Fluid-flowable cooler for cooling electrical and / or electronic components

Abstract

The invention relates to a cooler (100) through which a fluid can flow for cooling an electrical and / or electronic component (200). The cooler (100) comprises a cooling channel (103), through which a fluid can flow, and a cooling structure (106), which is arranged in the cooling channel (103). A wall (111; 111 ') of the cooling channel (103) is provided. 112) of the inner surface (1; 2) has a connecting region (6) and an edge region (5). The connecting region (6) is connected to the cooling structure (106), and the edge region (5) is not connected to the cooling structure (106).

Description

Technical Field

[0001] The invention relates to a cooler through which a fluid can flow for cooling an electrical and / or electronic component, and to an electrical and / or electronic device having such a cooler and at least one electrical and / or electronic component. Background Art

[0002] Power modules, such as inverter structures or converter structures, are used in hybrid vehicles or electric vehicles. For example, inverters that provide phase current to an electric motor are used to operate the electric motor. The power module can, for example, include a carrier substrate with conductor tracks, on which power semiconductors, for example, are arranged, which together with the carrier substrate form an electronic unit. During operation, the electronic unit generates heat that must be dissipated. To this end, the electronic unit is thermally connected to a cooler. Known coolers are provided with cooling channels through which a coolant can flow and which dissipates heat from the cooler. Turbulence structures, such as turbulence inserts, can be provided in the cooling channels of the cooler to ensure better heat dissipation from the coolant flowing through the cooler. The turbulence structures generate turbulence and increase the cooling surface. Summary of the Invention

[0003] The fluid-permeable cooler for cooling electrical and / or electronic components according to the present invention has the following advantages: it enables a more stable connection of the electrical and / or electronic components to the cooler while maintaining good cooling performance. This is achieved by partially connecting the cooling structure, in particular the turbulence insert, to a certain area of ​​the cooler, as this reduces stress in at least one connection layer connecting the electrical and / or electronic component to the cooler. Consequently, potential cracks in at least one connection layer can be avoided or crack propagation can be slowed, thereby maintaining the connectability of this layer. The fluid-permeable cooler for cooling electrical and / or electronic components comprises: a cooling channel through which the fluid can flow; and a cooling structure arranged in the cooling channel. The inner surface of the wall of the cooling channel has a connection region and an edge region, wherein the connection region is connected to the cooling structure and the edge region is not connected to the cooling structure. In particular, the connection region is materially connected to the cooling structure. In other words, the connection of the cooling structure to the inner surface of the wall of the cooling channel is separated / interrupted in the edge region. This means, in particular, that only the connection region is connected to the cooling structure. This reduces the stress caused by the different thermal expansion coefficients of the components of the cooler (e.g., the cooling channel wall and one / multiple walls of the cooling structure and / or the electrical and / or electronic components and / or at least one connecting layer). Consequently, the resulting different lengths / bends on at least one connecting layer can also be reduced. This makes it possible to avoid interruptions or reductions in contact between the electrical and / or electronic components and the cooler, which would otherwise result in the electrical and / or electronic components being unable to be cooled or at least unable to be cooled effectively. The edge region advantageously extends in the longitudinal and width directions of the cooler and / or cooling channel. The longitudinal direction preferably corresponds to the flow direction of the fluid flowing into / through the cooling channel. It should be understood that the inner surface of the wall advantageously faces the cooling channel. It should also be understood that the edge region advantageously corresponds to an area of ​​the inner surface that extends from one end of the inner surface of the wall of the cooling channel or begins at one end of the inner surface of the wall of the cooling channel. Advantageously, the entire edge region faces the cooling channel. The inner surface of the wall of the cooling channel can also preferably have two edge regions together with a connecting region located in the middle, the two edge regions not being connected to the cooling structure.

[0004] The dependent claims reveal preferred developments of the invention.

[0005] Advantageously, the edge region adjoins the connecting region. In particular, the inner surface can have only the edge region and the connecting region.

[0006] The cooler through which fluid can flow preferably also includes (at least) a cover plate and (at least) a base plate, which are connected to each other and define a cooling channel. In this case, the above-mentioned inner surface of the wall of the cooling channel advantageously corresponds to at least one area of ​​the inner side of the cover plate or the base plate.

[0007] The cover plate can preferably be designed to be flat.

[0008] Preferably, the cover plate and / or the base plate each have a constant thickness.The cover plate and the base plate can have the same or different thicknesses.

[0009] According to an advantageous embodiment, the base plate, in particular a deep-drawn plate, has a recess covered by the cover plate, so that a cooling channel is formed in the recess of the base plate between the base plate and the cover plate. The cooling structure is located in this cooling channel. This results in a compact, easy-to-manufacture cooler.

[0010] The cover plate and / or the cooling structure and / or the base plate are preferably designed as plates.

[0011] The cover and base advantageously form the housing of the cooler. Preferably, the housing consists solely of the cover and base. This provides a simple and very compact cooler with high cooling performance. The interior of the housing preferably corresponds at least partially, and in particular completely, to the cooling channels in which the cooling structures are located.

[0012] The cover plate can preferably be formed by stamping. The base plate can preferably be made by stamping or deep drawing. The cooling structure can preferably be formed by stamping or roll forming.

[0013] The cooling channel is preferably defined or delimited by a first wall, a second wall, a third wall, and a fourth wall. The third wall and the fourth wall can advantageously be configured as side walls. The first wall can preferably form a cover plate or a region of the cover plate. The second wall, the third wall, and the fourth wall can preferably form a base plate or a portion thereof. The aforementioned wall having an inner surface with an edge region preferably corresponds to the first wall or the second wall.

[0014] The inner surface of the first wall of the cooling channel and the inner surface of the second wall of the cooling channel are advantageously opposite each other. The inner surface of the first wall and the inner surface of the second wall are particularly preferably parallel to each other, in particular plane-parallel.

[0015] As previously mentioned, the inner surface of the wall of the cooling channel can have two edge regions. In particular, the inner surface of the first wall or the inner surface of the second wall of the cooling channel can have two edge regions that are not connected to the cooling structure. However, it is also possible for the inner surface of the first wall of the cooling channel and the inner surface of the second wall of the cooling channel to each have an edge region that is not connected to the cooling structure.

[0016] The cooling structure preferably has a region facing the inner surface, the region having a surface facing / facing the inner surface.

[0017] A portion of the surface is preferably opposite to the edge region and is not connected to the edge region. This means that a portion of the surface is preferably opposite to the connection region and is connected to the connection region.

[0018] The cooling structure particularly preferably has a plurality of regions which face the inner surface and each have a surface which faces / is facing the inner surface.

[0019] One of the surfaces is preferably at least partially, in particular completely, opposite the edge region and is not connected to the edge region. One of the surfaces is preferably at least partially, in particular completely, opposite the connection region and is connected to the connection region.

[0020] According to an advantageous embodiment, the edge area can be in contact with the cooling structure. In particular, the above-mentioned portion of the surface opposite to the edge area and not connected to the edge area can contact the edge area. Preferably, the above-mentioned surface that is at least partially opposite to the edge area and not connected to the edge area can contact the edge area. According to an alternative advantageous embodiment, a gap can be provided between the above-mentioned portion of the surface opposite to the edge area and not connected to the edge area and the edge area. Preferably, a gap can be provided between the above-mentioned surface that is at least partially opposite to the edge area and not connected to the edge area and the edge area. It should be understood that the gap is formed along the thickness direction of the cooler. The thickness direction preferably corresponds to the direction in which the cover plate is applied to the base plate.

[0021] According to one advantageous embodiment, the cooling structure can be arranged in the cooling channel so as not to overlap with the edge region. In other words, this means that no part of the cooling structure is located below or above the edge region, or opposite the edge region. Thus, the cooling structure is located only below or above the connection region. It should be understood that the edge region of the inner surface of the cooling channel wall is advantageously created by having the cooling structure have a dimension perpendicular to the flow direction, particularly across the width of the cooler, that is smaller than the corresponding dimension of the inner surface; and the cooling structure is arranged in the cooling channel spaced apart from one end of the inner surface. This spacing corresponds to the dimension of the edge region relative to the flow direction of the fluid in the cooling channel, particularly across the width of the cooler. This spacing should be understood to mean, in particular, the minimum distance between one end of the inner surface and the cooling structure. As previously mentioned, the cooling structure preferably has at least one region facing the inner surface, having a surface facing / opposing the inner surface. In particular, the cooling structure may have multiple regions facing the inner surface and each having a surface facing / opposing the inner surface. Arranging the cooling structure in the cooling channel so as not to overlap with the edge region particularly means that all such surfaces face / oppose the connection region.

[0022] The edge region preferably has a dimension perpendicular to the flow direction of the fluid in the cooling channel of between 5 and 15 mm, particularly preferably 10 mm. This allows for an optimal balance between stable placement of the cooling structure in the cooling channel and stress reduction in at least one connection layer connecting the electrical and / or electronic component to the cooler. The direction perpendicular to the flow direction of the fluid in the cooling channel preferably corresponds to the width of the cooler and / or cooling channel. Therefore, in designs where the cooling structure is arranged in the cooling channel without overlapping the edge region, the spacing (which corresponds to the dimension of the edge region relative to the flow direction of the fluid in the cooling channel, particularly the width of the cooler) is preferably between 5 and 15 mm, preferably 10 mm.

[0023] The edge region of the cooler can preferably extend in the flow direction of the fluid in the cooling channel between the first end of the cooling structure and the second end of the cooling structure, in particular from the first end of the cooling structure to the second end of the cooling structure. This means that the edge region is preferably formed only between the first end and the second end of the cooling structure, in particular only from the first end of the cooling structure to the second end of the cooling structure.

[0024] The cooler preferably has a receiving area for accommodating electrical and / or electronic components. According to an advantageous embodiment of the present invention, the cover plate may have a receiving area for accommodating electrical and / or electronic components. According to an alternative embodiment of the present invention, the base plate may have a receiving area for accommodating electrical and / or electronic components.

[0025] It is also possible that not only the cover plate but also the base plate each have such a receiving area. In this configuration, two electrical and / or electronic components can be arranged at the cooler and cooled by the cooler.

[0026] The receiving area of ​​the cover plate and / or the receiving area of ​​the base plate can be configured in particular as a support surface. The support surface is advantageously a part of the outer surface of the corresponding component, ie the cover plate or the base plate.

[0027] The edge region can preferably extend in the flow direction of the fluid in the cooling channel from a first end of the receiving region to a second end of the receiving region.

[0028] The cooling structure preferably extends in the direction of flow of the fluid in the cooling channel from a first end of the receiving area to a second end of the receiving area. In other words, the cooling structure is preferably arranged only in the area of ​​the cooling channel that corresponds to or is associated with the receiving area or the electrical and / or electronic component. In particular, the cooling structure is arranged directly below the receiving area.

[0029] Preferably, the inner surface of the wall of the cooling channel may have another edge region that extends in the direction of flow of the fluid in the cooling channel and is not connected to the cooling structure. The connecting region is arranged between the two edge regions. This means that the inner surface of the wall of the cooling channel has (only) two edge regions and one connecting region. The connecting region may also be referred to as an intermediate region in this context. According to one advantageous embodiment, the cooling structure is arranged entirely between the edge regions.

[0030] According to an advantageous embodiment, the dimensions of the cooling structure in a direction perpendicular to the flow direction of the fluid may be smaller than the dimensions of the receiving area and / or the dimensions of the electrical and / or electronic components in a direction perpendicular to the flow direction of the fluid. According to an alternative advantageous embodiment, the dimensions of the cooling structure in a direction perpendicular to the flow direction of the fluid may be the same as the dimensions of the receiving area and / or the dimensions of the electrical and / or electronic components in a direction perpendicular to the flow direction of the fluid.

[0031] In the context of the present invention, cooling structures are preferably understood to be surface-enlarging, flow-guiding and heat-transfer-enhancing structures.

[0032] The cooling structure is preferably designed as a turbulator (also called a turbulence structure). This means that the cooling structure is designed to generate turbulence in the fluid flowing through the cooling channel. This ensures better heat dissipation from the cooler to the fluid flowing through the cooler. In particular, the cooling structure is designed as a turbulence insert.

[0033] The cooling structure can preferably include a cooling rib structure and / or a pin structure (cooling pin structure). It is also conceivable that the cooling structure also has one or more cooling structure elements having a shape different from the cooling ribs or pins, as an alternative or in addition. It is particularly possible for the cooling structure to have a plurality of cooling structure elements having different shapes. Thus, for example, it is possible for the cooling structure to have one cooling rib and one pin, or a plurality of cooling ribs and a plurality of pins. Within the scope of the present invention, cooling ribs and pins can each be specifically referred to as cooling structure elements.

[0034] The cooling rib structure can preferably include (only) one cooling rib or multiple cooling ribs, which are preferably arranged one after the other in a flow direction. The flow direction particularly corresponds to the main flow direction of a fluid serving as a coolant, which flows through the through-holes formed by the cooling ribs. The main flow direction here particularly refers to the direction in which the fluid primarily flows, i.e., the velocity component of the fluid in this direction is greater than the velocity component of the fluid in a direction perpendicular to the main flow direction. The main flow direction preferably corresponds to the direction in which the fluid is introduced into the cooler through which the fluid can flow. The main flow direction is preferably parallel to the longitudinal direction of the cooler.

[0035] Preferably, the cooling ribs are formed by a wave-shaped profile which repeats periodically in the repeating direction. The pin structure can preferably comprise only one or more pins, which are preferably arranged in the flow direction and / or in a direction perpendicular to the flow direction.

[0036] The cooling structure can preferably be formed at least partially, in particular completely, from a material and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). Advantageously, the cooling structure can be formed at least partially, in particular completely, from aluminum or coated with aluminum. These embodiments particularly relate to cooling structural elements of the cooling structure.

[0037] The entire cooler, ie the cover plate, the base plate and the cooling structure, can preferably be produced from and / or coated with the same material, preferably aluminum or, for example, copper or stainless steel.

[0038] Within the framework of the present invention, the fluid that can flow through the cooler can also be specifically referred to as coolant (cooling fluid). For example, water can be used as coolant.

[0039] Furthermore, the present invention relates to an electrical and / or electronic device having an aforementioned cooler through which a fluid can flow and an electrical and / or electronic component arranged on the heat sink.

[0040] The electrical and / or electronic device may be, in particular, a power electronic device comprising at least one power electronic module, in particular a plurality of power electronic modules. Within the scope of the present invention, a power electronic module may also be specifically referred to as a power module. A power electronic module preferably comprises a carrier plate and / or conductor tracks and / or one or more power semiconductors.

[0041] The power electronics module is preferably joined to a fluid-permeable cooler, in particular a cover plate, by means of a layer produced by a soldering or sintering process (the layer can therefore be referred to as a soldering layer or a sintering layer, respectively). Softening layer and sintering layer are each understood to be the aforementioned connecting layer.

[0042] Each power electronic module is preferably arranged on a receiving area, in particular a support surface, of the cooler assigned to the power electronic module. This means that the number of receiving areas preferably corresponds to the number of power electronic modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein identical components or components with identical functions are respectively provided with identical reference numerals.

[0044] Figure 1 A simplified schematic diagram of an electrical and / or electronic device according to the invention with a cooler through which a fluid can flow according to a first exemplary embodiment of the invention is shown in longitudinal section,

[0045] Figure 2 Shown Figure 1 a simplified schematic top view of an area of ​​an electrical and / or electronic device in

[0046] Figure 3 Shown in cross section Figure 1 A simplified schematic diagram of an electrical and / or electronic device in

[0047] Figure 4 shows a simplified schematic cross-sectional view of an electric and / or electronic device according to a second embodiment of the invention,

[0048] Figure 5 A simplified schematic top view of a region of an electrical and / or electronic device according to the invention is shown according to a third embodiment of the invention, and

[0049] Figure 6 A simplified schematic cross-sectional view of an electrical and / or electronic device according to a third embodiment of the invention is shown. DETAILED DESCRIPTION

[0050] The following will refer to Figures 1 to 3 An electrical and / or electronic device 1000 according to the present invention is described according to a first exemplary embodiment of the present invention. The device has a plurality of electrical and / or electronic components 200 and a cooler 100 through which a fluid can flow for cooling the electrical and / or electronic components 200 .

[0051] In particular, the electrical and / or electronic device 1000 in this embodiment includes three electrical and / or electronic components 200. However, the number of electrical and / or electronic components 200 can vary. It is also possible that the electrical and / or electronic device 1000 has only one electrical and / or electronic component 200.

[0052] During operation, electrical and / or electronic components 200 generate heat that must be dissipated to ensure efficient operation of the components. To this end, the electrical and / or electronic components 200 are arranged on a cooler 100 through which a fluid can flow, particularly on the cover 101 of the cooler 100, so that the generated heat can be dissipated through the cooler 100. In particular, each of the electrical and / or electronic components 200 is arranged on a receiving area 115, particularly a support surface, formed on the cover 101. Each of the receiving areas 115 corresponds to a region of the outer surface of the cover 101 that is configured to receive the component 200 before the corresponding electrical and / or electronic component 200 is placed on the cooler 100 and that actually receives the component 200 after the corresponding electrical and / or electronic component 200 is placed. When the electrical and / or electronic components 200 are assembled, the corresponding receiving area 115 contacts the corresponding component 200.

[0053] In particular, a separate connecting layer 201 is arranged between the cooler 100 (in particular each receiving area in the receiving area 115) and each electrical and / or electronic component 200, in order to fix and thermally connect the corresponding electrical and / or electronic component 200 to the cooler 100. However, it is also feasible to place all electrical and / or electronic components 200 on the cover plate 101 by means of a continuous connecting layer. Advantageously, a connecting layer can be located between each layer 201 and the cooler 100, which is firmly connected to the cooler 100 and allows wetting of the connecting layer 201. In particular, the connecting layer can be made of copper or nickel. The connecting layer is an optional feature of the electrical and / or electronic device 1000 and can in particular be regarded as either a separate component or as part of the cooler 100.

[0054] The electrical and / or electronic device 1000 may, in particular, be a power electronics device having an electrical and / or electronic component 200 configured as a power module. This may, for example, be a power circuit of a hybrid vehicle or electric vehicle, such as an inverter structure or a converter structure. Each of the power modules may, for example, have a carrier plate, conductor tracks, and power semiconductors. The conductor tracks may, in particular, be copper conductor tracks, with the carrier plate preferably being constructed from ceramic. The power semiconductors may be applied to the conductor tracks using a layer, in particular a solder layer or a sintered layer. The conductor tracks and the carrier plate together form a power base plate. Each connecting layer 201 may be produced using a soldering or sintering process and thus, respectively, is a solder layer or a sintered layer, by means of which the corresponding power module is bonded to a fluid-permeable cooler 100 and thereby thermally connected thereto. For this purpose, the cooler 100, in particular the cover plate 101, may advantageously be surface-coated with a material suitable for soldering or sintering processes.

[0055] from Figure 1 and 3 As can be seen, the fluid-permeable cooler 100 includes a base plate 102 in addition to a cover plate 101. The cover plate 101 and base plate 102 are connected to one another, in particular by brazing. Advantageously, the cover plate 101 and base plate 102 can be connected to one another using brazing material. Here, the cover plate 101 forms the top surface of the cooler 100, and the base plate 102 forms the bottom surface of the cooler 100.

[0056] An interior space is defined by cover plate 101 and base plate 102 (which, when assembled, form housing 110 of cooler 100), and cooling channels 103 are formed in the interior space. A fluid, particularly water, serving as a coolant flows through cooling channels 103 to dissipate heat generated by electrical and / or electronic components 200.

[0057] In particular, the cover plate 101 is of flat design, wherein the base plate 102 has a recess 120 covered by the cover plate 101, so that the cooling channel 103 is formed in the recess 120 of the base plate 102 between the base plate 102 and the cover plate 101. This allows a cooler that is easy to manufacture to be realized in a compact design. The housing 110 is provided with an inlet 104 ( Figure 1 ) for introducing a fluid used as a coolant. The housing 110 is provided with an outlet 105 ( Figure 1 The inlet 104 and the outlet 105 are advantageously designed as connecting pieces and are preferably joined in the same manufacturing step in which the cover plate 101 and the base plate 102 are connected to one another by means of solder, in particular hard solder.

[0058] Both base plate 102 and cover plate 101 are constructed as sheet materials and advantageously each have a constant thickness. Base plate 2 and cover plate 3 can have the same thickness or different thicknesses. The respective thickness also specifically refers to the thickness of the respective starting sheet material from which base plate 102 or cover plate 103 is produced. To form recess 120 in base plate 102, base plate 102 can advantageously be produced by a deep drawing process.

[0059] Depend on Figure 3 The cooling channel 103 is shown to be defined or delimited in the circumferential direction by, in particular, a first wall 111, a second wall 112, a third wall 113 and a fourth wall 114. In particular, the third wall 113 and the fourth wall 114 are configured as side walls. The first wall 111 and the second wall 112 are opposite and parallel to each other.

[0060] In particular, cooling channel 103 is defined by the respective inner surfaces of first wall 111, second wall 112, third wall 113, and fourth wall 114. First wall 111 has a first inner surface 1, second wall 112 has a second inner surface 2, third wall 113 has a third inner surface 3, and fourth wall 114 has a fourth inner surface 4. First inner surface 1, second inner surface 2, third inner surface 3, and fourth inner surface 4 completely face cooling channel 103. First inner surface 1 is considered to correspond to a region of the inner side of cover plate 101, while second inner surface 2, third inner surface 3, and fourth inner surface 4 each correspond to a region of the inner side of base plate 102. First inner surface 1 and second inner surface 2 are parallel to each other, and in particular, are plane-parallel.

[0061] Depend on Figure 1 and 2 As a result, a separate cooling structure 106 is arranged in the cooling channel 103 for each electrical and / or electronic component 200. The cooling structure serves as a surface-enlarging structure for guiding the flow of the fluid serving as the coolant and enhancing heat transfer. This means that in this embodiment, three cooling structures 106 are arranged in the cooling channel 103.

[0062] Each cooling structure 106 is arranged directly below the corresponding electrical and / or electronic component 200 and extends along the fluid flow direction 500 in / through the cooling channel 103 from the first end of the corresponding electrical and / or electronic component 200 to the second end of the corresponding electrical and / or electronic component 200, or from the first end of the corresponding receiving area 115 to the second end of the corresponding receiving area 115. This enables targeted heat transfer from each electrical and / or electronic component 200 to its associated cooling structure 106. However, it is also possible for the cooling structure 106 to be longer in the fluid flow direction 500 than the corresponding electrical and / or electronic component 200 or the corresponding receiving area 115. In this case, however, the cooling structures 106 are arranged spaced apart from each other in the fluid flow direction 500. The fluid flow direction 500 advantageously corresponds to the longitudinal direction of the cooler 100 or the cooling channel 103. In particular, the flow direction 500 corresponds to the main flow direction of the fluid in / through the cooling channel 103.

[0063] The cooling structures 106 extend in particular over the entire width of the corresponding receiving area 115 or the corresponding electrical and / or electronic component 200. In other words, the dimension (width) of each of the cooling structures 106 in a direction 501 perpendicular to the flow direction 500 of the fluid is smaller than the dimension (width) of the corresponding receiving area 115 or the corresponding electrical and / or electronic component 200 in a direction 501 perpendicular to the flow direction 500 of the fluid.

[0064] In particular, each cooling structure 106 is configured as a cooling rib structure. For this purpose, the cooling rib structure has a plurality of cooling ribs 160, which are arranged sequentially in / through the cooling channel 103 along the flow direction 500 of the fluid ( Figure 1 ). However, it is also possible that at least one of the cooling structures 106 has a single cooling rib 160, which extends from a first end of the corresponding electrical and / or electronic component 200 to a second end of the corresponding electrical and / or electronic component 200, or from a first end of the corresponding receiving area 115 to a second end of the corresponding receiving area 115.

[0065] Figure 3 It is further shown that each cooling rib 160 is formed by a wave-shaped profile that repeats periodically along a repeating direction. The repeating direction advantageously corresponds to a direction 501 perpendicular to the flow direction 500 of the fluid, or to the width direction of the cooler 100.

[0066] Each cooling structure 106 is preferably formed from a material and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). The cooling structures 106 can advantageously be formed from aluminum or coated with aluminum. Other thermally conductive materials are also possible for the cooling structures 106 and / or their coatings.

[0067] At least two components of the fluid-permeable cooler 100 and / or at least one component of the fluid-permeable cooler 100 and at least one component of the electrical and / or electronic component 200 have different coefficients of thermal expansion. In particular, the cover plate 101 (the cover plate is in particular constructed of a metal material) can have a coefficient of expansion that is in particular greater than the coefficient of expansion of the electrical and / or electronic component 200. Preferably, the cover plate 101 and the base plate 102 are constructed of aluminum, wherein the electronics and / or electronic component 200 has a coefficient of thermal expansion that is different from that of aluminum. As a result, when these components expand / contract thermally, the expansion / contraction of the cover plate 101 is in particular suppressed, which can cause the cooler 100 to bend. As a result, stresses are generated in the layer 201 connecting the electrical and / or electronic component 200 to the cooler 100, and in particular also in a subsequent layer / multiple subsequent layers (if present). Excessively high stresses can cause cracks in the connecting layer 201 and in particular also in the subsequent layer / layers, which in turn lead over time to no or only reduced thermal contact between the electrical and / or electronic component 200 and the cooler 100 .

[0068] In order to avoid this and thereby ensure a good heat transfer between the electrical and / or electronic component 200 and the cooler 100 , each of the cooling structures 106 is partially connected to the cooler 100 .

[0069] In particular, the first inner surface 1 has two edge regions 5 and one connecting region 6. The two edge regions 5 are not connected to the cooling structure 106, while the connecting region 6 is connected to the cooling structure 106. The connecting region 6 is connected to the cooling structure 106, in particular, is materially connected. The connecting region 6 is arranged between the edge regions 5 and directly adjoins the edge regions 5. This means that the first inner surface 1 has only two edge regions 5 and one connecting region 6. The connecting region 6 is the central region of the first inner surface 1.

[0070] Each cooling rib 160 has a plurality of first regions 11 facing the first inner surface 1, wherein each of the first regions 11 has a surface 13 facing / opposing the first inner surface 1. Surface 13 of first region 11 is plane-parallel to first inner surface 1. Furthermore, each cooling rib 160 has a plurality of second regions 12 facing the second inner surface 2, wherein each of the second regions 12 has a surface 14 facing the second inner surface 2. Surface 14 of second region 12 is plane-parallel to second inner surface 2.

[0071] The fact that the edge region 5 is not connected to the cooling structure 106 means that those first surfaces 13 or parts thereof that face the edge region 5 are not connected to the edge region 5. In particular, the first surfaces 13 or parts thereof that face the edge region 5 can be in contact with the edge region 5, wherein relative movement between the first surfaces 13 or parts thereof that face the edge region 5 is possible. Those first surfaces 13 or parts thereof that face the connection region 6 are connected to the connection region 6.

[0072] The connection region 6 is connected to the cooling structure 106 by means of a solder layer 116, in particular a hard solder layer. In order to prevent connection between the edge region 5 of the first inner surface 1 and the cooling structure 106, in particular the first surface 13 facing the edge region 5, a solder resist paste can be applied locally in the edge region 5, for example, when manufacturing the cooler 100. Alternatively, the edge region 5 can also be embossed so that the gap between the edge region 5 and the cooling structure 106, in particular the first surface 13 facing the edge region 5, becomes too large to be filled with solder. In this case, the edge region 5 does not contact the cooling structure 106. The solder layer 116 preferably extends over the entire first inner surface 1 and in particular also over the entire inner side of the cover plate 101 in the width direction of the cooler 100, so that the solder layer 116 also connects the cover plate 101 to the base plate 102. It should be noted that although the solder layer 116 preferably extends over the entire first inner surface 1 in the width direction of the cooler 100, the edge region 5 is not connected to the cooling structure 106, as described above.

[0073] In the cooler 100 Figure 3 In the cross-sectional view shown, the cooling rib 160 shown has five first regions 11 and therefore also five first surfaces 13. Figure 3 It is shown that each edge region 5 faces one complete first surface 13 and partially faces another first surface 13 and is not connected thereto. However, this may vary depending on the design of the cooling structure 106 or cooling structures 160 and the cooling channel 103 .

[0074] The cooling structure 106 is further connected to the base plate 102 by means of a solder layer 117, in particular a brazing layer. The connection of the cooling structure 106 to the cover plate 101 and the base plate 102, as well as the connection of the cover plate 101 to the base plate 102 can be carried out in the same production step.

[0075] The partial connection of cooling structure 106 to cover plate 101 reduces stresses that may arise in connection layer 201 during operation of electrical and / or electronic component 200 due to different expansion coefficients of various components of electrical and / or electronic device 1000. This is achieved, in particular, by preventing the components of electrical and / or electronic device 1000 from experiencing excessive expansion and contraction relative to one another due to the partial connection of cooling structure 106 to cover plate 101. Consequently, a stable connection of electrical and / or electronic component 200 to cover plate 101 is achieved. Simultaneously, heat is transferred from electrical and / or electronic component 200 through connection layer 201 to cover plate 201, and from there via solder layer 116 to cooling structure 106, where it is dissipated by the fluid flowing through cooling channels 103.

[0076] In order to achieve an optimal balance between a stable connection of the electrical and / or electronic component 200 to the cover plate 201 and good dissipation of heat generated by the electrical and / or electronic component 200 through the cooling structure 106, the dimension 502 of each edge area 5 in a direction 501 perpendicular to the flow direction is between 5 mm and 15 mm, preferably 10 mm.

[0077] Figure 4 The present invention relates to an electrical and / or electronic device 1000 according to a second exemplary embodiment of the present invention, which has a cooler 100 through which a fluid can flow.

[0078] The electric and / or electronic device 1000 according to the second embodiment differs from the electric and / or electronic device according to the first embodiment in the connection of the cooling structure 106 to the housing 110 of the cooler 100 .

[0079] from Figure 4 It can be seen that the second inner surface 2 of the second wall 112 rather than the first inner surface 1 of the first wall 111 of the cooling channel 103 has two edge regions 5 , which are constructed in the same manner as the edge regions 5 of the first inner surface 1 in the first embodiment.

[0080] In other words, in the fluid-permeable cooler 100 according to the second embodiment, each cooling structure 106 is partially connected to the base plate 102. The advantages described with reference to the cooler 100 according to the first embodiment also apply to the cooler 100 or the electrical and / or electronic device 1000 according to the second embodiment.

[0081] Figure 5 and 6 The present invention relates to an electrical and / or electronic device 1000 according to a third exemplary embodiment of the present invention, which has a cooler 100 through which a fluid can flow.

[0082] The electric and / or electronic device 1000 according to the third embodiment differs from the electric and / or electronic device according to the first embodiment in the design of the cooling structure 106 and its connection to the housing 110 of the cooler 100 .

[0083] In the third embodiment, each cooling structure 106 is arranged so as not to overlap with the edge region 106 of the first inner surface 1. In other words, this means that no portion of the corresponding cooling structure 106 is located below the edge region 5, or no portion of the cooling structure 106 is opposite the edge region 5. Therefore, the cooling structure 106 is located only below the connection region 6. Here, all first surfaces 13 face the connection region 6 and are connected thereto.

[0084] It should be understood that the edge region 5 of the first inner surface 1 of the first wall 111 of the cooling channel 103 is formed as follows: the cooling structure 106 has a dimension 503 (width) in a direction 501 perpendicular to the flow direction 500 of the fluid or in the width direction of the cooler 100, which is smaller than the corresponding dimension (width) of the first inner surface 1 in the direction 501 perpendicular to the flow direction 500 of the fluid, and the cooling structure 106 is arranged in the cooling channel 103 spaced apart from one end of the first inner surface 1 in the direction 501 perpendicular to the flow direction 500. The dimension (width) of the first inner surface 1 in the direction 501 perpendicular to the flow direction 500 of the fluid corresponds to the sum of the corresponding dimension 502 (width) of the edge region 5 and the corresponding dimension (width) of the connection region 6.

[0085] The aforementioned spacing between each end of the first inner surface 1 and the cooling structure 106 corresponds to a dimension 502 of the corresponding edge region 5 in the flow direction 500 of the fluid in the cooling channel 103. This means that the spacing is between 5 mm and 15 mm, preferably 10 mm. The spacing between each end of the first inner surface 1 and the cooling structure 106 corresponds to the minimum spacing between one end of the first inner surface 1 and the cooling structure 106.

[0086] In particular, the cooling structures 106 do not extend over the entire width of the corresponding receiving area 115 or the corresponding electrical and / or electronic component 200. In other words, the width of each of the cooling structures 106 is smaller than the width of the corresponding receiving area 115 or the corresponding electrical and / or electronic component 200. This creates two bypass channels 118 for the fluid.

[0087] Due to the described design of the cooling structure 106 and its arrangement in the cooling channel 103 , the electrical and / or electronic device 1000 according to the third embodiment also achieves the advantages mentioned with reference to the first and second embodiments.

Claims

1. A fluid-permeable cooler (100) for cooling electrical and / or electronic components (200), comprising: A cooling channel (103) through which a fluid can flow, and A cooling structure (106) is arranged in the cooling channel (103), wherein an inner surface (1; 2) of a wall (111; 112) of the cooling channel (103) has a connection region (6) and an edge region (5), wherein the connection region (6) is connected to the cooling structure (106) and the edge region (5) is not connected to the cooling structure (106).

2. The fluid-permeable cooler (100) according to claim 1, wherein: The edge region (5) adjoins the connecting region (6).

3. The fluid-permeable cooler (100) according to any one of the preceding claims, further comprising a cover plate (101) and a base plate (102), the cover plate and the base plate being connected to each other and defining the cooling channel (103), wherein: The inner surface (1; 2) is at least a portion of the inner side of the cover plate (101) or the inner side of the base plate (102).

4. The cooler (100) through which a fluid can flow according to any one of the preceding claims, wherein: The cooling structure (106) has at least one region (11; 12) facing the inner surface (1; 2), the region having a surface (13; 14) facing the inner surface (1; 2), wherein a portion of the surface (13; 14) is opposite to the edge region (5) and is not connected to the edge region (5).

5. The cooler (100) through which a fluid can flow according to any one of the preceding claims, wherein: The edge region (5) is in contact with the cooling structure (106).

6. The cooler (100) through which fluid can flow according to any one of claims 1 to 3, wherein: The cooling structure (106) is arranged in the cooling channel (103) in such a manner that it does not overlap with the edge region (5).

7. The cooler (100) through which a fluid can flow according to any one of the preceding claims, wherein: The dimension (502) of the edge region (5) in a direction (501) perpendicular to the flow direction (500) of the fluid in the cooling channel (103) is between 5 mm and 15 mm, preferably 10 mm.

8. The cooler (100) through which a fluid can flow according to any one of the preceding claims, wherein: The edge region (5) extends between a first end of the cooling structure (106) and a second end of the cooling structure (106) in a flow direction (500) of a fluid in the cooling channel (103), in particular, extends from the first end of the cooling structure (106) to the second end of the cooling structure (106).

9. The cooler (100) through which a fluid can flow according to any one of the preceding claims, further comprising a receiving area (115) for receiving an electrical and / or electronic component (200).

10. The cooler (100) through which fluid can flow according to claim 9, wherein: The edge region (5) extends from a first end of the accommodating region (115) to a second end of the accommodating region (115) in a flow direction (500) of the fluid in the cooling channel (103), and / or The cooling structure (106) extends from a first end of the accommodating area (115) to a second end of the accommodating area (115) in a flow direction (500) of the fluid in the cooling channel (103).

11. The cooler (100) through which a fluid can flow according to any one of the preceding claims, wherein: The inner surface (1; 2) of the wall (101; 102) of the cooling channel (103) has another edge region (5), which extends in the flow direction (500) of the fluid in the cooling channel (103) and is not connected to the cooling structure (106), wherein the connecting region (6) is arranged between the two edge regions (5).

12. An electrical and / or electronic device (1000) comprising a cooler (100) through which fluid can flow according to any one of the preceding claims and an electrical and / or electronic component (200) arranged at the cooler (100) through which fluid can flow.

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