Wafer spin-drying device and single-wafer brushing machine

Abstract

The invention discloses a wafer spin-drying device, and belongs to the field of semiconductor wafer cleaning. According to the device, a rotary driving piece does not need to be adopted to drive the throwing disc to achieve clamping and loosening of the wafer through rotation of the multiple clamping pieces, and the undesirable phenomenon that clamping and loosening of the wafer are unstable due to the fact that fatigue precision becomes poor after the rotary driving piece (such as a servo motor) is used for multiple times for a long time is avoided. When the wafer is taken out, the fatigue precision of the rotary driving piece becomes poor, so that the wafer is not completely loosened by the plurality of clamping pieces, and the wafer is easily broken when the wafer is taken out. According to the wafer clamping device, the driving telescopic part, the rotating connecting part, the lifting part and the limiting rod are arranged to be matched to form a connecting rod mechanism to drive the first driving part, rotating control over the clamping part is achieved through cooperation of the two driving parts, the connecting rod mechanism only needs to complete wafer clamping operation, long-time stable operation can be guaranteed, and the working efficiency is improved. And a certain protection effect is indirectly achieved on the rotary driving piece.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafer cleaning, and in particular to a wafer drying device and a single-wafer brushing machine. Background Art

[0002] Wafers refer to the basic raw materials used to make semiconductor devices, such as wafers obtained from materials such as silicon, sapphire, silicon carbide, gallium nitride, gallium oxide, lithium tantalate, and lithium niobate, which are used in photovoltaic devices, LED light-emitting elements, power devices and other fields.

[0003] During the production process, or after a period of use, silicon carbide wafers often need to be scrubbed on both sides. After scrubbing, the wafers are taken out and spun or dried.

[0004] However, the current spin-drying device is very likely to have poor wafer clamping after long-term use. Summary of the Invention

[0005] The present invention provides a wafer drying device and a single-wafer brushing machine. This device can solve the problem of servo motor fatigue and poor wafer clamping in the prior art. The technical solution is as follows:

[0006] In one aspect, a wafer drying device is provided, comprising:

[0007] The drying component includes a spinner and a rotating drive member connected to the spinner, the rotating drive member is used to drive the spinner to rotate;

[0008] The cam is connected to the control stand by an adjusting device and the control stand is connected with the control stand by an adjusting device, the control stand being connected with the control stand by an adjusting screw thread and the adjusting screw thread, and the control stand is connected with the control stand by an adjusting screw thread, and the control stand is connected with the control stand by an adjusting screw thread.

[0009] Among them, after the lifting component drives the limit sleeve to rise and cooperate with the limit rod, the rotating connecting part drives the lifting component to rotate and at the same time drives the first driving component to rotate relative to the swing plate during the rotation, so as to drive multiple clamping components to rotate through the cooperation of the first driving component and the second driving component to form a clamping space; after the lifting component descends to the limit sleeve and separates from the limit rod, the elastic component drives the first driving component to reverse, so as to drive multiple clamping components to rotate and clamp the wafer through the cooperation of the first driving component and the second driving component.

[0010] Optionally, the rotating connecting member includes: a sleeve portion and two swing arms, the sleeve portion has a through hole for being sleeved on a part in the rotating driving member, the two swing arms are distributed on both sides of the sleeve portion, one end of the two swing arms is respectively fixedly connected to the sleeve portion, and the other end is respectively connected to the bottom of the lifting member and the telescopic rod of the driving telescopic member.

[0011] Optionally, the bottom of the spin tray has a limiting hole, and the wafer spin-drying device further comprises: a lifting limiting member, the lifting limiting member having a rotating limiting rod matched with the limiting hole;

[0012] When the first driving member rotates, the lifting limit member drives the rotation limit rod to rise into the limit hole; after the multiple clamping members clamp the wafer, the lifting limit member drives the rotation limit rod to descend and separate from the limit hole.

[0013] Optionally, the rotary drive member includes: a rotating shaft, a synchronous transmission member and a servo motor, one end of the rotating shaft is fastened to the bottom of the spinneret, and the synchronous transmission member is respectively connected to the other end of the rotating shaft and the rotating shaft of the servo motor.

[0014] Optionally, the wafer drying device further comprises: a photoelectric sensor, an origin induction plate and a PLC controller, wherein the origin induction plate is mounted on the synchronous transmission member and cooperates with the photoelectric sensor, and the photoelectric sensor and the servo motor are both electrically connected to the PLC controller;

[0015] The photoelectric sensor and the origin sensor are used to calibrate the rotation of the spinning disc to the target position.

[0016] Optionally, the wafer drying device also includes: a protective shell and a sealing cover, the side of the protective shell has a wafer entry and exit window, and the bottom has a mounting hole, the sealing cover is located at the bottom of the spin tray and is fixed at the mounting hole, the sealing cover has an arc-shaped slide groove, and the limit rod is exposed from the arc-shaped slide groove; the spin tray and multiple clamps are all installed in the protective shell.

[0017] Optionally, the wafer drying device further includes: an infrared heater and a camera installed on the inner wall of the protective shell, wherein the camera is used to obtain image signals of the wafers clamped by the multiple clamping members.

[0018] Optionally, the wafer drying device further comprises: an air supply fan installed on the top of the outer side of the protective shell, and an air exhaust fan installed on the side of the outer side of the protective shell;

[0019] The air supply fan can blow clean gas with a preset pressure into the protective shell, and the exhaust fan can extract the gas in the protective shell.

[0020] Optionally, each of the clamping members includes a main body and a clamping portion, the main body is inserted into the spinner, and the clamping portion is arranged on the top of the main body and eccentrically arranged with respect to the main body.

[0021] On the other hand, a single-wafer brushing machine is provided, which includes: a wafer picking robot and a wafer spinning device, wherein the wafer picking robot is used to place the wafer into the clamping space formed by multiple clamping members in the wafer spinning device, or to take the wafer out of the clamping space formed by the multiple clamping members.

[0022] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0023] There is no need to use a rotary drive member to drive a fling plate to realize the rotation of multiple clamping members to clamp and release the wafer, which avoids the fatigue precision variation of the rotary drive member (for example, a servo motor) after long-term and repeated use, resulting in unstable undesirable phenomena in the clamping and releasing of the wafer. For example, if the rotary drive member drives the fling plate to realize the rotation of multiple clamping members to release the wafer, the rotary drive member will experience fatigue precision variation, resulting in multiple clamping members not being completely released to the wafer, which can easily cause the wafer to break when the wafer is taken out. In the present application, a driving telescopic member, a rotating connecting member, a lifting member and a limiting rod are provided to cooperate to form a connecting rod mechanism to realize the drive of the first driving member, and the rotation control of the clamping member is realized by the cooperation of the first driving member and the second driving member. The above-mentioned connecting rod mechanism only needs to complete the clamping operation of the wafer, which can ensure stable operation for a long time and indirectly play a certain protective role for the rotary drive member. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 This is a schematic structural diagram of a wafer drying device provided in an embodiment of the present application;

[0026] Figure 2 yes Figure 1 A schematic diagram of a portion of the structure of a wafer drying device is shown;

[0027] Figure 3 yes Figure 1 An axonometric view of a wafer drying device is shown;

[0028] Figure 4 This is a schematic structural diagram of another wafer drying device provided in an embodiment of the present application;

[0029] Figure 5 This is an axonometric diagram of another wafer drying device provided in an embodiment of the present application;

[0030] Figure 6 is a cross-sectional view of a wafer drying device provided in an embodiment of the present application;

[0031] Figure 7 This is a structural diagram of another wafer drying device provided in an embodiment of the present application;

[0032] Figure 8 This is a structural schematic diagram of another wafer drying device provided in an embodiment of the present application.

[0033] Among them, the drying component 100, the clamping component 200, the spin plate 101, the rotating driving component 102, the first driving component 201, the elastic component 202, the lifting component 203, the rotating connecting component 204, the driving telescopic component 205, multiple clamping components 206, the second driving component 206a, the limiting rod 201a, the avoidance chute C, the limiting sleeve 203a, the wafer Y, the telescopic rod 205a, the machine 300, the sleeve portion 204a, the swing arm 204b, the limiting hole 101a, the lifting component Limiting member 400, rotation limiting rod 401, rotating shaft 102a, synchronous transmission member 102b, servo motor 102c, first synchronous wheel A1, second synchronous wheel A2, synchronous belt A3, photoelectric sensor 500, origin sensing plate 600, protective shell 700, sealing cover 800, wafer entry and exit window 701, mounting through hole 702, window sealing plate 900, driving component 1000, infrared heater 1100, camera 1200, air supply fan 1300.

[0034] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0035] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0037] It should be understood that references throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present invention. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout this specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0038] Please refer to Figure 1 、 Figure 2 and Figure 3 , Figure 1 This is a schematic structural diagram of a wafer drying device provided in an embodiment of the present application. Figure 2 yes Figure 1 The schematic diagram of part of the structure of the wafer drying device is shown. Figure 3 yes Figure 1 The wafer drying device may include a drying component 100 and a clamping component 200 .

[0039] The drying component 100 in the wafer drying device may include: a spinner 101 and a rotating driving member 102 connected to the spinner 101 , and the rotating driving member 102 may be used to drive the spinner 101 to rotate.

[0040] The clamping member 200 in the wafer drying device can comprise: a first driver 201, an elastic member 202, a lifting member 203, a rotating connector 204, a drive telescopic member 205 and a plurality of clamping members 206. These plurality of clamping members 206 are movably inserted in the top of the spinning tray 101 and are distributed around the central axis of the spinning tray 101. Each clamping member 206 can rotate relative to the spinning tray 101, and the side of each clamping member 206 can have a second driver 206a. The first driver 201 is installed in the top of the spinning tray 101 and can be distributed between a plurality of clamping members 206 to cooperate with a plurality of second drivers 206a transmissions, and the first driver 201 can rotate relative to the spinning tray 101, and the bottom edge of the first driver 201 can have a limiting rod 201a. The elastic member 202 is distributed at the edge position of the first driver 201, and the two ends of this elastic member 202 can be fastened to the spinning tray 101 and the first driver 201 respectively. The lifting member 203 can be located at the bottom of the spinning tray 101 and can have a limiting sleeve 203a that cooperates with the limiting rod 201a. The rotating connector 204 is sleeved on the portion of the rotary drive member 102 and one end can be tightly connected to the bottom of the lifting member 203. The telescopic rod 205a of the driving telescopic member 205 can be hinged to the other end of the rotating connector 204 to drive the rotating connector 204 to rotate about the central axis of the spinning tray 101. Here, the spinning tray 101 can have an avoidance chute C that cooperates with the limiting rod 201a, and the limiting rod 201a can be exposed from the avoidance chute C.

[0041] After the lifting member 203 drives the limiting sleeve 203a upward to engage with the limiting rod 201a, the rotating connector 204 rotates, driving the lifting member 203 to rotate while also driving the first drive member 201 to rotate relative to the spinner 101. The first drive member 201 and the second drive member 206a cooperate to drive the multiple clamping members 206 to rotate and form a clamping space. After the lifting member 203 descends until the limiting sleeve 203a separates from the limiting rod 201a, the elastic member 202 drives the first drive member 201 to reverse, and the first drive member 201 and the second drive member 206a cooperate to drive the multiple clamping members 206 to rotate and clamp the wafer Y.

[0042] For example, when the wafer drying device is used to dry the wafers, all components in the wafer drying device are in the initial target position. First, the lifting component 203 drives the limiting sleeve 203a to rise and cooperate with the limiting rod 201a, and then drives the telescopic rod 205a of the telescopic component 205 to extend and drive the rotating connecting member 204 to rotate; then, the rotating connecting member 204 drives the lifting component 203 to rotate during the rotation process to drive the first driving member 201 to rotate. During the rotation of the first driving member 201, the second driving member 206a drives the clamping member 206 to rotate to form a clamping space. During the rotation of the moving member 201, the elastic member 202 is stretched and elastically deformed. Subsequently, the wafer is placed in the clamping space formed by the multiple clamping members 206, and the lifting member 203 descends until the limiting sleeve 203a separates from the limiting rod 201a. The rebound force of the elastic member 202 then drives the first driving member 201 to reverse. During this reversal, the second driving member 206a drives the multiple clamping members 206 to reverse and clamp the wafer. Finally, the rotating driving member 102 drives the spinner 101 to rotate, thereby synchronously rotating the multiple clamping members 206 and wafer Y. The elastic member 202 can be a metal coil spring or a rubber strip, for example.

[0043] After the wafer drying device completes the wafer drying operation, the lifting component 203 drives the limiting sleeve 203a to rise and engage with the limiting rod 201a, thereby driving the telescopic rod 205a of the telescopic member 205 to extend and rotate the rotating connecting member 204. Subsequently, during the rotation process, the rotating connecting member 204 drives the lifting component 203 to rotate, thereby driving the first driving member 201 to rotate. During the rotation of the first driving member 201, the second driving member 206a drives the clamping member 206 to rotate and release the wafer. In this way, it is no longer necessary to use the rotating driving member 102 to drive the spinning tray 101 to achieve the rotation of multiple clamping members 206 to clamp and release the wafer. This avoids the fatigue and poor precision of the rotating driving member 102 (e.g., servo motor) after long-term and repeated use, which leads to unstable clamping and release of the wafer. For example, if the rotary drive member 102 drives the spinning disc 101 to rotate and release the multiple clamping members 206, if the rotary drive member 102 becomes fatigued and the precision deteriorates, the multiple clamping members 206 may not completely release the wafer, which may easily cause the wafer to break when the wafer is removed. In the present application, a driving telescopic member 205, a rotating connecting member 204, a lifting member 203, and a limiting rod 201a are provided to cooperate to form a connecting rod mechanism to drive the first driving member 201. The rotation control of the clamping member 206 is achieved through the cooperation of the first driving member 201 and the second driving member 206a. The above-mentioned connecting rod mechanism only needs to complete the wafer clamping operation, which can ensure long-term stable operation and indirectly play a certain protective role for the rotary drive member 102.

[0044] In summary, the embodiment of the present application provides a wafer drying device, which may include: a drying component and a clamping component. There is no need to use a rotating drive member to drive a spinning disc to realize the rotation of multiple clamping members to clamp and release the wafer, which avoids the fatigue precision degradation of the rotating drive member (for example, a servo motor) after long-term and repeated use, resulting in unstable and undesirable phenomena in the clamping and releasing of the wafer. For example, if the rotating drive member drives the spinning disc to realize the rotation of multiple clamping members to release the wafer, the fatigue precision of the rotating drive member deteriorates, resulting in multiple clamping members not being completely released from the wafer, which is very likely to cause the wafer to break when the wafer is taken out. In the present application, a driving telescopic member, a rotating connecting member, a lifting member and a limit rod are provided to cooperate to form a connecting rod mechanism to realize the drive of the first driving member, and the rotation control of the clamping member is realized by the cooperation of the first driving member and the second driving member. The above-mentioned connecting rod mechanism only needs to complete the clamping operation of the wafer, which can ensure long-term stable operation and indirectly play a certain protective role for the rotating drive member.

[0045] For example, Figure 1 As shown, the wafer drying apparatus may further include a platform 300. The rotary drive member 102, the rotating connector 204, and the telescopic drive member 205 may all be mounted on the platform 300, with the platform 300 supporting these components. For example, the telescopic drive member 205 may be mounted on the platform, one end of the telescopic rod 205a may be hinged to the rotating connector 204, and the bottom end of the telescopic drive member 205 may be hinged to the platform 300. The rotating connector 204 is mounted on the platform 300 and is rotatably connected to the platform 300.

[0046] Optional, please refer to Figure 4 , Figure 4 : This is a schematic structural diagram of another wafer drying device provided by an embodiment of the present application. The rotating connecting member 204 in the clamping member 200 may include: a sleeve portion 204a and two swing arms 204b, the sleeve portion 204a having a through hole for being sleeved on a portion in the rotating driving member 102, the two swing arms 204b being distributed on both sides of the sleeve portion 204a, and one end of the two swing arms 204b being fixedly connected to the sleeve portion 204a, and the other ends of the two swing arms 204b can be respectively connected to the bottom of the lifting member 203 and the telescopic rod 205a of the driving telescopic member 205. In this way, by providing the sleeve portion 204a in the rotating connecting member 204 and the two swing arms 204b fixed on both sides of the sleeve portion 204a, when the driving telescopic member 205 drives the sleeve portion 204a to rotate through one swing arm 204b, the lifting member 203 can be driven to swing through the other swing arm 204b, so that the structure of the wafer drying device is compact and conducive to miniaturization design. For example, the driving telescopic member 205 may be a driving cylinder, an electric motor or the like, and the driving telescopic member 205 is provided with a reed switch for detecting the extension stroke of the telescopic rod 205 a of the driving telescopic member 205 .

[0047] In the examples of this application, please refer to Figure 4 and Figure 5 , Figure 5 This is an axonometric diagram of another wafer drying device provided in an embodiment of the present application. The bottom of the spin tray 101 may have a limiting hole 101a, and the wafer drying device may further include: a lifting limiting member 400, which may have a rotating limiting rod 401 that cooperates with the limiting hole 101a. Specifically, when the first driving member 201 rotates, the lifting limiting member 400 drives the end of the rotating limiting rod 401 to rise into the limiting hole 101a; after the multiple clamping members 206 clamp the wafer, the lifting limiting member 400 can drive the rotating limiting rod 401 to descend and separate from the limiting hole 101a at the bottom of the spin tray 101. In this way, by setting a lifting limit member 400 in the wafer spinning device, after the rotation limit rod 401 in the lifting limit member 400 cooperates with the limit hole 101a at the bottom of the spin plate 101, the position of the spin plate 101 can be ensured to remain unchanged during the rotation of the first driving member 201, thereby ensuring the positions of multiple clamping members 206, so that the reliability of placing the wafer into the clamping space and taking it out from the clamping space is better.

[0048] Optional, please refer to Figure 5 and Figure 6 , Figure 6 It is a cross-sectional view of a wafer drying device provided in an embodiment of the present application. The rotating drive member 102 in the drying component 100 may include: a rotating shaft 102a, a synchronous transmission member 102b and a servo motor 102c. One end of the rotating shaft 102a can be fastened to the bottom of the spin tray 101, and the synchronous transmission member 102b can be connected to the other end of the rotating shaft 102a and the rotating shaft of the servo motor 102c respectively. For example, the synchronous transmission member 102b may include: a first synchronous wheel A1, a second synchronous wheel A2 and a synchronous belt A3. The first synchronous wheel A1 can be synchronously connected to the rotating shaft of the servo motor 102c, the second synchronous wheel A2 can be synchronously connected to the end of the rotating shaft 102a, and the synchronous belt A3 can be wound around the first synchronous wheel A1 and the second synchronous wheel A2.

[0049] In this application, if Figure 5 and Figure 6As shown, the wafer drying device may further include: a photoelectric sensor 500, an origin sensor 600, and a PLC controller (not shown). The origin sensor 600 may be mounted on the synchronous transmission member 102b and cooperate with the photoelectric sensor 500. The photoelectric sensor 500 and the servo motor 102c may both be electrically connected to the PLC controller. The photoelectric sensor 500 and the origin sensor 600 may be used to calibrate the rotation of the spinning tray 101 to the target position. This ensures that the initial position limit rod 201a and the limit sleeve 203a of the lifting component 203 are aligned before operation. After operation, the limit sleeve 203a of the lifting component 203 is directly below the limit rod 201a each time a wafer is removed. After initial startup, the servo motor 102c returns to its origin via the photoelectric sensor 500 and the origin sensor 600, ensuring accurate travel each time. The origin sensor 600 may be mounted on either the second synchronous wheel A2 or the first synchronous wheel A1.

[0050] Optional, please refer to Figure 5 、 Figure 6 、 Figure 7 and Figure 8 , Figure 7 This is a structural diagram of another wafer drying device provided in an embodiment of the present application. Figure 8 It is a structural schematic diagram of another wafer drying device provided in an embodiment of the present application. The wafer drying device may further include: a protective shell 700 and a sealing cover 800. The side of the protective shell 700 may have a wafer entry and exit window 701, and the bottom may have a mounting hole 702. The sealing cover 800 may be located at the bottom of the spin tray 101 and may be fixed at the mounting hole 702. The sealing cover 800 may have an arc-shaped slide 801, and the limit rod 201a may be exposed from the arc-shaped slide 801. The spin tray 101 and the plurality of clamping members 206 may be installed in the protective shell 700. In this case, part of the rotating shaft 102a in the rotating drive member 102 is located in the protective shell 700 and connected to the spin tray 101, and part of it extends out of the protective shell 700 through the mounting hole 702, and the sealing cover 800 is provided at the mounting hole 702. In this way, the sealing performance of the protective housing 700 can be guaranteed as much as possible, so that the cleanliness level of the housing cavity can reach a Class 10 environment, improving the wafer cleaning yield by more than 3%, while also ensuring the cleanliness of the wafers after drying in the protective housing 700. Here, the sealing cover 800 can be mounted on the rotating shaft 102a, and the rotating shaft 102a can rotate relative to the sealing cover 800.

[0051] It should be noted that, in order to further ensure the sealing of the protective housing 700 and thus ensure the cleanliness of the wafers, the wafer drying apparatus may further include: a window sealing plate 900 and a driving component 1000, which may be connected to the window sealing plate 900. The driving component 1000 may be configured to: drive the window sealing plate 900 to move to the wafer access window 701 or drive the window sealing plate 900 to move out from the wafer access window 701.

[0052] In the present application, the wafer drying device may also include: an infrared heater 1100 and a camera 1200 installed on the inner wall of the protective shell 700, and the camera 1200 can obtain image signals of the wafers clamped by the multiple clamps 206. In this way, the infrared heater 1100 can assist in drying the wafers in the protective shell 700, speed up the drying rate of the wafers, and effectively reduce the tiny defects on the surface of the wafers by more than 30%. In addition, through the camera 1200 in the protective shell 700, the operator can observe the condition of the wafers in the protective shell 700 through the wafer image signals transmitted in real time by the camera 1200, thereby ensuring the safety performance of the wafers during the drying process.

[0053] In an embodiment of the present application, the wafer drying device may further include: an air supply fan 1300 installed on the top of the outer side of the protective shell 700, and an exhaust fan (not shown in the figure) installed on the side of the outer side of the protective shell 700. Among them, the air supply fan 1300 can blow clean gas with a preset pressure into the protective shell 700, and the exhaust fan can extract the gas in the protective shell 700. In this way, by arranging the air supply fan 1300 at the top of the protective shell 700, the air supply fan 1300 can deliver gas of a certain pressure into the protective shell 700, so that the dust particles in the protective shell 700 are dispersed in the bottom area of ​​the protective shell 700. The exhaust fan can remove the dust particles in the protective shell 700, thereby ensuring the cleanliness of the protective shell 700, and then ensuring the cleanliness of the wafer. In addition, the material of the protective shell is also selected to be antistatic material to reduce the adsorption of dust particles on the shell, thereby avoiding the accumulation of dust particles in the chamber.

[0054] For example, Figure 4 As shown, each clamping member 206 may include a main body 2061 and a clamping portion 2062. The main body 2061 may be inserted into the upper side of the spinner 101 and may be provided with a second driving member 206a. The clamping portion 2062 is provided on the top of the main body 2061 and may be eccentric to the main body 2061. In this way, during the rotation of the main body 2061, the clamping portion 2062 may be driven to deflect to release the wafer or clamp the wafer.

[0055] An embodiment of the present application also provides a single-wafer brushing machine, which may include: a wafer picking robot and a wafer drying device, the wafer picking robot is used to place the wafer into the clamping space formed by multiple clamping members in the wafer drying device, or to take the wafer out of the clamping space formed by multiple clamping members.

[0056] For example, the single-wafer brushing machine may also include: a double-sided brushing machine (not shown in the figure), which can be used to brush both sides of the wafer. The wafer after brushing can be placed in a wafer drying device by a wafer-taking robot for drying.

[0057] The embodiments of the wafer spin-drying device and the embodiments of the method for using the wafer spin-drying device provided in the embodiments of the present invention can be referenced to each other, and the embodiments of the present invention will not be described in detail here.

[0058] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0059] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A wafer drying device, characterized in that: include: The drying component includes a spinner and a rotating drive member connected to the spinner, the rotating drive member is used to drive the spinner to rotate; The lifting mechanism is a lifting mechanism, and the lifting mechanism is a lifting mechanism, and the lifting mechanism is a lifting mechanism, and the lifting mechanism is a lifting mechanism, and the lifting mechanism is a lifting mechanism. Among them, after the lifting component drives the limit sleeve to rise and cooperate with the limit rod, the rotating connecting part drives the lifting component to rotate and at the same time drives the first driving component to rotate relative to the swing plate during the rotation, so as to drive multiple clamping components to rotate through the cooperation of the first driving component and the second driving component to form a clamping space; after the lifting component descends to the limit sleeve and separates from the limit rod, the elastic component drives the first driving component to reverse, so as to drive multiple clamping components to rotate and clamp the wafer through the cooperation of the first driving component and the second driving component.

2. The wafer drying device according to claim 1, characterized in that: The rotating connecting member includes: a sleeve portion and two swing arms, the sleeve portion has a through hole for being sleeved on a part in the rotating driving member, the two swing arms are distributed on both sides of the sleeve portion, and one end of the two swing arms is respectively fixedly connected to the sleeve portion, and the other end is respectively connected to the bottom of the lifting component and the telescopic rod of the driving telescopic component.

3. The wafer drying device according to claim 1, characterized in that: The bottom of the spin tray is provided with a limiting hole, and the wafer drying device further comprises: a lifting limiting member, wherein the lifting limiting member has a rotating limiting rod matched with the limiting hole; When the first driving member rotates, the lifting limit member drives the rotation limit rod to rise into the limit hole; after the multiple clamping members clamp the wafer, the lifting limit member drives the rotation limit rod to descend and separate from the limit hole.

4. The wafer drying device according to any one of claims 1 to 3, characterized in that: The rotary drive member includes a rotating shaft, a synchronous transmission member and a servo motor. One end of the rotating shaft is tightly connected to the bottom of the spinning disc, and the synchronous transmission member is respectively connected to the other end of the rotating shaft and the rotating shaft of the servo motor.

5. The wafer drying device according to claim 4, characterized in that: The wafer drying device further includes: a photoelectric sensor, an origin sensor sheet and a PLC controller, wherein the origin sensor sheet is mounted on the synchronous transmission member and cooperates with the photoelectric sensor, and the photoelectric sensor and the servo motor are both electrically connected to the PLC controller; The photoelectric sensor and the origin sensor are used to calibrate the rotation of the spinning disc to the target position.

6. The wafer drying device according to claim 4, characterized in that: The wafer drying device also includes: a protective shell and a sealing cover. The side of the protective shell has a wafer entry and exit window, and the bottom has a mounting hole. The sealing cover is located at the bottom of the spinner and is fixed at the mounting hole. The sealing cover has an arc-shaped slide groove, and the limit rod is exposed from the arc-shaped slide groove. The spinner and multiple clamps are all installed in the protective shell.

7. The wafer drying device according to claim 6, characterized in that: The wafer drying device further includes: an infrared heater and a camera installed on the inner side wall of the protective shell, and the camera is used to obtain image signals of the wafers clamped by the multiple clamping members.

8. The wafer drying device according to claim 6, characterized in that: The wafer drying device further includes: an air supply fan installed on the top of the outer side of the protective shell, and an air exhaust fan installed on the side of the outer side of the protective shell; The air supply fan can blow clean gas with a preset pressure into the protective shell, and the exhaust fan can extract the gas in the protective shell.

9. The wafer drying device according to any one of claims 1-3 and 5-8, characterized in that: Each of the clamping members includes a main body and a clamping part. The main body is inserted into the spinning disc and is provided with the second driving member. The clamping part is arranged on the top of the main body and eccentrically arranged with the main body.

10. A single-chip flashing machine, characterized in that: include: A wafer-taking robot and a wafer-drying device as described in any one of claims 1 to 9 above, wherein the wafer-taking robot is used to place wafers into a clamping space formed by a plurality of clamping members, or to take wafers out of the clamping space formed by the plurality of clamping members.

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