments, a stack of substrates is supported in a cassette that is placed in the first load lock chamber 104. Once the first load lock chamber 104 is evacuated, the substrates are retrieved one at a time from the cassette using a robot located in the transfer chamber 106. In one embodiment, the second load lock chamber 120 receives a single substrate after processing is performed on each side and unloads the processed substrates to the EFEM 102. The second load lock chamber 120 can be a dual chamber, including an upper chamber 125 ( Figure 3A ) for receiving substrates after both sides have been processed and unloading the substrates to the EFEM 102, and includes a flipper module 130 ( Figure 3A ) is used to flip the substrate on one side that has been processed to process the other side. However, other loading and unloading configurations are also conceivable.

[0034] Pre-cleaning the substrate is important for removing impurities (e.g., oxides) from the substrate surface so that the metal film deposited in the deposition chamber is not electrically isolated from the substrate. By performing pre-cleaning in the first and second pre-cleaning chambers 110 and 114, which share the same vacuum environment as the first and second deposition chambers 112 and 116, the substrate can be transferred from the cleaning chambers to the deposition chambers without being exposed to the atmosphere. This prevents the formation of impurities on the substrate during the transfer process. Additionally, since vacuum is maintained in the substrate processing system 100 during the transfer of the cleaned substrate to the deposition chamber, vacuum pumping cycles are reduced.

[0035] In some embodiments, only one substrate is processed at a time in each pre-clean and deposition chamber. Alternatively, multiple substrates, such as four to six substrates, may be processed at once. In such embodiments, the substrates may be positioned on rotatable pedestals within separate chambers. In some embodiments, the first pre-clean chamber 110 and the second pre-clean chamber 114 are pre-clean etch chambers for etching substrate surfaces. However, other types of pre-clean chambers are also contemplated. In some embodiments, one or both of the pre-clean chambers are replaced with deposition chambers for performing reactive sputtering processes, such as depositing silicon nitride, aluminum oxide, or other materials. In an inductively coupled plasma (ICP) chamber, a coil at the top of the chamber is energized by an external RF source, generating an excitation field within the chamber. Argon gas is flowed through the chamber from an external source. Argon atoms within the chamber are ionized (charged) by the RF energy. The substrate is biased by a DC bias source coupled to an aluminum pedestal on which the substrate rests. The charged atoms are attracted to the substrate, causing etching of the substrate surface. Gases other than argon may be used, depending on the desired etch rate and the material being etched. The ionization energy level of the etch as part of the cleaning process can be relatively low compared to the process used to etch features in the substrate surface. The lower energy can avoid damaging circuit elements and features already formed on the substrate.

[0036] In some embodiments, the first deposition chamber 112 and the second deposition chamber 116 are PVD chambers. In such embodiments, the PVD chamber can be configured to deposit copper, titanium, aluminum, gold, nickel, nickel vanadium, silver and / or tantalum. However, other types of deposition processes and materials are also contemplated. In a PVD chamber, the entire back side of the substrate is in electrical and thermal contact with the susceptor. Controlling the temperature of the substrate during the sputtering process is important for obtaining predictable and reliable films. The coolant system includes an external cooling source that supplies fluid to cooling lines in the susceptor. The cooling source can be replaced or augmented with a heating source to increase the workpiece temperature independently of the sputtering process.

[0037] In certain embodiments, an RF bias source is electrically coupled to the pedestal to energize the pedestal and, therefore, the substrate during the sputtering process. For example, substrate bias (RF bias) may be used when the substrate / panel has features that require good step coverage. Alternatively, the pedestal may be grounded, floating, or biased solely with a DC voltage source.

[0038] In operation, the PVD deposition chamber is evacuated and backfilled with argon gas. The gas is powered by a DC power supply to couple the electromagnetic field in the PVD deposition chamber to excite a continuous high-density plasma near the target surface. The plasma confined near the target surface contains positive ions (e.g., Ar+) and free electrons. The ions in the plasma collide with the target surface and sputter the material from the target. The substrate receives the sputtered material to form a deposited layer on the substrate surface. In one example, up to 20 kilowatts of DC power can be provided to the target, allowing the target to deposit about 1 micron of material per minute on the substrate.

[0039] The PVD deposition chamber uses a magnetron assembly outside the vacuum to further control the bombardment of the target by ions formed in the plasma. In some embodiments, a fixed permanent magnet is located behind the target (used as a deposition source) so that the plasma is confined to the target area. In other cases, the magnet is scanned on the back side of the target to help distribute the magnetic field evenly on the target, thereby achieving more uniform target erosion. The resulting magnetic field forms a closed loop annular path that acts as an electron trap, reshaping the trajectory of secondary electrons ejected from the target into a cycloidal path, greatly increasing the possibility of ionization of the sputtering gas in the confinement area. Inert gases (such as argon) are typically used as sputtering gases because they tend not to react with the target material or combine with any process gas, and produce higher sputtering and deposition rates due to their high molecular weight. Positively charged argon ions from the plasma are accelerated toward the negatively biased target and impact the target, causing material to sputter from the target surface.

[0040] During processing operations, the chamber walls are typically electrically grounded. A bias voltage on the substrate can drive a flux of charged species (Ar+ and / or atoms sputtered from the target) toward the substrate. The flux can alter the properties of the sputtered material deposited on the substrate surface, such as film density.

[0041] Figure 2A method 200 is shown for flipping a substrate 122 in a vacuum using the flipper module 130 of the second load lock chamber 120, according to certain embodiments. As described below, the process of flipping the substrate can be performed between deposition processes performed on opposing sides of the substrate. Thus, by interleaving flipping steps between deposition steps on opposing sides of the substrate, a first side of the substrate can receive deposited material while an opposing second side of the substrate, opposite the side receiving the deposited material, is supported by elements within the deposition chamber and actively cooled and / or biased.

[0042] Example Flipper Module Description

[0043] Figure 3A According to certain embodiments Figure 1 A schematic top isometric view of a portion of a substrate processing system 100 is shown. As shown, a load lock chamber 120 is configured to receive and unload substrates 122 during processing and includes an upper chamber 125 and a flipper module 130 configured to receive a processed substrate 122, for example, on a front side 122a, and flip the substrate 122 for processing on a back side 122b.

[0044] like Figure 3A As shown, the substrate 122 is disposed in the transfer chamber 106. Figure 3A , for the sake of clarity, only the transfer chamber 106 and the flipper module 130 of the second load lock chamber 120 are shown. The edge of the substrate 122c contacts the end effector of the transfer robot 124. The substrate 122 and the end effector of the transfer robot 124 are aligned with a door of the flipper module 130 of the load lock chamber 120. According to some embodiments, the front side 122a of the substrate 122 faces upward and the back side 122b faces downward. The substrate 122 may have a thickness in the range of about 0.1 mm to about 4 mm, for example, in the range of about 0.2 mm to about 3.2 mm. In this example, the substrate 122 is a panel (also referred to as a "substrate" in this case).

[0045] Figure 3AAlso shown is how the load lock chamber 120 may further include a plurality of sensors 180, 182, 184, 186. Each of the plurality of sensors 180, 182, 184, 186 is an optical sensor, but may also be a proximity sensor, a pressure sensor, a rotation sensor, a temperature sensor, other sensors, or any combination thereof, for analyzing characteristics of the chamber 120 and the substrate 122. According to some embodiments, the panel or substrate presence sensor 180 reads whether the substrate 122 has been positioned within the chamber 120 or the flipper module 130. The panel or substrate transfer sensor 182 reads whether the substrate 122 has been released by the transfer robot 124. The panel or substrate rotation sensor 184 reads whether the substrate 122 has been released during the flipping process (e.g., Figure 2 For context, the amount that the substrate 122 has rotated can indicate whether the module 130 is ready to perform another step in the flip operation. The gripper position sensor 186 reads whether the substrate 122 is currently being held by the flipper module 130 during the flip process. Figure 4A When the clamp assembly is shown in the open position, the substrate is not secured. Figure 5A When the clamp assembly is shown in the closed position, the substrate 122 is secured. Figure 3A As shown, the plurality of sensors 180, 182, 184, 186 are positioned outside of the chamber 120, but in some embodiments may be disposed within the chamber 120. According to some embodiments, the plurality of sensors 180, 182, 184, 186 may be coupled to the controller 126 to monitor and control the module 130.

[0046] Figure 3B FIG. 1 shows the substrate 122 when the transfer robot 124 transfers the substrate 122 from the transfer chamber 106 to the flipper module 130. Figure 3B In the figure, for the sake of clarity, only the transfer chamber 106 and the flipper module 130 of the second load lock chamber 120 are shown. In addition, in order to show the interior of each chamber, the upper part of the load lock chamber is omitted. Figure 3B As shown, the transfer robot 124 has moved the substrate 122 from the transfer chamber 106 into the housing 131 of the flipper module 130. Once the substrate is in the flipper module 130, the transfer robot can release the substrate 122 and allow the flipper module 130 to provide support to the substrate 122.

[0047] Figure 4A A schematic diagram of the inverter module 130 is shown in a closed position (also referred to as a "clamped position") according to some embodiments. The inverter module 130 includes a clamp assembly 140, a motor assembly 134, and a lift plate assembly 420 for rotation. Figure 4B The lifter plate assembly 420 is shown in a lowered position according to some embodiments. Figure 5A A schematic diagram of the flipper module 130 is shown in an open position for receiving or removing a substrate 122 from the flipper module 130 . Figure 5B An exploded perspective view of a portion of a clamp assembly 140 is shown, according to some embodiments. Figure 5C is in Figure 5A An enlarged view of a portion of the clamp assembly 140 is shown in the open position. Figure 6A is a detailed perspective view of a portion of the clamp assembly 140 in an open position, wherein the substrate 122 is positioned and supported by a plurality of lift pins 402, according to some embodiments. Figure 6B A detailed view of the plurality of fingers 610a, 610b holding the substrate 122 when the clamp assembly 140 has been closed on the substrate 122 is shown, according to some embodiments. Figure 6C yes Figure 6A An enlarged view of the plurality of substrate support elements 606a, 606b is shown.

[0048] Clamping position

[0049] like Figure 4A As shown, the flipper module 130 shows the clamp assembly 140, which is held within the vacuum environment 131a along with the lift plate assembly 420, while the motor assembly is located outside the module housing 131, rather than within the vacuum environment 131a. According to some embodiments, the motor assembly 134 includes a housing 132, a motor 133, and a shaft and seal assembly 156. The motor 133 is configured to rotate the clamp assembly 140 about a first axis A1. In the clamped position, the lift plate assembly 420 is located outside the rotational path of the clamp assembly 140. By using the motor assembly 134, the rotational path of the clamp assembly 140 is formed around the first axis A1.

[0050] like Figures 4A-5B As shown, the clamp assembly 140 includes a first clamp assembly 148a, a second clamp assembly 148b, at least one of two or more clamp slides 410, and at least one of two or more spring-loaded connectors 174. The first clamp assembly 148a includes a first plate 142, and the second clamp assembly 148b includes a second plate 144. The first plate 142 and the second plate 144 are maintained parallel to each other by the clamp slides 410. The one or more clamp slides 410 are used to provide a connection between the first plate 142 and the second plate 144 to help maintain their parallelism and also to allow for a mechanical biasing force provided by one of the two or more spring-loaded connectors 174.

[0051] like Figure 4AAs shown, the motor assembly 134 is connected to the clamp assembly 140 via a shaft and seal assembly 156. The shaft and seal assembly 156 are connected to at least one or more clamp slides 410 through the module housing 131. The support 146 is coupled to the interior of the housing 131 and is connected to the clamp slide 410, which is connected to the side of the clamp assembly 140 opposite the motor assembly 134. The support 146 is aligned with the first axis A1 and supports the clamp assembly 140. The shaft and seal 156 allow rotational motion to be transferred from the motor 133 to the clamp assembly 140 while maintaining the vacuum environment in the processing system 100. Figure 4A As shown, the first axis A1 is parallel to the X axis. The motor 133 may include programmed stops every 180° and may be an electric, gear-driven, or belt-driven motor assembly, although other types are also contemplated.

[0052] like Figure 4B As shown, the lifter plate assembly 420 includes a lifter plate 406 coupled to an actuator 135 via an actuator shaft 137. The actuator 135 is coupled to the housing 131 of the flipper module 130. The actuator 135 extends and retracts the lifter plate assembly 420 along a first direction D1 parallel to the Z axis. The actuator shaft is parallel to Figure 4A The Z direction in the coordinate system. The lifter plate assembly 420 includes a plurality of lifters 402 extending from the lifter plate surface 408, and a plurality of clamp assembly pins 404 extending from the lifter plate surface 408. In addition, the lifter plate assembly 420 may include a plurality of clamp alignment pins 460 extending from the lifter plate surface 408 along the first direction D1.

[0053] The lifter plate assembly 420 includes the plurality of lifters 402, the plurality of clamp assembly pins 404, and the plurality of clamp alignment pins 460 aligned in a first direction D1. During a flipping operation, the lifter plate 406 is lowered by the actuator 135 out of the rotational path of the clamp assembly 140. In some embodiments, the actuator is located outside the housing 131 at standard pressure, while the actuator shaft 137 is disposed within the housing 131. The actuator 135 and the actuator shaft 137 are sealed using a bellows assembly to prevent loss of vacuum pressure.

[0054] The plurality of lift pins 402 are configured to support and receive the substrate 122 when the actuator 135 extends the lift pin plate assembly 420 into the clamp assembly 140. Figure 5A As shown, the clamp assembly pin 404 is configured to contact the clamp assembly 140 and hold the clamp assembly 140 open when the actuator 135 extends the lift plate assembly 420 into the clamp assembly 140, as described in more detail below. The clamp alignment pin 460 is configured to align the clamp assembly 140 when the clamp alignment pin 460 passes through the alignment holes 436a-b, as shown in FIG. Figure 5BThe clamp alignment pin 460 passes through the alignment holes 436a-b in the clamp assembly perpendicular to the first plane P1.

[0055] like Figure 4A As shown, the spring loaded connector 174 mechanically biases the first plate 142 and the second plate 144 of the clamp assembly toward a closed position. The spring loaded connector 174 is coupled to the first and second clamp assemblies 148a, 148b. At least one or more clamp slides 410 are coupled to the clamp assembly 140. The clamp slides 410 are coupled to the motor assembly 134 so that the motor 133 transfers rotational energy to the clamp assembly 140 through the clamp slides 410. As part of the execution of the method 200, another clamp slide 410 is disposed opposite the clamp slide 410 adjacent the motor assembly 134. Figure 4A On the left side, the clamp slide 410 is coupled to the support 146 for providing support during rotation of the clamp assembly 140. The support is coupled to the interior of the flipper module 130.

[0056] After the plurality of guide blocks 608a, 608b align the substrate 122 relative to the center of the clamp assembly 140, the fingers 610a, 610b of the substrate support member 606 contact the substrate 122 when the clamp assembly 140 is closed. The guide blocks 608a, 608b may remain in contact with the substrate during rotation. Figure 6B As shown, the fingers 610a, 610b are coupled to the plurality of guide blocks 608a, 608b via the finger plate 612. The substrate supporting surfaces 614a, 614b of the fingers 610a, 610b are aligned in a direction parallel to the first plane P1, as shown in FIG. Figure 5B As shown. The fingers 610a, 610b are coupled to the finger frame plate 612 via a clip geometry, although other coupling methods are also contemplated. In one example, the clip geometry of the fingers 610a, 610b includes a resilient alloy element that includes features that engage or "snap" to the support member or body. The finger frame plate 612 may include one or more metals, such as aluminum, aluminum alloys, steel, stainless steel, and alloys thereof or any combination thereof. The fingers 610a, 610b include a resilient copper alloy, but other materials may also be used for the fingers 610a, 610b. For example, the fingers 610a, 610b may include beryllium copper with a nickel tin coating or other similar metal coating. As Figure 6BAs shown, the fingers 610a, 610b have a triangular shape, but other embodiments are also contemplated. Each finger 610a, 610b can include a resilient element of any shape that, when combined with the other fingers 610a, 610b, can contact, support, and / or retain the substrate 122. The substrate 122 is held in position between the first plate 142 and the second plate 144 so that the clamp assembly 140, in the clamped position, can rotate the substrate 122 without displacing the substrate 122.

[0057] According to some embodiments and as Figure 6B As shown, the finger support contact surface 614 is configured to deflect when the force provided by the spring-loaded connector 174 causes the first plate 142 and the second plate 144 of the clamp assembly 140 to contact the substrate 122. The finger support 610 is configured to contact the substrate 122 only in certain predetermined areas 10 millimeters (mm) wide. The predetermined areas can be limited to the substrate surfaces 122a-b, 10 mm from the substrate edge 122c, and in the shape of a 10 mm wide strip extending across the substrate surfaces 122a-b. Other predetermined areas and area sizes are also contemplated. These predetermined areas can reduce damage to the substrate surfaces 122a-b and maximize production yields.

[0058] like Figure 6A 、 6B6C , the first plate 142 and the second plate 144 each include a plurality of substrate support elements 606 and a plurality of guide blocks 608. The plurality of guide blocks 608 can be coupled to the first plate 142 and the second plate 144 using mechanical fasteners, although other methods are also contemplated. According to some embodiments, the substrate support element 606 includes a finger frame plate 612 (also referred to as a "finger frame base") and fingers 610a, 610b coupled to the finger frame plate 612. The finger frame plate 612 can include one or more metals, such as aluminum, an aluminum alloy, steel, stainless steel, alloys thereof, polymers, or ceramics, or any combination thereof. The substrate support element 606 can also be directly coupled to the first plate 142 and the second plate 144. The guide blocks 608 are coupled to the first plate 142 and the second plate 144 and are used to help align and position the substrate 122 within the fixture assembly 140. Each guide block 608 also includes an alignment surface 604. The plurality of guide blocks 608 can be made of one or more metals, such as aluminum, an aluminum alloy, steel, stainless steel, alloys thereof, or any combination thereof. Polymers are also contemplated. When the clamp assembly 140 is closed on the substrate 122, any misalignment of the substrate 122 in the XY plane can be corrected by the guide blocks 608. The misaligned outer edge 122c of the substrate will contact the alignment surface 604, causing the substrate 122 to slide into alignment within the clamp assembly 140. Before flipping the substrate 122, when the clamp assembly 140 is closed on the substrate 122, any misalignment of the substrate 122 within the clamp assembly 140 is corrected because the edge of the substrate 122c contacts and follows the contour of the guide block alignment surface 604. Consequently, when the plurality of lift pins 402 lowers the substrate 122 to a position where it rests on the plurality of finger racks 610, gravity causes the substrate 122 to move into position. In some embodiments, the plurality of guide blocks 608 can correct deviations up to 7 mm, for example, 4 mm, from center, and at least 2 mm from a predetermined position.

[0059] Open Location

[0060] like Figure 5A As shown, when the clamp assembly 140 is in the open position, the module is properly oriented to receive a substrate, or is ready to remove a substrate from the clamp assembly 140 .

[0061] When the clamp assembly pin 404 of the lifter plate assembly 420 contacts the opposing plate of the clamp assembly 140, the clamp assembly 140 is in the open position. Figure 5A As shown, the clamp assembly pins 404 resist the biasing force of the spring loaded connector 174 to separate the opposing plates of the clamp assembly 140 from the base plate 122. The clamp assembly pins 404 contact the first plate 142 on the opposite side of the clamp assembly 140 and therefore pass through the second plate 144 when the clamp assembly 140 is positioned in this orientation. Figure 5AAs shown, the plurality of lifting pins 402 pass through the first plate 142 or the second plate 144 to contact and support the substrate 122. The first plate 142 and the second plate 144 further include a plurality of holes 432a-b, 434a-b, 436a-b, as shown in FIG. Figure 5B When in the open position, the clamp assembly pin 404 passes through the holes 432a-b, 434a-b, depending on which of the first plate 142 or the second plate 144 is closer to the lifter plate assembly 420 due to its flipped orientation (e.g., which plate is located at the top or bottom of the clamp assembly 140). Generally speaking, the first and second plate holes 432a-b, 434a-b are configured so that the clamp assembly pin 404 will only contact the plates on opposite sides of the lifter plate assembly 420. The plate holes 432a-b, 434a-b of the plate closer to the lifter plate assembly 420 will allow the clamp assembly pin 404 to pass therethrough.

[0062] like Figure 5A and 5C As shown, once the lift plate assembly 420 is extended to place the clamp assembly 140 in the open position, the substrate 122 can be removed from or placed within the clamp assembly 140. When the substrate 122 is placed in the open position within the clamp assembly 140, it is supported by the plurality of lift pins 402. According to some embodiments, if the substrate 122 is positioned within the flipper module 130, the presence sensor 180 can be used to indicate that the substrate 122 is no longer moving and is in the correct position within the clamp assembly 140. In addition, the transfer sensor 182 can be used to indicate when the transfer robot 124 has released the substrate 122 and that the substrate 122 is supported only by the plurality of lift pins 402.

[0063] like Figure 5B As shown, the substrate 122 is positioned between the first plate 142 and the second plate 144 according to some orientations. The first plate 142 and the second plate 144 have openings that allow the plurality of substrate support elements 606a, 606b to be positioned within the boundaries of the first plate 142 and the second plate 144. Figure 4A and 6B As shown, the plurality of substrate support elements 606 (such as Figure 5B The substrate support elements 606a, 606b (shown in FIG) are configured to contact the substrate 122 once the clamp assembly 140 is closed. As described above, the substrate support elements 606a, 606b ( Figure 5B ) of finger racks 610a, 610b ( Figure 6B ) The area contacting the substrate 122 may be predetermined to minimize contact between the clamp assembly 140 and the substrate 122 , thereby increasing the available area of ​​the substrate 122 .

[0064] like Figure 5A and 5CAs shown, the clamp assembly 140 is held open by the clamp assembly pin 404 pressing against the first plate 142 against the bias of the spring-loaded connector 174. The clamp alignment pin 460 passing through the plurality of clamp alignment holes 436a, 436b keeps the movement of the clamp assembly 140 limited to the first direction D1 and aligns the first plane P1 perpendicular to the first direction D1.

[0065] Figure 6A FIG. 1 shows the corner of the clamp assembly 140 in the open position according to some embodiments. Figure 6A and Figure 6C As shown, in the open position, the plurality of guide blocks 608 do not support the base plate 122 in the open position. In contrast, in the open position, only the lifting rods 402 are in contact with the base plate 122.

[0066] Figure 6D 1 is a top view of the flipper module 130, showing the stop assembly. The stop assembly includes one or more stop plates 450 and one or more stop modules 452. The stop plate 450 is coupled to the first plate 142, and another stop plate 450 is coupled to the second plate 144 (obscured from view from below the first plate 142). The stop plate 450 is configured to contact the stop module 452 once the clamp assembly 140 is rotated. According to some embodiments, the clamp assembly 140 is first rotated 180° clockwise around the axis of the motor 133 (e.g., Figure 4A ) to flip the first substrate, and then rotate 180° counterclockwise around the axis of the motor 133 to flip the next substrate. After each flip, once the stop plate 450 contacts the stop module 452, the clamp assembly 140 stops rotating. The stop plate 450 and the stop module 452 are configured to stop the rotation of the clamp assembly 140 and prevent the clamp assembly 140 from overtravel. According to some embodiments, the sensor 184 (such as Figure 3A ) is configured to monitor when the stop plate 450 contacts the stop module 452.

[0067] Exemplary Tumbler Usage

[0068] Figure 2 A method of flipping a substrate is shown. In operation 202, as Figure 3B As shown, the substrate 122 is transferred from the transfer chamber 106 to the flipper module 130. During operation 202, the processing system 100 moves the substrate 122 to a position where the clamp assembly 140 receives the substrate 122 ( Figure 3A ).

[0069] Operation 204 begins with the clamp assembly 140 in the open position, as shown. Figure 5AAs shown. Because the lifter plate assembly 420 is positioned to contact the clamp assembly 140 and hold it open, the substrate is received on the plurality of lifters 402. In other embodiments, the clamp assembly 140 is raised from a lowered position prior to operation 202. The clamp assembly pins 404 of the clamp assembly contact the plates 142, 144 opposite the lifter plate assembly 420 and resist the bias of the spring loaded connector 174 and hold the clamp assembly 140 open. Once the substrate 122 has been received on the plurality of lifters 402, the actuator 135 retracts the lifter plate assembly 420, at which point the plurality of lifters 402 deposits the substrate on the finger rack contact surface 614 so that the substrate lifters 402 no longer support the substrate 122. Additionally, as the lifter plate assembly 420 continues to move away from the clamp assembly 140 and toward the lower portion of the module housing 131, as shown Figure 4B As shown, the clamp assembly pin 404 disengages the plate 142 of the clamp assembly 140 and the spring loaded connector 174, biasing the first plate 142 and the second plate 144 to the position shown in FIG. Figure 4A and 6B In the closed position, as shown Figure 6B As shown, the plurality of substrate support elements 606a and 606b contact the substrate 122 on a first side or front side 122a and a second side or back side 122b of the substrate, respectively.

[0070] In operation 206, the lift plate 406 is lowered to clear the rotation of the clamp assembly. The clamp assembly 140 is rotated approximately 180° by the motor 133. After the clamp assembly 140 has rotated approximately 180°, the orientation of the clamp assembly 140 and the substrate 122 secured therein is considered "flipped." For example, after rotation, the top surface (front side 122a) of the substrate is oriented downward, and the back surface (rear side 122b) of the substrate 122 is oriented upward. During rotation, the front side 122a remains in contact with the substrate support element 606a of the first assembly 148a, and the rear side 122b remains in contact with the substrate support element 606b of the second assembly 148b during rotation because the clamp assembly 140 remains closed around the substrate 122 due to the bias applied by the spring-loaded connector 174. Once the stop plate assembly plate 150 contacts the stop module 452, the clamp assembly 140 stops rotating. In other embodiments, the rotation determination method may include an encoder coupled to the motor 133 and a sensor to indicate that the desired rotation has been achieved.

[0071] At operation 208, the lift plate is raised again to open the clamp assembly 140 to a similar Figure 5AThe first and second plates 142, 144 are now positioned in the same orientation as shown. However, at operation 208, the first plate 142 and the second plate 144 have swapped positions, such that the second plate 144 is positioned above the first plate 142. The actuator 135 extends the lifter plate assembly 420 to contact the clamp assembly 140 and holds it open by contacting the plates 142, 144 opposite the lifter plate assembly 420 via the clamp assembly pins 404. The plurality of clamp assembly pins 404 extend through the holes 432a, 434a in the first plate 142 to contact the second plate 144. The plurality of spring-loaded connectors 174 no longer secure the substrate 122 in the clamp assembly 140, and the substrate 122 rests on the lifter plates 402.

[0072] In operation 210, the substrate 122 is transferred out of the flipper module 130. The transfer robot 124 can be used to transfer the flipper module out, but other methods are also contemplated. According to some embodiments, the transfer robot 124 removes the flipped substrate 122 from the lift pins 402 and the flipper module 130 and transfers the flipped substrate 122 to the transfer chamber 106. When the substrate 122 is transferred back to the transfer chamber 106 after flipping, a pre-cleaning and / or deposition process can be performed on the unprocessed side. As described above, during each operation of method 200, the substrate 122 is maintained in a vacuum. Therefore, when the substrate 122 is transferred back to the transfer chamber 106, it is not necessary to degas the substrate 122 before performing subsequent pre-cleaning and / or deposition processes on the back side 122b. This can significantly save time and increase the output of double-sided processing.

[0073] While the foregoing is directed to embodiments of the present invention, other and further embodiments of the present invention may be devised without departing from the general scope thereof, and the scope of the present invention is determined by the claims hereinafter appended.

Claims

1. A module of a processing system, the module comprising: A substrate clamp assembly, the substrate clamp assembly comprising: A first plate assembly, the first plate assembly comprising: First Board; and a plurality of substrate supporting elements coupled to the first plate, wherein each of the substrate supporting elements has a substrate supporting surface; A second plate assembly, the second plate assembly comprising: Second Board; and a plurality of substrate supporting elements coupled to the second plate, wherein each of the substrate supporting elements has a substrate supporting surface, wherein the substrate supporting surfaces of the substrate supporting elements of the first plate assembly and the second plate assembly are aligned in a parallel direction relative to a first plane; a motor assembly coupled to the substrate clamp assembly and configured to rotate the substrate clamp assembly about a first axis parallel to the first plane and orient the substrate supporting surfaces of the substrate supporting elements of the first plate assembly and the second plate assembly in a first direction; A lifting rod plate assembly, the lifting rod plate assembly comprising: a plurality of fixture assembly pins; and a plurality of lift rods, wherein the plurality of lift rods and the plurality of clamp assembly pins extend in a first direction; and A lift pin actuator is configured to position the plurality of lift pins along the first direction and within the openings formed in the first plate when the substrate supporting surface is positioned in the first direction.

2. The module of claim 1, further comprising: One or more stop plates coupled to the first plate or the second plate of the substrate clamp assembly, wherein the stop plates are positioned to contact a stop module disposed within the module and positioned a distance from the first axis.

3. The module of claim 1 , further comprising: A plurality of spring loaded connectors are coupled to the substrate clamp assembly.

4. The module of claim 1 , further comprising a plurality of guide blocks coupled to the first plate, wherein each substrate supporting element of the plurality of substrate supporting elements is coupled to a corresponding guide block of the plurality of guide blocks; and A plurality of spring loaded connectors are coupled to each of the first plate and the second plate.

5. The module of claim 1 , further comprising a plurality of guide blocks coupled to the first plate, wherein the plurality of guide blocks include alignment surfaces, wherein each of the plurality of substrate supporting elements extends from a corresponding one of the plurality of guide blocks in a direction perpendicular to the major plane of the first plate.

6. The module of claim 1 , further comprising a plurality of sensors coupled to a chamber, wherein the substrate clamp assembly and the lifter plate are disposed within the chamber, and At least one sensor of the plurality of sensors comprises: Fixture position sensor, Substrate presence sensor, Substrate transport sensor, or Substrate rotation sensor.

7. The module of claim 1 , wherein the lifter plate assembly further comprises: A plurality of clamp alignment pins are coupled to the lifter plate, wherein the plurality of clamp alignment pins extend along the first direction.

8. The module of claim 1, wherein each of the plurality of substrate support elements is configured to receive a substrate having a thickness in a range of about 0.2 mm to about 3.2 mm.

9. A processing system, comprising: deposition chamber; a transfer chamber coupled to the deposition chamber; and a load lock chamber coupled to the transfer chamber, wherein the load lock chamber comprises a module, wherein the module comprises: A fixture assembly, wherein the fixture assembly comprises: First board; a second plate, the second plate being parallel to the first plate, the second plate being movably coupled to the first plate in a direction perpendicular to a major plane of the first plate; a first plurality of guide blocks coupled to the first plate; a second plurality of guide blocks coupled to the second plate; a first plurality of substrate support elements coupled to the first plate; and a second plurality of substrate support elements coupled to the second plate; a lift rod assembly disposed within the load lock chamber; one or more stop plates coupled to the clamp assembly; and A plurality of sensors are in communication with the module.

10. The processing system of claim 9, wherein the module further comprises: an actuator coupled to the module; a motor assembly coupled to the module, wherein the clamp assembly is coupled to the clamp assembly; and Wherein, the lifting rod assembly further includes: a lifter plate coupled to the actuator, wherein the actuator is configured to move the lifter plate in a first direction to configure the clamp assembly in an open position; a plurality of clamp assembly pins coupled to the lifter plate; and A plurality of lift rods are coupled to the lift rod plate.

11. The processing system of claim 9, wherein the load lock chamber further comprises: One or more stops coupled to the load lock chamber, wherein the one or more stops are configured to prevent overtravel during rotation of the clamp assembly.

12. The processing system of claim 9, wherein the plurality of sensors are optical sensors.

13. The processing system of claim 9, wherein the first plurality of substrate support elements and the second plurality of substrate support elements each comprise a separate finger and finger mount.

14. The processing system of claim 13, wherein each of the fingers comprises a triangular shape and has a contact surface configured to receive the substrate.

15. A method of rotating a substrate within a processing system, the method comprising: moving a lifter plate assembly to contact the clamp assembly, wherein the lifter plate assembly positions the clamp assembly in an open position, wherein the lifter plate assembly comprises: Lifting rod plate; a plurality of clamp assembly pins coupled to the lifter plate; and a plurality of lift rods coupled to the lift rod plate, wherein the lift rod assembly is coupled to an actuator, wherein the clamp assembly opens when the plurality of clamp assembly pins contact the clamp assembly; receiving the substrate from a robot when the clamp assembly is in the open position; receiving the substrate on the lifter plate assembly within the fixture assembly, wherein the substrate is received on the plurality of lifters; sensing whether the substrate is in a correct position, wherein a plurality of sensors sense the status of the substrate; lowering the lifter plate assembly, wherein lowering the lifter plate assembly allows the clamp assembly to close; rotating the substrate in a vacuum; and The lift pin assembly is extended to open the clamp assembly and support the substrate with the lift pins.

16. The method of claim 15, wherein when the actuator retracts the lifter plate assembly, the substrate is supported by the clamp assembly, wherein the clamp assembly comprises: A first plate assembly, the first plate assembly comprising: a first plate having a mounting surface; a plurality of guide blocks coupled to the first plate; and a plurality of substrate supporting elements coupled to the mounting surface of the first plate, wherein each of the substrate supporting elements has a substrate supporting surface; and A second plate assembly, the second plate assembly comprising: a second plate having a mounting surface; a plurality of guide blocks coupled to the second plate; and a plurality of substrate support elements coupled to the mounting surface of the second plate, wherein each of the substrate support elements has a substrate supporting surface; The substrate supporting surfaces of the substrate supporting elements of the first plate assembly and the second plate assembly are aligned in a parallel direction relative to a first plane.

17. The method of claim 16, wherein the lifter plate assembly comprises: A plurality of clamp assembly pins extend from the lifter plate and are configured to contact the clamp assembly and hold the clamp assembly open.

18. The method of claim 16, wherein the clamp assembly further comprises one or more stop plates, wherein the rotation of the clamp assembly is stopped when the one or more stop plates contact one or more stop modules.

19. The method of claim 16, wherein a sensor of the plurality of sensors detects when a substrate is in a proper position for closing the clamp assembly.

20. The method of claim 16, wherein the plurality of substrate support elements each comprise a separate finger and a finger base, wherein the finger comprises a triangular shape and has a contact surface configured to receive the substrate.

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