Method for manufacturing copper foil substrate

Abstract

The invention discloses a manufacturing method of a copper foil substrate, which comprises the following steps of: providing two copper foil sheets in an overlapped state, arranging a bonding sheet between the two copper foil sheets, and forming a basic processing piece by the two copper foil sheets and the bonding sheet; at least one basic machined part is placed and fixed in a pressing jig comprising two clamping plates, tungsten disulfide coating films are formed on the surfaces of the clamping plates, and in the pressing process of the pressing jig, glue rich in the bonding piece overflows to the surfaces of the clamping plates; pressing, heating and baking the basic machined part, and disassembling the pressing jig and taking out the basic machined part after the basic machined part is shaped; and cleaning the cured residual adhesive on the clamping plate of the pressing jig, wherein the cleaning procedure comprises brushing by a nylon brush wheel, washing with water at normal temperature and blowing off water drops at normal temperature.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing copper foil substrates, particularly a method for spraying a tungsten disulfide coating on the plywood of a laminating jig used in the production process of the copper foil substrates. The coating has anti-stick and easy-to-clean properties. Therefore, when cleaning residual glue on the plywood, only a low-cutting-force nylon brush wheel is required to largely remove it. Small remaining glue spots can be removed by rinsing with room-temperature water, and residual water droplets on the plywood can be dried by simply blowing them with a blower at room temperature, thereby facilitating the reuse of the plywood. The present invention eliminates the need for release fluid to dissolve the colloid, as is conventionally done. In addition to being environmentally friendly and reducing production costs, it also facilitates the automated production of copper foil substrates. Background Art

[0002] With the rapid development of technology and information, various electronic products or devices are constantly being introduced on the market. Printed circuit boards (PCBs) are installed inside electronic products or devices for electronic components to be assembled. Electronic components with different functions or effects are soldered to the electronic circuits formed by the printed circuit boards, so that electronic products or devices can operate normally. With the widespread use of circuit boards, related process equipment manufacturers have also become more actively involved in research and development.

[0003] Circuit boards are generally categorized as rigid and flexible based on their flexibility. They can be divided into single-sided, double-sided, and multilayer boards based on the number of layers. Materials include paper-based copper foil substrates, composite substrates, fiberglass cloth copper foil substrates, flexible or rigid copper foil substrates, ceramic substrates, metal substrates, and thermoplastic substrates. Copper foil laminate (CCL) is an essential and critical base material in the circuit board manufacturing process. It is a laminate formed under high temperature and high pressure by laminating a prepreg (also known as a film) made by impregnating insulating paper, fiberglass cloth, or other fiber materials with resin with copper foil. Before processing, the prepreg is continuously wound to form a tape. After slitting and slicing, the cut sheets are stacked, heated to a certain temperature, and cured by pressing to form a substrate of the desired thickness. This substrate is then copper-clad on one or both sides, and then laminated and cured to form a copper foil substrate.

[0004] The pressing plate of the laminating jig for processing copper foil substrates is usually made of stainless steel. During the laminating process, the colloid inside the semi-cured adhesive sheet overflows from the copper foil machine base and remains on the pressing plate. The solidified colloid remaining on the pressing plate will contaminate the product and is not conducive to reuse. Therefore, the pressing plate must be cleaned. The standard operation for cleaning the residual glue is: (1) using a high-cutting force brush wheel to brush it off; (2) using high-temperature hot water for a rinse; (3) using a release fluid to dissolve the colloid; (4) using high-temperature hot air to solidify the release fluid remaining on the pressing plate. However, the aforementioned brush wheel causes great wear and tear on the pressing plate and reduces its service life, and heating water to a high temperature is extremely energy-consuming. Furthermore, the release fluid is a consumable material, which not only increases production costs but is also not environmentally friendly. The blower that provides high-temperature hot air consumes a lot of electricity and increases production costs. Regarding the above-mentioned shortcomings, those engaged in this industry need to study and solve them. Summary of the Invention

[0005] Therefore, in view of the above problems, the main object of the present invention is to provide a method for manufacturing a copper foil substrate.

[0006] The present invention provides a method for manufacturing a copper foil substrate, comprising: providing two copper foil sheets in a stacked state and an adhesive sheet disposed between the two copper foil sheets, wherein the two copper foil sheets and the adhesive sheet form a basic processing part; placing and fixing at least one basic processing part in a pressing jig comprising two clamping plates, wherein a tungsten disulfide coating is formed on the surfaces of the clamping plates, and during a pressurization process of the pressing jig, a colloid-rich substance in the adhesive sheet overflows onto the surfaces of the clamping plates; pressing and heating the basic processing part, and disassembling the pressing jig after the basic processing part is formed and removing it; and cleaning the solidified adhesive residue on the clamping plates of the pressing jig, wherein the cleaning process comprises brushing with a nylon brush wheel, washing with water at room temperature, and blowing off water droplets at room temperature. The plywood of the aforementioned pressing jig is sprayed with a tungsten disulfide coating, which has anti-stick and easy-to-clean properties. Therefore, when cleaning the residual glue on the plywood, only a low-cutting-force nylon brush wheel is needed to brush most of it away. The remaining small glue spots can be removed by rinsing with room-temperature water, and the remaining water droplets on the plywood can be dried by simply blowing them with a blower at room temperature, thereby facilitating the reuse of the plywood. The present invention reduces the operation of dissolving the colloid with release fluid as in the conventional technology. In addition to having the advantages of being environmentally friendly and reducing production costs, it is also more conducive to the production of copper foil substrates using an automated process.

[0007] Among them, the splint is made of mirror stainless steel.

[0008] The adhesive sheet is made of insulating paper or glass fiber cloth impregnated with resin.

[0009] The basic workpiece and at least one added layer workpiece can be placed in the pressing fixture for pressing and heating and baking operations. The added layer workpiece includes an adhesive sheet attached to the copper foil on either side of the basic workpiece, and a copper foil attached to the other side of the adhesive sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a three-dimensional exploded view of the copper foil substrate placed in the pressing fixture of the present invention before pressing.

[0011] Figure 2 This is a side cross-sectional view of a copper foil substrate placed in a pressing fixture of the present invention after pressing.

[0012] Figure 3 This is another exploded perspective view of the copper foil substrate placed in the pressing fixture of the present invention before pressing.

[0013] Figure 4 This is another side cross-sectional view of the present invention after the copper foil substrate is placed in the pressing fixture for pressing.

[0014] Figure 5 This is a three-dimensional schematic diagram of the present invention's pressing jig having a molded surface formed thereon.

[0015] Figure 6 This is a flow chart of the method for manufacturing the copper foil substrate of the present invention.

[0016] Explanation of the accompanying figures: 1-basic workpiece; 11-copper foil; 12-adhesive sheet; 2-pressing jig; 21-plywood; 22-tungsten disulfide coating; 3-build-up workpiece; 31-adhesive sheet; 32-copper foil; A1-providing two copper foils in a stacked state and an adhesive sheet between the two copper foils, and the two copper foils and the adhesive sheet form a basic workpiece; A2-placing and fixing at least one basic workpiece on a plate including two The pressing jig of the splint has a tungsten disulfide coating formed on its surface. During the pressurization process of the pressing jig, the colloid-rich adhesive sheet overflows onto the surface of the splint. A3: The basic workpiece is pressed and heated and baked. After the basic workpiece is shaped, the pressing jig is disassembled and removed. A4: The solidified residual glue on the splint of the pressing jig is cleaned. The cleaning process includes brushing with a nylon brush, washing with water at room temperature, and blowing off water droplets at room temperature. DETAILED DESCRIPTION

[0017] In order to achieve the above-mentioned objectives and effects, the technical means and structures adopted by the present invention are now described in detail with reference to the accompanying drawings for the characteristics and functions of the preferred embodiments of the present invention to facilitate a complete understanding.

[0018] like Figure 1 、 Figure 2 、 Figure 5The figures are respectively a perspective exploded view of a copper foil substrate placed in a pressing jig of the present invention before pressing, a side cross-sectional view after pressing, and a perspective schematic view of a plated surface formed on the clamping plate of the pressing jig. As can be clearly seen from the figures, the first embodiment of the present invention for manufacturing a copper foil substrate (CCL) includes: a basic processing part 1 and a pressing jig 2, and its features are detailed as follows:

[0019] The basic workpiece 1 includes two copper foils 11 stacked together, and an adhesive sheet 12 (PrePreg, PP) is disposed between the two copper foils 11 .

[0020] The pressing fixture 2 includes two clamping plates 21 , and at least one base workpiece 1 is placed and fixed in the two clamping plates 21 . A tungsten disulfide (WS2) coating 22 is formed on the surface of the clamping plates 21 .

[0021] like Figure 3 、 Figure 4 As shown in the figures, each is another three-dimensional exploded view of a copper foil substrate placed in a pressing jig of the present invention before pressing and another side cross-sectional view after pressing. It can be clearly seen from the figures that the second embodiment structure of the present invention for manufacturing a copper foil substrate includes: a basic processing part 1, a pressing jig 2 and a layer-building processing part 3. The only difference between this embodiment and the above-mentioned first embodiment structure is that in addition to placing the basic processing part 1 in the two clamping plates 21 of the pressing jig 2, at least one layer-building processing part 3 is provided above or below the basic processing part 1 to form a more multi-layer copper foil substrate, and the layer-building processing part 3 includes an adhesive sheet 31 attached to the copper foil sheet 11 on either side of the basic processing part 1, and a copper foil sheet 32 ​​attached to the other side of the adhesive sheet 31. The remaining components are no different from the first embodiment structure.

[0022] See also Figure 6 FIG. 1 is a flow chart of a method for manufacturing a copper foil substrate according to the present invention, comprising the following steps:

[0023] Step A1: Provide two copper foils 11 in a stacked state and dispose an adhesive sheet 12 between the two copper foils 11 , so that the two copper foils 11 and the adhesive sheet 12 form a basic workpiece 1 .

[0024] Step A2: Place and fix at least one basic workpiece 1 in a pressing fixture 2 including two clamping plates 21, and a tungsten disulfide coating 22 is formed on the surface of the clamping plates 21. During the pressurization process of the pressing fixture 2, the colloid-rich adhesive sheet 12 overflows to the surface of the clamping plates.

[0025] Step A3: Press and heat the basic workpiece 1 , and after the basic workpiece 1 is shaped, disassemble the pressing jig 2 and take it out.

[0026] Step A4: Clean the cured adhesive residue on the clamping plate 21 of the pressing fixture 2. The cleaning process includes brushing with a nylon brush, washing with water at room temperature, and blowing off water droplets at room temperature.

[0027] The clamping plate 21 is made of mirror-finished stainless steel; and the adhesive sheet 12 is made of insulating paper or glass fiber cloth impregnated with resin.

[0028] In the above-mentioned step A2, the basic processing part and at least one build-up processing part 3 can be placed in the pressing fixture 2 for pressing and heating and baking operations. The build-up processing part 3 includes an adhesive sheet 31 attached to the copper foil 11 on either side of the basic processing part 1, and a copper foil 32 attached to the other side of the adhesive sheet 31.

[0029] The main feature of the present invention is that the clamping plate 21 of the pressing jig 2 used in the production process of the copper foil substrate is sprayed with a tungsten disulfide coating 22, which has anti-stick and easy-to-clean properties. Therefore, when cleaning residual glue on the clamping plate 21, only a low-cutting-force nylon brush wheel is required to brush most of it away. Small remaining glue spots can be removed by rinsing with room-temperature water. Residual water droplets on the clamping plate 21 can be dried by simply blowing them with a blower at room temperature, thereby facilitating the reuse of the clamping plate 21. The present invention eliminates the process of dissolving the colloid with release fluid as in the conventional technology. In addition to having the advantages of being environmentally friendly and reducing production costs, it also facilitates the production of copper foil substrates using an automated process.

[0030] The above description is merely a preferred embodiment of the present invention and does not limit the scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the contents of the present invention description and drawings should be included in the scope of the present invention and are hereby stated.

[0031] In summary, the above-mentioned method for manufacturing a copper foil substrate of the present invention can truly achieve its efficacy and purpose when used. Therefore, the present invention is truly an invention with excellent practicality and meets the application requirements for an invention patent.

Claims

1. A method for manufacturing a copper foil substrate, characterized in that: The following steps are involved: A1. Providing two copper foils in a stacked state with an adhesive sheet disposed between the two copper foils, wherein the two copper foils and the adhesive sheet form a basic workpiece; A2. placing and fixing at least one base workpiece in a pressing fixture comprising two clamping plates, wherein a tungsten disulfide coating is formed on the surfaces of the clamping plates, and during the pressing process of the pressing fixture, the colloid-rich content of the adhesive sheet overflows onto the surfaces of the clamping plates; A3. Press and heat the basic workpiece. After the basic workpiece is shaped, disassemble the pressing jig and remove it; as well as A4. Clean the cured adhesive residue on the plywood of the pressing jig. The cleaning process includes brushing with a nylon brush, washing with water at room temperature, and blowing off water droplets at room temperature.

2. The method for manufacturing a copper foil substrate according to claim 1, wherein: The splint is made of mirror-finished stainless steel.

3. The method for manufacturing a copper foil substrate according to claim 1, wherein: The adhesive sheet is made of insulating paper or glass fiber cloth impregnated with resin.

4. The method for manufacturing a copper foil substrate according to claim 1, wherein: In step A2, the base workpiece and at least one build-up workpiece are placed in the pressing fixture for pressing and heating and baking operations. The build-up workpiece includes an adhesive sheet attached to the copper foil on either side of the base workpiece, and a copper foil attached to the other side of the adhesive sheet.

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