Heat dissipation shell of electronic equipment

Abstract

The invention discloses an electronic equipment heat dissipation shell, and relates to the technical field of electronic equipment, and the electronic equipment heat dissipation shell comprises a shell, a threaded hole, a mounting mechanism, a connecting sleeve rod, a fixed rod, a movable door, a first filter screen, a fixed cylinder, a second filter screen, fan blades, a turbulent flow assembly, a cleaning assembly and an efficiency improving assembly. The driving part drives the fan blades to rotate, external airflow is fed into the inner cavity of the shell through the fixing cylinder and then enters the shell through the threaded holes to cool electronic components, the turbulent flow assembly disturbs the airflow, the cooling effect is improved, the second filter screen filters external dust, and the cleaning assembly cleans the second filter screen. When the heat dissipation efficiency is lower than the heating efficiency of the electronic component, the efficiency improving assembly drives the fixing rod to rotate, the fixing rod drives the movable door to rotate, the movable door is opened, the heat dissipation area is increased, the heat dissipation efficiency is improved, and the problems that in the prior art, heat dissipation holes are mostly formed in a shell for heat dissipation, the heat dissipation area is fixed, and the heat dissipation efficiency is poor are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, in particular to a heat dissipation housing of an electronic equipment. Background Art

[0002] Electronic equipment is electrical equipment composed of microelectronic devices. This refers to equipment composed of electronic components such as integrated circuits, transistors, and electron tubes, and powered by electronic technology software. This includes computers, as well as robots controlled by computers, numerical control systems, or program-controlled systems.

[0003] The electronic components inside electronic devices will emit a large amount of heat when working. If this heat is not dissipated in time, it will affect the working efficiency of the electronic components. In the existing technology, most of the heat dissipation holes are opened on the shell to dissipate heat. The heat dissipation area is fixed and the heat dissipation efficiency is poor. Therefore, there is an urgent need for an electronic device heat dissipation shell to solve the above problem. Summary of the Invention

[0004] An object of the embodiments of the present invention is to provide a heat dissipation housing for an electronic device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An electronic device heat dissipation housing comprises a housing, a cavity is provided inside the housing, a sealing door is provided on the front of the housing that can be opened and closed, and further comprises:

[0007] Threaded holes are formed on the housing and communicate with the interior of the cavity, wherein the threaded holes are provided in a plurality of groups;

[0008] A mounting mechanism, threadedly connected to the threaded hole, for mounting electronic components;

[0009] A connecting sleeve rod, one end of which is connected to the side wall of the shell;

[0010] A fixed rod, rotatably connected to the connecting sleeve rod;

[0011] A movable door is connected to the fixed rod and abuts against the side wall of the shell, and the movable door is provided with a plurality of heat dissipation holes;

[0012] A first filter is disposed inside the housing and connected to the inner wall thereof;

[0013] A heat dissipation mechanism, one end of which is connected to the housing and the other end of which is connected to the connecting sleeve rod, is used to dissipate heat inside the housing. The heat dissipation mechanism includes:

[0014] a fixed cylinder connected to the shell and communicating with the internal cavity thereof;

[0015] a second filter screen connected to the fixed cylinder;

[0016] The fan blade is rotatably connected to the fixed cylinder;

[0017] The spoiler assembly is arranged in the cavity of the shell and connected to the fan blades to disrupt the airflow;

[0018] A cleaning assembly, one end of which is connected to the fixed cylinder and the other end of which is connected to the housing, for cleaning the second filter screen;

[0019] The efficiency-enhancing component has one end connected to the shell and the other end connected to the fixing rod, and is used to improve the heat dissipation effect.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention installs the installation mechanism through the threaded hole, and the installation mechanism installs the electronic components. When the interior of the shell is cooled, the driving part drives the fan blades to rotate, and the external air flow is sent into the internal cavity of the shell through the fixed cylinder, and then enters the interior of the shell through the threaded hole to dissipate heat for the electronic components. The spoiler component disrupts the airflow, thereby improving the heat dissipation effect. The second filter screen filters the external dust, and the cleaning component cleans the second filter screen. When the heat dissipation efficiency is lower than the heating efficiency of the electronic components, the efficiency improvement component drives the fixed rod to rotate, and the fixed rod drives the movable door to rotate, so that the movable door opens, increases the heat dissipation area, and thus improves the heat dissipation efficiency. This solves the problem in the prior art that most of the heat dissipation holes are opened on the shell for heat dissipation, the heat dissipation area is fixed, and the heat dissipation efficiency is poor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The figure is a schematic structural diagram of a heat dissipation housing of an electronic device according to an embodiment of the present invention.

[0023] Figure 2 It is a rear view of the housing in the embodiment of the present invention.

[0024] Figure 3 It is a rear cross-sectional view of the shell in an embodiment of the present invention.

[0025] Figure 4 for Figure 1 A magnified schematic diagram of the structure at point A.

[0026] Figure 5 It is a sectional perspective view of the housing in an embodiment of the present invention.

[0027] Figure 6 3D is a three-dimensional diagram of the installation mechanism in an embodiment of the present invention.

[0028] Figure 7 It is a three-dimensional diagram of the fixing cylinder in an embodiment of the present invention.

[0029] In the figure: 1-shell; 2-threaded hole; 3-mounting mechanism; 31-threaded rod; 32-mounting plate; 33-grip ring; 4-connecting sleeve; 5-fixing rod; 6-movable door; 7-first filter; 8-heat dissipation mechanism; 81-fixing cylinder; 82-second filter; 83-fan blade; 84-spoiler assembly; 85-cleaning assembly; 86-efficiency improvement assembly; 841-first connecting cylinder; 842-second connecting cylinder; 843-elastic member; 851-connecting pipe; 852-rotating ring; 853-inclined plate; 854-brush; 861-temperature detector; 862-rotating assembly; 863-adjusting assembly; 8621-connecting frame; 8622-gear; 8623-telescopic member; 8624-tooth plate; 8631-first conductive block; 8632-second conductive block; 8633-third conductive block; 9-shielding plate. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] In the embodiment of the present invention, please refer to Figures 1 to 7 An electronic device heat dissipation housing includes a housing 1, a cavity is provided inside the housing 1, a sealing door is provided on the front of the housing 1, and further includes:

[0032] Threaded holes 2 are formed on the housing 1 and communicate with the interior of the cavity. The threaded holes 2 are provided in a plurality of groups.

[0033] The mounting mechanism 3 is threadedly connected to the threaded hole 2 and is used for mounting electronic components;

[0034] A connecting rod 4, one end of which is connected to the side wall of the housing 1;

[0035] The fixing rod 5 is rotatably connected to the connecting sleeve rod 4;

[0036] The movable door 6 is connected to the fixed rod 5 and abuts against the side wall of the housing 1. The movable door 6 is provided with a plurality of heat dissipation holes;

[0037] The first filter screen 7 is provided inside the housing 1 and connected to the inner wall thereof;

[0038] The heat dissipation mechanism 8 is connected to the housing 1 at one end and to the connecting sleeve 4 at the other end, and is used to dissipate heat inside the housing 1. The heat dissipation mechanism 8 includes:

[0039] The fixed cylinder 81 is connected to the housing 1 and communicates with the internal cavity thereof;

[0040] The second filter screen 82 is connected to the fixed cylinder 81;

[0041] The fan blade 83 is rotatably connected to the fixed cylinder 81;

[0042] The spoiler assembly 84 is disposed in the cavity of the housing 1 and connected to the fan blades 83 to disrupt the airflow;

[0043] A cleaning assembly 85 , one end of which is connected to the fixed cylinder 81 and the other end of which is connected to the housing 1 , is used to clean the second filter screen 82 ;

[0044] The efficiency-enhancing component 86 has one end connected to the housing 1 and the other end connected to the fixing rod 5 for improving the heat dissipation effect.

[0045] A driver (not shown) is located within the fixed cylinder 81. The output end of the driver is connected to the fan blades 83, driving the rotation of the fan blades 83. The mounting mechanism 3 is installed through the threaded hole 2. The mounting mechanism 3 is used to mount electronic components. When cooling the interior of the housing 1, the driver (not shown) drives the fan blades 83 to rotate, directing external airflow through the fixed cylinder 81 into the internal cavity of the housing 1, and then into the interior of the housing 1 through the threaded hole 2 to dissipate heat from the electronic components. The spoiler assembly 84 disrupts the airflow, thereby improving the heat dissipation effect. The second filter 82 filters external dust, and the cleaning assembly 85 cleans the second filter 82. When the heat dissipation efficiency is lower than the heating efficiency of the electronic components, the efficiency enhancement assembly 86 drives the fixed rod 5 to rotate, which in turn drives the movable door 6 to rotate, causing the movable door 6 to open, increasing the heat dissipation area and thereby improving the heat dissipation efficiency. The driver can be a stepper motor, servo motor, or the like.

[0046] As an embodiment of the present invention, please refer to Figure 1 and Figure 6 , the mounting mechanism 3 includes:

[0047] The threaded rod 31 is threadedly connected to the threaded hole 2;

[0048] The mounting plate 32 is rotatably connected to the threaded rod 31;

[0049] The grip ring 33 is connected to the threaded rod 31 .

[0050] By holding the grip ring 33 and rotating it, the grip ring 33 drives the threaded rod 31 to rotate, so that the threaded rod 31 is threadedly connected with the threaded hole 2, and then the mounting plate 32 is installed, and the electronic components are installed on the mounting plate 32. The mounting mechanism 3 can also use bolts to fix the mounting plate 32.

[0051] As an embodiment of the present invention, please refer to Figure 2 and Figure 3, the spoiler assembly 84 includes:

[0052] The first connecting tube 841 is connected to the fan blade 83. The first connecting tube 841 has several groups. The interior of the first connecting tube 841 is connected to the interior of the fixed tube 81. The first connecting tube 841 has several groups of first through holes.

[0053] The second connecting tube 842 is slidably connected to the first connecting tube 841. The second connecting tube 842 is in communication with the interior of the first connecting tube 841. The second connecting tube 842 is provided with a plurality of second through holes.

[0054] One end of the elastic member 843 is connected to the first connecting tube 841 , and the other end is connected to the second connecting tube 842 .

[0055] The fan blades 83 rotate, allowing external airflow to enter the interior of the fixed cylinder 81. Part of the airflow passes through the fixed cylinder 81 and enters the interior of the first connecting cylinder 841 and the second connecting cylinder 842, and is blown out through the first through hole and the second through hole. At the same time, the fan blades 83 drive the first connecting cylinder 841 to rotate, and the first connecting cylinder 841 drives the second connecting cylinder 842 to rotate. Under the cooperation of centrifugal force and elastic member 843, the overall length of the second connecting cylinder 842 and the first connecting cylinder 841 changes, disrupting the airflow and thereby improving the heat dissipation effect. The elastic member 843 can be a spring, a spring, etc.

[0056] As an embodiment of the present invention, please refer to Figure 2 、 Figure 3 、 Figure 5 and Figure 7 , the cleaning component 85 includes:

[0057] A connecting tube 851, one end of which is in communication with the interior of the fixing tube 81, wherein the connecting tube 851 is partially disposed in the internal cavity of the housing 1, and the other end of the connecting tube 851 passes through the housing 1;

[0058] The rotating ring 852 is rotatably connected to the fixed cylinder 81;

[0059] Inclined plates 853 are connected to the rotating ring 852 and are provided in several groups;

[0060] The brush 854 is connected to the rotating ring 852 .

[0061] The connecting tube 851 is made of a flexible material with resilience, so that after being deformed by an external force, it can automatically recover under its own resilience. A one-way valve is provided inside the connecting tube 851 to allow air to flow in one direction inside it. The first connecting tube 841 and the second connecting tube 842 rotate, changing their overall length, causing the second connecting tube 842 to collide with the connecting tube 851. Since the connecting tube 851 is relatively soft, the collision between the two is relatively quiet and does not generate noise. At the same time, the connecting tube 851 deforms, compressing the internal space of the connecting tube 851, causing air to flow out of the port of the connecting tube 851 exposed to the outside of the housing 1. The airflow impacts the inclined plate 853, causing the inclined plate 853 to rotate. The inclined plate 853 drives the rotating ring 852 to rotate, which in turn drives the brush 854 to rotate. The brush 854 cleans the second filter 82. At the same time, the connecting tube 851 itself has a resilient force and automatically recovers after deformation, drawing some of the air that has entered the interior of the fixed tube 81 back into the connecting tube 851, ensuring that there is always air inside the connecting tube 851. The rotating ring 852 is rotatably provided with a ball bearing that abuts the outer wall of the fixed tube 81, ensuring smooth rotation of the rotating ring 852.

[0062] As an embodiment of the present invention, please refer to Figure 1 and Figure 4 , the efficiency improvement component 86 includes:

[0063] The temperature detector 861 is connected to the inner wall of the housing 1 and is used to detect the internal temperature of the housing 1;

[0064] The rotating assembly 862 has one end connected to the housing 1 and the other end connected to the fixed rod 5, and is used to drive the fixed rod 5 to rotate;

[0065] The regulating component 863 is connected to the rotating component 862 and is electrically connected to the temperature detector 861 and the driving component, and is used to regulate the working efficiency of the driving component.

[0066] When the heat dissipation efficiency is lower than the heating efficiency of the electronic components, the temperature inside the housing 1 gradually rises. The temperature detector 861 monitors the temperature inside the housing 1. When the temperature reaches a certain specified value, the temperature detector 861 controls the movement of the rotating assembly 862. The rotating assembly 862 drives the fixed rod 5 to rotate, which in turn drives the movable door 6 to rotate, thereby increasing the heat dissipation area. The rotating assembly 862 drives the adjustment assembly 863 to move. The adjustment assembly 863 adjusts the working efficiency of the driving member, thereby improving the heat dissipation effect. The temperature detector 861 is internally equipped with temperature monitoring electronic components and control components. The temperature monitoring electronic components monitor the temperature and transmit the data to the control components. The control components process and analyze the data and control the movement of the rotating assembly 862.

[0067] As an embodiment of the present invention, please refer to Figure 1 and Figure 4 , the rotating assembly 862 includes:

[0068] Connecting frame 8621, connected to housing 1;

[0069] Gear 8622, connected to the fixed rod 5;

[0070] The telescopic member 8623 has one end connected to the connecting frame 8621;

[0071] The tooth plate 8624 is connected to the other end of the telescopic member 8623 and meshes with the gear 8622.

[0072] Temperature detector 861 controls the operation of telescopic member 8623, which drives toothed plate 8624 to move laterally. Toothed plate 8624 drives gear 8622 to rotate. Gear 8622 drives fixed rod 5 to rotate. Fixed rod 5 drives movable door 6 to rotate, causing movable door 6 to open and increase the heat dissipation area. The telescopic member 8623 can be a pneumatic cylinder, an electric telescopic rod, or the like.

[0073] As an embodiment of the present invention, please refer to Figure 1 and Figure 4 , the adjustment component 863 includes:

[0074] A first conductive block 8631 connected to the connection frame 8621;

[0075] The second conductive block 8632 is connected to the tooth plate 8624;

[0076] The third conductive block 8633 is connected to the connection frame 8621 .

[0077] In the initial state, the first conductive block 8631 is in contact with the second conductive block 8632, and the driving circuit is connected to work, dissipating heat inside the shell 1. When the temperature inside the shell 1 continues to rise, the tooth plate 8624 drives the second conductive block 8632 to move, so that the second conductive block 8632 is in contact with the third conductive block 8633, and the driving circuit is connected to work. At this time, the rotation speed of the driving member is accelerated, thereby improving the heat dissipation effect.

[0078] As an embodiment of the present invention, please refer to Figure 1 , also includes:

[0079] The shielding plate 9 is connected to the movable door 6 and is used to shield the heat dissipation holes.

[0080] The heat dissipation holes on the movable door 6 are shielded by the shielding plate 9 to prevent rainwater from entering the interior of the housing 1 through the heat dissipation holes.

[0081] The working principle of the present invention is as follows: in the initial state, the first conductive block 8631 abuts against the second conductive block 8632, the driving member circuit is connected to work, the movable door 6 abuts against the shell 1, and the driving member drives the fan blade 83 to rotate, sending the external airflow through the fixed cylinder 81 into the internal cavity of the shell 1, and then enters the interior of the shell 1 through the threaded hole 2 to dissipate heat for the electronic components. Part of the airflow enters the first connecting cylinder 841 and the second connecting cylinder 842 through the fixed cylinder 81, and is blown out through the first through hole and the second through hole. At the same time, the fan blade 83 drives the first connecting cylinder 841 to rotate, and the first connecting cylinder 841 drives the second connecting cylinder 842 to rotate. Under the cooperation of centrifugal force and the elastic member 843, the overall length of the second connecting cylinder 842 and the first connecting cylinder 841 changes, thereby disrupting the airflow. Thereby improving the heat dissipation effect, and during the rotation process, the second connecting cylinder 842 collides with the connecting tube 851. Since the connecting tube 851 is relatively soft, the collision sound between the two is small and no noise is generated. At the same time, the connecting tube 851 is deformed, compressing the internal space of the connecting tube 851, so that the airflow flows and flows out from the port of the connecting tube 851 exposed to the outside of the shell 1. The airflow hits the inclined plate 853, causing the inclined plate 853 to rotate, and the inclined plate 853 drives the rotating ring 852 to rotate, and the rotating ring 852 drives the brush 854 to rotate, and the brush 854 cleans the second filter 82. At the same time, the connecting tube 851 itself has a rebound force, and automatically recovers after deformation, and draws part of the gas that has entered the interior of the fixed cylinder 81 into the interior of the connecting tube 851, ensuring that there is always gas inside the connecting tube 851.

[0082] When the heat dissipation efficiency is lower than the heating efficiency of the electronic components, the temperature inside the shell 1 gradually increases, and the temperature detector 861 monitors the temperature inside the shell 1. After reaching a certain specified value, the temperature detector 861 controls the telescopic part 8623 to work, and the telescopic part 8623 drives the tooth plate 8624 to move horizontally, and the tooth plate 8624 drives the gear 8622 to rotate, and the gear 8622 drives the fixed rod 5 to rotate, and the fixed rod 5 drives the movable door 6 to rotate, so that the movable door 6 opens, thereby increasing the heat dissipation area. At the same time, the tooth plate 8624 drives the second conductive block 8632 to move, so that the second conductive block 8632 abuts against the third conductive block 8633, and the driving circuit is connected to work, and at this time the rotation rate of the driving part is accelerated, further improving the heat dissipation effect.

[0083] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0084] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An electronic device heat dissipation housing, comprising a housing, a cavity provided inside the housing, and an openable and closable sealing door provided on the front of the housing, characterized in that: Also includes: Threaded holes are formed on the housing and communicate with the interior of the cavity, wherein the threaded holes are provided in a plurality of groups; A mounting mechanism, threadedly connected to the threaded hole, for mounting electronic components; A connecting sleeve rod, one end of which is connected to the side wall of the shell; A fixed rod, rotatably connected to the connecting sleeve rod; A movable door is connected to the fixed rod and abuts against the side wall of the shell, and the movable door is provided with a plurality of heat dissipation holes; A first filter is disposed inside the housing and connected to the inner wall thereof; A heat dissipation mechanism, one end of which is connected to the housing and the other end of which is connected to the connecting sleeve rod, is used to dissipate heat inside the housing. The heat dissipation mechanism includes: a fixed cylinder connected to the shell and communicating with the internal cavity thereof; a second filter screen connected to the fixed cylinder; The fan blade is rotatably connected to the fixed cylinder; The spoiler assembly is arranged in the cavity of the shell and connected to the fan blades to disrupt the airflow; A cleaning assembly, one end of which is connected to the fixed cylinder and the other end of which is connected to the housing, for cleaning the second filter screen; The efficiency-enhancing component has one end connected to the shell and the other end connected to the fixing rod, and is used to improve the heat dissipation effect.

2. The electronic device heat dissipation housing according to claim 1, characterized in that: The mounting mechanism comprises: A threaded rod, threadedly connected to the threaded hole; a mounting plate, rotatably connected to the threaded rod; Grip ring, connected to the threaded rod.

3. The electronic device heat dissipation housing according to claim 1, characterized in that: The spoiler assembly includes: A first connecting tube is connected to the fan blades. The first connecting tube is provided in a plurality of groups. The interior of the first connecting tube is communicated with the interior of the fixed tube. The first connecting tube is provided with a plurality of groups of first through holes. a second connecting tube, slidably connected to the first connecting tube, the second connecting tube being in communication with the interior of the first connecting tube, and having a plurality of groups of second through holes formed on the second connecting tube; The elastic member has one end connected to the first connecting tube and the other end connected to the second connecting tube.

4. The electronic device heat dissipation housing according to claim 1, characterized in that: The cleaning component comprises: A connecting pipe, one end of which is in communication with the interior of the fixing cylinder, the connecting pipe being partially disposed in the interior cavity of the shell, and the other end of which passes through the shell; A rotating ring, rotatably connected to the fixed cylinder; Inclined plates are connected to the rotating ring, and the inclined plates are provided in several groups; A brush is connected to the rotating ring.

5. The electronic device heat dissipation housing according to claim 1, characterized in that: The efficiency improvement components include: A temperature detector is connected to the inner wall of the shell and is used to detect the temperature inside the shell; A rotating assembly, one end of which is connected to the housing and the other end of which is connected to the fixed rod, for driving the fixed rod to rotate; The regulating component is connected to the rotating component and is electrically connected to the temperature detector and the driving component, and is used to regulate the working efficiency of the driving component.

6. The electronic device heat dissipation housing according to claim 5, characterized in that: The rotating assembly comprises: A connecting frame connected to the housing; a gear connected to the fixed rod; A telescopic member, one end of which is connected to the connecting frame; The tooth plate is connected to the other end of the telescopic member and meshes with the gear.

7. The electronic device heat dissipation housing according to claim 6, characterized in that: The adjustment component includes: a first conductive block connected to the connection frame; a second conductive block connected to the tooth plate; The third conductive block is connected to the connection frame.

8. The electronic device heat dissipation housing according to claim 1, characterized in that: Also includes: The shielding plate is connected to the movable door and is used to shield the heat dissipation holes.

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