Component carrier assembly and method for producing component carrier assembly

Abstract

The invention relates to a component carrier assembly comprising a component carrier comprising a stack (4) of at least one electrically conductive layer structure (5) and at least one electrically insulating layer structure (6). It further comprises a component (10), preferably an electronic component, embedded at least partially within the stack (4) and comprising a first main surface (11), a second main surface (12) opposite the first main surface (11), and at least one side surface (13) connecting the first main surface (11) and the second main surface (12) to each other, a first edge (14) is formed at the intersection of the first main surface (11) and the at least one side surface (13) and a second edge (15) is formed at the intersection of the second main surface (12) and the at least one side surface (13). An adhesive profile is provided in the region of a first edge (14) of the component (10). The invention also relates to a method for producing such a component carrier.

Description

Technical Field

[0001] The invention relates to a component carrier assembly comprising a stack of a plurality of layers forming at least one electrically conductive layer structure and at least one electrically insulating layer structure, the stack comprising a cavity. The invention also relates to a component carrier assembly and a method for producing a component carrier. Background Art

[0002] According to the prior art, it is known to attach electronic components, such as chips or the like, to a component carrier. The components are usually attached to the carrier material by welding, gluing or similar means. Some components may be freely accessible on the carrier or may also have a protective cover.

[0003] US10483181B2 discloses a package comprising a support plate and an electronic integrated circuit chip mounted on the support plate by a layer of adhesive, and a package cover, the package cover and the support plate defining together at least one cavity in which the electronic integrated circuit chip is located, wherein at least one adhesive bead is inserted between the peripheral area of ​​the support plate and the end edge of the peripheral wall of the package cover. Summary of the Invention

[0004] The object of the present invention is to overcome the disadvantages of the prior art and to provide a component carrier assembly and a method by means of which, on the one hand, the component is to be protected by the carrier and, on the other hand, an improved fixing of the component in the component carrier assembly is to be provided.

[0005] This object is achieved by a component carrier assembly comprising a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, preferably an electronic component, which is at least partially, preferably completely, embedded in the stack and comprises a first main surface, a second main surface opposite the first main surface, and at least one side surface connecting the first and second main surfaces to one another, wherein a first edge is formed at the intersection of the first main surface and the at least one side surface, and a second edge is formed at the intersection of the second main surface and the at least one side surface. A preferably continuously extending bonding profile is provided in the region of the first edge of the component, preferably directly at this first edge.

[0006] The present invention enables components to be embedded in a component carrier, providing improved component protection during the manufacture of the component-carrier assembly. Furthermore, the adhesive profile provides a protective area for the component, which also improves component stability. A further advantage of the adhesive profile is that it can also serve as an assembly aid for the inserted component.

[0007] As another possible advantage, a direct physical / electrical connection to one major surface (preferably the first major surface) can be achieved without vertically penetrating connections.

[0008] The bonding profile may comprise at least one material selected from the group consisting of resin, fluorinated epoxy resin, semi-cured resin. The semi-cured resin may comprise an organic polymer material such as epoxy resin, poly(meth)acrylate, polyethylene terephthalate, polyimide or a mixture thereof.

[0009] Furthermore, the semi-cured resin may include reinforcing materials, such as particles, including inorganic materials, such as glass and / or ceramics.

[0010] Preferably, the viscosity of the semi-cured resin at room temperature may be less than 10^4 Pascal seconds (Pa*s), preferably less than 5000 Pa*s.

[0011] Furthermore, the bonding profile may comprise a two-component adhesive.

[0012] In another possible embodiment, pre-hardening of the adhesive (or a defined area of ​​the adhesive) may be provided, preferably using ultraviolet (UV) light.

[0013] Components can be electronic or non-electronic, active or passive.

[0014] The at least one component can be selected from the group consisting of a non-conductive inlay, a conductive inlay (e.g., a metal inlay, preferably comprising copper or aluminum), a heat transfer element (e.g., a heat pipe), a light-conducting element (e.g., an optical waveguide or optical conductor connection), an electronic component, or a combination thereof. The inlay can, for example, be a metal block with or without an insulating material coating (IMS inlay), which can be embedded or surface-mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, aluminum oxide (Al2O3), or aluminum nitride (AlN). Other geometries with increased surface area are also often used to increase heat exchange capacity. Furthermore, the component may be an active electronic component (embodied with at least one pn junction), a passive electronic component (e.g. a resistor, an inductor or a capacitor), an electronic chip, a memory device (e.g. a DRAM or another data memory), a filter, an integrated circuit (e.g. a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL) and a complex programmable logic device (CPLDs)), a signal processing component, a power management component (e.g. a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET) These include insulated gate field-effect transistors (IGFETs), all of which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound), optoelectronic interface components, light-emitting diodes, optocouplers, voltage converters (such as DC / DC converters or AC / DC converters), encryption components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferromagnetic element, such as a ferrite core) or a paramagnetic element. However, the component may also be an IC substrate, an interposer, or another component carrier, such as in a board-in-board configuration. The component can be surface mounted on the component carrier and / or can be embedded in the interior thereof.In addition, other components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0015] Preferably, the electronic component comprises a chip and / or an integrated circuit (IC).The electronic component may be an active device, but may also be a passive device, such as a capacitor, an inductor or a resistor, or a combination thereof.

[0016] The component may have non-planar side surfaces, such as concave or convex surfaces, or inclined surfaces. The first (or second) major surface may also be non-planar.

[0017] Another advantage of the present invention is that it can provide a two-sided direct fan-out embedding solution, such as fan-out and / or fan-in. In possible embodiments, no metal layer on the back side of the component and / or no additional processing steps (such as laser processes) for component connection (which results in sensitive processing for embedding components) may be required, which leads to a simple and efficient design of the component carrier.

[0018] Furthermore, very thin stacks are possible with the present invention.

[0019] In one embodiment, the second edge is free of adhesive contours, preferably free of adhesive, wherein preferably the entire second major surface is free of adhesive. This can bring the advantage of utilizing the entire second major surface of the component for electrical or thermal connection.

[0020] Preferably, the component can be completely embedded in the stack and the second edge is covered by at least one layer structure of the stack, wherein preferably the second edge is in contact with the at least one layer structure of the stack.

[0021] In another embodiment, the component may include a surface modification to improve the properties of the bond between the component and the bonding profile, such as an increase / enlargement of the effective contact surface, preferably in the region of the first edge (or in the region of contact with the bonding profile). The component may include a plurality of surface elements, such as fins, strips or the like, which are spaced apart from one another to increase the effective surface area associated with the bonding profile, for example by providing small openings between the surface elements.

[0022] According to one embodiment, the bonding profile connects a component (preferably a first edge of the component) and a portion of the stack, preferably a layer structure or a core of the stack, to one another. Thus, improved embedding of the component (between layers) can be provided.

[0023] The core is preferably a provided element having at least one electrically insulating layer and preferably at least one electrically conductive layer. The core may include reinforcement structures, such as glass fibers or glass spheres, and may be in a fully cured stage. Thus, it may provide mechanical stability to the stack.

[0024] Preferably, the first main surface and / or the second main surface, preferably at least the second main surface, may comprise at least one electrically conductive surface portion, preferably a plurality of electrically conductive portions, for establishing an electrical connection to a functional part of the component. Using the described manufacturing method, a simple and reliable connection to the at least one main surface can be established.

[0025] Preferably, the active surface portion of the component defines a portion of the edge provided with at least one electrically conductive surface portion. The active surface portion may preferably be a portion or surface of the component which comprises a functional element or the like and / or can be in contact with a functional element or the like, so that the active surface portion does not merely define the geometric shape of the component.

[0026] Preferably, the active surface defines a portion of the second edge that is free of a bonding profile.

[0027] Preferably, each major surface of the component is an active surface comprising at least one electrically conductive surface.

[0028] Preferably, the bonding profile is in contact with the first edge. This can bring the advantage of reliably holding the component in the desired position while establishing a chemical and / or physical connection.

[0029] In an advantageous embodiment, the bonding profile partially covers the first main surface and / or partially covers at least one side surface. The bonding profile can provide a sealing effect, thereby preventing the embedding substance from flowing towards the central part of the main surface of the component (i.e., not reaching the conductive parts or corresponding sensitive parts, i.e., optically functional areas, on said main surface).

[0030] In another embodiment, the bonding profile is planar on a first side, preferably facing away from the component, and non-planar on a second side opposite the first side (preferably extending relative to the main extension direction / width), preferably contacting the component. The planar surface can provide improved component embedding and improved component alignment via the bonding profile. The non-planar second side (opposite the first side) can include a combination of at least two different surfaces. For example, when viewed in cross-section, the second side can be interrupted and / or include a stepped portion or a plurality of surfaces at different height levels.

[0031] However, a "non-planar" side may still include planar portions in the main extension direction / perpendicular to the stacking direction. Furthermore, the term (non-planar) may include wavy and / or curved portions (when viewed in cross-section). The second side may also include an inclined portion.

[0032] According to a preferred embodiment, the bonding profile is spaced apart from the first edge.The bonding profile may form a spacing element for the component and also be spaced apart from the edge, wherein the embedding substance may flow around the first edge to provide improved embedding.

[0033] Preferably, the bonding profile is in contact with at least one electrically insulating layer structure of the stack and / or with at least one electrically conductive layer structure of the stack.This can bring the advantage of using well-known PCB-related manufacturing processes and thus generating a small amount of scrap.

[0034] According to one embodiment, the bonding contour is in contact with the component. Direct contact of the component with the bonding contour can enhance the placement accuracy of the component inside the component carrier, thereby helping to create smaller component carrier designs due to the higher accuracy.

[0035] In another embodiment, the surface of the bonding profile facing away from the component is spaced apart from the first main surface of the component and / or the first main surface is spaced apart from the layer structure to which the bonding profile connects the component. By means of this adaptation, a groove can be provided below the profile for possible further elements.

[0036] Preferably, the bonding profile has a frame shape and / or is a closed profile and / or is composed of a plurality of separate profiles and / or is in the form of at least one point, in particular a plurality of points. Providing a closed profile can achieve a sealing effect that prevents the embedding material from flowing toward the central portion of the main surface of the component. Separate profiles or profiles formed of points can provide a stable component connection using less adhesive material.

[0037] In addition, the adhesive layer and the component can be at least partially, preferably completely, arranged in and / or on the core and / or stacking structure of the stack. According to this embodiment, a simplified component arrangement can be achieved, the component having the adhesive profile for connecting it to the stack to be produced.

[0038] According to one embodiment, the bonding contour extends along the outer contour of the first main surface, preferably along the entire outer contour of the first main surface. This embodiment enables particularly stable positioning and alignment of the components by means of the bonding contour.

[0039] Preferably, the bonding profile encloses a preferably flat interior space. This allows for a simplified geometric design of the space, creating a regular hollow space beneath the component through the bonding profile (and the component). This embodiment allows for a single space to be used for inserting different materials for different functions. Furthermore, the geometry of the provided space can be defined by the bonding profile.

[0040] In another advantageous embodiment, at least one further bonding profile is provided within the inner space, wherein the further bonding profile preferably connects the component and the stacked layer structure to one another and / or surrounds a functional part, preferably at least one electrically conductive surface part, of the component on the first main surface in order to establish an electrical connection to the functional part within the component. This design enables the formation of subdivided spaces, so that, for example, different materials can be inserted into multiple spaces or a material can be selectively inserted into a single space.

[0041] In one embodiment, the inner space is empty, which can bring the advantage of saving material and thus reducing the mass of the component carrier.

[0042] Alternatively, the inner space can be at least partially filled with a material different from the material forming the bonding profile, wherein the material in the inner space preferably comprises a metal, in particular copper, and / or an insulating material, and / or residues, in particular residues from a temporary layer, and / or a material having functional properties, wherein preferred functional properties include transparency, mechanical reinforcement, heat dissipation, antenna properties, and / or high-frequency structures. This can offer the advantage of expanding the range of uses of the component carrier, since many different functions can be involved.

[0043] Preferably, the material within the inner space is an electrically conductive material, preferably copper, and is preferably electrically connected to at least one electrically conductive layer structure of the stack and / or to at least one electrically conductive surface portion of the component via at least one vertical connection. This has the advantage that no additional space is required for connection to or from the component, and due to the use of copper, a reliable electrical and / or thermal connection can be established.

[0044] The object of the present invention is also achieved by a method for producing a component carrier, which comprises the following steps, preferably in the following order:

[0045] (a) providing a component, preferably an electronic component, the component comprising a first main surface, a second main surface opposite to the first main surface, and at least one side surface connecting the first main surface and the second main surface to each other, wherein a first edge is formed at an intersection of the first main surface and the at least one side surface, and a second edge is formed at an intersection of the second main surface and the at least one side surface;

[0046] (b) providing a preferably continuously extending bonding profile in the region of the first edge of the component, preferably directly at the first edge;

[0047] (c) forming a component carrier which comprises a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure, and in which the component is at least partially, preferably completely, embedded.

[0048] The invention enables the component to be embedded in the component carrier, wherein the component can be better protected during the manufacture of the component-carrier assembly. In addition, a protection zone can be provided by the bonding profile (for the component), which also improves the stability of the component.

[0049] According to one embodiment, step (b) comprises applying an adhesive layer to the base layer, preferably a metal foil, and / or to the component, preferably by printing, in particular 3D printing and / or screen printing, and / or dispensing and / or laminating an adhesive foil, and then by a structuring process, for example by laser exposure and / or plasma treatment, and connecting the base layer and the component to one another via an adhesive profile, wherein the adhesive profile preferably encloses an interior space between the base layer and the first main surface of the component, wherein the interior space is preferably completely sealed off from the outside. This ensures a reliable connection of the component to the stack via the adhesive layer.

[0050] Preferably, step (c) comprises depositing the stack onto a substrate.

[0051] In a preferred embodiment, step (c) comprises at least partially, preferably completely, removing the base layer from the stack, preferably by etching, such that the first main surface of the component is at least partially exposed. This allows for easy access to the interior space.

[0052] In another embodiment, step (c) comprises applying a material, preferably an electrically conductive material, to the interior space enclosed by the bonding contour and / or to the first main surface of the component. This allows for the establishment of an electrical and / or thermal connection to or from the component in a simple manner using PCB-related manufacturing machines.

[0053] According to a preferred embodiment, step (c) comprises establishing an electrical connection to at least one electrically conductive portion of the component, preferably between at least one electrically conductive portion of the component and the stacked electrically conductive layer structure, through the inner space enclosed by the bonding contour.

[0054] As mentioned above, the adhesive profile may comprise a two-component adhesive. Preferably, the adhesive profile may be partially provided; separated into each of its two components, one of which may be provided on the component and the other on the stack, the two components fusing to each other when the component is inserted into the stack.

[0055] The step of providing a bonding profile may comprise a further step of pre-hardening the adhesive (or a defined area of ​​adhesive), preferably using UV light.

[0056] It is understood that, within the meaning of this application, a "material" can include one or more types of elements. It is also understood that even if two of the (first, second, and third) materials include the same element but differ in another element and / or composition and / or element ratio, they are still considered different from each other. For example, if the first material is a TiW alloy and the second material is Ti, then they are certainly different from each other.

[0057] In the context of this application, the term “component-carrier assembly” is understood to mean a combination of a component carrier and at least one electronic component.

[0058] In the context of this application, the term "component carrier" may particularly refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical and / or electronic carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interconnect, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers from the aforementioned types.

[0059] In the context of this application, the term "stack" may particularly refer to an arrangement of multiple planar layer structures that are mounted parallel to one another. These layer structures may include at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the stack may be a laminate of the electrically insulating and conductive layer structures, formed in particular by applying mechanical pressure and / or heat. The stack may provide a plate-shaped component carrier that can offer a large mounting surface for additional components. Nevertheless, in one example, the stack may be very thin and compact. In another example, the stack may be very thick for high-density products. The stacking direction (height / thickness) may be arranged in the vertical direction z. Furthermore, the stacking direction may be perpendicular to the two main extension directions (in the x and y directions) of the (plate-shaped) component carrier.

[0060] In the context of the present application, the term "layer structure" may particularly refer to a continuous or discontinuous layer, a patterned layer or a plurality of discontinuous islands in a common plane. A plurality of such layers stacked parallel to one another may form a stack in the vertical direction.

[0061] In the context of this application, the term "main surface" of an object may particularly refer to one of the two largest opposing surfaces of the object. The main surfaces may be connected by a circumferential side wall. The thickness of an object, such as a stack, may be defined by the distance between the two opposing main surfaces.

[0062] Preferably, the component carrier assembly is a printed circuit board (PCB) and / or a substrate (eg an IC substrate) and / or an interconnector.

[0063] In the context of this application, the term "printed circuit board" (PCB) may particularly refer to a plate-shaped component carrier formed by laminating multiple conductive layer structures with multiple electrically insulating layer structures, for example, by applying pressure and / or providing heat. As a preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or fiberglass, so-called prepreg or FR4 material. The various conductive layer structures can be interconnected in the desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and partially or completely filling these holes with conductive material (particularly copper), thereby forming via connections or any other through-hole connections. Filled holes connecting the entire stack (through-hole connections extending through multiple layers or the entire stack), or filling holes connecting at least two conductive layers, are referred to as vias. Similarly, optical interconnects can be formed through the various layers of the stack to form an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in the PCB, the PCB is typically configured to accommodate one or more components on one or two opposing surfaces of the plate-shaped PCB. These components can be connected to the respective main surfaces by soldering. The dielectric portion of a PCB may be composed of a resin and reinforcing fibers such as glass fiber.

[0064] In one embodiment, at least one electrically insulating layer structure comprises at least one member selected from the group consisting of a resin or polymer, such as an epoxy resin, a cyanate ester resin, a benzocyclobutene resin, a bismaleimide triazine resin, a polystyrene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcement structures, such as meshes, fibers, spheres, or other types of filler particles, such as those made of glass (laminated glass), may also be used to form a composite material. A prepreg resin combined with a reinforcing agent, such as fibers impregnated with the aforementioned resins, is referred to as a prepreg. These prepregs are typically named based on their properties, such as FR4 or FR5, which describe their flame retardancy. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials may also be used, particularly epoxy-based buildup materials (e.g., buildup films) or photoimageable dielectric materials. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can also be used as electrically insulating structures in the component carrier.

[0065] In one embodiment, the at least one conductive layer structure comprises at least one member selected from the group consisting of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions thereof may also be used, in particular coated with a superconducting material or a conductive polymer, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT), respectively.

[0066] In terms of surface treatment, the exposed conductive surface portions of the component carrier can also be selectively subjected to a surface finish. Such a surface finish can be a conductive covering material on the conductive layer structures (such as pads, conductive tracks, etc., particularly containing or consisting of copper) exposed on the surface of the component carrier. If such exposed conductive layer structures are not protected, the exposed conductive component carrier material (particularly copper) may oxidize, thereby reducing the reliability of the component carrier. The surface finish can then serve as the interface between the surface-mounted component and the component carrier. The function of the surface finish is to protect the exposed conductive layer structures (particularly copper circuits) and enable bonding to one or more components, such as by soldering. Examples of materials suitable for surface finish include organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (particularly hard gold), chemical tin, nickel-gold, nickel-palladium, etc.

[0067] According to another possible embodiment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the layer stack or component carrier in terms of surface treatment. For example, such a solder resist can be formed over the entire main surface and then patterned to expose one or more conductive surface portions that will be used to electrically connect the component carrier to the electronic peripheral device. The remaining surface portions of the component carrier covered with the solder resist, in particular those containing copper, can be effectively protected from oxidation or corrosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to provide a better understanding of the present invention, the present invention is explained in more detail with the help of the following drawings.

[0069] This is shown below in a highly simplified diagram:

[0070] Figure 1 An embodiment of a component carrier is shown;

[0071] Figure 2 An embodiment of an intermediate product having a base layer is shown;

[0072] Figure 3 An embodiment of an intermediate product with an applied bonding profile is shown;

[0073] Figure 4An embodiment showing an intermediate product with inserted components;

[0074] Figure 5 An embodiment of an intermediate product with an applied electrically insulating layer structure is shown;

[0075] Figure 6 An embodiment showing an intermediate product in the combining step;

[0076] Figure 7 An example of an intermediate product showing base layer removal;

[0077] Figure 8 An embodiment of an intermediate product with an applied conductive layer is shown;

[0078] Figure 9 An embodiment of a component carrier assembly is shown;

[0079] Figure 10 Another embodiment of a component carrier assembly is shown;

[0080] Figure 11 Another embodiment of a component carrier assembly is shown;

[0081] Figure 12 a and b show embodiments of the adhesive layer;

[0082] Figure 13 An example of an adhesive layer is shown. DETAILED DESCRIPTION

[0083] As an introduction, it should be noted that in the embodiments described in different ways, the same parts or method steps are represented by the same reference numerals or the same component names; at the same time, the disclosure contained in the entire description can be similarly applied to the same parts with the same reference numerals or the same component names. In addition, the position indications selected in the description, such as top, bottom, side, etc., refer to the figures directly shown and described; and if the position is changed, the position indication should be similarly applied to the new position.

[0084] These embodiments show possible variants; however, it should be noted in this regard that the invention is not limited to the variants specifically shown; on the contrary, combinations of various individual variants are also possible and, thanks to the technical information provided by the present invention, this possibility of variation is subject to the skills of a person skilled in the art working in this technical field.

[0085] The scope of protection is determined by the claims. However, the description and drawings serve to interpret the claims. Individual features or combinations of features from the various exemplary embodiments shown and described may constitute independent solutions according to the invention. The subject matter underlying the independent solutions according to the invention can be inferred from the description.

[0086] For the sake of order, it should finally be noted that some facts shown in the drawings have been represented not to scale and / or enlarged and / or reduced in size for the sake of a better understanding.

[0087] Figure 1 A carrier assembly 1 is shown, which comprises a component carrier 2 having a stack 4 of at least one electrically conductive layer structure 5 and at least one electrically insulating layer structure 6 .

[0088] The carrier assembly further comprises a component 10, preferably an electronic component, which is at least partially, preferably completely, embedded in the stack 4 and comprises a first main surface 11, a second main surface 12 opposite the first main surface 11, and at least one side surface 13 connecting the first main surface 11 and the second main surface 12 to one another, wherein a first edge 14 is formed at the intersection of the first main surface 11 and the at least one side surface 13, and a second edge 15 is formed at the intersection of the second main surface 12 and the at least one side surface 13, and wherein a preferably continuously extending bonding profile 3 is provided in the region of the first edge 14 of the component 10, preferably directly at the first edge. Figure 1 shown.

[0089] In one example, a first angle 26 in the range of 45° to 135°, in particular in the range of 70° to 110°, can be enclosed between the first main surface 11 and the side surface 13. Additionally or alternatively, a second angle 27 in the range of 45° to 135°, in particular in the range of 70° to 110°, can be enclosed between the second main surface 12 and the side surface 13.

[0090] As previously mentioned, the second edge 15 may be free of adhesive profiles, preferably free of adhesive, wherein preferably the entire second major surface 12 is free of adhesive. Alternatively, the second edge 15 and optionally the second major surface 12 may be covered by adhesive.

[0091] Preferably, the component 10 can be completely embedded in the stack 4 and the second edge 15 is covered by the at least one layer structure 5 , 6 of the stack 4 , wherein the second edge 15 is preferably in contact with the at least one layer structure 5 , 6 of the stack 4 .

[0092] As shown, the bonding profile 3 preferably connects the component 10 to a portion of the stack 4, preferably a layer structure 5, 6 (or core) of the stack 4. Furthermore, the bonding profile 3 can connect the component 10 to another component and a portion of the stack, wherein the component and the other component can be spaced apart from each other.

[0093] The first main surface 11 and / or the second main surface 12 , preferably at least the second main surface 12 , comprises at least one electrically conductive surface portion 8 , preferably a plurality of electrically conductive portions 8 , for establishing an electrical connection to the functional part 9 of the component 10 .

[0094] like Figure 1 As further shown, the bonding profile 3 is preferably in contact with the first edge 14 , preferably in particular such that the bonding profile 3 partially covers the first main surface 11 and / or partially covers the at least one side surface 13 .

[0095] The bonding profile 3 may be planar on a first side, preferably surface 24, wherein preferably the first side faces away from the component 10, and may be non-planar on a second side opposite the first side, wherein preferably the second side is in contact with the component 10. In another example, both the first side and the second side may be planar or non-planar.

[0096] As mentioned above, the bonding profile 3 is preferably in contact with the component 10 .

[0097] In another embodiment, independent of the embodiment shown, the component 10 may include a surface modification to improve the bonding properties between the component and the adhesive layer, such as an increased / enlarged effective contact surface, preferably in the region of the first edge 14 (or in the region of contact with the adhesive profile).

[0098] Also independent of the embodiment shown, the component may also comprise a plurality of surface elements 28, such as Figure 1 10 , for example, microfins, strips or the like, are shown in dashed lines in order to increase the effective surface area associated with the bonding profile, for example by providing small openings between the surface elements, wherein the openings can preferably have the same shape as the surface elements 28. The surface elements 28 can be arranged at least partially in the region of the first edge, preferably distributed over the entire circumference of the component 10 (relative to the extension of the bonding profile). The surface elements can be similar, preferably identical, repeatedly arranged elements.

[0099] Furthermore, as already mentioned, two-component adhesives can be used for bonding profiles, wherein one of the two components can be applied for the above-mentioned surface modification.

[0100] According to one embodiment, the bonding profile 3 can also be Figure 10 It is shown spaced a distance from the first edge 14 (irrelevant to the embodiment shown).

[0101] The bonding profile 3 is preferably in contact with at least one electrically insulating layer structure 6 of the stack 4 and / or with at least one electrically conductive layer structure 5 of the stack 4. The bonding profile 3 is preferably completely embedded. Alternatively, at least a portion of the bonding profile 3 may be exposed (at Figure 7 shown in ).

[0102] Preferably, the first side of the bonding profile 3 facing away from the component 10 (e.g., surface 24) is spaced apart from the first major surface 11 of the component 10, and / or the first major surface 11 is preferably spaced apart from the layer structure 5, 6 to which the bonding profile 3 connects the component 10. Thus, a distance 21 is shown, which is formed between the major surface and the surface 24 of the bonding profile facing away from the component 10. In one example, the distance 21 can be less than 10 µm. Alternatively, the distance 21 can be in the range of 10 µm to 50 µm.

[0103] The bonding profile 3 preferably has a frame shape and / or is a closed profile and / or is composed of a plurality of separated profiles and / or is in the form of at least one point, in particular a plurality of points. In one embodiment, the bonding profile 3 extends along the outer contour of the first major surface 11, preferably extends along the entire outer contour of the first major surface.

[0104] Preferably, the adhesive layer 3 and the component 10 are at least partially, preferably completely, arranged in and / or on the core (preferably comprising at least one electrically insulating structure and at least one electrically conductive layer structure) and / or the stacking structure of the stack 4.

[0105] The bonding contour 3 preferably encloses a preferably planar interior space 16 .

[0106] According to one embodiment, the inner space 16 may be empty, such as Figure 10 shown.

[0107] In an alternative embodiment, the inner space 16 is at least partially filled with a material 17 that is different from the material forming the bonding profile 3, wherein the material within the inner space 16 preferably comprises a metal, in particular copper and / or an insulating material and / or in particular residues from a temporary layer and / or a material with functional properties, wherein preferably the functional properties include transparency, mechanical reinforcement, heat dissipation, antenna properties and / or high-frequency structures.

[0108] Preferably, material 17 within inner space 16 is an electrically conductive material, preferably copper, and is electrically coupled to at least one electrically conductive layer structure 5 of stack 4 and / or to at least one electrically conductive surface portion 8 of component 10, preferably via at least one vertical connection.

[0109] like Figure 1 As further shown (also independent of the illustrated embodiment), at least one further bonding contour 18 can be provided in the interior space 16, wherein the further bonding contour 18 preferably connects the component 10 and the layer structures 5, 6 of the stack 4 to one another and / or can surround a functional part 8 of the component 10 on the first main surface 11, preferably around at least one electrically conductive surface part for establishing an electrical connection to a functional part 9 within the component 10.

[0110] Figures 2 to 9 A possible method for producing a component carrier arrangement 1 is shown, wherein intermediate products of several steps are illustrated by a cross-sectional view ( FIG. a ) and a top view ( FIG. b ).

[0111] Figures 2 to 9 The method shown comprises the following steps (preferably in the following order):

[0112] (a) providing a component 10, preferably an electronic component, comprising a first main surface 11, a second main surface 12 opposite the first main surface 11, and at least one side surface 13 connecting the first main surface 11 and the second main surface 12 to each other, wherein a first edge 14 is formed at the intersection of the first main surface 11 and the at least one side surface 13, and a second edge 15 is formed at the intersection of the second main surface 12 and the at least one side surface 13;

[0113] (b) providing a preferably continuously extending bonding profile 3 in the region of the first edge 14 of the component 10 , preferably directly at this first edge;

[0114] (c) Forming a component carrier 2 , which comprises a stack 4 of at least one electrically conductive layer structure 5 and at least one electrically insulating layer structure 6 , and in which the component 10 is at least partially, preferably completely, embedded.

[0115] According to another possible embodiment, step (b) of providing the bonding profile 3 can be performed after step (c) of forming the component carrier 2 .

[0116] The step of providing the bonding profile 3 may comprise applying the bonding layer 3 to the base layer 19, preferably a metal foil, and / or to the component 10, preferably by printing, in particular 3D printing and / or screen printing, and / or dispensing and / or laminating an bonding foil, and then by a structuring process, for example by laser exposure and / or plasma treatment, and connecting the base layer 19 and the component 10 to one another via the bonding profile 3. Preferably, the bonding profile 3 encloses an inner space 16 between the base layer 19 and the first main surface 11 of the component 10, wherein preferably the inner space 16 is completely sealed with respect to the outside, e.g. Figure 4 As already mentioned, the step of forming the component carrier 2 can be carried out before the step of providing the bonding profile 3 in the region of the first edge 14 of the component, for example in a possible printing process, in such a way that the component can be (at least partially) embedded in the stack, wherein the bonding profile can be provided in a subsequent step.

[0117] Preferably, step (c) comprises depositing the stack onto a substrate.

[0118] Step (c) may comprise at least partially, preferably completely, removing the base layer from the stack, preferably by etching, such that the first main surface of the component is at least partially exposed.

[0119] Step (c) may comprise applying a material, preferably an electrically conductive material, to the interior space enclosed by the bonding profile and / or to the first major surface of the component.

[0120] The step of setting the bonding profile may comprise a further step of pre-hardening the adhesive (or a defined area of ​​adhesive), preferably using UV light.

[0121] Alternatively, the bonding profile 3 can be applied to the component 10 before connecting the component 10 and the base layer (not shown). Furthermore, the bonding profile 3 can be applied partially to both the base layer 19 and the component 10. The bonding profile can comprise a two-component adhesive.

[0122] If you can Figure 2 b (or Figure 3 As can be seen in b), the bonding contour 3 can preferably have a frame shape and / or a closed contour.

[0123] As previously mentioned, the interior space 16 is preferably completely sealed from the exterior.

[0124] like Figure 4 a and Figure 4 As shown in FIG. 1 b , the bonding profile 3 preferably extends along the outer contour of the first main surface 11 , preferably along the entire outer contour of the first main surface.

[0125] The electronic component 10 preferably includes a conductive portion 8 (here in the form of a pad) on its second surface 12 for establishing an electrical connection with the functional portion 9 of the electronic component 10. In addition, in an exemplary embodiment, the electronic component 10 also includes a conductive portion 8 on its opposite first surface 11 for establishing a further electrical connection with the functional portion 9 of the electronic component 10 and / or for heat distribution. The conductive portion 8 can be a component pad or a layer that overlaps the pad, preferably preventing the component pad from being exposed. The conductive portion 8 can protrude from the main surface. Alternatively, the conductive portion 8 can be flush with the main surface or can be recessed in the main surface.

[0126] The step of forming the component carrier 2 may include depositing the stack 4 onto the substrate 19 .

[0127] As previously mentioned, the bonding profile 3 may be planar on a first side, preferably the surface 24 , wherein the bonding profile may be non-planar on a second side opposite the first side, wherein preferably the second side is in contact with the component 10 .

[0128] like Figure 4As shown in detail IV in a, the non-planar (second) side may include a stepped portion, for example, such that the cross-section of the bonding profile can be formed to resemble an "L" shape. Additionally (or alternatively), as shown by the dashed lines, the second side may include wavy and / or curved portions (when viewed in cross-section).

[0129] With regard to the stepped portion, provision may thus be made that the second side thereof as a whole may not be planar, but may consist of a plurality of planar surfaces which are preferably at right angles to one another (or preferably depending on the shape of the component).

[0130] At this point it should be mentioned that this geometry of the bonding contour 3 can also be provided before it comes into contact with the component 10 .

[0131] like Figure 5 As shown, an insulating layer structure 6 and / or a core is preferably applied to a base layer 19, wherein the core is also at least partially made of an insulating material, such as, but not limited to, resin (FR4), glass, ceramic, etc. Preferably, the thickness 23 of the insulating layer structure 6 (relative to the base layer 19) is at least equal to the height 22 of the component 10, preferably slightly higher than the height 22 of the component 10, for example preferably at least 5 μm higher.

[0132] For the sake of completeness, it should be mentioned at this point that a layer structure comprising different layers, for example a plurality of electrically insulating and electrically conductive layers, can be applied to the base layer.

[0133] Furthermore, a temporary layer 20 can be applied in the form of a release foil or the like on top of the second facing surface 12 of the intermediate product before the bonding step, preferably the crimping step, is carried out. Figure 6 The crimping tool 7 is shown in FIG.

[0134] After bonding, the temporary layer is preferably removed, for example by peeling.

[0135] The base layer 19 can also be removed from the stack at least partially, preferably completely, preferably by etching, so that the first main surface 11 of the component 10 is at least partially exposed, as shown. Figure 7 Alternatively, plasma treatment or chemical / mechanical polishing processes may be used.

[0136] Reference Figure 8 , forming at least one electrically conductive layer structure 5 so that the component 10 is at least partially, preferably completely, embedded in the stack. The at least one electrically conductive layer structure 5 may include an electrically insulating layer structure 6 and may consist of a copper-clad electrically insulating layer sheet. The copper-clad electrically insulating layer sheet may be applied to the stack using a lamination process.

[0137] Furthermore, a material 17 , preferably an electrically conductive material, can be applied to the inner space 16 enclosed by the bonding contour 3 and / or to the first main surface 11 of the component 10 .

[0138] Alternatively (or additionally), a mask or another filling material may be inserted or applied in the inner space 16. A resin or an electrically insulating material may also be filled or applied in the space.

[0139] As previously described, the step of forming the component carrier 2 may comprise establishing an electrical connection to at least one conductive portion 8 of the component 10 via the space 16 enclosed by the bonding contour 3 , preferably establishing an electrical connection between at least one conductive portion 8 of the component 10 and the conductive layer structure 5 of the stack 4 .

[0140] If a conductive layer 5 is provided on the top and / or bottom of the intermediate product, the material of the layer 5 is selectively removed. The selective removal can be done by using a laser beam, in particular a UV laser beam.

[0141] For example, an electrical connection may be provided between at least one conductive portion 8 and a trace formed after selective removal (e.g. Figure 9 a), you can set up a direct fan-out (or fan-in) structure (such as Figure 9 b).

[0142] Alternatively, the selective removal may be done by applying a mask, preferably from a photoresist, and subsequently etching. Optionally, after the material removal process, a cleaning or washing process may be applied, for example using a cleaning fluid, ie water or an organic solvent.

[0143] like Figure 10 and 11 As shown in dashed lines, component 10 may have non-planar side surfaces 13, such as concave or convex surfaces, or inclined surfaces.The first (or second) major surface may also be non-planar.

[0144] like Figure 11 As shown, the bonding profile may only partially cover the peripheral surface 13 of the component 10 .

[0145] and Figure 11 Regardless of the embodiment shown, the space 16 may be (at least partially) filled with a material 17 having specific properties, such as, but not limited to, a transparent material, a reinforcing material, an antenna or a high-frequency structure. Figure 11 As further shown, different materials 17 a and / or 17 b or elements may be inserted or filled in the space 16 .

[0146] Figure 12 Another embodiment of the bonding profile 3 is shown. Figure 12 The bonding profile of a) consists of multiple separate profiles. As shown by the dotted lines, the separate profile on each side can also consist of multiple profiles.

[0147] according to Figure 12The bonding profile of b is in the form of a plurality of dots, wherein the size, number, and spacing of the dots can be variably designed. For example, but not limited to, the dot size can range from 10µm to 300µm, preferably 20µm to 200µm, and the distance between dots can range from 10µm to 700µm, preferably 20µm to 500µm. The thickness of the bonding profile can range from 3µm to 50µm, preferably 5µm to 30µm. Combinations of dots and profiles are also possible.

[0148] Figure 13 Another embodiment of the bonding profile 3 is shown, wherein the bonding profile 3 comprises a reinforcement profile 25, wherein the reinforcement profile 25 is preferably completely covered by the bonding profile 3. The reinforcement profile can have a shape corresponding to the shape or profile of the bonding profile 3 after insertion of the component 10, for example similar to an "L" shape.

[0149] Preferably, the reinforcement profile can be covered with a pre-cured resin and / or one component of a two-component adhesive to form a bonding profile 3 .

[0150] like Figure 13 As further shown by dashed lines, the component 10 may also include a surface element 28 as described above, wherein the reinforcing profile 25 may include a second surface element formed complementary to the surface element 28 of the component 10, for example, they may be formed so that they engage in openings of the other element 28.

[0151] Reference Signs List

[0152] 1 carrier component

[0153] 2 component carriers

[0154] 3 bonding profiles

[0155] 4 stacks

[0156] 5 Conductive layer structure

[0157] 6Insulation layer structure

[0158] 7. Crimping tool

[0159] 8 Conductive surface part

[0160] 9 Functional parts

[0161] 10 parts

[0162] 11 first main surface

[0163] 12 second main surface

[0164] 13 side surface

[0165] 14 First Edge

[0166] 15 The Second Edge

[0167] 16 Space

[0168] 17 Materials

[0169] 18 bonding profiles

[0170] 19 Grassroots

[0171] 20 temporary layers

[0172] 21 Distance

[0173] 22 height

[0174] 23 thickness

[0175] 24 surfaces

[0176] 25 Enhanced Contour

[0177] 26 First Angle

[0178] 27 Second Angle

[0179] 28 surface elements

Claims

1. A component carrier assembly (1), comprising: A component carrier (2) comprising a stack (4) of at least one electrically conductive layer structure (5) and at least one insulating layer structure (6), and A component (10) at least partially embedded in the stack (4) and comprising a first main surface (11), a second main surface (12) opposite the first main surface (11), and at least one side surface (13) connecting the first main surface (11) and the second main surface (12) to each other, wherein a first edge (14) is formed at the intersection of the first main surface (11) and the at least one side surface (13), and a second edge (15) is formed at the intersection of the second main surface (12) and the at least one side surface (13), Therein, an adhesive contour (3) is provided in the region of a first edge (14) of the component (10).

2. The component carrier according to claim 1, wherein The second edge (15) has no bonding profile.

3. The component carrier according to claim 1 , wherein: The component (10) is completely embedded in the stack (4), and the second edge (15) is covered by at least one layer structure (5, 6) of the stack (4).

4. The component carrier according to claim 1 , wherein: The bonding profile (3) connects the component (10) and a part of the stack (4), preferably the layer structure (5, 6) or the core of the stack (4), to one another.

5. The component carrier according to claim 1, wherein: The first main surface (11) and / or the second main surface (12), preferably at least the second main surface (12), comprises at least one electrically conductive surface portion (8) for establishing an electrical connection to a functional part (9) of the component (10).

6. The component carrier according to claim 1, wherein: The bonding profile (3) is in contact with the first edge (14).

7. The component carrier according to claim 1, wherein: The bonding profile (3) partially covers the first main surface (11) and / or partially covers the at least one side surface (13).

8. The component carrier according to claim 1, wherein: The bonding contour (3) is planar on a first side and non-planar on a second side opposite the first side, wherein the second side is preferably in contact with the component (10).

9. The component carrier according to claim 1, wherein: The bonding profile (3) is spaced a distance from the first edge (14).

10. The component carrier according to claim 1, wherein: The bonding profile (3) is in contact with at least one electrically insulating layer structure (6) of the stack (4) and / or with at least one electrically conductive layer structure (5) of the stack (4).

11. The component carrier according to claim 1, wherein: The bonding profile (3) is in contact with the component (10).

12. The component carrier according to claim 1, wherein: The surface of the bonding profile (3) facing away from the component (10) is spaced apart from the first main surface (11) of the component (10), and / or the first main surface (11) is spaced apart from the layer structure (5, 6) to which the bonding profile (3) connects the component (10).

13. The component carrier according to claim 1, wherein: The bonding contour (3) has a frame shape and / or is a closed contour and / or consists of a plurality of separate contours and / or is in the form of at least one point, in particular a plurality of points.

14. The component carrier according to claim 1, wherein: The adhesive layer (3) and the component (10) are arranged at least partially, preferably completely, within and / or on the core and / or the stacking structure of the stack (4).

15. The component carrier according to claim 1, wherein: The bonding profile (3) extends along the outer contour of the first main surface (11), preferably along the entire outer contour of said first main surface.

16. The component carrier according to claim 1, wherein: The bonding contour (3) encloses a preferably planar interior space (16).

17. The component carrier according to claim 16, wherein At least one further bonding contour (18) is provided in the interior space (16), wherein the further bonding contour (18) preferably connects the component (10) and the layer structure (5, 6) of the stack (4) to one another and / or surrounds at least one electrically conductive surface portion of a functional part (8) of the component (10) on the first main surface (11), preferably for establishing an electrical connection to a functional part (9) within the component (10).

18. The component carrier according to claim 16 or 17, wherein The inner space (16) is empty.

19. The component carrier according to claim 17, wherein: The inner space (16) is at least partially filled with a material (17) that is different from the material forming the bonding profile (3).

20. The component carrier according to claim 1, wherein: The material (17) in the inner space (16) is an electrically conductive material, preferably copper, and is electrically connected to at least one electrically conductive layer structure (5) of the stack (4).

21. A method for producing a component carrier assembly (1) according to one of the preceding claims, comprising the following steps: (a) providing a component (10), preferably an electronic component, comprising a first main surface (11), a second main surface (12) opposite to the first main surface (11), and at least one side surface (13) connecting the first main surface (11) and the second main surface (12) to each other, wherein a first edge (14) is formed at the intersection of the first main surface (11) and the at least one side surface (13), and a second edge (15) is formed at the intersection of the second main surface (12) and the at least one side surface (13); (b) providing a bonding profile (3) in the region of a first edge (14) of the component (10); (c) forming a component carrier (2) comprising a stack (4) of at least one electrically conductive layer structure (5) and at least one electrically insulating layer structure (6), and wherein the component (10) is at least partially, preferably completely, embedded in the stack (4).

22. The method according to claim 21, wherein Step (b) comprises applying an adhesive layer (3) to the base layer (19) and / or the component (10) and connecting the base layer (19) and the component (10) to one another via the adhesive profile (3).

23. The method according to claim 21 or 22, wherein Step (c) comprises depositing the stack (4) onto a substrate (19).

24. The method according to any one of claims 21 to 23, wherein: Step (c) comprises at least partially, preferably completely, removing the base layer (19) from the stack, preferably by etching, so that the first main surface (11) of the component (10) is at least partially exposed.

25. The method according to any one of claims 21 to 24, wherein: Step (c) comprises applying a material (17), preferably an electrically conductive material, to the space (16) enclosed by the bonding profile (3) and / or to the first main surface (11) of the component (10).

26. The method according to any one of claims 21 to 25, wherein: Step (c) comprises establishing an electrical connection to at least one electrically conductive portion (8) of the component (10), preferably between at least one electrically conductive portion (8) of the component (10) and the electrically conductive layer structure (5) of the stack (4), via the space (16) enclosed by the bonding contour (3).

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