Mass transfer equipment

Abstract

The invention discloses a huge transfer device, and relates to the technical field of huge transfer, the huge transfer device is used for transferring crystal grains of an upper substrate to a lower substrate, the huge transfer device comprises a machine table, a jig system and a laser system, the jig system comprises an upper jig module and a lower jig module which are arranged on the machine table, and the laser system comprises a laser system and a control system. The upper jig module is used for fixing the upper substrate; the laser system comprises a laser device, a homogenizer, a diaphragm and a laser head, the homogenizer and the diaphragm are sequentially arranged between the laser device and the laser head, the homogenizer is used for homogenizing laser into flat-topped light, the diaphragm is used for shaping the laser, the laser head is used for emitting the laser, and the laser head is used for emitting the laser. And transferring the crystal grains of the upper substrate to the lower substrate. According to the technical scheme provided by the invention, the ablation quality of the huge transfer equipment is improved, and the transfer efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of mass transfer technology, and in particular to a mass transfer device. Background Art

[0002] In the manufacturing process of LED devices, mass transfer technology plays a vital role. Micro-LED is usually manufactured on a semiconductor substrate and needs to be transferred to the driving backplane through sophisticated technology. The number of pixels transferred in Micro-LED display technology is very large, and is usually transferred through mass transfer technology. In laser mass transfer, it is generally necessary to carry the upper substrate by the upper loading platform and the lower substrate by the unloading platform, and to use laser ablation to make the grains attached to the upper substrate fall to the designated area of ​​the lower substrate to achieve the purpose of transfer. However, in the related art, the energy of the laser spot emitted by the laser emitter is Gaussian distributed, the energy in the middle area of ​​the spot is large and the energy in the edge area is small, which affects the peeling of the grains at the edge of the upper substrate and is not conducive to the transfer quality of the mass transfer equipment. Summary of the Invention

[0003] The main purpose of the present invention is to provide a mass transfer device, aiming to improve the ablation quality of the mass transfer device and improve the transfer quality.

[0004] To achieve the above objectives, the present invention proposes a mass transfer device for transferring dies from an upper substrate to a lower substrate, the mass transfer device comprising:

[0005] Machine;

[0006] A fixture system, comprising an upper fixture module and a lower fixture module provided on the machine, wherein the upper fixture module is used to fix the upper substrate; and

[0007] A laser system includes a laser, a homogenizer, an aperture and a laser head. The homogenizer and the aperture are arranged in sequence between the laser and the laser head. The homogenizer is used to homogenize the laser into a flat-top light, the aperture is used to shape the laser, and the laser head is used to emit laser light to transfer the grains on the upper substrate to the lower substrate.

[0008] In one embodiment, the laser system further comprises a beam expander, which is disposed between the laser and the homogenizer and is used to expand the laser beam;

[0009] And / or, the laser system also includes multiple reflectors, the optical path between the homogenizer and the laser head includes a first section, a second section, a third section, a fourth section and a fifth section, which are angled in sequence, one or more reflectors are provided between the first section and the second section, one or more reflectors are provided between the second section and the third section, one or more reflectors are provided between the third section and the fourth section, and one or more reflectors are provided between the fourth section and the fifth section.

[0010] In one embodiment, the laser head is connected to a rangefinder, and the rangefinder is used to measure the distance between the upper substrate and the lower substrate.

[0011] The lower jig module includes a moving device, three leveling components and a placement jig. The three leveling components are arranged between the moving device and the placement jig. The placement jig is used to fix the lower substrate. The leveling component is used to level the placement jig. The placement jig is used to place the lower substrate. The leveling component is electrically connected to the rangefinder.

[0012] In one embodiment, the leveling assembly includes a first joint bearing, a second joint bearing and a leveling electric cylinder, the first joint bearing is arranged between the leveling electric cylinder and the placement jig, and the second joint bearing is arranged between the leveling electric cylinder and the moving device, so that the leveling electric cylinder and the placement jig are articulated, and the leveling electric cylinder and the moving device are articulated.

[0013] In one embodiment, the rangefinder is a spectral confocal displacement sensor.

[0014] In one embodiment, the mobile device includes an X-axis drive component, a first Y-axis drive component, a first Z-axis drive component and a first rotating table, the X-axis drive component is arranged on the machine, the first Y-axis drive component is connected to the output end of the X-axis drive component, the first Z-axis drive component is connected to the output end of the first Y-axis drive component, the first rotating table is connected to the output end of the first Z-axis drive component, and the placement fixture is connected to the output end of the first rotating table.

[0015] In one embodiment, the upper fixture module includes a second Y-axis drive component, a second rotating table and a suction cup plate, the second Y-axis drive component is connected to the machine, the second rotating table is connected to the output end of the second Y-axis drive component, the suction cup plate is connected to the output end of the second rotating table, and the suction cup plate is used to suck the upper substrate.

[0016] In one embodiment, the suction cup plate has a bottom surface for adsorbing the upper substrate, the laser head is arranged on the side of the suction cup plate away from the bottom surface, the suction cup plate is provided with a through cavity, the through cavity is arranged through the bottom surface, and the through cavity is used to avoid the laser emitted by the laser head.

[0017] In one embodiment, the laser system further comprises a bracket and a second Z-axis drive assembly, wherein the bracket is connected to the machine platform, the second Z-axis drive assembly is provided on the bracket, and the laser head is connected to an output end of the second Z-axis drive assembly;

[0018] And / or, the mass transfer device also includes a visual system, the visual system includes a camera module and a lighting component, the camera module is connected to the laser head, the lighting component is connected to the laser head, and the lighting component is arranged around the output end of the camera module.

[0019] In one embodiment, the laser head includes a shell and a galvanometer field lens assembly, the shell is provided with a cavity and a first through hole and a second through hole communicating with the cavity, the galvanometer field lens assembly is arranged in the cavity, the first through hole is used for allowing laser light to enter the galvanometer field lens assembly, and the second through hole is used for allowing the galvanometer field lens assembly to emit laser light.

[0020] The technical solution of the present invention fixes the upper substrate and the lower substrate respectively by the upper fixture module and the lower fixture module. After the upper and lower fixture modules fix the upper and lower substrates in place, the laser system peels the grains on the upper substrate to the lower substrate by ablation. The laser in the laser system is used to generate and emit laser light. At this time, the energy of the laser spot is Gaussian distributed, and the shape of the spot is usually circular or elliptical. Therefore, a homogenizer and an aperture are provided in the laser transmission path of the laser and the laser head. The homogenizer converts the non-uniformly distributed Gaussian beam into a flat-top beam with uniform energy distribution. The homogenized laser then passes through the aperture, which shapes the laser and reshapes the circular or elliptical spot into a rectangular spot. In this way, the laser spot emitted from the laser head is a rectangular spot with uniform energy distribution. The edge of the grain at the edge of the spot also obtains energy consistent with the center of the grain. This is conducive to the laser peeling of the grains on the upper substrate, ensuring that the grains do not shift or overturn during transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 A schematic structural diagram of an optical system in an embodiment of the present invention;

[0023] Figure 2 A schematic structural diagram of a mass transfer device according to an embodiment of the present invention;

[0024] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0025] Figure 4 Another structural schematic diagram of a mass transfer device according to an embodiment of the present invention;

[0026] Figure 5 for Figure 4 A partial enlarged view of point B in the middle;

[0027] Figure 6 A schematic structural diagram of a lower fixture module in an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of the exploded structure of the lower fixture module in one embodiment of the present invention;

[0029] Figure 8 for Figure 7 A partial enlarged view of point C in the middle;

[0030] Figure 9 A schematic diagram of the exploded structure of an upper fixture module in one embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the exploded structure of the upper fixture module in one embodiment provided by the present invention.

[0032] Description of Figure Numbers:

[0033] 100. Mass transfer equipment; 1. Machine; 2. Fixture system; 21. Upper fixture module; 211. Second Y-axis drive assembly; 212. Second rotation table; 213. Suction cup plate; 214. Through hole; 215. Upper substrate; 22. Lower fixture module; 221. Moving device; 2211. X-axis drive assembly; 2212. First Y-axis drive assembly; 2213. First Z-axis drive assembly; 2214. First rotation table; 222. Leveling assembly; 2221. Mounting frame; 2222. Leveling electric cylinder; 2223. Second joint bearing; 2 3. Placement fixture; 231. Placement column; 24. Lower substrate; 3. Laser system; 31. Laser; 32. Homogenizer; 33. Aperture; 34. Laser head; 341. Housing; 342. Galvanometer field lens assembly; 35. Beam expander; 36. Rangefinder; 37. Bracket; 38. Second Z-axis drive assembly; 4. Vision system; 41. Camera module; 42. Illumination element; 5. Optical path; 51. First section; 52. Second section; 53. Third section; 54. Fourth section; 55. Fifth section; 56. Sixth section; 57. Seventh section; 58. Reflector;

[0034] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] Please refer to Figures 1 to 10 As shown, the present invention proposes a mass transfer device 100 for transferring grains from an upper substrate 215 to a lower substrate 24. The mass transfer device 100 includes a machine 1, a fixture system 2 and a laser system 3. The fixture system 2 includes an upper fixture module 21 and a lower fixture module 22 provided on the machine 1. The upper fixture module 21 is used to fix the upper substrate 215; the laser system 3 includes a laser 31, a homogenizer 32, an aperture 33 and a laser head 34. The homogenizer 32 and the aperture 33 are sequentially provided between the laser 31 and the laser head 34. The homogenizer 32 is used to homogenize the laser into a flat-top light, the aperture 33 is used to shape the laser, and the laser head 34 is used to emit laser to transfer the grains from the upper substrate 215 to the lower substrate 24.

[0039] It is understood that the homogenizer 32 refers to an optical element that converts a non-uniformly distributed Gaussian beam into a flat-top beam with uniform energy distribution, and the aperture 33 refers to an optical beam limiting device used to limit the beam divergence angle and adjust the spot shape. It should be noted that a flat-top beam refers to a laser beam with a uniform rectangular or circular spot energy distribution. Optionally, the homogenizer 32 can be implemented using an aspheric lens group or a diffractive optical element, achieving energy homogenization through multi-level beam splitting and superposition. Optionally, the aperture 33 can adopt an adjustable mechanical aperture or a fixed aperture structure to achieve precise control of the beam profile through physical blocking.

[0040] In this embodiment, after the upper fixture module 21 and the lower fixture module 22 fix the upper substrate 215 and the lower substrate 24 in place, the laser system 3 peels off the grains on the upper substrate 215 to the lower substrate 24 by ablation. The laser 31 in the laser system 3 is used to generate and emit laser light. At this time, the energy of the laser spot is Gaussian distributed, and the shape of the spot is usually circular or elliptical. Therefore, a homogenizer 32 and an aperture 33 are provided in the laser transmission path of the laser 31 and the laser head 34. The homogenizer 32 converts the non-uniformly distributed Gaussian beam into a flat-top beam with uniform energy distribution. The homogenized laser then passes through the aperture 33, and the aperture 33 shapes the laser to shape the circular or elliptical spot into a rectangular spot. In this way, the laser spot emitted from the laser head 34 is a rectangular spot with uniform energy distribution. The edge of the grain located at the edge of the spot also obtains energy consistent with the center of the grain. At the same time, it is convenient for the splicing scanning of the spot, which is conducive to the laser peeling of the grains on the upper substrate 215, ensuring that the grains do not shift or overturn during transfer, thereby ensuring the transfer quality and efficiency.

[0041] In actual implementation, the original light beam output by the laser 31 is first processed by the homogenizer 32 and converted into a flat-top beam with uniform energy distribution, eliminating the energy peak in the central area. Subsequently, the aperture 33 spatially shapes the flat-top beam, limits the beam divergence angle through the aperture, and trims the beam edge to form a rectangular light spot. The double-processed light beam is accurately projected by the laser head 34 onto the upper substrate 215, with uniform energy distribution, to avoid insufficient energy at the edge of the grain located at the edge of the light spot, which prevents it from being peeled off. The light spot output by the laser head 34 corresponds to a single grain on the upper substrate 215. Through the high-speed movement of the laser beam, multiple grains at designated positions on the upper substrate 215 can be knocked down one by one to transfer the grains on the upper substrate 215 to the lower substrate 24.

[0042] In one embodiment of the present invention, the laser system 3 further includes a beam expander 35 . The beam expander 35 is disposed between the laser 31 and the homogenizer 32 . The beam expander 35 is used to expand the laser beam.

[0043] In this embodiment, the beam expander 35 is an optical element that changes the diameter of the laser beam, thereby adjusting the laser beam divergence angle to match the incident parameters of the subsequent homogenizer 32. Specifically, the beam expander 35 amplifies the diameter of the original beam at the output end of the laser source, allowing the parallel beam with a reduced divergence angle to enter the homogenizer 32. This facilitates the homogenizer 32 to generate a flat-top spot with uniform energy distribution and also facilitates stable transmission of the laser beam in the optical path 5.

[0044] In one embodiment of the present invention, the laser system 3 further includes a plurality of reflectors 58. The optical path 5 between the homogenizer 32 and the laser head 34 includes a first section 51, a second section 52, a third section 53, a fourth section 54 and a fifth section 55, which are angled in sequence. One or more reflectors 58 are provided between the first section 51 and the second section 52, one or more reflectors 58 are provided between the second section 52 and the third section 53, one or more reflectors 58 are provided between the third section 53 and the fourth section 54, and one or more reflectors 58 are provided between the fourth section 54 and the fifth section 55.

[0045] In this embodiment, the reflector 58 refers to an optical plane mirror with high reflectivity, which can be specifically realized by using a glass substrate with aluminum or dielectric film coated on the surface, and is used to change the laser transmission direction to achieve folding of the optical path 5 .

[0046] Optionally, adjacent optical paths 5 are arranged vertically. The first segment 51 of the optical path 5 transmits light horizontally, the second segment 52 of the optical path 5 transmits light vertically, the third segment 53 of the optical path 5 transmits light horizontally, the fourth segment 54 of the optical path 5 transmits light perpendicular to the horizontal plane, and the fifth segment 55 transmits light horizontally. The fifth segment 55 of the optical path 5 transmits laser light to the laser head 34. The transitions between the optical paths 5 are achieved by reflectors 58. This three-dimensional spatial folding method compresses the optical paths 5, which originally need to extend in a straight line, within a limited height, facilitating the compact layout of the laser system 3 on the machine 1. In actual implementation, the transmission direction of each optical path 5 can be set according to the actual layout requirements.

[0047] Optionally, the optical path 5 between the laser 31 and the homogenizer 32 may include a sixth segment 56 and a seventh segment 57 at an angle. The seventh segment 57 optical path connects to the first segment 51 optical path. The sixth segment 56 optical path is formed by the output optical path of the laser 31. The sixth segment 56 optical path and the seventh segment 57 optical path are deflected by a reflector 58, and the seventh segment 57 optical path and the first segment 51 optical path are deflected by a reflector 58. It will be understood that the provision of multiple reflectors 58 can extend the transmission optical path of the laser and reduce light disturbance.

[0048] In one embodiment of the present invention, the laser head 34 is connected to a rangefinder 36, which is used to measure the distance between the upper substrate 215 and the lower substrate 24. The lower jig module 22 includes a moving device 221, three leveling components 222 and a placement jig 23. The three leveling components 222 are arranged between the moving device 221 and the placement jig 23. The placement jig 23 is used to fix the lower substrate 24. The leveling component 222 is used to level the placement jig 23. The placement jig 23 is used to place the lower substrate 24. The leveling component 222 and the rangefinder 36 are electrically connected.

[0049] In this embodiment, the placement jig 23 is used to place the lower substrate 24. The moving device 221 can drive the mounting platform to move the placement jig 23, thereby adjusting the position of the lower substrate 24 in space to accommodate alignment requirements for the lower substrate 24 and the upper substrate 215 at different positions. A rangefinder 36 is mounted on the laser head 34. Before the laser head 34 emits laser light, the rangefinder 36 is used to detect the distance between the upper and lower substrates 215. The leveling assembly 222 can adjust the level of the lower substrate 24 based on the detection results of the rangefinder 36 to maintain a parallel position between the upper surface of the lower substrate 24 and the lower surface of the upper substrate 215, thereby improving the success rate of die transfer. It is understood that before aligning the upper surface of the lower substrate 24 with the lower surface of the upper substrate 215, the lower surface of the upper substrate 215 can be pre-adjusted to a horizontal state.

[0050] Three leveling assemblies 222 are disposed between the mobile device 221 and the placement jig 23. These assemblies can adjust the distances between at least three locations on the lower substrate 24 and corresponding locations on the upper substrate 215 to be equal, thereby aligning the lower substrate 24 and the upper substrate 215 to a parallel state. This ensures a uniform spacing between the upper and lower substrates 215 during the die transfer process, improving the success rate and accuracy of die transfer. The distances between the three corresponding locations on the upper and lower substrates 215 and 24 can be measured by a rangefinder 36. Alternatively, the rangefinder 36 can directly detect the distances between the three locations on the lower substrate 24 corresponding to the three leveling assemblies 222 and the upper substrate 215. Based on the detection results, the leveling assemblies 222 adjust the heights of the three locations on the lower substrate 24, ultimately aligning the distances between the three locations on the lower substrate 24 and the upper substrate 215, and aligning the upper and lower substrates 215 and 24 to a parallel state. The lower fixture module 22 can achieve the leveling steps of the lower substrate 24 and the upper substrate 215 only through three leveling components 222, which greatly simplifies the structure of the lower fixture module 22 and reduces the production cost of the lower fixture module 22.

[0051] It is understandable that the distance meter 36 not only participates in the leveling step of the upper substrate 215 and the lower substrate 24, but also needs to detect the distance between the upper substrate 215 and the lower substrate 24 before transfer, so that the distance between the upper substrate 215 and the lower substrate 24 meets the transfer conditions of the grains.

[0052] In actual implementation, the mass transfer apparatus 100 includes a control system. This control system can control the rangefinder 36 to detect the distance between the upper substrate 215 and the lower substrate 24 before controlling the laser to be emitted. Based on the detection result, the leveling assembly 222 is controlled to adjust the level of the lower substrate 24 so that the upper substrate 215 and the lower substrate 24 are aligned. The provision of the moving device 221 also enables the transfer of the lower substrate 24 between the loading, processing, and unloading positions.

[0053] Optionally, the three leveling components 222 are all arranged vertically. When arranged vertically, the axis of the leveling electric cylinder 2222 is consistent with the direction of gravity, and can more directly bear and offset the pressure generated by the placement jig 23 and the lower substrate 24 placed thereon. When adjusting the horizontality of the lower substrate 24, the drive of the leveling component 222 can more accurately change the height of the lower substrate 24 in the vertical direction, thereby achieving more precise and stable support and leveling, which is conducive to improving the accuracy and quality of grain transfer. At the same time, the vertical arrangement of the leveling component 222 can also reduce or even avoid the lateral force generated by the leveling component 222 on the placement jig 23 and the lower substrate 24, thereby avoiding the lateral force causing the placement jig 23 and the lower substrate 24 to twist or deform, so that the placement jig 23 and the lower substrate 24 maintain better flatness and stability.

[0054] Optionally, a placement column 231 is provided on a side of the placement jig 23 facing away from the leveling assembly 222 . The placement column 231 includes a plurality of placement columns 231 , and the plurality of placement columns 231 are detachably provided on the placement jig 23 .

[0055] In this embodiment, the lower substrate 24 is placed on multiple placement posts 231 of the placement jig 23. The placement posts 231 provide flat and stable support for the lower substrate 24. The multiple placement posts 231 are dispersed throughout the placement jig 23 to avoid damage to electronic components on the lower substrate 24, which could affect the quality of the lower substrate 24. The detachable placement posts 231 allow users to flexibly adjust their positions to accommodate lower substrates 24 of varying sizes and shapes, enhancing the versatility and adaptability of the lower jig module 22.

[0056] Optionally, the placement jig 23 is provided with a placement groove, and the placement column 231 is arranged at the bottom of the placement groove. When the lower substrate 24 is placed on the placement surface, the side surface of the lower substrate 24 is limited by the wall of the placement groove to ensure that the lower substrate 24 remains fixed in position during the grain transfer process to avoid affecting the transfer quality of the grain.

[0057] In actual implementation, the three leveling assemblies 222 are arranged non-collinearly between the mounting platform and the placement jig 23. In addition to leveling the lower baseboard 24, the leveling assemblies 222 also support the placement jig 23. The three non-collinear leveling assemblies 222 provide stable support for the placement jig 23. The leveling assemblies 222 are connected to the mounting platform and the placement jig 23 using detachable connections, such as snap-fit ​​structures or bolts, to facilitate maintenance and replacement of the leveling assemblies 222, reducing the production and use costs of the lower jig module 22.

[0058] In actual implementation, the placement jig 23 is arranged in a rectangular shape, with three leveling assemblies 222 corresponding to two adjacent corners and a side not adjacent to the two corners of the placement jig 23. This creates a stable triangular arrangement for the three leveling assemblies 222, ensuring stable support for the placement jig 23. This arrangement also allows for greater spacing between the three leveling assemblies 222, facilitating accurate leveling of the placement jig 23 and the lower substrate 24. The force applied to the three leveling assemblies 222 is also more even, ensuring operational stability and extending the service life of the leveling assemblies 222. Alternatively, the placement jig 23 may be arranged in a rectangular, square, or other quadrilateral shape.

[0059] In one embodiment of the present invention, the leveling assembly 222 includes a first joint bearing, a second joint bearing 2223 and a leveling electric cylinder 2222. The first joint bearing is arranged between the leveling electric cylinder 2222 and the placement jig 23, and the second joint bearing 2223 is arranged between the leveling electric cylinder 2222 and the moving device 221, so that the leveling electric cylinder 2222 and the placement jig 23 are articulated, and the leveling electric cylinder 2222 and the moving device 221 are articulated.

[0060] As will be understood, a spherical kinematic pair (SAB) can be implemented using an inner ring with an outer spherical surface and an outer ring with an inner spherical surface. In this embodiment, the leveling cylinder 2222 and the placement jig 23 are connected via a first SAB, and the leveling cylinder 2222 and the moving device 221 are connected via a second SAB 2223. This creates an articulated connection between the leveling cylinder 2222, the placement jig 23, and the moving device 221. This articulation allows the connected components to rotate relative to each other within a certain angular range. This allows the placement jig 23 to flexibly adjust its angle during leveling, better adapting to different leveling requirements. It also effectively prevents the three leveling components 222 from causing bending or deformation of the placement jig 23 and lower base plate 24 during leveling. This articulated connection not only avoids stress concentration caused by restricted relative motion between the moving device 221 and the leveling assembly 222, and between the leveling assembly 222 and the placement jig 23, but also prevents additional torque caused by installation errors in the leveling assembly 222. Optionally, the leveling electric cylinder 2222 may be a micro electric cylinder, so that the leveling electric cylinder 2222 has a smaller volume and a larger thrust, and can meet the leveling requirements of the lower fixture module 22 in a narrow space.

[0061] In actual implementation, the leveling assembly 222 includes a mounting bracket 37, which is connected to the placement jig 23. The mounting bracket 37 forms an installation space on the side facing away from the placement jig 23. The leveling electric cylinder 2222 is connected to the mounting jig through a first joint bearing, and the output end of the leveling electric cylinder 2222 is connected to the moving device 221 through a second joint bearing 2223.

[0062] Optionally, the line connecting the first and second spherical plain bearings 2223 is collinear with the axis of the output shaft of the leveling electric cylinder 2222. During the leveling process, the mounting platform provides support for the leveling assembly 222, which in turn provides support for the placement of the jig 23. The collinear arrangement of the first and second spherical plain bearings 2223 and the leveling electric cylinder 2222 ensures that the force applied by the leveling assembly 222 is transmitted along the axis of the leveling assembly 222, thereby ensuring the stability of the leveling assembly 222 in supporting the placement of the jig 23.

[0063] In one embodiment of the present invention, rangefinder 36 is a spectral confocal displacement sensor. A spectral confocal displacement sensor is a non-contact optical measurement device based on wavelength resolution. Specifically, it can be implemented using a sensor structure with a broad-spectrum light source and a spectroscopic system. The sensor calculates object displacement by analyzing the wavelength offset of reflected light. In mass transfer apparatus 100, this sensor is configured to measure the spacing between upper and lower substrates 215 and 24. Its submicron resolution meets the precision requirements of micron-level grain transfer, while wavelength resolution eliminates measurement errors caused by differences in substrate surface reflectivity.

[0064] Optionally, the rangefinder 36 is located on the side of the upper substrate 215 facing away from the lower substrate 24. In practical implementation, the spectral confocal displacement sensor can transmit a broad spectrum beam of light containing a continuous range of wavelengths through the upper substrate 215 toward the lower surface of the upper substrate 215 and the upper surface of the lower substrate 24. When the beam is focused on the substrate surfaces at different spacings, only specific wavelengths of the reflected light are received by the sensor. A spectroscopic element analyzes the spatial position corresponding to these wavelengths, allowing the precise calculation of the spacing between the upper and lower substrates 215, 24.

[0065] In one embodiment of the present invention, the mobile device 221 includes an X-axis drive component 2211, a first Y-axis drive component 2212, a first Z-axis drive component 2213 and a first rotating table 2214. The X-axis drive component 2211 is arranged on the machine 1, the first Y-axis drive component 2212 is connected to the output end of the X-axis drive component 2211, the first Z-axis drive component 2213 is connected to the output end of the first Y-axis drive component 2212, the first rotating table 2214 is connected to the output end of the first Z-axis drive component 2213, and the placement fixture 23 is connected to the output end of the first rotating table 2214.

[0066] In this embodiment, the driving directions of the X-axis drive assembly 2211, the Y-axis drive assembly, and the first Z-axis drive assembly 2213 are respectively arranged parallel to the X-axis, Y-axis, and Z-axis directions, and the X-axis, Y-axis, and Z-axis are arranged perpendicular to each other. The rotation axis of the first rotating table 2214 is the Z-axis direction. The first rotating table 2214 is used to adjust the angle of the placement fixture 23 and the lower substrate 24 in the plane to facilitate alignment of the lower substrate 24 and the upper substrate 215. In this way, the position of the lower substrate 24 in space can be adjusted, allowing the lower substrate 24 to move quickly and accurately in three-dimensional space. It can also adjust the angle of the lower substrate 24 in the horizontal plane to align the lower substrate 24 and the upper substrate 215.

[0067] In actual implementation, the upper substrate 215 is set parallel to the XY plane, and the placement fixture 23 and the lower substrate 24 are set parallel to the XY plane. The first rotating table 2214 can adjust the projections of the upper substrate 215 and the lower substrate 24 in the XY plane to overlap, so as to facilitate the transfer of grains from the upper substrate 215 to the lower substrate 24.

[0068] In actual implementation, the X-axis drive assembly 2211, the Y-axis drive assembly, and the first Z-axis drive assembly 2213 achieve precise displacement control in the X-axis direction, the Y-axis direction, and the Z-axis direction through transmission components such as motors, lead screws, and guide rails. The first rotating platform 2214 can be formed as a DD motor driven rotating platform.

[0069] In one embodiment of the present invention, the upper fixture module 21 includes a second Y-axis drive assembly 211, a second rotating table 212 and a suction cup plate 213. The second Y-axis drive assembly 211 is connected to the machine 1, the second rotating table 212 is connected to the output end of the second Y-axis drive assembly 211, and the suction cup plate 213 is connected to the output end of the second rotating table 212. The suction cup plate 213 is used to suck the upper substrate 215.

[0070] In this embodiment, the second Y-axis drive assembly 211 is used to drive the suction cup plate 213 and the second rotating stage 212 to translate along the Y-axis. The second rotating stage 212 is used to drive the suction cup plate 213 to rotate about the Z-axis. The suction cup plate 213 has an adsorption end and a fixed end. The fixed end is connected to the output end of the second rotating stage 212. The adsorption end is used to vacuum adsorb the upper substrate 215, so that the upper substrate 215 is suspended in the air, facilitating the drop of the die on the upper substrate 215 onto the lower substrate 24. The suction cup plate 213 secures the upper substrate 215 through vacuum adsorption, preventing deformation or displacement of the substrate caused by mechanical clamping.

[0071] Optionally, the suction cup plate 213 is a supporting plate with negative pressure suction holes, which can be implemented using a porous ceramic substrate in conjunction with a vacuum line, to secure the upper substrate 215 by vacuum suction. The second Y-axis drive assembly 211 and the second rotating table 212 can be used to transfer the upper substrate 215 between the upper and lower material positions and the processing position, facilitating the loading and unloading of the upper substrate 215.

[0072] At the same time, the second Y-axis drive assembly 211 and the second rotating table 212 can also cooperate with the lower substrate 24 to adjust the position of the upper substrate 215 to facilitate the alignment of the upper substrate 215 and the lower substrate 24. When the upper substrate 215 needs to transfer grains with the lower substrate 24, the second rotating table 212 drives the suction cup plate 213 to rotate about the Z-axis, so that the upper substrate 215 reaches the processing position corresponding to the laser head 34. The second Y-axis drive assembly 211 drives the upper substrate 215 to move along the Y-axis, so that the upper substrate 215 and the lower substrate 24 are initially aligned in the Y-axis direction. Afterwards, the X-axis drive assembly 2211, the Y-axis drive assembly, and the first rotating table 2214 adjust the position and angle of the lower substrate 24 to align the upper and lower substrates 24. The leveling assembly 222 then adjusts the parallelism of the lower substrate 24 to ensure that the upper substrate 215 and the lower substrate 24 are parallel. Before processing, the distance between the upper substrate 215 and the lower substrate 24 can be adjusted by the rangefinder 36 and the first Z-axis driving component so that the distance between the upper substrate 215 and the lower substrate 24 meets the processing adjustment.

[0073] In one embodiment of the present invention, the suction cup plate 213 has a bottom surface for adsorbing the upper substrate 215, and the laser head 34 is arranged on the side of the suction cup plate 213 away from the bottom surface. The suction cup plate 213 is provided with a through cavity, which is arranged through the bottom surface. The through cavity is used to avoid the laser emitted by the laser head 34.

[0074] In this embodiment, the suction cup plate 213 uses a vacuum suction structure to secure the upper substrate 215. Its bottom surface is equipped with an array of suction holes to generate negative pressure. A through-hole structure extends through the upper and lower surfaces of the suction cup plate 213, allowing the laser light emitted by the laser head 34 located above the suction cup plate 213 to reach the upper substrate 215.

[0075] In actual implementation, the suction cup plate 213 is fixed to the bottom surface of the upper substrate 215 by vacuum adsorption. The laser head 34 is located on the upper side of the suction cup plate 213. The emitted laser beam passes through the suction cup plate 213 through the through-hole cavity and directly acts on the grains on the upper substrate 215. The axial penetration design of the through-hole cavity creates a physical escape space in the suction cup plate 213, completely eliminating the obstruction of the suction cup plate 213 to the laser path. The port where the through-hole cavity contacts the upper substrate 215 can be equipped with a transparent sealing cover, such as sapphire or quartz, to maintain the vacuum adsorption environment without affecting laser transmission.

[0076] At the same time, the provision of the through cavity can also reduce the weight of the suction cup plate 213, thereby preventing the suspended suction cup plate 213 from bending after prolonged use.

[0077] In one embodiment of the present invention, the laser system 3 further includes a bracket 37 and a second Z-axis drive assembly 38 . The bracket 37 is connected to the machine 1 , the second Z-axis drive assembly 38 is disposed on the bracket 37 , and the laser head 34 is connected to the output end of the second Z-axis drive assembly 38 .

[0078] In this embodiment, the bracket 37 can be arranged in a gantry to support the second Z-axis drive assembly 38, the laser 31, the laser head 34, and the beam expander 35, the homogenizer 32, the aperture 33, the reflector 58, etc. located in the optical path 5. It can be understood that the optical path 5 of the laser system 3 is arranged in a protective shell to prevent interference with the transmission of the laser. The second Z-axis drive assembly 38 is a linear motion mechanism that adjusts the position of the laser head 34 along the Z-axis direction. It is used to accurately control the working distance between the laser head 34 and the lower substrate 24 so that the focusing plane of the laser head 34 coincides with the ablation plane of the upper substrate 215 to accurately peel off the grains on the upper substrate 215. Optionally, the second Z-axis drive assembly 38 can be implemented using a ball screw module driven by a servo motor.

[0079] In one embodiment of the present invention, the mass transfer device 100 also includes a visual system 4, which includes a camera module 41 and a lighting component 42. The camera module 41 is connected to the laser head 34, and the lighting component 42 is connected to the laser head 34. The lighting component 42 is arranged around the output end of the camera module 41.

[0080] In this embodiment, the camera module 41 can detect the position of the upper substrate 215 and the lower substrate 24, so that the laser head 34 can be aligned with the ablation position of the upper substrate 215. At the same time, the camera module 41 can also assist the upper fixture module 21 and the lower fixture module 22 in adjusting their positions to align the upper substrate 215 with the lower substrate 24, so that the grains on the upper substrate 215 can fall accurately into the supporting position of the lower substrate 24. The lighting component 42 is a ring-shaped light source that provides uniform illumination for the camera module 41. It can be implemented by arranging an LED array around the camera lens to eliminate imaging shadows and enhance feature contrast.

[0081] During actual implementation, the bracket 37 is connected and fixed on the machine 1 to form a stable installation reference surface. The second Z-axis drive assembly 38 is installed along the Z-axis direction, and its output end is connected to the laser head 34 through a flange. When the drive assembly is running, the laser head 34 can be adjusted for micron-level displacement in the Z-axis direction. In the visual system 4, the camera module 41 and the lighting component 42 are coaxially installed, and the light emitted by the lighting component 42 is uniformly emitted in a coaxial manner to facilitate accurate photography of the camera module 41. During the grain transfer process, the second Z-axis drive assembly 38 adjusts the height of the laser head 34 in real time according to the feedback data from the rangefinder 36 to ensure that the laser focus is always located on the ablation surface of the upper substrate 215, thereby improving the accuracy and qualification of the ablation.

[0082] In one embodiment of the present invention, the laser head 34 includes a shell 341 and a galvanometer field lens assembly 342. The shell 341 is provided with a cavity and a first through hole and a second through hole connecting the cavity. The galvanometer field lens assembly 342 is arranged in the cavity. The first through hole is used for allowing laser light to enter the galvanometer field lens assembly 342, and the second through hole is used for allowing the galvanometer field lens assembly 342 to emit laser light.

[0083] In this embodiment, housing 341 serves as a supporting structure and includes a cavity for isolating external vibrations and dust interference. The galvanometer field lens assembly 342 is an integrated optical module comprising a scanning galvanometer and a focusing field lens. Specifically, it may employ a combination of a digitally controlled high-speed galvanometer and a telecentric field lens to achieve two-dimensional deflection and focusing of the laser beam, enabling the laser beam to ablate and remove grains from the upper substrate 215. A first through-hole allows the laser to enter galvanometer field lens assembly 342, while a second through-hole allows the galvanometer field lens assembly 342 to extend, ensuring that the laser can be emitted outside the cavity. The integrated design of galvanometer field lens assembly 342 replaces the separate galvanometer drive module and external lens assembly found in conventional devices, making the optical path 5 more compact. In actual implementation, the optical path 5 entering the first through-hole constitutes the fifth segment 55 of the optical path 5. A reflector 58 may be disposed on the exterior of housing 341 to achieve a transition between the fourth segment 54 of the optical path 5 and the fifth segment 55 of the optical path 5. The second through hole is arranged on the bottom wall of the shell, the first through hole is arranged on one side wall of the shell, the other side wall of the shell is connected to the output end of the second Z-axis drive assembly 38, and the visual system 4 and the rangefinder 36 are arranged on the side of the shell away from the second Z-axis drive assembly 38.

[0084] In practice, after entering the housing 341 through the first through-hole, the laser beam is precisely controlled within the cavity by the galvanometer field lens assembly 342. This assembly comprises a galvanometer and a field lens. The galvanometer field lens assembly 342 uses a high-speed galvanometer to adjust the laser deflection angle while simultaneously focusing the beam through the field lens to achieve full coverage of the grains on the upper substrate 215. During processing, the laser head 34, upper substrate 215, and lower substrate 24 are positioned sequentially along the Z-axis.

[0085] It should be noted that the X-axis, Y-axis, and Z-axis drive components in this application refer to drive mechanisms that move in a straight line, which can be implemented using a ball screw module or a linear motor and guide rails. The above description is only an exemplary embodiment of the present invention and does not limit the scope of the invention. All equivalent structural transformations made using the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields within the technical concept of the present invention are included in the scope of the invention's patent protection.

Claims

1. A mass transfer device for transferring dies from an upper substrate to a lower substrate, characterized in that: The mass transfer equipment includes: Machine; A fixture system, comprising an upper fixture module and a lower fixture module provided on the machine, wherein the upper fixture module is used to fix the upper substrate; and A laser system includes a laser, a homogenizer, an aperture and a laser head. The homogenizer and the aperture are arranged in sequence between the laser and the laser head. The homogenizer is used to homogenize the laser into a flat-top light, the aperture is used to shape the laser, and the laser head is used to emit laser light to transfer the grains on the upper substrate to the lower substrate.

2. The mass transfer device according to claim 1, wherein: The laser system further comprises a beam expander, which is arranged between the laser and the homogenizer and is used to expand the laser beam; And / or, the laser system also includes multiple reflectors, the optical path between the homogenizer and the laser head includes a first section, a second section, a third section, a fourth section and a fifth section, which are angled in sequence, one or more reflectors are provided between the first section and the second section, one or more reflectors are provided between the second section and the third section, one or more reflectors are provided between the third section and the fourth section, and one or more reflectors are provided between the fourth section and the fifth section.

3. The mass transfer device according to claim 1, wherein: The laser head is connected to a distance meter, and the distance meter is used to measure the distance between the upper substrate and the lower substrate. The lower jig module includes a moving device, three leveling components and a placement jig. The three leveling components are arranged between the moving device and the placement jig. The placement jig is used to fix the lower substrate. The leveling component is used to level the placement jig. The placement jig is used to place the lower substrate. The leveling component is electrically connected to the rangefinder.

4. The mass transfer device according to claim 3, wherein: The leveling assembly includes a first joint bearing, a second joint bearing and a leveling electric cylinder. The first joint bearing is arranged between the leveling electric cylinder and the placement jig, and the second joint bearing is arranged between the leveling electric cylinder and the moving device, so that the leveling electric cylinder and the placement jig are hinged, and the leveling electric cylinder and the moving device are hinged.

5. The mass transfer device according to claim 3, wherein: The rangefinder is a spectral confocal displacement sensor.

6. The mass transfer device according to claim 3, wherein: The mobile device includes an X-axis drive component, a first Y-axis drive component, a first Z-axis drive component and a first rotating table. The X-axis drive component is arranged on the machine, the first Y-axis drive component is connected to the output end of the X-axis drive component, the first Z-axis drive component is connected to the output end of the first Y-axis drive component, the first rotating table is connected to the output end of the first Z-axis drive component, and the placement fixture is connected to the output end of the first rotating table.

7. The mass transfer device according to any one of claims 1 to 5, characterized in that: The upper fixture module includes a second Y-axis drive component, a second rotating table and a suction cup plate. The second Y-axis drive component is connected to the machine platform, the second rotating table is connected to the output end of the second Y-axis drive component, and the suction cup plate is connected to the output end of the second rotating table. The suction cup plate is used to absorb the upper substrate.

8. The mass transfer apparatus according to claim 7, wherein: The suction cup plate has a bottom surface for adsorbing the upper substrate. The laser head is arranged on the side of the suction cup plate away from the bottom surface. The suction cup plate is provided with a through cavity, which is arranged through the bottom surface. The through cavity is used to avoid the laser emitted by the laser head.

9. The mass transfer device according to any one of claims 1 to 5, characterized in that: The laser system further includes a bracket and a second Z-axis drive assembly, wherein the bracket is connected to the machine platform, the second Z-axis drive assembly is provided on the bracket, and the laser head is connected to the output end of the second Z-axis drive assembly; And / or, the mass transfer device also includes a visual system, the visual system includes a camera module and a lighting component, the camera module is connected to the laser head, the lighting component is connected to the laser head, and the lighting component is arranged around the output end of the camera module.

10. The mass transfer device according to any one of claims 1 to 5, characterized in that: The laser head includes a shell and a galvanometer field lens assembly. The shell is provided with a cavity and a first through hole and a second through hole communicating with the cavity. The galvanometer field lens assembly is arranged in the cavity. The first through hole is used for allowing laser light to enter the galvanometer field lens assembly, and the second through hole is used for allowing the galvanometer field lens assembly to emit laser light.

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