Bonding apparatus and method of manufacturing display device using same

Abstract

The invention relates to a bonding apparatus and a method of manufacturing a display device. The bonding apparatus includes a first unit and a second unit. The first unit includes: a first temperature control unit; and first fastening holes defined through the first unit and spaced apart from each other in the first direction, where the first unit has a first coefficient of thermal expansion. The second unit is disposed under and in contact with the first unit. The second unit includes: a second temperature control unit; and a second fastening hole defined through the second unit and spaced apart from each other in the first direction, where the second unit has a second coefficient of thermal expansion. The joining apparatus includes: fastening members each inserted into a respective first fastening hole and a respective second fastening hole, where the respective second fastening hole is aligned with the respective first fastening hole; and a stage disposed below the second unit.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2024-0034881, filed on March 13, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to a bonding apparatus that can be used in a manufacturing process of a display device and a method of manufacturing a display device using the bonding apparatus. Background Art

[0004] The display device generates images and provides the images to the user through its display screen.

[0005] The display device includes a plurality of pixels. The pixels receive electrical signals via signal lines. A bonding process may be performed to bond circuit components to pad portions corresponding to ends of the signal lines. The circuit components may include a data driver, a flexible circuit board, and other components. Summary of the Invention

[0006] The present disclosure provides a bonding apparatus capable of preventing thermal deformation of a pressing unit, which can prevent pressing defects.

[0007] The present disclosure provides a method of manufacturing a display device capable of selecting a first unit and a second unit included in a bonding apparatus in consideration of a reference temperature in a bonding process, or setting an appropriate reference temperature in consideration of the first unit and the second unit.

[0008] An embodiment supported by the present disclosure provides a joining device, comprising: a first unit, including a first temperature control part and first fastening holes defined as passing through the first unit and spaced apart from each other in a first direction, wherein the first unit has a first thermal expansion coefficient; a second unit, arranged below the first unit and in contact with the first unit, the second unit including a second temperature control part and second fastening holes defined as passing through the second unit and spaced apart from each other in the first direction, wherein the second unit has a second thermal expansion coefficient; fastening members, each inserted into a corresponding first fastening hole in the first fastening hole and a corresponding second fastening hole in the second fastening hole, wherein the corresponding second fastening holes are aligned with the corresponding first fastening holes in the first direction; and a stage, arranged below the second unit.

[0009] The first temperature control section and the second temperature control section may be configured to adjust the temperature of the first unit and the temperature of the second unit, respectively, based on a relationship between a value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first unit and a value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second unit.

[0010] The first temperature control portion and the second temperature control portion are configured to adjust the temperature of the first unit and the temperature of the second unit, respectively, so that a value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first unit is within a range of about 0.9 times to about 1.1 times a value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second unit.

[0011] The first temperature control part is disposed above the first fastening hole.

[0012] The second temperature control part is disposed below the second fastening hole.

[0013] The first unit and the second unit extend in a first direction.

[0014] A length of the first unit extending in the first direction is equal to a length of the second unit extending in the first direction.

[0015] The first temperature control part includes a first temperature sensor and a first resistor heating wire.

[0016] The second temperature control part includes a second temperature sensor and a second resistor heating wire.

[0017] The first temperature control part penetrates the first unit and is provided in the first unit.

[0018] The second temperature control part penetrates the second unit and is provided in the second unit.

[0019] The second unit includes a tip portion defined in a lower portion of the second unit, and the tip portion protrudes in a direction from the second unit toward the stage.

[0020] The tip portion includes a flat lower surface.

[0021] The fastening members are provided in the first fastening hole and the second fastening hole.

[0022] At least one of the first unit and the second unit includes tungsten carbide.

[0023] The engaging device also includes a head disposed on and coupled with the first unit.

[0024] The upper surface of the stage has a flat surface defined by a first direction and a second direction intersecting the first direction.

[0025] The head is configured to reciprocate in a third direction intersecting the first direction and the second direction.

[0026] Embodiments supported by the present disclosure provide a method for manufacturing a display device. The method includes: aligning a circuit component on a prepared display panel including a solder pad on a stage; placing a pressing unit including a first unit and a second unit above the circuit component, wherein the first unit includes a first temperature control portion, and the second unit is disposed below the first unit and includes a second temperature control portion; and pressing the circuit component using the pressing unit in association with bonding the circuit component to the solder pad. Bonding the circuit component to the solder pad includes: adjusting the temperature of the first unit using the first temperature control portion or adjusting the temperature of the second unit using the second temperature control portion; and moving the pressing unit downward based on determining that each of the first unit and the second unit is at a corresponding reference temperature.

[0027] Adjusting the temperature of the first unit or the temperature of the second unit is based on achieving or maintaining a first ratio of the temperature of the second unit to the temperature of the first unit, such that the first ratio is within a range of about 0.9 times to about 1.1 times a second ratio of a first coefficient of thermal expansion of the first unit to a second coefficient of thermal expansion of the second unit.

[0028] The first temperature control part includes a first temperature sensor and a first resistor heating wire.

[0029] The second temperature control part includes a second temperature sensor and a second resistor heating wire.

[0030] Adjusting the temperature of the first unit or the second unit includes providing current to at least one of the first resistor heating wire and the second resistor heating wire.

[0031] The second unit includes a tip portion defined in a lower portion of the second unit, and the tip portion protrudes in a direction from the second unit toward the stage.

[0032] Engaging the circuit member includes maintaining the tip portion in contact with the circuit member such that the tip portion transfers heat to the circuit member.

[0033] Embodiments supported by the present disclosure provide a method for manufacturing a display device. The method includes: selecting a first unit from a plurality of first units and selecting a second unit from a plurality of second units, wherein the first unit includes a first temperature control portion and the second unit includes a second temperature control portion; forming a pressing unit including the first unit and the second unit, wherein the second unit is coupled to a lower portion of the first unit; aligning a circuit member on a prepared display panel including a pad on a stage; placing the pressing unit above the circuit member; and moving the pressing unit downward in association with bonding the circuit member to the pad.

[0034] Bonding the circuit member to the pad includes adjusting or maintaining the selected first unit according to a first reference temperature by the first temperature control section, and adjusting or maintaining the selected second unit according to a second reference temperature by the second temperature control section.

[0035] Forming the pressing unit includes placing the second unit on the lower portion of the first unit; and inserting each of the fastening members into a corresponding first fastening hole defined as passing through the first unit and spaced apart from each other in the first direction and a corresponding second fastening hole defined as passing through the second unit and spaced apart from each other in the first direction.

[0036] The first temperature control unit includes a first temperature sensor and a first resistor heating wire, the second temperature control unit includes a second temperature sensor and a second resistor heating wire, and adjusting or maintaining the first unit according to the first reference temperature includes providing current to the first resistor heating wire, and adjusting or maintaining the second unit according to the second reference temperature includes providing current to the second resistor heating wire.

[0037] The second unit includes a tip portion defined in a lower portion of the second unit, and the tip portion protrudes in a direction from the second unit toward the stage.

[0038] Bonding the circuit component to the pad includes maintaining the tip portion in contact with the circuit component while bonding the circuit component to the pad such that the tip portion transfers heat to the circuit component.

[0039] According to the embodiments of the present disclosure described herein, the bonding device prevents thermal deformation of the first and second units. Therefore, the lower surface of the second unit remains a flat surface, and thus, the bonding device provides uniform pressure to the entire area of ​​the circuit member through the flat surface of the second unit.

[0040] According to an embodiment of the present disclosure, a method for manufacturing a display device can prevent thermal deformation of a first unit and a second unit of a bonding device, which can prevent the cost associated with replacing the first unit or the second unit due to deformation. Thus, for example, the time and cost of replacing a deformed first unit or a deformed second unit can be reduced or eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and other advantages of the present disclosure will become readily apparent by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0042] Figure 1 is a perspective view of a bonding device according to an embodiment of the present disclosure;

[0043] Figure 2 is a side view of a pressing unit according to an embodiment of the present disclosure;

[0044] Figure 3 is a side view of the first unit and the second unit before the first unit and the second unit are assembled with each other;

[0045] Figure 4 is a side view of the first unit and the second unit after the first unit and the second unit are assembled with each other;

[0046] Figure 5 This includes the use of Figure 1 A perspective view of an electronic device with a display panel manufactured by the bonding apparatus shown in FIG;

[0047] Figure 6 yes Figure 5 An exploded perspective view of the electronic device shown in ;

[0048] Figure 7 yes Figure 6 A plan view of the display panel shown in ;

[0049] Figure 8 yes Figure 6 an enlarged perspective view of a portion of the display panel shown in ;

[0050] Figure 9 and Figure 10 is a perspective view of a bonding device according to an embodiment of the present disclosure;

[0051] Figure 11 yes Figure 10 A side view of the engagement device shown in ;

[0052] Figure 12 and Figure 13 is a view showing a deformation length of a pressing unit;

[0053] 14A to 14F is a graph showing deformation lengths according to changes in temperature and thermal expansion coefficients of the first unit and the second unit; and

[0054] Figures 15 to 17 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0055] The present disclosure can be modified and implemented in many different forms, and therefore, exemplary embodiments supported by the present disclosure will be shown in the accompanying drawings and described in detail below. However, the present disclosure should not be limited to the specific disclosed form, and should be interpreted as including all modifications, equivalents or substitutes included in the spirit and scope of the present disclosure.

[0056] In this disclosure, it will be understood that when an element (or region, layer or portion) is referred to as being "on," "connected to" or "coupled to" another element or layer, the element can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0057] Like reference numerals always represent like elements. In the accompanying drawings, the thickness, proportions and sizes of components are exaggerated for the effective description of the technical content. As used herein, the term "and / or" may include any and all combinations of one or more of the related listed items.

[0058] It will be understood that although the terms first, second, etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish an element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below can be referred to as the second element. As used herein, the singular "a", "an", and "the" are intended to also include plural forms, unless the context clearly indicates otherwise.

[0059] For ease of description, spatially relative terms such as “below,” “beneath,” “lower,” “above,” “upper,” etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings.

[0060] It will also be understood that the terms “include” and / or “includes”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0061] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted as idealized or overly formalized unless explicitly defined as such herein.

[0062] As used herein, the terms "about" or "approximately" are inclusive of the stated value and include a suitable range of deviation from the particular value as determined by one of ordinary skill in the art, given the measurements in question and the errors associated with the measurement of a particular quantity. For example, the term "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0063] As used herein, the term "substantially" means approximately or practically. The term "substantially equal" means approximately equal or practically equal. The term "substantially identical" means approximately identical or practically identical. The term "substantially perpendicular" means approximately perpendicular or practically perpendicular. The term "substantially parallel" means approximately parallel or practically parallel.

[0064] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0065] Figure 1 is a perspective view of a bonding apparatus BTA according to an embodiment of the present disclosure.

[0066] refer to Figure 1 , the bonding apparatus BTA may include a stage STG, a pressing unit PU, a connecting portion CST, a head HP, and a guide portion GP.

[0067] The stage STG may be provided at the lowest position in the bonding apparatus BTA. The stage STG may provide a display panel P-DP (refer to FIG. Figure 9 ) flat surface.

[0068] The stage STG may have a rectangular parallelepiped shape. When viewed on a plane, the stage upper surface SU may have a rectangular shape having short sides extending in a first direction DR1 and long sides extending in a second direction DR2 intersecting the first direction DR1. However, the shape of the stage STG or the shape of the stage upper surface SU should not be particularly limited as long as a preliminary display panel P-DP (reference display panel 100) is provided thereon. Figure 9 )'s flat upper surface.

[0069] Hereinafter, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 may be referred to as a third direction DR3 .

[0070] The suction holes VFH may be defined through the upper surface SU of the stage. The suction holes VFH may be arranged in the first direction DR1 and the second direction DR2. The inside of the suction holes VFH may be maintained in a vacuum state, and thus, the display panel P-DP (reference Figure 9 ) can be fixed to the upper surface SU of the table.

[0071] Although not separately shown, the bonding apparatus BTA may further include a motor to maintain a vacuum state in the suction holes VFH.

[0072] The guide portion GP may be provided on the stage STG. The guide portion GP may be provided adjacent to one of the opposite sides of the stage STG in the second direction DR2. The guide portion GP may play a role in guiding the reciprocating movement of the head HP, which will be described later. Although not separately illustrated, the guide portion GP may be connected to a separate fixing member, and its position may be fixed.

[0073] The guide portion GP may have a rectangular parallelepiped shape. However, the shape of the guide portion GP should not be particularly limited as long as the guide portion GP functions in the reciprocating movement of the guide head HP.

[0074] The head HP may be disposed on one of opposite sides of the guide portion GP in the second direction DR2. The head HP may be disposed on and coupled with the first unit UT1. The head HP may be disposed on and adjacent to one side of the stage STG.

[0075] The head HP may reciprocate along one side of the guide portion GP in the third direction DR3 . Therefore, the pressing unit PU coupled to the head HP may reciprocate in the third direction DR3 .

[0076] like Figure 1 As shown in FIG, the head HP has a rectangular parallelepiped shape, however, the shape of the head HP should not be particularly limited as long as the guide portion GP provides a side on which the head HP reciprocates in the third direction DR3.

[0077] The connection portion CST may be connected to the lower surface of the head HP. The connection portion CST may be provided between the stage STG and the head HP. The head HP may be connected to the pressing unit PU through the connection portion CST.

[0078] The pressing unit PU may be connected to the connection portion CST and may be disposed under the head HP. Therefore, when the head HP reciprocates in the third direction DR3, the pressing unit PU may reciprocate in the third direction DR3 together with the head HP.

[0079] Therefore, the pressing unit PU can be in direct contact with the circuit member and can be used in preparing the display panel P-DP (refer to FIG. Figure 9 ) is applied to the circuit components during the bonding process. This will be described in detail later.

[0080] The pressing unit PU may include a first unit UT1 and a second unit UT2 disposed under the first unit UT1 .

[0081] The first unit UT1 and the second unit UT2 may be configured to prepare the display panel P-DP (refer to Figure 9The first unit UT1 may be coupled to the second unit UT2 by a fastening member SCW.

[0082] The first unit UT1 and the second unit UT2 may be lowered to press the circuit member after being coupled to each other by the fastening member SCW. That is, the heated first unit UT1 and the second unit UT2 may apply target heat and pressure to the circuit member to support the bonding process to attach the circuit member to the pads DP-PD (refer to FIG. Figure 7 ).

[0083] However, when the first unit UT1 and the second unit UT2 have different thermal expansion coefficients, the shape of the pressing unit PU may be deformed due to the difference in thermal expansion between the first unit UT1 and the second unit UT2. In other words, when the thermal expansion of the first unit UT1 is different from that of the second unit UT2, the shape of the pressing unit PU may be deformed.

[0084] Hereinafter, a method of controlling the temperature of the first unit UT1 and the second unit UT2 by using the temperature control parts TC1 and TC2 (refer to FIG. Figure 4 ) to control the temperature of each of the first unit UT1 and the second unit UT2 to prevent deformation of the pressing unit PU in a bonding process, and a method of manufacturing a display device using the bonding apparatus BTA.

[0085] Figure 2 is a side view of the pressing unit PU according to an embodiment of the present disclosure. Figure 3 1 is a side view of the first unit UT1 and the second unit UT2 before they are assembled with each other. Figure 4 1 is a side view of the first unit UT1 and the second unit UT2 after the first unit UT1 and the second unit UT2 are assembled with each other.

[0086] In the following, reference will be made to Figures 2 to 4 The structure and function of the pressing unit PU are described.

[0087] refer to Figure 2 , the pressing unit PU may include a first unit UT1 and a second unit UT2.

[0088] The first unit UT1 may include a first portion PT1, a second portion PT2, and a first temperature control part TC1. However, the first portion PT1 and the second portion PT2 are distinguished from each other only for convenience of explanation, and the first unit UT1 may have a continuous, integrated shape.

[0089] The first insertion opening OP1 may be defined to pass through the first portion PT1. The first insertion opening OP1 may be an opening that passes through the first portion PT1 and extends in the first direction DR1. The first temperature control portion TC1 may be disposed in the first insertion opening OP1. That is, the first temperature control portion TC1 may be disposed inside the first insertion opening OP1.

[0090] like Figure 2 As shown in FIG, the first insertion opening OP1 has a circular shape when viewed in the first direction DR1. However, the shape of the first insertion opening OP1 should not be particularly limited as long as the first temperature control part TC1 is disposed in the first insertion opening OP1.

[0091] The second portion PT2 may be defined below the first portion PT1. Figure 2 As shown in FIG, the second portion PT2 has a quadrangular shape when viewed in the first direction DR1, but the shape of the second portion PT2 should not be particularly limited.

[0092] A first fastening hole CH1 described later may be defined through the second portion PT2. In the present embodiment, the first fastening hole CH1 may be an opening penetrating the second portion PT2 of the first unit UT1 along the second direction DR2.

[0093] The first temperature control part TC1 may be disposed above the first fastening hole CH1, and the second temperature control part TC2 may be disposed below the second fastening hole CH2. Therefore, when viewed in the first direction DR1 or the second direction DR2, the first temperature control part TC1 may not overlap with the first fastening hole CH1, and the second temperature control part TC2 may not overlap with the second fastening hole CH2.

[0094] The first unit UT1 may include a first material having a first thermal expansion coefficient. As an example, the first material may include an extremely hard material, such as Or tungsten carbide.

[0095] The second unit UT2 may be disposed under the first unit UT1 and may be in contact with the first unit UT1.

[0096] The second unit UT2 may include a fastening portion CP, a tip portion TP, and a second temperature control portion TC2. However, the fastening portion CP and the tip portion TP are distinguished from each other only for convenience of explanation, and the second unit UT2 may have a continuous, integrated shape.

[0097] The second insertion opening OP2 may be defined as passing through the fastening portion CP. The second insertion opening OP2 may be an opening that passes through the fastening portion CP and extends in the first direction DR1. The second temperature control portion TC2 may be disposed in the second insertion opening OP2. That is, the second temperature control portion TC2 may be disposed inside the second insertion opening OP2.

[0098] Figure 2 The second insertion opening OP2 having a circular shape when viewed from one side of the second insertion opening OP2 is shown as a representative example, however, the shape of the second insertion opening OP2 should not be particularly limited as long as the second temperature control part TC2 is provided in the second insertion opening OP2.

[0099] The tip portion TP may be defined at a lower portion of the fastening portion CP. The tip portion TP may be positioned toward the stage STG (reference Figure 1 ) protrudes from the second unit UT2 in a direction of . That is, the tip portion TP may have a shape that protrudes downward from the fastening portion CP.

[0100] The lower surface TB may be defined at the lower portion of the tip portion TP. The lower surface TB may be in direct contact with the circuit board during the bonding process and may press the circuit board. Therefore, the lower surface TB may be flat to apply uniform pressure to the circuit member.

[0101] The second unit UT2 may include a second material having a second thermal expansion coefficient. As an example, the second material may include an extremely hard material, such as Or tungsten carbide.

[0102] refer to Figure 3 , first fastening holes CH1 may be defined through the first unit UT1 and may be spaced apart from each other in the first direction DR1, and second fastening holes CH2 may be defined through the second unit UT2 and may be spaced apart from each other in the first direction DR1.

[0103] A separation distance between the first fastening holes CH1 may be substantially the same as a separation distance between the second fastening holes CH2 .

[0104] In this embodiment, the first unit UT1 and the second unit UT2 may extend in the first direction DR1. The length of the first unit UT1 in the first direction DR1 may be referred to as a first length L1, and the length of the second unit UT2 in the first direction DR1 may be referred to as a second length L2.

[0105] In the pressing unit PU, the first length L1 may be substantially the same as the second length L2.

[0106] According to the conventional pressing unit, the first unit and the second unit have different lengths in the first direction DR1 to compensate for a difference in thermal expansion amount between the first unit and the second unit in the first direction DR1.

[0107] However, according to the pressing unit PU of the present disclosure, the temperature of each of the first unit UT1 and the second unit UT2 can be set by taking into account the thermal expansion coefficients of the first unit UT1 and the second unit UT2, and thus, the first unit UT1 and the second unit UT2 can have substantially the same amount of thermal expansion in the first direction DR1. Therefore, even if the first length L1 and the second length L2 are the same, the pressing unit PU can be prevented from being deformed due to the difference in the amount of thermal expansion between the first unit UT1 and the second unit UT2.

[0108] However, the first length L1 and the second length L2 should not be particularly limited as long as the separation distance between the first fastening holes CH1 is the same as the separation distance between the second fastening holes CH2.

[0109] Figure 4 The assembled state of the first unit UT1 and the second unit UT2 by the fastening member SCW is shown.

[0110] The first fastening hole CH1 may be defined to pass through the second portion PT2 of the first unit UT1, and the second fastening hole CH2 (see Figure 3 ) may be defined as a fastening portion CP passing through the second unit UT2. The first unit UT1 and the second unit UT2 may be coupled and fixed to each other by the fastening member SCW.

[0111] The first unit UT1 and the second unit UT2 may be coupled to each other by inserting the fastening member SCW into the first and second fastening holes CH1 and CH2 in a state in which at least a portion of the second portion PT2 overlaps the fastening part CP.

[0112] Although not separately shown, the first temperature control unit TC1 may include a first temperature sensor and a first heating member, and may be connected to an external power source. For example, the first heating member may be a resistive element, such as a first resistor heating wire. Thus, when a voltage is applied to the first temperature control unit TC1, the first resistor heating wire may generate heat.

[0113] Heat generated from the first temperature control part TC1 may be transferred to the first portion PT1 and the second portion PT2 .

[0114] The first temperature sensor of the first temperature control part TC1 may measure the temperature of the first unit UT1 .

[0115] When the temperature of the first unit UT1 is lower than the target temperature of the first unit UT1 used in the bonding process, the external power supply may apply a voltage to the first resistor heating wire, and thus the first resistor heating wire may generate heat. In the present disclosure, the target temperature of the first unit UT1 used in the bonding process may be referred to as a first reference temperature.

[0116] The first temperature control part TC1 may increase the temperature of the first unit UT1 until the temperature of the first unit UT1 reaches a first reference temperature.

[0117] When the temperature of the first unit UT1 is equal to the first reference temperature, the first temperature control unit TC1 can generate a small amount of heat to compensate for the heat dissipated from the first unit UT1 to the atmosphere, thereby maintaining the temperature of the first unit UT1. In other words, the first temperature control unit TC1 can maintain the temperature of the first unit UT1 at the first reference temperature for the bonding process (e.g., required in the bonding process).

[0118] Although not separately shown, the second temperature control part TC2 may include a second temperature sensor and a second heating member, and may be connected to an external power source. The second heating member may be a resistive element, such as, for example, a second resistor heating wire.

[0119] Heat generated from the second temperature control portion TC2 may be transferred to the fastening portion CP and the tip portion TP.

[0120] The second temperature sensor of the second temperature control unit TC2 can measure the temperature of the second unit UT2. In an example where the temperature of the second unit UT2 is lower than the second reference temperature, an external power supply can apply a voltage to the second resistor heating wire to generate heat. In other words, the second temperature control unit TC2 can increase the temperature of the second unit UT2 to a second reference temperature for the bonding process (e.g., required in the bonding process).

[0121] When the temperature of the second unit UT2 is equal to the second reference temperature, the temperature sensor of the second temperature control unit TC2 can generate a small amount of heat to compensate for the heat dissipated from the second unit UT2 to the atmosphere, thereby maintaining the temperature of the second unit UT2. In other words, the second temperature control unit TC2 can maintain the temperature of the second unit UT2 at the second reference temperature for the bonding process (for example, required in the bonding process).

[0122] The first temperature control unit TC1 and the second temperature control unit TC2 can adjust the temperature of the first unit UT1 and the temperature of the second unit UT2 so that the length change rate is within a certain value range. In the present disclosure, the length change rate can be defined as a value obtained by subtracting a value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second unit UT2 from a value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first unit UT1.

[0123] The first temperature control unit TC1 and the second temperature control unit TC2 can adjust the temperature of the first unit UT1 and the temperature of the second unit UT2 so that the value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first unit UT1 is within a range of about 0.9 times to about 1.1 times the value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second unit UT2. In the present disclosure, the temperature change amount of a specific unit may refer to a value obtained by subtracting the temperature of the specific unit before adjustment by the temperature control unit from the temperature of the specific unit after adjustment by the temperature control unit when the temperature of the specific unit is adjusted by the temperature control unit.

[0124] However, preferably, the first temperature control part TC1 and the second temperature control part TC2 can respectively adjust the temperature of the first unit UT1 and the temperature of the second unit UT2 so that the value obtained by multiplying the first thermal expansion coefficient by the temperature of the first unit UT1 is equal to the value obtained by multiplying the second thermal expansion coefficient by the temperature of the second unit UT2.

[0125] Therefore, the amount of thermal expansion of the first unit UT1 may be the same as the amount of thermal expansion of the second unit UT2 , or may differ from the amount of thermal expansion of the second unit UT2 by approximately 10%.

[0126] Since the bonding apparatus BTA according to the present disclosure may use the first and second temperature control parts TC1 and TC2 to flatten the lower surface TB of the tip portion TP, bonding defects may be prevented from occurring.

[0127] Figure 5 This includes the use of Figure 1 3D is a perspective view of an electronic device ED with a display panel manufactured by the bonding apparatus BTA shown in FIG. Figure 6 yes Figure 5 Exploded perspective view of the electronic device ED shown in FIG.

[0128] refer to Figure 5 and Figure 6, the electronic device ED can be activated in response to an electrical signal. In this embodiment, a smartphone is shown as a representative example of the electronic device ED. However, the present disclosure should not be limited thereto or thereby, and the electronic device ED can be applied to various electronic products such as, for example, personal computers, notebook computers, televisions, personal digital assistants, car navigation units, game units, smartphones, tablet computers, cameras, and the like.

[0129] The electronic device ED can display an image IM via the display surface ED-IS. Figure 5 An icon image is shown as a representative example of the image IM. The display surface ED-IS may be substantially parallel to a plane defined by the first direction DR1 and the second direction DR2.

[0130] The display surface ED-IS may include a display area ED-DA in which an image IM is displayed and a non-display area ED-NDA adjacent to the display area ED-DA. The non-display area ED-NDA may be an area in which the image IM is not displayed. However, the present disclosure should not be limited thereto or thereby, and the non-display area ED-NDA may be defined as being adjacent to one side of the display area ED-DA, or may be omitted.

[0131] refer to Figure 6 , the electronic device ED may include a window WM, a display device DD, and a receiving member BC.

[0132] The window WM may be disposed above the display device DD and may transmit the image IM provided from the display device DD to the outside of the electronic device ED. The window WM may include a transmission area TA and a non-transmission area NTA.

[0133] The window WM may include a base layer and a functional layer disposed on the base layer. The functional layer may include a protective layer, an anti-fingerprint layer, etc. The base layer of the window WM may include glass, sapphire, or a plastic material. The base layer of the window WM may include an optically transparent insulating material. For example, the base layer of the window WM may include a glass substrate or a plastic film, or may include a glass substrate and a plastic film coupled to the glass substrate via an adhesive.

[0134] The transmission area TA can be Figure 5 The transmissive area TA may overlap the display area ED-DA shown in FIG and may have a shape corresponding to the shape of the display area ED-DA. The transmissive area TA may transmit the image IM (refer to FIG) displayed in the display device DD. Figure 5 ) is transmitted to the outside of the electronic device ED.

[0135] The non-transmitting area NTA may be Figure 5The non-display area ED-NDA shown in FIG overlaps and may have a shape corresponding to the shape of the non-display area ED-NDA. The non-transmission area NTA may have a relatively low transmittance compared to the transmittance of the transmittance area TA. The non-transmission area NTA may be defined by a border pattern provided in a portion of the base layer of the window WM, and the area where the border pattern is not provided may be defined as the transmittance area TA. However, the present disclosure should not be limited to or thereby, and the non-transmission area NTA may be omitted.

[0136] According to an embodiment, an anti-reflection layer may be provided between the window WM and the display device DD. The anti-reflection layer may reduce the reflectivity of the display device DD relative to external light incident thereon from outside the display device DD. The anti-reflection layer may include color filters. The color filters may be arranged in a predetermined arrangement. As an example, the color filters may be arranged by taking into account the light emission colors of pixels included in the display panel DP, which will be described later. In some aspects, the anti-reflection layer may also include a black matrix disposed adjacent to the color filters.

[0137] The display device DD may include a display panel DP and an input sensing unit ISU.

[0138] The display panel DP may be a liquid crystal display panel or a light-emitting display panel. As examples, the display panel DP may be a liquid crystal display panel including liquid crystal elements, an organic electroluminescent display panel including organic electroluminescent elements, or a quantum dot light-emitting display panel including quantum dot light-emitting elements. However, the present disclosure should not be limited thereto or thereby. Hereinafter, an organic light-emitting display panel will be described as the display panel DP.

[0139] The input sensing unit ISU may be provided on the display panel DP. The input sensing unit ISU may include one of a capacitive sensor, an optical sensor, an ultrasonic sensor, and an electromagnetic induction sensor. The input sensing unit ISU may be formed on the display panel DP through a continuous process, or may be separately manufactured and attached to the upper portion of the display panel DP using an adhesive layer.

[0140] The display device DD may further include a driving chip DC and a circuit board PB mounted on the display panel DP.

[0141] In this embodiment, the circuit board PB may be a flexible circuit board. Hereinafter, the circuit board PB will be described as a flexible circuit board, and the flexible circuit board will be given the same reference numerals as the circuit board PB. However, the nature of the circuit board PB should not be limited to or thereby, and the circuit board PB may be rigid.

[0142] The circuit board PB may electrically connect the display panel DP and the main circuit board.

[0143] The driving chip DC may be mounted on the display panel DP. The driving chip DC may be an integrated circuit provided in the form of a chip after being coupled to pads exposed on the display panel DP.

[0144] The driving chip DC may be connected to at least some of the signal lines connected to the pixels. The driving chip DC may provide an electrical signal to each of the pixels arranged in the display panel DP through the signal lines.

[0145] The driving chip DC may include a driving element to drive the pixel. As an example, the driving chip DC may include a circuit connected to the data line DL (refer to Figure 7 ) to apply a data signal to each of the data lines DL.

[0146] The driver chip DC may be connected to the circuit board PB.

[0147] In this embodiment, the circuit board PB and the driving chip DC directly mounted on the display panel DP may be referred to as circuit members.

[0148] The circuit board PB may be bent so that a portion of the circuit board PB faces the rear surface of the display panel DP, however, the present disclosure should not be limited thereto or thereby. According to an embodiment, a portion of the display panel DP may be bent so that the driving chip DC faces the rear surface of the display device DD.

[0149] The receiving member BC can accommodate the display device DD. The receiving member BC can be coupled to the window WM and can define the appearance of the electronic device ED. The receiving member BC can be made of a relatively rigid material and can absorb external impacts applied thereto. The receiving member BC can include a plurality of receiving portions coupled to each other.

[0150] The display device DD may further include a main board received in the receiving member BC, an electronic module mounted on the main board, a camera module, a power supply module, and the like.

[0151] Figure 7 yes Figure 6 . A plan view of the display panel DP shown in FIG.

[0152] refer to Figure 7 , the display panel DP may include pixels PX, a gate driving circuit GDC, a plurality of signal lines SGL, and a plurality of pads DP-PD.

[0153] The pixels PX may be arranged in the display area DP-DA. Each of the pixels PX may include a light emitting element and a pixel driving circuit connected to the light emitting element. In this embodiment, the light emitting element may be an organic light emitting element.

[0154] The gate drive circuit GDC may be provided in the non-display area DP-NDA of the display panel DP. The gate drive circuit GDC may sequentially output gate signals to the gate lines GL. The gate drive circuit GDC may include transistors formed using the same process as the transistors of the pixels PX (e.g., a low-temperature polysilicon (LTPS) process, a low-temperature polycrystalline oxide (LTPO) process, or a mixed oxide and polysilicon (HOP) process).

[0155] However, the driving circuit of the display panel DP should not be limited to the gate driving circuit GDC, and the display panel DP may further include another driving circuit to apply a light emission control signal to the pixel PX. As an example, the display panel DP may include a light emission driving circuit.

[0156] Signal lines SGL may be provided in the display area DP-DA and the non-display area DP-NDA. The signal lines SGL may include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. Each gate line GL may be connected to a corresponding pixel PX among the pixels PX, and each data line DL may be connected to a corresponding pixel PX among the pixels PX. The power lines PL may be connected to the pixels PX. The control signal lines CSL may provide control signals to the gate drive circuit GDC.

[0157] The pads DP-PD may be provided in the non-display area DP-NDA. The pads DP-PD may include a first pad PD1, a second pad PD2, and a third pad PD3.

[0158] The non-display area DP-NDA may include a first pad area PA1 and a second pad area PA2. The first and second pads PD1 and PD2 may be disposed in the first pad area PA1, and the driver chip DC may be disposed in the first pad area PA1. The third pad PD3 may be disposed in the second pad area PA2, and the circuit board PB may be disposed in the second pad area PA2.

[0159] The first pad area PA1 and the second pad area PA2 may be spaced apart from each other in the second direction DR2.

[0160] The first pad area PA1 may include a first area B1 in which the first pad PD1 is disposed and a second area B2 in which the second pad PD2 is disposed. The first pad PD1 may be arranged in the first area B1 along the first direction DR1, and the second pad PD2 may be arranged in the second area B2 along the first direction DR1. Hereinafter, the area in which the first pad PD1 and the second pad PD2 are disposed may be referred to as the first pad area PA1, and the area in which the third pad PD3 is disposed may be referred to as the second pad area PA2.

[0161] The first to third pads PD1 , PD2 , and PD3 may be exposed to the outside in the non-display area DP-NDA of the display panel DP, and this will be described in detail later.

[0162] In this embodiment, the first pads PD1 may be arranged in a row in the first region B1. The second pads PD2 may be arranged in a row in the second region B2. However, the number of rows in which the first pads PD1 and the second pads PD2 are arranged should not be limited thereto or thereby. As an example, each of the first pads PD1 and the second pads PD2 may be arranged in two or more rows in the respective regions of the first region B1 and the second region B2.

[0163] refer to Figure 7 The second region B2 may be spaced apart from the first region B1 in the second direction DR2. The second pads PD2 arranged in the second region B2 may be connected to the third pads PD3 arranged in the second pad area PA2 via the connection signal lines S-CL in a one-to-one correspondence.

[0164] The circuit board PB may include substrate bump electrodes PB-BP. The substrate bump electrodes PB-BP may be arranged in the first direction DR1. The substrate bump electrodes PB-BP of the circuit board PB may be connected to the third pads PD3 of the second pad area PA2.

[0165] Figure 8 yes Figure 6 1 is an enlarged perspective view of a portion of the display panel DP shown in FIG.

[0166] Figure 8 : is an enlarged perspective view of the first pad area PA1 and the second pad area PA2 of the display device DD according to an embodiment of the present disclosure. Figure 8 , the driving chip DC and the circuit board PB are shown as being detachable from the display panel DP. Figure 7 The arrangement and connection relationship between the first pad area PA1 and the second pad area PA2 are described, and repeated descriptions thereof are omitted for the sake of brevity.

[0167] refer to Figure 8 The driving chip DC may include driving bump electrodes DC-BP. The driving bump electrodes DC-BP may include first bumps BP1 connected to the first pads PD1 in a one-to-one correspondence and second bumps BP2 connected to the second pads PD2 in a one-to-one correspondence.

[0168] The first film CF1 may be disposed between the driving chip DC and the first pad area PA1.

[0169] The first film CF1 may include a synthetic resin having adhesive properties and an anisotropic conductive film (ACF) including conductive balls, however, the present disclosure should not be limited thereto or thereby. As an example, the first film CF1 may include a non-conductive film (NCF).

[0170] When the driving chip DC disposed on the first film CF1 in the first pad area PA1 is pressed, the driving bump electrode DC-BP may be electrically connected to the first and second pads PD1 and PD2 .

[0171] The circuit board PB may include substrate bump electrodes PB-BP mounted therein. The circuit board PB may provide image signals, driving voltages, and other control signals to the driving chip DC.

[0172] The substrate bump electrodes PB-BP may be provided on the lower surface PB-DS of the circuit board PB. The substrate bump electrodes PB-BP may be connected to the third pads PD3 in a one-to-one correspondence. The second film CF2 may be provided between the circuit board PB and the second pad area PA2. Each of the substrate bump electrodes PB-BP may be connected to the third pads PD3 by connecting the signal lines S-CL (reference Figure 7 ) are connected to the second pads PD2 arranged in the first direction DR1.

[0173] The second film CF2 may include a synthetic resin having adhesive properties and an anisotropic conductive film (ACF) including conductive balls, however, the present disclosure should not be limited thereto or thereby. As an example, the second film CF2 may include a non-conductive film (NCF).

[0174] The driver chip DC may receive the first signal via the second pad PD2 and the second bump BP2. The driver chip DC may provide a second signal generated based on the first signal to the first pad PD1 via the first bump BP1. As an example, when the driver chip DC includes a data driver circuit, the data driver circuit may generate the second signal based on the first signal.

[0175] The first signal may be an image signal as a digital signal applied thereto from the outside, and the second signal may be a data signal as an analog signal. The driving chip DC may generate an analog voltage corresponding to the grayscale value of the image signal. The data signal may be transmitted through the data line DL (reference Figure 7 ) is applied to the pixel.

[0176] Figure 9 and Figure 10 is a perspective view of a bonding apparatus BTA according to an embodiment of the present disclosure. Figure 11 yes Figure 10 A side view of the bonding apparatus BTA is shown in FIG.

[0177] Hereinafter, the bonding process of the preliminary display panel P-DP and the driving chip DC will be described as a representative example of the bonding process of the preliminary display panel P-DP and the circuit member. The bonding process and bonding structure of the preliminary display panel P-DP and the driving chip DC can be applied to the preliminary display panel P-DP and other circuit members (such as, for example, a circuit board PB (refer to FIG. Figure 8 ))'s joining process and joining structure.

[0178] refer to Figure 9 , prepare display panel P-DP and driver chip DC (reference Figure 8 ) may be disposed on the stage STG. In the present disclosure, the preliminary display panel P-DP may refer to a display panel DP in a state before the display panel DP is completed in a manufacturing process of the display device (refer to Figure 6 For the sake of explanation, Figure 9 Circuit components provided between the preliminary display panel P-DP and the pressing unit PU are omitted.

[0179] It is defined as the suction hole VFH (refer to Figure 1 ) is converted into a vacuum state, and thus, the preliminary display panel P-DP may be fixed to the upper surface of the stage STG.

[0180] After the preparation display panel P-DP is fixed to the stage STG, the head HP can move along one side of the guide portion GP in the third direction DR3. As the head HP moves in the third direction DR3, the pressing unit PU connected to the head HP can also move in the third direction DR3. Therefore, the tip portion TP (refer to Figure 11 ) can move in the third direction DR3.

[0181] Figure 10 The head HP is shown lowered and the tip portion TP included in the pressing unit PU (refer to Figure 11 ) The state of pressing the driving chip DC is taken as a representative example.

[0182] Figure 11 1 is a view showing a state in which the tip portion TP included in the pressing unit PU presses the driving chip DC when viewed in the first direction DR1. Figure 11 For the sake of convenience, the bonding device BTA (see Figure 1 ) in the head HP (see Figure 1 ), guide part GP (see Figure 1 ) and the connecting portion CST (see Figure 1 ).

[0183] refer to Figure 11, when the pressing unit PU presses the driving chip DC, heat generated from the first temperature control part TC1 may be transferred to the driving chip DC through the fastening portion CP and the tip portion TP of the second unit UT2.

[0184] In some aspects, heat generated from the second temperature control part TC2 may be transferred to the driving chip DC through the fastening portion CP and the tip portion TP of the second unit UT2 .

[0185] The first film CF1 may receive heat through the driving chip DC contacting the tip portion TP and may be cured. Thus, the driving chip DC and the preliminary display panel P-DP may be bonded to each other.

[0186] Figure 12 and Figure 13 1 and 2 are diagrams illustrating the deformation length of the pressing unit PU.

[0187] For ease of explanation, Figure 12 and Figure 13 The first fastening hole CH1 is omitted (refer to Figure 3 ) and the second fastening hole CH2 (reference Figure 3 ) and the first temperature control unit TC1 (reference Figure 4 ) and the second temperature control unit TC2 (reference Figure 4 ).

[0188] Figure 12 FIG shows a pressing unit PU in which the thermal expansion amount of the first unit UT1 is smaller than the thermal expansion amount of the second unit UT2. Figure 12 In the pressing unit PU shown in , a value obtained by multiplying the thermal expansion coefficient of the first unit UT1 by the temperature change amount of the first unit UT1 may be smaller than a value obtained by multiplying the thermal expansion coefficient of the second unit UT2 by the temperature change amount of the second unit UT2.

[0189] When the thermal expansion amount of the first unit UT1 is smaller than that of the second unit UT2, the first length L1 may be smaller than the second length L2. Therefore, the pressing unit PU may be deformed to bulge in a direction from the first unit UT1 to the second unit UT2.

[0190] In this case, the lower surface TB (refer to Figure 11 ) from the center of the imaginary straight line VL at one end and the other end to the bottom surface TB of the second unit UT2 may be referred to as a deformation length DT.

[0191] When the pressing unit PU is deformed to protrude in a direction from the first unit UT1 to the second unit UT2 , the deformation length DT may be defined as having a “positive value”.

[0192] Figure 13 FIG shows a pressing unit PU in which the thermal expansion amount of the first unit UT1 is greater than the thermal expansion amount of the second unit UT2. Figure 13 In the pressing unit PU shown in , a value obtained by multiplying the thermal expansion coefficient of the first unit UT1 by the temperature change amount of the first unit UT1 may be greater than a value obtained by multiplying the thermal expansion coefficient of the second unit UT2 by the temperature change amount of the second unit UT2.

[0193] When the thermal expansion amount of the first unit UT1 is greater than that of the second unit UT2, the first length L1 may be greater than the second length L2. Therefore, the pressing unit PU may be deformed to bulge in a direction from the second unit UT2 to the first unit UT1.

[0194] When the pressing unit PU is deformed to protrude in a direction from the second unit UT2 to the first unit UT1 , the deformation length DT may be defined as having a “negative value”.

[0195] The bonding apparatus according to the present disclosure can adjust the temperature of the first unit UT1 and the temperature of the second unit UT2 to reduce the absolute value of the deformation length DT. In some aspects, the method of manufacturing a display device may include setting the temperature of the first unit UT1 and the temperature of the second unit UT2 according to a reference temperature ratio by considering the first thermal expansion coefficient of the first unit UT1 and the second thermal expansion coefficient of the second unit UT2. According to one or more embodiments of the present disclosure, the method of manufacturing a display device may include appropriately selecting the first thermal expansion coefficient of the first unit UT1 and the second thermal expansion coefficient of the second unit UT2 by considering the reference temperature ratio used in the bonding process.

[0196] 14A to 14F is a graph showing deformation length according to changes in temperature and thermal expansion coefficient of the first unit and the second unit.

[0197] Hereinafter, the method of adjusting the first unit UT1 (refer to Figure 1 ) and the second unit UT2 (reference Figure 1 ) temperature and thermal expansion coefficient to set the deformation length DT (reference Figure 13 ) is a method of minimizing the absolute value of the reference temperature ratio. In the present disclosure, the reference temperature ratio may be defined as a ratio of a first reference temperature to a second reference temperature.

[0198] In some embodiments, the embodiments described herein are merely examples to help understand the present disclosure, and the scope of the present disclosure should not be limited thereto or thereby.

[0199] Figure 14A The first unit UT1 (refer to Figure 1) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a thermal expansion coefficient of approximately 5.4 ppm.

[0200] The temperature of the first unit UT1 included in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2 .

[0201] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a 1:1 ratio, the deformation length is approximately zero (0) at all temperatures tested.

[0202] That is, since the first unit UT1 (reference Figure 1 ) and the second unit UT2 (reference Figure 1 ) have the same thermal expansion coefficient and the temperature of the first unit UT1 is set to be the same as the temperature of the second unit UT2, so the first unit UT1 and the second unit UT2 can have the same thermal expansion amount.

[0203] Therefore, when the first unit UT1 (refer to Figure 1 ) and the second unit UT2 (reference Figure 1 ) is about 5.4 ppm and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 1:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0204] Figure 14B The first unit UT1 (refer to Figure 1 ) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a coefficient of thermal expansion of approximately 5.295 ppm.

[0205] refer to Figure 14B , including that the temperature of the first unit UT1 in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2.

[0206] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a ratio of 0.98:1, the deformation length is approximately zero (0) at all temperatures tested.

[0207] Therefore, when the first unit UT1 (refer to Figure 1 ) and the thermal expansion coefficient of the second unit UT2 (reference Figure 1 ) are about 5.4 ppm and about 5.295 ppm respectively and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 0.98:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0208] Figure 14C The first unit UT1 (refer to Figure 1 ) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a thermal expansion coefficient of approximately 5.184 ppm.

[0209] refer to Figure 14C , including that the temperature of the first unit UT1 in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2.

[0210] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a ratio of 0.96:1, the deformation length is approximately zero (0) at all temperatures tested.

[0211] Therefore, when the first unit UT1 (refer to Figure 1 ) and the thermal expansion coefficient of the second unit UT2 (reference Figure 1 ) are about 5.4 ppm and about 5.184 ppm respectively and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 0.96:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0212] Figure 14D The first unit UT1 (refer to Figure 1 ) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a thermal expansion coefficient of approximately 5.08 ppm.

[0213] refer to Figure 14D , including that the temperature of the first unit UT1 in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2.

[0214] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a ratio of 0.94:1, the deformation length is approximately zero (0) at all temperatures tested.

[0215] Therefore, when the first unit UT1 (refer to Figure 1 ) and the thermal expansion coefficient of the second unit UT2 (reference Figure 1 ) are about 5.4 ppm and about 5.08 ppm respectively and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 0.94:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0216] Figure 14E The first unit UT1 (refer to Figure 1 ) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a thermal expansion coefficient of approximately 4.97 ppm.

[0217] refer to Figure 14E , including that the temperature of the first unit UT1 in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2.

[0218] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a ratio of 0.92:1, the deformation length is approximately zero (0) at all temperatures tested.

[0219] Therefore, when the first unit UT1 (refer to Figure 1 ) and the thermal expansion coefficient of the second unit UT2 (reference Figure 1 ) are about 5.4 ppm and about 4.97 ppm respectively and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 0.92:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0220] Figure 14F The first unit UT1 (refer to Figure 1 ) has a thermal expansion coefficient of about 5.4 ppm and the second unit UT2 (reference Figure 1 ) has a thermal expansion coefficient of approximately 4.86 ppm.

[0221] refer to Figure 14F, including that the temperature of the first unit UT1 in each test example is set to about 0.9 times, about 0.92 times, about 0.94 times, about 0.96 times, about 0.98 times, or about 1 times the temperature of the second unit UT2.

[0222] When the first unit UT1 (refer to Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) in a ratio of 0.90:1, the deformation length was approximately zero (0) at all temperatures tested.

[0223] Therefore, when the first unit UT1 (refer to Figure 1 ) and the thermal expansion coefficient of the second unit UT2 (reference Figure 1 ) are about 5.4 ppm and about 4.86 ppm respectively and the reference temperature ratio of the first unit UT1 to the second unit UT2 is 0.90:1, the deformation length DT (reference Figure 13 ) can be minimized at all processing temperatures.

[0224] As described herein, the bonding device according to the present disclosure may consider the first unit UT1 (refer to Figure 1 ) and the second unit UT2 (reference Figure 1 ) is made of each of the materials of the first unit UT1 and the second unit UT2 to determine the thermal expansion coefficient of each of the first unit UT1 and the second unit UT2, and the first temperature control part TC1 and the second temperature control part TC2 can be used to maintain the reference temperature ratio of the first unit UT1 and the second unit UT2, which can reduce the difference in thermal expansion amount between the first unit UT1 and the second unit UT2.

[0225] According to one or more embodiments of the present disclosure with respect to the bonding apparatus, the absolute value of the deformation length DT can be minimized within the range of the processing temperature, and the pressing unit PU (refer to Figure 1 ) may have a flat lower surface TB (refer to Figure 2 ).

[0226] The method of manufacturing a display device may include setting a reference temperature ratio so that a first reference temperature and a second reference temperature are included in a range of a target processing temperature, and an embodiment of the present disclosure may include selectively increasing the first unit UT1 (reference temperature) by considering a target thermal expansion coefficient. Figure 1 ) and the second unit UT2 (reference Figure 1 ) are combined with each other.

[0227] Therefore, the bonding device BTA according to the present disclosure (refer to Figure 1 ) can prevent the first unit UT1 and the second unit UT2 from being thermally deformed. Figure 1) of the lower surface TB (reference Figure 2 ) can be flat during the bonding process, and therefore, pressure can be uniformly applied to the entire area of ​​the circuit member.

[0228] Figures 15 to 17 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0229] In the following, reference will be made to Figures 15 to 17 A method of manufacturing a display device is described, the method comprising: by considering a first unit UT1 (reference Figure 1 ) and the second unit UT2 (reference Figure 1 ) of the thermal expansion coefficient to set an appropriate reference temperature ratio; and after the first unit UT1 and the second unit UT2 reach the first reference temperature and the second reference temperature, respectively, using the pressing unit PU (reference Figure 1 ) Press the circuit component.

[0230] refer to Figure 15 , a method for manufacturing a display device may include: aligning a circuit member on a prepared display panel including a pad on a stage (S10); placing a pressing unit on the circuit member (S20), the pressing unit including a first unit including a first temperature control part and a second unit including a second temperature control part and coupled to the first unit below the first unit; and bonding the circuit member and the pad by pressing (applying pressure) using the pressing unit (S30).

[0231] In the bonding operation (S30), the tip portion TP (reference Figure 11 ) can be used with the driver chip DC (reference Figure 11 ) and can transfer heat from the second unit UT2 (reference Figure 11 ) is transmitted to the driver chip DC.

[0232] refer to Figure 16 The joining operation (S30) may include: adjusting the temperature of the first unit and the temperature of the second unit using the first temperature control part and the second temperature control part respectively (S31); determining whether the temperature of the first unit and the temperature of the second unit each reach the corresponding reference temperature (S32); and moving the pressing unit downward based on determining that the temperature of the first unit and the temperature of the second unit are equal to (have each reached) the corresponding reference temperature (S33).

[0233] In determining whether the temperature of the first unit and the temperature of the second unit have each reached the corresponding reference temperature (S32), based on determining that the temperature of the first unit and the temperature of the second unit are equal to the corresponding reference temperature (when each of the first unit and the second unit reaches the corresponding reference temperature), the joining operation (S30) may include continuing to move the pressing unit downward (S33), and when the temperature of either one of the first unit and the second unit does not reach the corresponding reference temperature, the joining operation (S30) may include continuing to adjust (S31) the unit that does not meet the corresponding reference temperature (for example, the first unit UT1 (reference temperature)). Figure 1 ), the second unit UT2 (reference Figure 1 That is, for example, the bonding operation (S30) may include continuing to adjust the temperature of the first unit UT1 and / or the temperature of the second unit UT2 (S31).

[0234] In some examples, adjusting the temperature of the first unit and / or the temperature of the second unit (S31) may include adjusting the temperature of the first unit and / or the temperature of the second unit in association with obtaining or maintaining a ratio (e.g., a first ratio) of the temperature of the second unit UT2 to the temperature of the first unit UT1, such that the first ratio is within a range of about 0.9 times to about 1.1 times the ratio (e.g., the second ratio) of the first thermal expansion coefficient to the second thermal expansion coefficient. In an example, adjusting the temperature of the first unit and / or the temperature of the second unit (S31) may include maintaining the ratio such that the ratio of the temperature of the second unit UT2 to the temperature of the first unit UT1 is substantially the same as the ratio of the first thermal expansion coefficient to the second thermal expansion coefficient.

[0235] Adjusting the temperature of the first unit and the second unit ( S31 ) may include supplying current to each of the first resistor heating wire and the second resistor heating wire.

[0236] Additionally or alternatively, the methods and operations described herein may be based on whether the temperature of the first unit and / or the temperature of the second unit reaches a corresponding reference temperature, so as to obtain or maintain a target ratio of the temperature of the second unit UT2 to the temperature of the first unit UT1. For example, in association with this ratio, some embodiments may include adjusting the temperature of the second unit UT2 while maintaining the temperature of the first unit UT1 to obtain the target ratio. In another example, some embodiments may include adjusting the temperature of the first unit UT1 while maintaining the temperature of the second unit UT2 to obtain the target ratio. Therefore, in some exemplary embodiments, the joining operation (S30) may include determining whether the ratio meets the target ratio instead of the operation described with reference to S32, or in addition to the operation described with reference to S32, the joining operation (S30) may also include determining whether the ratio meets the target ratio.

[0237] The method of manufacturing a display device may include determining a first unit UT1 (reference Figure 1 ) and the second unit UT2 (reference Figure 1 ) of the material, the first unit UT1 (reference Figure 1 ) of the temperature of the second unit UT2 (reference Figure 1 ) temperature. Therefore, in the bonding process, the bonding pressure can be uniformly applied to the circuit member.

[0238] refer to Figure 17 , a method for manufacturing a display device may include: selecting one of a plurality of first units including a first temperature control part and selecting one of a plurality of second units including a second temperature control part (S100); forming a pressing unit including the selected first unit and the selected second unit coupled to a lower portion of the selected first unit (S200); aligning a circuit member on a prepared display panel including a pad on a stage (S300); placing the pressing unit on the circuit member (S400); and moving the pressing unit downward to press the circuit member to be bonded to the pad (S500).

[0239] When bonding the circuit member ( S500 ), the method may include maintaining the selected first unit UT1 at a first reference temperature through the first temperature control part TC1 , and the method may include maintaining the selected second unit UT2 at a second reference temperature through the second temperature control part TC2 .

[0240] Although not separately shown in the drawings, forming the pressing unit (S200) may include placing the second unit UT2 under the first unit UT1, and inserting fastening members into first fastening holes defined through the first unit UT1 and spaced apart from each other in the first direction, and second fastening holes defined through the second unit UT2 and spaced apart from each other in the first direction.

[0241] According to one or more embodiments of the present disclosure, the method of manufacturing a display device may support setting a pressing unit PU (refer to FIG. 1 ) designed in consideration of a thermal expansion coefficient by selecting a first unit and a second unit ( S100 ). Figure 1 ). Therefore, when the bonding process requires a specific processing temperature, the method may include adjusting the first unit UT1 (refer to Figure 1 ) and the second unit UT2 (reference Figure 1 ) of the thermal expansion coefficient to maintain the reference temperature ratio and / or the specific processing temperature. Therefore, the method of manufacturing a display device as described herein can support uniform application of bonding pressure to the circuit member during the bonding process.

[0242] That is, the method of manufacturing the display device can prevent thermal deformation of the first unit UT1 and the second unit UT2, which can prevent or reduce the risk of replacing the first unit UT1 in the event of deformation (refer to FIG. Figure 1 ) or the second unit UT2 (reference Figure 1 Therefore, the manufacturing efficiency of the display device can be improved.

[0243] In the description of the flow chart and operation provided herein, the operation can be performed in an order different from the order shown, or can be performed in a different order or at a different time. Specific operations can also be omitted from the flow chart, one or more operations can be repeated, or other operations can be added to the flow chart.

[0244] Although the embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to the exemplary embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the present disclosure as claimed in the appended claims. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the embodiments of the present disclosure should be determined according to the appended claims.

Claims

1. A bonding device comprising: Unit 1 includes: a first temperature control unit; and first fastening holes defined through the first unit and spaced apart from each other in a first direction, wherein the first unit has a first coefficient of thermal expansion; A second unit is provided below the first unit and in contact with the first unit, the second unit comprising: a second temperature control unit; and second fastening holes defined through the second unit and spaced apart from each other in the first direction, wherein the second unit has a second coefficient of thermal expansion; fastening members each inserted into a corresponding first fastening hole among the first fastening holes and a corresponding second fastening hole among the second fastening holes, wherein the corresponding second fastening holes are aligned with the corresponding first fastening holes in the first direction; and The platform is arranged below the second unit.

2. The bonding apparatus according to claim 1, wherein The first temperature control section and the second temperature control section are configured to adjust the temperature of the first cell and the temperature of the second cell, respectively, based on a relationship between a value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first cell and a value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second cell.

3. The bonding apparatus according to claim 1, wherein The first temperature control portion and the second temperature control portion are configured to adjust the temperature of the first cell and the temperature of the second cell, respectively, so that a value obtained by multiplying the first thermal expansion coefficient by the temperature change amount of the first cell is within a range of 0.9 times to 1.1 times a value obtained by multiplying the second thermal expansion coefficient by the temperature change amount of the second cell.

4. A method for manufacturing a display device, comprising: aligning the circuit component on a prepared display panel including pads on the stage; placing a pressing unit including a first unit and a second unit over the circuit member, wherein the first unit includes a first temperature control part, and the second unit is disposed below the first unit and includes a second temperature control part; and In association with bonding the circuit member to the pad, pressing the circuit member using the pressing unit to bond the circuit member to the pad includes: adjusting the temperature of the first unit using the first temperature control part or adjusting the temperature of the second unit using the second temperature control part; and The pressing unit is moved downward based on determining that each of the first unit and the second unit is at a corresponding reference temperature.

5. The method according to claim 4, wherein: Adjusting the temperature of the first cell or the temperature of the second cell is based on obtaining or maintaining a first ratio of the temperature of the second cell to the temperature of the first cell, such that the first ratio is within a range of 0.9 to 1.1 times a second ratio of a first coefficient of thermal expansion of the first cell to a second coefficient of thermal expansion of the second cell.

6. The method according to claim 4, wherein: The first temperature control unit includes a first temperature sensor and a first resistor heating wire; The second temperature control unit includes a second temperature sensor and a second resistor heating wire; as well as Adjusting the temperature of the first unit or the second unit includes providing current to at least one of the first resistor heating wire and the second resistor heating wire.

7. A method for manufacturing a display device, comprising: selecting a first unit among a plurality of first units and a second unit among a plurality of second units, wherein the first unit includes a first temperature control portion and the second unit includes a second temperature control portion; forming a pressing unit including the first unit and the second unit, wherein the second unit is coupled to a lower portion of the first unit; aligning the circuit component on a prepared display panel including pads on the stage; placing the pressing unit above the circuit member; and The pressing unit is moved downward in association with bonding the circuit member to the pad, wherein bonding the circuit member to the pad includes adjusting or maintaining the selected first unit according to a first reference temperature by the first temperature control portion, and adjusting or maintaining the selected second unit according to a second reference temperature by the second temperature control portion.

8. The method according to claim 7, wherein: Forming the pressing unit includes: placing the second unit on the lower portion of the first unit; and Each of the fastening members is inserted into a corresponding first fastening hole defined through the first unit and spaced apart from each other in the first direction and a corresponding second fastening hole defined through the second unit and spaced apart from each other in the first direction.

9. The method according to claim 7, wherein: The first temperature control unit includes a first temperature sensor and a first resistor heating wire; The second temperature control unit includes a second temperature sensor and a second resistor heating wire; as well as Adjusting or maintaining the first unit according to the first reference temperature includes providing current to the first resistor heating wire, and adjusting or maintaining the second unit according to the second reference temperature includes providing current to the second resistor heating wire.

10. The method according to claim 7, wherein: the second unit including a tip portion defined in a lower portion of the second unit; the tip portion protruding in a direction from the second unit toward the stage; as well as Bonding the circuit component to the pad includes maintaining the tip portion in contact with the circuit component such that the tip portion transfers heat to the circuit component.

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