A lightweight radio frequency assembly based on a ball grid array for shock resistance

Abstract

The application provides a kind of lightweight radio frequency assembly based on impact resistance ball grid array, relating to radio frequency technical field.The radio frequency assembly includes substrate, side plate, support plate, elastic piece, pop support ball, chip silicon base and BGA solder ball;Side plate is installed on substrate, multiple support plates are arranged in the inside of substrate, elastic piece is arranged between support plate and substrate, adjacent two support plates are connected by pop support ball, chip silicon base is installed on support plate, and BGA solder ball is connected between substrate and external structure.By multiple structures, the stability of radio frequency assembly is enhanced, and the weight and manufacturing cost of radio frequency assembly are reduced by using anti-impact mechanical structure to build shielding structure.

Description

Technical Field

[0001] This invention relates to the field of radio frequency technology, and more specifically, to a lightweight radio frequency component based on an impact-resistant ball grid array. Background Technology

[0002] In the actual operating environment of traditional circuits, such as when aircraft are in atmospheric turbulence and high-speed maneuvering in the aerospace field, and when military equipment is in complex electromagnetic confrontation and severe mechanical vibration scenarios, circuits not only have to withstand strong acceleration impacts, but also face severe electromagnetic interference challenges.

[0003] Traditional RF components employ metal cavity isolation schemes. Under strong impacts, their significant weight leads to a dramatic increase in the equivalent weight of the circuit, severely compromising equipment stability. Manufacturing them requires high-precision machining and expensive materials, resulting in high costs. Furthermore, metal cavities easily introduce electromagnetic interference, significantly interfering with the precise phase locking of the PLL and the frequency conversion of the converter module in phase-locked frequency converter circuits, leading to a substantial reduction in circuit performance, particularly signal isolation. Under complex conditions such as strong impacts, these components struggle to meet the stringent performance requirements of modern high-performance electronic devices. Therefore, there is an urgent need to develop a lightweight RF component based on an impact-resistant ball grid array to address these issues. Summary of the Invention

[0004] The problem that this invention aims to solve is that traditional radio frequency components severely damage the stability of devices under complex conditions such as strong impacts.

[0005] To address the aforementioned issues, this invention provides a lightweight radio frequency component based on an impact-resistant ball grid array, comprising a substrate, side plates, a support plate, elastic elements, pop-up support balls, a silicon chip substrate, and BGA solder balls.

[0006] The side plate is mounted on the substrate, and multiple support plates are disposed inside the substrate. An elastic element is disposed between the support plate and the substrate. Two adjacent support plates are connected by pop-up support balls. The silicon chip is mounted on the support plate. The substrate is connected to the external structure by BGA solder balls.

[0007] Optionally, grooves are etched around the BGA solder balls on the substrate;

[0008] The circuit board is a flexible circuit board.

[0009] Optionally, a high-Q filter circuit is disposed on the silicon substrate of the chip;

[0010] A resonant cavity is etched into the support plate;

[0011] The support plate includes a composite material layer, a metal material layer, and a magnetic material layer. The metal material layer is covered on the composite material layer, and the magnetic material layer is covered on the metal material layer. The composite material layer is the outer layer of the support plate, and the magnetic material layer is the inner layer of the support plate.

[0012] Optionally, the magnetic material of the magnetic material layer is permalloy, the metal material of the metal material layer is copper, and the composite material of the composite material layer is selected from any one of silicon carbide-based composite materials, graphene-reinforced composite materials, nanocomposite materials, and metal-polymer multilayer composite materials.

[0013] Optionally, a MEMS sensor and an adaptive filtering circuit are disposed inside the packaging space formed by the substrate and the side plate.

[0014] Optionally, the BGA solder balls are made of Sn-Ag-Cu-Ti alloy material; redundant BGA solder balls are arranged inside the outermost BGA solder balls on the substrate, and the spacing between the outermost BGA solder balls is smaller than the spacing between the innermost redundant BGA solder balls.

[0015] Optionally, the substrate includes a carbon fiber layer and a metal strip, wherein the carbon fiber layer is made of honeycomb carbon fiber reinforced polymer and the metal strip is embedded inside.

[0016] Optionally, the substrate includes a low-loss layer made of liquid crystal polymer, and the substrate has a periodic EBG structure.

[0017] Optionally, the substrate may have integrated flow channels and a graphene film.

[0018] Optionally, the substrate is provided with a grounding shielding ring and an internal shielding ring;

[0019] The grounding shielding ring consists of BGA solder balls with double-layer grounding arranged around the BGA solder balls that transmit radio frequency signals.

[0020] The built-in shielding ring consists of a metal strip layer and a composite material layer disposed within the substrate.

[0021] This invention provides a lightweight radio frequency component based on an impact-resistant ball grid array. Compared with existing technologies, it has the following advantages:

[0022] Elastic components are cleverly added between the silicon chip and the substrate, as well as at the connection areas of different functional modules. These components can efficiently absorb and disperse mechanical stress during strong acceleration impacts through their elastic deformation. Pop-up balls are placed between multiple support plates to prevent collisions under strong impacts. These multiple structures enhance the stability of the RF component. Furthermore, because the silicon chip is mounted between two support plates and surrounded by pop-up balls, a shielding structure is formed around the silicon chip. This shock-resistant mechanical structure reduces the weight and manufacturing cost of the RF component. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of an impact-resistant, elastically supported BGA packaging architecture provided in an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of a support plate structure provided in an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a substrate structure provided in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of another substrate structure provided in an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Substrate; 2. Side plate; 3. Support plate; 4. Elastic element; 5. POP support ball; 6. Chip silicon substrate; 7. BGA solder ball; 11. Carbon fiber layer; 12. Metal strip; 13. Honeycomb carbon fiber foam interlayer; 14. Low loss layer; 31. Composite material layer; 32. Metal material layer; 33. Magnetic material layer. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application are described clearly and completely. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0032] like Figure 1 As shown in the figure, an embodiment of this application provides a lightweight radio frequency component based on an impact-resistant ball grid array, including a substrate 1, a side plate 2, a support plate 3, an elastic element 4, pop support balls 5, a chip silicon substrate 6, and BGA solder balls 7.

[0033] The side plate 2 is installed on the substrate 1 by parallel seam welding using a parallel seam welding machine. The substrate 1 has multiple support plates 3 inside. An elastic element 4 is provided between the support plate 3 and the substrate 1. Two adjacent support plates 3 are connected by pop-up support balls 5. The chip silicon substrate 6 is installed on the support plate 3. The substrate 1 is connected to the external structure by BGA solder balls 7.

[0034] Specifically, the elastic element 4 can be an elastic bracket, spring, or sheet, and its material can be a specially customized high-elasticity, high-damping rubber material. The above structure constitutes the elastic support BGA packaging architecture for the RF component. Figure 1 In the middle, the uppermost and lowermost support plates are fixedly connected to elastic elements at both ends, and the middle support plate is connected to the upper and lower support plates by pop ball 5.

[0035] In this embodiment, elastic elements are cleverly added between the chip silicon substrate 6 and the substrate 1, as well as at the connection areas of different functional modules. These elements can efficiently absorb and disperse mechanical stress through their elastic deformation during strong acceleration impacts. Pop-up balls 5 are placed between multiple support plates 3 to prevent collisions between the support plates 3 under strong impacts. The size and shape of the pop-up balls 5 at different locations can vary depending on requirements. Figure 1 In this design, the pop-up balls 5 between the upper support plates 3 are significantly larger than those between the lower support plates 3, thus enabling graded absorption of impact forces and oscillations. This multi-layered structure enhances the stability of the RF component. Furthermore, because the silicon chip 6 is mounted between the two support plates 3 and surrounded by pop-up balls 5, a shielding structure is formed around the silicon chip 6. This shock-resistant mechanical structure eliminates the need for additional shielding components (such as metal covers), reducing the weight and manufacturing cost of the RF component.

[0036] In addition to the aforementioned flexible BGA packaging architecture, other aspects enhance the stability and interference shielding of RF components, such as flexible interconnect and stress-relieving circuit design, reinforced straight ball solder array layout, integrated design of multi-layer composite shielding and high-Q filtering, and adaptive filtering adjustment based on microelectromechanical systems (MEMS). These aspects will be explained in detail below.

[0037] In an optional embodiment of this application, the flexible interconnect and stress relief circuit design specifically involves etching grooves around the BGA solder balls 7 on the substrate 1; the circuit board in the chip silicon substrate 6 is a flexible circuit board.

[0038] Specifically, flexible printed circuit boards (FPCs) with excellent flexibility and electrical performance are selected to replace some of the traditional rigid circuit connections. A stress relief structure is carefully designed around the BGA solder balls 7, a transition fillet is added between the solder joint and the pad, and microgrooves are etched in the substrate area near the solder joint.

[0039] In this embodiment, flexible interconnect technology is employed on the critical signal transmission path of the phase-locked frequency converter circuit. Flexible printed circuit boards (FPCs), possessing excellent flexibility and superior electrical performance, are selected to replace some traditional rigid wiring connections. FPCs can flexibly bend and deform in response to changes in mechanical stress during impact, effectively avoiding the risk of wiring breakage caused by stress concentration. Simultaneously, a stress-relieving structure is carefully designed around the BGA solder balls 7, a transition fillet is added between the solder joint and the pad, and microgrooves are etched in the substrate area near the solder joint. This promotes the priority release of stress generated by strong impacts at these pre-designed structures, ensuring the reliability of the solder joints under complex stress environments.

[0040] In an optional embodiment of this application, the reinforced straight ball solder joint array layout specifically involves cleverly adding special alloying elements to the solder joint material. The BGA solder balls 7 are made of Sn-Ag-Cu-Ti alloy material. Redundant BGA solder balls 7 are arranged inside the outer periphery of the substrate 1, and the spacing between the outer periphery BGA solder balls 7 is smaller than the spacing between the inner redundant BGA solder balls 7.

[0041] Specifically, the BGA solder balls are densely arranged around the perimeter to enhance edge impact resistance, while redundant solder balls are used internally to distribute stress. By precisely controlling the welding parameters, a highly consistent straight-ball solder joint array with superior mechanical strength is created. During the layout of the reinforced straight-ball solder joint array, finite element analysis is used to simulate impact loads to optimize the number and position of redundant solder balls, and EDA tools are used for non-uniform solder ball layout design.

[0042] In this embodiment, the straight-ball solder joint design of the BGA is improved, significantly increasing the density and strength of the solder joints. By precisely controlling the welding parameters, a highly consistent array of straight-ball solder joints with superior mechanical strength is created. Special alloying elements, such as indium (In) and bismuth (Bi), are cleverly added to the solder joint material, greatly improving the toughness and fatigue resistance of the solder joints. When facing strong acceleration impacts, the high-density solder joint array can collaboratively share mechanical stress, effectively preventing individual solder joints from cracking or detaching due to excessive stress, thus comprehensively ensuring the reliability of electrical connections between modules of the phase-locked frequency converter circuit.

[0043] In an optional embodiment of this application, the integrated design of multi-layer composite shielding and high-Q filtering specifically includes: a high-Q filtering circuit disposed on the silicon substrate 6 of the chip; and a resonant cavity etched on the support plate 3; as shown below. Figure 2 As shown, the support plate 3 includes a composite material layer 31, a metal material layer 32, and a magnetic material layer 33. The metal material layer 32 is covered on the composite material layer 31, and the magnetic material layer 33 is covered on the metal material layer 32. The composite material layer 31 is the outer layer of the support plate 3, and the magnetic material layer 33 is the inner layer of the support plate 3.

[0044] Specifically, the two support plates 3 form a shielding layer. Between each shielding layer, a high-Q filter circuit is integrated. By etching a resonant cavity of a specific shape within the shielding layer and loading capacitors and inductors with high quality factors, a highly efficient filter for interference signals in different frequency bands is constructed. This deeply integrates electromagnetic shielding with high-Q filtering functionality.

[0045] The magnetic material of the magnetic material layer 33 is permalloy, which effectively shields low-frequency magnetic field interference; the metal material of the metal material layer 32 is copper, which strongly shields high-frequency electric field interference; the composite material of the composite material layer 31 is any one of silicon carbide-based composite materials, graphene-reinforced composite materials, nanocomposite materials, and metal-polymer multilayer composite materials.

[0046] The substrate 1 is provided with a grounding shielding ring and an internal shielding ring. The grounding shielding ring consists of double-layered grounded BGA solder balls 7 arranged around the BGA solder balls 7 that transmit radio frequency signals. The grounding shielding ring forms a grounding shielding ring with a Faraday cage effect by arranging double-layered grounded solder balls around the radio frequency signal solder balls. The internal shielding ring consists of a metal strip layer and a composite material layer disposed within the substrate 1. The internal shielding ring isolates high-frequency crosstalk by embedding a high-conductivity metal layer and a copper-graphene composite material within the substrate.

[0047] In an optional embodiment of this application, the substrate 1 includes a carbon fiber layer 11 and a metal strip 12. The carbon fiber layer 11 is made of honeycomb carbon fiber reinforced polymer, and the metal strip 12 is embedded inside. Figure 3 As shown, the substrate 1 includes a carbon fiber layer 11, which is a carbon fiber reinforced polymer; a honeycomb carbon fiber foam interlayer 13; and an embedded metal strip 12.

[0048] In an optional embodiment of this application, the substrate 1 includes a low-loss layer 14, the low-loss layer 14 being made of liquid crystal polymer, and a periodic EBG structure is disposed within the substrate 1. For example... Figure 4As shown, substrate 1 includes a low-loss layer 14, which is a liquid crystal polymer (LCP) with a low loss factor (Df) < 0.002, to reduce signal attenuation. A periodic EBG structure is designed within substrate 1 to suppress electromagnetic coupling in specific frequency bands. A metal strip 12 is also embedded within the low-loss layer 14.

[0049] In an optional embodiment of this application, the substrate 1 integrates flow channels and a graphene film. The integration of microchannels and a highly thermally conductive graphene film in the substrate 1 ensures heat dissipation for the radio frequency devices. After the design is completed, ANSYS Multiphysics is used to co-simulate mechanical shock, thermal distribution, and electromagnetic fields to verify the robustness of the design.

[0050] The various substrates 1 mentioned above can be selected according to actual needs. Some substrates 1 are more focused on lightweight design, some are more focused on signal transmission protection, and some are more focused on high integration and heat dissipation.

[0051] By employing the above technical solution, electromagnetic shielding and high-Q filtering functions are deeply integrated. The innermost layer uses a high-permeability magnetic material, such as permalloy, to effectively shield low-frequency magnetic field interference; the middle layer uses a high-conductivity metallic material, such as copper, to strongly shield high-frequency electric field interference; and the outermost layer uses a composite material that combines mechanical protection and electromagnetic shielding performance. High-Q filtering circuits are cleverly integrated between the shielding layers. By etching resonant cavities of a specific shape within the shielding layers and loading capacitors and inductors with high quality factors, highly efficient filters targeting interference signals in different frequency bands are constructed. These filters can accurately filter out interference signals outside the operating frequency band of the phase-locked converter circuit, greatly improving signal purity.

[0052] In an optional embodiment of this application, the adaptive filtering adjustment based on microelectromechanical systems (MEMS) specifically involves introducing advanced microelectromechanical systems (MEMS) technology, wherein a MEMS sensor and an adaptive filtering circuit are disposed inside the packaging space formed by the substrate 1 and the side plate 2.

[0053] Specifically, the MEMS sensor monitors the electromagnetic interference in the environment in real time. When it detects changes in parameters such as the frequency and amplitude of the interference signal, it quickly feeds this information back to the adaptive filtering circuit. Based on the feedback, the adaptive filtering circuit automatically adjusts the filtering parameters, such as changing the center frequency and bandwidth of the filter, to ensure that it can efficiently filter out interference signals and maintain the stable operation of the phase-locked converter circuit under different electromagnetic interference environments.

[0054] In summary, this lightweight RF signal isolation technology with a strong impact-resistant grid ball array solves the problems of traditional metal cavity isolation solutions, which suffer from a significant increase in the equivalent weight of the circuit due to its large weight under strong impact, severely compromising equipment stability; and the high cost due to the need for high-precision machining and expensive materials in manufacturing.

[0055] In summary, compared with existing technologies, it has the following beneficial effects:

[0056] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0057] 1. Improve impact resistance and stability

[0058] Verified through numerous rigorous simulated high-acceleration impact experiments, the structural design using the technology of this invention can still maintain stable operation when the impact intensity reaches 5-10 times the tolerance limit of traditional technology. The circuit failure rate is significantly reduced compared to traditional technology, providing a solid guarantee for the reliable operation of equipment in extreme impact environments.

[0059] 2. Lightweight

[0060] Compared to traditional metal cavity isolation solutions, this invention, through the lightweight design of BGA and the ingenious application of new materials, successfully reduces the weight of the phase-locked frequency converter circuit by 80%, which effectively meets the urgent needs of weight-sensitive fields such as aerospace and mobile military equipment, and significantly improves the mobility and energy efficiency of the equipment.

[0061] 3. Enhance signal isolation and filtering performance

[0062] The integrated design of multi-layer composite shielding and high-Q filtering, along with MEMS adaptive filtering adjustment, enhances the signal isolation and filtering performance of this invention. It can attenuate interference signals outside the target frequency band by more than 80dB, effectively improving the signal-to-noise ratio, increasing frequency synthesis accuracy by 40%, and optimizing signal quality. This lays a solid foundation for applications with extremely high signal quality requirements, such as communication and radar.

[0063] 4. Cost-effectiveness advantages

[0064] By eliminating the complex and expensive metal cavity processing steps, simplifying the manufacturing process, and rationally selecting new materials with controllable costs, the technical solution of this invention reduces the overall manufacturing cost of the phase-locked frequency converter circuit by 50%, demonstrating a cost advantage in large-scale production.

[0065] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0066] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A lightweight radio frequency component based on an impact-resistant ball grid array, characterized in that, Includes substrate (1), side plate (2), support plate (3), elastic element (4), pop support ball (5), chip silicon base (6) and BGA solder ball (7); The side plate (2) is mounted on the substrate (1). Multiple support plates (3) are provided inside the substrate (1). An elastic element (4) is provided between the support plate (3) and the substrate (1). Two adjacent support plates (3) are connected by pop support balls (5). The chip silicon substrate (6) is mounted on the support plate (3). The substrate (1) is connected to the external structure by BGA solder balls (7). A high-Q filter circuit is provided on the silicon substrate (6) of the chip; A resonant cavity is etched on the support plate (3); The support plate (3) includes a composite material layer (31), a metal material layer (32) and a magnetic material layer (33). The metal material layer (32) is covered on the composite material layer (31), and the magnetic material layer (33) is covered on the metal material layer (32). The composite material layer (31) is the outer layer of the support plate (3), and the magnetic material layer (33) is the inner layer of the support plate (3).

2. The lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, On the substrate (1), grooves are etched around the BGA solder balls (7); The circuit board in the silicon-based chip (6) is a flexible circuit board.

3. A lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The magnetic material of the magnetic material layer (33) is permalloy, the metal material of the metal material layer (32) is copper, and the composite material of the composite material layer (31) is any one of silicon carbide-based composite material, graphene-reinforced composite material, nanocomposite material and metal-polymer multilayer composite material.

4. The lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The package space formed by the substrate (1) and the side plate (2) contains a MEMS sensor and an adaptive filtering circuit.

5. A lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The BGA solder balls (7) are made of Sn-Ag-Cu-Ti alloy material; redundant BGA solder balls (7) are arranged inside the outer BGA solder balls (7) on the substrate (1), and the arrangement spacing of the outer BGA solder balls (7) is smaller than the arrangement spacing of the inner redundant BGA solder balls (7).

6. A lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The substrate (1) includes a carbon fiber layer (11) and a metal strip (12). The carbon fiber layer (11) is made of honeycomb carbon fiber reinforced polymer and has a metal strip (12) embedded inside.

7. A lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The substrate (1) includes a low-loss layer (14) made of liquid crystal polymer, and a periodic EBG structure is provided in the substrate (1).

8. A lightweight radio frequency component based on an impact-resistant ball grid array as described in claim 1, characterized in that, The substrate (1) is integrated with flow channels and a graphene film.

9. A lightweight radio frequency component based on an impact-resistant ball grid array as described in any one of claims 1-8, characterized in that, The substrate (1) is provided with a grounding shielding ring and an internal shielding ring; The grounding shielding ring is a BGA solder ball (7) with double grounding arranged around the BGA solder ball (7) that transmits radio frequency signals. The built-in shielding ring is a metal strip layer and a composite material layer disposed in the substrate (1).

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