Printed substrate and electronic control device

Abstract

The invention provides a printed board and an electronic control device. The printed substrate is provided with an insulating substrate and a power supply pattern (12) which is a part of a conductive wiring part and which is provided on at least one surface (S1) of the insulating substrate. In addition, the printed substrate is provided with: an insulating part (18) which is a part where the power supply pattern is not formed on one surface; and a terminal pad (14) which is a portion to which solder connection is to be performed, one portion of which is connected to the power supply pattern and the other portion of which is provided adjacent to the insulating portion. In addition, the printed substrate is provided with a conductive extension pattern (17a) which is surrounded by the insulating part and extends from the terminal pad.

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board and an electronic control device. Background Art

[0002] As an example of a printed circuit board, the technology disclosed in Patent Document 1 is known. The printed circuit board includes a thermal pad in which at least half of the entire circumference of a through-hole is covered by a planar pattern. The thermal pad is composed of the planar pattern, a plurality of bridges connecting the planar pattern and the through-hole, and a thermal gap.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-109020 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] However, in the case of thermal pads, the bridge portion is directly connected to the planar pattern. Therefore, heat from soldering the printed circuit board dissipates toward the planar pattern. This reduces the solderability of the printed circuit board and may reduce the reliability of the solder connection. Furthermore, further improvements are required for printed circuit boards and electronic control devices, based on the aforementioned and other considerations not mentioned.

[0008] One object of the disclosure is to provide a printed circuit board with improved solder connection reliability. Another object of the disclosure is to provide an electronic control device with improved solder connection reliability.

[0009] Solutions to Problems

[0010] The printed circuit board disclosed here comprises: an insulating substrate; a planar pattern, which is a part of a conductive wiring portion and is arranged on at least one side of the insulating substrate; a non-forming portion, which is a portion on one side where no planar pattern is formed; an electrode connecting portion, which is a portion for solder connection, a part of which is connected to the planar pattern and the other part is arranged adjacent to the non-forming portion; and a conductive extended pattern, which is surrounded by the non-forming portion and extends from the electrode connecting portion.

[0011] The printed circuit board disclosed herein includes an electrode connection portion, one portion of which is connected to the planar pattern and the other portion of which is adjacent to the non-formed portion. The extended pattern extending from the electrode connection portion is surrounded by the non-formed portion. Therefore, when the electrode connection portion is brazed, the extended pattern is heated, and the heat is less likely to dissipate into the planar pattern. This prevents a decrease in solderability and improves solder connection reliability.

[0012] The electronic control device disclosed herein is an electronic control device comprising a printed circuit board and an electronic component (40) mounted on the printed circuit board.

[0013] The printed circuit board comprises: an insulating substrate; a planar pattern, which is a part of a conductive wiring portion and is provided on at least one side of the insulating substrate; a non-forming portion, which is a portion on one side where no planar pattern is formed; an electrode connecting portion, which is a portion for solder connection, a part of which is connected to the planar pattern and another part of which is provided adjacent to the non-forming portion; and a conductive extended pattern, which is surrounded by the non-forming portion and extends from the electrode connecting portion.

[0014] The electronic component is electrically connected to the wiring portion.

[0015] Thus, the electronic control device includes the above-mentioned printed circuit board, thereby improving the reliability of solder connection in the electronic control device.

[0016] The various solutions disclosed in this specification employ different technical means to achieve their respective objectives. The claims and the symbols within parentheses therein are provided for illustrative purposes only to illustrate the correspondence between the components of the embodiments described below and are not intended to limit the scope of the technology. The objectives, features, and effects disclosed in this specification will become more apparent with reference to the detailed description and accompanying drawings that follow. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a plan view showing a schematic configuration of the electronic control device in the first embodiment.

[0018] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0019] Figure 3 yes Figure 1 An enlarged top view of part III.

[0020] Figure 4 This is a plan view showing a schematic configuration of an electronic control device in Modification 1.

[0021] Figure 5 It is a plan view showing a schematic configuration of an electronic control device in Modification 2.

[0022] Figure 6 It is a plan view showing a schematic configuration of an electronic control device in Modification 3.

[0023] Figure 7 It is along Figure 6 A cross-sectional view taken along line VII-VII.

[0024] Figure 8It is a cross-sectional view showing a schematic configuration of an electronic control device in a second embodiment.

[0025] Figure 9 It is a partial plan view showing a schematic configuration of an electronic control device in a second embodiment. DETAILED DESCRIPTION

[0026] Hereinafter, various embodiments for implementing the present disclosure will be described with reference to the accompanying drawings. Within each embodiment, portions corresponding to those described in a previous embodiment are denoted by the same reference numerals, and duplicate descriptions may be omitted. Within each embodiment, when only a portion of a structure is described, the remaining portions of the structure may be referred to and applied to the previously described embodiments.

[0027] In the following, three directions perpendicular to each other are referred to as the X direction, the Y direction, and the Z direction. In addition, a plane defined by the X direction and the Y direction is referred to as the XY plane.

[0028] (First embodiment)

[0029] use Figures 1 to 3 A printed circuit board 10 according to this embodiment and an electronic control device 100 including the printed circuit board 10 will be described.

[0030] <Electronic Control Unit 100>

[0031] like Figure 1 、 Figure 2 As shown, the electronic control device 100 includes a printed circuit board 10, a power connector 21, an external connector 22, and electronic components 40. Furthermore, the electronic control device 100 may also include a housing to house these components. The printed circuit board 10 will be described later. The structure in which the connectors 21 and 22 and the electronic components 40 are mounted on the printed circuit board 10 may also be referred to as a circuit board or printed circuit board.

[0032] The power connector 21 is mounted on the printed circuit board 10. The power connector 21 is a connector for electrically connecting a power supply device provided outside the electronic control device 100 to the electronic control device 100. The power supply device supplies operating power and the like to the electronic components 40.

[0033] The power connector 21 includes, for example, power terminals 21a, ground terminals 21b, and a connector housing 21c. The connector housing 21c holds the power terminals 21a and ground terminals 21b, exposing both ends of the power terminals 21a and the ground terminals 21b. The two terminals 21a and 21b are electrically connected to the wiring portion of the printed circuit board 10 via a conductive connecting member. Solder, silver paste, or the like can be used as the conductive connecting member.

[0034] The external connector 22 is mounted on the printed circuit board 10. The external connector 22 is a connector for electrically connecting a load device provided outside the electronic control device 100 to the electronic control device 100. The load device is a device that is driven and controlled by the electronic control device 100.

[0035] The external connector 22 includes, for example, a power terminal 22a, a ground terminal 22b, and a connector housing 22c. The connector housing 22c holds the power terminal 22a and the ground terminal 22b, exposing both ends of the power terminal 22a and the ground terminal 22b. The two terminals 22a and 22b are electrically connected to the wiring portion of the printed circuit board 10 via a conductive connecting member.

[0036] The power connector 21 and the external connector 22 are equivalent to the plug-in mounting components. The terminals 21a, 21b, 22a, and 22b are equivalent to the terminals of the plug-in mounting components. Figure 2 In order to simplify the drawing, the connector housings 21c and 22c and the power terminals 21a and 22a are shown by two-dot chain lines.

[0037] Electronic components 40 are mounted on printed circuit board 10. Together with the wiring portion of printed circuit board 10, electronic components 40 form an electronic circuit. Multiple electronic components 40 are mounted on printed circuit board 10. In other words, electronic control device 100 includes multiple electronic components 40. The terminals of electronic components 40 are electrically connected to the wiring portion of printed circuit board 10 via conductive connecting members. Electronic components 40 may also be referred to as circuit elements or circuit devices.

[0038] The electronic components 40 include switching elements, resistors, capacitors, coils, and the like. The switching elements are semiconductor switching elements such as MOSFETs and IGBTs. One of the electronic components 40 may also be a driver circuit that outputs a drive signal to an external load. Another electronic component 40 may also be a power supply circuit that generates internal power for the electronic control unit 100 from power supplied by a power supply device. Alternatively, a driver circuit and a power supply circuit may be mounted on the printed circuit board 10 as the electronic components 40.

[0039] In addition, in this embodiment, a surface-mounted electronic component 40 is used as an example. However, the present disclosure is not limited to this, and an insert-mounted electronic component 40 can also be used. A surface-mounted electronic component 40 is also called an SMD 40. SMD is the abbreviation for Surface Mount Device. An insert-mounted electronic component 40 is also called a THD 40. THD is the abbreviation for Through Hole Device.

[0040] <Printed circuit board 10>

[0041] Here, use Figure 1 、 Figure 2 、 Figure 3 Next, the printed circuit board 10 is described. The printed circuit board 10 includes an electrically insulating insulating substrate 11 and conductive wiring portions 12 to 15 and 17a.

[0042] like Figure 1 、 Figure 2 As shown, the insulating substrate 11 has a first surface S1 and a back surface S2 opposite to the first surface. The first surface S1 and the back surface S2 are flat surfaces along the XY plane. The insulating substrate 11 has four side surfaces S3 to S6. The side surfaces S3 to S6 are surfaces connected to the first surface S1 and the back surface S2. The first side surface S3 and the second side surface S4 are opposite to each other. The third side surface S5 and the fourth side surface S6 are opposite to each other.

[0043] The wiring portions 12 to 15 and 17 a include wiring patterns 12 to 14 and 17 a formed by patterning a conductive thin film (copper foil or the like) and an interlayer connection portion 15 formed in a through hole 16 by plating or the like.

[0044] like Figure 2 As shown, through-hole 16 is a hole formed from one side S1 of insulating substrate 11 to the back side S2. Through-hole 16 is a hole that constitutes a through hole. Insulating substrate 11 has an interlayer connection portion 15 formed on the surface that constitutes through-hole 16. Interlayer connection portion 15 is connected to terminal pad 14 formed on one side S1. Interlayer connection portion 15 can also be called a through-electrode portion. Terminal pad 14 will be described later.

[0045] The through-hole includes a terminal pad 14, an interlayer connector 15, and a through-hole 16. The through-hole serves as an electrode for inserting connectors 21 and 22, which are mounted components. Specifically, through-hole 16 receives terminals 21a, 21b, 22a, and 22b of connectors 21 and 22. Terminals 21a, 21b, 22a, and 22b are electrically connected to terminal pad 14 and interlayer connector 15 via solder 50.

[0046] In this embodiment, two through holes are formed in the power pattern 12 and the ground pattern 13, respectively. A through hole for THD 40 may also be formed in the printed circuit board 10.

[0047] In addition, Figure 2 In order to simplify the drawing, the solder 50 is shown only on the power terminal 22a side. However, the solder 50 is provided corresponding to each terminal 21a, 21b, 22a, 22b. Therefore, the solder 50 is connected to each through hole.

[0048] like Figure 1 、 Figure 2As shown, the power pattern 12 is provided on at least one side S1 of the insulating substrate 11. The power pattern 12 is a wiring pattern for current flow. Therefore, the power pattern 12 can also be said to be a wiring pattern for current supply. In addition, the power pattern 12 is a wiring pattern electrically connected to the power terminals 21a and 22a.

[0049] A plurality of power supply patterns 12 are formed on one surface S1. The power supply patterns 12 are electrically connected to terminals of the electronic component 40. Adjacent power supply patterns 12 are electrically connected via the electronic component 40.

[0050] like Figure 1 As shown, ground pattern 13 is provided on at least one side S1 of insulating substrate 11. Like power pattern 12, ground pattern 13 is a wiring pattern for current flow. Therefore, ground pattern 13 can also be said to be a wiring pattern for current flow. Furthermore, ground pattern 13 is a wiring pattern electrically connected to ground terminals 21b and 22b.

[0051] Figures 1 to 3 The hollow arrows in the figure indicate the approximate direction of current flow. Specifically, in the power pattern 12, current flows from the power terminal 21a toward the electronic component 40. Furthermore, in the power pattern 12, current flows from the electronic component 40 toward the power terminal 22a. Meanwhile, in the ground pattern 13, current flows from the ground terminal 22b toward the ground terminal 21b.

[0052] The power pattern 12 and the ground pattern 13 are equivalent to planar patterns. A planar pattern is a portion of a wiring portion. A planar pattern refers to a fully filled wiring pattern. The power pattern 12 and the ground pattern 13 are wiring patterns with an area larger than the terminal pad 14 described later. The power pattern 12 and the ground pattern 13 are wiring patterns for carrying large currents. The power pattern 12 and the ground pattern 13 are wiring patterns with an area larger than that of signal wiring, i.e., a wide width. Signal wiring is, for example, a wiring pattern connected to the gate electrode of a MOSFET. Hereinafter, the power pattern 12 and the ground pattern 13 will also be collectively referred to as planar patterns.

[0053] like Figures 1 to 3 As shown, printed circuit board 10 has an insulating portion 18 on one side S1 where power pattern 12 and ground pattern 13 are not formed. Insulating portion 18 is formed by patterning power pattern 12 and ground pattern 13 so that one side S1 is exposed. Insulating portion 18 is provided around terminal pads 14, which will be described later.

[0054] Insulating portion 18 is provided to improve the solderability of terminal pad 14. Specifically, insulating portion 18 is provided to suppress the dissipation of heat from terminal pad 14 to the planar pattern during soldering. Insulating portion 18 corresponds to a non-formed portion. Insulating portion 18 can also be considered an area where the planar pattern has been removed. Figure 3The reference line RL is a virtual line indicating the boundary between the power pattern 12 and the insulating portion 18 .

[0055] like Figure 1 、 Figure 2 、 Figure 3 As shown, the terminal pads 14 are provided in connection with the power pattern 12 and the ground pattern 13. Specifically, the terminal pads 14 are wiring patterns that are continuous with the power pattern 12 and the ground pattern 13. The terminal pads 14 are locations to which solder 50 is connected. In this embodiment, two terminal pads 14 for the power pattern 12 and two terminal pads 14 for the ground pattern 13 are provided as an example. The following description uses the terminal pads 14 to which the power terminal 21a is connected.

[0056] like Figure 3 As shown, terminal pad 14 is provided in a ring shape around through-hole 16. A portion of terminal pad 14 is connected to power pattern 12. Another portion of terminal pad 14 is provided adjacent to insulating portion 18. Terminal pad 14 corresponds to an electrode connecting portion. Terminal pad 14 can also be referred to as a through-hole pad.

[0057] The terminal pad 14 can be divided into a connecting portion 141 and an insulating side portion 142, defined by a reference line RL. The connecting portion 141 is connected to the power pattern 12. The connecting portion 141 is located closer to the power pattern 12 than the reference line RL. Alternatively, the connecting portion 141 can be considered to be closer to the electronic component 40 than the reference line RL. The connecting portion 141 can also be considered part of the power pattern 12.

[0058] The insulating side portion 142 is a portion adjacent to the insulating portion 18. The insulating side portion 142 is a portion closer to the insulating portion 18 than the reference line RL. In addition, the insulating side portion 142 can also be considered to be a portion on the opposite side of the electronic component 40 than the reference line RL. The insulating side portion 142 can also be considered to be a portion extending from the power pattern 12. Adjacent means in the image Figure 3 So let's look at the adjacent situation when we look at the XY plane.

[0059] The extended pattern 17a is a wiring pattern that is surrounded by the insulating portion 18 and extends from the terminal pad 14. A portion of the extended pattern 17a is connected to the insulating side portion 142. In addition, the extended pattern 17a is not directly connected to the power pattern 12. It can be said that the extended pattern 17a extends from the terminal pad 14 to a position that is not connected to the power pattern 12. In other words, the extended pattern 17a is a portion separated from the power pattern 12. The extended pattern 17a is provided on the insulating portion 18 in a manner that does not connect the terminal pad 14 and the power pattern 12. In this embodiment, as an example, a rectangular extended pattern 17a is adopted. However, the present disclosure is not limited to this.

[0060] Furthermore, the terminal pad 14 on the ground pattern 13 side can be divided into a connecting portion 141 and an insulating side portion 142, similarly to the above description. Furthermore, the extended pattern 17a is provided so as to be connected to the terminal pad 14 on the ground pattern 13 side. In this case, the connecting portion 141 is a portion located closer to the ground pattern 13 side than the reference line RL. The insulating side portion 142 is a portion located closer to the insulating portion 18 side than the reference line RL. The connecting portion 141 can also be considered as a portion of the ground pattern 13. The insulating side portion 142 can also be considered as a portion extending from the ground pattern 13. The extended pattern 17a does not directly contact the ground pattern 13.

[0061] Here, the positional relationship among the power pattern 12, the terminal pad 14, and the insulating portion 18 will be described. Figure 1 As shown, the power pattern 12 is positioned closer to the electronic component 40 than the terminal pads 14. In other words, the majority of the power pattern 12 is positioned closer to the electronic component 40 than the terminal pads 14. Furthermore, the insulating portion 18 is positioned on the side opposite the electronic component 40 relative to the terminal pads 14. Thus, in the direction of current flow, the insulating portion 18, the terminal pads 14, and the power pattern 12 are arranged in this order. Furthermore, the printed circuit board 10 includes an extended pattern 17a on the insulating portion 18 thus positioned.

[0062] Thus, in the case of the terminal pad 14, when current flows through the planar pattern, the current density in the connecting portion 141 is higher than the current density in the insulating side portion 142. Taking the direction of current flow into consideration, the wiring pattern of the printed circuit board 10 is arranged so that the connecting portion 141 with a high current density is connected to the planar pattern, while the insulating side portion 142 with a low current density is not directly in contact with the planar pattern.

[0063] Next, the width of the planar pattern and the terminal pad 14 will be described. The width here refers to the width (length) in the Y direction. Figure 1 、 Figure 3 As shown, the width WW of the planar pattern is wider than the width LW of the terminal pad 14. The width LW of the terminal pad 14 is the width of the portion of the terminal pad 14 that is connected to the planar pattern. This facilitates the flow of current from the terminal pad 14 to the planar pattern on the printed circuit board 10. Furthermore, the width LW of the terminal pad 14 is preferably set to a level that does not adversely affect the insulating portion 18 due to the heat generated by the terminal pad 14 when current flows through the planar pattern.

[0064] Effects

[0065] As described above, the printed circuit board 10 includes a terminal pad 14, one portion of which is connected to the planar pattern and the other portion of which is adjacent to the insulating portion 18. The extended pattern 17a extending from the terminal pad 14 is surrounded by the insulating portion 18. Therefore, the extended pattern 17a is heated during soldering of the terminal pad 14, and the heat is not easily dissipated into the planar pattern. Furthermore, the heat of the extended pattern 17a is transferred to the terminal pad 14.

[0066] As a result, the printed circuit board 10 can suppress a decrease in the temperature of the terminal pads 14 and, consequently, the interlayer connection portion 15 during soldering. Consequently, the printed circuit board 10 can suppress a decrease in solderability and improve the connection reliability of the solder 50. Specifically, the printed circuit board 10 can improve the connection reliability of the solder 50 compared to a structure (comparative example) having a thermal pad connecting the terminal pads 14 and the planar pattern via a bridge portion.

[0067] Furthermore, in the comparative example, current flows through the bridge portion. Consequently, heat is generated in the bridge portion. Especially when large current flows through the planar pattern, the temperature in the bridge portion rises significantly. Therefore, in the comparative example, if the glass transition temperature of the insulating substrate is exceeded, the reliability and quality of the printed circuit board will be reduced.

[0068] In contrast, in printed circuit board 10, unlike the bridge portion, the connecting portion 141 is connected to the planar pattern. Therefore, the width of connecting portion 141, where the current density is high, is wider than in the comparative example. This allows printed circuit board 10 to suppress heat generation caused by current flow, thereby preventing degradation in the reliability of printed circuit board 10. Thus, printed circuit board 10 achieves both suppression of heat generation caused by current flow and improved connection reliability of solder 50.

[0069] The electronic control device 100 includes the printed circuit board 10 and the electronic component 40 mounted on the printed circuit board 10. This improves the connection reliability of the solder 50 in the electronic control device 100. Furthermore, the electronic control device 100 can suppress heat generation due to energization.

[0070] The preferred embodiments of the present disclosure have been described above. However, the present disclosure is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the main purpose of the present disclosure. Hereinafter, as other aspects of the present disclosure, modifications 1 to 3 and the second embodiment will be described. The above-mentioned embodiments and modifications 1 to 3 and the second embodiment can also be implemented individually, and can also be implemented in appropriate combinations. The present disclosure is not limited to the combinations shown in the embodiments, and can be implemented in various combinations.

[0071] (Variation 1)

[0072] like Figure 4As shown, the printed circuit board 10 may also extend a plurality of extended patterns 17b to the terminal pad 14. In addition, the plurality of extended patterns 17b may be arranged radially. In addition, the extended patterns 17b may be arranged in a curved shape.

[0073] (Variation 2)

[0074] like Figure 5 As shown, the printed circuit board 10 may also be provided with a T-shaped extended pattern 17c. That is, the extended pattern 17c includes a portion extending linearly from the insulating side portion 142 and a portion perpendicular to the portion.

[0075] As described above, the extended patterns 17a to 17c are formed in the insulating portion 18. The shape and area of ​​the insulating portion 18 are limited to prevent the printed circuit board 10 from becoming larger. Therefore, the extended patterns 17a to 17c are preferably formed within the limited insulating portion 18 to ensure sufficient heat during soldering.

[0076] (Variation 3)

[0077] like Figure 6 、 Figure 7 As shown, the extended pattern 17d may be stacked in multiple layers via the insulating substrate 11. That is, the printed substrate 10 is a multilayer substrate in which wiring patterns are stacked in multiple layers via the insulating substrate 11. Furthermore, the extended pattern 17d may be provided in each layer of the printed substrate 10.

[0078] Furthermore, the stacked extension patterns 17d can also be electrically connected via interlayer connection portions 17d1. The interlayer connection portions 17d1 are provided on the insulating substrate 11 and are connected to the extension patterns 17d of each layer. The interlayer connection portions 17d1 are so-called via holes.

[0079] (Second embodiment)

[0080] use Figure 8 、 Figure 9 Next, an electronic control device 101 and a printed circuit board 10a according to a second embodiment will be described. Figure 8 is with Figure 2 Equivalent cross-sectional view. Figure 9 It is a partial plan view of the region including the terminal pads 14. The electronic control device 101 differs from the electronic control device 100 mainly in that it includes an inter-board connector 23. The printed circuit board 10a also differs from the printed circuit board 10 mainly in the structure of the terminal pads 14.

[0081] The electronic control device 101 includes a printed circuit board 10a. An inter-board connector 23 is mounted on the printed circuit board 10a in place of the connectors 21 and 22. The inter-board connector 23 is a connector for electrically connecting printed circuit boards that are disposed facing each other.

[0082] like Figure 8 、 Figure 9 As shown, the printed circuit board 10a is provided with a power supply pattern 12 as part of a planar pattern, similarly to the above embodiment. Furthermore, the printed circuit board 10a has an insulating portion 18 on one side S1 where no planar pattern is formed. Furthermore, an electronic component 40 is mounted on the printed circuit board 10a.

[0083] like Figure 8 、 Figure 9 As shown, inter-substrate connector 23 includes power terminals 23a, a connector housing 23c, and signal terminals 23d. Connector housing 23c holds power terminals 23a and signal terminals 23d, exposing portions of power terminals 23a and signal terminals 23d. Unlike connectors 21 and 22, inter-substrate connector 23 is a surface-mount connector. Inter-substrate connector 23 is equivalent to a surface-mount component.

[0084] like Figure 9 As shown, a signal pattern 19 as part of a wiring pattern is provided on the printed circuit board 10a. The signal pattern 19 is connected to a signal pad 191. The signal pad 191 is connected to the signal terminal 23d. The signal pad 191 may also be called a signal pad.

[0085] Furthermore, the printed circuit board 10a has terminal pads 14 on one side S1. The power supply terminals 23a are connected to the terminal pads 14. Specifically, the terminal pads 14 are pads for surface mounting. The terminal pads 14 may also be called terminal pads.

[0086] As in the above-described embodiment, the terminal pad 14 is a portion to which solder 50 is connected. A portion of the terminal pad 14 is connected to the planar pattern, and another portion is provided adjacent to the insulating portion 18. Here, as an example, a terminal pad 14 connected to the power pattern 12 is used. Furthermore, a conductive extended pattern 17e is provided on the printed circuit board 10a, which is surrounded by the insulating portion 18 and extends from the terminal pad 14.

[0087] The electronic control device 101 can achieve the same effects as the electronic control device 100 .

[0088] While the present disclosure is described based on embodiments, it should be understood that the present disclosure is not limited to these embodiments or configurations. The present disclosure also encompasses various modifications and equivalents. Furthermore, various combinations and configurations are disclosed in the present disclosure, but combinations and configurations that include only one element, more than one element, or less than one element also fall within the scope and spirit of the present disclosure.

[0089] (Disclosure of technical ideas)

[0090] This specification discloses multiple technical concepts described in the following multiple items. Some items are sometimes described in a multiple dependency form, where a subsequent item selectively references a previous item. In addition, some items are sometimes described in a multiple dependency form, where a multiple dependency form is referenced by another multiple dependency form. These items described in a multiple dependency form define multiple technical concepts.

[0091] (Technical Thought 1)

[0092] A printed circuit board comprising:

[0093] insulating substrate;

[0094] a planar pattern, which is a part of the conductive wiring portion and is provided on at least one surface of the insulating substrate;

[0095] a non-formed portion, which is a portion on the one side where the planar pattern is not formed;

[0096] an electrode connecting portion, which is a portion to be connected with solder, wherein a portion of the electrode connecting portion is connected to the planar pattern and another portion is provided adjacent to the non-formed portion; and

[0097] A conductive extended pattern is surrounded by the non-formed portion and extends from the electrode connecting portion.

[0098] (Technical Thought 2)

[0099] According to the printed circuit board of technical idea 1, the width of the planar pattern is wider than the width of the portion of the electrode connecting portion connected to the planar pattern.

[0100] (Technical Thought 3)

[0101] According to the printed circuit board according to the technical idea 1 or 2, a plurality of the extending patterns are extended to the electrode connecting portion.

[0102] (Technical Thought 4)

[0103] According to the printed circuit board according to technical idea 3, the plurality of extending patterns are radially arranged.

[0104] (Technical Thought 5)

[0105] According to any one of technical concepts 1 to 4, the planar pattern is a pattern electrically connected to the electronic component, and the planar pattern is provided closer to the electronic component than the electrode connection portion.

[0106] The non-formed portion is provided on the side opposite to the electronic component with respect to the electrode connecting portion.

[0107] (Technical Thought 6)

[0108] According to the printed circuit board according to technical idea 5, the electronic component is a power supply circuit.

[0109] (Technical Thought 7)

[0110] According to the printed circuit board according to technical idea 5, the electronic component is a drive circuit.

[0111] (Technical Thought 8)

[0112] According to any one of technical concepts 1 to 7, the insulating substrate has a through hole formed from the one surface to the opposite surface of the one surface.

[0113] The electrode connecting portion is provided around the through hole on the one surface and is connected to a terminal of an insert mounting component.

[0114] (Technical Thought 9)

[0115] According to the printed circuit board according to any one of technical concepts 1 to 7, the electrode connecting portion is provided on the one surface and is connected to a terminal of a surface mount component.

[0116] (Technical Thought 10)

[0117] According to any one of technical concepts 1 to 9, the extended pattern is stacked in multiple layers via the insulating substrate.

[0118] (Technical Thought 11)

[0119] According to the printed circuit board according to technical concept 10, the printed circuit board includes an interlayer connection portion (17d1) provided on the insulating substrate and electrically connecting the stacked extended patterns.

[0120] (Technical Thought 12)

[0121] An electronic control device includes a printed circuit board and electronic components mounted on the printed circuit board, wherein:

[0122] The printed circuit board comprises:

[0123] insulating substrate;

[0124] a planar pattern, which is a part of the conductive wiring portion and is provided on at least one surface of the insulating substrate;

[0125] a non-formed portion, which is a portion on the one side where the planar pattern is not formed;

[0126] an electrode connecting portion, which is a portion to be connected with solder, wherein a portion of the electrode connecting portion is connected to the planar pattern and another portion is provided adjacent to the non-formed portion; and

[0127] A conductive extended pattern is surrounded by the non-formed portion and extends from the electrode connecting portion.

[0128] The electronic component is electrically connected to the wiring portion.

Claims

1. A printed circuit board, characterized in that: have: insulating substrate; a planar pattern, which is a part of the conductive wiring portion and is provided on at least one side of the insulating substrate; a non-formed portion, which is a portion on the one side where the planar pattern is not formed; an electrode connecting portion, which is a portion for solder connection, wherein a portion of the electrode connecting portion is connected to the planar pattern and another portion is provided adjacent to the non-formed portion; as well as A conductive extended pattern is surrounded by the non-formed portion and extends from the electrode connecting portion.

2. The printed circuit board according to claim 1, wherein The width of the planar pattern is wider than the width of a portion of the electrode connecting portion connected to the planar pattern.

3. The printed circuit board according to claim 1 or 2, characterized in that: A plurality of the extending patterns are extended from the electrode connecting portion.

4. The printed circuit board according to claim 3, wherein The plurality of extending arrangement patterns are arranged radially.

5. The printed circuit board according to claim 1 or 2, characterized in that: The planar pattern is a pattern electrically connected to the electronic component, and the planar pattern is provided at a position closer to the electronic component than the electrode connection portion. The non-formed portion is provided on the side opposite to the electronic component with respect to the electrode connecting portion.

6. The printed circuit board according to claim 5, wherein: The electronic component is a power supply circuit.

7. The printed circuit board according to claim 5, wherein: The electronic component is a drive circuit.

8. The printed circuit board according to claim 1 or 2, characterized in that: The insulating substrate has a through hole formed from the one surface to the opposite surface of the one surface, The electrode connecting portion is provided around the through hole on the one surface and is connected to a terminal of an insert mounting component.

9. The printed circuit board according to claim 1 or 2, characterized in that: The electrode connecting portion is provided on the one surface and is connected to a terminal of a surface mounting component.

10. The printed circuit board according to claim 1 or 2, characterized in that: The extended patterns are stacked in multiple layers via the insulating substrate.

11. The printed circuit board according to claim 10, wherein: The printed circuit board includes an interlayer connection portion provided on the insulating substrate and electrically connecting the stacked extension patterns.

12. An electronic control device comprising a printed circuit board and electronic components mounted on the printed circuit board, characterized in that: The printed circuit board comprises: insulating substrate; a planar pattern, which is a part of the conductive wiring portion and is provided on at least one side of the insulating substrate; a non-formed portion, which is a portion on the one side where the planar pattern is not formed; an electrode connecting portion, which is a portion for solder connection, wherein a portion of the electrode connecting portion is connected to the planar pattern and another portion is provided adjacent to the non-formed portion; as well as a conductive extended pattern, which is surrounded by the non-formed portion and extends from the electrode connecting portion; The electronic component is electrically connected to the wiring portion.

Images