Electronic device

Abstract

The invention provides electronic equipment which comprises an airflow driving part, a middle frame, a main board and a structural part, the middle frame, the main board and the structural part are sequentially arranged in a stacked mode in the first direction, and a first guide part and a second guide part are arranged between the structural part and the main board and jointly define a first air channel. A third guide part and a fourth guide part are arranged between the middle frame and the main plate and define a second air duct together with the middle frame and the main plate; the airflow driving part is located on the first air channel and the second air channel or located on a path where the first air channel and the second air channel communicate with the outside of the electronic equipment. The airflow driving part is used for driving air to be blown to the air outlets of the first air channel and the second air channel from the air inlets of the first air channel and the second air channel. The first air duct and the second air duct are arranged on the two surfaces of the mainboard respectively to dissipate heat of the two surfaces of the mainboard, the heat dissipation efficiency can be improved, and the first guide part, the second guide part, the third guide part and the fourth guide part can reduce the wind resistance of cold air in the electronic equipment.

Description

[0001] This application is a divisional application. The application number of the original application is 2020113495703, and the original application date is November 26, 2020. The entire content of the original application is incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of terminal technology, and in particular to an electronic device. Background Art

[0003] With the development of smartphones, features such as CPU, charging, and camera have become key indicators of a product's performance. As phone functionality increases, so too does heat generation. Excessive heating can affect proper function. Currently, there are two main types of air-cooling solutions. One involves an external fan that blows heat away from the phone's surface, making it inconvenient to carry and hindering operation. The other involves an internal fan, which currently cools the phone by stacking fans on the motherboard and creating independent air ducts. However, this prevents direct contact between the cool air and the heat-generating components, resulting in poor heat dissipation. Furthermore, the overall thickness of the stacked device is insufficient to meet the current trend of thinner, higher-performance products. Summary of the Invention

[0004] The present application provides an electronic device that can directly dissipate heat to the upper and lower surfaces of a mainboard and reduce wind resistance.

[0005] The electronic device provided in the present application includes an airflow driving component and a middle frame, a mainboard, and structural components stacked in sequence along a first direction. Among them, the middle frame is the main bearing component in the electronic device, and the middle frame can be a carrier for carrying internal components of the electronic device. One side of the middle frame is used to install a display screen, and the other side is used to install components such as a battery and a mainboard. The mainboard is also called the mainboard, system board or motherboard. It is a component of the circuit of an integrated electronic device. The layout arrangement, size, shape, and power supply specifications of each component on the mainboard are all subject to general standards. When the electronic device is working, each component on the mainboard will generate a lot of heat, which is the main heat source of the electronic device. If the mainboard heats up too much, it will affect the performance of the components on the mainboard, and the mainboard needs to be cooled and dissipated in time. The airflow driving component is a fan, including a centrifugal fan or an axial fan. The shape of the fan can be cylindrical, columnar or other shapes.

[0006] The middle frame and structural members are arranged on both sides of the mainboard along a first direction. In this embodiment, the first direction is the thickness direction of the electronic device. The structural member can be a back cover or a support member. The support member is used to support the mainboard, which is fixed between the support member and the middle frame. The support member can also be used to support other electronic components in the electronic device.

[0007] A first guide portion and a second guide portion are provided between the structural member and the mainboard, and are arranged relative to each other along the second direction. The first guide portion, the structural member, the second guide portion and the mainboard together enclose a first air duct. The second direction intersects with the first direction. In this embodiment, the second direction is perpendicular to the first direction. The second direction is parallel to the plane where the display screen or the back cover of the electronic device is located. The second direction may be the width direction of the electronic device or the length direction of the electronic device. In this embodiment, the second direction is the width direction of the electronic device. When the structural member is a back cover, only a portion of the back cover participates in forming the first air duct. When the structural member is a support member, the entire support member or a portion of the support member may participate in forming the first air duct.

[0008] The first and second guide portions can be a continuous block or a block with pores. In this embodiment, the first and second guide portions are a continuous block. When cold air from the outside of the electronic device enters the first air duct, the cold air does not leak out to areas outside the first air duct, but is dissipated only on the surface of the motherboard within the first air duct, thereby improving the motherboard's heat dissipation efficiency.

[0009] In some embodiments, the first guide portion and the second guide portion are discontinuous blocks. The first guide portion has multiple first guide sub-sections, and the second guide portion has multiple second guide sub-sections. A first gap is defined between two adjacent first guide sub-sections, and a second gap is defined between two adjacent second guide sub-sections. The lengths of the multiple first guide sub-sections can be the same or different, and the widths of the first gaps between two adjacent first guide sub-sections can be the same or different. The lengths of the multiple second guide sub-sections can be the same or different, and the widths of the second gaps between two adjacent second guide sub-sections can be the same or different. In this embodiment, the first guide portion and the second guide portion can also guide most of the cold air through the first air duct, thereby improving the heat dissipation efficiency of the motherboard surface located in the first air duct. In this embodiment, the first guide portion and the second guide portion are discontinuous blocks, which facilitates electrical connection of the motherboard to other electronic components in the electronic device via connecting wires. For example, one end of the connecting wire passes through the first gap or the second gap to electrically connect to the surface of the motherboard facing the structural component, while the other end of the connecting wire is connected to an electronic component other than the motherboard. The provision of the first gap or the second gap facilitates electrical connection of the surface of the motherboard facing the structural component to surrounding electronic components.

[0010] A third guide portion and a fourth guide portion are disposed between the middle frame and the mainboard, opposing each other along a third direction. The third guide portion, the middle frame, the fourth guide portion, and the mainboard collectively enclose a second air duct. The first direction intersects the second direction and the third direction, respectively. In this embodiment, the third direction is perpendicular to the first direction and the same as the second direction, and the first and second air ducts are arranged parallel to each other. In some embodiments, the third direction and the second direction may be different and intersect each other.

[0011] The third and fourth guide portions can be continuous blocks or blocks with pores. In this embodiment, the third and fourth guide portions are continuous blocks. When cold air from the electronic device enters the second air duct, it prevents the cold air from leaking outside the second air duct and dissipates heat only on the motherboard surface within the second air duct. The first and second air ducts dissipate heat from two surfaces of the motherboard, respectively, thereby improving the motherboard's heat dissipation efficiency.

[0012] In some embodiments, the third and fourth guide portions are discontinuous blocks. The third guide portion has multiple third guide sub-sections, and the fourth guide portion has multiple fourth guide sub-sections. A third gap is defined between two adjacent third guide sub-sections, and a fourth gap is defined between two adjacent fourth guide sub-sections. The lengths of the multiple third guide sub-sections can be the same or different, and the widths of the third gaps between two adjacent third guide sub-sections can be the same or different. The lengths of the multiple fourth guide sub-sections can be the same or different, and the widths of the fourth gaps between two adjacent fourth guide sub-sections can be the same or different. In this embodiment, the third and fourth guide portions can also guide cool air through the second air duct to increase the heat dissipation efficiency of the motherboard surface located in the second air duct. In this embodiment, the third and fourth guide portions are discontinuous blocks, which facilitates electrical connection of the motherboard to other electronic components in the electronic device via connecting wires. For example, one end of the connecting wire passes through the third or fourth gap to electrically connect to the surface of the motherboard facing the midframe, while the other end of the connecting wire connects to an electronic component other than the motherboard. The provision of the third or fourth gap facilitates electrical connection of the surface of the motherboard facing the midframe to surrounding electronic components.

[0013] The airflow driving component is located on the first air duct and the second air duct or on the path where the first air duct and the second air duct connect to the outside of the electronic device. The first air duct and the second air duct both have an air inlet and an air outlet that are relatively arranged and connected to the outside of the electronic device. The airflow driving component is used to drive the wind from the air inlets of the first air duct and the second air duct to the air outlets of the first air duct and the second air duct respectively.

[0014] The first and second air ducts include the interiors of the first and second air ducts and the air outlets or air inlets of the first and second air ducts, i.e., the air flow driving member may be located within the interiors of the first and second air ducts, or at the air outlets or air inlets of the first and second air ducts. In this application, an air inlet refers to the location where air enters a component, and an air outlet refers to the location where air leaves a component. For example, the air inlet and air outlet of the air flow driving member may be designated as a first air inlet and a first air outlet. When the air flow driving member is operating, the driving air enters from the first air inlet and exits from the first air outlet, wherein the first air inlet and the first air outlet are located on opposite sides of the air flow driving member. For another example, the air inlet and air outlet of the first air duct may be designated as a second air inlet and a second air outlet. The second air inlet and the second air outlet are located at opposite ends of the first air duct, respectively. When the air flow driving member is operating, the driving air enters from the second air inlet of the first air duct, passes through the interior of the first air duct, and exits from the second air outlet. For another example, the air inlet and air outlet of the second air duct are recorded as the third air inlet and the third air outlet, and the third air inlet and the third air outlet are respectively located at the two ends of the second air duct. When the airflow driving component is working, the driving air enters from the third air inlet of the second air duct, and then passes through the interior of the second air duct and leaves from the third air outlet.

[0015] The number of airflow driving members can be set to 1, 2, 3, or more than 3 according to actual needs. In some embodiments, there are two airflow driving members, and the two airflow driving members are respectively located inside the first air duct and the second air duct. For the airflow driving member located in the first air duct, the first air inlet of the airflow driving member and the second air inlet of the first air duct are located on the same side, and the first air outlet of the airflow driving member and the second air outlet of the first air duct are located on the same side. When the airflow driving member is in operation, air enters the second air inlet of the first air duct, then enters the first air inlet of the airflow driving member, then leaves the airflow driving member from the first air outlet of the airflow driving member, and then leaves the first air duct through the second air outlet. For the airflow driving element located in the second air duct, the first air inlet of the airflow driving element and the third air inlet of the second air duct are located on the same side, and the first air outlet of the airflow driving element and the third air outlet of the second air duct are located on the same side. When the airflow driving element is in operation, air enters the third air inlet of the second air duct, then enters the first air inlet of the airflow driving element, exits the airflow driving element through the first air outlet of the airflow driving element, and then exits the second air duct through the third air outlet. In this embodiment, the second air inlet and the third air inlet are located on the same side, and the second air outlet and the third air outlet are located on the same side. In some embodiments, the second air inlet and the third air outlet are located on the same side, and the second air outlet and the third air inlet are located on the same side. This means that the airflow driving elements in the first and second air ducts blow air in opposite directions, and the air flows in opposite directions in the first and second air ducts. In some embodiments, two or more airflow driving elements may be provided in each of the first and second air ducts to increase air volume or speed, thereby improving cooling efficiency.

[0016] The airflow driving member being located on a path where the first air duct and the second air duct are connected to the outside of the electronic device includes the airflow driving member being located on a path where the air inlets of the first air duct and the second air duct are connected to the outside of the electronic device, or the airflow driving member being located on a path where the air outlets of the first air duct and the second air duct are connected to the outside of the electronic device. In one embodiment, the airflow driving member is located on a path where the second air inlet of the first air duct is connected to the outside of the electronic device. For example, when the electronic device includes a back cover, the air inlet of the electronic device is provided on a side wall of the back cover. In this embodiment, an air inlet hole can be provided on the second guide portion so that the second air inlet of the first air duct is connected to the outside. The airflow driving member is located between the second air inlet of the first air duct and the air inlet of the back cover. When the airflow driving member is in operation, the air is driven to enter the electronic device from the air inlet of the back cover, and then the air enters the second air inlet of the first air duct. In one embodiment, the airflow driving member is located on a path connecting the second air outlet of the first air duct to the outside of the electronic device. For example, the air outlet of the electronic device is located on the other side wall of the back cover. In this embodiment, an air outlet hole can be provided on the first guide portion to connect the second air outlet of the first air duct to the outside. The airflow driving member is located between the second air outlet of the first air duct and the air outlet of the back cover. When the airflow driving member is in operation, a negative pressure is formed in the internal space of the electronic device, thereby driving the airflow entering the first air duct to pass through the first air duct and then exit from the second air outlet, enter the first air inlet of the airflow driving member, and then exit from the first air outlet of the airflow driving member and then exit the electronic device through the air outlet of the back cover. The specific embodiment of the airflow driving member being located on a path connecting the air inlet or air outlet of the second air duct to the outside of the electronic device is similar to the above and will not be repeated here. Similarly, in the above embodiment, two or more airflow driving members can be provided to increase the air volume or speed, thereby improving the cooling efficiency.

[0017] In the present application, a first air duct and a second air duct are respectively provided on both surfaces of the mainboard to dissipate heat from the two surfaces of the mainboard, which can improve the heat dissipation efficiency. The first air duct is provided with a first guide part and a second guide part on both sides, and the second air duct is provided with a third guide part and a fourth guide part on both sides. On the one hand, it can prevent the cold air from flowing into other spaces outside the first air duct and the second air duct, so that the air volume in the first air duct and the second air duct is reduced and the heat dissipation efficiency is reduced; on the other hand, it can also reduce the wind resistance of the cold air in the electronic device. The first guide part and the second guide part provide guidance for part of the cold air so that the part of the cold air circulates in the first air duct, and the third guide part and the fourth guide part provide guidance for another part of the cold air so that the part of the cold air circulates in the second air duct. Under the same air volume entering the electronic device, it can prevent part of the cold air from circulating in other spaces outside the first air duct and the second air duct, so as to reduce the wind resistance of the overall air volume entering the electronic device, speed up the circulation speed of the cold air in the electronic device, and thereby improve the heat dissipation efficiency of the heat-generating components on the mainboard.

[0018] In one possible implementation, the air outlets of the first and second air ducts are arranged on the same side and are interconnected, the airflow driving member is located on one side of the air outlets of the first and second air ducts, the air inlet of the airflow driving member is connected to the air outlets of the first and second air ducts, and the air outlet of the airflow driving member is connected to the outside of the electronic device. In this embodiment, the second air inlet of the first air duct is arranged on the same side as the third air inlet of the second air duct, the second air outlet of the first air duct is arranged on the same side as the third air outlet of the second air duct, the first air inlet of the airflow driving member is the opening of the airflow driving member toward the second air duct, and the first air outlet of the airflow driving member is the opening of the airflow driving member toward the structural member. When the airflow driving member is working, a negative pressure is formed at the first air inlet of the airflow driving member, causing the air in the first air duct and the second air duct to flow toward the airflow driving member, thereby forming a negative pressure in the first air duct and the second air duct, thereby driving the external cold air of the electronic device connected to the first air duct and the second air duct to enter the first air duct and the second air duct, thereby dissipating heat from the two surfaces of the mainboard, and the heated air is sucked into the airflow driving member and leaves the electronic device from the first air outlet of the airflow driving member.

[0019] In one possible implementation, the air inlets of the first and second air ducts are arranged on the same side and are interconnected. The airflow driving member is located on one side of the air inlets of the first and second air ducts, and the air inlet of the airflow driving member is connected to the outside of the electronic device, and the air outlet of the airflow driving member is connected to the air inlets of the first and second air ducts. When the airflow driving member is in operation, the first air inlet of the airflow driving member draws in cold air from the outside of the electronic device, and the cold air is blown from the first air outlet of the airflow driving member to the first and second air ducts, thereby dissipating heat from the mainboard. The airflow driving member can be mounted at a position on the structural member corresponding to the air inlets of the first and second air ducts, or can be mounted at a position on the mainboard corresponding to the air inlets of the first and second air ducts.

[0020] In some embodiments, the electronic device includes two airflow driving members, one of which is located on one side of the air outlet of the first and second air ducts, with its air inlet communicating with the air outlet of the first and second air ducts, and its air outlet communicating with the exterior of the electronic device; and the other airflow driving member is located on one side of the air inlet of the first and second air ducts, with its air inlet communicating with the exterior of the electronic device, and its air outlet communicating with the air inlet of the first and second air ducts. The two airflow driving members are respectively disposed at the air inlet and air outlet of the first and second air ducts to increase the air circulation speed, improve the heat exchange rate between the motherboard and the cold air, and thereby enhance the heat dissipation efficiency of the motherboard.

[0021] In one possible implementation, the orthographic projections of the first and second air ducts on the mainboard at least partially overlap. In some embodiments, the orthographic projections of the first and second air ducts on the mainboard completely overlap, allowing the cool air in the first and second air ducts to dissipate heat from the mainboard with maximum efficiency. In some embodiments, the orthographic projections of the first and second air ducts on the mainboard may intersect.

[0022] In one possible implementation, the length of the first and second guide portions along the fourth direction is the same as the length of the mainboard, and the length of the third and fourth guide portions along the fourth direction is the same as the length of the mainboard. This ensures that the length of the first and second air ducts along the fourth direction is the same as the length of the mainboard along the fourth direction, thereby maximizing cooling efficiency for the mainboard. The fourth direction is perpendicular to the first direction and coplanar and perpendicular to the second direction. In this embodiment, the fourth direction is the length of the electronic device, the first direction is the thickness of the electronic device, and the second direction is the width of the electronic device.

[0023] In some embodiments, the lengths of the first, second, third, and fourth guide portions along the fourth direction can be set based on the location of a primary heat-generating component on the mainboard. When the primary heat-generating component is located in a portion of the mainboard close to the airflow driving element, the lengths of the first, second, third, and fourth guide portions along the fourth direction can be set shorter than those of the mainboard. This allows the first and second air ducts to dissipate heat only from the portion containing the heat-generating component. This targeted arrangement of the air ducts not only dissipates heat from the mainboard but also saves space occupied by the air ducts.

[0024] In one possible implementation, the region of the structural member located in the first air duct is provided with a first air inlet and a first air outlet that penetrate two opposite surfaces of the structural member. The first air inlet and the first air outlet are located at opposite ends of the first air duct, respectively. The first air inlet and the first air outlet are respectively connected to the outside of the electronic device, and the first air outlet is connected to the air outlet (first air outlet) of the air flow driving member, so that wind enters from the first air inlet, flows through the first air duct and the air flow driving member, and flows out from the first air outlet. Specifically, after the cold air enters from the first air inlet, part of the cold air is heated and converted into hot air after flowing through the first air duct. The hot air enters the air inlet of the air flow driving member from the air outlet of the first air duct and leaves the electronic device from the air outlet of the air flow driving member. The shapes of the first air inlet and the first air outlet can be any one of circular, square, elliptical or irregular shapes.

[0025] In one possible implementation, the mainboard is provided with a second air inlet extending through two opposing surfaces of the mainboard. The second air inlet is connected to the first air inlet, allowing air to enter the second air inlet from the first air inlet, flow through the second air duct and the air flow driving element, and exit from the first air outlet. Specifically, after cold air enters the first air inlet, another portion of the cold air enters the second air duct from the second air inlet. After flowing through the second air duct, it is heated to hot air. The hot air enters the air inlet of the air flow driving element from the air outlet of the second air duct and exits the electronic device from the air outlet of the air flow driving element. In this embodiment, cold air from outside the electronic device is split after the first air inlet, with a portion of the cold air entering the first air duct and another portion of the cold air entering the second air duct through the second air inlet. This allows the cold air to cool the electronic device in the two air ducts on the upper and lower surfaces of the mainboard. In this embodiment, the cold air inlet side of the structural member can be located on a side of the structural member away from the mainboard. For example, when the structural member is a back cover, the first air inlet of the structural member connects the interior and exterior of the electronic device, and the cold air enters the electronic device through the first air inlet.

[0026] In some embodiments, the cold air can first enter the second air duct and then enter the first air duct through the air inlet hole on the main panel. That is to say, in this embodiment, the air inlet side of the cold air can be set on the side of the display screen or the frame of the middle frame, or set on the back cover, and enter the second air duct through other air ducts in the back cover.

[0027] In one possible implementation, the airflow driving element is located on the side of the mainboard away from the second air inlet. Specifically, the airflow driving element and the mainboard are not stacked in the thickness direction, but are arranged parallel to each other in the width or length direction, thereby reducing the stacking thickness of the electronic device. In some embodiments, the thickness of the airflow driving element in the first direction is the same as the thickness of the mainboard in the first direction. The surfaces of the airflow driving element along the first direction are aligned parallel to the surfaces of the mainboard along the first direction, respectively. This ensures that the thickness of both components, in the first direction, is only the thickness of one mainboard or one airflow driving element, thereby reducing the stacking thickness of the electronic device. Furthermore, in this embodiment, the airflow driving element is located on the side of the mainboard away from the second air inlet, allowing cold air entering the first air inlet to cool the mainboard between the first air inlet and the airflow driving element. When the first and second air ducts are the same length as the mainboard in the fourth direction, the cold air can cool the entire mainboard, improving cooling and heat dissipation efficiency.

[0028] In one possible implementation, the second air inlet at least partially overlaps with the orthographic projection of the first air inlet on the mainboard, thereby connecting the first air inlet with the second air inlet. In this embodiment, the second air inlet completely overlaps with the orthographic projection of the first air inlet on the mainboard, thereby increasing the amount of cold air entering the second air duct and reducing wind resistance. In one embodiment, when the airflow drive member is located on one side of the air inlet of the first and second air ducts, a second air outlet is further provided at the end of the mainboard away from the second air inlet, extending through the mainboard, and the orthographic projections of the first and second air outlets on the mainboard at least partially overlap. This connects the first and second air outlets, thereby increasing the speed at which air leaves the electronic device.

[0029] In the embodiment of the present application, the shapes of the first air duct and the second air duct are not limited and can be set according to the shape of the main board, wherein the main board can be square, T-shaped or L-shaped, etc., and the shapes of the first air duct and the second air duct can also be square, T-shaped or L-shaped.

[0030] In one possible implementation, the first air outlet at least partially overlaps with the orthographic projection of the airflow driving member on the structural member. In this embodiment, the first air outlet overlaps with the orthographic projection of the airflow driving member on the structural member, and the length of the airflow driving member in the second direction is the same as the length of the mainboard in the second direction. In this embodiment, the first guide portion and the second guide portion are disposed between the airflow driving member and the structural member, adjacent to one end of the airflow driving member.

[0031] In one possible implementation, a fifth gap is provided between the airflow driving member and the mainboard, and the first air duct is connected to the air inlet of the airflow driving member through the fifth gap. When the airflow driving member is operating, the cold air from the first air duct is sucked into the airflow driving member through the fifth gap. Since the air inlet (first air inlet) of the airflow driving member is connected to the first air duct, when the airflow driving member is operating, part of the cold air flows through the first air duct and enters the airflow driving member through the fifth gap, while another part of the cold air flows through the second air duct and enters the airflow driving member through the air outlet (third air outlet) of the second air duct, wherein the end of the second air duct adjacent to the airflow driving member is the air outlet of the second air duct. The length of the fifth gap along the fourth direction can be set according to the actual product situation, for example, to 5 mm or 8 mm.

[0032] In one possible implementation, the structural member is a back cover, and the first guide portion and the second guide portion are connected to the back cover. The first guide portion and the second guide portion are arranged between the back cover and the main board. In this embodiment, when the structural member is a back cover, the first air duct is formed by part of the back cover, that is, the first guide portion and the second guide portion are connected and fixed to the middle part of the back cover, and the first guide portion and the second guide portion can be connected between the back cover and the main board by adhesives, screws, snaps, etc. In some embodiments, the first guide portion and the second guide portion can be formed by a boss protruding from the back cover to the main board, that is, the first guide portion and the second guide portion are integrally formed with the back cover. In some embodiments, the back cover itself can also be grooved to form the first air duct, wherein the groove walls on both sides are the first guide portion and the second guide portion respectively.

[0033] In one embodiment, the first air inlet and the first air outlet are provided on the back cover, and the side of the back cover away from the mainboard is the external environment of the electronic device. Cold air from the external environment enters the electronic device from the first air inlet, part of the cold air flows through the first air duct and enters the air flow driving member from the fifth gap, and the other part of the cold air enters the second air duct from the second air inlet, flows through the second air duct and enters the air flow driving member, and then leaves the electronic device from the first air outlet. In order to reduce the amount of water from the external environment entering the electronic device through the first air inlet and the first air outlet, a water-proof and breathable film layer may be provided in the first air inlet and the first air outlet to block water vapor. In some embodiments, the first air inlet and the first air outlet may be provided on the side wall of the back cover that protrudes toward the display screen to prevent the user's hands from blocking the first air inlet and the first air outlet when holding the back cover.

[0034] In one possible implementation, the structural member is a support member, and the first guide portion and the second guide portion are relatively arranged at the edge of the support member and connected to the support member. The support member can be used to support a mainboard or other electronic components in an electronic device. The shape of the support member and the mainboard can be the same or different. When the shape of the support member and the mainboard is the same, the first guide portion and the second guide portion are relatively arranged at the edge of the mainboard and connected to the mainboard. At this time, the entire support member and the mainboard as well as the first guide portion and the second guide portion are jointly enclosed to form a first air duct. In some embodiments, the first guide portion and the second guide portion can be composed of bosses protruding from the support member to the mainboard, that is, the first guide portion and the second guide portion are integrally formed with the support member. In some embodiments, the support member itself can also be grooved to form the first air duct, wherein the groove walls on both sides are the first guide portion and the second guide portion respectively.

[0035] In one possible implementation, the support member is provided with a first side wall and a second side wall at both ends along the fourth direction. The first side wall is connected to one end of the first guide portion and the second guide portion, and the second side wall is connected to the other end of the first guide portion and the second guide portion. The first side wall is positioned adjacent to the air inlet of the first air duct, and the second side wall is positioned adjacent to the air outlet of the first air duct. The fourth direction is perpendicular to the first direction and coplanar and perpendicular to the second direction. In this embodiment, the fourth direction is the length direction of the electronic device, the first direction is the thickness direction of the electronic device, and the second direction is the width direction of the electronic device. The first side wall, the first guide portion, the second side wall, and the second guide portion are connected end to end in sequence and, together with the support member and the mainboard on both sides along the first direction, form the first air duct. The first side wall and the second side wall can be formed by projections protruding from the support member toward the mainboard, i.e., the first side wall and the second side wall are integrally formed with the support member, or they can be separate components connected between the mainboard and the support member via adhesive, screws, snaps, or other fasteners.

[0036] In this embodiment, the electronic device further comprises a back cover, the back cover being located on a side of the support member away from the mainboard, the back cover being provided with a third air inlet and a third air outlet extending through two opposite surfaces of the back cover, the third air inlet communicating with the exterior of the electronic device and communicating with the first air duct and the second air duct, respectively, and the third air outlet communicating with the exterior of the electronic device and communicating with the first air duct and the second air duct, respectively. Specifically, the third air inlet communicates with the first air duct and the second air duct, respectively, by communicating with the first air inlet and the second air inlet, and the third air outlet communicates with the first air duct and the second air duct, respectively, by communicating with the first air outlet and the air outlet of the air flow driving member. In this embodiment, the back cover is provided with a third air inlet and a third air outlet communicating with the external environment, i.e., the side of the back cover away from the support member is the external environment of the electronic device, cold air from the external environment enters the first air inlet through the third air inlet, part of the cold air flows through the first air duct and enters the air flow driving member through the fifth gap, another part of the cold air enters the second air duct through the second air inlet, flows through the second air duct, enters the air flow driving member, and then exits the electronic device through the first air outlet and the third air outlet, respectively. In order to reduce the amount of water in the external environment that enters the electronic device through the third air inlet and the third air outlet, a water-proof and breathable film layer may be provided in the third air inlet and the third air outlet to block water vapor.

[0037] In one possible implementation, the orthographic projections of the first air inlet, the second air inlet, and the third air inlet on the back cover at least partially overlap. This allows cold air from outside the electronic device to enter the first and second air ducts more efficiently. The orthographic projections of the first air outlet, the third air outlet, and the air outlet of the airflow drive element on the back cover at least partially overlap. This allows hot air that has cooled the heat-generating components on the mainboard to be smoothly discharged from the electronic device. This arrangement can reduce wind resistance and accelerate the cooling efficiency of the heat-generating components on the mainboard. The sizes of the first air inlet, the second air inlet, and the third air inlet can be set according to actual product conditions.

[0038] In one possible implementation, the third guide portion and the fourth guide portion are connected to the middle frame. In this embodiment, the second air duct is formed by part of the rear middle frame, that is, the third guide portion and the fourth guide portion are connected and fixed to the middle part of the middle frame, and the third guide portion and the fourth guide portion can be connected between the middle frame and the main board by means of adhesives, screws, snaps, etc. Among them, the third guide portion and the fourth guide portion can be adapted to the shape of the main board, and the third guide portion and the fourth guide portion are connected to the edge of the main board. In some embodiments, the third guide portion and the fourth guide portion can be formed by a boss protruding from the middle frame toward the main board, that is, the third guide portion and the fourth guide portion are integrally formed with the middle frame. In some embodiments, the middle frame itself can also be grooved to form the second air duct.

[0039] In some embodiments, the third guide portion and the fourth guide portion can be separate first and second bosses, respectively. The first and second bosses can be connected between the mainboard and the middle frame by adhesives, screws, snaps, or the like to form the third guide portion and the fourth guide portion of the second air duct.

[0040] In one possible implementation, the air inlet of the airflow driving member is positioned adjacent to and intersects the mainboard. This allows the air inlet of the airflow driving member to be directed toward the outlet of the first air duct, increasing the inlet area for hot air from the first air duct to enter the airflow driving member and improving the air intake volume. In some embodiments, a predetermined angle is formed between the surface of the airflow driving member with the air inlet and the mainboard. In one specific embodiment, the predetermined angle is 45°.

[0041] In one possible implementation, the airflow driving member is electrically connected to the mainboard. The mainboard provides electrical energy to the airflow driving member to enable the airflow driving member to operate. In some embodiments, the airflow driving member is electrically connected to the driving circuit on the mainboard via an electrical connection line.

[0042] In one possible implementation, the electronic device further includes a first battery and a second battery, which are spaced apart along the second direction on a side of the middle frame facing the mainboard, the first battery being located on a side of the third guide portion away from the second air duct, and the second battery being located on a side of the fourth guide portion away from the second air duct, the heights of the first battery and the second battery along the first direction being greater than the heights of the third guide portion and the fourth guide portion, and the mainboard being located between the first battery and the second battery along the second direction. In this embodiment, the mainboard is T-shaped, and the middle frame is provided with a first receiving position for receiving the first battery and the second battery, and a second receiving position for receiving the airflow drive element. The first receiving position is located on both sides of the mainboard, and the second receiving position is located at an end of the mainboard adjacent to the first air outlet. The third guide portion and the fourth guide portion are portions of the T-shaped mainboard having a bent section along the second direction.

[0043] In some embodiments, the shapes of the third and fourth guide portions can be configured based on the shape of the motherboard, and are not limited to elongated strips, arcs, curved segments, etc. In this embodiment, the third and fourth guide portions serve to both accommodate the first and second batteries and to guide the wind direction of the second air duct. This utilizes the battery housing components of the electronic device as guides, saving space and simplifying the electronic device's structural design.

[0044] The first battery and the second battery can be connected in series or in parallel according to product requirements, or can operate independently. In this embodiment, the arrangement of the two batteries allows the motherboard to be clamped between the two. On the one hand, this can fix the motherboard and improve the structural strength. On the other hand, it is conducive to forming a second air duct to prevent wind from flowing through various areas of the electronic device and increasing wind resistance.

[0045] In some embodiments, the third and fourth guide portions are provided with third and fourth side walls at both ends along the fourth direction. The third side wall, the third guide portion, the fourth side wall, and the fourth guide portion are connected end to end and, together with the mainboard and a portion of the middle frame, enclose a second air duct. The third side wall, the third guide portion, the fourth side wall, and the fourth guide portion seal the perimeter of the second air duct, allowing air to circulate only within the second air duct, preventing air leakage from the perimeter of the second air duct, increasing air volume within the second air duct, and improving cooling efficiency. The third and fourth side walls may be formed by bosses protruding from the middle frame toward the mainboard, i.e., the third and fourth side walls are integrally formed with the middle frame, or they may be separate components connected between the mainboard and the middle frame via adhesives, screws, snaps, or other connection methods.

[0046] In some embodiments, the length of the third side wall and the fourth side wall along the fourth direction is set to be larger, wherein the fourth direction is the length direction of the electronic device. After the mainboard is placed on the surface of the third side wall, the fourth side wall, the third guide part and the fourth guide part away from the middle frame, the mainboard and the third side wall and the fourth side wall are fixedly connected with screws, and no other components are used to fix the mainboard and the third guide part and the fourth guide part. This arrangement can save design space of the electronic device in the second direction (width direction).

[0047] In one possible implementation, the electronic device further includes a shielding member disposed on a surface of a motherboard. The shielding member is used to shield electronic components that generate radiated signals. In some embodiments, two shielding members may be provided, one disposed on opposite surfaces of the motherboard. In some embodiments, the shielding member includes openings to expose electronic components that do not generate radiated signals, allowing these components to be directly cooled by cool air.

[0048] In some embodiments, a CPU is provided on the surface of the motherboard facing the middle frame. Since the CPU generates a lot of heat when the electronic device is working, a thermal conductive material can be provided at the position of the shield corresponding to the CPU to accelerate the cooling of the CPU. The thermal conductive material includes TIM, such as gel or silicone.

[0049] In one possible implementation, a heat generating device is provided on the mainboard, and an opening is provided in the shielding member to expose the heat generating device. The heat generating device can be provided on any surface of the mainboard, so that the heat generating device is directly cooled by the cool air from the first or second air duct. In some embodiments, a heat-conducting material is provided on the surface of the heat generating device away from the mainboard to conduct heat away from the heat generating device, thereby improving cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0051] Figure 1 This is a schematic exploded perspective view of an electronic device provided in one embodiment of the present application;

[0052] Figure 2 This is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0053] Figure 3 This is a schematic structural diagram of a structural component portion of an electronic device provided in one embodiment of the present application;

[0054] Figure 4 This is a schematic structural diagram of a middle frame portion of an electronic device provided in one embodiment of the present application;

[0055] Figure 5a This is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0056] Figure 5b This application Figure 5a EE cross-sectional view in;

[0057] Figure 5c This is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0058] Figure 5d This application Figure 5c FF cross-sectional view in;

[0059] Figure 5e This is a schematic structural diagram of a middle frame, main board, and structural components of an electronic device provided in one embodiment of the present application;

[0060] Figure 5f This is a schematic structural diagram of a first air duct and a rear cover portion of an electronic device provided by one embodiment of the present application as viewed from the rear cover side;

[0061] Figure 5g This is a schematic structural diagram of a first air duct and a rear cover portion of an electronic device provided by one embodiment of the present application as viewed from the rear cover side;

[0062] Figure 5h This is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0063] Figure 5i This application Figure 5h GG cross-sectional view in;

[0064] Figure 5jThis is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0065] Figure 5k This application Figure 5j HH section view in;

[0066] Figure 5l This is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0067] Figure 5m This application Figure 5l Section II in the figure;

[0068] Figure 5n This is a schematic structural diagram of a middle frame, a mainboard, and structural components of an electronic device provided in one embodiment of the present application, viewed from the structural component side;

[0069] Figure 5o This application Figure 5n JJ sectional view in;

[0070] Figure 5p This application Figure 5n KK cross-sectional view in;

[0071] Figure 6 This is a schematic diagram of the structures of three main boards provided in one embodiment of the present application;

[0072] Figure 7 This is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0073] Figure 8 This is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0074] Figure 9 This is a schematic structural diagram of an electronic device in operation provided by one embodiment of the present application;

[0075] Figure 10 This is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0076] Figure 11a This is a schematic structural diagram of an electronic device in operation provided by one embodiment of the present application;

[0077] Figure 11b This is a schematic structural diagram of a support portion of an electronic device provided in one embodiment of the present application;

[0078] Figure 12This is a structural diagram of a middle frame, a third guide portion, and a mainboard portion of an electronic device provided in one embodiment of the present application;

[0079] Figure 13 This is a structural diagram of a middle frame, a fourth guide portion, and a mainboard portion of an electronic device provided in one embodiment of the present application;

[0080] Figure 14 This is a schematic structural diagram of an electronic device in operation provided by one embodiment of the present application;

[0081] Figure 15 This is a structural diagram of a middle frame, a first battery, and a second battery portion of an electronic device provided in one embodiment of the present application;

[0082] Figure 16 This application Figure 15 LL cross-sectional view;

[0083] Figure 17 This is a schematic structural diagram of a mainboard of an electronic device provided in one embodiment of the present application;

[0084] Figure 18 This is a schematic structural diagram of a mainboard of an electronic device provided in one embodiment of the present application;

[0085] Figure 19 This is a schematic structural diagram of a mainboard of an electronic device provided in one embodiment of the present application;

[0086] Figure 20 This is a schematic structural diagram of an electronic device provided by a comparative embodiment of the present application;

[0087] Figure 21 This is a simulation schematic diagram of an electronic device provided in one embodiment of the present application;

[0088] Figure 22 This is a simulation schematic diagram of a mainboard portion of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0089] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0090] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of this application are explained and described below.

[0091] CPU: central processing unit, central processing unit.

[0092] WIFI: Mobile hotspot.

[0093] TIM: Thermal Interface Material, thermal conductive interface material.

[0094] CFM: cubic feet per minute, gas flow unit, cubic feet per minute.

[0095] The present application provides an electronic device, comprising an airflow driving member and a middle frame, a main board, and a structural member stacked in sequence along a first direction. A first guide portion and a second guide portion are provided between the structural member and the main board, and together they enclose a first air duct. A third guide portion and a fourth guide portion are provided between the middle frame and the main board, and together they enclose a second air duct. The airflow driving member is located on the air ducts of the first and second air ducts, or on a path where the first and second air ducts connect to the outside of the electronic device. The airflow driving member is configured to drive air from the air inlets of the first and second air ducts to the air outlets of the first and second air ducts, respectively. By providing the first and second air ducts on both surfaces of the main board, heat is dissipated from both surfaces of the main board, thereby improving heat dissipation efficiency. The first and second guide portions, as well as the third and fourth guide portions, can guide cold air to circulate in the first and second air ducts, thereby reducing wind resistance of the cold air within the electronic device and accelerating the flow of the cold air, thereby improving heat dissipation efficiency.

[0096] See also Figure 1 and Figure 2In one embodiment of the present application, an electronic device 10 is provided. The electronic device 10 may be a mobile phone, tablet computer, notebook computer, wearable product, smart home terminal, or other electronic device. In this embodiment, taking the mobile phone as an example, the electronic device 10 includes an airflow driving component 400 and a middle frame 100, a main board 200, and a structural component 300 stacked in sequence along a first direction A. The middle frame 100 is the main supporting component within the electronic device 10. The middle frame 100 may be a carrier for supporting components within the electronic device 10. One side of the middle frame 100 is used to mount the display screen 20, and the other side is used to mount components such as the battery and the main board 200. The motherboard 200, also known as the mainboard, system board, or motherboard, is the component that integrates the circuitry of the electronic device 10. For example, if the electronic device 10 is a mobile phone, the mobile phone motherboard 200 can be divided into three parts: 1. The baseband part, including the baseband chip and power management chip for encoding; 2. The radio frequency part, including the radio frequency processor and radio frequency amplifier module, for signal transmission and reception; 3. Other parts, including the CPU, memory, various controllers (including touch screen, Bluetooth, Wi-Fi, sensors, etc.), as well as interfaces for microphones, receivers, speakers, cameras, and display screens. These three components are integrated on the mobile phone motherboard 200. Universal standards have been established for the layout, size, shape, and power supply specifications of the components on the motherboard 200. When the electronic device 10 is operating, the components on the motherboard 200 generate a significant amount of heat, which is the primary heat source for the electronic device 10. Excessive heating of the motherboard 200 can affect the performance of the components on the motherboard 200, necessitating timely cooling and dissipation of heat. The airflow driving member 400 is a fan, including a centrifugal fan or an axial flow fan, and the shape of the fan can be cylindrical, columnar or other shapes.

[0097] The middle frame 100 and the structural member 300 are arranged on both sides of the main board 200 along the first direction A (eg Figure 2 In this embodiment, the first direction A is the thickness direction of the electronic device 10. The structural member 300 may be the back cover 700 or the support member 800. The support member 800 is used to support the mainboard 200. The mainboard 200 is fixed between the support member 800 and the middle frame 100. The support member 800 may also be used to support other electronic components in the electronic device 10.

[0098] A first guide portion 510 and a second guide portion 520 are provided between the structural member 300 and the main board 200 and are arranged opposite to each other along the second direction B (eg, Figure 2As shown in FIG5 , the first guide portion 510, the structural member 300, the second guide portion 520 and the mainboard 200 together enclose a first air duct 500. The second direction B intersects with the first direction A. In this embodiment, the second direction B is perpendicular to the first direction A. The second direction B is parallel to the plane where the display screen 20 or the back cover 700 of the electronic device 10 is located, wherein the second direction B can be the width direction of the electronic device 10 or the length direction of the electronic device 10. In this embodiment, the second direction B is the width direction of the electronic device 10. When the structural member 300 is the back cover 700, part of the back cover 700 can participate in forming the first air duct 500. When the structural member 300 is the support member 800, the entire support member 800 or part of the support member 800 can participate in forming the first air duct 500.

[0099] The first guide portion 510 and the second guide portion 520 can be a continuous block or a block with pores. In this embodiment, the first guide portion 510 and the second guide portion 520 are a continuous block. When cold air from the outside of the electronic device 10 enters the first air duct 500, the cold air does not leak out to areas outside the first air duct 500. Instead, the cold air is dissipated only on the surface of the motherboard 200 within the first air duct 500, thereby improving the heat dissipation efficiency of the motherboard 200.

[0100] In some embodiments, the first guide portion 510 and the second guide portion 520 are discontinuous blocks, see Figure 3 , Figure 3This is a schematic diagram of the structure of the structural member 300 as viewed from the display screen 20. The first guide portion 510 includes multiple first guide sub-portions 511, and the second guide portion 520 includes multiple second guide sub-portions 521. A first gap 512 is defined between two adjacent first guide sub-portions 511, and a second gap 522 is defined between two adjacent second guide sub-portions 521. The lengths of the multiple first guide sub-portions 511 can be the same or different, and the widths of the first gaps 512 between two adjacent first guide sub-portions 511 can be the same or different. The lengths of the multiple second guide sub-portions 521 can be the same or different, and the widths of the second gaps 522 between two adjacent second guide sub-portions 521 can be the same or different. In this embodiment, the first guide portion 510 and the second guide portion 520 can also guide most of the cold air through the first air duct 500, thereby improving the heat dissipation efficiency of the motherboard 200 located on the surface of the first air duct 500. In this embodiment, the first guide portion 510 and the second guide portion 520 are discontinuous blocks, which is conducive to the electrical connection of the mainboard 200 with other electronic components in the electronic device 10 through a connecting line. For example, one end of the connecting line passes through the first gap 512 or the second gap 522 to be electrically connected to the surface of the mainboard 200 facing the structural part 300, and the other end of the connecting line is connected to electronic components other than the mainboard 200. The setting of the first gap 512 or the second gap 522 is conducive to the electrical connection of the surface of the mainboard 200 facing the structural part 300 with the surrounding electronic components.

[0101] Please refer again Figure 2 A third guide portion 610 and a fourth guide portion 620 are disposed between the middle frame 100 and the mainboard 200 and are arranged relative to each other along a third direction C. The third guide portion 610, the middle frame 100, the fourth guide portion 620, and the mainboard 200 collectively enclose a second air duct 600. The first direction A intersects with the second direction B and the third direction C, respectively. In this embodiment, the third direction C is perpendicular to the first direction A and is the same as the second direction B. The first air duct 500 and the second air duct 600 are arranged in parallel. In some embodiments, the third direction C and the second direction B may be different and intersect with each other.

[0102] The third guide portion 610 and the fourth guide portion 620 can be a continuous block or a block with pores. In this embodiment, the third guide portion 610 and the fourth guide portion 620 are continuous blocks. When cold air from the outside of the electronic device 10 enters the second air duct 600, the cold air does not leak out to areas outside the second air duct 600, but dissipates heat only from the surface of the motherboard 200 within the second air duct 600. The first air duct 500 and the second air duct 600 dissipate heat from two surfaces of the motherboard 200, respectively, thereby improving the heat dissipation efficiency of the motherboard 200.

[0103] In some embodiments, the third guide portion 610 and the fourth guide portion 620 are discontinuous blocks, see Figure 4 , Figure 4 This is a schematic structural diagram of the middle frame 100 as viewed from the side of the back cover 700. The third guide portion 610 has multiple third guide sub-portions 611, and the fourth guide portion 620 has multiple fourth guide sub-portions 621. A third gap 612 is defined between two adjacent third guide sub-portions 611, and a fourth gap 622 is defined between two adjacent fourth guide sub-portions 621. The lengths of the multiple third guide sub-portions 611 can be the same or different, and the widths of the third gaps 612 between two adjacent third guide sub-portions 611 can be the same or different. The lengths of the multiple fourth guide sub-portions 621 can be the same or different, and the widths of the fourth gaps 622 between two adjacent fourth guide sub-portions 621 can be the same or different. In this embodiment, the third guide portion 610 and the fourth guide portion 620 can also guide cold air through the second air duct 600 to improve the heat dissipation efficiency of the motherboard 200 located on the surface of the second air duct 600. In this embodiment, the third guide portion 610 and the fourth guide portion 620 are discontinuous blocks, which is conducive to the electrical connection of the mainboard 200 with other electronic components in the electronic device 10 through a connecting line. For example, one end of the connecting line passes through the third gap 612 or the fourth gap 622 to be electrically connected to the surface of the mainboard 200 facing the middle frame 100, and the other end of the connecting line is connected to electronic components other than the mainboard 200. The setting of the third gap 612 or the fourth gap 622 is conducive to the electrical connection of the surface of the mainboard 200 facing the middle frame 100 with the surrounding electronic components.

[0104] The airflow driving member 400 is located on the first air duct 500 and the second air duct 600 or on the path where the first air duct 500 and the second air duct 600 connect to the outside of the electronic device 10. The first air duct 500 and the second air duct 600 both have an air inlet and an air outlet that are relatively arranged and connected to the outside of the electronic device 10. The airflow driving member 400 is used to drive the wind from the air inlets of the first air duct 500 and the second air duct 600 to the air outlets of the first air duct 500 and the second air duct 600 respectively.

[0105] The first air duct 500 and the second air duct 600 include the interior of the first air duct 500 and the second air duct 600 and the air outlet or air inlet of the first air duct 500 and the second air duct 600, that is, the air flow driving member 400 can be located inside the first air duct 500 and the second air duct 600 (such as Figure 5d and Figure 5e ), or at the air outlets of the first air duct 500 and the second air duct 600 (as shown Figure 5a and Figure 5b as shown) or air inlet (as shown Figure 5h and Figure 5iIn this application, the air inlet is the location where the air enters the component, and the air outlet is the location where the air leaves the component. For example, see Figure 5a and Figure 5b , Figure 5a Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5b yes Figure 5a In the EE cross-sectional view in FIG, the air inlet and air outlet of the airflow driving member 400 are denoted as the first air inlet R1 and the first air outlet C1. When the airflow driving member 400 is in operation, the driving air enters through the first air inlet R1 and exits through the first air outlet C1, wherein the first air inlet R1 and the first air outlet C1 are located on opposite sides of the airflow driving member 400. For another example, the air inlet and air outlet of the first air duct 500 are denoted as the second air inlet R2 and the second air outlet C2, wherein the second air inlet R2 and the second air outlet C2 are located at opposite ends of the first air duct 500, respectively. When the airflow driving member 400 is in operation, the driving air enters through the second air inlet R2 of the first air duct 500, passes through the interior of the first air duct 500, and exits through the second air outlet C2. For another example, the air inlet and air outlet of the second air duct 600 are recorded as the third air inlet R3 and the third air outlet C3. The third air inlet R3 and the third air outlet C3 are respectively located at the two ends of the second air duct 600. When the airflow driving component 400 is working, the driving air enters from the third air inlet R3 of the second air duct 600, and then passes through the interior of the second air duct 600 and leaves from the third air outlet C3.

[0106] The number of airflow driving members 400 can be set to 1, 2, 3 or more than 3 according to actual needs. Figure 5c and Figure 5d ,in Figure 5c Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5d yes Figure 5cIn the FF cross-sectional view, in some embodiments, there are two airflow driving members 400, and the two airflow driving members 400 are respectively located inside the first air duct 500 and the second air duct 600. For the airflow driving member 400 located in the first air duct 500, the first air inlet R1 of the airflow driving member 400 and the second air inlet R2 of the first air duct 500 are located on the same side, and the first air outlet C1 of the airflow driving member 400 and the second air outlet C2 of the first air duct 500 are located on the same side. When the airflow driving member 400 is working, the wind F1 enters the second air inlet R2 of the first air duct 500, then enters the first air inlet R1 of the airflow driving member 400, and then leaves the airflow driving member 400 from the first air outlet C1 of the airflow driving member 400, and then leaves the first air duct 500 through the second air outlet C2. Regarding the airflow driving member 400 located in the second air duct 600, the first air inlet R1 of the airflow driving member 400 and the third air inlet R3 of the second air duct 600 are located on the same side, and the first air outlet C1 of the airflow driving member 400 and the third air outlet C3 of the second air duct 600 are located on the same side. When the airflow driving member 400 is in operation, the wind F2 enters the third air inlet R3 of the second air duct 600, then enters the first air inlet R1 of the airflow driving member 400, leaves the airflow driving member 400 through the first air outlet C1 of the airflow driving member 400, and then leaves the second air duct 600 through the third air outlet C3. In this embodiment, the second air inlet R2 and the third air inlet R3 are located on the same side, and the second air outlet C2 and the third air outlet C3 are located on the same side. Please refer to FIG. Figure 5e In some embodiments, the second air inlet R2 and the third air outlet C3 are disposed on the same side, and the second air outlet C2 and the third air inlet R3 are disposed on the same side. This means that the airflow driving members 400 in the first air duct 500 and the second air duct 600 blow air in opposite directions, and the air flows in opposite directions in the first air duct 500 and the second air duct 600. In some embodiments, two or more airflow driving members 400 may be disposed in each of the first air duct 500 and the second air duct 600 to increase air volume or speed, thereby improving cooling efficiency.

[0107] The airflow driving member 400 being located on a path where the first air duct 500 and the second air duct 600 are connected to the outside of the electronic device 10 includes the airflow driving member 400 being located on a path where the air inlets of the first air duct 500 and the second air duct 600 are connected to the outside of the electronic device 10, or the airflow driving member 400 being located on a path where the air outlets of the first air duct 500 and the second air duct 600 are connected to the outside of the electronic device 10. Figure 5f , Figure 5fThis is a schematic diagram of the first air duct 500 and the back cover 700 of the electronic device 10 as viewed from the side of the back cover 700. In one embodiment, the airflow driving member 400 is located on the path where the second air inlet R2 of the first air duct 500 communicates with the outside of the electronic device 10. For example, when the electronic device 10 includes the back cover 700, the air inlet R4 of the electronic device 10 is provided on a side wall of the back cover 700. In this embodiment, an air inlet hole can be provided on the second guide portion 520 to enable the second air inlet R2 of the first air duct 500 to communicate with the outside. The airflow driving member 400 is located between the second air inlet R2 of the first air duct 500 and the air inlet R4 of the back cover 700. When the airflow driving member 400 is in operation, it drives the air to enter the electronic device 10 from the air inlet R4 of the back cover 700, and then the air enters the second air inlet R2 of the first air duct 500. Please refer to FIG. Figure 5g , Figure 5g 700 in the electronic device 10, the air flow driving member 400 is located on the path where the second air outlet C2 of the first air duct 500 is connected to the outside of the electronic device 10. For example, the air outlet C4 of the electronic device 10 is located on the other side wall of the back cover 700. In this embodiment, an air outlet hole can be provided on the first guide portion 510 to connect the second air outlet C2 of the first air duct 500 to the outside. The driving member 400 is located between the second air outlet C2 of the first air duct 500 and the air outlet C4 of the back cover 700. When the airflow driving member 400 is working, a negative pressure will be formed in the internal space of the electronic device 10, thereby driving the airflow entering the first air duct 500 to leave from the second air outlet C2 after passing through the first air duct 500, and enter the first air inlet R1 of the airflow driving member 400, and then leave from the first air outlet C1 of the airflow driving member 400, and then leave the electronic device 10 from the air outlet C4 of the back cover 700. The specific implementation of the airflow driving member 400 being located on the path where the air inlet or air outlet of the second air duct 600 connects to the outside of the electronic device 10 is similar to the above and will not be repeated here. Similarly, in the above embodiment, two or more airflow driving members 400 can be provided to increase the air volume or speed up the flow rate, thereby improving the cooling efficiency. It should be noted that, Figure 5f and Figure 5g It is only for illustration that the airflow driving member 400 may be disposed on a path where the air inlet or the air outlet of the first air duct 500 communicates with the outside of the electronic device 10 , and the structure in an actual product is not limited thereto.

[0108] In the present application, a first air duct 500 and a second air duct 600 are respectively provided on both surfaces of the mainboard 200 to dissipate heat from both surfaces of the mainboard 200, thereby improving heat dissipation efficiency. In addition, a first guide portion 510 and a second guide portion 520 are provided on both sides of the first air duct 500, and a third guide portion 610 and a fourth guide portion 620 are provided on both sides of the second air duct 600. On the one hand, this can prevent the cold air from flowing into other spaces outside the first air duct 500 and the second air duct 600, thereby reducing the air volume in the first air duct 500 and the second air duct 600 and reducing the heat dissipation efficiency; on the other hand, this can also reduce the amount of cold air flowing into the electronic device 10. The first guide portion 510 and the second guide portion 520 provide guidance for part of the cold air so that the part of the cold air circulates in the first air duct 500, and the third guide portion 610 and the fourth guide portion 620 provide guidance for another part of the cold air so that the part of the cold air circulates in the second air duct 600. Under the same air volume entering the electronic device 10, part of the cold air can be prevented from circulating in other spaces outside the first air duct 500 and the second air duct 600, so as to reduce the wind resistance of the overall air volume entering the electronic device 10, speed up the circulation speed of the cold air in the electronic device 10, and thereby improve the heat dissipation efficiency of the heating components on the mainboard 200.

[0109] In one possible implementation, the air outlets of the first air duct 500 and the second air duct 600 are arranged on the same side and are connected to each other, the air flow driving member 400 is located on one side of the air outlets of the first air duct 500 and the second air duct 600, and the air inlet of the air flow driving member 400 is connected to the air outlets of the first air duct 500 and the second air duct 600, and the air outlet of the air flow driving member 400 is connected to the outside of the electronic device 10. Please refer to Figure 5a and Figure 5b In this embodiment, the second air inlet R2 of the first air duct 500 and the third air inlet R3 of the second air duct 600 are arranged on the same side, the second air outlet C2 of the first air duct 500 and the third air outlet C3 of the second air duct 600 are arranged on the same side, the first air inlet R1 of the airflow driving member 400 is the opening of the airflow driving member 400 toward the second air duct 600, and the first air outlet C1 of the airflow driving member 400 is the opening of the airflow driving member 400 toward the structural member 300, as shown in FIG. Figure 5bAs shown, the first air inlet R1 of the airflow driving member 400 is at the bottom, and the first air outlet C1 is at the top. When the airflow driving member 400 is in operation, the first air inlet R1 of the airflow driving member 400 forms a negative pressure, causing the air in the first air duct 500 and the second air duct 600 to flow toward the airflow driving member 400, thereby creating a negative pressure in the first air duct 500 and the second air duct 600. This in turn drives the external cold air F of the electronic device 10 connected to the first air duct 500 and the second air duct 600 into the first air duct 500 and the second air duct 600, thereby dissipating heat from both surfaces of the mainboard 200. The heated air is then drawn into the airflow driving member 400 and leaves the electronic device 10 through the first air outlet C1 of the airflow driving member 400.

[0110] See also Figure 5h and Figure 5i ,in Figure 5h Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5i yes Figure 5h In the GG cross-sectional view in FIG, in one possible implementation, the air inlets of the first air duct 500 and the second air duct 600 are arranged on the same side and are interconnected. The airflow driving member 400 is located on one side of the air inlets of the first air duct 500 and the second air duct 600, and the air inlet of the airflow driving member 400 is connected to the outside of the electronic device 10, and the air outlet of the airflow driving member 400 is connected to the air inlets of the first air duct 500 and the second air duct 600. In this embodiment, when the airflow driving member 400 is in operation, the first air inlet R1 of the airflow driving member 400 draws in cold air F from outside the electronic device 10. The cold air F is blown from the first air outlet C1 of the airflow driving member 400 toward the first air duct 500 and the second air duct 600, thereby dissipating heat from the mainboard 200. The airflow driving member 400 can be mounted on the structural member 300 at positions corresponding to the air inlets of the first air duct 500 and the second air duct 600 , or on the main board 200 at positions corresponding to the air inlets of the first air duct 500 and the second air duct 600 .

[0111] In some embodiments, the electronic device 10 includes two air flow driving members 400, see Figure 5j and Figure 5k ,in Figure 5j Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5k yes Figure 5jThe HH cross-sectional view in FIG. 1 shows an embodiment of the present invention, which includes an airflow driving member 400a and an airflow driving member 400b. The airflow driving member 400a is located on one side of the air outlet of the first air duct 500 and the second air duct 600, and the air inlet of the airflow driving member 400a is connected to the air outlet of the first air duct 500 and the second air duct 600, and the air outlet of the airflow driving member 400a is connected to the outside of the electronic device 10. The airflow driving member 400b is located on one side of the air inlet of the first air duct 500 and the second air duct 600, and the air inlet of the airflow driving member 400b is connected to the outside of the electronic device 10, and the air outlet of the airflow driving member 400b is connected to the air inlet of the first air duct 500 and the second air duct 600. The two airflow driving members 400 are respectively arranged at the air inlet and outlet of the first air duct 500 and the second air duct 600 to accelerate the air circulation speed, improve the heat exchange rate between the motherboard 200 and the cold air, and improve the heat dissipation efficiency of the motherboard 200.

[0112] In one possible implementation, the orthographic projections of the first air duct 500 and the second air duct 600 on the mainboard 200 at least partially overlap. In some embodiments, the orthographic projections of the first air duct 500 and the second air duct 600 on the mainboard 200 completely overlap, allowing the cold air F in the first air duct 500 and the second air duct 600 to dissipate heat from the mainboard 200 with maximum efficiency. In some embodiments, the orthographic projections of the first air duct 500 and the second air duct 600 on the mainboard 200 may intersect.

[0113] See also Figure 5l and Figure 5m ,in Figure 5l Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5m yes Figure 5l In the cross-sectional view II in FIG, in one possible implementation, the length of the first guide portion 510 and the second guide portion 520 along the fourth direction D is the same as the length of the mainboard 200, and the length of the third guide portion 610 and the fourth guide portion 620 along the fourth direction D is the same as the length of the mainboard 200. This ensures that the length of the first air duct 500 and the second air duct 600 along the fourth direction D is the same as the length of the mainboard 200 along the fourth direction D, thereby achieving maximum cooling efficiency for the mainboard 200. The fourth direction D is perpendicular to the first direction A and coplanar and perpendicular to the second direction B. In this embodiment, the fourth direction D is the length direction of the electronic device 10, the first direction A is the thickness direction of the electronic device 10, and the second direction B is the width direction of the electronic device 10.

[0114] In some embodiments, the lengths of the first guide portion 510, the second guide portion 520, the third guide portion 610, and the fourth guide portion 620 along the fourth direction D can be set according to the position of the main heating device 230 on the mainboard 200. For example, see Figure 5n 、 Figure 5o and Figure 5p ,in Figure 5n Schematic diagram of the middle frame 100, the mainboard 200 and the structural member 300 as viewed from the side of the structural member 300. Figure 5o yes Figure 5n In the JJ cross-sectional view, Figure 5p yes Figure 5n As shown in the KK cross-sectional view in FIG1 , when the main heating device 230 on the main board 200 is located in a part of the main board 200 close to the airflow driving member 400, the length of the first guide portion 510, the second guide portion 520, the third guide portion 610 and the fourth guide portion 620 along the fourth direction D can be set to be shorter than that of the main board 200, so that the first air duct 500 and the second air duct 600 only dissipate heat for the part with the heating device 230. Such targeted setting of the air duct can not only dissipate heat for the main board 200, but also save space occupied by the air duct.

[0115] Please refer again Figure 1 and Figure 5b In one possible implementation, the region of the structural member 300 located in the first air duct 500 is provided with a first air inlet 310 and a first air outlet 320 that penetrate two opposing surfaces of the structural member 300. The first air inlet 310 and the first air outlet 320 are located at opposite ends of the first air duct 500, respectively. The first air inlet 310 and the first air outlet 320 are respectively connected to the exterior of the electronic device 10, and the first air outlet 320 is connected to the air outlet (first air outlet C1) of the air flow driving member 400, so that the air F enters from the first air inlet 310, flows through the first air duct 500 and the air flow driving member 400, and flows out from the first air outlet 320. Specifically, after the cold air F enters from the first air inlet 310, a portion of the cold air F1 flows through the first air duct 500 and is heated to become hot air. The hot air enters the air inlet of the air flow driving member 400 from the air outlet of the first air duct 500 and leaves the electronic device 10 from the air outlet of the air flow driving member 400. The shapes of the first air inlet 310 and the first air outlet 320 can be any one of circular, square, elliptical or irregular shapes.

[0116] In one possible implementation, the mainboard 200 is provided with second air inlet holes 210 extending through two opposing surfaces of the mainboard 200. The second air inlet holes 210 are connected to the first air inlet holes 310, allowing air to enter the second air inlet holes 210 from the first air inlet holes 310, flow through the second air duct 600 and the air flow driving member 400, and exit from the first air outlet holes 320. Specifically, after cold air F enters the first air inlet hole 310, another portion of cold air F2 enters the second air duct 600 from the second air inlet hole 210. After passing through the second air duct 600, the cold air is heated and converted into hot air. The hot air then enters the air inlet of the air flow driving member 400 from the air outlet of the second air duct 600 and exits the electronic device 10 from the air outlet of the air flow driving member 400. In this embodiment, cold air F from outside the electronic device 10 is split after the first air inlet 310. A portion of the cold air F1 enters the first air duct 500, while another portion of the cold air F2 enters the second air duct 600 through the second air inlet 210. This allows the cold air F to cool the mainboard 200 through the two air ducts on the upper and lower surfaces. In this embodiment, the air inlet side of the cold air F can be located on the side of the structural member 300 away from the mainboard 200. For example, when the structural member 300 is a back cover 700, the first air inlet 310 of the structural member 300 connects the interior and exterior of the electronic device 10, and the cold air F enters the electronic device 10 through the first air inlet 310.

[0117] In some embodiments, the cold air F can first enter the second air duct 600, and then enter the first air duct 500 through the air inlet hole on the main panel 200. That is to say, in this embodiment, the air inlet side of the cold air F can be set on the side of the display screen 20 or the frame of the middle frame 100, or set on the back cover 700, and enter the second air duct 600 through other air ducts in the back cover 700.

[0118] In one possible implementation, the airflow driving member 400 is located on a side of the mainboard 200 away from the second air inlet 210. That is, the airflow driving member 400 and the mainboard 200 are not stacked in the thickness direction, but are arranged parallel to each other in the width or length direction, thereby reducing the stacking thickness of the electronic device 10. In some embodiments, the thickness of the airflow driving member 400 in the first direction A is the same as the thickness of the mainboard 200 in the first direction A. The surfaces of the airflow driving member 400 along the first direction A are aligned parallel to the surfaces of the mainboard 200 along the first direction A. This ensures that the thickness of both components, the airflow driving member 400 and the mainboard 200, in the first direction A, is only the thickness of one mainboard 200 or one airflow driving member 400, thereby reducing the stacking thickness of the electronic device 10. In addition, in this embodiment, the air flow driving member 400 is located on the side of the mainboard 200 away from the second air inlet hole 210, so that the cold air entering the first air inlet hole 310 can blow and cool the mainboard 200 between the first air inlet hole 310 and the air flow driving member 400. When the first air duct 500 and the second air duct 600 are the same length as the mainboard 200 in the fourth direction D, the cold air can blow and cool the entire mainboard 200, thereby improving the cooling and heat dissipation efficiency.

[0119] In one possible implementation, the orthographic projections of the second air inlet 210 and the first air inlet 310 on the mainboard 200 at least partially overlap. This allows the first air inlet 310 to communicate with the second air inlet 210. In this embodiment, the orthographic projections of the second air inlet 210 and the first air inlet 310 on the mainboard 200 completely overlap, increasing the amount of cold air F entering the second air duct 600 and reducing wind resistance. In one embodiment, see Figure 5i When the airflow driving member 400 is located on one side of the air inlet of the first air duct 500 and the second air duct 600, a second air outlet 240 is further provided on the end of the mainboard 200 away from the second air inlet 210, penetrating the mainboard 200. The orthographic projections of the first air outlet 320 and the second air outlet 240 on the mainboard 200 at least partially overlap. This allows the first air outlet 320 and the second air outlet 240 to communicate with each other, increasing the speed at which air leaves the electronic device 10.

[0120] In the embodiment of the present application, the shapes of the first air duct 500 and the second air duct 600 are not limited and can be set according to the shape of the mainboard 200. Figure 6 As shown, the main board 200 may be square, T-shaped, or L-shaped, and the shapes of the first air duct 500 and the second air duct 600 may also be square, T-shaped, or L-shaped.

[0121] Please refer again Figure 1 、 Figure 5a and Figure 5bIn one possible implementation, the first air outlet 320 and the orthographic projection of the airflow driving member 400 on the structural member 300 at least partially overlap. In this embodiment, the first air outlet 320 and the orthographic projection of the airflow driving member 400 on the structural member 300 overlap, and the length of the airflow driving member 400 in the second direction B is the same as the length of the main board 200 in the second direction B. In this embodiment, the first guide portion 510 and the second guide portion 520 are disposed between the airflow driving member 400 and the structural member 300 adjacent to one end of the airflow driving member 400 (e.g., Figure 5m shown).

[0122] In a possible implementation, there is a fifth gap 220 between the airflow driving member 400 and the main board 200, and the first air duct 500 is connected to the air inlet of the airflow driving member 400 through the fifth gap 220 (eg, Figure 1 and Figure 5b (as shown). When the airflow driving member 400 is operating, the cold air F1 from the first air duct 500 is drawn into the airflow driving member 400 through the fifth gap 220. Because the air inlet (first air inlet R1) of the airflow driving member 400 is connected to the first air duct 500, when the airflow driving member 400 is operating, part of the cold air F1 flows through the first air duct 500 and enters the airflow driving member 400 through the fifth gap 220, while another part of the cold air F2 flows through the second air duct 600 and enters the airflow driving member 400 through the air outlet (third air outlet C3) of the second air duct 600. The length of the fifth gap 220 along the fourth direction D can be set according to actual product conditions, for example, to 5 mm or 8 mm.

[0123] See also Figure 7 In a possible implementation, the structural member 300 is a back cover 700, and the first guide portion 510 and the second guide portion 520 are connected to the back cover 700. The first guide portion 510 and the second guide portion 520 are arranged between the back cover 700 and the main board 200. In this embodiment, when the structural member 300 is the back cover 700, the first air duct 500 is formed by a part of the back cover 700, that is, the first guide portion 510 and the second guide portion 520 are connected and fixed to the middle part of the back cover 700 (such as Figure 7 As shown in FIG. 1 , the first guide portion 510 and the second guide portion 520 may be connected between the back cover 700 and the main board 200 by means of adhesive, screws, snaps, or the like. In some embodiments, the first guide portion 510 and the second guide portion 520 may be formed by bosses protruding from the back cover 700 toward the main board 200, i.e., the first guide portion 510 and the second guide portion 520 are integrally formed with the back cover 700. In some embodiments, see FIG. Figure 8 Alternatively, the back cover 700 itself may be grooved to form the first air duct 500 , wherein the groove walls on both sides are the first guide portion 510 and the second guide portion 520 respectively.

[0124] See also Figure 9 , Figure 9 This is a schematic diagram of one structure of the electronic device 10. In this embodiment, the first air inlet 310 and the first air outlet 320 are provided on the back cover 700. The side of the back cover 700 away from the mainboard 200 is the external environment of the electronic device 10. Cold air F from the external environment enters the electronic device 10 through the first air inlet 310. Part of the cold air F1 flows through the first air duct 500 and enters the air flow driving member 400 through the fifth gap 220. Another part of the cold air F2 enters the second air duct 600 through the second air inlet 210, flows through the second air duct 600, enters the air flow driving member 400, and then leaves the electronic device 10 through the first air outlet 320. To reduce the amount of water from the external environment entering the electronic device 10 through the first air inlet 310 and the first air outlet 320, a water-proof and breathable film layer can be provided in the first air inlet 310 and the first air outlet 320 to block water vapor. In some embodiments, the first air inlet 310 and the first air outlet 320 may be provided on the side wall of the back cover 700 protruding toward the display screen 20 to prevent the user's hands from blocking the first air inlet 310 and the first air outlet 320 when holding the back cover 700.

[0125] See also Figure 10 In one possible implementation, the structural member 300 is a support member 800, and the first guide portion 510 and the second guide portion 520 are disposed opposite each other at the edge of the support member 800 and connected to the support member 800. The support member 800 can be used to support the motherboard 200 or other electronic components in the electronic device 10. The support member 800 and the motherboard 200 can have the same or different shapes. When the support member 800 and the motherboard 200 have the same shape, the first guide portion 510 and the second guide portion 520 are disposed opposite each other at the edge of the motherboard 200 and connected to the motherboard 200. In this case, the entire support member 800, the motherboard 200, and the first guide portion 510 and the second guide portion 520 together enclose the first air duct 500. In some embodiments, the first guide portion 510 and the second guide portion 520 can be formed by protrusions from the support member 800 toward the motherboard 200, that is, the first guide portion 510 and the second guide portion 520 are integrally formed with the support member 800. In some embodiments, the support member 800 itself may be grooved to form the first air duct 500 , wherein the groove walls on both sides serve as the first guide portion 510 and the second guide portion 520 , respectively.

[0126] See also Figure 11a and Figure 11b ,in Figure 11a is a schematic diagram of a structure of an electronic device 10. Figure 11bSchematic diagram of the structure of the support member 800. In one possible implementation, the support member 800 is provided with a first sidewall 810 and a second sidewall 820 at both ends along the fourth direction D. The first sidewall 810 is connected to one end of the first guide portion 510 and the second guide portion 520, and the second sidewall 820 is connected to the other ends of the first guide portion 510 and the second guide portion 520. The first sidewall 810 is positioned adjacent to the air inlet of the first air duct 500, and the second sidewall 820 is positioned adjacent to the air outlet of the first air duct 500. The fourth direction D is perpendicular to the first direction A and coplanar and perpendicular to the second direction B. In this embodiment, the fourth direction D is the length direction of the electronic device 10, the first direction A is the thickness direction of the electronic device 10, and the second direction B is the width direction of the electronic device 10. The first sidewall 810, the first guide portion 510, the second sidewall 820, and the second guide portion 520 are connected end to end and, together with the support member 800 and the mainboard 200 on both sides along the first direction A, form the first air duct 500. Among them, the first side wall 810 and the second side wall 820 can be composed of bosses protruding from the support member 800 toward the main board 200, that is, the first side wall 810 and the second side wall 820 and the support member 800 are integrally formed, or they can be separate components connected between the main board 200 and the support member 800 by adhesives, screws, snaps, etc.

[0127] In this embodiment, the electronic device 10 further includes a back cover 700 (eg Figure 11aAs shown, the back cover 700 is located on a side of the support member 800 away from the mainboard 200. The back cover 700 is provided with a third air inlet 710 and a third air outlet 720 extending through two opposite surfaces of the back cover 700. The third air inlet 710 communicates with the exterior of the electronic device 10 and is respectively communicated with the first air duct 500 and the second air duct 600. The third air outlet 720 communicates with the exterior of the electronic device 10 and is respectively communicated with the first air duct 500 and the second air duct 600. Specifically, the third air inlet 710 communicates with the first air inlet 310 and the second air inlet 210, thereby communicating with the first air duct 500 and the second air duct 600, respectively. The third air outlet 720 communicates with the first air duct 500 and the second air duct 600, respectively, by communicating with the first air outlet 320 and the air outlet of the airflow driving member 400. In this embodiment, a third air inlet 710 and a third air outlet 720 are provided on the back cover 700, which communicate with the external environment. Specifically, the side of the back cover 700 away from the support member 800 is the external environment of the electronic device 10. Cold air F from the external environment enters the first air inlet 310 through the third air inlet 710. Part of the cold air F1 flows through the first air duct 500 and enters the airflow driving member 400 through the fifth gap 220. Another portion of the cold air F2 enters the second air inlet 210 and enters the second air duct 600. After flowing through the second air duct 600, it enters the airflow driving member 400 and then exits the electronic device 10 through the first air outlet 320 and the third air outlet 720, in sequence. To reduce the amount of water from the external environment entering the electronic device 10 through the third air inlet 710 and the third air outlet 720, a water-proof and breathable film layer may be provided in the third air inlet 710 and the third air outlet 720 to block water vapor.

[0128] In one possible implementation, the orthographic projections of the first air inlet 310, the second air inlet 210, and the third air inlet 710 on the back cover 700 at least partially overlap. This allows the cold air outside the electronic device 10 to enter the first air duct 500 and the second air duct 600 with greater efficiency. The orthographic projections of the first air outlet 320, the third air outlet 720, and the air outlet of the airflow driving member 400 on the back cover 700 at least partially overlap. This allows the hot air that has cooled the heating device 230 on the mainboard 200 to be smoothly discharged from the electronic device 10. This setting can reduce wind resistance and accelerate the cooling efficiency of the heating device 230 on the mainboard 200. The sizes of the first air inlet 310, the second air inlet 210, and the third air inlet 710 can be set according to actual product conditions.

[0129] Please refer again Figure 2 In a possible implementation, the third guide portion 610 and the fourth guide portion 620 are connected to the middle frame 100. In this embodiment, the second air duct 600 is formed by a portion of the rear middle frame 100, that is, the third guide portion 610 and the fourth guide portion 620 are connected and fixed to the middle portion of the middle frame 100 (such as Figure 2As shown in FIG. 1 , the third guide portion 610 and the fourth guide portion 620 may be connected between the middle frame 100 and the mainboard 200 via adhesive, screws, snaps, or other connection methods. The third guide portion 610 and the fourth guide portion 620 may conform to the shape of the mainboard 200 and be connected to the edge of the mainboard 200. In some embodiments, the third guide portion 610 and the fourth guide portion 620 may be formed by bosses protruding from the middle frame 100 toward the mainboard 200, i.e., the third guide portion 610 and the fourth guide portion 620 are integrally formed with the middle frame 100. In some embodiments, the middle frame 100 itself may be grooved to form the second air duct 600.

[0130] In some embodiments, see Figure 12 and Figure 13 , Figure 12 This is a structural diagram of one of the parts of the middle frame 100, the third guide portion 610 and the mainboard 200 in the electronic device 10. Figure 13 This is a schematic structural diagram of the middle frame 100, the fourth guide portion 620 and the mainboard 200 in the electronic device 10, wherein the third guide portion 610 and the fourth guide portion 620 can be separate first bosses 613 and second bosses 614, respectively. The first bosses 613 and the second bosses 614 can be connected between the mainboard 200 and the middle frame 100 by adhesives, screws, snaps, etc. to form the third guide portion 610 and the fourth guide portion 620 of the second air duct 600.

[0131] See also Figure 14 , Figure 14 Figure 1 is a schematic diagram of the structure of electronic device 10. In one possible implementation, the air inlet of airflow driving member 400 is positioned adjacent to and intersects with the mainboard 200. This allows the air inlet of airflow driving member 400 to be directed toward the air outlet of first air duct 500, increasing the area through which hot air from first air duct 500 enters airflow driving member 400 and improving air intake. In some embodiments, a predetermined angle α is formed between the surface of airflow driving member 400 with the air inlet and mainboard 200. In one specific embodiment, the predetermined angle α is 45°.

[0132] In one possible implementation, the airflow driving member 400 is electrically connected to the mainboard 200. The mainboard 200 provides power to the airflow driving member 400, thereby operating the airflow driving member 400. In some embodiments, the airflow driving member 400 is electrically connected to the driving circuit on the mainboard 200 via an electrical connection line.

[0133] See also Figure 15 and Figure 16 , Figure 15 1 is a schematic structural diagram of the middle frame 100, the first battery 900, and the second battery 1000 of the electronic device 10. Figure 16 yes Figure 15 LL cross-sectional view in FIG. In one possible implementation, the electronic device 10 further includes a first battery 900 and a second battery 1000. The first battery 900 and the second battery 1000 are spaced apart along the second direction B on a side of the middle frame 100 facing the mainboard 200. The first battery 900 is located on a side of the third guide portion 610 away from the second air duct 600, and the second battery 1000 is located on a side of the fourth guide portion 620 away from the second air duct 600. The height of the first battery 900 and the second battery 1000 along the first direction A is greater than the height of the third guide portion 610 and the fourth guide portion 620 (as shown in FIG. 1 ). Figure 16 As shown), the mainboard 200 is arranged between the first battery 900 and the second battery 1000 along the second direction B. In this embodiment, the mainboard 200 is T-shaped, and the middle frame 100 is provided with a first receiving position 110 for receiving the first battery 900 and the second battery 1000, and a second receiving position 120 for receiving the airflow driving member 400. The first receiving position 110 is located on both sides of the mainboard 200, and the second receiving position 120 is located at one end of the mainboard 200 adjacent to the first air outlet 320. The third guide portion 610 and the fourth guide portion 620 are portions of the T-shaped mainboard 200 having a bent section along the second direction B, as shown in FIG. Figure 15 Medium black bold part.

[0134] In some embodiments, the shapes of the third guide portion 610 and the fourth guide portion 620 can be configured based on the shape of the motherboard 200 and are not limited to elongated strips, arcs, curved line segments, etc. In this embodiment, the third guide portion 610 and the fourth guide portion 620 serve to both accommodate the first battery 900 and the second battery 1000 and to guide the wind direction of the second air duct 600. This utilizes the battery-receiving components of the electronic device 10 as guides, saving space and simplifying the structure of the electronic device 10.

[0135] The first battery 900 and the second battery 1000 can be connected in series or in parallel according to product requirements, or can be operated independently. In this embodiment, the arrangement of the two batteries allows the mainboard 200 to be clamped between the two. On the one hand, it can fix the mainboard 200 and improve the structural strength. On the other hand, it is conducive to forming a second air duct 600 to prevent wind from flowing through various areas of the electronic device 20 and increasing wind resistance.

[0136] In some embodiments, the third guide portion 610 and the fourth guide portion 620 are provided with a third side wall 630 and a fourth side wall 640 at both ends along the fourth direction D. The third side wall 630, the third guide portion 610, the fourth side wall 640 and the fourth guide portion 620 are connected end to end in sequence, and together with the mainboard 200 and part of the middle frame 100, form a second air duct 600. The third side wall 630, the third guide portion 610, the fourth side wall 640 and the fourth guide portion 620 close the periphery of the second air duct 600, so that the wind can circulate only in the second air duct 600, thereby preventing wind from leaking from the periphery of the second air duct 600, increasing the air volume in the second air duct 600, and improving the cooling efficiency. The third side wall 630 and the fourth side wall 640 may be formed by bosses protruding from the middle frame 100 toward the mainboard 200, that is, the third side wall 630 and the fourth side wall 640 are integrally formed with the middle frame 100, or they may be separate components connected between the mainboard 200 and the middle frame 100 by adhesives, screws, snaps, or the like.

[0137] In some embodiments, the length of the third side wall 630 and the fourth side wall 640 along the fourth direction D is set to be larger, wherein the fourth direction D is the length direction of the electronic device 10. After the mainboard 200 is placed on the surface of the third side wall 630, the fourth side wall 640, the third guide portion 610 and the fourth guide portion 620 away from the middle frame 100, the mainboard 200 and the third side wall 630 and the fourth side wall 640 are fixedly connected with screws, and no other components are used to fix the mainboard 200 and the third guide portion 610 and the fourth guide portion 620. This arrangement can save design space of the electronic device 10 in the second direction B (width direction).

[0138] Please refer again Figure 1 In one possible implementation, the electronic device 10 further includes a shielding member 1100, which is disposed on the surface of the mainboard 200. The shielding member 1100 is used to shield electronic devices that generate radiation signals. In some embodiments, there may be two shielding members 1100, which are disposed on two opposite surfaces of the mainboard 200. In some embodiments, see Figure 17 , Figure 17 Schematic diagram of the structure of the mainboard 200 in the electronic device 10. The shielding member 1100 is provided with an opening 1110 to expose the electronic device 1120 that does not generate radiation signals, and the electronic device 1120 can be directly cooled by cold air.

[0139] See also Figure 18 , Figure 18This is a structural diagram of the motherboard 200 portion of the electronic device 10. In some embodiments, a CPU 1130 is provided on the surface of the motherboard 200 facing the middle frame 100. Since the CPU 1130 generates more heat when the electronic device 10 is working, a thermal conductive material 1140 can be set at the position of the shielding member 1100 corresponding to the CPU 1130 to accelerate the cooling of the CPU 1130. The thermal conductive material 1140 includes a TIM, such as gel or silicone.

[0140] See also Figure 19 , Figure 19 The figure is a schematic diagram of the structure of the motherboard 200 of the electronic device 10. In one possible implementation, a heating device 230 is provided on the motherboard 200, and an opening 1110 is provided in the shielding member 1100 to expose the heating device 230. The heating device 230 can be provided on any surface of the motherboard 200, so that the heating device 230 is directly cooled by the cold air from the first air duct 500 or the second air duct 600. In some embodiments, a thermally conductive material 1140 is provided on the surface of the heating device 230 away from the motherboard 200. The thermally conductive material 1140 conducts heat from the heating device 230, thereby improving cooling efficiency.

[0141] In order to illustrate the beneficial effects of the electronic device 10 in this application, this application also provides the following specific implementation methods, comparative implementation methods and test results for illustration.

[0142] Implementation Method 1

[0143] See also Figures 1 to 5b In this embodiment, the electronic device 10 is a mobile phone, comprising an airflow driving member 400 and a display screen 20, a middle frame 100, a mainboard 200, a structural member 300 and a back cover 700 stacked in sequence along a first direction A. The middle frame 10 is provided with a first battery 900 and a second battery 1000 (eg, Figure 15 As shown), heating devices 230 are provided on both surfaces of the mainboard 200, and the heating devices 230 include a CPU 1130 (as shown Figure 2 In this embodiment, the first direction A is the thickness direction of the electronic device 10 , wherein the structural member 300 is a supporting member 800 .

[0144] A first guide portion 510 and a second guide portion 520 are provided between the support member 800 and the main board 200 and are arranged opposite to each other along the second direction B (eg, Figure 2 ), and the first side wall 810 and the second side wall 820 (as shown) oppositely disposed along the fourth direction D Figure 11b(as shown), the first guide portion 510, the second guide portion 520, the first side wall 810, the second side wall 820, the support member 800, and the mainboard 200 collectively enclose the first air duct 500. The fourth direction D and the second direction B are perpendicular to the first direction A. In this embodiment, the second direction B is the width direction of the electronic device 10, and the fourth direction D is the length direction of the electronic device 10.

[0145] A third guide portion 610 and a fourth guide portion 620 are provided between the middle frame 100 and the mainboard 200, and a third side wall 630 and a fourth side wall 640 are provided opposite to the device along the fourth direction D. The third side wall 630, the third guide portion 610, the fourth side wall 640 and the fourth guide portion 620 are connected end to end in sequence and enclosed with the mainboard 200 and part of the middle frame 100 to form a second air duct 600 (as shown in FIG. Figure 15 The orthographic projections of the first air duct 500 and the second air duct 600 on the main board 200 overlap. The third direction C is the same as the second direction B.

[0146] The support member 800 is located in the first air duct 500 and is provided with a first air inlet 310 and a first air outlet 320 (such as Figure 11a (as shown), the first air inlet 310 and the first air outlet 320 are located at opposite ends of the first air duct 500, and the first air outlet 320 is connected to the air inlet of the air flow driving member 400. The mainboard 200 is provided with a second air inlet 210 extending through two opposing surfaces of the mainboard 200. The air flow driving member 400 is located on a side of the mainboard 200 away from the second air inlet 210, and the second air inlet 210 is connected to the first air inlet 310.

[0147] The back cover 700 is located on the side of the support member 800 away from the mainboard 200. The back cover 700 is provided with a third air inlet 710 and a third air outlet 720 extending through opposite surfaces of the back cover 700. The third air inlet 710 communicates with the exterior of the electronic device 10 and with the first air inlet 310 and the second air inlet 210, respectively. The third air outlet 720 communicates with the exterior of the electronic device 10 and with the first air outlet 320 and the air outlet of the airflow driving member 400, respectively. The orthographic projections of the first air inlet 310, the second air inlet 210, and the third air inlet 710 on the back cover 700 partially overlap. The lengths of the first air inlet 310, the second air inlet 210, and the third air inlet 710 along the fourth direction D are 18 mm, and the lengths along the second direction B are 5 mm. The lengths of the first air outlet 320 and the third air outlet 720 along the fourth direction D and the second direction B are 18 mm, respectively. The airflow driving member 400 is a fan, the length of the fan along the fourth direction D and the length along the second direction B are both 18 mm, and the length along the first direction A is 5 mm.

[0148] The airflow driving component 400 is located on one side of the air outlet of the first air duct 500 and the second air duct 600. There is a fifth gap 220 between the airflow driving component 400 and the main board 200. The first air duct 500 is connected to the air inlet of the airflow driving component 400 through the fifth gap 220, and the air outlet of the second air duct 600 is connected to the air inlet of the airflow driving component 400.

[0149] The cold air F from the external environment enters the first air inlet 310 from the third air inlet 710, and then enters the electronic device 10 from the first air inlet 310. Part of the cold air F1 flows through the first air duct 500 and enters the air flow driving component 400 from the fifth gap 220. Another part of the cold air F2 enters the second air duct 600 from the second air inlet 210, flows through the second air duct 600 and enters the air flow driving component 400, and then passes through the first air outlet 320 and the third air outlet 720 in sequence to leave the electronic device 10.

[0150] In this embodiment, the mainboard 200 is arranged in a T-shape, and the first and second air ducts 500 and 600 have the same shape as the mainboard 200. The first battery 900 and the second battery 1000 are spaced apart along the second direction B on the side of the middle frame 100 facing the mainboard 200. The first battery 900 is located on the side of the third guide 610 away from the second air duct 600, and the second battery 1000 is located on the side of the fourth guide 620 away from the second air duct 600.

[0151] Comparative Implementation Methods

[0152] See also Figure 20In a comparative embodiment, an electronic device 10a is provided, comprising a display screen 20, a middle frame 100, a mainboard 200, a heat sink 1200, an airflow driving member 400, and a back cover 700. The display screen 20 and the mainboard 200 are disposed on both sides of the middle frame 100, the heat sink 1200 is disposed on a side of the mainboard 200 away from the middle frame 100, and the back cover 700 is disposed on a side of the heat sink 1200 away from the mainboard 200. The heat sink 1200 has a hollow cavity structure, and the airflow driving element 400 is disposed within the cavity of the heat sink 1200. The heat sink 1200 includes a first surface 1230 adjacent to the back cover 700. A fourth air inlet 1210 and a fourth air outlet 1220 are provided on the first surface 1230, extending through the first surface 1230. The fourth air inlet 1210 and the fourth air outlet 1220 are disposed at opposite ends of the heat sink 1200. The back cover 700 includes a third air inlet 710 and a third air outlet 720 extending through the opposite surfaces. The orthographic projections of the fourth air inlet 1210 and the third air inlet 710 on the back cover 700 overlap, and the orthographic projections of the fourth air outlet 1220 and the third air outlet 720 on the back cover 700 overlap. Cold air enters from the third air inlet 710, passes through the fourth air inlet 1210, and enters the heat sink 1200. Then, driven by the airflow driver 400, it passes through the fourth air outlet 1220 and the third air outlet 720 in sequence and is discharged from the electronic device 10a. The airflow driver 400 is a fan having a length and width of 18 mm and a height of 5 mm. In this comparative embodiment, heat can only be dissipated to the surface of the motherboard 200 facing the heat sink 1200, and the cold air F cannot directly blow on the surface of the motherboard 200. The cold air F can only first cool the surface of the heat sink 1200 adjacent to the motherboard 200, and then cool the motherboard 200 through this cooled surface. This results in poor cooling efficiency. Testing has shown that the overall heat dissipation capacity of the electronic device 10a provided in this comparative embodiment is 50 mA / °C to 65 mA / °C. Furthermore, the heat sink 1200 is an independent air duct structure. Stacking it within the entire device increases the thickness, which is not conducive to meeting the current trend of lightweight and high-performance products.

[0153] This application conducts effect tests on the above-mentioned embodiment 1, wherein the simulation schematic diagram in embodiment 1 is as follows: Figure 21 and Figure 22 As shown, Figure 21 is a simulation diagram of implementation mode 1, Figure 22 Schematic diagram of the air flowing through the first air duct 500 and the second air duct 600 on the upper and lower surfaces of the main board 200 in embodiment 1. Figure 21 and Figure 22It can be seen that when the electronic device 10 provided in Embodiment 1 is in operation, the cold air F enters the first air duct 500 and the second air duct 600 on both sides of the mainboard 200, thereby dissipating heat and cooling the upper and lower surfaces of the mainboard 200. The electronic device 10 provided in Embodiment 1 was tested with air volumes of 0.2 CFM and 0.5 CFM. The test data are shown in Table 1. The heat dissipation capacity of the first air duct 500 reached 95 mA / °C and 160 mA / °C at air volumes of 0.2 CFM and 0.5 CFM, respectively. The heat dissipation capacity of the second air duct 600 reached 81.7 mA / °C and 120 mA / °C at air volumes of 0.2 CFM and 0.5 CFM, respectively. The heat dissipation efficiency is significantly higher than that of the electronic device 10a provided in the comparative embodiment. In addition, the internal wind resistance of the electronic device 10 in Embodiment 1 of the present application is only 25 Pa and 85 Pa at air volumes of 0.2 CFM and 0.5 CFM, respectively, indicating that it has a smaller wind resistance, is more conducive to the flow of cold air, and accelerates the cooling speed.

[0154] Table 1

[0155]

[0156] The electronic device provided in the embodiments of the present application is introduced in detail above. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there may be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device is used to dissipate heat from a heat generating component of an electronic device, wherein the electronic device includes a middle frame, a main board, and a back cover stacked in sequence along a first direction. The heat dissipation device includes an airflow driving member, a first air duct, and a second air duct. The first air duct is located between the back cover and the main board of the electronic device, and the second air duct is located between the middle frame and the main board of the electronic device. The first air duct and the second air duct each have an air inlet and an air outlet that are arranged opposite to each other and communicate with the outside of the electronic device. The air flow driving member is located on a path where the air inlet of the first air duct and the air inlet of the second air duct communicate with the outside of the electronic device. The air flow driving member is used to drive cold air from the air inlet of the first air duct and the air inlet of the second air duct to blow toward the air outlet of the first air duct and the air outlet of the second air duct, respectively. The air inlet of the first air duct and the air inlet of the second air duct are arranged on the same side and are connected to each other, and the air inlet of the first air duct and the air inlet of the second air duct are located on the rear cover; The air outlet of the first air duct and the air outlet of the second air duct are arranged on the same side and are connected to each other. The air outlet of the first air duct and the air outlet of the second air duct are located on the side wall of the rear cover.

2. The heat dissipation device according to claim 1, characterized in that: The first air duct includes a first guide portion and a second guide portion, and the second air duct includes a third guide portion and a fourth guide portion. The first guide portion and the second guide portion are used to guide the cold air to circulate in the first air duct, and the third guide portion and the fourth guide portion are used to guide the cold air to circulate in the second air duct.

3. The heat dissipation device according to claim 2, characterized in that: At least one of the third guide portion and the fourth guide portion has a shape of at least one of a long strip, an arc, or a bent line segment.

4. The heat dissipation device according to claim 2 or 3, characterized in that: The first guide portion and the second guide portion are relatively arranged between the back cover and the main board along a second direction, the second direction intersects with the first direction, and the first guide portion, the back cover, the second guide portion and the main board together enclose the first air duct.

5. The heat dissipation device according to any one of claims 2 to 4, characterized in that: The middle frame is stacked on the side of the mainboard away from the first air duct along the first direction, and the third guide portion and the fourth guide portion are relatively arranged between the middle frame and the mainboard along the third direction, and the third direction intersects with the first direction. The third guide portion, the middle frame, the fourth guide portion and the mainboard together enclose the second air duct.

6. The heat dissipation device according to any one of claims 2 to 5, characterized in that: The first guide portion and the second guide portion are connected to the rear cover.

7. The heat dissipation device according to any one of claims 2 to 6, characterized in that: The third guide portion and the fourth guide portion are connected to the middle frame.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The airflow driving component is electrically connected to the main board.

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that: Along a direction perpendicular to the first direction, the airflow driving member is located on one side of the main board.

10. The heat dissipation device according to any one of claims 1 to 9, characterized in that: Along the first direction, an orthographic projection of at least one of the first air duct and the second air duct on the main board at least partially overlaps.

11. The heat dissipation device according to any one of claims 1 to 10, characterized in that: Along the length direction of the main board, a length of at least one of the first air duct and the second air duct is the same as a length of the main board.

12. The heat dissipation device according to any one of claims 1 to 10, characterized in that: Along the length direction of the main board, a length of at least one of the first air duct and the second air duct is smaller than a length of the main board.

13. The heat dissipation device according to any one of claims 1 to 12, characterized in that: The area of ​​the back cover located in the first air duct is provided with a first air inlet and a first air outlet that penetrate the two opposite surfaces of the back cover, the first air inlet and the first air outlet are respectively located at opposite ends of the first air duct, the first air inlet and the first air outlet are respectively connected to the outside of the electronic device, and the first air outlet is connected to the air outlet of the air flow driving component, so that wind enters from the first air inlet, flows through the first air duct and the air flow driving component, and flows out from the first air outlet.

14. The heat dissipation device according to claim 13, characterized in that: The first air outlet and the air outlet of the air flow driving member are at least partially overlapped with each other in their orthographic projections on the rear cover.

15. The heat dissipation device according to claim 13 or 14, characterized in that: The main board is provided with a second air inlet hole which passes through two opposite surfaces of the main board. The second air inlet hole is connected to the first air inlet hole so that air enters the second air inlet hole from the first air inlet hole, flows through the second air duct and the air flow driving element, and flows out from the first air outlet hole.

16. The heat dissipation device according to claim 15, characterized in that: The second air inlet hole and the orthographic projection of the first air inlet hole on the mainboard at least partially overlap.

17. The heat dissipation device according to claim 15, characterized in that: The airflow driving component is located on a side of the mainboard away from the second air inlet hole.

18. The heat dissipation device according to any one of claims 1 to 17, characterized in that: A fifth gap is defined between the airflow driving component and the main board, and the first air duct is communicated with the air inlet of the airflow driving component through the fifth gap.

19. The heat dissipation device according to any one of claims 1 to 18, characterized in that: The airflow driving member is located on one side of the air inlet of the first air duct and the second air duct, and the air inlet of the airflow driving member is connected to the outside of the electronic device, and the air outlet of the airflow driving member is connected to the air inlet of the first air duct and the second air duct.

20. The heat dissipation device according to any one of claims 1 to 19, characterized in that: The back cover is provided with a third air inlet and a third air outlet which pass through two opposite surfaces of the back cover. The third air inlet is connected to the outside of the heat dissipation device and is respectively connected to the first air duct and the second air duct. The third air outlet is connected to the outside of the heat dissipation device and is respectively connected to the first air duct and the second air duct.

21. An electronic device, characterized in that: The electronic device includes a middle frame, a mainboard, a back cover, and a heat dissipation device, wherein the middle frame, the mainboard, and the back cover are stacked in sequence along a first direction, and the heat dissipation device includes an airflow driving member, a first air duct, and a second air duct, wherein the first air duct is located between the back cover and the mainboard, and the second air duct is located between the middle frame and the mainboard; The first air duct and the second air duct each have an air inlet and an air outlet that are arranged opposite to each other and communicate with the outside of the electronic device. The air flow driving member is located on a path where the air inlet of the first air duct and the air inlet of the second air duct communicate with the outside of the electronic device. The air flow driving member is electrically connected to the mainboard and is used to drive cold air from the air inlet of the first air duct and the air inlet of the second air duct to blow toward the air outlet of the first air duct and the air outlet of the second air duct, respectively. The air inlet of the first air duct and the air inlet of the second air duct are arranged on the same side and are connected to each other, and the air inlet of the first air duct and the air inlet of the second air duct are located on the rear cover; The air outlet of the first air duct and the air outlet of the second air duct are arranged on the same side and are connected to each other. The air outlet of the first air duct and the air outlet of the second air duct are located on the side wall of the rear cover.

22. The electronic device according to claim 21, wherein: The first air duct includes a first guide portion and a second guide portion, and the second air duct includes a third guide portion and a fourth guide portion. The first guide portion and the second guide portion are used to guide the cold air to circulate in the first air duct, and the third guide portion and the fourth guide portion are used to guide the cold air to circulate in the second air duct.

23. The electronic device according to claim 22, wherein: At least one of the third guide portion and the fourth guide portion has a shape of at least one of a long strip, an arc, or a bent line segment.

24. The electronic device according to claim 22 or 23, characterized in that: The first guide portion and the second guide portion are relatively arranged between the back cover and the main board along a second direction, the second direction intersects with the first direction, and the first guide portion, the back cover, the second guide portion and the main board together enclose the first air duct.

25. The electronic device according to any one of claims 22 to 24, characterized in that: The middle frame is stacked on the side of the mainboard away from the first air duct along the first direction, and the third guide portion and the fourth guide portion are relatively arranged between the middle frame and the mainboard along the third direction, and the third direction intersects with the first direction. The third guide portion, the middle frame, the fourth guide portion and the mainboard together enclose the second air duct.

26. The electronic device according to any one of claims 21 to 25, characterized in that: Along a direction perpendicular to the first direction, the airflow driving member is located on one side of the main board.

27. The electronic device according to any one of claims 22 to 25, characterized in that: The electronic device also includes a first battery and a second battery, and the first battery and the second battery are arranged at intervals along a third direction on a side of the middle frame facing the mainboard, and the third direction intersects with the first direction. The first battery is located on a side of the third guide portion away from the second air duct, and the second battery is located on a side of the fourth guide portion away from the second air duct. The height of the first battery and the second battery along the first direction is greater than the height of the third guide portion and the fourth guide portion, and the mainboard is arranged between the first battery and the second battery along the third direction.

28. The electronic device according to any one of claims 21 to 27, characterized in that: The electronic device further includes a shielding component, which is disposed on a surface of the mainboard and is distributed in at least one of the first air duct and the second air duct.

29. The electronic device according to claim 28, wherein The shielding member is provided with heat-conducting material at a position corresponding to the heating device provided on the mainboard.

30. The electronic device according to claim 28, wherein A heating device is provided on the mainboard, and the shielding component is provided with an opening to expose the heating device. The heating device is distributed in at least one of the first air duct and the second air duct.

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