Photoelectric co-packaging temperature control management architecture with combination of TEC and micro-channel

Abstract

The invention belongs to the field of photoelectric co-packaging, and particularly relates to a photoelectric co-packaging temperature control management framework combining a TEC and a micro-channel. In a photoelectric co-packaging heat dissipation system, a traditional shell is replaced by a micro-channel heat dissipation shell, targeted micro-channel partition design of the corresponding heat dissipation shell is performed according to the layout of each module in a packaging body, and the incidence relation between the temperature difference and the heat transfer rate is efficiently utilized. An integrated operation layout in which the micro-channel heat dissipation shell is used as the hot end of the TEC of the semiconductor chilling plate is provided; the micro-channel heat dissipation shell is arranged between the thermal elements, directional heat conduction control is achieved between the thermal elements through low-heat-conduction materials, the thermal elements conduct heat mainly through the micro-channel heat dissipation shell, heat conduction is greatly controlled through the low-heat-conduction materials between the thermal elements, and finally thermal crosstalk between the thermal elements is better controlled. The problem that high-integration-level packaging cannot be carried out due to thermal crosstalk in photoelectric co-packaging is effectively solved.

Description

Technical Field

[0001] The present invention belongs to the field of optoelectronic co-packaging, and specifically relates to an optoelectronic co-packaging temperature control management architecture combining TEC and microchannels. Background Art

[0002] As semiconductor technology gradually approaches its physical limits, in order to continue Moore's Law, manufacturers have turned their attention to the packaging of non-traditional chips and chips, and engineers have continuously improved the integration of chips. However, stacking a large number of chips in the same package through packaging will cause their power and heat generation to continue to increase. Moreover, because chips of different types and uses are integrated into the same package, the thermal crosstalk inside the package using traditional packaging technology is extremely serious.

[0003] With the development of high-performance technologies, engineers have developed optical interconnect chips based on traditional electrical interconnect chips. However, due to the stringent temperature requirements of optical signals, in order to integrate optical and electrical interconnect chips into the same package, the thermal crosstalk problem between traditional packaging technologies has become an urgent problem that engineers need to solve. To address these issues, an optoelectronic packaging process that can resolve the thermal crosstalk and high heat of various devices within a large-scale integrated package has become a key issue restricting chip development.

[0004] Among existing optoelectronic co-packaging technologies, the most common approach is to independently control the temperature of the optical module through a semiconductor micro-electric cooler (TEC). The cold end of the TEC contacts the optical module, while the hot end of the TEC is connected to an external metal heat sink. In traditional packaging technology, this metal heat conductor is generally also responsible for dissipating heat from other components within the package, such as the electrical interconnect chip. When the number of chips integrated into the package is small and the heat passing through the metal heat sink is low, the crosstalk between the optical and electrical interconnect chips is low, and the cooling efficiency of the TEC module is within an acceptable range. However, as the number of chips integrated into the package increases, the heat generated by the package increases, and the thermal crosstalk between the optical and electrical interconnect chips becomes extremely severe, causing the cooling efficiency of the TEC module to become extremely low, or even to lose its cooling capacity, resulting in increased heat loss in the package and even failure of the optical interconnect chip.

[0005] It can be seen that although the TEC cooler can sensitively control the temperature of the optical module, it faces the problem of the upper limit of the hot end temperature, which makes it impossible to achieve high-integration packaging of optoelectronics, greatly restricting the development of optical interconnect chip technology. Summary of the Invention

[0006] To address these issues and shortcomings, and to address the severe thermal crosstalk within traditional optoelectronic packaging technologies, which increases with the number of integrated chips, the present invention provides a combined optoelectronic package temperature management architecture combining a TEC (electrical condenser) and microfluidics. This architecture utilizes a semiconductor cooler (TEC) and microfluidics to create a relatively independent, zoned heat sink temperature control architecture, significantly reducing the thermal crosstalk between different components and modules within the package.

[0007] A photoelectric co-packaged temperature control management architecture combining TEC and microfluidics specifically includes a microfluidic heat dissipation housing, a semiconductor refrigeration plate TEC, an electrical interconnection chip, a laser, an optical interconnection chip, an adapter plate and an organic substrate.

[0008] The microchannels of the microchannel heat dissipation housing are etched in corresponding partitions according to the distribution of each thermal element, so that each thermal element has its own corresponding microchannel separated by a region, thereby reducing thermal crosstalk between different microchannel partitions.

[0009] Furthermore, the microchannel partitioning of the microchannel heat dissipation housing is adjusted according to the distribution position of the corresponding thermal elements and the heat distribution on the surface of the package body. The adjustment method is to regulate the microchannel density and channel diameter to improve the heat dissipation capacity. The greater the heat dissipation demand, the larger the corresponding microchannel density and channel diameter.

[0010] Furthermore, the transmission direction of the microchannel fluid in the microchannel heat dissipation housing is directional designed to further adjust the heat conduction direction of each thermal element, thereby improving the thermal isolation performance.

[0011] Furthermore, the material of the microchannel heat dissipation housing is a low thermal conductivity material (such as glass, organic plastic), so that heat conduction mainly relies on the microchannel to further enhance the thermal crosstalk isolation effect between various thermal components, especially for temperature-sensitive thermal components (such as optical chips).

[0012] Furthermore, the PN junction of the semiconductor refrigeration chip TEC is directly integrated under the micro-channel heat dissipation housing, and the micro-channel heat dissipation housing serves as the hot end of the semiconductor refrigeration chip TEC.

[0013] Furthermore, the adapter plate adopts a low thermal conductivity glass adapter plate (such as organic glass, ceramic, polymer). For example, the electrical interconnect chip is connected to the glass adapter plate using flip chip packaging technology, so that the heat of the chip is mainly conducted through the microchannel heat dissipation housing.

[0014] Furthermore, the optical interconnect chip is not in direct contact with the organic substrate, and a heat insulation layer is used or the optical interconnect chip is suspended in the air, so that heat conduction is mainly conducted through the microchannel heat dissipation housing.

[0015] Furthermore, the organic substrate does not serve as a main heat dissipation channel, and the material used is a material with relatively low thermal conductivity such as polyimide, BT resin, and FR4.

[0016] The present invention innovatively proposes replacing the traditional metal or plastic housing with a microfluidic heat dissipation housing in a co-packaged optoelectronic heat dissipation system. A targeted microfluidic zoning design is made for the heat dissipation housing according to the layout of each module inside the package, effectively utilizing the relationship between temperature difference and heat transfer rate. Furthermore, an operational layout is provided in which the microfluidic heat dissipation housing serves as the hot end of the semiconductor refrigeration element (TEC), integrating the semiconductor refrigeration element (TEC) with the microfluidic channel. Furthermore, low thermal conductivity materials (such as glass adapter plates, organic substrates, and microfluidic heat dissipation housing materials) are used to achieve directional heat conduction control between various thermal elements. Each thermal element mainly relies on the microfluidic heat dissipation housing for heat conduction, and the use of low thermal conductivity materials greatly controls the heat conduction between the various thermal elements, ultimately achieving better control of the thermal crosstalk between the various thermal elements (such as optical interconnect chips and electrical interconnect chips).

[0017] Beneficial effects of the present invention:

[0018] 1. Compared with the traditional packaging form of metal heat dissipation shell, the present invention adopts partitioned microchannels for different distribution areas of thermal components as the packaging shell. By limiting the transmission direction of the fluid in the microchannel, the regional density of the microchannel, and the flow channel diameter of the microchannel, it can meet the different heat dissipation requirements of each module inside the package. At the same time, it can also greatly avoid thermal crosstalk between the packaging shell and each thermal component, and can meet the heat dissipation situation of greater heat flux density, so that more types of modules can be integrated inside the package, thereby improving the integration of the package.

[0019] 2. The present invention innovatively proposes to use the microfluidic heat dissipation housing as the hot end of the semiconductor refrigeration chip TEC, which can avoid the use of bonding glue. It not only improves the reliability of the housing and the semiconductor refrigeration chip, but also greatly reduces the thermal resistance between the semiconductor refrigeration chip and the housing, greatly improving the cooling efficiency of the semiconductor refrigeration chip.

[0020] 3. Compared with the traditional packaging technology that uses high thermal conductivity components (such as silicon adapter plates), the present invention adopts a low thermal conductivity component architecture (such as glass adapter plates, organic substrates, and optical chip suspension architectures) to reduce the thermal crosstalk from different modules through the adapter plates and substrates, reduce the indirect thermal crosstalk between modules, and further strengthen the thermal isolation inside the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A cross-sectional schematic diagram of the optoelectronic co-packaged temperature control management architecture of the TEC and microfluidic channel combination of the present invention.

[0022] Figure 2Cross-sectional diagram of a conventional optoelectronic co-packaging architecture.

[0023] Figure 3 Schematic diagram of the internal flow channel partitioning of the microfluidic channel housing in the embodiment.

[0024] Figure 4 FIG. 4 is a schematic diagram of a heat transfer path of an embodiment.

[0025] Figure numerals: microchannel heat dissipation housing (101), semiconductor cooling plate (102), electrical interconnection chip (2), laser (3), optical interconnection chip (4), glass adapter plate (5), organic substrate (6), metal heat dissipation housing (7), silicon adapter plate (8), water inlet (9), heat dissipation channel of electrical interconnection chip (10), heat dissipation channel of optical interconnection chip (11), water outlet (12), heat conduction (13), natural convection (14), heat radiation (15). DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0027] Example:

[0028] like Figure 3 As shown, three relatively independent partitioned microchannels are formed on a silicon wafer by laser etching, and the microchannel heat dissipation housing (101) of the package body is used as the heat dissipation housing (101). The hot end (102) of the semiconductor cooling plate TEC is adhered to the bottom of the heat dissipation channel (11) of the optical interconnection chip by welding or bonding glue. The back of the electrical interconnection chip is also bonded to the microchannel heat dissipation housing (101) by bonding glue under the other two heat dissipation channels (10) of the electrical interconnection chip. At the same time, the cold end of the semiconductor cooling plate TEC is connected to the laser (3), and the laser and the optical interconnection chip (4) together form an optical communication module inside the package.

[0029] On the front of the two electrical interconnection chips (2), the electrical interconnection chip (2) is connected to one side of the glass transfer plate (5) using a flip chip process, and the other side of the glass transfer plate is interconnected with the optical interconnection chip. Finally, the glass transfer plate (5) is connected to the organic substrate (6) through solder balls. The overall structure is as follows: Figure 4 It is worth noting that, depending on the temperature sensitivity of the optical communication module, the optical module and the organic substrate (6) may be further thermally isolated. The method adopted in this embodiment is to suspend the optical module to prevent heat transfer between the organic substrate and the optical interconnect chip through contact. In addition, the use of a thermal insulation coating to isolate the optical interconnect chip from the organic substrate may also be considered.

[0030] In the traditional optoelectronic co-packaging process architecture, such as Figure 2As shown, a unified module, typically a metal heat sink, is typically used to simultaneously conduct heat from both the optical module (e.g., optical interconnect chip) and the electrical module (e.g., electrical interconnect chip) out of the package. Because the optical interconnect chip and the optical module integrated within the package are far more temperature sensitive than the electrical interconnect chip, a thermally conductive cooler (TEC) is typically used to dissipate heat from the optical module. However, as the number of components integrated within the package increases, thermal crosstalk between the components becomes extremely severe. Using traditional packaging techniques can significantly reduce the cooling efficiency of the TEC and even cause it to fail, interfering with the normal operation of the optical module and severely restricting the increase in chip integration.

[0031] In order to solve the problem of thermal crosstalk between different heating powers and temperature-sensitive components inside the package, the present invention innovatively uses a partitioned microfluidic system. By constraining the flow channel direction and regional flow channel density in the microfluidic system, the microfluidic channels in different areas correspond to different modules for targeted heat dissipation, thereby reducing the thermal crosstalk between various components (such as Figure 3 , Figure 4 ).

[0032] From the above embodiments, it can be seen that the present invention replaces the traditional heat dissipation housing with a microchannel heat dissipation housing (101) formed by etching a silicon-based material or a metal material, and at the same time, the hot end of the semiconductor cooling piece TEC (102) is welded to the bottom of the heat dissipation housing etched with a separate partitioned heat dissipation channel, and the cold end of the semiconductor cooling piece TEC (102) is attached to the laser (3), optical interconnection chip and other temperature-sensitive components; the remaining part of the heat dissipation housing is still etched with another partitioned heat dissipation microchannel, and under this part, the electrical interconnection chip (2) integrated in the package body can be attached to the module that is relatively less sensitive to temperature. By introducing the heat dissipation housing etched with microchannels, the heat dissipation paths of components with different temperature sensitivities and working under different operating temperature conditions are isolated; at the same time, the microchannels corresponding to components with different thermal powers can be encrypted, thereby realizing artificial directional planning of the heat transfer route, not only reducing the thermal crosstalk problem of different components, but also etching different microchannels for components with different thermal powers, so that the temperature distribution inside the package is uniform, reducing the thermal stress of the package.

Claims

1. A photoelectric co-packaged temperature control management architecture combining a TEC and a microfluidic channel, comprising a semiconductor refrigeration element (TEC), an electrical interconnect chip, a laser, an optical interconnect chip, an adapter plate, and an organic substrate, characterized by: Also included is a microfluidic heat dissipation housing; The microchannels of the microchannel heat dissipation housing are etched in corresponding partitions according to the distribution of each thermal element, so that each thermal element has its own corresponding microchannel separated by a region, thereby reducing thermal crosstalk between different microchannel partitions.

2. The optoelectronic co-package temperature control management architecture combining TEC and microfluidic channels as claimed in claim 1, characterized in that: The microchannel partitioning of the microchannel heat dissipation housing is adjusted according to the distribution position of the corresponding thermal elements and the heat distribution on the surface of the package body. The adjustment method is to regulate the microchannel density and channel diameter to improve the heat dissipation capacity. The greater the heat dissipation demand, the larger the corresponding microchannel density and channel diameter.

3. The optoelectronic co-packaged temperature control management architecture combining TEC and microfluidic channels as claimed in claim 1, characterized in that: The transmission direction of the microchannel fluid in the microchannel heat dissipation housing is directional designed to further adjust the direction of heat conduction.

4. The optoelectronic co-package temperature control management architecture combining TEC and microfluidic channels as claimed in claim 1, characterized in that: The material of the micro-channel heat dissipation housing is a material with low thermal conductivity.

5. The optoelectronic co-package temperature control management architecture combining TEC and microfluidic channels as claimed in claim 1, characterized in that: The PN junction of the semiconductor refrigeration piece TEC is directly integrated under the micro-channel heat dissipation housing, and the micro-channel heat dissipation housing serves as the hot end of the semiconductor refrigeration piece TEC.

6. The optoelectronic co-packaged temperature control management architecture of the TEC and microfluidic channel combination as claimed in claim 1, characterized in that: The transfer plate is a glass transfer plate with low thermal conductivity.

7. The optoelectronic co-package temperature control management architecture of the TEC and microfluidic channel combination as claimed in claim 6, characterized in that: The low thermal conductivity glass transfer plate material is specifically organic glass, ceramic or polymer.

8. The optoelectronic co-packaged temperature control management architecture combining TEC and microfluidic channels as claimed in claim 1, characterized in that: The optical interconnection chip is not in direct contact with the organic substrate, and a heat insulation layer is used or the optical interconnection chip is suspended.

9. The optoelectronic co-packaged temperature control management architecture of the TEC and microfluidic channel combination as claimed in claim 1, characterized in that: The material used for the organic substrate is a material with low thermal conductivity.

10. The optoelectronic co-package temperature control management architecture of the TEC and microfluidic channel combination as claimed in claim 9, characterized in that: The material with low thermal conductivity is polyimide, BT resin, or FR4.

Images