Cooling system and cooling method for ICP-MS

Abstract

The invention provides a cooling system and a cooling method for ICP-MS. The cooling system and the cooling method for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. The cooling system for ICP-MS. comprises a partition cooling unit, the temperature monitoring unit is integrated on the atomization cooling part, the interface cooling part and the radio frequency cooling part and used for collecting temperature data of all areas in real time, the temperature regulation and control unit comprises a temperature feedback module and a self-adaptive adjustment module, the temperature feedback module is electrically connected with the temperature monitoring unit, and the self-adaptive adjustment module is electrically connected with the temperature monitoring unit. The temperature feedback module is used for comparing the difference between real-time temperature data and standard temperature data and positioning the position of a temperature abnormal source, the self-adaptive adjusting module is electrically connected with the temperature feedback module, the self-adaptive adjusting module is electrically connected with the partition cooling unit, and the partition cooling unit is electrically connected with the temperature feedback module. And the control module is used for adjusting operation parameters of the partition cooling units in real time.

Description

Technical Field

[0001] The present invention belongs to the technical field of inductively coupled plasma mass spectrometers, and in particular relates to a cooling system and a cooling method for ICP-MS. Background Art

[0002] An inductively coupled plasma mass spectrometer (ICP-MS) is an analytical instrument that combines inductively coupled plasma (ICP) technology with mass spectrometry. Its basic structure primarily consists of a sample introduction system, nebulizer, ion source, plasma interface, ion focusing system, quadrupole mass filter, ion detector, and other components. As a high-precision trace analysis instrument, its core components generate significant heat during operation. Inadequate heat dissipation can lead to performance degradation, poor stability, and even equipment damage. For example, the sampling cone and the skimmer cone in the plasma interface area are in direct contact with the high-temperature plasma (about 6000-10000K). Heat accumulation can easily lead to cone carbon buildup, ion recombination, and signal drift, affecting resolution and sensitivity. For example, the RF power supply has high power (usually 1.5-2kW), and traditional heat dissipation designs cannot effectively disperse the heat from the circuit board, resulting in poor power supply stability and even aging of components. For example, the fine capillary in the atomizer introducer in the nebulizer is mainly used to generate aerosols. However, because the temperature of the atomizer introducer is too high, the droplets generated by the volatile sample solution can easily clog the fine capillary, causing the nebulizer to "stall."

[0003] For example, the invention patent with application number CN202180076225.3 discloses an air-cooled interface for an inductively coupled plasma mass spectrometer (ICP-MS). The interface structure is configured to quickly transfer heat from the front surface of the interface exposed to the high-temperature plasma while maintaining the heat in the ion beam to avoid recombination and aggregation. The air-cooled interface of the present system includes a set of fins for rapid heat transfer, which can be placed in various orientations along the side of the ICP-MS system. Open-pore metal foam is also used to improve heat transfer efficiency. The system can be cooled by natural convection or forced convection using one or more fans.

[0004] This air-cooled interface can only cool the plasma interface area. However, the high-temperature areas of the ICP-MS (plasma interface, RF power supply, and nebulizer) lack precise temperature monitoring and dynamic cooling control capabilities, resulting in the inability to accurately identify the high-temperature areas, which in turn causes mass spectrum signal drift or analysis errors. Summary of the Invention

[0005] Based on this, the present invention provides a cooling system and cooling method for ICP-MS to solve the technical problem in the prior art that the high-temperature area (plasma interface, RF power supply, and atomizer) of the plasma mass spectrometer (ICP-MS) lacks accurate temperature monitoring and dynamic cooling control capabilities, resulting in the inability to accurately identify the high-temperature area, and further causing mass spectrum signal drift or analysis errors.

[0006] The technical solution of the present invention to solve the above technical problems is as follows:

[0007] A cooling system for an ICP-MS comprises a partitioned cooling unit, wherein the partitioned cooling unit comprises an atomizing cooling part, an interface cooling part and a radio frequency cooling part, wherein the atomizing cooling part adopts semiconductor refrigeration for cooling, the interface cooling part adopts spiral tube water cooling, and the radio frequency cooling part adopts air-cooled diversion cooling; a temperature monitoring unit, wherein the temperature monitoring unit is integrated with the atomizing cooling part, the interface cooling part and the radio frequency cooling part and is used to collect temperature data of each area in real time; a temperature control unit, wherein the temperature control unit comprises a temperature feedback module and an adaptive adjustment module, wherein the temperature feedback module is electrically connected to the temperature monitoring unit, the temperature feedback module is used to compare the difference between the real-time temperature data and the standard temperature data, and locate the position of the temperature anomaly source, the adaptive adjustment module is electrically connected to the temperature feedback module, and the adaptive adjustment module is electrically connected to the partitioned cooling unit and is used to adjust the operating parameters of the partitioned cooling unit in real time.

[0008] Preferably, the atomization cooling part includes an atomization introducer, an argon gas intervention chamber and a refrigeration component; the atomization introducer includes a liquid chamber, a liquid pipe, a mixing tank, an introduction pipe and a fine capillary tube which are connected in sequence, the liquid chamber contains a sample solution, and the end of the fine capillary tube extends into the atomization chamber of the nebulizer; the argon gas intervention chamber includes an air chamber and an air pipe which are connected to each other, the air chamber contains argon gas, and the air pipe is connected to the liquid pipe for mixing argon gas and sample solution into the mixing tank; the refrigeration component includes a semiconductor refrigeration element and a DC power supply, the refrigeration surface of the semiconductor refrigeration element is in contact with the outer wall of the mixing tank, the DC power supply is electrically connected to the semiconductor refrigeration element, and the DC power supply is electrically connected to the adaptive adjustment module.

[0009] Preferably, the refrigeration component also includes a water cooler, one end of which is in contact with the heating surface of the semiconductor refrigeration component; the water cooler includes a cold water tank, a first water pump and a coil, the cold water tank is arranged on one side of the atomizing introducer, the first water pump is arranged in the cold water tank, the coil is spirally arranged on one side of the heating surface of the semiconductor refrigeration component, and the liquid inlet end of the coil is connected to the first water pump, the liquid outlet end of the coil extends into the cold water tank, and the first water pump is electrically connected to the adaptive adjustment module.

[0010] Preferably, an ion flow shell, a sampling cone and a cutting cone are provided in the ICP-MS, and the sampling cone and the cutting cone are coaxially arranged in the ion flow shell in sequence. The interface cooling part includes a variable diameter spiral cooling tube, an outer frame body, a connecting tube and an external circulation water supply part. The variable diameter spiral cooling tube is nested in the outer wall of the sampling cone and / or the outer wall of the cutting cone. The outer frame body is embedded in the inner wall of the ion flow shell, and the outer frame body is detachably connected to the variable diameter spiral cooling tube. One end of the connecting tube is sleeved with the variable diameter spiral cooling tube. The external circulation water supply part is located on the outside of the plasma mass spectrometer, and the other end of the connecting tube passes through the ion flow shell and is connected to the external circulation water supply part. The external circulation water supply part is electrically connected to the adaptive adjustment module.

[0011] Preferably, the outer frame body includes an inner connecting ring, an adjustable connecting rod and a fixing screw. The inner connecting ring is sleeved on the inner wall of the ion flow shell, one end of the adjustable connecting rod is connected to the inner connecting ring, and the other end of the adjustable connecting rod is connected to the variable diameter spiral cooling tube. The fixing screw is arranged on the inner connecting ring, and the fixing screw passes through the inner connecting ring and is connected to the ion flow shell.

[0012] Preferably, the RF cooling unit includes several heat dissipation substrates, heat pipes, fins and centrifugal fans. The several heat dissipation substrates are evenly arranged along a preset spacing. The heat dissipation substrates and the RF power supply PCB board are bonded to each other. The heat pipes are arranged between adjacent heat dissipation substrates, and the heat pipes and the heat dissipation substrates are in contact with each other. The fins are located on one side of the heat dissipation substrate, the heat pipes are connected to the fins, and the centrifugal fan is arranged on the side close to the fins.

[0013] Preferably, the heat dissipation substrate is arranged at an angle, and the angle between the heat dissipation substrate and the RF power supply PCB board is 15° to 45°.

[0014] Preferably, the adaptive adjustment module includes an initial adjustment module and a gradient adjustment module, the initial adjustment module is electrically connected to the temperature feedback module, and the initial adjustment module is electrically connected to the partitioned cooling unit, and the gradient adjustment module is electrically connected to the initial adjustment module.

[0015] A cooling method comprises step S1: synchronously collecting temperature data of an atomizer area, a plasma interface area and a radio frequency power supply area through the temperature monitoring unit; step S2: the temperature feedback module receives a real-time temperature data signal, compares the real-time temperature data with standard temperature data, and if abnormal temperature data occurs, locates the position of the temperature abnormality source according to the temperature data signal transmission source, and generates a corresponding temperature adjustment signal; step S3: the adaptive adjustment module receives and responds to the temperature adjustment signal, adjusts the operating parameters of the partitioned cooling unit in real time according to the temperature adjustment signal, and starts the corresponding cooling part until the temperature of all areas returns to the set range.

[0016] Preferably, the gradient adjustment module includes a first-level gradient adjustment, a second-level gradient adjustment and a third-level gradient adjustment; wherein, when the temperature of the atomizer area is -10°C to 10°C, or the temperature of the plasma interface area is 5000°C to 7000°C, or the temperature of the RF power area is 10°C to 30°C, the gradient adjustment module performs a first-level gradient adjustment; when the temperature of the atomizer area is 10.1°C to 30°C, or the temperature of the plasma interface area is 7000.1°C to 9000°C, or the temperature of the RF power area is 30.1°C to 45°C, the gradient adjustment module performs a second-level gradient adjustment; when the temperature of the atomizer area is greater than 30.1°C, or the temperature of the plasma interface area is greater than 9000.1°C, or the temperature of the RF power area is greater than 45.1°C, the gradient adjustment module performs a third-level gradient adjustment.

[0017] Compared with the prior art, the present invention has at least the following advantages:

[0018] The cooling system can simultaneously accurately identify and monitor the high-temperature areas (plasma interface area, RF power supply area, and nebulizer area) of the plasma mass spectrometer (ICP-MS), achieve dynamic cooling control, and reduce mass spectrum signal drift or analysis errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the cooling system used for ICP-MS.

[0020] Figure 2 Schematic diagram of the temperature control unit.

[0021] Figure 3 Schematic diagram of the gradient adjustment module.

[0022] Figure 4 This is the axonometric view of the atomizing cooling unit.

[0023] Figure 5 This is an axonometric view of the atomizer introducer and argon intervention chamber.

[0024] Figure 6 This is an axonometric drawing of the refrigeration component.

[0025] Figure 7 A top view of the refrigeration component.

[0026] Figure 8 Schematic diagram of coils and semiconductor refrigeration components.

[0027] Figure 9 Schematic diagram of introducing droplets into the atomizer.

[0028] Figure 10 Schematic diagram of the interface cooling unit and the RF cooling unit.

[0029] Figure 11 This is the axonometric view of the interface cooling part.

[0030] Figure 12 This is a top view of the interface cooling part.

[0031] Figure 13 This is the main view of the interface cooling part.

[0032] Figure 14 This is the axonometric view of the RF cooling unit.

[0033] In the figure: partition cooling unit 10, atomizing cooling part 100, atomizing introducer 110, liquid chamber 111, liquid pipe 112, mixing tank 113, introduction pipe 114, fine capillary 115, peristaltic pump 116, discharge pipe 117, argon gas intervention chamber 120, gas chamber 121, gas pipe 122, refrigeration assembly 130, semiconductor refrigeration element 131, DC power supply 132, water cooler 133, cold water tank 1331, first water pump 1332, coil 1333, heat conductive clamp 1334, interface cooling part 200, variable diameter spiral cooling pipe 210, outer frame body 220, inner connecting ring 221, adjustable connecting rod 222, fixed Fixed screw 223, connecting pipe 230, external circulation water supply unit 240, water storage tank 241, second water pump 242, RF cooling unit 300, heat dissipation substrate 310, heat pipe 320, fins 330, centrifugal fan 340, temperature monitoring unit 20, temperature control unit 30, temperature feedback module 400, adaptive adjustment module 500, initial adjustment module 510, gradient adjustment module 520, first-level gradient adjustment 521, second-level gradient adjustment 522, third-level gradient adjustment 523, plasma mass spectrometer 40, ion flow shell 600, sampling cone 610, nebulizer 700, RF power supply 800. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The following will further describe the technical solution of the present invention in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific embodiments.

[0035] It should be understood that the same or similar numbers in the drawings of the embodiments correspond to the same or similar parts. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom" and the like indicating an orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0036] Please see Figures 1 to 14 A cooling system for ICP-MS includes a partitioned cooling unit 10, which includes a mist cooling section 100, an interface cooling section 200 and a radio frequency cooling section 300. The mist cooling section 100 mainly cools the nebulizer 700 area to prevent the volatile sample solution from volatilizing in large quantities and clogging the capillary 115; the interface cooling section 200 mainly cools the sampling cone 610 and the intercepting cone, and the radio frequency cooling section 300 mainly cools the RF power supply 800.

[0037] The atomizing cooling unit 100 utilizes semiconductor refrigeration. Since the volatile sample solution needs to be cooled, efficient cooling equipment is required. Existing nebulizers 700 lack such cooling equipment, or typically use water cooling, which is relatively inefficient. Therefore, the nebulizer 700 utilizes semiconductor refrigeration, which achieves cooling through the Peltier effect. N-type materials have excess electrons and a negative thermoelectric potential. P-type materials have insufficient electrons and a positive thermoelectric potential. When electrons pass from the P-type to the N-type junction, the junction temperature decreases, and its energy inevitably increases. This increase in energy is equivalent to the energy consumed by the junction. Conversely, when electrons flow from the N-type to the P-type material, the junction temperature increases. Consequently, one surface absorbs heat while the other releases heat, achieving heat transfer and a cooling effect. For more detailed information on the principle and structure of the semiconductor refrigeration element 131310, please refer to [http: / / www.pti.org / ].

[0038] The interface cooling part 200 adopts spiral tube water cooling. Since the temperature of the sampling cone 610 or the intercepting cone is relatively high during operation, water cooling has high heat exchange efficiency and can achieve continuous cooling.

[0039] The RF cooling unit 300 adopts air-cooled conduction cooling. Since the RF power supply 800 is a power-on device, air-cooled conduction cooling is more efficient.

[0040] Temperature monitoring unit 20, see Figure 2 The temperature monitoring unit 20 is integrated into the atomizing cooling unit 100, the interface cooling unit 200 and the RF cooling unit 300, and is used to collect temperature data of each area in real time; wherein, the atomizing cooling unit 100 is provided with a semiconductor thermistor, and the interface cooling unit 200 is provided with a thin film thermocouple array, and the thin film thermocouple array is composed of at least 12 micron-level thin film sensors, with a spatial arrangement density of ≥5 / cm 2 , which can detect local hot spots within the scale range of 0.1-1 mm on the surface of the sampling cone 610 and the intercepting cone; the radio frequency cooling part 300 is provided with an optical fiber temperature sensor.

[0041] Temperature control unit 30, see Figure 2 and Figure 3 The temperature control unit 30 includes a temperature feedback module 400 and an adaptive adjustment module 500. The temperature feedback module 400 is electrically connected to the temperature monitoring unit 20. Specifically, the temperature feedback module 400 is electrically connected to a semiconductor thermistor sensor, the temperature feedback module 400 is electrically connected to a thin film thermocouple, and the temperature feedback module 400 is electrically connected to an optical fiber temperature sensor. The temperature feedback module 400 simultaneously receives temperature signals from three areas. Subsequently, the temperature feedback module 400 is used to compare the real-time temperature data with the standard temperature data and locate the source of the temperature anomaly. Wherein, the standard temperature data is a standard temperature database collected and set, for example, the standard temperature of the atomizer 700 area is set to 10°C, the standard temperature of the plasma interface area is set to 5000°C, and the standard temperature of the plasma interface area is set to 10°C. According to the real-time temperature data provided by the temperature monitoring unit 20, the real-time temperature data is compared with the standard temperature data through the temperature feedback module 400. If the real-time temperature data is greater than the standard temperature data, the area where the real-time temperature data is located is located, and a temperature adjustment signal for the corresponding area that needs cooling is generated to prepare for cooling. For example, when the temperature monitoring unit 20 detects that the temperature of the plasma interface area has reached 6000°C, exceeding the standard 5000°C, it is located that the plasma interface area needs to be cooled, and the temperature adjustment signal for the plasma interface area is generated.

[0042] The adaptive adjustment module 500 is electrically connected to the temperature feedback module 400 and the partitioned cooling unit 10. The adaptive adjustment module 500 receives and responds to temperature adjustment signals and controls the cooling units of the areas requiring cooling, thereby adjusting the operating parameters of the partitioned cooling unit 10 in real time. For example, when a temperature adjustment signal is received indicating that the plasma interface area needs to be cooled, the interface cooling unit 200 is controlled to open and cool the plasma interface area. This achieves precise monitoring and dynamic cooling control.

[0043] The cooling system provided in the embodiments of the present application can simultaneously accurately identify and monitor the high-temperature areas (plasma interface area, RF power supply 800 area, and nebulizer 700 area) of the plasma mass spectrometer 40 (ICP-MS), realize dynamic cooling control, and reduce mass spectrum signal drift or analysis errors.

[0044] As an example description, see Figures 4 to 9 The atomization cooling part 100 includes an atomization introducer 110, an argon intervention chamber 120 and a refrigeration component 130; the atomization introducer 110 is used to convert the liquid sample into fine droplets and introduce it into the atomization chamber of the nebulizer 700, wherein the sample solution includes a clear and transparent aqueous solution, ethanol solution, etc. The argon intervention chamber 120 is connected to the atomization introducer 110, and argon will enter the atomization chamber at the same time as the droplets. Argon is used as an ionized reaction gas in the mass spectrometer. By colliding with the aerosol, the aerosol is ionized to facilitate subsequent analysis.

[0045] Among them, see Figure 5 The atomizing introducer 110 includes a liquid chamber 111, a peristaltic pump 116, a liquid pipe 112, a mixing tank 113, an introduction pipe 114 and a fine capillary 115 which are sequentially connected. The liquid chamber 111 contains a sample solution, such as an aqueous solution. The peristaltic pump 116 is connected to the liquid chamber 111. The sample solution in the liquid chamber 111 is extracted by the peristaltic pump 116 and enters the liquid pipe 112. The sample solution in the liquid pipe 112 enters the mixing tank 113. The inner wall of the mixing tank 113 is hollow. After the sample solution enters the mixing tank 113, it will be in a droplet state. One end of the introduction tube 114 is located in the mixing tank 113. The fast-flowing sample solution droplet portion will enter the introduction tube 114. The introduction tube 114 is connected to the fine capillary 115. The droplets will enter the fine capillary 115 along the introduction tube 114. The end of the fine capillary 115 extends into the atomization chamber of the nebulizer 700.

[0046] Specifically, most of the droplets are generated in the mixing tank 113. Therefore, it is necessary to set the temperature monitoring unit 20, that is, a semiconductor thermistor, to transmit the temperature in the mixing tank 113 in real time. Only by monitoring the temperature in the mixing tank 113 in real time can the volatilization of the sample solution be reduced and the droplet concentration be reduced.

[0047] Furthermore, the atomizing introducer 110 further includes a drain pipe 117112, which is connected to the mixing tank 113 and is located at the bottom of the mixing tank 113. Excess sample solution will be discharged through the drain pipe 117112 for collection and secondary utilization.

[0048] Furthermore, the argon intervention chamber 120 includes an air chamber 121 and an air pipe 122 that are interconnected. Argon is contained in the air chamber 121, and the air pipe 122 is connected to the liquid pipe 112, so as to mix the argon with the sample solution and enter the mixing tank 113. When the argon passes through the mixing tank 113 and enters the mixing tank 113, the argon will drive the droplets to enter the introduction pipe 114 at the same time, and then enter the capillary 115. When the droplets are ejected from the nozzle at the tip of the capillary 115, the argon exerts a shear force on them, decomposing the droplets into fine aerosol droplets, which then enter the atomization chamber.

[0049] Also, see Figures 6 to 8 The cooling assembly 130 includes a semiconductor cooler 131 and a DC power supply 132. The cooling surface of the semiconductor cooler 131 is in contact with the outer wall of the mixing tank 113, and the DC power supply 132 is electrically connected to the semiconductor cooler 131. The semiconductor cooler 131 is composed of an N-type semiconductor and a P-type semiconductor. These semiconductor materials achieve cooling through the Peltier effect. The N-type material has excess electrons and a negative thermoelectric potential. The P-type material has insufficient electrons and a positive thermoelectric potential. When electrons pass from the P-type to the N-type junction, the junction temperature decreases, and its energy inevitably increases. This increase in energy is equivalent to the energy consumed by the junction. Conversely, when electrons flow from the N-type to the P-type material, the junction temperature increases. Consequently, one surface absorbs heat while the other releases heat, achieving heat transfer and a cooling effect. For more detailed information on the principle and structure of the semiconductor cooler 131, please refer to [http: / / www.pti.com / refrigeration ... When the DC power supply 132 energizes the semiconductor refrigeration element 131 , the semiconductor refrigeration element 131 starts working, and its cooling surface contacts the outer wall of the mixing tank 113 to cool the mixing tank 113 .

[0050] It should be noted that when the adaptive adjustment module 500 adjusts the atomizing cooling unit 100, the adaptive adjustment module 500 is electrically connected to the DC power supply 132, controlling the connection and disconnection between the DC power supply 132 and the peltier element 131. Furthermore, the adaptive adjustment module 500 controls the current of the DC power supply 132, thereby varying the cooling efficiency of the peltier element 131. Controlling the connection and disconnection of the circuit, or controlling the current, is a conventional control method and technique and will not be further elaborated upon here.

[0051] The atomizing cooling section 100 provided in the embodiment of the present application takes ethanol solution as an example of the sample solution. Due to the high volatility of ethanol solution, after the ethanol solution is pumped out of the liquid chamber 111 by the peristaltic pump 116, it enters the liquid pipe 112 and is mixed with the argon gas introduced from the gas chamber 121 into the gas pipe 122, and enters the mixing tank 113 at the same time, forming mixed droplets formed by ethanol droplets and argon gas. Taking the normal laboratory temperature of 20°C as an example, at 20°C, the volatility of ethanol droplets is high, and a large number of mixed droplets will be generated to enter the inlet pipe 114, and then enter the capillary tube 115 from the inlet pipe 114, which can easily cause the mixed droplets to block the capillary tube 115. Therefore, in order to reduce the volatility of the ethanol solution, and since the lower the temperature, the lower the volatility of the ethanol solution, according to this principle, when the sample solution is a volatile solution such as ethanol, the DC power supply 132 is turned on to energize the semiconductor refrigeration element 131. When the cooling surface temperature of the semiconductor refrigeration element 131 decreases, the cooling surface of the semiconductor refrigeration element 131 is in contact with the outer surface of the mixing tank 113, and the temperature of the outer wall of the mixing tank 113 also decreases, thereby lowering the temperature inside the mixing tank 113, reducing the volatility of the ethanol solution, and thus significantly reducing the concentration of ethanol droplets. By attaching the semiconductor refrigeration element 131 to the outer surface of the mixing tank 113 of the atomizing introducer 110, after power is applied, the semiconductor refrigeration element 131 quickly cools the mixing tank 113, lowering the temperature of the mixing tank 113. This temperature drop reduces the volatility of the sample solution, thereby reducing the droplet concentration, reducing the blockage rate of the capillary tube 115, and preventing the atomizer 700 from experiencing multiple "burnouts". It is worth noting that the temperature drop reduces the volatility of the sample solution and reduces the blockage rate of the capillary 115, but this does not mean that the capillary 115 will not be blocked again. It only reduces the number of blockages of the capillary 115 and reduces the blockage rate.

[0052] In a preferred embodiment, to ensure that the semiconductor refrigeration element 131 and the mixing tank 113 maintain a close fit, the semiconductor refrigeration element 131 is further provided with a fixing sleeve and a binding strap. The fixing sleeve is elastic and wraps around the outer wall of the mixing tank 113. The binding strap is located on one side of the fixing sleeve and passes around the outer wall of the mixing tank 113 to be detachably connected to the semiconductor refrigeration element 131. The fixing sleeve and the binding strap are respectively located on either side of the inlet pipe 114. The fixing sleeve is first expanded with elasticity and placed on one side of the mixing tank 113. The binding strap is then tied to the mixing tank 113 to secure the semiconductor refrigeration element 131 to the mixing tank 113, ensuring a close fit between the two, convenient use, and quick removal.

[0053] In one embodiment, since one side of the semiconductor refrigeration element 131 is cooled and the other side is heated, in order to keep the semiconductor refrigeration element 131 in a cooling state for a long time, it is necessary to perform heat dissipation treatment on the heating surface of the semiconductor refrigeration element 131. Traditional heat dissipation usually uses air cooling. However, since the space on the side of the atomizer 700 of the plasma mass spectrometer 40 is relatively small, there is no space for installing a fan and a heat sink. In addition, the use of fan cooling is noisy and easily blows up dust. The refrigeration component 130 also includes a water cooler 133, see Figure 6 One end of the water cooler 133 is in contact with the heating surface of the semiconductor refrigeration component 131; the water cooler 133 can be installed on one side of the semiconductor refrigeration component 131, and dissipates heat from the heating surface of the semiconductor refrigeration component 131 by water cooling, with low noise, small space occupied by the plasma mass spectrometer 40, and no dust.

[0054] As a further explanation, the water cooler 133 includes a cold water tank 1331, a first water pump 1332 and a coil 1333. The cold water tank 1331 is arranged on one side of the atomizing introducer 110, the first water pump 1332 is arranged in the cold water tank 1331, the coil 1333 is spirally arranged on one side of the heating surface of the semiconductor refrigeration component 131, and the liquid inlet end of the coil 1333 is connected to the first water pump 1332, and the liquid outlet end of the coil 1333 extends into the cold water tank 1331, and the first water pump 1332 is electrically connected to the adaptive adjustment module 500. For sample solutions with greater volatility, the mixing tank 113 needs to be kept in a low-temperature environment for a long time to reduce the volatility of the sample solution. By turning on the first water pump 1332, cooling water is introduced into the coil 1333. Since the coil 1333 is in contact with the heating surface of the semiconductor refrigeration component 131, the cooling water in the coil 1333 exchanges heat with the heating surface of the semiconductor refrigeration component 131, thereby reducing the temperature of the heating surface of the semiconductor refrigeration component 131, thereby allowing the semiconductor refrigeration component 131 to maintain a cooling effect for a long time, thereby cooling the mixing tank 113.

[0055] It should be noted that the adaptive adjustment module is also electrically connected to the first water pump 1332, and the opening and closing of the first water pump 1332 is controlled by the electromagnetic flow regulating valve on the first water pump 1332. Furthermore, the flow rate of water flowing out of the first water pump 1332 can be controlled by the electromagnetic flow regulating valve.

[0056] For details, see Figure 8 The coils 1333 are evenly arranged in a curved spiral shape on one side of the heating surface of the semiconductor refrigeration element 131 .

[0057] Specifically, the coil 1333 is made of a heat-conducting metal material, which can easily transfer the heat from the heating surface of the semiconductor refrigeration component 131 to the surface of the coil 1333 .

[0058] In a preferred embodiment, the coiled tube 1333 is further provided with a plurality of heat-conducting clamping rings 1334. The heat-conducting clamping rings 1334 wrap around the outer wall of the coiled tube 1333, and the ends of the heat-conducting clamping rings 1334 are clamped to the heating surface of the semiconductor refrigeration element 131. The heat-conducting clamping rings 1334 ensure that the coiled tube 1333 and the heating surface of the semiconductor refrigeration element 131 remain in contact with each other for a long time, maintaining the heat exchange effect. At the same time, the heat-conducting clamping rings 1334 are made of a heat-conducting material, and the heat from the heating surface of the semiconductor refrigeration element 131 is transferred to the surface of the coiled tube 1333 through the heat-conducting clamping rings 1334.

[0059] Specifically, a plurality of clamping holes are opened on one side of the heating surface of the semiconductor refrigeration component 131, and the heat-conducting clamping ring 1334 is clamped in the clamping holes by interference fit.

[0060] In a preferred embodiment, the coiled tube 1333 is flat, which facilitates the mutual contact between the coiled tube 1333 and the semiconductor refrigeration element 131 and increases the contact surface, thereby facilitating heat transfer and achieving efficient heat transfer.

[0061] In a preferred embodiment, when the coolant is not cooling water but other coolants are used, when the coolant temperature is high, in order to lower the temperature of the coolant, the water cooler 133 also includes a refrigerant box, which is arranged on the cold water tank 1331. The refrigerant box contains refrigerant. When the coolant temperature is high, the coolant temperature is lowered by adding refrigerant to the coolant.

[0062] In one embodiment, an ICP-MS 40 is provided with an ion flow housing 600, a sampling cone 610, and a skimmer cone. The sampling cone 610 and the skimmer cone are coaxially disposed within the ion flow housing 600. The sampling cone 610 is configured to draw the majority of the carrier gas flow (i.e., the ion flow) from the central channel of the plasma into the conical aperture and into the first-stage vacuum chamber. The skimmer cone is configured to select the central portion of the expanded jet from the aperture of the sampling cone 610 and allow it to pass through the skimmer cone and into the next stage of vacuum.

[0063] Specifically, the sampling cone 610 is fixed in the ion flow housing 600 via a hollow ring, and the skimmer cone is fixed in the ion flow housing 600 via a hollow ring.

[0064] For further explanation, see Figures 10 to 13 The interface cooling part 200 includes a variable diameter spiral cooling pipe 210, an outer frame body 220, a connecting pipe 230 and an external circulating water supply part 240. The variable diameter spiral cooling pipe 210 is nested on the outer wall of the sampling cone 610 and / or the outer wall of the intercepting cone. The variable diameter spiral cooling pipe 210 is made of a fast heat conducting material. Cooling liquid flows in the tube of the variable diameter spiral cooling pipe 210. The heat from the outer surface of the sampling cone 610 and the intercepting cone is transferred to the variable diameter spiral cooling pipe 210, and the heat of the variable diameter spiral cooling pipe 210 is cooled by the cooling liquid.

[0065] Furthermore, in order to facilitate the fixing of the variable diameter spiral cooling tube 210 on the outer wall of the sampling cone 610 or / and the outer wall of the intercepting cone, the outer frame body 220 is embedded in the inner wall of the ion flow shell 600, and the outer frame body 220 and the variable diameter spiral cooling tube 210 are detachably connected, one end of the connecting tube 230 is sleeved with the variable diameter spiral cooling tube 210, and the external circulation water supply part 240 is located outside the plasma mass spectrometer 40, the outer frame body 220 and the ion flow shell 600 are detachably connected or fixedly connected, and the detachable connection can be achieved by using screws and screw holes, or by welding or integral casting. At the same time, the outer frame body 220 and the variable diameter spiral cooling tube 210 are detachably connected, and the variable diameter spiral cooling tube 210 is nested in the outer wall of the sampling cone 610 or / and the outer wall of the intercepting cone, and the variable diameter spiral cooling tube 210 is coaxially arranged with the sampling cone 610.

[0066] Furthermore, one end of the connecting pipe 230 is connected to the variable diameter spiral cooling pipe 210, and the external circulating water supply unit 240 is located outside the plasma mass spectrometer 40. The other end of the connecting pipe 230 passes through the ion flow housing 600 and communicates with the external circulating water supply unit 240. The external circulating water supply unit 240 contains a coolant. Specifically, the coolant can be cooling water or a liquid with a cooling effect. The coolant needs to be regularly replaced or a coolant added to maintain the cooling effect of the coolant. Specifically, the connecting pipe 230 can be a hose.

[0067] Specifically, the external circulating water supply unit 240 is electrically connected to the adaptive adjustment module 500. A second water pump 242 is provided within the external circulating water supply unit 240. The adaptive adjustment module 500 electrically connects the electromagnetic flow control valve of the second water pump 242, and the electromagnetic flow control valve on the second water pump 242 controls the opening and closing of the second water pump 242. The electromagnetic flow control valve also controls the flow rate of water flowing out of the second water pump 242.

[0068] The interface cooling portion 200 provided in the embodiment of the present application utilizes the external circulating water supply portion 240 to provide cooling liquid, and the cooling liquid is passed into the connecting pipe 230 at a preset flow rate. The cooling liquid enters the liquid inlet of the variable diameter spiral cooling pipe 210 through the connecting pipe 230, and the cooling liquid takes out the heat of the variable diameter spiral cooling pipe 210. Through the principle of heat transfer, the heat of the sampling cone 610 and the skimmer cone is reduced. The cooling liquid then flows back from the liquid outlet of the variable diameter spiral cooling pipe 210 through the connecting pipe 230 to the external circulating water supply portion 240 to achieve heat exchange. The auxiliary cooling system has a simple structure and strong applicability. It can cool the key heat source area (sampling cone 610 and skimmer cone), and the circulation of the cooling liquid can achieve a continuous cooling effect, thereby improving the cooling effect on the key heat source area (sampling cone 610 and skimmer cone), thereby reducing carbon deposition, ion recombination and signal drift at the sampling cone 610 and the skimmer cone, and improving resolution and sensitivity.

[0069] Furthermore, the pipeline path of the variable diameter spiral cooling tube 210 is a conical spiral. According to the conical spiral pipeline paths of the sampling cone 610 and the skimmer cone, the variable diameter spiral cooling tube 210 is configured to be compatible with the sampling cone 610 or the skimmer cone, and can better fit the outer walls of the sampling cone 610 and the skimmer cone, thereby improving the cooling effect.

[0070] Furthermore, the cross section of the flow channel of the variable diameter spiral cooling tube 210 is elliptical, which can increase the contact area between the variable diameter spiral cooling tube 210, the sampling cone 610, and the skimmer cone, thereby further improving the cooling effect.

[0071] Furthermore, two sets of outer frames 220 are provided, with the two sets of outer frames 220 being located on the liquid inlet side and the liquid outlet side of the variable diameter spiral cooling tube 210, respectively. Providing two sets of outer frames 220 allows the outer frames 220 to be stably fixed within the ion flow housing 600. The outer frames 220 secure the variable diameter spiral cooling tube 210, allowing the variable diameter spiral cooling tube 210 to remain relatively fixed and in close contact with the sampling cone 610 or the skimmer cone, thereby cooling the sampling cone 610 and the skimmer cone.

[0072] In a preferred embodiment, see Figure 13In order to make the variable diameter spiral cooling tube 210 and the sampling cone 610 or the skimmer cone fit together and be located on the same axis, the outer frame body 220 includes an inner connecting ring 221, an adjustable connecting rod 222 and a fixing screw 223. The inner connecting ring 221 is sleeved on the inner wall of the ion flow shell 600, one end of the adjustable connecting rod 222 is connected to the inner connecting ring 221, and the other end of the adjustable connecting rod 222 is connected to the variable diameter spiral cooling tube 210. The fixing screw 223 is arranged on the inner connecting ring 221, and the fixing screw 223 passes through the inner connecting ring 221 and is connected to the ion flow shell 600. As a more detailed description, taking the adjustable connecting rod 222 as an example, the two sets of the inner connecting rings 221 are sleeved in the ion flow housing 600, and the inner connecting rings 221 are connected to the ion flow housing 600 by the fixing screws 223. Specifically, both the inner connecting ring 221 and the ion flow housing 600 have threaded holes, and the fixing screws 223 are fixed through the threaded holes; then, the variable diameter spiral cooling tube 210 is pre-sleeved and nested on the outer wall of the sampling cone 610, and one end of the adjustable connecting rod 222 is installed on the inner connecting ring 221. On, and keep it fixed, one end of the adjustable connecting rod 222 is clamped on the variable diameter spiral cooling tube 210, and the two adjustable connecting rods 222 are respectively located on the liquid inlet pipe 112 side and the liquid outlet pipe 112 side of the variable diameter spiral cooling tube 210. By fine-tuning the two adjustable connecting rods 222 to stretch up and down in the vertical direction, each circle of the spiral tube of the variable diameter spiral cooling tube 210 is fit together with the variable diameter spiral cooling tube 210, stopping adjusting the adjustable connecting rod 222 and keeping it fixed, the nesting setting of the variable diameter spiral cooling tube 210 can be completed, which is convenient for subsequent cooling and heat exchange.

[0073] The external circulating water supply unit 240 includes a water tank 241 and a second water pump 242. The second water pump 242 is disposed within the water tank 241. The first hose passes through the water tank 241 and is connected to the second water pump 242. The second hose is in communication with the water tank 241. When the second water pump 242 is activated, it draws coolant from the water tank 241 into the first hose. The returned coolant then flows back into the water tank 241 through the second hose.

[0074] As a further detailed explanation, in order to facilitate the adjustment of the adjustable connecting rod 222, the adjustable connecting rod 222 includes a first connecting rod, a second connecting rod and a spiral adjustment column. The first connecting rod is arranged on the inner connecting ring 221, and one end of the second connecting rod can be slidably sleeved in the first connecting rod. The other end of the second connecting rod is connected to the variable diameter spiral cooling tube 210. The spiral adjustment column is arranged on the side wall of the first connecting rod, and one end of the spiral adjustment rod passes through the side wall of the first connecting rod and is pushed onto the side wall of the second connecting rod. By reversing the spiral adjustment rod, the spiral adjustment rod is in a relaxed state, so that the second connecting rod can slide inside the first connecting rod. The second connecting rod is fine-tuned to slide inside the first connecting rod, driving the variable-diameter spiral cooling tube 210 and the outer surface of the sampling cone 610 to fit together. When in the fitting state, the spiral adjustment rod is rotated forward, and the front end of the spiral adjustment rod passes through the side wall of the first connecting rod and presses against the side wall of the second connecting rod. The spiral adjustment rod is continued to be rotated so that the front end of the spiral adjustment rod squeezes the second connecting rod, so that the second connecting rod and the first connecting rod are in close contact with each other and remain relatively fixed.

[0075] Specifically, one end of the first connecting rod is a threaded column, and a threaded hole is provided on the inner connecting ring 221. The end of the first connecting rod with the threaded column can be screwed into the threaded hole. One end of the second connecting rod has a clamp, and the clamp can be fixed on the variable diameter spiral cooling tube 210.

[0076] In a preferred embodiment, the connecting pipe 230 includes a first hose and a second hose. The first hose is provided with a first sleeve and a second sleeve. One end of the first hose is connected to the liquid inlet of the variable diameter spiral cooling pipe 210 through the first sleeve. The second sleeve is provided on the ion flow housing 600. The other end of the first hose is connected to the second sleeve and is connected to the external circulating water supply unit 240 through the second sleeve. The second hose is provided with a third sleeve and a fourth sleeve. One end of the second hose is connected to the liquid outlet of the variable diameter spiral cooling pipe 210 through the third sleeve. The fourth sleeve is provided on the ion flow housing 600. The other end of the second hose is connected to the fourth sleeve and is connected to the external circulating water supply unit 240 through the fourth sleeve. The first sleeve mainly serves to connect and seal the first hose to the variable diameter spiral cooling pipe 210. The second sleeve mainly plays the role of connecting and bridging. The second sleeve passes through the ion flow shell 600 and the plasma mass spectrometer at the same time. The first hose and the second hose each have two sections, and one section is located inside the ion flow shell 600, and the other section is located outside the plasma mass spectrometer 40. The first hose and the second hose located inside the ion flow shell 600 are connected to one end of the second sleeve and sealed to prevent liquid leakage. The first hose and the second hose located outside the plasma mass spectrometer 40 are connected to the other end of the second sleeve and sealed to prevent liquid leakage.

[0077] In some embodiments, the plasma mass spectrometer 40 is further provided with an RF power supply PCB. The RF power supply has high power (typically 1.5-2 kW). The RF power supply PCB generates a large amount of heat during prolonged operation and is a key heat source area of ​​the plasma mass spectrometer 40. To reduce the temperature of the RF power supply PCB, the RF cooling unit 300 is used to cover the surface of the RF power supply PCB to dissipate heat from the RF power supply PCB.

[0078] In a possible embodiment, since the RF power supply PCB board is not suitable for water cooling, see Figure 14The RF cooling unit 300 includes a plurality of heat dissipation substrates 310, heat pipes 320, fins 330, and a centrifugal fan 340. The plurality of heat dissipation substrates 310 are evenly arranged along a preset spacing. The heat dissipation substrates 310 are in contact with the RF power PCB. The plurality of heat dissipation substrates 310 can quickly transfer heat from the RF power PCB and are easy to install on the surface of the RF power PCB. The heat pipes 320 are arranged between adjacent heat dissipation substrates 310, and the heat pipes 320 and the heat dissipation substrates 310 are in contact with each other. The heat pipes 320 can quickly transfer heat from one end of the heat dissipation substrate 310 to the other end. The fins 330 are located on one side of the heat dissipation substrate 310, the heat pipes 320 are connected to the fins 330, and a plurality of fins 330 are evenly arranged. The fins 330 mainly play a role in heat dissipation. The centrifugal fan 340 is arranged on a side close to the fins 330. By adopting an air cooling method, the heat of the RF power PCB board can be quickly dissipated, the RF power PCB board is cooled, and the poor stability of the radio frequency power supply on the RF power PCB board caused by high temperature is avoided.

[0079] Specifically, the adaptive adjustment module 500 is electrically connected to the centrifugal fan 340 to control the opening and closing of the circuit of the centrifugal fan 340. Simultaneously, it also controls the speed of the centrifugal fan 340, thereby adjusting the cooling efficiency of the RF cooling unit 300. Controlling the opening and closing of the circuit of the centrifugal fan 340, or controlling the speed of the centrifugal fan 340, is a conventional control method and technology and will not be further described here.

[0080] In a preferred embodiment, the heat sink substrate 310 is tilted, and the angle between the heat sink substrate 310 and the RF power PCB is 15°-45°. When the heat sink substrates 310 are arranged at an angle of 15°-45°, a stepped flow channel is formed, forcing the airflow to generate turbulence (Reynolds number Re>2300) in the gap between the substrates. Compared to parallel plate laminar flow (Re<2000), the convective heat transfer coefficient under turbulent conditions is increased by 3-5 times, significantly reducing the surface temperature of the RF power PCB.

[0081] Specifically, the angle between the heat dissipation substrate 310 and the RF power PCB is 30°, and the surface temperature of the RF power PCB is reduced by about 20% compared with that when the PCB is parallel to the heat dissipation substrate 310 .

[0082] As a further description, the adaptive adjustment module 500 includes an initial adjustment module 510 and a gradient adjustment module 520. The initial adjustment module 510 is electrically connected to the temperature feedback module 400, and the initial adjustment module 510 is electrically connected to the partition cooling unit 10, and the gradient adjustment module 520 is electrically connected to the initial adjustment module 510. When the plasma mass spectrometer 40 is started, the initial adjustment module 510 is also started synchronously, and the partition cooling unit 10 is regulated to start by the initial adjustment module 510. Specifically, the atomizing cooling part 100, the interface cooling part 200 and the radio frequency cooling part 300 are started synchronously, mainly for detecting whether the atomizing cooling part 100, the interface cooling part 200 and the radio frequency cooling part 300 are in normal working state; for example, regulating the DC power supply 132 in the atomizing cooling part 100 and the semiconductor refrigeration part 131 It is in a connected state. Taking the semiconductor refrigeration component 131 of TEC1-12706 as an example, the initial starting current of the DC power supply 132 is 2A, and a small current is used for starting; the second water pump 242 in the external circulation water supply part 240 of the interface cooling part 200 is regulated to start, and the flow rate of the cooling water is controlled to 3L / min through the electromagnetic flow control valve, and the water flow is a small flow cooling; the centrifugal fan 340 in the RF cooling part 300 is regulated to turn on, and the speed of the centrifugal fan 340 is regulated to 2000 rpm, which is in a low speed state.

[0083] As the plasma mass spectrometer 40 continues to work, the temperature of the nebulizer 700 area, the plasma interface area and the RF power supply 800 area continues to rise, and cooling adjustment is required through the gradient adjustment module 520. The gradient adjustment module 520 includes a first-level gradient adjustment 521, a second-level gradient adjustment 522 and a third-level gradient adjustment 523. When the nebulizer 700 area, the plasma interface area and the RF power supply 800 area are in different temperature ranges, different temperature adjustment modes are activated.

[0084] A cooling method comprising

[0085] Step S1: synchronously collecting temperature data of the atomizer 700 area, the plasma interface area, and the radio frequency power supply area through the temperature monitoring unit 20;

[0086] Step S2: The temperature feedback module 400 receives the real-time temperature data signal, compares the real-time temperature data with the standard temperature data, and if abnormal temperature data is found, locates the source of the temperature abnormality according to the temperature data signal transmission source, and generates a corresponding temperature adjustment signal;

[0087] Step S3: The adaptive adjustment module 500 receives and responds to the temperature adjustment signal, adjusts the operating parameters of the partitioned cooling unit 10 in real time according to the temperature adjustment signal, and starts the corresponding cooling part until the temperature of all areas returns to the set range.

[0088] In a possible embodiment, the gradient adjustment module 520 includes a first-level gradient adjustment 521, a second-level gradient adjustment 522, and a third-level gradient adjustment 523; specifically, the first-level gradient adjustment 521 is: the current of the DC power supply 132 is increased from 2A of the initial starting current to 4A, the flow rate of the cooling water of the electromagnetic flow control valve is increased from 3L / min to 5L / min, and the speed of the centrifugal fan 340 is increased from 2000 rpm to 4000 rpm; the second-level gradient adjustment 522 is: the current of the DC power supply 132 is increased from 2A to 4A, the flow rate of the cooling water of the electromagnetic flow control valve is increased from 3L / min to 5L / min, and the speed of the centrifugal fan 340 is increased from 2000 rpm to 4000 rpm; The flow rate of the cooling water of the electromagnetic flow control valve increases from 4A to 6A, the flow rate of the cooling water of the electromagnetic flow control valve increases from 5L / min to 8L / min, and the speed of the centrifugal fan 340 increases from 4000 rpm to 6000 rpm; the three-level gradient adjustment 523 is: the current of the DC power supply 132 increases from 6A of the initial starting current to 9A, the flow rate of the cooling water of the electromagnetic flow control valve increases from 8L / min to 12L / min, and the speed of the centrifugal fan 340 increases from 6000 rpm to 9000 rpm.

[0089] Among them, when the temperature of the atomizer 700 area is -10°C to 10°C, or the temperature of the plasma interface area is 5000°C to 7000°C, or the temperature of the RF power area is 10°C to 30°C, the gradient adjustment module 520 performs a first-level gradient adjustment 521; when the temperature of the atomizer 700 area is 10.1°C to 30°C, or the temperature of the plasma interface area is 7000.1°C to 9000°C, or the temperature of the RF power area is 30.1°C to 45°C, the gradient adjustment module 520 performs a second-level gradient adjustment 522; when the temperature of the atomizer 700 area is greater than 30.1°C, or the temperature of the plasma interface area is greater than 9000.1°C, or the temperature of the RF power area is greater than 45.1°C, the gradient adjustment module 520 performs a third-level gradient adjustment 523.

[0090] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A cooling system for ICP-MS, characterized in that: include A partitioned cooling unit, comprising an atomizing cooling unit, an interface cooling unit, and a radio frequency cooling unit, wherein the atomizing cooling unit is cooled by semiconductor refrigeration, the interface cooling unit is cooled by spiral tube water, and the radio frequency cooling unit is cooled by air-cooled diversion; A temperature monitoring unit, which is integrated with the atomizing cooling unit, the interface cooling unit, and the radio frequency cooling unit, and is used to collect temperature data of each area in real time; The temperature control unit includes a temperature feedback module and an adaptive adjustment module. The temperature feedback module is electrically connected to the temperature monitoring unit. The temperature feedback module is used to compare the difference between real-time temperature data and standard temperature data and locate the source of temperature anomaly. The adaptive adjustment module is electrically connected to the temperature feedback module, and the adaptive adjustment module is electrically connected to the partitioned cooling unit, and is used to adjust the operating parameters of the partitioned cooling unit in real time.

2. The cooling system for ICP-MS according to claim 1, wherein: The atomization cooling unit includes an atomization introducer, an argon gas intervention chamber and a refrigeration component; The atomizing introducer comprises a liquid chamber, a liquid pipe, a mixing tank, an introduction pipe and a fine capillary tube which are sequentially connected. The liquid chamber contains a sample solution, and the end of the fine capillary tube extends into the atomizing chamber of the atomizer; The argon intervention chamber includes an air chamber and an air pipe that are interconnected. Argon is stored in the air chamber, and the air pipe is connected to the liquid pipe for mixing the argon and the sample solution into the mixing tank. The refrigeration assembly includes a semiconductor refrigeration element and a DC power supply. The refrigeration surface of the semiconductor refrigeration element is in contact with the outer wall of the mixing tank. The DC power supply is electrically connected to the semiconductor refrigeration element, and the DC power supply is electrically connected to the adaptive adjustment module.

3. The cooling system for ICP-MS according to claim 2, wherein: The refrigeration assembly also includes a water cooler, one end of which is in contact with the heating surface of the semiconductor refrigeration component; the water cooler includes a cold water tank, a first water pump and a coil, the cold water tank is arranged on one side of the atomizing introducer, the first water pump is arranged in the cold water tank, the coil is spirally arranged on one side of the heating surface of the semiconductor refrigeration component, and the liquid inlet end of the coil is connected to the first water pump, the liquid outlet end of the coil extends into the cold water tank, and the first water pump is electrically connected to the adaptive adjustment module.

4. The cooling system for an ICP-MS according to claim 1, wherein the ICP-MS is provided with an ion flow housing, a sampling cone, and a skimmer cone, wherein the sampling cone and the skimmer cone are sequentially coaxially arranged in the ion flow housing, wherein: The interface cooling part includes a variable diameter spiral cooling pipe, an outer frame body, a connecting pipe and an external circulation water supply part. The variable diameter spiral cooling pipe is nested in the outer wall of the sampling cone and / or the outer wall of the intercepting cone. The outer frame body is embedded in the inner wall of the ion flow shell, and the outer frame body is detachably connected to the variable diameter spiral cooling pipe. One end of the connecting pipe is sleeved with the variable diameter spiral cooling pipe. The external circulation water supply part is located on the outside of the plasma mass spectrometer. The other end of the connecting pipe passes through the ion flow shell and is connected to the external circulation water supply part. The external circulation water supply part is electrically connected to the adaptive adjustment module.

5. The cooling system for ICP-MS according to claim 4, wherein: The outer frame body includes an inner connecting ring, an adjustable connecting rod and a fixing screw. The inner connecting ring is sleeved on the inner wall of the ion flow shell, one end of the adjustable connecting rod is connected to the inner connecting ring, and the other end of the adjustable connecting rod is connected to the variable diameter spiral cooling tube. The fixing screw is arranged on the inner connecting ring, and the fixing screw passes through the inner connecting ring and is connected to the ion flow shell.

6. The cooling system for ICP-MS according to claim 1, wherein: The RF cooling unit includes several heat dissipation substrates, heat pipes, fins and centrifugal fans. The several heat dissipation substrates are evenly arranged along a preset spacing. The heat dissipation substrates and the RF power supply are in contact with each other. The heat pipes are arranged between adjacent heat dissipation substrates, and the heat pipes and the heat dissipation substrates are in contact with each other. The fins are located on one side of the heat dissipation substrates, the heat pipes are connected to the fins, and the centrifugal fan is arranged on the side close to the fins.

7. The cooling system for ICP-MS according to claim 6, wherein: The heat dissipation substrate is tilted, and the angle between the heat dissipation substrate and the RF power supply is 15° to 45°.

8. The cooling system for ICP-MS according to claim 1, wherein The adaptive adjustment module includes an initial adjustment module and a gradient adjustment module. The initial adjustment module is electrically connected to the temperature feedback module, and the initial adjustment module is electrically connected to the partitioned cooling unit. The gradient adjustment module is electrically connected to the initial adjustment module.

9. A cooling method for ICP-MS, applied to the cooling system for ICP-MS according to claim 8, characterized in that: include Step S1: synchronously collecting temperature data of the atomizer area, the plasma interface area, and the radio frequency power supply area through the temperature monitoring unit; Step S2: The temperature feedback module receives the real-time temperature data signal, compares the real-time temperature data with the standard temperature data, and if abnormal temperature data appears, locates the source of the temperature abnormality according to the temperature data signal transmission source, and generates a corresponding temperature adjustment signal; Step S3: The adaptive adjustment module receives and responds to the temperature adjustment signal, adjusts the operating parameters of the partitioned cooling unit in real time according to the temperature adjustment signal, and starts the corresponding cooling unit until the temperature of all areas returns to the set range.

10. The cooling method for ICP-MS according to claim 9, characterized in that: include The gradient adjustment module includes a first-level gradient adjustment, a second-level gradient adjustment and a third-level gradient adjustment; Wherein, when the temperature of the atomizer area is -10°C to 10°C, or the temperature of the plasma interface area is 5000°C to 7000°C, or the temperature of the RF power supply area is 10°C to 30°C, the gradient adjustment module performs a first-level gradient adjustment; When the temperature of the atomizer area is 10.1°C to 30°C, or the temperature of the plasma interface area is 7000.1°C to 9000°C, or the temperature of the RF power supply area is 30.1°C to 45°C, the gradient adjustment module performs secondary gradient adjustment; When the temperature of the atomizer area is greater than 30.1° C., or the temperature of the plasma interface area is greater than 9000.1° C., or the temperature of the radio frequency power supply area is greater than 45.1° C., the gradient adjustment module performs three-level gradient adjustment.

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