Wafer drying apparatus

Abstract

The application discloses a wafer drying device, which comprises a water collecting seat, a containing cavity of the water collecting seat is provided with a fixing sleeve; a lifting seat is sleeved on the outer periphery of the fixing sleeve, and the lifting seat is slidingly arranged relative to the fixing sleeve; a closed space is formed between the lifting seat and the fixing sleeve, and an air source is connected to the closed space, so that the lifting seat can be lifted under the action of the change of the air pressure in the closed space; and a waterproof cover is fixedly connected with the lifting seat to be lifted with the lifting seat. The wafer drying device can be lifted by controlling the change of the air pressure through the external air source, the number of mechanical components is reduced, the shaking problem during lifting is effectively eliminated, the motion precision is improved, liquid splashing and equipment pollution are avoided, the integrated design of the air pressure driving mechanism significantly reduces the space occupation in the vertical direction, and the equipment installation height requirement is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a wafer drying device. BACKGROUND

[0002] In the field of semiconductor manufacturing, the cleaning and drying process after the wafer chemical-mechanical polishing (CMP) process is crucial to the yield of chips. At present, wafer drying devices are mainly divided into vertical drying and horizontal drying. Among them, the horizontal drying technology fixes the wafer on a rotating table, rotates it at high speed, and cooperates with deionized water spraying and gas blowing to realize the drying of the wafer surface.

[0003] In the prior art, the wafer needs to rely on the clamping mechanism to provide stable support when rotating at high speed, so as to overcome the centrifugal force and prevent the wafer from being thrown out of the rotating table. At the same time, in order to cooperate with the mechanical hand to complete the wafer loading and unloading operation, the clamping mechanism needs to be released in time during the wafer taking and placing stage. In addition, in order to avoid the splashing of liquid on the surface of the wafer when rotating at high speed, a water baffle higher than the wafer needs to be configured, and the water baffle needs to be lowered during the wafer taking and placing to prevent interference with the movement of the mechanical hand.

[0004] However, the current design uses double driving parts to drive the water baffle to rise and fall, and because there are only two supporting points, the water baffle shakes when moving. At the same time, this structure occupies a large space in the box, has a higher requirement for the installation height of the equipment, increases the complexity of the structure of the equipment and the number of parts, not only increases the manufacturing cost, but also reduces the stability and maintenance convenience of the equipment. SUMMARY

[0005] The present application discloses a wafer drying device which can simplify the driving structure, reduce the number of parts, reduce the manufacturing cost and failure rate, and improve the maintenance convenience of the equipment.

[0006] In order to achieve the above purpose, the present application discloses a wafer drying device, comprising:

[0007] A water collecting seat is provided with a containing cavity, and a fixed sleeve is arranged in the containing cavity;

[0008] A lifting seat is sleeved on the outer periphery of the fixed sleeve, and the lifting seat is slidingly arranged relative to the fixed sleeve. A closed space is formed between the lifting seat and the fixed sleeve, and an air source is connected to the closed space, so that the lifting seat can be lifted under the action of the change of air pressure in the closed space;

[0009] A waterproof cover is fixedly connected with the lifting seat to lift with the lifting seat.

[0010] In a possible implementation, the lifting seat comprises a sliding sleeve, an inner wall of the sliding sleeve is provided with a first annular groove, and / or an outer wall of the fixed sleeve is provided with a second annular groove, so that the closed space is formed between the sliding sleeve and the fixed sleeve.

[0011] In a possible implementation, the inner wall of the sliding sleeve is provided with the first annular groove, the outer wall of the fixed sleeve is provided with the second annular groove, a first sealing ring is arranged above the first annular groove of the inner wall of the sliding sleeve, and a second sealing ring is arranged below the second annular groove of the outer wall of the fixed sleeve, the first sealing ring, the second sealing ring, the first annular groove and the second annular groove jointly form the closed space.

[0012] In a possible implementation, the closed space is configured such that the lifting seat is capable of moving in a direction away from the water collecting seat when the air pressure in the closed space increases.

[0013] In a possible implementation, a first reset member is arranged between the lifting seat and the water collecting seat, and the first reset member is used to provide a reset force for the lifting seat to move towards the water collecting seat.

[0014] In a possible implementation, a guide hole is arranged on the lifting seat, and the wafer drying device further comprises a guide member, the guide member is arranged through the guide hole, so that the lifting seat moves under the reset force of the first reset member.

[0015] In a possible implementation, a lifting flange is arranged on the lifting seat, and a flange hole of the lifting flange is formed as the guide hole.

[0016] The guide member is a limiting screw, the limiting screw is fixed through the flange hole of the lifting flange and the bottom of the water collecting seat, the limiting screw is provided with a limiting sleeve with an opening downward, the first reset member is a first spring, the first spring is sleeved on the limiting screw and partially located in the limiting sleeve, one end of the first spring abuts against the lifting flange, and the other end of the first spring abuts against the bottom wall of the limiting sleeve.

[0017] In a possible implementation, the lifting seat further comprises a support arm arranged on the outer periphery of the sliding sleeve, and the waterproof cover is fixed on the support arm through a connecting member.

[0018] In a possible implementation, the support arms are a plurality of support arms, the plurality of support arms are evenly arranged around the outer periphery of the sliding sleeve, the support arms are provided with mounting grooves, the bottom edge of the waterproof cover is inserted into the mounting grooves, the side wall of the cover body of the waterproof cover is provided with an insertion hole, and the connecting piece is fixed to the support arm and inserted into the insertion hole to fix the waterproof cover and the support arm.

[0019] In a possible implementation, the cover body of the waterproof cover is a cylindrical structure with open ends, and the upper part of the cylindrical structure gradually decreases in diameter relative to the lower part.

[0020] In a possible implementation, the water collecting seat includes an outer cylinder body, and the outer diameter of the waterproof cover is smaller than the inner diameter of the outer cylinder body of the water collecting seat.

[0021] Compared with the prior art, the application has the following beneficial effects:

[0022] In the wafer drying device provided in the application, the containing cavity of the water collecting seat is provided with a fixed sleeve to provide stable axial guidance for the lifting seat and ensure the accuracy of the lifting movement. The lifting seat is sleeved on the outer periphery of the fixed sleeve, and the lifting seat is arranged to slide relative to the fixed sleeve, and a sealed space is formed between the two. The lifting is realized by controlling the change of air pressure in the sealed space through an external air source. The waterproof cover is fixed to the lifting seat and synchronously lifted with the lifting seat. Compared with the traditional double-drive driving mode, the driving structure is simplified, the number of mechanical parts is reduced, the shaking problem during lifting is effectively eliminated, the movement accuracy of the waterproof cover is improved, liquid splashing pollution of the equipment is avoided, and the integration design of the air pressure driving mechanism significantly reduces the vertical space occupation, reduces the equipment installation height requirement, also reduces the manufacturing cost and failure rate, and improves the equipment maintenance convenience. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0024] Figure 1 A structure schematic view of a wafer drying device provided in the embodiment of the application;

[0025] Figure 2 A structure schematic view of a lifting seat of a wafer drying device provided in the embodiment of the application;

[0026] Figure 3 A sectional view of a lifting seat of a wafer drying device provided in the embodiment of the application;

[0027] Figure 4 A structure diagram of a water collecting seat of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0028] Figure 5 A sectional view of a water collecting seat of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0029] Figure 6 A structure diagram of a waterproof cover of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0030] Figure 7 A front view of a waterproof cover of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0031] Figure 8 A sectional view of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0032] Figure 9 A partial sectional view of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0033] Figure 10 A structure diagram of a wafer seat of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0034] Figure 11 A structure diagram of a clamping piece of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0035] Figure 12 A structure diagram of a clamping piece of a wafer drying device provided by an embodiment of the present application is shown in the figure;

[0036] Figure 13 A structure diagram of a clamping piece of a wafer drying device provided by an embodiment of the present application is shown in the figure.

[0037] Explanation of reference signs:

[0038] 10 - water collecting seat; 11 - containing cavity; 12 - fixing sleeve; 121 - second ring groove; 122 - second sealing ring;

[0039] 20 - lifting seat; 21 - closed space; 22 - sliding sleeve; 221 - first ring groove; 222 - first sealing ring; 223 - threaded hole; 224 - external joint; 23 - guide hole; 231 - flange hole; 24 - lifting flange; 25 - support arm; 251 - mounting groove;

[0040] 30 - clamping assembly; 31 - support; 311 - rotating disc; 3111 - extension; 31111 - drive member mounting hole; 31111a - stepped surface; 31112 - ejector rod; 311121 - ejector rod head; 312 - rotating shaft; 313 - protective cover; 32 - clamping member; 321 - clamping jaw; 3211 - clamping surface; 322 - compensation hole; 33 - wafer seat; 331 - assembly groove; 332 - boss; 3321 - water-repellent groove; 333 - guide post; 334 - inclined surface; 335 - abutting portion;

[0041] 40 - waterproof cover; 41 - insertion hole; 42 - unlocking portion;

[0042] 50 - first reset member; 51 - first spring;

[0043] 60 - guide member; 61 - limiting screw; 611 - limiting sleeve;

[0044] 70 - connecting member;

[0045] 80 - clamping drive member; 81 - second spring;

[0046] 90 - detection sensor; 91 - transmitting end. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0048] In the present application, the terms “mounting”, “setting”, “provided with”, “connection”, “connected” should be understood broadly. For example, it can be fixed connection, detachable connection, or integral configuration; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication between two devices, elements or components. Those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0049] In addition, the terms “first”, “second” and the like are mainly used to distinguish different devices, elements or components (the specific types and configurations can be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of “multiple” is two or more.

[0050] In the field of semiconductor manufacturing, the cleaning and drying process after the chemical-mechanical polishing (CMP) process of the wafer is crucial to the yield of the chip. At present, the wafer drying device mainly includes vertical drying and horizontal drying. Among them, the horizontal drying technology fixes the wafer on the rotating table, rotates it at high speed, and cooperates with the deionized water spraying and gas blowing to realize the drying of the wafer surface.

[0051] In the prior art, the wafer needs to rely on the clamping mechanism to provide stable support when rotating at high speed, so as to overcome the centrifugal force and prevent the wafer from being thrown out of the rotating table. At the same time, in order to cooperate with the mechanical hand to complete the wafer loading and unloading operation, the clamping mechanism needs to be released in time during the wafer taking and placing stage. In addition, in order to avoid the liquid on the surface of the wafer splashing and polluting the equipment during high-speed rotation, a water baffle higher than the wafer needs to be configured, and the water baffle needs to be lowered during the wafer taking and placing to prevent interference with the movement of the mechanical hand.

[0052] However, the current design uses double driving parts to drive the water baffle to rise and fall, and because there are only two supporting points, the water baffle shakes when moving. At the same time, this structure occupies a large space in the box, has high requirements for the installation height of the equipment, increases the complexity of the structure of the equipment and the number of parts, not only increases the manufacturing cost, but also reduces the stability and maintenance convenience of the equipment.

[0053] In view of this, some embodiments of the present application provide a wafer drying device which can control the change of air pressure by an external air source to realize lifting and falling, reduce the number of mechanical parts, effectively eliminate the shaking problem during lifting and falling, improve the movement precision, avoid liquid splashing and polluting the equipment, and at the same time, the integrated design of the air pressure driving mechanism significantly reduces the vertical space occupation and reduces the installation height requirement of the equipment.

[0054] The present application will be described in detail below through specific embodiments:

[0055] The wafer drying device of the embodiments of the present application, as shown in Figures 1 to 13 The wafer drying device, comprising:

[0056] The water collecting seat 10 has a containing cavity 11, and the containing cavity 11 is provided with a fixed sleeve 12;

[0057] The lifting seat 20 is sleeved on the outer periphery of the fixed sleeve 12, and the lifting seat 20 is slidingly arranged relative to the fixed sleeve 12. The lifting seat 20 and the fixed sleeve 12 form a sealed space 21, and the sealed space 21 is connected with an air source, so that the lifting seat 20 can be lifted and lowered under the action of the change of air pressure in the sealed space 21;

[0058] The water baffle 40 is fixedly connected with the lifting seat 20 to lift and lower with the lifting seat 20.

[0059] The wafer drying device provided by the embodiment of the present application is characterized in that the water collecting seat 10 is internally provided with a containing cavity 11, a fixed sleeve 12 is installed in the containing cavity 11 to form a basic support structure of the device, the fixed sleeve 12 provides axial guidance for a lifting seat 20, the lifting seat 20 is sleeved on the outer periphery of the fixed sleeve 12 to form a sealed space 21 with the fixed sleeve 12, and the lifting is driven by controlling the change of air pressure of an external air source. When the air pressure increases, the pressure in the sealed space 21 pushes the lifting seat 20 to rise, and when the air pressure decreases, the lifting seat 20 is lowered under the action of gravity or a reset mechanism.

[0060] Thus, the fixed sleeve 12 is used for guidance and uniform driving by air pressure, the traditional double driving piece driving is replaced by air pressure driving, the number of mechanical parts is reduced, the motion stability is improved, the two-point support of the double driving piece is replaced, the left and right shaking during lifting is eliminated, the motion accuracy of the waterproof cover 40 is improved, and liquid splashing to pollute the equipment is avoided. The air pressure driving mechanism is integrated between the fixed sleeve 12 and the lifting seat 20, the structure is compact, the vertical space occupation is reduced, and the equipment installation height requirement is reduced.

[0061] The sealed space 21 is connected with the external air source through an air path, an electromagnetic valve is arranged in series on the air path, the electromagnetic valve can include a on-off valve, an air inlet speed regulating valve and an air outlet speed regulating valve, and the air source provides compressed gas (dry air or nitrogen can be used), and other components such as a safety valve and a pressure air device can also be connected in series on the air path.

[0062] The lifting seat 20 is arranged to slide relative to the fixed sleeve 12 along a first direction, so that the lifting seat 20 is lifted along the first direction, and the X direction in the figure is the first direction, which is also the vertical direction in this embodiment.

[0063] In some embodiments, as shown in Figure 1 The wafer drying device further includes a clamping assembly 30, the clamping assembly 30 includes a support 31 and a clamping piece 32 connected with each other, the support 31 is rotationally arranged on the fixed sleeve 12 and is used for placing a wafer, and the clamping piece 32 is rotationally arranged on the support 31 and can move between a clamping position for clamping the wafer and an unlocking position for separating from the wafer.

[0064] The waterproof cover 40 is located at the outer periphery of the clamping assembly 30, and the waterproof cover 40 is configured to abut against the clamping piece 32 when the clamping piece 32 is in the unlocking position, or the waterproof cover 40 is separated from the clamping piece 32 when the clamping piece 32 is in the clamping position.

[0065] The fixed sleeve 12 serves as the mounting base for the clamping assembly 30, ensuring central stability during wafer rotation. The support member 31 is rotatably mounted on the fixed sleeve 12, providing a support surface for the wafer. Its center serves as the center of rotation, ensuring balance during high-speed wafer rotation. The clamping member 32 is movably connected to the support member 31, allowing it to move between a "clamping position" (holding the wafer securely) and an "unlocking position" (releasing the wafer). Furthermore, the clamping and releasing of the clamping member 32 are linked to the raising and lowering of the waterproof cover 40. The waterproof cover 40 is fixed to the outer periphery of the lifting platform 20 and rises and falls synchronously with the lifting platform 20. When the waterproof cover 40 descends to abut against the clamping member 32, it locks the clamping member 32 into the unlocked position. When the support member 31 is activated to rotate to dry the wafer, the waterproof cover 40 rises and disengages from the clamping member 32, placing the clamping member 32 in the clamping position, securing the wafer securely and ensuring a secure hold.

[0066] Furthermore, the lifting and lowering of the waterproof cover 40 and the unlocking of the clamp 32 are controlled by a single pneumatic pressure source, eliminating independent drivers and controllers, reducing the number of parts and lowering manufacturing costs. Furthermore, a single pneumatic drive replaces the coordinated operation of multiple drivers, eliminating vulnerable components such as solenoid valves and air pipes, reducing failure rates and maintenance time. Furthermore, the mechanical linkage between the waterproof cover 40 and the clamp 32 ensures synchronized operation, avoiding the timing deviations that can occur with traditional independent drives and reducing the rate of wafer clamping defects.

[0067] In one possible implementation, Figures 2 to 5 As shown, the lifting seat 20 includes a sliding sleeve 22 , the inner wall of the sliding sleeve 22 has a first annular groove 221 , the outer wall of the fixed sleeve 12 has a second annular groove 121 , and the first annular groove 221 and the second annular groove 121 are arranged opposite to each other to form a closed space 21 .

[0068] As a result, the inner wall of the sliding sleeve 22 of the lifting seat 20 is provided with a first annular groove 221, while the outer wall of the fixed sleeve 12 is correspondingly provided with a second annular groove 121. The two annular grooves are arranged opposite each other, forming an annular, enclosed space 21. When compressed gas is introduced into the enclosed space 21 from an external gas source, the gas pressure acts evenly on the inner wall of the sliding sleeve 22. Due to the presence of the first annular groove 221, the gas pressure effectively propels the sliding sleeve 22 upward axially along the fixed sleeve 12. When the gas pressure decreases, the sliding sleeve 22 descends along the fixed sleeve 12 under its own weight or the action of a return spring, achieving the lifting and lowering motion of the lifting seat 20.

[0069] An annular groove is a portion of a shaft or sleeve part where the diameter is reduced. The first annular groove 221 is located on the inner wall of the sliding sleeve 22 and is an annular concave shape. The second annular groove 121 is located on the outer wall of the fixed sleeve 12 and is also an annular concave shape. When assembled, the two grooves face each other, forming a closed, annular space 21. This space acts like an air chamber, containing compressed gas.

[0070] Compared with the traditional double-drive structure, the driving mechanism is integrated between the fixed sleeve 12 and the ring groove of the sliding sleeve 22, without the need for complex drive components, connecting rods and other components, reducing the number of parts. Not only does it reduce the manufacturing cost of the equipment, but it also reduces the failure points caused by component wear. Moreover, the air pressure driving mode of the ring groove can provide uniform driving force, reduce the shaking amplitude of the lifting seat 20 when moving, significantly improve the movement accuracy of the waterproof cover 40, effectively avoid liquid splashing to pollute the equipment, and ensure the cleanliness of the wafer drying environment.

[0071] In some embodiments, as shown in Figure 8 and Figure 9 , the inner wall of the sliding sleeve 22 is provided with a first sealing ring 222 above the first ring groove 221, and the outer wall of the fixed sleeve 12 is provided with a second sealing ring 122 below the second ring groove 121. The first sealing ring 222, the second sealing ring 122, the first ring groove 221 and the second ring groove 121 together form a closed space 21.

[0072] The first sealing ring 222 and the second sealing ring 122 are respectively arranged above the first ring groove 221 and below the second ring groove 121, and form a sealing barrier with the ring groove to maintain the integrity of the closed space 21 and reduce the risk of gas leakage. During the wafer drying process, there may be complex conditions such as temperature fluctuations and vibrations inside the equipment. The sealing ring has a certain elasticity, and during the lifting process of the sliding sleeve 22, the sealing ring can provide cushioning, and the first sealing ring 222 and the second sealing ring 122 can reduce the radial shaking between the sliding sleeve 22 and the fixed sleeve 12, improve the movement accuracy of the lifting seat 20, reduce mechanical impact, and prolong the service life of the fixed sleeve 12 and the sliding sleeve 22. Moreover, when the wafer drying device is working, liquid may splash, and the closed space 21 surrounded by the sealing ring and the ring groove can effectively block the liquid from entering the air pressure driving system.

[0073] Among them, the sealing ring can be selected from a lip seal ring or an O-shaped seal ring, which is not limited in the present application. After the two ring grooves are arranged relative to each other, a sealing element is installed on the contact surface to ensure the sealing of the space. The sealing groove in the ring groove is designed according to the specifications of the sealing ring to ensure reliable sealing of the sealing ring in the compressed state and prevent air pressure leakage from affecting the driving effect of the lifting seat 20.

[0074] In some embodiments, as shown in Figure 8 and Figure 9 , the closed space 21 is configured such that the lifting seat 20 can move in a first direction away from the water collecting seat 10 when the air pressure in the closed space 21 increases.

[0075] When the external air source fills compressed gas into the sealed space 21, the gas pressure will uniformly act on the area below the first annular groove 221 of the inner wall of the sliding sleeve 22. Since the first annular groove 221 changes the force area of the inner wall of the sliding sleeve 22, the gas pressure can be converted into an upward driving force to push the lifting seat 20 to move in the first direction (away from the water collecting seat 10). When the gas pressure in the sealed space 21 decreases, the lifting seat 20 falls downward along the fixed sleeve 12 under the action of its own gravity or the reset spring.

[0076] The lifting of the lifting seat 20 in the first direction can drive the waterproof cover 40 to quickly cover the position where the wafer is located, and can quickly return to the position where the wafer protrudes from the waterproof cover 40, facilitating the wafer loading and unloading operation of the mechanical hand, greatly shortening the loading and unloading time, and significantly improving the production efficiency. At the same time, the device structure is more reasonable and compact, and the interference risk between the waterproof cover 40 and the water collecting seat 10 during mutual movement can be avoided, and the probability of wafer collision damage can be reduced.

[0077] In some embodiments, as shown in Figure 8 and Figure 9 , a first reset member 50 is arranged between the lifting seat 20 and the water collecting seat 10, and the first reset member 50 is used to provide a reset force for the lifting seat 20 to move towards the water collecting seat 10 in the first direction.

[0078] The first reset member 50 is arranged between the lifting seat 20 and the water collecting seat 10. When the sealed space 21 is inflated to lift the lifting seat 20, the spring is compressed to store elastic potential energy. When the gas pressure decreases, the first reset member 50 releases energy to push the lifting seat 20 to stably fall back along the first direction towards the water collecting seat 10. During the reset process, the reset force of the first reset member 50 and the gas pressure form a complement, so that even in the case of air source failure or sudden pressure loss, the lifting seat 20 can be reliably reset, and the reset success rate is improved.

[0079] Moreover, the buffering effect of the first reset member 50 reduces the hard collision between the lifting seat 20 and the water collecting seat 10, reduces the wear rate of the first sealing ring 222 and the second sealing ring 122, reduces the vibration amplitude of the equipment, and ensures the reliability of the lifting of the lifting seat 20.

[0080] In other embodiments, the lifting seat 20 and the water collecting seat 10 can also not be provided with a reset member, and the lifting seat 20 directly resets and falls under the action of gravity.

[0081] In some embodiments, as shown in Figure 2 and Figure 9 , a guide hole 23 is arranged on the lifting seat 20, and the wafer drying device further comprises a guide member 60, which is arranged in the guide hole 23 to enable the lifting seat 20 to move in the first direction under the reset force of the first reset member 50.

[0082] The guide 60 and the guide hole 23 form a clearance fit, limiting the movement degree of freedom of the lifting seat 20 in the first direction, ensuring that the lifting seat 20 moves absolutely straight during lifting and resetting, and avoiding wafer position deviation caused by deflection. The rigid support of the guide 60 can effectively suppress vibration and shaking during resetting. For example, when the first resetting member 50 releases energy, the unguided structure may produce an amplitude due to inertia, and the guided structure controls the amplitude within a reasonable range by restricting lateral displacement, ensuring process stability.

[0083] In some embodiments, as shown in Figure 2 The lifting flange plate 24 is provided on the lifting seat 20, and the flange hole 231 of the lifting flange plate 24 is formed as the guide hole 23.

[0084] As shown in Figure 8 and Figure 9 The guide 60 is a limiting screw 61, the limiting screw 61 passes through the flange hole 231 of the lifting flange plate 24 and is fixed to the bottom of the water collecting seat 10, the limiting screw 61 is provided with a limiting sleeve 611 with an opening facing downward, the first resetting member 50 is a first spring 51, the first spring 51 is sleeved on the limiting screw 61 and partially located in the limiting sleeve 611, one end of the first spring 51 abuts against the lifting flange plate 24, and the other end of the first spring 51 abuts against the bottom wall of the limiting sleeve 611.

[0085] In this way, the flange hole 231 of the lifting flange plate 24 directly serves as the guide hole 23, and the limiting screw 61 not only bears the function of the guide 60 (restricting the movement of the lifting seat 20 along the screw axis), but also is fixed to the water collecting seat 10 through threads, realizing the dual functions of positioning and connection. At the same time, since the flange hole 231 of the lifting flange plate 24 has multiple flange holes 231 and is uniformly arranged around the center in the circumferential direction, each flange hole 231 can correspond to a limiting screw 61, so that the structure is more stable and the lifting of the lifting seat 20 is more reliable.

[0086] The limiting sleeve 611 is coaxially arranged with the limiting screw 61, the first spring 51 is sleeved on the limiting screw 61 and embedded in the limiting sleeve 611, the limiting sleeve 611 radially restricts the first spring 51, can suppress the lateral bending of the first spring 51 when the first spring 51 is compressed, shortens the resetting force transmission path to a straight distance, avoids the moment loss caused by eccentric transmission, reduces the shaking amplitude of the lifting seat 20 during resetting, improves the energy utilization rate, maintains the movement stability, and also protects the first spring 51.

[0087] In some embodiments, as shown in Figure 1 and Figure 8 The lifting seat 20 further includes a support arm 25 arranged on the outer periphery of the sliding sleeve 22, and the waterproof cover 40 is fixed to the support arm 25.

[0088] The support arm 25 is arranged on the outer periphery of the sliding sleeve 22, so that the installation position of the waterproof cover 40 is away from the movement track of the lifting seat 20, and the waterproof cover 40 can keep a safe distance with the guide mechanism when the waterproof cover 40 is lifted with the support arm 25, so as to avoid scratching or jamming caused by movement interference and improve the movement reliability.

[0089] The support arm 25 adopts a cantilever structure, and the weight of the waterproof cover 40 is dispersed to the circumferential direction of the sliding sleeve 22, so that the eccentric load of the lifting seat 20 is controlled within a reasonable range, and the verticality of the lifting movement is avoided. After the waterproof cover 40 is fixed through the support arm 25, the waterproof cover 40 can completely cover the key components such as the sliding sleeve 22, the guide 60 and the return spring, and form a protective structure with side shielding.

[0090] In some embodiments, as shown in Figure 1 , the support arm 25 is a plurality of support arms 25, and the plurality of support arms 25 are uniformly arranged around the outer periphery of the sliding sleeve 22. The support arm 25 is provided with a mounting groove 251, and the side wall of the cover body of the waterproof cover 40 is provided with a plug-in hole 41.

[0091] As shown in Figure 8 , the wafer drying device further comprises a connecting piece 70, the bottom edge of the waterproof cover 40 is plugged into the mounting groove 251, the connecting piece 70 is fixed to the support arm 25 and is plugged into the plug-in hole 41, so as to fix the waterproof cover 40 and the support arm 25.

[0092] The plurality of support arms 25 are arranged around the circumference of the sliding sleeve 22, so that the weight of the waterproof cover 40 is uniformly transmitted to the sliding sleeve 22 through the support arm 25, and the deflection of the lifting seat 20 caused by single-point force is avoided. The support arm 25 and the sliding sleeve 22 form an annular support framework, and when the waterproof cover 40 is impacted from the outside, the impact force is dispersed and transmitted through the plurality of support arms 25, so as to avoid local deformation.

[0093] The bottom edge of the waterproof cover 40 is inserted into the mounting groove 251 to achieve pre-positioning, and the waterproof cover 40 is further provided with a plug-in hole 41 to form a connection node. Then, the connecting piece 70 is fixed by penetrating the plug-in hole 41, and then the connecting piece 70 can be fixed on the support arm 25 by a screw or the like fixing member, so as to achieve good fixing effect and also realize dismounting function. When the lifting seat 20 moves up and down, the plurality of support arms 25 synchronously drive the waterproof cover 40 to displace. Since the support arm 25 is arranged around the circumference of the sliding sleeve 22 and each support arm 25 is provided with the connecting piece 70, the waterproof cover 40 will not tilt, so as to ensure the structural stability and sealing.

[0094] The support arm 25 can be two, three, four or the like, which is not limited in the present application, and the plurality of support arms 25 are arranged around the outer periphery of the sliding sleeve 22.

[0095] In some embodiments, as shown in Figure 6 and Figure 7As shown, the cover body of the waterproof cover 40 is a cylindrical structure with both ends open, and the upper part of the cylindrical structure gradually decreases in diameter relative to the lower part.

[0096] Specifically, the waterproof cover is cylindrical, and the upper part of the cross section gradually decreases in diameter according to a certain radian to form an arc surface. When the liquid flying outward on the wafer surface hits the inner surface of the waterproof cover, the direction of the liquid rebound is obliquely downward, avoiding the liquid from rebounding to the wafer surface again. Moreover, the inner surface area of the upper part of the waterproof cover 40 can be sprayed with a hydrophobic material. When the liquid is thrown to the inner surface of the waterproof cover, the liquid can quickly fall downward without gathering. The inner wall of the waterproof cover 40 guides the airflow and liquid to uniformly diffuse in the radial direction, avoiding vortex caused by sudden changes in cross section, so that the condensed water or splashed droplets quickly slide down along the wall surface.

[0097] In some embodiments, as shown in Figure 1 and Figure 8 The water collecting seat 10 includes an outer cylinder, and the outer diameter of the waterproof cover 40 is smaller than the inner diameter of the outer cylinder of the water collecting seat 10. The gap between the waterproof cover 40 and the water collecting seat 10 is 5mm-10mm.

[0098] Since the waterproof cover 40 needs to be lifted in the water collecting seat 10, the outer diameter of the waterproof cover 40 is smaller than the inner diameter of the outer cylinder of the water collecting seat 10, so that the waterproof cover 40 can freely move up and down in the outer cylinder of the water collecting seat 10. However, if the gap between the waterproof cover 40 and the water collecting seat 10 is too large, it will affect the air extraction effect inside the water collecting seat 10, so that the air extraction inside the water collecting seat 10 tries to extract as much clean air from the space between the wafer and the waterproof cover as possible, avoiding that the atomized liquid caused by liquid splashing moves upward to the wafer above.

[0099] Therefore, the gap between the waterproof cover 40 and the water collecting seat 10 is 5mm-10mm, which provides a radial movement space for the waterproof cover 40, avoids rigid contact with the outer cylinder of the water collecting seat 10, ensures smooth lifting movement, and at the same time prevents excessive diffusion of the air extraction airflow. The negative pressure difference formed during air extraction makes air flow from the outside to the inside of the gap, forming a self-sealing, and external dust-containing gas cannot enter the inside of the waterproof cover 40 through the gap.

[0100] The gap between the waterproof cover 40 and the water collecting seat 10 can be 5mm, 7.5mm or 10mm, which is not limited in the present application.

[0101] In some embodiments, as shown in Figure 8 and Figure 9As shown, the support 31 includes a rotating disc 311 for placing the wafer and a rotating shaft 312 arranged at the bottom of the rotating disc 311, and the rotating shaft 312 is rotationally arranged in the fixed sleeve 12. The bottom of the rotating disc 311 is arranged at the outer periphery of the upper portion of the rotating shaft 312, and a protective cover 313 is arranged at the bottom of the rotating disc 311. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22.

[0102] During the high-speed rotation drying process of the wafer, the deionized water and chemical liquid can be splashed out along the edge of the rotating disc 311. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22, forming a labyrinth seal structure, which effectively blocks the splashed liquid from entering the inside of the fixed sleeve 12. The rotating shaft 312 is rotationally arranged on the bearing seat in the fixed sleeve 12, reducing the erosion of the bearing grease by the liquid, reducing the risk of bearing rust, and prolonging the service life of the transmission system.

[0103] The relative movement between the rotating shaft 312 and the fixed sleeve 12 can generate friction particles. The protective cover 313 acts as a physical barrier to prevent these particles from rising with the airflow and contaminating the wafer surface, reducing the particle defect rate of the wafer surface, and improving the chip manufacturing yield. When rotating at high speed, the protective cover 313 guides the airflow to flow along its outer surface, forming an annular airflow barrier, reducing the turbulence below the wafer, avoiding liquid residue caused by turbulent airflow, and improving drying uniformity.

[0104] In some embodiments, as shown in Figure 1 and Figure 9 The rotating disc 311 is provided with a plurality of extensions 3111 along the circumference of the rotating center thereof, each of the extensions 3111 is provided with a wafer seat 33 for placing the wafer, and the clamping members 32 are a plurality of and movably arranged on the corresponding wafer seats 33.

[0105] The rotating disc 311 is driven to realize circumferential movement by the rotating shaft 312. The plurality of extensions 3111 are arranged circumferentially, and the wafer seat 33 is arranged at the end of each extension 3111, forming a multi-station layout. The plurality of wafer seats 33 are used to support the wafer at the same time, and each wafer seat 33 is matched with the clamping member 32, which can realize the clamping and release of the wafer in the radial direction from multiple directions.

[0106] Due to the interval arrangement of the plurality of extensions 3111, the bottom of the wafer forms an open space, and the liquid can be directly discharged downward along the edge of the wafer under the action of centrifugal force. The heat generated by the high-speed rotation of the wafer during the drying process and the heat carried by the drying gas can be quickly dissipated through the open space at the bottom of the wafer.

[0107] In some embodiments, as shown in Figure 10As shown, the wafer seat 33 is provided with an assembly groove 331 on the side away from the rotation center, and the clamping piece 32 is rotationally assembled in the assembly groove 331. The clamping piece 32 includes clamping jaws 321 which extend out of the assembly groove 331, and the plurality of clamping jaws 321 are used to simultaneously clamp the outer periphery of the wafer.

[0108] The clamping jaws 321 are synchronously clamped from multiple points on the outer periphery, and self-centering is achieved by using the principle of circumferential force balance, so as to ensure that the wafer is concentric with the rotation center. The clamping jaws 321 are connected with the assembly groove 331 through a rotating shaft, and can be quickly disassembled and replaced without complex calibration. When the rotating disc 311 rotates at a high speed, the liquid on the surface of the clamping jaws 321 flows away through the assembly groove 331, and does not affect the clamping effect of the clamping jaws 321. Moreover, the clamping jaws 321 extend out of the assembly groove 331, and the rotating part is located in the groove, so that space is saved and the structure is compact.

[0109] In some embodiments, as shown in Figure 10 The wafer seat 33 is provided with a boss 332 which is located on the same straight line as the clamping jaws 321 along the radial direction of the rotating disc 311, and a plurality of horizontal and through-hydrophobic grooves 3321 are arranged on the upper surface of the boss 332.

[0110] The wafer is placed on the boss 332 of the wafer seat 33, which further reduces the contact area with the wafer, so that the space at the bottom of the wafer is increased, which is beneficial to the rotary drying. The boss 332 is provided with a plurality of horizontal and through-hydrophobic grooves 3321 on the upper surface of the boss 332, which can timely drain the liquid between the contact surface of the wafer and the boss 332. When the rotating disc 311 rotates at a high speed, the residual liquid on the surface of the wafer is thrown to the edge under the action of centrifugal force, and the hydrophobic grooves 3321 of the boss 332 act as drainage channels to guide the liquid to quickly pass through the groove body and be discharged along the radial direction. The boss 332 and the clamping jaws 321 are radially collinear, forming a radial restraint force of the boss 332 support and the clamping jaws 321 clamping, which inhibits the radial displacement of the wafer in high-speed rotation.

[0111] In some embodiments, as shown in Figure 10 The clamping jaws 321 have a clamping surface 3211 facing the rotation center, and the clamping surface 3211 is obliquely arranged, and the upper end of the clamping surface 3211 is closer to the rotation center than the lower end of the clamping surface 3211.

[0112] The upper end of the obliquely arranged clamping surface 3211 is closer to the rotation center than the lower end of the clamping surface 3211, so that after clamping, the part of the clamping jaw 321 located on the upper side of the wafer is closer to the rotation center, and the wafer cannot continue to move upward. When the rotating disc 311 accelerates rotation, the wafer generates centrifugal force due to inertia, the inclined clamping surface 3211 will be decomposed into a downward sliding force along the inclined surface and a normal pressure force pressing the clamping surface 3211, and the vertical component force will press the wafer downward to the boss 332, which can inhibit the axial jumping of the wafer in high-speed rotation in cooperation with the support of the hydrophobic groove 3321.

[0113] In some embodiments, as Figure 10 As shown, each wafer seat 33 is provided with two guide posts 333 , which are respectively located on both sides of the assembly groove 331 . The guide posts 333 are used to guide the wafer to be placed on the boss 332 .

[0114] Wafers are often very fragile and expensive, and any scratches, wear, or cracks on their surfaces can render them scrapped or degrade their performance. Guide pins 333 provide a clear guide path for the wafer, enabling more precise placement of the wafer on boss 332. This helps ensure the wafer is positioned correctly during processing or handling, reducing process issues or product quality degradation caused by positional deviations. Guide pins 333 prevent the wafer from colliding or rubbing against other components during placement, thereby reducing the risk of damage to the wafer surface.

[0115] In some embodiments, as Figure 10 As shown, the surface of the wafer seat 33 near the rotation center forms two inclined surfaces 334 , which are symmetrically arranged along the first direction. The connection between the two inclined surfaces 334 is closer to the rotation center than other positions of the inclined surfaces 334 .

[0116] During the semiconductor manufacturing process, residual liquid can carry impurities or contaminants. If this accumulates on the front bottom of wafer holder 33, it could contact the wafer during subsequent processing, contaminating the wafer surface and affecting wafer performance and quality. The two inclined surfaces 334 allow liquid to be ejected along the slopes during rotation, effectively preventing liquid accumulation and reducing the risk of wafer contamination, thereby improving product yield.

[0117] Moreover, if liquid accumulates at the bottom of the wafer seat 33, it may affect the stability of the wafer during rotation, causing slight changes in the position of the wafer during processing, and further affecting the stability and consistency of the process. The design of the two inclined surfaces 334 allows the liquid to be thrown out along the inclined surfaces during rotation, which can ensure that the wafer seat 33 remains in a relatively stable state during rotation, helping to improve the repeatability of the process and the consistency of product quality.

[0118] In some embodiments, as Figure 11 and Figure 12 As shown, the clamping member 32 has an abutting portion 335, and the waterproof cover 40 has an unlocking portion 42. Along the first direction, the unlocking portion 42 and the abutting portion 335 are arranged opposite to each other, and the unlocking portion 42 is located above the abutting portion 335. When the unlocking portion 42 abuts against the abutting portion 335, the unlocking portion 42 can drive the clamping member 32 to rotate so that the clamping claw 321 moves in a direction away from the rotation center.

[0119] Through the relative arrangement of the unlocking portion 42 and the abutting portion 335, the unlocking portion 42 is located above the abutting portion 335, and when the two abut against each other, the clamping member 32 can be driven to rotate by the pressing or displacement of the unlocking portion 42, so that the clamping jaw 321 is automatically opened (away from the rotation center), without the need for an additional power source, and the unlocking can be triggered by the lowering of the waterproof cover 40, thereby reducing the complexity and cost of the automatic equipment.

[0120] Since the waterproof cover 40 needs to be lifted and lowered in the water collecting seat 10, the clamping jaw 321 needs to be in the clamping position when it is lifted, and needs to be opened to be in the unlocked position when it is lowered, so the lifting and lowering of the waterproof cover 40 is linked with the opening and closing of the clamping jaw 321, so that the wafer release and the lowering action of the waterproof cover 40 are completed synchronously. At the same time, the unlocking portion 42 and the abutting portion 335 are arranged in the first direction (vertical direction) relative to each other, which occupies a small radial space of the equipment, and the structure is compact and space-saving.

[0121] In some embodiments, as shown in Figure 12 and Figure 13 , the clamping member 32 and the support member 31 have a clamping driving member 80 therebetween, and the clamping driving member 80 is used to provide an action force to the clamping member 32 towards the clamping position.

[0122] The clamping driving member 80 continuously applies an action force to the clamping member 32, so that the clamping jaw 321 always maintains the clamping position towards the rotation center. When the wafer is placed on the boss 332, the clamping jaw 321 can be tightly attached to the edge of the wafer by the action force applied by the clamping driving member 80, and even if there is a slight tolerance in the size of the wafer, the clamping driving member 80 can automatically compensate for the gap, so as to avoid the wafer from shaking or falling off during rotation or transmission.

[0123] By providing a continuous action force through the clamping driving member 80, the clamping member 32 can stably maintain the clamping state after the waterproof cover 40 is separated, avoiding the problem of insufficient stability caused by the dependence on the gravity characteristics of the traditional gravity type clamping. When the wafer rotates at a high speed, the action force applied by the clamping driving member 80 ensures that the clamping member 32 is tightly attached to the periphery of the wafer, effectively balances the centrifugal force, prevents the wafer from being thrown out, significantly reduces the risk of wafer damage caused by unstable clamping, and ensures the safety of the drying process.

[0124] In some embodiments, as shown in Figure 12 and Figure 13 , the extension portion 3111 is provided with a driving member mounting hole 31111 on the side away from the rotation center, a top rod 31112 is arranged in the driving member mounting hole 31111, the clamping driving member 80 is arranged between the top rod 31112 and the driving member mounting hole 31111, and the reset force of the clamping driving member 80 is used to push the top rod 31112 towards the clamping member 32, so as to maintain the clamping member 32 in the clamping position.

[0125] The clamping driving member 80 holds the clamping member 32 in the clamping position through the jacking rod 31112, and the position accuracy of the clamping member 32 can be ensured. Since the driving member mounting hole 31111 plays a positioning role on the jacking rod 31112, the movement direction of the jacking rod 31112 is stable, and thus the clamping member 32 can be accurately returned to the preset clamping position in the resetting process, improving the consistency and accuracy of wafer clamping.

[0126] The driving member mounting hole 31111 provides a stable mounting structure for the jacking rod 31112 and the clamping driving member 80, so that the mechanical transmission of the entire clamping assembly 30 is more stable. The jacking rod 31112 is constrained in the driving member mounting hole 31111 and is not prone to shaking or deviation, so that the force of the clamping driving member 80 can be more reliably transmitted to the clamping member 32, reducing the situation that the clamping member 32 is accidentally loosened due to unstable structure, and improving the stability and reliability of equipment operation.

[0127] The clamping driving member 80 automatically holds the clamping member 32 in the clamping position, without the need for an operator to manually adjust the position of the clamping member 32 after each operation, reducing the human operation steps and the probability of operation failure caused by human factors, and improving the automation degree and efficiency of wafer loading and unloading and processing.

[0128] In some embodiments, as shown in Figure 12 and Figure 13 , the driving member mounting hole 31111 is a stepped counterbore corresponding to the clamping member 32. The jacking rod 31112 has a jacking rod head 311121 protruding from the stepped counterbore. The diameter of the jacking rod head 311121 is greater than the outer diameter of the shaft of the jacking rod 31112. The clamping driving member 80 is a second spring 81. The second spring 81 is sleeved on the jacking rod 31112. One end of the second spring 81 abuts against the jacking rod head 311121, and the other end of the second spring 81 abuts against the stepped surface 31111a of the stepped counterbore.

[0129] When the unlocking portion 42 abuts against the abutting portion 335, the unlocking portion 42 can drive the clamping member 32 to rotate, so that the jacking rod 31112 continues to move towards the stepped counterbore, and the clamping jaw 321 is in the unlocked position. When the unlocking portion 42 is away from the clamping member 32, the second spring 81 is reset, and the jacking rod head 311121 pushes the clamping member 32 to keep the clamping member 32 in the clamping position. The second spring 81 is sleeved on the jacking rod 31112 and installed by using the stepped counterbore. This structure design makes the layout of the entire clamping mechanism more compact and occupies less space.

[0130] The stepped counterbore provides a precise mounting position and movement guide for the ejector rod 31112, ensuring that the ejector rod 31112 can only move along the axis direction of the stepped counterbore. The stepped surface 31111a of the stepped counterbore provides a stable support and positioning point for the second spring 81, with one end of the second spring 81 abutting against the stepped surface 31111a and the other end abutting against the ejector rod head 311121. This allows the spring to maintain a stable posture during compression and resetting, reducing the likelihood of tilting or deviation, thereby ensuring that the spring force can be accurately transmitted to the ejector rod 31112 and the clamping piece 32, effectively achieving the resetting function of the clamping piece 32. At the same time, this structure also facilitates the installation and replacement of the spring, reducing the difficulty of equipment maintenance.

[0131] The diameter of the ejector rod head 311121 is larger than the outer diameter of the rod body, forming a shoulder structure that provides a mounting point for the second spring 81. When the second spring 81 is compressed and reset, the ejector rod head 311121 can better withstand the spring force and uniformly transmit the force to the clamping piece 32. Through the cooperation of the unlocking portion 42 and the abutting portion 335, when the unlocking portion 42 abuts against the abutting portion 335, it can drive the clamping piece 32 to rotate, causing the ejector rod 31112 to move into the stepped counterbore and achieve the unlocking of the clamping jaw 321. When the unlocking portion 42 moves away from the clamping piece 32, the second spring 81 resets and pushes the ejector rod head 311121, causing the clamping piece 32 to return to the clamping position and achieving flexible control of the unlocking and clamping states of the clamping jaw 321.

[0132] In other embodiments, the clamping drive 80 can also be a tension spring. The tension spring is arranged between the wafer seat and the clamping piece. When the clamping piece 32 rotates from the clamping position to the unlocking position, the tension spring is stretched and accumulates elastic force. When the constraint is removed (the waterproof cover is detached), the tension spring contracts and drives the clamping piece 32 to reset to the clamping position.

[0133] In some embodiments, as shown in Figure 10 The center of rotation of the clamping piece 32 and the center of gravity of the clamping piece 32 are located at the same position, so that the force with which the clamping piece 32 clamps the wafer only comes from the action force of the clamping drive 80, i.e., the force with which the clamping piece 32 clamps the wafer when the support 31 rotates is always stable.

[0134] When the clamping member 32 rotates around the rotation center, if the rotation center and the gravity center do not coincide, the gravity of the clamping member 32 itself will generate an additional moment of force, which may fluctuate with the rotation angle of the clamping member 32, thereby interfering with the stability of the force provided by the clamping drive 80. When the positions of the two coincide, the gravity will not generate an additional moment of force, and the force state of the clamping member 32 during rotation is simpler. When the clamping member 32 switches to the clamping position, the force applied by the clamping drive 80 acts uniformly on the periphery of the wafer, avoiding the instability problem caused by the gravity moment of force, especially when the wafer rotates at high speed, which can reduce the risk of slight displacement of the wafer caused by fluctuations.

[0135] When the clamping member 32 rotates during switching between the unlocked and clamped states, if the rotation center and the gravity center are offset, a large centrifugal inertia force will be generated during the movement, which may cause the rotation speed of the clamping member 32 to be uneven or lag. When the two coincide, the rotational inertia of the clamping member 32 is more balanced, and the clamping member 32 can respond more quickly to changes in external force at the moment when the waterproof cover 40 abuts or separates, reducing the delay in action.

[0136] Further, in some embodiments, as shown in Figure 11 , the clamping member 32 is provided with a compensation hole 322 to make the rotation center of the clamping member 32 coincide with the gravity center of the clamping member 32.

[0137] During the manufacturing process of the clamping member 32, the gravity center and the preset rotation center do not coincide due to uneven material density and structural asymmetry (such as local protrusions, openings, etc.). The compensation hole 322 can adjust the position of the gravity center by removing excess material from the clamping member 32: if the gravity center is offset to one side, a compensation hole 322 can be opened on the corresponding side to reduce the mass, or a hole can be opened on the opposite side to balance the moment of force by reducing the weight, so that the gravity center falls accurately on the rotation center.

[0138] After the rotation center and the gravity center coincide, the force on the wafer during the rotation of the clamping member 32 is more stable, the stress distribution is more uniform, mechanical wear and fatigue damage can be reduced, the maintenance frequency and replacement cost of the clamping assembly 30 can be reduced, and the dynamic balance of the clamping member 32 can be ensured, reducing the vibration source during rotation and reducing the vibration amplitude and noise level of the entire equipment, providing a more stable operating environment for wafer drying, and indirectly ensuring the consistency of the drying process and the chip yield.

[0139] In some embodiments, as shown in Figure 12 and Figure 13 , the wafer drying device further comprises a detection sensor 90, and the clamping member 32 has a coinciding portion with the emission end 91 of the detection sensor 90 when the clamping member 32 is in the clamping position, and the clamping member 32 avoids the emission end 91 of the detection sensor 90 when the clamping member 32 is in the unlocked position.

[0140] By detecting the coincidence and avoidance relationship between the sensor 90 and the clamping piece 32 at different positions, it can be accurately judged whether the clamping piece 32 is in the clamping position or the unlocking position, which helps to ensure that the equipment operates according to the predetermined program, and avoids process errors or equipment damage caused by misjudgment of the clamping state.

[0141] During the wafer drying process, it is crucial to accurately know whether the wafer is clamped correctly to ensure the process quality. The detection sensor 90 can feedback the state of the clamping piece 32 in real time. Once an abnormal clamping is found, such as the clamping piece 32 is not in the correct clamping position, the equipment can immediately stop running or issue an alarm, thereby preventing the wafer from shifting or falling during the drying process, improving the reliability and stability of the entire process, and reducing the scrap rate caused by wafer clamping problems.

[0142] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer drying device, characterized in that: include: A water collecting seat, the water collecting seat having an accommodating cavity, wherein a fixing sleeve is provided in the accommodating cavity; A lifting seat, the lifting seat being sleeved on the outer circumference of the fixed sleeve and slidably arranged relative to the fixed sleeve, forming a closed space between the lifting seat and the fixed sleeve, and the closed space being connected to an external air source so that the lifting seat can be raised and lowered by changes in air pressure in the closed space; A waterproof cover, the waterproof cover is fixedly connected to the lifting seat so as to rise and fall with the lifting seat; The lifting seat includes a sliding sleeve, the inner wall of the sliding sleeve has a first annular groove, and the outer wall of the fixed sleeve has a second annular groove, so that the closed space is formed between the sliding sleeve and the fixed sleeve.

2. The wafer drying device according to claim 1, wherein: The inner wall of the sliding sleeve has a first annular groove, and the outer wall of the fixed sleeve has a second annular groove. The inner wall of the sliding sleeve is located above the first annular groove and is provided with a first sealing ring, and the outer wall of the fixed sleeve is located below the second annular groove and is provided with a second sealing ring. The first sealing ring, the second sealing ring, the first annular groove and the second annular groove together form the enclosed space.

3. The wafer drying device according to claim 1, wherein: The enclosed space is configured such that the lifting seat can move in a direction away from the water collecting seat when the air pressure in the enclosed space increases.

4. The wafer drying device according to any one of claims 1 to 3, characterized in that: A first restoring member is provided between the lifting seat and the water collecting seat, and the first restoring member is used to provide a restoring force for the lifting seat to move toward the water collecting seat.

5. The wafer drying device according to claim 4, characterized in that: The lifting seat is provided with a guide hole, and the wafer drying device further comprises a guide member, which is passed through the guide hole so that the lifting seat moves under the resetting force of the first resetting member.

6. The wafer drying device according to claim 5, characterized in that: The lifting seat is provided with a lifting flange, and the flange hole of the lifting flange is formed as the guide hole; The guide member is a limit screw, which passes through the flange hole of the lifting flange and is fixed to the bottom of the water collecting seat. The limit screw is provided with a limit sleeve with an opening facing downward. The first reset member is a first spring, which is sleeved on the limit screw and partially located in the limit sleeve. One end of the first spring abuts against the lifting flange, and the other end of the first spring abuts against the bottom wall of the limit sleeve.

7. The wafer drying device according to claim 1 or 2, characterized in that: The lifting seat further comprises a support arm arranged on the outer periphery of the sliding sleeve, and the waterproof cover is fixed on the support arm via a connecting piece.

8. The wafer drying device according to claim 7, characterized in that: There are multiple support arms, and the multiple support arms are evenly arranged around the outer circumference of the sliding sleeve. The support arms are provided with mounting grooves, and the bottom edge of the waterproof cover is inserted into the mounting grooves. The side wall of the waterproof cover is provided with a plug-in hole. The connecting piece is fixed to the support arm and plugged into the plug-in hole to fix the waterproof cover and the support arm.

9. The wafer drying device according to any one of claims 1 to 3, characterized in that: The cover body of the waterproof cover is a cylindrical structure with two ends open, and the upper diameter of the cylindrical structure gradually decreases relative to the lower diameter.

10. The wafer drying device according to claim 9, wherein: The water collecting seat comprises an outer cylinder, and the outer diameter of the waterproof cover is smaller than the inner diameter of the outer cylinder of the water collecting seat.

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