Integrated circuit chip

Abstract

An integrated circuit chip disclosed by the present invention comprises a circuit board, the board surface of the circuit board is provided with a fixing frame, the interior of the fixing frame is movably connected with a chip body, and the circuit board is movably connected with a cover plate used for sealing and covering the chip body; when the cover plate abuts against and is connected with the fixing frame, the circuit board, the fixing frame and the cover plate form a cavity used for installing the chip body. A clamping mechanism is arranged between the cover plate and the fixing frame, the clamping mechanism comprises a clamping rod and a clamping groove, the clamping rod is arranged on the cover plate, the clamping groove is formed in the fixing frame, and the clamping rod is connected with the clamping groove in a clamping mode. The problems that in the prior art, bare chip packaging operation is inconvenient, the packaging shell is complex or not firm to fix, and disassembly is difficult are solved, and the packaging efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chips and relates to an integrated circuit chip. Background Art

[0002] Integrated chips are manufactured by first integrating transistors into chiplets with specific functions, and then integrating the chiplets into chips through semiconductor technology according to application requirements.

[0003] Modern digital integrated circuit chips are primarily manufactured using CMOS processes and are available in a variety of packaging options. For discrete components, shorter pins help reduce electromagnetic interference (EMI) issues. Surface-mount devices offer improved electromagnetic compatibility (EMC) performance due to their smaller mounting area and lower mounting height. Therefore, surface-mount components should be preferred in designs, and even direct mounting of bare die on a printed circuit board (PCB) may be considered.

[0004] However, the current packaging process after the chip bare die is installed has the problem that the fixing of the packaging shell is relatively complicated and not secure, and it is also difficult to disassemble when necessary, resulting in low overall packaging efficiency. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an integrated circuit chip that solves the problems in the prior art of inconvenient chip bare die packaging operation, complex or unreliable packaging shell fixation, and difficult disassembly, thereby improving packaging efficiency.

[0006] To achieve the above object, the present invention is implemented by adopting the following technical solutions: An integrated circuit chip comprises a circuit board, wherein a fixed frame is provided on a surface of the circuit board, a chip body is movably connected within the fixed frame, and a cover plate for covering the chip body is movably connected to the circuit board; when the cover plate is in contact with the fixed frame, the circuit board, the fixed frame, and the cover plate form a cavity for mounting the chip body; A clamping mechanism is provided between the cover plate and the fixing frame. The clamping mechanism includes a clamping rod and a clamping slot. The clamping rod is provided on the cover plate, the clamping slot is provided on the fixing frame, and the clamping rod is clamped with the clamping slot.

[0007] Optionally, the side walls of the clamping rod are provided with clamping protrusions, and the slot walls of the clamping slot are respectively provided with clamping blocks; When the locking protrusion is locked with the locking block, the locking protrusion is arranged below the locking block, and the locking protrusion is in contact with the locking block.

[0008] Optionally, the card block is provided with a first inclined surface for facilitating the insertion of the card protrusion into the card slot; When the locking protrusion is inserted into the locking slot, the locking protrusion is slidably connected to the first inclined surface.

[0009] Optionally, the upper surface of the locking protrusion is provided with a second inclined surface for facilitating the pulling of the locking protrusion out of the locking slot; When the locking protrusion is pulled out of the locking slot, the locking block is slidably connected to the second inclined surface.

[0010] Optionally, a fixing protrusion is provided on the edge of the cover plate, and a fixing groove matching the fixing protrusion is provided on the fixing frame, and the fixing protrusion is in contact with the bottom of the fixing groove.

[0011] Optionally, waterproof paint is sprayed between the notch of the fixing groove and the fixing protrusion, between the cover plate and the pins of the chip body, and between the fixing frame and the pins of the chip body.

[0012] Optionally, a spraying notch is provided on the edge of the cover plate, and the connection between the notch of the fixing groove and the fixing protrusion is provided at the lowest point of the spraying notch.

[0013] Optionally, the cover plate is provided with a mounting groove matching the chip body.

[0014] Optionally, the notch of the mounting slot is provided with a plurality of grooves for the pins of the chip body to pass through.

[0015] Optionally, a protrusion is provided on the edge of the cover plate, and the protrusion is provided above the clamping mechanism.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides an integrated circuit chip. A fixing frame is provided on a circuit board surface. A chip body is movably connected to the fixing frame. The fixing frame facilitates the fixed placement of the chip body. A cover plate for covering the chip body is movably connected to the circuit board. The cover plate improves the stability of the chip body and prevents the chip body from falling off the fixing frame. A clamping mechanism is provided between the cover plate and the fixed frame, and the clamping mechanism includes a clamping rod and a clamping slot. The clamping rod is provided on the cover plate, and the clamping slot is provided on the fixed frame. The clamping rod and the clamping slot realize the clamping connection between the cover plate and the fixed frame, which facilitates the opening and closing between the cover plate and the fixed frame. The clamping mechanism can prevent the cover plate from opening accidentally, thereby ensuring the firmness of the chip body package. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of an integrated circuit chip according to an embodiment of the present invention; Figure 2 for Figure 1 A partial enlarged view of the middle clamping mechanism; Figure 3The figure is a side view of an integrated circuit chip cover according to an embodiment of the present invention.

[0018] In the figure: 1. Circuit board; 2. Fixing frame; 3. Chip body; 4. Cover plate; 5. Clamping mechanism; 51. Clamping rod; 52. Clamping slot; 53. Clamping protrusion; 54. Clamping block; 55. First inclined surface; 56. Second inclined surface; 6. Placement slot; 7. Groove; 8. Supporting protrusion; 9. Pin; 10. Mounting rod; 11. Fixing protrusion; 12. Fixing slot; 13. Spraying notch. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0021] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances. Example

[0022] like Figures 1 to 3 As shown, an integrated circuit chip includes a horizontally placed circuit board 1, the upper surface of the circuit board 1 is provided with a fixing frame 2 and a mounting rod 10, a chip body 3 is movably connected in the fixing frame 2, the edge of the chip body 3 is provided with pins 9, the pins 9 are welded to the circuit board 1, and a cover plate 4 for covering the chip body 3 is movably connected to the circuit board 1, and one end of the cover plate 4 is hinged to the mounting rod 10.

[0023] A clamping mechanism 5 is provided between the other end of the cover plate 4 and the fixed frame 2. The clamping mechanism 5 includes two clamping rods 51 and a clamping slot 52. The clamping rod 51 is provided on the cover plate 4. The upper end of the clamping rod 51 is connected to the edge of the cover plate 4. The clamping rod 51 itself has a certain toughness. The clamping rod 51 is arranged vertically to the cover plate 4. The lower end of the clamping rod 51 can move relative to the upper end of the clamping rod 51 when subjected to a force. When the force disappears, the clamping rod 51 returns to its original state. The clamping slot 52 is provided on the fixed frame 2. The lower end side wall of the clamping rod 51 is provided with a clamping protrusion 53, and the two side groove walls of the clamping slot 52 are respectively provided with a clamping block 54; the clamping rod 51 and the clamping slot 52 are clamped together by the clamping block 54 and the clamping protrusion 53; when the clamping protrusion 53 is clamped with the clamping block 54, the clamping protrusion 53 is arranged below the clamping block 54, and the clamping protrusion 53 and the clamping block 54 are in contact with each other.

[0024] The latch block 54 is provided with a first inclined surface 55 for facilitating the insertion of the latch protrusion 53 into the latch slot 52. When the latch protrusion 53 is inserted into the latch slot 52, the latch protrusion 53 slides in contact with the first inclined surface 55. The upper surface of the latch protrusion 53 is provided with a second inclined surface 56 for facilitating the removal of the latch protrusion 53 from the latch slot 52. When the latch protrusion 53 is removed from the latch slot 52, the latch block 54 slides in contact with the second inclined surface 56.

[0025] The cover 4 has a mounting groove 6 on its surface that matches the chip body 3. When the cover 4 is closed, the bottom of the mounting groove 6 contacts the chip body 3. The opening of the mounting groove 6 has several grooves 7 for pins 9 to pass through. The edge of the cover 4 has a support ridge 8, which is located above the latching mechanism 5. Example

[0026] like Figures 1 to 3 As shown, an integrated circuit chip includes a horizontally placed circuit board 1, the upper surface of the circuit board 1 is provided with a fixing frame 2 and a mounting rod 10, a chip body 3 is movably connected in the fixing frame 2, the edge of the chip body 3 is provided with pins 9, the pins 9 are welded to the circuit board 1, and a cover plate 4 for covering the chip body 3 is movably connected to the circuit board 1, and one end of the cover plate 4 is hinged to the mounting rod 10.

[0027] A clamping mechanism 5 is provided between the other end of the cover plate 4 and the fixed frame 2. The clamping mechanism 5 includes two clamping rods 51 and a clamping slot 52. The clamping rod 51 is provided on the cover plate 4. The upper end of the clamping rod 51 is connected to the edge of the cover plate 4. The clamping rod 51 itself has a certain toughness. The clamping rod 51 is arranged vertically to the cover plate 4. The lower end of the clamping rod 51 can move relative to the upper end of the clamping rod 51 when receiving a force. When the force disappears, the clamping rod 51 returns to its original state. The clamping slot 52 is provided on the fixed frame 2. The lower end side wall of the clamping rod 51 is provided with a clamping protrusion 53, and the two side groove walls of the clamping slot 52 are respectively provided with a clamping block 54; the clamping rod 51 and the clamping slot 52 are clamped together by the clamping block 54 and the clamping protrusion 53; when the clamping protrusion 53 is clamped with the clamping block 54, the clamping protrusion 53 is arranged below the clamping block 54, and the clamping protrusion 53 and the clamping block 54 are in contact with each other.

[0028] The latch block 54 is provided with a first inclined surface 55 for facilitating the insertion of the latch protrusion 53 into the latch slot 52. When the latch protrusion 53 is inserted into the latch slot 52, the latch protrusion 53 slides in contact with the first inclined surface 55. The upper surface of the latch protrusion 53 is provided with a second inclined surface 56 for facilitating the removal of the latch protrusion 53 from the latch slot 52. When the latch protrusion 53 is removed from the latch slot 52, the latch block 54 slides in contact with the second inclined surface 56.

[0029] The cover 4 has a mounting groove 6 on its surface that matches the chip body 3. When the cover 4 is closed, the bottom of the mounting groove 6 contacts the chip body 3. The opening of the mounting groove 6 has several grooves 7 for pins 9 to pass through. The edge of the cover 4 has a support ridge 8, which is located above the latching mechanism 5.

[0030] A fixing protrusion 11 is provided on the edge of the cover plate 4, and the fixing protrusion 11 is provided on both sides of the groove 7. A fixing groove 12 matching the fixing protrusion 11 is provided on the fixing frame 2, and the fixing protrusion 11 is in contact with the bottom of the fixing groove 12; the fixing protrusion 11 and the fixing groove 12 can prevent the cover plate 4 and the fixing frame 2 from shifting laterally, thereby improving the stability of the connection between the fixing protrusion 11 and the fixing groove 12.

[0031] Waterproof paint 14 is sprayed between the notch of the fixing groove 12 and the fixing protrusion 11, between the cover plate 4 and the pins 9 of the chip body 3, and between the fixing frame 2 and the pins 9 of the chip body 3. The waterproof paint 14 is a three-proof paint.

[0032] A spraying notch 13 is provided on the edge of the cover plate 4. The connection between the notch of the fixing groove 12 and the fixing protrusion 11 is located at the lowest point of the spraying notch 13. The spraying notch 13 facilitates the collection of waterproof paint 14. Since the connection between the notch of the fixing groove 12 and the fixing protrusion 11 is located at the lowest point of the spraying notch 13, the collected waterproof paint 14 flows to the connection between the fixing protrusion 11 and the fixing groove 12, thereby improving the waterproof effect.

[0033] The working method of the present invention is as follows: when in use, the chip body 3 is placed in the fixing frame 2 of the circuit board 1, and then the pins 9 around the chip body 3 are soldered to the circuit board 1. The cover plate 4 is turned over, and when the clamping protrusion 53 is inserted into the clamping slot 52, the clamping protrusion 53 is slidably connected with the first inclined surface 55, and the distance between the clamping protrusions 53 gradually decreases. Then, the second inclined surface 56 of the clamping protrusion 53 is slidably connected with the clamping block 54, and the distance between the clamping protrusions 53 gradually increases until the clamping block 54 slides out of the second inclined surface 56. At this time, the clamping rod 51 and the cover plate 4 are perpendicular to each other, and the clamping protrusion 53 is in contact with the clamping block 54. The waterproof paint 14 is sprayed in the spraying notch 13, between the cover plate 4 and the pins 9 of the chip body 3, and between the fixing frame 2 and the pins 9 of the chip body 3. The waterproof paint 14 flows in the spraying notch 13 to the connection between the notch of the fixing groove 12 and the fixing protrusion 11, completing the encapsulation of the bare chip of the chip body 3. During disassembly, the supporting protrusion 8 is pulled upward with force to move the clamping rod 51 upward, and the second inclined surface 56 of the clamping protrusion 53 is slidably connected with the clamping block 54, and the spacing between the clamping protrusions 53 gradually decreases. Then the clamping protrusion 53 is slidably connected with the first inclined surface 55, and the spacing between the clamping protrusions 53 gradually increases until the clamping rod 51 is separated from the clamping slot 52. The integrated circuit chip and the chip body 3 are convenient for packaging and disassembly of the bare die, and the chip bare die packaging shell has a good fixing effect, which is convenient for efficient packaging of the chip bare die.

[0034] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An integrated circuit chip, comprising a circuit board, characterized in that: The circuit board is provided with a fixing frame, a chip body is movably connected to the fixing frame, and a cover plate for covering the chip body is movably connected to the circuit board; when the cover plate is in contact with the fixing frame, the circuit board, the fixing frame and the cover plate form a cavity for mounting the chip body; A clamping mechanism is provided between the cover plate and the fixing frame. The clamping mechanism includes a clamping rod and a clamping slot. The clamping rod is provided on the cover plate, the clamping slot is provided on the fixing frame, and the clamping rod is clamped with the clamping slot.

2. The integrated circuit chip according to claim 1, wherein: The side walls of the clamping rod are provided with clamping protrusions, and the groove walls of the clamping slot are respectively provided with clamping blocks; When the locking protrusion is locked with the locking block, the locking protrusion is arranged below the locking block, and the locking protrusion is in contact with the locking block.

3. The integrated circuit chip according to claim 2, wherein: The card block is provided with a first inclined surface for facilitating the insertion of the card protrusion into the card slot; When the locking protrusion is inserted into the locking slot, the locking protrusion is slidably connected to the first inclined surface.

4. The integrated circuit chip according to claim 2, wherein: The upper surface of the locking protrusion is provided with a second inclined surface for facilitating the pulling of the locking protrusion out of the locking slot; When the locking protrusion is pulled out of the locking slot, the locking block is slidably connected to the second inclined surface.

5. The integrated circuit chip according to claim 1, wherein: The edge of the cover plate is provided with a fixing protrusion, and the fixing frame is provided with a fixing groove matching the fixing protrusion, and the fixing protrusion is in contact with the bottom of the fixing groove.

6. The integrated circuit chip according to claim 5, wherein: Waterproof paint is sprayed between the notch of the fixing groove and the fixing protrusion, between the cover plate and the pins of the chip body, and between the fixing frame and the pins of the chip body.

7. The integrated circuit chip according to claim 6, wherein: The edge of the cover plate is provided with a spraying notch, and the connection between the notch of the fixing groove and the fixing protrusion is arranged at the lowest point of the spraying notch.

8. The integrated circuit chip according to claim 1, wherein: The plate surface of the cover plate is provided with a mounting groove matching the chip body.

9. The integrated circuit chip according to claim 8, wherein: The notch of the mounting slot is provided with a plurality of grooves for the pins of the chip body to pass through.

10. The integrated circuit chip according to claim 1, wherein: The edge of the cover plate is provided with a supporting protrusion, and the supporting protrusion is arranged above the clamping mechanism.

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