Electronic device module and electronic equipment

Abstract

The invention discloses an electronic device module and electronic equipment, and relates to the technical field of electronic equipment. The electronic device module comprises a printed circuit board, a first electronic device located on the first surface of the printed circuit board, and a first colloid located on the second surface of the printed circuit board. In the direction perpendicular to the first surface, a first area covered by the first electronic device and a second area covered by the first colloid are at least partially overlapped. Since the first colloid is solid, the first colloid can reinforce the part of the covered printed circuit board in the second area. Therefore, the probability of deformation of the part, located in the second area, of the printed circuit board under external stress can be reduced. The first area and the second area are at least partially overlapped, so that the first electronic device covering the first area can be protected to a certain extent.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic device module and an electronic equipment. Background Art

[0002] Electronic devices such as mobile phones, tablets, and laptops include a housing and an electronic device module located within it. Typically, the housing comprises a cover, a midframe, and a back cover. These together form a cavity within which the electronic device module resides. The electronic device module includes a printed circuit board (PCB) and the electronic devices located on its surface.

[0003] In related technologies, since electronic devices need to develop towards ultra-thin devices, on the one hand, the thickness of the back cover continues to decrease; on the other hand, the gaps between components along the thickness direction of the electronic device are getting smaller and smaller.

[0004] However, as the thickness of the back cover decreases, its rigidity also decreases. This means that when the electronic device is subjected to external stress, the external stress is easily transmitted to the printed circuit board through the back cover, causing the printed circuit board to deform, thereby damaging the electronic components located on the surface of the printed circuit board and affecting the reliability of the electronic device. Summary of the Invention

[0005] The embodiments of the present application provide an electronic device module and electronic device that can protect a first electronic device in the electronic device module, thereby, to a certain extent, resolving the problem that the first electronic device is easily damaged when the electronic device is subjected to external stress, thereby improving the reliability of the electronic device. The technical solution is as follows:

[0006] In a first aspect, an electronic device module is provided. The electronic device module is applied to electronic equipment and includes a printed circuit board, a first electronic device, and a first colloid.

[0007] The first electronic device may be a chip in an electronic device that is easily damaged. The printed circuit board is a support for the electronic device. The printed circuit board has a first surface and a second surface relative to each other, and the first surface and the second surface may both be provided with electronic devices. Here, the first electronic device is provided on the first surface. A first colloid in a solid state is adhered to the second surface. For ease of description, the area covered by the first electronic device on the first surface is referred to as the first area; and the area covered by the first colloid on the second surface is referred to as the second area. In an embodiment of the present application, the first area and the second area at least partially overlap along a preset direction perpendicular to the first surface.

[0008] In an embodiment of the present application, an electronic device module includes a printed circuit board, a first electronic device located on a first surface of the printed circuit board, and a first colloid located on a second surface of the printed circuit board. In a direction perpendicular to the first surface, a first area covered by the first electronic device and a second area covered by the first colloid at least partially overlap. Since the first colloid is solid, the first colloid can reinforce the portion of the covered printed circuit board located in the second area. In this way, the probability of deformation of the portion of the printed circuit board located in the second area when subjected to external stress can be reduced. Since the first area and the second area at least partially overlap, this can also provide a certain degree of protection for the first electronic device covering the first area, thereby solving to a certain extent the problem that the first electronic device is easily damaged when the electronic device is subjected to external stress, and can improve the reliability of the electronic device to which the electronic device module is applied.

[0009] In some embodiments, the electronic device module further includes: a second electronic device and a shielding cover. The second electronic device may be an inductor, a capacitor, or the like. The second electronic device is disposed within the second region of the second surface. The first colloid may cover the second electronic device and be bonded to the second surface. The shielding cover is also located on the second surface and, together with the second surface, forms a first cavity. Both the first colloid and the second electronic device are located within the first cavity.

[0010] Furthermore, the electronic device module may further include a first enclosure structure. The first enclosure structure is located within the first cavity and is connected to at least one of the second surface and the shielding cover. The first enclosure structure is disposed around the second area. The first colloid is bonded to an inner wall of the first enclosure structure.

[0011] In some embodiments, the electronic device module further includes a second colloid. The second colloid covers the first electronic device and is bonded to the first surface. For ease of description, the area covered by the second colloid on the first surface is referred to as the third area. Therefore, the first area is located within the third area. In this way, the second colloid covering the first electronic device can reinforce the first electronic device, thereby protecting the first electronic device from damage and improving the reliability of the electronic device in which the electronic device module is used.

[0012] Furthermore, the electronic device module may further include a second enclosure structure, the second enclosure structure being connected to the first surface, the second enclosure structure being disposed around the third area, and the second colloid being bonded to an inner wall of the second enclosure structure.

[0013] Furthermore, the electronic device module may also include a first reinforcement structure. The first reinforcement structure is connected to the second enclosure structure. The printed circuit board, the second enclosure structure and the first reinforcement structure enclose a second cavity. The second cavity is located on the side of the first reinforcement structure close to the printed circuit board. The first electronic device is located in the second cavity. The first reinforcement structure also encloses the second enclosure structure to form a holding pool, which is located on the side of the first reinforcement structure away from the printed circuit board. The first reinforcement structure is provided with a first glue inlet hole, and the first glue inlet hole passes through the first reinforcement structure. The second colloid includes a first sub-colloid and a second sub-colloid. The first sub-colloid is located in the second cavity, the second sub-colloid is located in the holding pool, and the first sub-colloid and the second sub-colloid are connected through the first glue inlet hole.

[0014] That is, in this embodiment, the first reinforcement structure is embedded in the second colloid, so that the first reinforcement structure is bonded to the first electronic device via the second colloid. Thus, the first reinforcement structure can reinforce the first electronic device, thereby protecting the first electronic device from damage and improving the reliability of the electronic device in which the electronic device module is used.

[0015] In some embodiments, the printed circuit board is provided with a second glue inlet hole and a first vent hole. The second glue inlet hole extends through the printed circuit board, with a first end of the second glue inlet hole located in the third region and a second end of the second glue inlet hole located in the second region. The first colloid and the second colloid are connected via the second glue inlet hole. The first vent hole extends through the printed circuit board, with a first end of the first vent hole located in the second region. The second end of the first vent hole is located on the first surface and not in the third region.

[0016] Furthermore, the first colloid is also bonded to the shielding cover.

[0017] In some other embodiments, the shielding cover is provided with a third glue inlet hole and a second exhaust hole, both of which are located within the surrounding range of the first enclosure structure.

[0018] Furthermore, the electronic device module may further include a shielding cover connected to the shielding case and configured to cover the third glue inlet hole and the second exhaust hole to enhance the shielding effect of the shielding case.

[0019] In some embodiments, along a preset direction, the first area is located within the coverage of the second area.

[0020] In some embodiments, the electronic device module may further include a second reinforcement structure comprising a plate body, which is bonded or welded to a surface of the first electronic device away from the printed circuit board, thereby reinforcing the first electronic device.

[0021] Furthermore, the second reinforcement structure may further include two or more limiting members, each of which is connected to the board to define the relative position of the board and the first electronic component.

[0022] In a second aspect, an electronic device is provided, comprising a housing and an electronic device module according to any one of the first aspects, wherein the housing is formed with a cavity, and the electronic device module is located in the cavity formed by the housing.

[0023] In some embodiments, the housing includes a back cover, wherein the first surface of the printed circuit board is away from the back cover, and the second surface is close to the back cover.

[0024] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the appearance of a first electronic device in the related art;

[0026] Figure 2 This is a schematic diagram of the appearance of a second electronic device in the related art;

[0027] Figure 3 It is a schematic diagram of the exploded structure of an electronic device in the related art;

[0028] Figure 4 This is a schematic diagram of the exploded structure of a housing of an electronic device in the related art;

[0029] Figure 5 This is a structural diagram of an electronic device module in the related art;

[0030] Figure 6 This is a schematic diagram of a cross-sectional structure of an electronic device along the thickness direction in the related art;

[0031] Figure 7 1 is a schematic structural diagram of a first electronic device module provided in an embodiment of the present application;

[0032] Figure 8 This is a schematic diagram of the exploded structure of the first electronic device module provided in an embodiment of the present application;

[0033] Figure 9 1 is a structural diagram of a second electronic device module provided in an embodiment of the present application;

[0034] Figure 10 1 is a schematic structural diagram of a third electronic device module provided in an embodiment of the present application;

[0035] Figure 11This is a schematic top view of a first enclosure structure provided in an embodiment of the present application;

[0036] Figure 12 1 is a schematic diagram of a top view of an electronic device module provided in an embodiment of the present application at the AA cross section;

[0037] Figure 13 1 is a schematic structural diagram of a fourth electronic device module provided in an embodiment of the present application;

[0038] Figure 14 1 is a schematic structural diagram of a fifth electronic device module provided in an embodiment of the present application;

[0039] Figure 15 1 is a schematic structural diagram of a sixth electronic device module provided in an embodiment of the present application;

[0040] Figure 16 1 is a structural diagram of a seventh electronic device module provided in an embodiment of the present application;

[0041] Figure 17 This is a schematic diagram of the exploded structure of the second electronic device module provided in an embodiment of the present application;

[0042] Figure 18 1 is a schematic structural diagram of an eighth electronic device module provided in an embodiment of the present application;

[0043] Figure 19 This is a bottom-up structural schematic diagram of a second enclosure structure provided in an embodiment of the present application;

[0044] Figure 20 1 is a schematic structural diagram of a ninth electronic device module provided in an embodiment of the present application;

[0045] Figure 21 This is a bottom-up structural schematic diagram of a second enclosure structure and a first reinforcement structure provided in an embodiment of the present application;

[0046] Figure 22 1 is a schematic structural diagram of a tenth electronic device module provided in an embodiment of the present application;

[0047] Figure 23 1 is a schematic structural diagram of an eleventh electronic device module provided in an embodiment of the present application;

[0048] Figure 24 1 is a schematic structural diagram of a twelfth electronic device module provided in an embodiment of the present application;

[0049] Figure 25 is a structural schematic diagram of the first second reinforcement structure provided in an embodiment of the present application;

[0050] Figure 26is a structural schematic diagram of a second second reinforcement structure provided in an embodiment of the present application;

[0051] Figure 27 is a structural diagram of a thirteenth electronic device module provided in an embodiment of the present application;

[0052] Figure 28 14 is a schematic structural diagram of a fourteenth electronic device module provided in an embodiment of the present application;

[0053] Figure 29 This is a flow chart for preparing the first electronic device module provided in an embodiment of the present application;

[0054] Figure 30 This is a flow chart for preparing the second electronic device module provided in an embodiment of the present application;

[0055] Figure 31 This is a flow chart for preparing the third electronic device module provided in an embodiment of the present application;

[0056] Figure 32 This is a flow chart for preparing the fourth electronic device module provided in an embodiment of the present application;

[0057] Figure 33 This is a flow chart for preparing the fifth electronic device module provided in an embodiment of the present application;

[0058] Figure 34 15 is a structural diagram of an electronic device module provided in an embodiment of the present application;

[0059] Figure 35 This is a relationship diagram between the modulus of the buffer material of the buffer pad and the maximum strain of the chip of the first electronic device in the related art.

[0060] In the related art, the meanings of the figures are as follows:

[0061] 10. Electronic device; 11. Housing; 112. Cover; 114. Display; 120. Middle frame; 121. Metal plate; 122. Top frame; 123. Bottom frame; 124. Left frame; 125. Right frame; 13. Electronic device module; 132. Mainboard; 1321. Printed circuit board; 1322. First electronic device; 1323. Other electronic devices; 1324. Shielding cover; 1326. Screws; 1327. Bracket; 134. Small board; 140. Energy storage module; 150. Back cover; 162. Front camera; 164. Rear camera

[0062] In the embodiments of the present application, the meanings represented by the accompanying figures are:

[0063] 20. Electronic device module; 2002. Second cavity; 2003. Third cavity; 2004. Receiving tank; 201. First cavity; 210. Printed circuit board; 2102. Second glue inlet hole; 2104. First exhaust hole; 211. First surface; 2111. First area; 2112. Third area; 212. Second surface; 2121. Second area; 220. First electronic device; 230. First colloid; 240. Second electronic device Sub-component; 250, first shielding cover; 2502, third glue inlet hole; 2504, second exhaust hole; 252, shielding cover; 260, first enclosure structure; 270, second colloid; 271, first sub-colloid; 272, second sub-colloid; 280, second enclosure structure; 292, first reinforcement structure; 2922, first glue inlet hole; 294, second reinforcement structure; 2942, plate; 2944, limiter; 296, second shielding cover. DETAILED DESCRIPTION

[0064] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0065] It should be understood that the “multiple” mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, words such as “first” and “second” are used to distinguish between identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as “first” and “second” do not limit the quantity and execution order, and words such as “first” and “second” do not necessarily limit them to be different.

[0066] Before explaining the electronic device module provided in the embodiments of the present application in detail, the application scenarios and related technologies of the electronic device module are first explained.

[0067] Electronic device modules are used in electronic devices, such as smart watches, mobile phones, tablet computers, and laptop computers. Figure 1 and Figure 2 1 is a schematic diagram of the appearance of two different electronic devices 10 in the related art. Figure 1 In the embodiment shown, the electronic device 10 is a mobile phone; Figure 2 In the illustrated embodiment, the electronic device 10 is a tablet computer.

[0068] For example, Figure 3FIG1 is a schematic diagram of an exploded structure of an electronic device 10 in the related art, wherein the electronic device 10 shown in the figure is a mobile phone. Figure 3 As shown, the electronic device 10 includes: a cover plate 112, a display screen 114, a middle frame 120, a mainboard 132, a small board 134, an energy storage module 140, and a back cover 150. The display screen 114 is disposed between the cover plate 112 and the middle frame 120. The middle frame 120, the mainboard 132, the small board 134, and the energy storage module 140 are disposed between the display screen 114 and the back cover 150. The mainboard 132, the small board 134, and the energy storage module 140 can be disposed on the middle frame 120. For example, the mainboard 132, the small board 134, and the energy storage module 140 are disposed on the side of the middle frame 120 facing the back cover 150. In other embodiments, the mainboard 132, the small board 134, and the energy storage module 140 can also be disposed on the side of the middle frame 120 facing the display screen 114.

[0069] The cover plate 112 is a transparent cover plate 112 , for example, the cover plate 112 may be a glass cover plate or a sapphire cover plate. The cover plate 112 is used to cover and protect the display screen 114 .

[0070] The middle frame 120 may include a metal plate 121 and a frame. The frame is arranged around the outer edge of the metal plate 121. Generally speaking, the frame may be a square frame. For example, Figure 3 As shown, the frame may include a top frame 122 and a bottom frame 123 that are arranged opposite to each other, and a left frame 124 and a right frame 125 that are located between the top frame 122 and the bottom frame 123 and are arranged opposite to each other. In this embodiment, the side of the middle frame 120 is the surface surrounded by the top frame 122, the bottom frame 123, the left frame 124 and the right frame 125. The metal plate 121 may be an aluminum plate, an aluminum alloy, or a magnesium alloy. Each frame may be a metal frame, a ceramic frame, or a glass frame. The metal plate 121 and the frame may be welded, clamped, or integrally formed, or the metal plate 121 and the frame may be connected by injection molding of plastic parts.

[0071] The back cover 150 may be a metal back cover 150 , a glass back cover 150 , a plastic back cover 150 , or a ceramic back cover 150 . In the embodiment of the present application, the material of the back cover 150 is not limited.

[0072] It can be understood that, here, the cover 112 , the frame (including the top frame 122 , the bottom frame 123 , the left frame 124 and the right frame 125 ) and the back cover 150 of the electronic device 10 are combined to form the housing 11 of the electronic device 10 . Figure 4 FIG. 1 is a schematic diagram of an exploded structure of a housing 11 of an electronic device 10 in the related art. Figure 3 and Figure 4As shown, the housing 11 has a cavity, which is formed by the cover 112, the middle frame 120 and the back cover 150. The display screen 114, the main board 132, the small board 134 and the energy storage module 140 are all located in the cavity of the housing 11.

[0073] The display screen 114 may be an organic light emitting diode (OLED) display screen 114 or a liquid crystal display (LCD) display screen 114. It should be understood that the display screen 114 may include a display panel and a touch panel, where the display panel is used to output display content to the user, and the touch panel is used to receive touch events input by the user on the display screen 114.

[0074] Both mainboard 132 and sub-board 134 include printed circuit boards (PCBs) and electronic components mounted on the PCBs. For example, electronic components in mainboard 132 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), a baseband processor, a power management unit (PMU), resistors, capacitors, inductors, and sensors. Electronic components in sub-board 134 include, but are not limited to, a microphone, a speaker, resistors, capacitors, inductors, and sensors.

[0075] It is understood that the main board 132 and the small board 134 may have raised and / or recessed positions depending on the electronic components. The specific shapes of the main board 132 and the small board 134, as well as the location and size of the electronic components, are related to the design layout of the electronic device 10. In the embodiments of this application, for ease of description, the main board 132 and the small board 134 are collectively referred to as the electronic device module.

[0076] In some embodiments, as Figure 3 As shown, the electronic device 10 may further include a camera and a flash (not shown in the figure). The camera may include a front camera 162 and a rear camera 164. The rear camera 164 and the flash may be arranged on the side of the metal plate 121 facing the rear cover 150, and the rear cover 150 may be provided with mounting holes for the flash and the rear camera 164 to be installed. The front camera 162 may be arranged on the side of the metal plate 121 facing the display screen 114. In some embodiments, the front camera 162 provided in the electronic device 10 may include one or more cameras, and the rear camera 164 may also include one or more cameras.

[0077] In the related art, as electronic devices 10 are moving towards ultra-thin devices, the thickness of the back cover 150 is continuously decreasing. For example, electronic devices 10 are gradually abandoning traditional glass back covers 150 in favor of thinner and lighter materials such as sheet materials, fiberglass, or polyurethane. Furthermore, along the thickness direction Z of the electronic device 10, the gaps between components are becoming increasingly smaller, and the number of hollow designs within the electronic device 10 is increasing.

[0078] However, as the thickness of the back cover 150 decreases, the rigidity of the back cover 150 also decreases. As a result, when the electronic device 10 is subjected to external stress, the external stress is easily transmitted to the printed circuit board through the back cover 150, causing the printed circuit board to deform, thereby damaging the electronic components located on the surface of the printed circuit board and affecting the reliability of the electronic device 10.

[0079] This technical problem is described in detail below with reference to the accompanying drawings.

[0080] Figure 5 1 is a structural diagram of an electronic device module 13 in the related art. Figure 5 As shown, the electronic device module 13 includes a printed circuit board 1321, a first electronic device 1322 and other electronic devices 1323 mounted on the printed circuit board 1321, and a shielding cover 1324 mounted on the printed circuit board 1321 for electromagnetic shielding. The first electronic device 1322 can be an integrated circuit (IC) chip, such as a CPU, GPU, PMU, or baseband processor; the other electronic devices 1323 can be capacitors, inductors, and the like.

[0081] Figure 6 This is a schematic diagram of a cross-sectional structure of an electronic device 10 along the thickness direction Z in the related art. The electronic device 10 shown in the figure includes: Figure 5 The electronic device module 13 shown. Figure 6 As shown, in the electronic device 10, the first electronic device 1322 is typically located on a surface of a printed circuit board 1321 near the display screen 114. The electronic device 10 also includes a bracket 1327 fixed to the printed circuit board 1321 by screws 1326. The bracket 1327 can be disposed between the rear camera 164 and the electronic device module 13 to prevent the rear camera 164 from squeezing the electronic device module 13 when subjected to external stress.

[0082] However, since the electronic device 10 needs to be developed in a light and thin direction, the bracket 1327 of some electronic devices 10 may be designed as a hollow structure, or even the bracket 1327 may be eliminated, which is not conducive to the protection of the electronic device module 13. Figure 6As shown, since the electronic device 10 needs to be thin and light, the bracket 1327 does not fully protect the entire electronic device module 13. Furthermore, in order to install the rear camera 164, the portion of the rear cover 150 near the rear camera 164 will bulge outward, which makes the portion of the rear cover 150 near the rear camera 164 more prone to stress concentration.

[0083] In actual applications, when the electronic device 10 is in a situation such as falling or being squeezed, Figure 6 As shown, external stress F is easily transmitted through the rear cover 150 to the shielding cover 1324 of the electronic device module 13 near the rear cover 150, and then to other electronic components 1323 (such as inductors and capacitors) located higher in the electronic device module 13. When other electronic components 1323 are subjected to pressure or impact, they can cause deformation of the printed circuit board 1321. In this case, the first electronic component 1322 mounted on the printed circuit board 1321 will experience significant bending stress, resulting in damage.

[0084] In the related art, two different schemes are generally used to protect the first electronic device 1322 in the electronic device module 13. The first scheme is to adjust the layout of the electronic devices in the electronic device module 13 so that the first electronic device 1322 can avoid external stress as much as possible. However, as the density of electronic devices on the electronic device module 13 continues to increase, the layout space of the electronic devices is severely limited, so the layout of the electronic devices is difficult to adjust. In addition, the layout adjustment of the electronic devices is also limited by factors such as the charging performance, heat dissipation performance, and radio frequency performance of the electronic device 10. The second scheme is to increase the thickness of the printed circuit board 1321 or increase the gap between the electronic devices in the electronic device module 13. However, this will increase the overall thickness of the electronic device 10 and reduce the competitiveness of the product.

[0085] To this end, an embodiment of the present application provides an electronic device module and an electronic device, which can protect the first electronic device in the electronic device module without adjusting the layout of the electronic devices in the electronic device module or increasing the thickness of the printed circuit board, thereby solving to a certain extent the problem that the first electronic device is easily damaged when the electronic device is subjected to external stress, and can improve the reliability of the electronic device.

[0086] The electronic device module provided in the embodiments of the present application is explained in detail below.

[0087] Figure 7 2 is a structural diagram of an electronic device module 20 provided in an embodiment of the present application. Figure 8 is a schematic diagram of an exploded structure of an electronic device module 20 provided in an embodiment of the present application, and Figure 8 for Figure 7 The exploded structure of the electronic device module 20 is shown. Figure 7 and Figure 8 As shown, the electronic device module 20 includes a printed circuit board 210 , a first electronic device 220 and a first colloid 230 .

[0088] The printed circuit board 210, also known as a printed circuit board, is a rigid circuit board. The printed circuit board 210 is a support for electronic devices and can be provided with multiple electronic devices. Generally, the multiple electronic devices provided on the printed circuit board 210 can be electrically connected through the printed circuit board 210. The printed circuit board 210 has a first surface 211 and a second surface 212 relative to each other, and both the first surface 211 and the second surface 212 can be provided with electronic devices. Generally, the first surface 211 and the second surface 212 are parallel to each other. In the embodiment of the present application, for ease of description, a first direction X, a second direction Y, and a third direction Z are defined. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other, and the first direction X and the second direction Y are both extension directions of the first surface 211. The third direction Z is the thickness direction of the printed circuit board 210.

[0089] The first electronic device 220 is an electronic device that is easily damaged by external stress. The first electronic device 220 can be a single IC chip or multiple IC chips stacked and fixed together. The first electronic device 220 is disposed on the first surface 211 of the printed circuit board 210. Generally, when the electronic device module 20 is used in an electronic device, the first surface 211 of the printed circuit board 210 is close to the display screen of the electronic device and away from the back cover of the electronic device. In other words, when the electronic device module 20 is used in an electronic device, the first electronic device 220 is located between the printed circuit board 210 and the display screen.

[0090] The first colloid 230 is a colloid that is solid after curing. The first colloid 230 is located on the second surface 212 of the printed circuit board 210 and is bonded to the second surface 212. Figure 8As shown, in the embodiment of the present application, for the convenience of description, the area covered by the first electronic device 220 on the first surface 211 is referred to as the first area 2111; the area covered by the first colloid 230 on the second surface 212 is referred to as the second area 2121. Along a preset direction, the first area 2111 and the second area 2121 at least partially overlap. The preset direction refers to the direction perpendicular to the first surface 211, that is, the third direction Z. At least partial overlap includes two cases: partial overlap and complete overlap. Partial overlap of the first area 2111 and the second area 2121 means that: along the third direction Z, a part of the first area 2111 overlaps with a part of the second area 2121, another part of the first area 2111 does not overlap with the second area 2121, and another part of the second area 2121 does not overlap with the first area 2111. The complete overlap between the first area 2111 and the second area 2121 means that, along the third direction Z, the range of the first area 2111 completely falls within the range of the second area 2121 , or / and, the range of the second area 2121 completely falls within the range of the first area 2111 .

[0091] Understandably, in Figure 7 and Figure 8 In the embodiment shown, the range of the first area 2111 is completely within the range of the second area 2121 along the third direction Z (ie, the first area 2111 and the second area 2121 completely overlap). In other embodiments, the structure of the electronic device module 20 may also be as follows: Figure 9 As shown, in this case, along the third direction Z, the first region 2111 and the second region 2121 partially overlap.

[0092] As previously mentioned, when an electronic device is subjected to external stress, damage to the first electronic device 220 is primarily caused by deformation of the printed circuit board 210 due to the external stress. This, in turn, generates significant bending stress in the first electronic device 220 mounted on the printed circuit board 210 at the location where the printed circuit board 210 is deformed, further damaging the first electronic device 220. In the present embodiment, the first colloid 230 can reinforce the portion of the printed circuit board 210 located in the second region 2121 that it covers. This reduces the probability of deformation of the portion of the printed circuit board 210 located in the second region 2121 when subjected to external stress. Because the first region 2111 and the second region 2121 at least partially overlap, this also provides some protection for the first electronic device 220 covering the first region 2111. This, to some extent, addresses the issue of damage to the first electronic device 220 when the electronic device is subjected to external stress, thereby improving the reliability of the electronic device in which the electronic device module 20 is used. In some specific embodiments, along the third direction Z, the range of the first area 2111 completely falls within the range of the second area 2121 , thereby protecting the first electronic device 220 covering the first area 2111 to the greatest extent.

[0093] The electronic device module 20 provided in the embodiment of the present application is further explained below.

[0094] one, Figure 10 FIG. 2 is a structural diagram of another electronic device module 20 provided in an embodiment of the present application. Figure 10 As shown, in some embodiments, the electronic device module 20 further includes a second electronic device 240 and a first shielding cover 250 .

[0095] The second electronic device 240 can be an inductor, a capacitor, or an IC chip, etc. The second electronic device 240 is disposed on the second surface 212 of the printed circuit board 210 and is located in the second region 2121 . The first colloid 230 covers the second electronic device 240 and is bonded to the second surface 212 .

[0096] The first shielding cover 250 can be a metal shielding cover. The first shielding cover 250 is disposed on the second surface 212 of the printed circuit board 210 and is welded to the second surface 212 of the printed circuit board 210. The first shielding cover 250 and the second surface 212 enclose a first cavity 201. The first cavity 201 is used to accommodate electronic components. The first shielding cover 250 can provide electromagnetic shielding for the electronic components within the first cavity 201. Here, the first colloid 230 and the second electronic component 240 are both located within the first cavity 201.

[0097] Specifically, the electronic device module 20 provided in the embodiment of the present application does not change the layout of the electronic devices in the module compared to the electronic device module 13 in the related art. Therefore, in the related art, the electronic device module 13 includes a second electronic device (i.e., Figure 5 When the other electronic devices 1323 described in the embodiment of the present application are included, the electronic device module 20 provided in the embodiment of the present application may also include the other electronic devices 1323 (i.e., the second electronic device 240). In this case, the first colloid 230 can be set to cover the second electronic device 240 and bonded to the second surface 212, so that the portion of the printed circuit board 210 located in the second area 2121 can be reinforced without involving the adjustment of the layout of the electronic devices. Similarly, when the electronic device module 13 in the related art includes a shielding cover 1324 located on the second surface of the printed circuit board 1321, the electronic device module 20 provided in the embodiment of the present application may also include the shielding cover 1324 (i.e., the first shielding cover 250). In this case, the first colloid 230 can be set in the first cavity 201 formed by the first shielding cover 250 and the printed circuit board 210, and bonded to the second surface 212, so that the portion of the printed circuit board 210 located in the second area 2121 can be reinforced without increasing the thickness of the electronic device module 20.

[0098] It is understood that in the embodiment of the present application, the electronic device module 20 may include multiple second electronic devices 240. In other words, the electronic device module 20 may include multiple electronic devices disposed on the second surface 212 of the printed circuit board 210 and located within the second region 2121. In this case, the first colloid 230 covers all electronic devices within the second region 2121 and adheres to the second surface 212.

[0099] In some embodiments, Figure 10 As shown, the electronic device module 20 further includes a first enclosure structure 260 . Figure 11 2 is a schematic top view of a first enclosure structure 260 provided in an embodiment of the present application. Figure 12 1 is a schematic diagram of a top view of an electronic device module 20 provided in an embodiment of the present application at section AA, where "top view" means that the viewing direction is the opposite direction of the third direction Z. Figures 10 to 12 As shown, the first enclosure structure 260 is located within the first cavity 201 formed by the first shielding cover 250 and the printed circuit board 210. The first enclosure structure 260 is annular and surrounds the second area 2121. The first colloid 230 is located within the first enclosure structure 260 and is bonded to the inner wall of the first enclosure structure 260.

[0100] It is understood that the first colloid 230 can be formed by solidifying liquid glue. Therefore, during the formation of the first colloid 230, a first enclosure structure 260 is required to confine the liquid glue to the second region 2121 of the second surface 212 of the printed circuit board 210. In this way, after the liquid glue solidifies, the first colloid 230 covering the second region 2121 is formed. In some embodiments, after the liquid glue solidifies into the first colloid 230, the first enclosure structure 260 can be removed. In other embodiments, when the first colloid 230 is formed using a partial molding technique, the first enclosure structure 260 may not be required during the formation of the first colloid 230. This will not be described in detail.

[0101] In the embodiment of the present application, the first enclosure structure 260 is connected to at least one of the second surface 212 and the first shielding cover 250. The connection method of the first enclosure structure 260 is explained in detail below from three different embodiments.

[0102] 1. In a first possible embodiment, the first enclosure structure 260 is connected to the second surface 212 and to the first shielding cover 250 .

[0103] exist Figure 10 In the illustrated embodiment, a structure is shown in which the first enclosure structure 260 is connected to both the second surface 212 and the first shielding cover 250. In this case, the first enclosure structure 260 and the first shielding cover 250 can be welded together, or the first enclosure structure 260 and the first shielding cover 250 can also be an integrally formed structure. The first enclosure structure 260 and the second surface 212 of the printed circuit board 210 can be welded together. In this way, the liquid glue can be confined to the space enclosed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250, thereby forming the first colloid 230 bonded to the second surface 212, the first enclosure structure 260, and the first shielding cover 250.

[0104] 2. In a second possible embodiment, the first enclosure structure 260 is connected to the second surface 212 and is not connected to the first shielding cover 250 .

[0105] Figure 132 is a schematic structural diagram of another electronic device module 20 provided in an embodiment of the present application, which shows a structure in which the first enclosure structure 260 is connected to the second surface 212 and is not connected to the first shielding cover 250. In this case, the first enclosure structure 260 can be welded to the second surface 212 of the printed circuit board 210. In this embodiment, there can be a small gap between the first enclosure structure 260 and the first shielding cover 250, and the gap meets the following conditions: under the action of surface tension, liquid glue cannot overflow from the gap to outside the enclosure range of the first enclosure structure 260. In this way, the liquid glue can be confined to the space enclosed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250, thereby forming the first glue 230 bonded to the second surface 212, the first enclosure structure 260, and the first shielding cover 250.

[0106] 3. In a third possible embodiment, the first enclosure structure 260 is connected to the first shielding cover 250 and is not connected to the second surface 212 .

[0107] Figure 14 2 is a schematic structural diagram of another electronic device module 20 provided in an embodiment of the present application, which shows a structure in which the first enclosure structure 260 is connected to the first shielding cover 250 and is not connected to the second surface 212. In this case, the first enclosure structure 260 can be welded to the first shielding cover 250 or formed integrally with the first shielding cover 250. In this embodiment, there can be a small gap between the first enclosure structure 260 and the second surface 212, and the gap meets the following conditions: the liquid glue cannot overflow from the gap to outside the enclosure range of the first enclosure structure 260 due to the action of surface tension. In this way, the liquid glue can be confined to the space enclosed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250, thereby forming the first glue 230 bonded to the second surface 212, the first enclosure structure 260, and the first shielding cover 250.

[0108] exist Figure 14 In the illustrated embodiment, the first enclosure structure 260 and the first shielding cover 250 are an integrally formed structure.

[0109] In the above three different embodiments, glue inlet holes can be opened on the printed circuit board 210 or the first shielding cover 250 to inject liquid glue into the space enclosed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250, which will not be described in detail here.

[0110] It is understandable that in some other embodiments, the second area 2121 may also be the area covered by the first shielding cover 250. In this case, Figure 15As shown, the electronic device module 20 does not include the first enclosure structure 260. During the formation of the first colloid 230, the liquid glue completely fills the space in the first cavity 201 except for the electronic device. Thus, after the liquid glue solidifies into the first colloid 230, the first cavity 201 is filled with the first colloid 230 and the electronic devices (including the second electronic device 240 and other electronic devices).

[0111] two, Figure 16 This is a structural diagram of another electronic device module 20 provided in an embodiment of the present application. Figure 17 is a schematic diagram of an exploded structure of another electronic device module 20 provided in an embodiment of the present application, and Figure 17 for Figure 16 The exploded structure of the electronic device module 20 is shown. Figure 16 and Figure 17 As shown, the electronic device module 20 further includes a second colloid 270 .

[0112] The second colloid 270 is a colloid that is solid after being cured. The second colloid 270 covers the first electronic device 220 and is bonded to the first surface 211. Figure 17 As shown, in the embodiment of the present application, for ease of description, the area covered by the second colloid 270 on the first surface 211 is referred to as the third area 2112. Since the second colloid 270 covers the first electronic device 220, the first area 2111 is located within the third area 2112. In this way, the second colloid 270 covering the first electronic device 220 can reinforce the first electronic device 220, thereby protecting the first electronic device 220 from damage, and improving the reliability of the electronic device used by the electronic device module 20. In addition, the second colloid 270 can also wrap the grinding damage layer and the cutting damage layer of the first electronic device 220, thereby alleviating stress concentration at the defective position during the bending process of the first electronic device 220.

[0113] In some embodiments, as Figure 18 As shown, the electronic device module 20 further includes a second enclosure structure 280 . Figure 19 This is a bottom-view structural diagram of a second enclosure structure 280 provided in an embodiment of the present application, where "top-view" means that the viewing direction is the third direction Z. Figure 18 and Figure 19 As shown, the second enclosure structure 280 is disposed on the first surface 211 of the printed circuit board 210 and is connected to the first surface 211. The second enclosure structure 280 is annular and is disposed around the third area 2112. The second colloid 270 is located within the second enclosure structure 280 and is bonded to the inner wall of the second enclosure structure 280.

[0114] As will be appreciated, the second colloid 270 is also formed by curing liquid glue. Therefore, during the formation of the second colloid 270, a second containment structure 280 is required to confine the liquid glue to the third region 2112 of the first surface 211 of the printed circuit board 210. As will be appreciated, during the formation of the second colloid 270, the first electronic device 220 is already mounted on the first surface 211 of the printed circuit board 210. Thus, after the liquid glue has cured, the second colloid 270 is formed, encapsulating the first electronic device 220 and covering the third region 2112. In some embodiments, the second containment structure 280 can be removed after the second colloid 270 is formed. In other embodiments, the second colloid 270 can be formed using a partial molding technique, thereby eliminating the need for the second containment structure 280 during the formation of the second colloid 270.

[0115] In the embodiment of the present application, the electronic device module 20 may further include a reinforcement structure. The reinforcement structure is used to reinforce the first electronic device 220, thereby protecting the first electronic device 220 from damage. Two different reinforcement structures are explained in detail below.

[0116] 1. In a first possible embodiment, the electronic device module 20 may further include a first reinforcement structure 292 .

[0117] Specifically, if Figure 20 As shown, the first reinforcement structure 292 is connected to the second enclosure structure 280, thereby enclosing the printed circuit board 210, the second enclosure structure 280, and the first reinforcement structure 292 to form a second cavity. The second cavity is located on the side of the first reinforcement structure 292 closest to the printed circuit board 210, and the first electronic device 220 is located within the second cavity. Here, the first reinforcement structure 292 can have a high elastic modulus, so that the first reinforcement structure 292 can reinforce the first electronic device 220. For example, the first reinforcement structure 292 can be made of metal, such as copper, aluminum alloy, or stainless steel.

[0118] Along the direction opposite to the third direction Z, the height of the first reinforcement structure 292 relative to the first surface 211 of the printed circuit board 210 is less than the height of the second enclosure structure 280, so that the location where the second enclosure structure 280 connects to the first reinforcement structure 292 is not the end of the second enclosure structure 280 away from the printed circuit board 210. In this case, the first reinforcement structure 292 and the second enclosure structure 280 also enclose a holding pool, which is located on the side of the first reinforcement structure 292 away from the printed circuit board 210.

[0119] Figure 21 2 is a bottom view of a second enclosure structure 280 and a first reinforcement structure 292 provided in an embodiment of the present application. Figure 21As shown, the first reinforcement structure 292 is provided with a first glue inlet hole 2922, and the first glue inlet hole 2922 passes through the first reinforcement structure 292. In this case, as in Figure 20 As shown, the second colloid 270 may include a first sub-colloid 271 and a second sub-colloid 272. The first sub-colloid 271 refers to the portion of the second colloid 270 located in the second cavity, and the second sub-colloid 272 refers to the portion of the second colloid 270 located in the holding pool. The first sub-colloid 271 and the second sub-colloid 272 are connected through a first glue inlet hole 2922. That is to say, in this embodiment, the first reinforcement structure 292 is embedded in the second colloid 270, so that the first reinforcement structure 292 is bonded to the first electronic device 220 through the second colloid 270. In this way, the first reinforcement structure 292 can reinforce the first electronic device 220, improve the bending resistance of the first electronic device 220, thereby protecting the first electronic device 220 from damage, and can improve the reliability of the electronic device to which the electronic device module 20 is applied.

[0120] It is understood that in this embodiment, when forming the second colloid 270, liquid glue can be injected into the second cavity through the first glue inlet hole 2922 of the first reinforcement structure 292, and the liquid glue is allowed to overflow from the first glue inlet hole 2922 and fill the holding pool. In this way, after the liquid glue is cured, the second colloid 270 including the first sub-colloid 271 and the second sub-colloid 272 can be formed.

[0121] It is understood that in some other embodiments, the location where the second enclosure structure 280 is connected to the first reinforcement structure 292 may also be the end of the second enclosure structure 280 away from the printed circuit board 210. In this case, the first reinforcement structure 292 does not enclose the second enclosure structure 280 to form a holding pool, and the second colloid 270 is located only in the second cavity and adheres to the first surface 211 of the printed circuit board 210, the inner wall of the second enclosure structure 280, and the surface of the first reinforcement structure 292 close to the printed circuit board 210.

[0122] Based on this embodiment, the first colloid 230 can be formed in two different ways. For ease of understanding, in the following description, the cavity enclosed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250 for accommodating the first colloid 230 is referred to as the third cavity. It is understood that the third cavity is located within the first cavity 201.

[0123] (1) The first colloid 230 and the second colloid 270 are formed at the same time.

[0124] In the first method, the first colloid 230 and the second colloid 270 are formed at the same time. In this case, the liquid glue used to form the first colloid 230 and the liquid glue used to form the second colloid 270 are injected at one time. Figure 22 As shown, the printed circuit board 210 may be provided with a second glue inlet hole 2102 and a first exhaust hole 2104 .

[0125] The second glue hole 2102 passes through the printed circuit board 210, and the first end of the second glue hole 2102 is located in the third area 2112, and the second end of the second glue hole 2102 is located in the second area 2121. In other words, the third cavity is connected to the second cavity through the second glue hole 2102.

[0126] The first vent hole 2104 extends through the printed circuit board 210, and a first end of the first vent hole 2104 is located in the second region 2121. The second end of the first vent hole 2104 is located on the first surface 211 and not in the third region 2112. In other words, during the injection of liquid glue, the second end of the first vent hole 2104 will not be covered by the liquid glue.

[0127] As can be seen from the foregoing description, the second cavity is connected to the holding tank via the first glue inlet hole 2922. Thus, when forming the first colloid 230 and the second colloid 270, liquid glue can be injected into the second cavity from the first glue inlet hole 2922 of the first reinforcement structure 292. The process of injecting liquid glue can be divided into three stages: In the first stage, the liquid glue in the second cavity flows into the third cavity through the second glue inlet hole 2102. During this process, gas in the third cavity is discharged through the first vent hole 2104. This ensures smooth filling of the liquid glue while preventing gas from causing localized voids in the liquid glue. The first stage ends when the liquid glue completely fills the third cavity and the second glue inlet hole 2102. In the second stage, the liquid glue fills the second cavity and the first glue inlet hole 2922. The second stage ends when the liquid glue completely fills the second cavity and the first glue inlet hole 2922. In the third stage, the liquid glue fills the holding tank. In this way, after the liquid glue is solidified, the first colloid 230 and the second colloid 270 are formed. The first colloid 230 and the second colloid 270 formed in this way are connected together through the second glue inlet hole 2102.

[0128] As will be appreciated, in this embodiment, the first glue inlet hole 2922 and the second glue inlet hole 2102 have relatively large diameters to allow liquid glue to flow through them. For example, the diameter of the second glue inlet hole 2102 is 0.5 mm to 0.8 mm. The first vent hole 2104 has a relatively small diameter. The diameter of the first vent hole 2104 should satisfy the following conditions: liquid glue cannot flow into the first vent hole 2104 due to surface tension. For example, the diameter of the first vent hole 2104 is 0.2 mm to 0.4 mm. In this embodiment, the formed first glue 230 is bonded to the first shielding cover 250. As will be appreciated, the number of the first glue inlet hole 2922, the second glue inlet hole 2102, and the first vent hole 2104 can all be multiple. Preferably, the second glue inlet hole 2102 and the first vent hole 2104 extend along the third direction Z to penetrate the printed circuit board 210.

[0129] (2) The first colloid 230 and the second colloid 270 are formed in two steps.

[0130] In the second method, the first colloid 230 and the second colloid 270 are formed twice. In this case, the liquid glue used to form the first colloid 230 and the liquid glue used to form the second colloid 270 are injected separately. Figure 23 As shown, the first shielding cover 250 may be provided with a third glue inlet hole 2502 and a second exhaust hole 2504. The third glue inlet hole 2502 and the second exhaust hole 2504 both pass through the first shielding cover 250 and are both located within the surrounding range of the first enclosure structure 260.

[0131] In this embodiment, the first colloid 230 can be formed first, and then the second colloid 270 can be formed. When forming the first colloid 230, liquid glue can be injected into the third cavity through the third glue inlet hole 2502. During this process, the gas in the third cavity is discharged from the second exhaust hole 2504. After the liquid glue completely fills the third cavity, the liquid glue is solidified to form the first colloid 230. When forming the second colloid 270, liquid glue can be injected into the second cavity through the first glue inlet hole 2922 of the first reinforcement structure 292, and the liquid glue is allowed to overflow from the first glue inlet hole 2922 and fill the holding pool. After the liquid glue completely fills the second cavity and the holding pool, the liquid glue is solidified to form the second colloid 270.

[0132] It is understandable that in this embodiment, considering that the opening of the third glue inlet hole 2502 and the second exhaust hole 2504 will affect the electromagnetic shielding effect of the first shielding cover 250, the electronic device module 20 may further include a metal shielding cover 252. Figure 24As shown, the shielding cover 252 is connected to the shielding case and is used to cover the third glue inlet hole 2502 and the second exhaust hole 2504 to enhance the shielding effect of the shielding case.

[0133] 2. In a second possible embodiment, the electronic device module 20 further includes a second reinforcement structure 294 .

[0134] Figure 25 Schematic diagram of the structure of a second reinforcement structure 294 provided in an embodiment of the present application. Figure 25 As shown, in some embodiments, the second reinforcement structure 294 includes a plate 2942. The plate 2942 can have a relatively high elastic modulus. For example, the plate 2942 can be made of a metal material such as copper, aluminum alloy, or stainless steel. The plate 2942 can be bonded or welded to the surface of the first electronic device 220 away from the printed circuit board 210, thereby reinforcing the first electronic device 220. In some specific embodiments, the thickness of the plate 2942 is 0.1 mm to 0.15 mm.

[0135] Furthermore, the second reinforcement structure 294 may further include two or more limiting members 2944. Each of the two or more limiting members 2944 is connected to the plate 2942 to limit the relative position of the plate 2942 and the first electronic device 220. For example, Figure 26 In the embodiment shown, the second reinforcement structure 294 includes four stoppers 2944. In this case, when the second reinforcement structure 294 is connected to the first electronic device 220, as shown in FIG. Figure 27 As shown, one pair of the four stoppers 2944 (i.e., two stoppers 2944 at opposing positions) can be engaged with the left and right sides of the first electronic device 220 along the first direction X, while the other pair of stoppers 2944 can be engaged with the left and right sides of the first electronic device 220 along the second direction Y. In this way, the second reinforcement structure 294 can be prevented from moving relative to the first electronic device 220 along the first direction X or the second direction Y.

[0136] In some specific embodiments, the height of the limiting member 2944 relative to the surface of the plate 2942 close to the first electronic device 220 is 0.2 mm to 0.35 mm.

[0137] It can be understood that in some embodiments, the electronic device module 20 may include both the first reinforcement structure 292 and the second reinforcement structure 294 described above.

[0138] In some embodiments, as Figure 28As shown, the first surface 211 of the printed circuit board 210 may also be provided with a shielding cover, namely, a second shielding cover 296. The electronic components (including the first electronic component 220 and other electronic components) on the first surface 211 of the printed circuit board 210, the second enclosure structure 280, the second colloid 270, etc. are all located within the second shielding cover 296.

[0139] The following describes a method for preparing the electronic device module 20 in detail from five possible implementations in conjunction with the accompanying drawings.

[0140] 1. The first possible implementation method.

[0141] In the first possible implementation, Figure 29 As shown, the method for preparing the electronic device module 20 includes the following steps S110 to S140.

[0142] S110 , ① provide a first shielding cover 250 and a first enclosure structure 260 ; ② provide a printed circuit board 210 , and install electronic components on the second surface 212 of the printed circuit board 210 .

[0143] A printed circuit board 210 having a second glue inlet hole 2102 and a first exhaust hole 2104 is provided, and electronic components, such as a second electronic component 240, are mounted on the second surface 212 of the printed circuit board 210. Furthermore, a first shielding cover 250 and a first enclosure structure 260 are provided. The first shielding cover 250 is a shielding cover that needs to be soldered to the second surface 212 of the printed circuit board 210.

[0144] Understandably, in Figure 29 In the embodiment shown, the first shielding cover 250 and the first enclosure structure 260 are connected together, and the first shielding cover 250 and the first enclosure structure 260 are integrally formed. In other embodiments, the first enclosure structure 260 can also be welded to the first shielding cover 250.

[0145] In some specific embodiments, the second glue inlet hole 2102 and the first exhaust hole 2104 can be made by laser drilling or mechanical drilling. The diameter of the second glue inlet hole 2102 is 0.5 mm to 0.8 mm, and the number of the second glue inlet holes 2102 can be 1 to 3. The diameter of the first exhaust hole 2104 is 0.2 mm to 0.4 mm. The number of the first exhaust holes 2104 can be 1 to 3. The material of the first enclosure structure 260 can be metal, such as copper, aluminum alloy or stainless steel. The thickness of the first enclosure structure 260 is 0.1 mm to 0.15 mm. The material of the first enclosure structure 260 can also be dam glue.

[0146] In some specific embodiments, the electronic components on the second surface 212 of the printed circuit board 210 may be mounted by tinning and reflow soldering.

[0147] S120 , welding the first shielding cover 250 and the first enclosure structure 260 to the second surface 212 of the printed circuit board 210 .

[0148] The first shielding cover 250 and the first enclosure structure 260 are welded to the second surface 212 of the printed circuit board 210. After welding, all electronic components on the second surface 212 are located within the coverage of the first shielding cover 250. In addition, the second glue inlet 2102 and the first exhaust hole 2104 are both located within the enclosure of the first enclosure structure 260. The enclosure of the first enclosure structure 260 is the second area 2121.

[0149] Understandably, in Figure 29 In the illustrated embodiment, the first shielding cover 250 and the first enclosure structure 260 are connected together. In this case, the first shielding cover 250 and the first enclosure structure 260 need to be welded to the second surface 212 of the printed circuit board 210 at the same time. In other embodiments, when the first shielding cover 250 and the first enclosure structure 260 are not connected together, the first enclosure structure 260 may be welded to the second surface 212 of the printed circuit board 210 first, and then the first shielding cover 250 may be welded to the printed circuit board 210 and the first enclosure structure 260. In other embodiments, the first enclosure structure 260 may be connected to only one of the first shielding cover 250 and the second surface 212 of the printed circuit board 210.

[0150] Here, the first shielding cover 250 and the first enclosure structure 260 can be soldered to the second surface 212 of the printed circuit board 210 by tinning and reflow soldering. Alternatively, the first shielding cover 250 and the first enclosure structure 260 can also be soldered to the second surface 212 of the printed circuit board 210 by laser welding.

[0151] After step S120 is completed, the third cavity 2003 is formed. The third cavity 2003 is a cavity formed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250.

[0152] S130 , installing electronic components on the first surface 211 of the printed circuit board 210 , and installing the second enclosure structure 280 and the first reinforcement structure 292 .

[0153] The installation of electronic components, such as the first electronic component 220, on the first surface 211 of the printed circuit board 210 is completed. In addition, a second enclosure structure 280 and a first reinforcement structure 292 are provided. The second enclosure structure 280 and the first reinforcement structure 292 can be welded together or integrally formed. The second enclosure structure 280 is also welded to the first surface 211 of the printed circuit board 210, so that the second glue inlet hole 2102 is located within the enclosure range of the second enclosure structure 280, and the first exhaust hole 2104 is located outside the enclosure range of the second enclosure structure 280. The enclosure range of the second enclosure structure 280 is the third area 2112.

[0154] The first reinforcement structure 292 is provided with a first glue inlet hole 2922 penetrating the first reinforcement structure 292 .

[0155] In some specific embodiments, the second enclosure structure 280 can be made of metal, such as copper, copper alloy, aluminum alloy, or stainless steel. The thickness of the second enclosure structure 280 is 0.1 mm to 0.15 mm. The material of the second enclosure structure 280 can also be dam glue.

[0156] After step S130 is completed, the second cavity 2002 and the holding pool 2004 are formed. The second cavity 2002 is the cavity enclosed by the printed circuit board 210, the second enclosure structure 280, and the first reinforcement structure 292. The holding pool 2004 is the recessed pit formed by the first reinforcement structure 292 and the second enclosure structure 280, located on the side of the first reinforcement structure 292 away from the printed circuit board 210.

[0157] In some specific embodiments, the depth of the holding pool 2004 along the third direction Z is 0.03 mm to 0.05 mm. Along the third direction Z, the distance between the first reinforcement structure 292 and the first electronic device 220 is 0.03 mm to 0.05 mm.

[0158] S140, injecting liquid glue into the holding pool 2004 until the holding pool 2004 is completely filled with the liquid glue; and solidifying the liquid glue.

[0159] The process of injecting liquid glue can be divided into three stages: In the first stage, the liquid glue in the second cavity 2002 flows into the third cavity 2003 through the second glue inlet hole 2102. During this process, the gas in the third cavity 2003 is discharged through the first exhaust hole 2104. The first stage ends when the liquid glue completely fills the third cavity 2003 and the second glue inlet hole 2102. In the second stage, the liquid glue fills the second cavity 2002 and the first glue inlet hole 2922. The second stage ends when the liquid glue completely fills the second cavity 2002 and the first glue inlet hole 2922. In the third stage, the liquid glue fills the holding pool 2004.

[0160] The liquid glue can be cured at high temperature, for example. Generally, the liquid glue is cured by heating it at a temperature between 100°C (degrees Celsius) and 130°C for 15 to 25 minutes. After the liquid glue cures, the first colloid 230 and the second colloid 270 are formed, thus completing the preparation of the electronic device module 20.

[0161] In some specific embodiments, the liquid glue is a highly fluid thermosetting polymer material such as underfill glue, epoxy molding compound (EMC) glue, potting glue, or other encapsulating glue. In some preferred embodiments, due to the lower filler density of underfill glue, using underfill glue can improve the convenience of rework and increase the rework yield.

[0162] In some embodiments, the preparation of the electronic device module 20 may further include the following step: installing a second shielding cover 296 on the first surface 211 of the printed circuit board 210 .

[0163] 2. The second possible implementation method.

[0164] In the second possible implementation, Figure 30 As shown, the method for preparing the electronic device module 20 includes the following steps S210 to S240.

[0165] S210 , ① provide a first shielding cover 250 and a first enclosure structure 260 ; ② provide a printed circuit board 210 , and install electronic components on the second surface 212 of the printed circuit board 210 .

[0166] Step S210 is identical to step S110 and will not be described again.

[0167] S220 , welding the first shielding cover 250 and the first enclosure structure 260 to the second surface 212 of the printed circuit board 210 .

[0168] Step S220 is identical to step S120 and will not be described again.

[0169] S230 , installing electronic components on the first surface 211 of the printed circuit board 210 , and installing the second enclosure structure 280 and the second reinforcement structure 294 .

[0170] The installation of electronic components, such as the first electronic component 220, on the first surface 211 of the printed circuit board 210 is completed. Furthermore, the second enclosure structure 280 is also soldered to the first surface 211 of the printed circuit board 210. In this embodiment, the second glue inlet 2102 and the first exhaust hole 2104 are both located within the enclosure of the first enclosure structure 260. The first exhaust hole 2104 is located outside the enclosure of the second enclosure structure 280.

[0171] The second reinforcement structure 294 is installed. Here, three different installation methods for the second reinforcement structure 294 are provided. In the first method, the second reinforcement structure 294 can be soldered to the surface of the first electronic device 220 away from the printed circuit board 210. The solder can be a low-temperature alloy solder containing titanium, such as an alloy solder composed of tin, silver, and titanium. The soldering method can be low-temperature pressureless brazing. In the second method, the second reinforcement structure 294 can be bonded to the surface of the first electronic device 220 away from the printed circuit board 210 using pressure-sensitive adhesive or quick-drying adhesive. In this implementation, pressure along the third direction Z is required to ensure a tight bond between the second reinforcement structure 294 and the first electronic device 220. In the third method, the second reinforcement structure 294 can be bonded to the surface of the first electronic device 220 away from the printed circuit board 210 using non-pressure-sensitive adhesive. In this implementation, pressure along the third direction Z is not required. In these three installation methods, solder and glue can alleviate the mechanical stress caused by the hard contact between the first electronic device 220 and the second reinforcement structure 294 during the installation process, thereby protecting the first electronic device 220 and preventing mechanical damage to the first electronic device 220.

[0172] In step S230, the first electronic device 220 may be mounted on the first surface 211 of the printed circuit board 210, and then the second reinforcement structure 294 may be mounted on the first electronic device 220. Alternatively, the second reinforcement structure 294 may be mounted on the first electronic device 220, and then the first electronic device 220 with the second reinforcement structure 294 may be mounted on the first surface 211 of the printed circuit board 210.

[0173] S240 , injecting liquid glue into the enclosure range of the second enclosure structure 280 until the liquid glue submerges the second reinforcement structure 294 ; and curing the liquid glue.

[0174] The process of injecting liquid glue can be divided into two stages: In the first stage, the liquid glue flows into the third cavity 2003 through the second glue inlet hole 2102. During this process, the gas in the third cavity 2003 is discharged through the first exhaust hole 2104. The first stage ends when the liquid glue completely fills the third cavity 2003 and the second glue inlet hole 2102. In the second stage, the liquid glue fills the enclosure area of ​​the second enclosure structure 280. The second stage ends when the liquid glue submerges the second reinforcement structure 294.

[0175] The curing of liquid glue can be high temperature curing, which will not be described in detail.

[0176] In some embodiments, the preparation of the electronic device module 20 may further include the following step: installing a second shielding cover 296 on the first surface 211 of the printed circuit board 210 .

[0177] 3. The third possible implementation method.

[0178] In the third possible implementation, Figure 31 As shown, the method for preparing the electronic device module 20 includes the following steps S310 to S350.

[0179] S310 , ① provide a first shielding cover 250 and a first enclosure structure 260 ; ② provide a printed circuit board 210 , and install electronic components on the second surface 212 of the printed circuit board 210 .

[0180] A printed circuit board 210 is provided. In this embodiment, the printed circuit board 210 does not have a second glue inlet hole 2102 and a first exhaust hole 2104. The installation of electronic components on the second surface 212 of the printed circuit board 210, such as the second electronic component 240, is completed. In addition, a first shielding cover 250 and a first enclosure structure 260 are also provided. The first shielding cover 250 refers to a shielding cover that needs to be welded to the second surface 212 of the printed circuit board 210. Here, the first shielding cover 250 is provided with a third glue inlet hole 2502 and a second exhaust hole 2504. The third glue inlet hole 2502 and the second exhaust hole 2504 are both located within the enclosure range of the first enclosure structure 260.

[0181] S320 , welding the first shielding cover 250 and the first enclosure structure 260 to the second surface 212 of the printed circuit board 210 .

[0182] The first shielding cover 250 and the first enclosure structure 260 are welded to the second surface 212 of the printed circuit board 210. After welding, all electronic components on the second surface 212 are located within the coverage of the first shielding cover 250. The enclosure area of ​​the first enclosure structure 260 is the second area 2121.

[0183] After step S320 is completed, the third cavity 2003 is formed. The third cavity 2003 is a cavity formed by the printed circuit board 210, the first enclosure structure 260, and the first shielding cover 250.

[0184] S330 , electronic components are mounted on the first surface 211 of the printed circuit board 210 , and the second enclosure structure 280 and the first reinforcement structure 292 are mounted.

[0185] The installation of electronic components, such as the first electronic component 220, on the first surface 211 of the printed circuit board 210 is completed. Furthermore, a second enclosure structure 280 and a first reinforcement structure 292 are provided. The second enclosure structure 280 and the first reinforcement structure 292 can be welded together or integrally formed. The second enclosure structure 280 is also welded to the first surface 211 of the printed circuit board 210. The area enclosed by the second enclosure structure 280 constitutes the third area 2112.

[0186] The first reinforcement structure 292 is provided with a first glue inlet hole 2922 penetrating the first reinforcement structure 292 .

[0187] After step S330 is completed, the second cavity 2002 and the holding pool 2004 are formed. The second cavity 2002 is the cavity enclosed by the printed circuit board 210, the second enclosure structure 280, and the first reinforcement structure 292. The holding pool 2004 is the recessed pit formed by the first reinforcement structure 292 and the second enclosure structure 280, located on the side of the first reinforcement structure 292 away from the printed circuit board 210.

[0188] S340, injecting liquid glue into the holding pool 2004 until the holding pool 2004 is completely filled with the liquid glue; and solidifying the liquid glue.

[0189] The liquid glue injected into the holding pool 2004 can flow into the second cavity 2002 through the first glue inlet hole 2922. Thus, when the liquid glue fills the holding pool 2004, the liquid glue also fills the second cavity 2002. The liquid glue in the second cavity 2002 and the holding pool 2004 is solidified to form a second colloid 270.

[0190] S350 , filling the third cavity 2003 with liquid glue through the third glue inlet hole 2502 , and solidifying the liquid glue.

[0191] Liquid glue is injected into the third cavity 2003. During this process, the gas in the third cavity 2003 is discharged from the second exhaust hole 2504. The liquid glue in the third cavity 2003 is solidified to form the first colloid 230.

[0192] In this possible implementation, the first reinforcement structure 292 may be removed, the second enclosure structure 280 may be retained, and the second reinforcement structure 294 may be installed on the surface of the first electronic device 220 away from the printed circuit board 210 , which will not be described in detail.

[0193] In some embodiments, the preparation of the electronic device module 20 may further include the following step: installing a second shielding cover 296 on the first surface 211 of the printed circuit board 210 .

[0194] 4. The fourth possible implementation method.

[0195] In a fourth possible implementation, if Figure 32 As shown, the method for preparing the electronic device module 20 includes the following steps S410 to S440.

[0196] S410 , ① provide a first shielding cover 250 and a first enclosure structure 260 ; ② provide a printed circuit board 210 , and install electronic components on the second surface 212 of the printed circuit board 210 .

[0197] Step S410 is the same as step S310 and will not be described again.

[0198] S420 , welding the first shielding cover 250 and the first enclosure structure 260 to the second surface 212 of the printed circuit board 210 .

[0199] Step S420 is the same as step S320 and will not be described again.

[0200] S430 , installing electronic components on the first surface 211 of the printed circuit board 210 , and installing the second reinforcement structure 294 .

[0201] The installation of electronic components on the first surface 211 of the printed circuit board 210 , such as the first electronic component 220 , is completed. In addition, a second reinforcement structure 294 is installed on the surface of the first electronic component 220 away from the printed circuit board 210 .

[0202] S440 , filling the third cavity 2003 with liquid glue through the third glue inlet hole 2502 , and solidifying the liquid glue.

[0203] Liquid glue is injected into the third cavity 2003. During this process, the gas in the third cavity 2003 is discharged from the second exhaust hole 2504. The liquid glue in the third cavity 2003 is solidified to form the first colloid 230.

[0204] In some embodiments, the preparation of the electronic device module 20 may further include the following step: installing a second shielding cover 296 on the first surface 211 of the printed circuit board 210 .

[0205] 5. The fifth possible implementation method.

[0206] In a fifth possible implementation, if Figure 33 As shown, the method for preparing the electronic device module 20 includes the following steps S510 to S540.

[0207] S510 , ① provide a first shielding cover 250 and a first enclosure structure 260 ; ② provide a printed circuit board 210 , and install electronic components on the second surface 212 of the printed circuit board 210 .

[0208] Step S510 is the same as step S110 and will not be described again.

[0209] S520 , welding the first shielding cover 250 and the first enclosure structure 260 to the second surface 212 of the printed circuit board 210 .

[0210] Step S520 is the same as step S120 and will not be described again.

[0211] S530 , installing electronic components on the first surface 211 of the printed circuit board 210 , and installing the second enclosure structure 280 .

[0212] The installation of electronic components, such as the first electronic component 220, on the first surface 211 of the printed circuit board 210 is completed. Furthermore, the second enclosure structure 280 is also soldered to the first surface 211 of the printed circuit board 210. In this embodiment, the second glue inlet 2102 and the first exhaust hole 2104 are both located within the enclosure of the first enclosure structure 260. The first exhaust hole 2104 is located outside the enclosure of the second enclosure structure 280.

[0213] S540 , injecting liquid glue into the enclosure range of the second enclosure structure 280 until the liquid glue submerges the first electronic device 220 ; and curing the liquid glue.

[0214] The process of injecting liquid glue can be divided into two stages: In the first stage, the liquid glue flows into the third cavity 2003 through the second glue inlet hole 2102. During this process, the gas in the third cavity 2003 is discharged through the first exhaust hole 2104. The first stage ends when the liquid glue completely fills the third cavity 2003 and the second glue inlet hole 2102. In the second stage, the liquid glue fills the enclosure area of ​​the second enclosure structure 280. The second stage ends when the liquid glue submerges the second electronic device 240. The liquid glue can be cured at high temperature.

[0215] In some embodiments, the preparation of the electronic device module 20 may further include the following step: installing a second shielding cover 296 on the first surface 211 of the printed circuit board 210 .

[0216] The stress conditions of the electronic device module 20 provided by the related art and the embodiment of the present application under the extrusion scenario were analyzed using simulation software, and the results are shown in Table 1 below.

[0217] Table 1

[0218]

[0219] In Table 1, “electronic device modules in related art” refers to Figure 5 The electronic device module 13 shown; the second electronic device in the electronic device module in the related art refers to Figure 5 Other electronic devices 1323 marked in the figure. “Electronic device module in this application” refers to Figure 34 The electronic device module 20 shown in the present application refers to the second electronic device in the electronic device module Figure 34 The two second electronic devices 240 are marked in FIG. Figure 5 The electronic device module 13 shown, Figure 34 The only variation of the electronic device module 20 shown in this application is the addition of a first adhesive 230 covering the second electronic device 240 and bonded to the printed circuit board 210. Along the third direction Z, the coverage of the first electronic device 220 is completely within the coverage of the first adhesive 230.

[0220] According to Table 1 above, in the simulation results, Figure 5 The maximum strain of the first electronic device 1322 in the electronic device module 13 shown is 3541 μe; Figure 34 The maximum strain of the first electronic device 220 in the electronic device module 20 shown is 2862μe. Wherein, μ refers to 10-6 (i.e., micrometers), and e is the elastic modulus. It can be seen that the electronic device module 20 of the present application can reduce the maximum strain of the first electronic device 220, and the yield rate reaches 19.2%. In the simulation results, Figure 5 The maximum stress of the second electronic device 1323 in the electronic device module 13 shown is 64.2 MPa (megapascals); Figure 34 The maximum stress of the second electronic device 240 in the electronic device module 20 is 41.11 MPa. Therefore, the electronic device module 20 of the present application can reduce the maximum stress of the second electronic device 240 and achieve a yield rate of 36%.

[0221] In addition, the influence of the second reinforcement structure 294 on different chips was tested when the second reinforcement structure 294 only includes the plate 2942 and the material of the plate 2942 is copper. The results are shown in Table 2 below.

[0222] Table 2

[0223] No second reinforcement structure There is a second reinforcement structure Yield Chip A 10.9N 18.9N 73.4％ Chip B 23.9N 44.2N 84.9％

[0224] In Table 2, chip A and chip B are two different chips, that is, two different first electronic devices 220. For chip A, when chip A is not connected to the second reinforcement structure 294, its strength is 10.9 N (Newtons); when chip A is connected to the second reinforcement structure 294 (thickness 0.02 mm), its strength is 18.9 N. Thus, it can be seen that the second reinforcement structure 294 can increase the strength of chip A, and the yield rate is approximately 73.4%. For chip B, when chip B is not connected to the second reinforcement structure 294, its strength is 23.9 N (Newtons); when chip B is connected to the second reinforcement structure 294 (thickness 0.1 mm), its strength is 44.2 N. Thus, it can be seen that the second reinforcement structure 294 can increase the strength of chip B, and the yield rate is approximately 84.9%.

[0225] In addition, in the related art, a buffer pad is provided between the first electronic device 1322 and the shielding cover 1324 to reduce the strain of the first electronic device 1322. This related art is also simulated, and the results are as follows: Figure 35 As shown. Figure 35 In the figure, the horizontal axis is the modulus of the buffer material of the buffer pad, in MPa; the vertical axis is the maximum strain of the chip of the first electronic device 1322. Figure 35 It can be seen that in this related art, when the buffer material modulus of the buffer pad is 0, that is, when the buffer pad is not set, the maximum strain of the chip is 100%. Based on this, when the buffer material modulus of the buffer pad is 0.05MPa, the maximum strain of the chip is 96.6%, and the yield rate is 3.4%. When the buffer material modulus of the buffer pad is 5MPa, the maximum strain of the chip is 80.9%, and the yield rate is 19.1%. When the buffer material modulus of the buffer pad is 50MPa, the maximum strain of the chip is 80.2%, and the yield rate is 19.8%. When the buffer material modulus of the buffer pad is 80MPa, the maximum strain of the chip is 79.7%, and the yield rate is 20.3%. That is to say, in this related art, even if the buffer material modulus of the buffer pad is 80MPa (equivalent to the buffer pad being made of glass), the maximum strain of the first electronic device 1322 is only reduced by 20.3%. It can be seen that the electronic device module 20 provided in the embodiment of the present application has a significantly better protection effect on the first electronic device 220 than the buffer pad in the related art through the first colloid 230 , the second colloid 270 , the first reinforcement structure 292 , and the second reinforcement structure 294 .

[0226] The electronic device module 20 provided in the embodiment of the present application has at least the following beneficial effects: (1) The first colloid 230 can reinforce the portion of the covered printed circuit board 210 located in the second area 2121, thereby dispersing external mechanical stress. In this way, the probability of deformation of the portion of the printed circuit board 210 located in the second area 2121 when subjected to external stress can be reduced. Since the first area 2111 and the second area 2121 at least partially overlap, this can also play a certain protective role for the first electronic device 220 covering the first area 2111, thereby solving to a certain extent the problem that the first electronic device 220 is easily damaged when the electronic device is subjected to external stress, and can improve the reliability of the electronic device used by the electronic device module 20. (2) When the range of the first area 2111 completely falls within the range of the second area 2121, it can protect the first electronic device 220 covering the first area 2111 to the greatest extent. (3) Compared with the electronic device module 20 in the related art, the layout of the electronic devices in the module is not changed, and the thickness of the electronic device module 20 is not increased, thereby ensuring the product competitiveness of the electronic device. (4) The electronic device module 20 may also include a reinforcement structure (including a first reinforcement structure 292 and a second reinforcement structure 294) for reinforcing the first electronic device 220, thereby protecting the first electronic device 220. (5) The electronic device module 20 may also include a second colloid 270, which covers the first electronic device 220 and is used to reinforce the first electronic device 220, thereby protecting the first electronic device 220. (6) In addition, the second colloid 270 can also wrap the grinding damage layer and the cutting damage layer of the first electronic device 220, thereby alleviating the stress concentration at the defective position during the bending process of the first electronic device 220. The design of the second colloid 270 can also avoid the assembly stress that may be caused by direct hard contact between the first electronic device 220 and other structures (such as the reinforcement structure), thereby avoiding mechanical damage to the first electronic device 220 during the patch assembly process. (7) In the embodiment of the present application, the enclosure structure (including the first enclosure combination and the second enclosure structure 280), the filling method of the liquid glue, etc. can all be implemented using existing equipment and processes, without increasing the complexity of the preparation process of the electronic device module 20.

[0227] The present application also provides an electronic device including a housing and an electronic device module 20 as described in any of the above embodiments. The housing has a cavity. The cavity is formed by a cover plate, a middle frame, and a rear cover. The electronic device module 20 is located within the cavity formed by the housing.

[0228] In some embodiments, the electronic device module 20 is disposed in the cavity in such a manner that the first surface 211 of the printed circuit board 210 is away from the back cover, and the second surface 212 is close to the back cover.

[0229] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. An electronic device module, applied to electronic equipment, characterized in that: The electronic device module includes: a printed circuit board, a first electronic device and a first colloid; The printed circuit board has a first surface and a second surface opposite to each other, the first electronic device is located on the first surface, and the first electronic device covers a first area of ​​the first surface; The first colloid is in a solid state, adheres to the second surface, and covers a second area of ​​the second surface; along a preset direction, the first area and the second area at least partially overlap, and the preset direction is a direction perpendicular to the first surface.

2. The electronic device module according to claim 1, wherein: The electronic device module further includes: a second electronic device and a shielding cover; The second electronic device is located in the second area of ​​the second surface, and the first colloid covers the second electronic device; The shielding cover is located on the second surface and encloses the second surface to form a first cavity. The first colloid and the second electronic device are both located in the first cavity.

3. The electronic device module according to claim 2, wherein: The electronic device module further includes: a first enclosure structure; The first enclosure structure is located in the first cavity and is connected to at least one of the second surface and the shielding cover; the first enclosure structure is arranged around the second area, and the first colloid is bonded to the inner wall of the first enclosure structure.

4. The electronic device module according to any one of claims 1 to 3, wherein: The electronic device module further includes: a second colloid; The second colloid covers the first electronic component and adheres to a third area of ​​the first surface, and the first area is located in the third area.

5. The electronic device module according to claim 4, wherein: The electronic device module further includes: a second enclosure structure; The second enclosure structure is connected to the first surface; the second enclosure structure is arranged around the third area, and the second colloid is bonded to the inner wall of the second enclosure structure.

6. The electronic device module according to claim 5, wherein: The electronic device module further includes: a first reinforcement structure; The first reinforcement structure is connected to the second enclosure structure; the printed circuit board, the second enclosure structure, and the first reinforcement structure enclose a second cavity, the second cavity is located on a side of the first reinforcement structure close to the printed circuit board, and the first electronic device is located in the second cavity; the first reinforcement structure and the second enclosure structure also enclose a holding pool, the holding pool is located on a side of the first reinforcement structure away from the printed circuit board; The first reinforcement structure is provided with a first glue inlet hole, which passes through the first reinforcement structure; the second colloid includes a first sub-colloid and a second sub-colloid, the first sub-colloid is located in the second cavity, the second sub-colloid is located in the holding pool, and the first sub-colloid and the second sub-colloid are connected through the first glue inlet hole.

7. The electronic device module according to any one of claims 4 to 6, wherein: The printed circuit board is provided with a second glue inlet hole and a first exhaust hole; The second glue inlet hole passes through the printed circuit board, and the first end of the second glue inlet hole is located in the third area, and the second end of the second glue inlet hole is located in the second area; the first colloid and the second colloid are connected through the second glue inlet hole; The first exhaust hole passes through the printed circuit board, and a first end of the first exhaust hole is located in the second area, and a second end of the first exhaust hole is located in the first surface and not in the third area.

8. The electronic device module according to claim 3, wherein: The shielding cover is provided with a third glue inlet hole and a second exhaust hole; the third glue inlet hole and the second exhaust hole are both located within the surrounding range of the first enclosure structure.

9. The electronic device module according to claim 8, wherein: The electronic device module further includes a shielding cover connected to the shielding case and configured to cover the third glue inlet hole and the second exhaust hole.

10. The electronic device module according to any one of claims 1 to 9, wherein: Along a preset direction, the first area is located within the coverage of the second area.

11. The electronic device module according to any one of claims 1 to 10, wherein: The electronic device module further includes: a second reinforcement structure; The second reinforcement structure includes a plate body, and the plate body is bonded or welded to a surface of the first electronic component away from the printed circuit board.

12. The electronic device module according to claim 11, wherein: The second reinforcement structure further includes two or more limiting members; Each of the two or more limiting members is connected to the board to limit the relative position of the board and the first electronic component.

13. An electronic device, characterized in that: comprising a housing and the electronic device module according to any one of claims 1 to 12; The housing is formed with a cavity, and the electronic device module is located in the cavity.

14. The electronic device according to claim 13, wherein: The housing includes a back cover, the first surface of the printed circuit board is away from the back cover, and the second surface of the printed circuit board is close to the back cover.

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