System and method for detecting rotation of vibratory polisher

Abstract

Example systems and methods for detecting motion of a sample undergoing a polishing operation in a vibratory polisher. The system includes a sample holder for holding a sample to be polished. The housing supports a platen on which the sample holder is placed. The platen allows the sample holder to move during the polishing operation, at which time the sample holder traverses the polishing fluid dispensed around the platen. One or more sensors are disposed about the housing, the one or more sensors being operable to monitor movement of the sample holder on the platen relative to the housing.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a non-provisional patent application of U.S. Provisional Patent Application No. 63 / 430,722, filed on December 7, 2022, entitled “Systems And Methods To Detect Rotation Of A Vibratory Polisher,” which is incorporated herein by reference in its entirety. Background Art

[0002] Grinding and polishing operations are performed on samples for numerous purposes across a wide variety of sectors and industries. In some applications, surface preparation of samples through grinding / polishing operations is performed by a grinding / polishing device. For example, a sample can be contained in a sample holder and polished by passing it through a polishing fluid. The amount of time the sample holder is polished determines the amount of polish applied to the sample. However, timing is often an unreliable proxy for the amount of polish applied to a sample. Therefore, a more reliable measurement of the amount of polish applied to a sample is desired. Summary of the Invention

[0003] A system and method for detecting rotation of a sample being polished in a vibratory polisher is disclosed, substantially as illustrated by and described in conjunction with at least one of the accompanying drawings, as more fully set forth in the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 An example system for polishing a sample in a sample holder according to aspects of the present disclosure is illustrated.

[0005] Figure 2 Pictured Figure 1 A top view of an example system.

[0006] Figure 3 Example methods for detecting rotation of a sample being polished in a vibratory polishing machine are provided according to aspects of the present disclosure.

[0007] The accompanying drawings are not necessarily drawn to scale. Where appropriate, similar or identical reference numbers are used to designate similar or identical components. DETAILED DESCRIPTION

[0008] Disclosed are systems and methods for detecting movement of a sample undergoing a polishing operation in a vibratory polisher. Specifically, the system includes a sample holder for securing the sample to be polished. A housing supports a platen on which the sample holder rests. The platen allows movement of the sample holder during the polishing operation, as the sample holder passes over polishing fluid dispensed around the platen. One or more sensors are disposed around the housing and are operable to monitor movement of the sample holder on the platen relative to the housing.

[0009] The disclosed polishing system and method employs a polishing system to perform a polishing operation on one or more samples. The polishing system may be a vibratory polishing system that includes a platen on which a sample, a set of samples, and / or a sample holder (e.g., a disk) is placed. During the polishing operation, the platen contains a polishing fluid and serves as a polishing surface over which the sample moves.

[0010] For example, a vibrating device (such as a vibrating bowl) is supported or otherwise connected to a platen, thereby forcing a sample across a polishing fluid (e.g., an abrasive fluid) on a vibrating polishing surface. The sample is often rotated about the inner circumference of the platen (surrounded by one or more bumpers), thereby polishing the sample.

[0011] Conventionally, a timer will provide the duration of time that a sample is on the polishing surface, wherein the amount of polishing performed on the sample is related to the amount of time associated with the experiment. However, the timer does not take into account the speed of motion, resulting in an inaccurate determination of the amount of polish on the sample.

[0012] In the disclosed examples, one or more sensors are positioned within, around, and / or in communication with the polishing system to monitor the motion, velocity, and / or position of the sample during the polishing operation. In other words, the number of rotations is used as an indicator of the amount of polishing performed on the sample. Therefore, the amount of polish on the sample is more closely related to the sample's motion and, therefore, the polishing action.

[0013] In some examples, the sensor is in electrical communication with a control system that is operable to monitor the position and / or relative motion of the sensor. Specifically, the system is operable to track the number of rotations and / or the periodic rotation rate of the sample(s) as they travel within the polishing system (e.g., around a circular path, in revolutions per unit time (e.g., revolutions per minute (RPM))). In this manner, the sensor data provides an accurate means of calculating and / or otherwise determining the distance traveled by the sample along the polishing surface in a given amount of time. Thus, the disclosed systems and methods can determine the total travel (e.g., rotational) distance, travel rate, and / or total number of rotations around the platen during a polishing operation by employing sensors and / or timers to indicate an end-of-cycle notification.

[0014] In the disclosed systems and methods, one or more sensors for detecting the sample holder can be arranged at predetermined fixed locations around the travel surface. As a list of non-limiting examples, these sensors can be integrated into the bowl surrounding the circular vibrating polishing surface, along the edge of the polishing surface, and / or on the exterior of the housing. As the sample holder disk circulates, the sensors detect the movement of the sample holder disk.

[0015] In some examples, one or more of these sensors can be specially designed to collect data corresponding to a particular sample, sample holder, and / or application. For example, one or more of these sensors can be installed in different ways with other sensors, such as installed with different horizontal and / or vertical orientations to monitor specific data. This unique orientation allows a given sensor to identify a particularly interesting disk, such as a front disk or rear disk, and / or other aspects of interest (e.g., size, relative to the speed of another sample holder, a sample or the physical properties of the sample holder, etc.) of a plurality of sample holders. Using the sensor data, a computer or controller will algorithmically determine the various aspects of the sample holder when the sample holder advances, and adjust frequency and / or amplitude (e.g., controlling vibration rate and therefore the power of the motion of the sample) in real time, while providing a cycle progress notification to the operator.

[0016] Advantages of the disclosed systems and methods include, but are not limited to, providing dynamic determination of the completion of a polishing operation based on distance traveled and / or rate. Furthermore, by employing distance traveled monitoring, monitoring actual motion around the polishing surface (rather than just time) provides for a more predictable and / or repeatable polishing operation for a given sample and / or system.

[0017] In some examples, detecting travel rate / speed changes can provide other improvements to the operator and / or polishing operation. As a non-limiting list of examples, determining sample motion can be used to determine low polishing fluid levels (and provide corresponding notifications); automatic polishing rate optimization of power and frequency (e.g., to control system vibration and sample speed); and / or identify sample holder performance issues.

[0018] In a disclosed example, a system for performing a polishing operation on a sample includes a sample holder for securing a sample to be polished; a housing for supporting a platen operable to allow movement of the sample holder during the polishing operation; and one or more sensors for monitoring movement of the sample holder relative to the housing.

[0019] In some examples, the controller is operable to receive data from the one or more sensors. In one example, the controller counts the number of rotations of the sample holder relative to the housing; and determines an amount of polishing of the sample based on the number of rotations. In one example, the controller determines a distance traveled by the sample based on the number of rotations. In one example, the controller controls one or more operating parameters of the system based on the number of rotations.

[0020] In some examples, the one or more operating parameters is the rotation speed of the sample.

[0021] In some examples, an actuator is included to control the movement of the sample holder. In some examples, a controller is operable to control the actuator to adjust the rotational speed of the sample holder based on measurements from one or more sensors. In some examples, a bowl is coupled to the actuator, and the actuator is configured to cause the bowl to vibrate to move the sample holder.

[0022] In some examples, the one or more sensors include a magnetic sensor, a Hall effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

[0023] In some examples, one or more sensors are disposed in a fixed position relative to the housing or the platen, each of the one or more sensors being operable to detect movement of the sample holder as the sample holder moves about the platen.

[0024] In some examples, a user interface is mounted on the housing, and the user interface is used to provide information or instructions to an operator, or receive commands from an operator.

[0025] In some examples, one or more sensors are disposed within a system that includes one or more of a housing, a cover, or a deck.

[0026] In some disclosed examples, a system for performing a polishing operation on a sample includes a sample holder for securing a sample to be polished, a bowl for vibrating the sample holder, and one or more sensors for monitoring movement of the sample holder relative to the bowl.

[0027] In some examples, an actuator is used to control the rate of vibration of the bowl, and thereby the rate of movement of the sample holder.

[0028] In some examples, the controller is operable to receive data from the one or more sensors; count a number of rotations of the sample holder relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

[0029] In an example, the controller compares the number of rotations of the sample holder to a list of numbers of rotations corresponding to polishing amounts; and determines the polishing amount of the sample based on the number of rotations.

[0030] In some examples, the sample holder includes a sensor tag operable to be read by the one or more sensors. In some examples, the sample holder includes a material operable to trigger the one or more sensors. In an example, the material is a ferrous metal.

[0031] In some disclosed examples, a system for performing a polishing operation on a sample includes: a sample to be polished; a housing for supporting a platen operable to allow movement of the sample during the polishing operation; and one or more sensors for monitoring movement of the sample relative to the housing.

[0032] In some examples, the controller is operable to receive data from the one or more sensors; count a number of rotations of the sample relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

[0033] In some examples, the controller is operable to receive data from the one or more sensors; and determine one or more characteristics of the sample based on the data.

[0034] In some examples, the one or more characteristics include a type of sample, a color of the sample, a temperature of the sample, a consistency of the sample, or a material characteristic of the sample.

[0035] As used herein, the word "exemplary" means "serving as an example, instance, or illustration." The embodiments described herein are not limiting, but merely exemplary. It should be understood that the described embodiments are not necessarily to be construed as preferred or advantageous over other embodiments. Furthermore, the term "embodiment" does not require that all disclosed embodiments include the discussed feature, advantage, or mode of operation.

[0036] As used herein, “and / or” refers to any one or more of the multiple items connected by “and / or” in a list. As an example, “x and / or y” refers to any element in the three-element set {(x), (y), (x, y)}. In other words, “x and / or y” refers to “one or both of x and y”. As another example, “x, y and / or z” refers to any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and / or z” refers to “one or more of x, y and z”. As used herein, the term “exemplary” refers to serving as a non-limiting example, instance, or diagram. As used herein, the terms “e.g.” and “for example” introduce a list of one or more non-limiting examples, instances, or diagrams.

[0037] To facilitate an understanding of the principles of the claimed technology and to present its best currently understood mode of operation, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe these embodiments. It will be understood, however, that this is not intended to limit the scope of the claimed technology, as such alterations and further modifications of the apparatus illustrated herein and such further applications of the principles of the claimed technology illustrated herein are within the ordinary course of thought of one skilled in the art to which the claimed technology pertains.

[0038] Figure 1 An example polishing system 100 is shown, which includes a sample holder 104 for supporting a sample 101 to be subjected to a processing operation such as polishing and / or grinding. A housing 106 can receive the sample holder 104 and / or the sample 101 itself and is operable to move the sample holder 104. In some examples, a motor or other actuator 108 (e.g., an electromagnet actuator, a solenoid, etc.) is disposed in the housing 106 and is operable to vibrate, rotate, and / or otherwise rotate the sample 101 and / or the sample holder 104. In some examples, the sample holder 104 is mounted to or otherwise secured by a bowl 103, which is configured to rotate, vibrate, or otherwise rotate the sample holder 104.

[0039] In an example, during a polishing operation, one or more sensors 110 are arranged around the sample holder 104. In some examples, the sensors 110 communicate with a controller or control circuitry 114 via a sensor connection 120. For example, each time the sample holder 104 passes by a sensor 110, the sensor 110 is triggered. This triggering generates a response (e.g., a signal), which can be transmitted via the sensor connection 120. Each such signal is received at the controller 114 to increment a counter value, which can be used to determine the amount of polishing of the sample.

[0040] In some examples, interface 112 provides a connection between sensor 110 and controller 114, which may be located within housing 106. For example, interface 112 may be one or more of a contact-based interface and / or a contactless interface, and may include physical connections (e.g., conduits, wiring, circuit elements, etc.) and / or electrical connections (e.g., wireless transceivers, inductive switches, etc.). Interface 112 allows signals containing data (corresponding to sensor measurements) to be transmitted to controller 114 for analysis. A user interface 116 may be mounted on housing 106 to provide information and / or instructions to an operator and may be operable to receive commands.

[0041] In some examples, the controller 114 is operable to control one or more parameters of the polishing operation in response to the motion data. For example, the controller 114 can increase and / or decrease the speed of the sample holder 104 around the platen 102 (e.g., by controlling the actuator 108). This can include completely stopping the motion.

[0042] The controller 114 is further operable to cause the user interface 116 to display information during the polishing operation regarding the duration, number of rotations, and / or an estimate of the progress of the polishing. In some examples, the controller 114 is connected to a remote device (e.g., a tablet, a smartphone, a network, a remote computer, etc.), and information can be transmitted (via wired or wireless) to such a device.

[0043] Figure 2 Pictured Figure 1 As shown, sensors 110 are arranged around the circumference of platen 102 such that rotational movement of sample holder 104 (along arrow 105) causes sample holder 104 to move across platen 102 (e.g., in direction 107) by contacting supports, walls, or boundaries 109 surrounding platen 102.

[0044] Sensor 110 can be an electrical sensor, a contact sensor, and / or a contactless sensor (e.g., a magnetic sensor, a Hall effect sensor, an optical sensor, an inductive sensor, a mechanical sensor, an imaging device, etc.), and can be integrated within boundary 109 and / or elsewhere around housing 106. In some examples, boundary 109 serves as a support around the vibrating polishing surface of platen 102 to guide the motion of the sample holder.

[0045] In some examples, one or more sensors 110A can be mounted within the housing 106, such as beneath the platen 102. Advantageously, the sensors within the housing 106 are connected to the controller 114 without the use of external sensors or cables. Thus, the sensors and / or cables are not exposed to the polishing environment (e.g., chemicals) and may not come into contact with any moving, vibrating, and / or rotating parts.

[0046] In some examples, multiple sensors, including sensors of multiple types, may be arranged in system 100. For example, sensor 110 may be a first type of sensor, while sensor 110A may be a second, different type of sensor. Figure 2A As shown, another sensor 110B may be disposed in the cover 122 .

[0047] These sensors are in electrical communication (e.g., via wires and / or wirelessly) to transmit sensor data to controller 114. In some examples, sensor 110 itself may have wires, traces, conduits, and / or other communication interfaces that connect directly to controller 114, while in other examples, sensor 110 may transmit signals to controller 114 via a connector 120. In some examples, one or more of the sensors, connectors, traces, wires, traces, conductors, etc., are not exposed and therefore not visible to an operator. In some examples, the sensors and / or associated connectors are shielded from environmental contaminants by covers, surface treatments, housings, etc., thereby ensuring that the sensors and connectors are protected from corrosive chemicals.

[0048] In some examples, an imaging device can be used to capture an image of the sample holder during the polishing operation. Such an image can capture various parameters of the sample holder, such as color, size, shape, temperature, and also capture indicia corresponding to information about the sample or sample holder, such as a barcode, quick-release code, text, an image, etc. The image and / or information extracted from the image can be transmitted to the controller 114 to determine one or more characteristics of the sample or sample holder, including speed, type of sample, or type of sample holder (as a non-limiting list of examples).

[0049] In some examples, the platen 102, the boundary 109, the bowl 103, and / or the sensor 110 itself are configured to be removed from the housing 106. In such examples, an electrical connector can be disposed on one or more of the aforementioned components so that a connection can be established between the sensor 110 and the controller 114 (e.g., via the connector 120).

[0050] In some examples, the sample holder 104 (or the disc) may include one or more features and / or characteristics that facilitate sensor operation and measurement. For example, and as a non-limiting list of examples, such features / characteristics include one or more of an optical target, metallic composition, sample holder height, a feature having a certain shape, and a radio frequency tag (e.g., RFID). Specifically, as the sample holder passes by the corresponding sensor, the features / characteristics may trigger a response (e.g., transmitting a signal, incrementing a counter, etc.).

[0051] Although three sensors 110 are illustrated in some examples, a single sensor may be used, as well as four or more sensors to suit any particular application.

[0052] Figure 3 A flow chart showing example instructions 300 is shown, which may be executed by an operator and / or Figure 1 The controller / control circuitry 114 is executed to detect the rotation of a sample being polished in a vibratory polisher, as disclosed herein. In block 302, a sample is placed in a sample holder. In block 304, the sample holder is placed on a platen, which may be coated with a polishing fluid. In block 306, the vibratory polisher is activated, causing the sample holder to move across the platen. In block 308, one or more sensors monitor the movement of the sample holder relative to the housing of the vibratory polisher.

[0053] In block 3010, motion information from the sensor is transmitted to and received by the control circuitry. In block 312, the control circuitry counts the number of rotations and / or the frequency with which the sensor moves past the sensor based on the received motion information. In block 314, the control circuitry determines (e.g., calculates) one or more parameters associated with the sample holder's motion based on the number of rotations. For example, as a non-limiting list of examples, the parameters may include one or more of the amount of distance traveled, the speed of travel, or the number of rotations around the platen.

[0054] In block 316, the control circuitry compares the determined or calculated parameters associated with the sample holder with a list of parameters corresponding to the polishing amount. This list may be stored (e.g., by the control circuitry) in a memory within system 100 and / or in a remote device. In block 318, the polishing amount is determined based on the comparison. In some examples, the control circuitry may calculate the polishing amount based on an equation and relevant variables without accessing the list. In block 320, the polishing amount is transmitted to, displayed to, or otherwise used by an operator or other system.

[0055] In some additional or alternative examples, in block 322, the control circuitry may be operable to control the motor to adjust the rotational speed of the sample holder based on the determined or calculated parameters to adjust the polishing amount or polishing rate.

[0056] The present method and system may be implemented in hardware, software, and / or a combination of hardware and software.Example embodiments include application specific integrated circuits and / or programmable control circuits.

[0057] The foregoing description and accompanying drawings illustrate principles, preferred embodiments, and modes of operation. However, the present disclosure should not be construed as being limited to the specific embodiments discussed above. Those skilled in the art will appreciate additional variations of the embodiments discussed above.

[0058] Although the present method and / or system has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and / or system. In addition, many modifications may be made to adapt particular circumstances or materials to the teachings of the present disclosure without departing from the scope of the present disclosure. For example, the frames and / or components of the disclosed examples may be combined, divided, rearranged and / or otherwise modified. Therefore, the present method and / or system is not limited to the specific embodiments disclosed. Rather, the present method and / or system will include all embodiments that fall within the scope of the appended claims, both literally and under the doctrine of equivalents. Although the controller and method are described as being used for grinding / polishing and / or hardness / density testing systems, these teachings may be similarly applied to other systems and operations.

[0059] All documents cited herein (including journal articles or abstracts, published or corresponding U.S. or foreign patent applications, issued or foreign patents, or any other documents) are each incorporated by reference in their entirety, including all data, tables, figures, and text presented in the cited documents.

Claims

1. A system for performing a polishing operation on a sample, the system comprising: a sample holder, the sample holder being used to fix the sample to be polished; a housing for supporting a platen operable to allow movement of the sample holder during a polishing operation; and One or more sensors for monitoring movement of the sample holder relative to the housing.

2. The system of claim 1 , further comprising: A controller is operable to receive data from the one or more sensors.

3. The system of claim 2, wherein: The controller is further operable to: counting the number of rotations of the sample holder relative to the housing; and The polishing amount of the sample is determined based on the number of rotations.

4. The system of claim 2, wherein: The controller is further configured to control one or more operating parameters of the system based on the number of rotations.

5. The system of claim 4, wherein: The one or more operating parameters is the rotation speed of the sample.

6. The system of claim 2, further comprising: An actuator for controlling the movement of the sample holder.

7. The system of claim 6, wherein: The controller is operable to control the actuator to adjust the rotational speed of the sample holder based on measurements from the one or more sensors.

8. The system of claim 6, further comprising: A bowl is connected to the actuator, the actuator being configured to cause the bowl to vibrate to move the sample holder.

9. The system of claim 1, wherein: The one or more sensors include a magnetic sensor, a Hall effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

10. The system of claim 1, wherein: The one or more sensors are arranged in a fixed position relative to the housing or the platen, and each of the one or more sensors is operable to detect movement of the sample holder as the sensor moves around the platen, wherein the one or more sensors are arranged within the system, and the system includes one or more of the housing, the cover, or the platen.

11. A system for performing a polishing operation on a sample, the system comprising: a sample holder, the sample holder being used to fix the sample to be polished; a bowl for vibrating the sample holder; as well as One or more sensors for monitoring movement of the sample holder relative to the bowl.

12. The system of claim 11, further comprising: An actuator for controlling the rate of vibration of the bowl and thereby the rate of movement of the sample holder.

13. The system of claim 11, further comprising: a controller operable to: receiving data from the one or more sensors; counting the number of rotations of the sample holder relative to the bowl; as well as The polishing amount of the sample is determined based on the number of rotations.

14. The system of claim 13, wherein: The controller is further operable to: comparing the number of rotations of the sample holder to a list of rotations corresponding to amounts of polishing; and The polishing amount of the sample is determined based on the number of rotations.

15. The system of claim 11, wherein: The sample holder includes a sensor tag operable to be read by the one or more sensors.

16. The system of claim 11, wherein: The sample holder includes a material operable to trigger the one or more sensors.

17. The system of claim 16, wherein: The material is a ferrous metal.

18. A system for performing a polishing operation on a sample, the system comprising: Sample to be polished; a housing for supporting a platen operable to allow movement of the sample during a polishing operation; as well as One or more sensors for monitoring movement of the sample relative to the housing.

19. The system of claim 18, further comprising: a controller operable to: receiving data from the one or more sensors; counting the number of rotations of the sample relative to the housing; as well as The polishing amount of the sample is determined based on the number of rotations.

20. The system of claim 18, further comprising: a controller operable to: receiving data from the one or more sensors; as well as One or more characteristics of the sample are determined based on the data, wherein the one or more characteristics include a type of sample, a color of the sample, a temperature of the sample, a consistency of the sample, or a material characteristic of the sample.

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