Spot welding mechanism for integrated circuit chip machining

Abstract

The invention relates to the technical field of integrated circuit chip processing, in particular to a spot welding mechanism for integrated circuit chip processing, which comprises a bottom plate, one side of the top end of the bottom plate is fixedly connected with a stand column, and the upper and lower sides of one end of the stand column are fixedly connected with a fixed column and a fixed seat respectively; a clamping protection mechanism, a cooling mechanism and an absorption purification mechanism are respectively arranged on the fixed seat; the clamping protection mechanism comprises a placing plate, the inner wall of the placing plate is used for placing a chip body, guide columns slidably penetrate through the two sides of the opposite angles of the top end of the placing plate, and the top ends of the two guide columns are fixedly connected with an upper cover plate; the chip body and the wire can be positioned and clamped, so that the pin of the chip body is in contact with the wire, the pin is further placed on the supporting column, in the process, a worker does not need to hold the pin by hand, the situation that fingers of the worker are scalded by a spot welding head is avoided, and therefore the safety during spot welding can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip processing, in particular to a spot welding mechanism for integrated circuit chip processing. Background Art

[0002] An integrated circuit chip is a microelectronic device made by placing a large number of microelectronic components (such as transistors, resistors, capacitors, etc.) on a silicon or semiconductor substrate. The pins of an integrated circuit chip are divided into single-row pins and double-row pins. Before using a double-row pin integrated circuit chip, the pins and wires need to be welded together by spot welding, so a special spot welding mechanism is required for processing.

[0003] In the prior art, when spot welding the pins and wires of a double-row pin integrated circuit chip, a worker needs to hold the double-row pin integrated circuit chip with one hand and the wires with the other hand to make the pins and wires contact each other, and then place them on a support column. Then, a spot welding head is used to weld and fix them. Due to the shaking of the hands, the pins and wires of the double-row pin integrated circuit chip may be misaligned, resulting in a smaller welding surface during spot welding, which affects the quality and effect of spot welding. In addition, during welding, both hands are close to the welding head. When the worker works for a long time, he will become tired. Therefore, when the worker is not careful, his fingers may touch the spot welding head, thereby burning the worker's fingers, which is less safe. In addition, during spot welding, since the support column contacts the pins of the double-row pin integrated circuit chip for a long time, the long spot welding operation will cause the top temperature of the support column to be too high, resulting in slow cooling of the solder joint, thereby reducing the strength and stability of the solder joint. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the background technology and to propose a spot welding mechanism for processing integrated circuit chips.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions: a spot welding mechanism for processing integrated circuit chips, comprising a base plate, a column fixedly connected to one side of the top of the base plate, a fixing column and a fixing seat fixedly connected to the upper and lower sides of one end of the column, respectively, and a clamping protection mechanism, a cooling mechanism, and an absorption and purification mechanism respectively provided on the fixing seat; The clamping protection mechanism includes a placement plate, the inner wall of the placement plate is used to place the chip body, the top of the placement plate is slidably penetrated by guide pillars on both sides of the diagonal, the tops of the two guide pillars are fixedly connected to the upper cover plate, the bottom end of the upper cover plate is provided with a groove adapted to the shape of the chip body, the upper cover plate and the placement plate are combined together to position and clamp the chip body; The clamping protection mechanism also includes a fixed splint and a movable splint, and arc grooves are symmetrically opened between the fixed splint and the movable splint. The arc grooves between the fixed splint and the movable splint form a circular shape and clamp and fix the wires. Fixed connecting plates are fixedly connected at both ends of the movable splint, and the two fixed connecting plates are fixedly connected to the upper cover plate.

[0006] Preferably, the clamping protection mechanism also includes a circular plate A fixedly connected to the bottom end of the guide column, a third tension spring is fixedly connected between the two circular plates A and the placement plate, a placement groove is symmetrically connected to the bottom of the inner wall of the placement plate, and a lifting column is slid through the two placement grooves, and the tops of the two lifting columns are fixedly connected to a lifting plate, the bottom ends of the two lifting columns are fixedly connected to a circular plate B, and a second tension spring is fixedly connected between the two circular plates B and the placement plate.

[0007] Preferably, the clamping protection mechanism also includes a slot provided on one side of the top end of the placement plate, a limiting column slidingly passing through the slot, an end of the limiting column away from the placement plate is fixedly connected to a side plate, and an end of the side plate close to the placement plate is fixedly connected to both sides of the limiting column corresponding to the end, and the two first tension springs are fixedly connected to the placement plate, and an insert plate is fixedly connected above the corresponding slot at the bottom end of the upper cover plate, and a limiting slot is provided at the outer end of the insert plate.

[0008] Preferably, the clamping protection mechanism also includes a U-shaped clamp plate B and a U-shaped frame plate A symmetrically fixedly connected to the fixed clamp plate and the movable clamp plate near one end of the placement plate. The two groups of the U-shaped clamp plates B and U-shaped frame plates A are used to limit the insulation layer of the wire so that the metal wire of the wire falls above the pins of the chip body. The bottom ends of the fixed clamp plate and the placement plate are respectively fixedly connected with an L-shaped plate B and an L-shaped plate A, and the L-shaped plate B and the L-shaped plate A are both fixedly connected to the fixing seat.

[0009] Preferably, the cooling mechanism includes a support column A and a support column B fixed through the fixed seat, the support column A and the support column B are in contact with the bottom ends of the pins of the chip body, and the bottom ends of the support column A and the support column B are respectively provided with an output flow channel and an input flow channel, the support column A and the support column B are connected by a pipe, and a conical tube is fixedly connected to the bottom of the inner wall of the output flow channel.

[0010] Preferably, a cooling box is fixedly connected to the other side of the top of the base plate, and a water pump is fixedly connected to the side of the top of the base plate corresponding to the cooling box. The water pumps are connected to the cooling box and support column B through pipes, and the support column A and the cooling box are connected through pipes.

[0011] Preferably, the absorption purification mechanism includes a connecting plate fixedly connected to the top of the fixed connecting plate, the other ends of the two connecting plates are fixedly connected to a fixed cover, and also includes a purification box fixedly connected to the top of the cooling box, the purification box and the fixed cover are connected by a hose, a box cover is provided at the top of the purification box, a plurality of activated carbon plates are fixedly connected to the bottom end of the box cover, an exhaust fan is fixedly connected to the side of the purification box corresponding to the top of the cooling box, and the exhaust fan and the purification box are connected by a hose.

[0012] Preferably, the top end of the fixed column is fixedly connected to an electric push rod, the telescopic end of the electric push rod is fixedly connected to a movable seat, and two spot welding heads are fixedly passed through the movable seat.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The U-shaped clamping plate and the U-shaped clamping plate are connected to each other, and the U-shaped clamping plate is connected to the U-shaped clamping plate. The U-shaped clamping plate is used to connect the U-shaped clamping plate and the U-shaped clamping plate. The U-shaped clamping plate is used to connect the U-shaped clamping plate and the U-shaped clamping plate. The U-shaped clamping plate is used to connect the U-shaped clamping plate and the U-shaped clamping plate. The U-shaped clamping plate is used to connect the U-shaped clamping plate and the U-shaped clamping plate. The U-shaped clamping plate is used to connect the U-shaped clamping plate. The cooling mechanism allows cooling water to be injected into the output and input channels of support pillars A and B during spot welding of the chip body pins and wires. The tapered cylinder allows the cooling water to fill the tops of the output and input channels, allowing the cooling water to cool the tops of the support pillars, thereby removing the heat generated during spot welding, thereby accelerating the cooling of the solder joints and improving their strength and stability. Through the absorption and purification mechanism, the irritating gas generated during spot welding can be absorbed by the fixed cover, and then transported into the purification box through a hose. The irritating gas is then purified of odor through the activated carbon plate in the purification box to prevent the irritating gas from entering the surrounding environment and protect the health of surrounding workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 2The present invention is a spot welding mechanism for processing integrated circuit chips Figure 1 Enlarged view of point A in the middle; Figure 3 This is a top view from another perspective of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 4 The present invention is a spot welding mechanism for processing integrated circuit chips Figure 3 Enlarged view of point B in the middle; Figure 5 A bottom view of a partial structure of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 6 This is a diagram showing the separation of the upper cover plate and the placement plate of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 7 This is a structural diagram of an upper cover plate and a placement plate of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 8 A partial cross-sectional view of a placement plate of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 9 This is a diagram showing the separation of the fixed clamping plate and the movable clamping plate of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 10 This is a cross-sectional view of support pillars A and B of a spot welding mechanism for processing integrated circuit chips according to the present invention; Figure 11 This is a structural diagram of a cleanroom box for a spot welding mechanism used for processing integrated circuit chips according to the present invention.

[0015] Figure: 1, bottom plate; 2, upright column; 3, electric push rod; 4, fixed column; 5, movable seat; 6, spot welding head; 7, L-shaped plate A; 8, water pump; 9, cooling box; 10, fixed seat; 11, support column A; 12, L-shaped plate B; 13, fixed cover; 14, connecting plate; 15, fixed clamping plate; 16, movable clamping plate; 17, wire; 18, U-shaped frame plate A; 19, support column B; 20, fixed connecting plate; 21, upper cover; 22, placement plate; 23, first tension spring; 24 , limiting column; 25, side panel; 26, purification box; 27, exhaust fan; 28, chip body; 29, second tension spring; 30, third tension spring; 31, circular plate A; 32, circular plate B; 33, guide column; 34, lifting column; 35, lifting plate; 36, placement slot; 37, limiting slot; 38, plug-in plate; 39, slot; 40, arc groove; 41, U-shaped splint B; 42, inlet channel; 43, tapered tube; 44, outlet channel; 45, activated carbon plate; 46, box cover. DETAILED DESCRIPTION

[0016] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are merely examples, and those skilled in the art may conceive of other obvious variations.

[0017] like Figures 1-11 The illustrated embodiment shows a spot welding mechanism for processing integrated circuit chips, comprising a base plate 1, a column 2 being fixedly connected to one side of the top of the base plate 1, a fixed column 4 and a fixed seat 10 being fixedly connected to the upper and lower sides of one end of the column 2, a motorized push rod 3 being fixedly connected to the top of the fixed column 4, a movable seat 5 being fixedly connected to the telescopic end of the motorized push rod 3, two spot welding heads 6 being fixedly passed through the movable seat 5, and a clamping protection mechanism, a cooling mechanism, and an absorption and purification mechanism being respectively provided on the movable seat 10. When spot welding is performed, the motorized push rod 3 is started to push the movable seat 5 downward, and a guide and limiting mechanism is provided between the movable seat 5 and the fixed column 4 to prevent the movable seat 5 from deflecting, and the movable seat 5 moves downward with the spot welding heads 6, thereby enabling the spot welding operation. like Figure 2 、 Figure 6 、 Figure 7 As shown, the clamping protection mechanism includes a placement plate 22, the inner wall of the placement plate 22 is used to place the chip body 28, and guide pillars 33 are slidably penetrated on both diagonal sides of the top of the placement plate 22. The tops of the two guide pillars 33 are fixedly connected to the upper cover plate 21. The bottom end of the upper cover plate 21 is provided with a groove that matches the shape of the chip body 28. The upper cover plate 21 and the placement plate 22 are combined together to position and clamp the chip body 28; like Figure 2 、 Figure 9 As shown, the clamping protection mechanism also includes a fixed splint 15 and a movable splint 16. Arc grooves 40 are symmetrically opened between the fixed splint 15 and the movable splint 16. The arc grooves 40 between the fixed splint 15 and the movable splint 16 form a circular shape and clamp and fix the wire 17. Both ends of the movable splint 16 are fixedly connected with fixed connecting plates 20, and the two fixed connecting plates 20 are fixedly connected to the upper cover plate 21.

[0018] like Figure 5 、 Figure 6As shown, the clamping protection mechanism also includes a circular plate A31 fixedly connected to the bottom end of the guide column 33, a third tension spring 30 is fixedly connected between the two circular plates A31 and the placement plate 22, a placement groove 36 is symmetrically connected to the bottom of the inner wall of the placement plate 22, and the two placement grooves 36 are symmetrically connected to each other. A lifting column 34 is slidably passed through the two placement grooves 36, and a lifting plate 35 is fixedly connected to the top of the two lifting columns 34. The bottom ends of the two lifting columns 34 are fixedly connected to a circular plate B32, and a second tension spring 29 is fixedly connected between the two circular plates B32 and the placement plate 22. When disassembling, the elastic reset of the second tension spring 29 can make the circular plate B32 and the lifting column 34 move upward, and move the lifting plate 35 upward, so that the chip body 28 is separated from the inside of the placement plate 22. At the same time, the elastic reset of the third tension spring 30 can make the circular plate A31 and the guide column 33 move upward. Since the length of the guide column 33 is greater than the lifting column 34, the lifting height of the upper cover plate 21 is greater than the height of the lifting plate 35, and also greater than the height of the chip body 28, which is convenient for removing the spot-welded chip body 28.

[0019] like Figure 7 、 Figure 8 As shown, the clamping protection mechanism also includes a slot 39 provided on one side of the top of the placement plate 22. The slot 39 slides through the limit post 24. The end of the limit post 24 away from the placement plate 22 is fixedly connected to the side plate 25. The end of the side plate 25 close to the placement plate 22 is fixedly connected to the first tension spring 23 on both sides of the limit post 24. The two first tension springs 23 are fixedly connected to the placement plate 22. The bottom end of the upper cover 21 is fixedly connected to the upper side of the slot 39. The outer end of the insert plate 38 has a limit slot 37. When clamping, the insert plate 38 will first contact the inclined surface on the limit post 24, causing the limit post 24 and the side plate 25 to move outward, while stretching the first tension spring 23. When the insert plate 38 is fully inserted into the slot 39, the elastic action of the first tension spring 23 can insert the limit post 24 into the limit slot 37, completing the clamping and fixing.

[0020] like Figure 2 、 Figure 5 、 Figure 9As shown, the clamping and protection mechanism also includes a U-shaped clamping plate B41 and a U-shaped frame plate A18 symmetrically fixedly connected to the fixed clamping plate 15 and the movable clamping plate 16 near one end of the placement plate 22. The two sets of U-shaped clamping plates B41 and U-shaped frame plate A18 are used to limit the insulation layer of the wire 17 so that the metal wire of the wire 17 falls above the pins of the chip body 28. The bottom ends of the fixed clamping plate 15 and the placement plate 22 are respectively fixedly connected to the L-shaped plate B12 and L-shaped plate A7, and the L-shaped plate B12 and L-shaped plate A7 are both fixedly connected to the fixed base 10. The U-shaped clamping plate B41 and U-shaped frame plate A18 can clamp and position the wire 17, and the fixed clamping plate 15 and the placement plate 22 are supported and fixed by the L-shaped plate B12 and L-shaped plate A7, so that they are fixedly mounted on the fixed base 10.

[0021] like Figure 1 、 Figure 2 As shown, the cooling mechanism includes a support column A11 and a support column B19 fixed through the fixed seat 10, the support column A11 and the support column B19 are in contact with the bottom end of the pin of the chip body 28, the support column A11 and the support column B19 bottom end are respectively provided with an output flow channel 44 and an input flow channel 42, the support column A11 and the support column B19 are connected by a pipe, the bottom of the inner wall of the output flow channel 44 is fixedly connected with a conical tube 43, the other side of the top of the base plate 1 is fixedly connected to a cooling box 9, the side of the top of the base plate 1 corresponding to the cooling box 9 is fixedly connected to a water pump 8, the water pump 8 is connected to the cooling box 9 and the support column B19 through a pipe, and the support column A11 and the cooling box 9 are connected by a pipe. Start the water pump 8 to let the cooling water in the cooling box 9 flow into the inlet channel 42 in the support column B19 through the pipe. Since the support column A11 and the support column B19 are connected by a pipe, the cooling water can flow into the outlet channel 44. The smaller diameter end of the tapered tube 43 faces upward, so the flow rate of the cooling water can be reduced, so that the cooling water fills the top of the inlet channel 42 and the outlet channel 44, completing the cooling operation. Thereafter, the cooling water flows back into the cooling box 9 through the pipe for cooling treatment, so that it can be recycled and resources saved.

[0022] like Figure 2 、 Figure 3 、 Figure 11As shown, the absorption and purification mechanism includes a connecting plate 14 fixedly connected to the top of the fixed connecting plate 20. The other ends of the two connecting plates 14 are fixedly connected to the fixed cover 13. It also includes a purification box 26 fixedly connected to the top of the cooling box 9. The purification box 26 and the fixed cover 13 are connected by a hose. The top of the purification box 26 is provided with a box cover 46. The bottom end of the box cover 46 is fixedly connected to a plurality of activated carbon plates 45. The top of the cooling box 9 corresponding to the purification box 26 is fixedly connected to an exhaust fan 27. The exhaust fan 27 and the purification box 26 are connected by a hose. During spot welding, irritating gas is generated. At this time, the exhaust fan 27 is activated to generate suction in the fixed cover 13 through the hose, thereby absorbing the irritating gas into the purification box 26. The multiple activated carbon plates 45 in the purification box 26 can filter and absorb harmful substances in the irritating gas, thereby discharging clean gas. Because the box cover 46 and the purification box 26 are in a detachable connection, the activated carbon plates 45 can be replaced, thereby maintaining a high efficiency of filtering and purification.

[0023] Working principle: First, place the chip body 28 on the lifting plate 35, and press the chip body 28 so that the lifting plate 35 is stuck in the placement groove 36. At this time, the chip body 28 is stuck inside the placement plate 22, and the second tension spring 29 is in a stretched state. Then, place the wire 17 in the arc groove 40. The insulation layer of the wire 17 can be limited by the U-shaped clamping plate B41, so that the metal wire of the wire 17 is placed above the pins of the chip body 28, and the pins of the chip body 28 are placed on the top of the support column A11 and the support column B19. Then, press the upper cover plate 21 downward and cover the top of the chip body 28. At the same time, the plug-in board 38 is inserted into the slot 39. The inclined surface of the limiting post 24 is squeezed to move it outward. When the inserting plate 38 is fully inserted into the slot 39, the limiting post 24 can be inserted into the limiting groove 37 through the elastic reset effect of the first tension spring 23 and the cooperation of the side plate 25, completing the limitation of the inserting plate 38 and the upper cover 21. Due to the existence of the fixed connecting plate 20, the movable clamping plate 16 is moved downward synchronously, so that the movable clamping plate 16 covers the top of the fixed clamping plate 15, completing the clamping and fixing of the wire 17. Therefore, during spot welding, the worker does not need to hold the chip body 28 and the wire 17, and the spot welding operation can be completed, thereby avoiding the situation where the worker's fingers are burned or crushed, and improving the safety of spot welding. After clamping and fixing, start the water pump 8 to transport the cooling water in the cooling box 9 into the input channel 42 in the support column B19 through the pipeline. Since the support column B19 and the support column A11 are connected by a pipeline, the cooling water flows into the output channel 44 through the pipeline, and the tapered tube 43 provided can slow down the flow rate of the cooling water so that the cooling water fills the top of the input channel 42 and the output channel 44, so that the cooling operation can be better performed, the cooling speed of the solder joints can be accelerated, the strength and stability of the solder joints can be improved, and the adaptability and practicality can be improved. At this time, start the electric push rod 3 to push the movable seat 5 and the spot welding head 6 downward, and make the spot welding head 6 contact the pins of the chip body 28 and the metal wires of the wires 17 to perform spot welding. During spot welding, start the exhaust fan 27 to generate suction in the fixed cover 13 through the hose, so that the irritating gas generated by spot welding can be absorbed into the purification box 26, and the activated carbon plate 45 in the purification box 26 absorbs the harmful substances in the irritating gas, thereby avoiding the impact on the surrounding environment and ensuring the health of the staff. After the spot welding is completed, the side plate 25 is pulled outward. Since the side plate 25 and the limiting column 24 are fixed together, the limiting column 24 can be moved outward and out of the range of the limiting groove 37, thereby releasing the limit on the insert plate 38. At this time, the circular plate A31 and the guide column 33 are moved upward by the elastic reset of the third tension spring 30, and the upper cover plate 21 is moved upward at the same time. Similarly, the circular plate B32 and the lifting column 34 are moved upward by the elastic reset of the second tension spring 29, so that the chip body 28 can be quickly separated and removed quickly.

[0024] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A spot welding mechanism for processing integrated circuit chips, comprising a base plate (1), a column (2) fixedly connected to one side of the top of the base plate (1), and a fixing column (4) and a fixing seat (10) fixedly connected to the upper and lower sides of one end of the column (2), characterized in that: The fixing seat (10) is respectively provided with a clamping protection mechanism, a cooling mechanism and an absorption and purification mechanism; The clamping protection mechanism includes a placement plate (22), the inner wall of the placement plate (22) is used to place the chip body (28), and guide columns (33) are slidably passed through the diagonal sides of the top of the placement plate (22), and the tops of the two guide columns (33) are fixedly connected to the upper cover plate (21), and the bottom end of the upper cover plate (21) is provided with a groove that is adapted to the shape of the chip body (28), and the upper cover plate (21) and the placement plate (22) are combined together to position and clamp the chip body (28); The clamping protection mechanism also includes a fixed clamping plate (15) and a movable clamping plate (16), wherein arc grooves (40) are symmetrically provided between the fixed clamping plate (15) and the movable clamping plate (16), and the arc grooves (40) between the fixed clamping plate (15) and the movable clamping plate (16) form a circular shape and clamp and fix the wire (17), and both ends of the movable clamping plate (16) are fixedly connected to fixed connecting plates (20), and the two fixed connecting plates (20) are fixedly connected to the upper cover plate (21).

2. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The clamping protection mechanism also includes a circular plate A (31) fixedly connected to the bottom end of the guide column (33), a third tension spring (30) fixedly connected between the two circular plates A (31) and the placement plate (22), a placement groove (36) symmetrically connected to the bottom of the inner wall of the placement plate (22), a lifting column (34) slidingly passed through the two placement grooves (36), a lifting plate (35) fixedly connected to the top of the two lifting columns (34), a circular plate B (32) fixedly connected to the bottom end of the two lifting columns (34), and a second tension spring (29) fixedly connected between the two circular plates B (32) and the placement plate (22).

3. The spot welding mechanism for processing integrated circuit chips according to claim 2, characterized in that: The clamping protection mechanism also includes a slot (39) provided on one side of the top end of the placement plate (22), the slot (39) slidingly passes through a limiting column (24), the limiting column (24) is fixedly connected to a side plate (25) at one end away from the placement plate (22), the side plate (25) is fixedly connected to both sides of the limiting column (24) at one end close to the placement plate (22), and the two first tension springs (23) are fixedly connected to the placement plate (22), and the bottom end of the upper cover plate (21) is fixedly connected to an insert plate (38) above the slot (39), and a limiting slot (37) is provided at one end outside the insert plate (38).

4. A spot welding mechanism for processing integrated circuit chips according to claim 3, characterized in that: The clamping protection mechanism also includes a U-shaped clamping plate B (41) and a U-shaped frame plate A (18) symmetrically fixedly connected to the fixed clamping plate (15) and the movable clamping plate (16) near one end of the placement plate (22), and the two sets of the U-shaped clamping plate B (41) and the U-shaped frame plate A (18) are used to limit the insulation layer of the wire (17) so that the metal wire of the wire (17) falls above the pin of the chip body (28), and the bottom ends of the fixed clamping plate (15) and the placement plate (22) are fixedly connected to the L-shaped plate B (12) and the L-shaped plate A (7), respectively, and the L-shaped plate B (12) and the L-shaped plate A (7) are both fixedly connected to the fixing seat (10).

5. The spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The cooling mechanism includes a support column A (11) and a support column B (19) fixedly passing through the fixing seat (10), wherein the support column A (11) and the support column B (19) are in contact with the bottom ends of the pins of the chip body (28), and the bottom ends of the support column A (11) and the support column B (19) are respectively provided with an output flow channel (44) and an input flow channel (42), and the support column A (11) and the support column B (19) are connected by a pipeline, and a conical tube (43) is fixedly connected to the bottom of the inner wall of the output flow channel (44).

6. The spot welding mechanism for processing integrated circuit chips according to claim 5, characterized in that: A cooling box (9) is fixedly connected to the other side of the top of the base plate (1), and a water pump (8) is fixedly connected to the side of the top of the base plate (1) corresponding to the cooling box (9). The water pump (8) is connected to the cooling box (9) and the support column B (19) through a pipeline, and the support column A (11) and the cooling box (9) are connected through a pipeline.

7. A spot welding mechanism for processing integrated circuit chips according to claim 6, characterized in that: The absorption purification mechanism includes a connecting plate (14) fixedly connected to the top of the fixed connecting plate (20), the other ends of the two connecting plates (14) are fixedly connected to a fixed cover (13), and also includes a purification box (26) fixedly connected to the top of the cooling box (9), the purification box (26) and the fixed cover (13) are connected by a hose, a box cover (46) is provided at the top of the purification box (26), and a plurality of activated carbon plates (45) are fixedly connected to the bottom end of the box cover (46), and an exhaust fan (27) is fixedly connected to the side of the top of the cooling box (9) corresponding to the purification box (26), and the exhaust fan (27) and the purification box (26) are connected by a hose.

8. The spot welding mechanism for integrated circuit chip processing according to claim 1, characterized in that: The top end of the fixed column (4) is fixedly connected to an electric push rod (3), the telescopic end of the electric push rod (3) is fixedly connected to a movable seat (5), and two spot welding heads (6) are fixedly penetrated on the movable seat (5).

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