Electroplating pretreatment equipment for circuit board

Abstract

The invention belongs to the technical field of circuit board processing, and particularly relates to circuit board electroplating pretreatment equipment which comprises stacking equipment and treatment equipment, the stacking equipment comprises a stacked circuit board, a pretreatment penetrating opening is formed in an inner cavity of the stacked circuit board, and guide storage sheaths are symmetrically arranged on the outer surface of the stacked circuit board. According to the device, the pre-treatment through holes of the stacked circuit boards can be accurately butted through the butting cylinders on the two sides, so that an input silver nitrate solution circularly flows in the external circulating pipe, the drainage equipment, the butting cylinders and the pre-treatment through holes, and then the pre-treatment through holes are subjected to silver plating work; as the silver nitrate solution is not in contact with the outer surfaces of the circuit boards and the edge position of the outer side of the hole wall of the pretreatment through hole when flowing circularly, redundant silver ions are not attached to the edge position of the outer side of the hole wall of each circuit board, so that the outer surfaces of the circuit boards are prevented from being polluted, and the service life of the circuit boards is prolonged. And the subsequent film pasting work can be normally carried out.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, in particular to a circuit board electroplating pre-treatment device. Background Art

[0002] In recent years, circuit boards have been trending toward being lighter, thinner, smaller, and featuring high-density interconnects. The need to fit more microdevices onto a limited surface has driven the design of printed circuit boards toward higher density, higher precision, multiple layers, and smaller apertures. To meet the demands of increasingly sophisticated electronic products, these products are continuously becoming thinner. This trend toward thinner products has necessitated significant adjustments to printed circuit board manufacturing processes, necessitating the development of new equipment and processes.

[0003] Before existing circuit boards undergo electroplating, they need to be drilled and silver-plated. A layer of conductive silver is plated on the walls of the through-holes in the circuit board. This involves immersing the board in a solution containing silver nitrate, which ionizes the circuit board so that the silver ions adhere to the outer surface of the hole walls. However, when silver ions adhere to larger holes, they may exceed their actual adhesion range. That is, excess silver will adhere to the outer edge of the hole wall, preventing the subsequent film-lamination work from proceeding normally. Therefore, improvements are needed. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention solves the technical problems thereof by adopting the following technical solutions: a circuit board electroplating pre-treatment device, comprising a stacking device and a processing device, wherein the stacking device comprises stacked circuit boards, the inner cavity of the stacked circuit boards is provided with a pre-treatment through-port, the outer surface of the stacked circuit boards is symmetrically provided with guide and storage sheaths, the lower surface of the guide and storage sheaths being fixedly connected to a horizontal moving rod; the processing device comprises a control component, the front surface of the control component is symmetrically provided with a drainage device, the front end of the drainage device is fixedly connected to a docking device; The docking device includes a docking tube, which transports silver nitrate solution through the inner wall. A clamping groove is provided at the top of the outer surface of the docking tube, and an isolation groove is provided at the bottom of the inner cavity of the docking tube. A built-in air pump is symmetrically arranged on the upper part of the inner cavity of the docking tube. The bottom end of the exhaust port of the built-in air pump is fixedly connected with a folding connecting pipe, and the bottom end of the folding connecting pipe is fixedly connected with an energy storage ring. Exothermic resistor plates are symmetrically arranged at the bottom of the inner cavity of the energy storage ring. Electric energy is stored in the energy storage ring, and the exothermic resistor plate can be powered to generate heat to heat the internal liquid of the isolation groove. A waterproof gasket is fixedly connected to the bottom end of the exothermic resistor plate. Pre-pressing devices are symmetrically arranged on both sides of the outer surface of the docking tube. In the non-working state, the contracted folding connecting pipe will pull the energy storage ring upward, so that the waterproof gasket blocks the top opening of the isolation groove, preventing external liquid from entering the space where the exothermic resistor plate is located.

[0005] Furthermore, the control component includes a cluster box, the inner cavity of the cluster box is evenly provided with guide slides, the cluster box can slide up and down along the guide slides through the internal rollers, the middle of the inner cavity of the cluster box is slidably connected to the propulsion slide, the front end of the propulsion slide is symmetrically provided with a fine-tuning slide, the fine-tuning slide can slightly move the control link through its scale slide, the inner cavity of the fine-tuning slide is evenly provided with a control link through the guide slide, the front end of the control link is fixedly connected with a sleeve connecting plate, the outer surface of the fine-tuning slide is fixedly connected to a circulation pump on the side away from the propulsion slide, and the back of the inner cavity of the circulation pump is symmetrically provided with an external circulation pipe, and the control component as a whole can control the movement of the symmetrical docking cylinders on the upper and lower sides to dock with the pre-treatment through-ports on the upper and lower sides of the stacked circuit boards.

[0006] Furthermore, there are two control components. The front end of the inner wall of the sleeve connecting plate is engaged with the top of the outer surface of the docking tube through a engaging groove. The outer surface of the control connecting rod is slidably connected to the inner cavity of the fine-tuning slide box. There are four external circulation pipes, and both ends of the external circulation pipes extend to the interior of the circulation pump. The outer surface of the built-in air pump is fixedly connected to the inner cavity of the docking tube. The outer surface of the energy storage ring is slidably connected to the inner cavity of the docking tube. The bottom end of the heat release resistor plate extends to the interior of the isolation groove. The upper surface of the waterproof gasket is squeezed against the top of the inner wall of the isolation groove. The bottom end of the docking tube is squeezed against the outer surface of the stacked circuit board through the pre-processing through-port. The upper and lower ends of the guide slide are fixedly connected with anchor blocks. The outer surface of the fine-tuning slide box is fixedly connected to the front end of the propulsion slide.

[0007] Furthermore, the drainage device includes a butt-joint tube, the bottom end of which is fixedly connected to a compression tube, and external connecting tubes are symmetrically provided on both sides of the inner cavity of the butt-joint tube through a through-hole, and a connecting soft sleeve is inserted into the top of the inner wall of the butt-joint tube. By breaking open the external connecting tubes on both sides, the silver nitrate solution to be circulated can be added to the interior of the butt-joint tube, and the external connecting tubes on both sides can be engaged with each other through the butt-joint slots at their ends to form a closed annular body. The bottom end of the connecting soft sleeve is fixedly connected to the top end of the butt-joint tube, and the end of the butt-joint tube away from the connecting soft sleeve is fixedly connected to the front end of the liquid discharge port of the circulation pump, the outer surface of the external connecting tube is slidably connected to the inner cavity of the butt-joint tube, and the bottom end of the external connecting tube is fixedly connected to a limiting sleeve.

[0008] Furthermore, the prestressing device includes an external arc plate, the top of the inner wall of which is fixedly connected to a pressure-sensitive arc plate, and the lower surface of the pressure-sensitive arc plate is evenly provided with sensitive springs. The bottom ends of the sensitive springs are fixedly connected to prestressing plugs, and the bottom ends of the prestressing plugs extend outside the external arc plate. The outer surface of the external arc plate is fixedly connected to the outer surface of the docking tube, and the bottom of the external arc plate is flush with the bottom of the docking tube. The top of the sensitive spring is fixedly connected to the lower surface of the pressure-sensitive arc plate, and the bottom of the outer surface of the prestressing plug is slidably connected to the bottom of the inner cavity of the external arc plate.

[0009] The beneficial effects of the present invention are as follows: 1. The device can precisely dock the pretreatment through-ports of the stacked circuit boards through the docking sleeves on both sides, so that the input silver nitrate solution circulates inside the external circulation pipe, drainage equipment, docking sleeve and pretreatment through-ports, and then silver-plated the pretreatment through-ports. Since the silver nitrate solution will not contact the outer surface of the circuit board and the edge position of the outer side of the hole wall of the pretreatment through-port when circulating, no excess silver layer will be attached to the edge position of the outer side of the hole wall of each circuit board, thereby ensuring that the outer surface of the circuit board will not be contaminated by the silver nitrate solution and ensuring that the subsequent film lamination work can be carried out normally.

[0010] 2. The device can perform batch silver plating on circuit boards. Since the pre-treatment through-ports of the same batch of circuit boards are interconnected and docked after being stacked, and the processing precision of the circuit boards is the same, the silver nitrate solution can uniformly silver-plate the pre-treatment through-ports of all circuit boards after circulation. In the case that the outer edge of the pre-treatment through-ports is not silver-plated, the silver plating efficiency is improved. If a thicker silver layer needs to be electroplated on the pre-treatment through-ports, the silver layer will affect the separation of the stacked circuit boards. Alternatively, each circuit board can be silver-plated separately to achieve a precise silver plating effect.

[0011] 3. Although the silver nitrate solution can circulate inside the device, the silver ion content of the silver nitrate solution inside is constantly decreasing during electroplating, so the silver nitrate solution needs to be replenished in time. At this time, the external connecting pipes on both sides are opened, and high-concentration silver nitrate solution is added to the inside of the connecting pipe through the external connecting pipe. Then, under the connection of the connecting soft sleeve and the external connecting pipe, the connecting pipe is closed so that the silver nitrate solution inside can meet the electroplating requirements.

[0012] 4. Since circuit boards are usually thin and fragile, before the docking sleeve is about to contact the outer surface of the circuit board, the pre-stressing devices located on both sides of the outer surface of the circuit board will contact the edge of the pre-treatment through-port in advance, and then the pre-stressing soft plug will contact the outer surface of the circuit board in advance, and the pressure of the sensitive spring will trigger the pressure-sensitive arc plate. At this time, the pressure-sensitive arc plate sends an electrical signal to make the fine-tuning slide box reduce the sliding speed of the guide slide rod in time, thereby performing fine-tuning work. Finally, when the docking sleeve is docked with the pre-treatment through-port, no strong impact or extrusion marks will be caused to the circuit board, thereby protecting the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front view of the present invention; Figure 2 is a cross-sectional view of the present invention; Figure 3 It is a structural schematic diagram of the stacking device of the present invention; Figure 4 It is a structural schematic diagram of the processing equipment of the present invention; Figure 5 is a cross-sectional view of the docking device of the present invention; Figure 6 It is a structural diagram of the control component of the present invention; Figure 7 is a cross-sectional view of the drainage device of the present invention; Figure 8 It is a cross-sectional view of the pre-pressing device of the present invention.

[0014] Figure: 1. Stacking device; 2. Processing device; 11. Stacking circuit boards; 12. Pre-treatment penetration port; 13. Guide and storage sheath; 14. Horizontal movement rod; 21. Control component; 22. Drainage device; 3. Docking device; 31. Docking tube; 32. Snap-fit ​​groove; 33. Isolation groove; 34. Built-in air pump; 35. Folding connecting pipe; 36. Energy storage ring; 37. Heat dissipation resistor plate; 38. Waterproof gasket; 211 , cluster box; 212, guide slide; 213, propulsion slide; 214, fine-tuning slide box; 215, control connecting rod; 216, sleeve connecting plate; 217, circulation pump; 218, external circulation pipe; 221, docking connecting pipe; 222, compression connecting pipe; 223, external connecting pipe; 224, connecting soft sleeve; 4, preloading equipment; 41, external arc plate; 42, pressure-sensitive arc plate; 43, sensitive spring; 44, preloading soft plug. DETAILED DESCRIPTION

[0015] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described to better illustrate the principles of the invention and its practical application, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for specific applications.

[0016] Example 1, please refer to Figures 1-6 The present invention provides a technical solution: a circuit board electroplating pre-treatment device, comprising a stacking device 1 and a processing device 2, wherein the stacking device 1 comprises a stacked circuit board 11, the inner cavity of the stacked circuit board 11 is provided with a pre-treatment through-port 12, the outer surface of the stacked circuit board 11 is symmetrically provided with a guide storage sheath 13, and the lower surface of the guide storage sheath 13 is fixedly connected to a horizontal moving rod 14; the processing device 2 comprises a control component 21, the front surface of the control component 21 is symmetrically provided with a drainage device 22, and the front end of the drainage device 22 is fixedly connected to a docking device 3; The docking device 3 includes a docking tube 31, which transports silver nitrate solution through the inner wall. A clamping groove 32 is provided at the top of the outer surface of the docking tube 31, and an isolation groove 33 is provided at the bottom of the inner cavity of the docking tube 31. A built-in air pump 34 is symmetrically arranged on the upper part of the inner cavity of the docking tube 31. The bottom end of the exhaust port of the built-in air pump 34 is fixedly connected to a folding connecting pipe 35, and the bottom end of the folding connecting pipe 35 is fixedly connected to an energy storage ring 36. A heat release resistor plate 37 is symmetrically arranged at the bottom of the inner cavity of the energy storage ring 36. The energy storage ring 36 stores electrical energy inside and can generate heat by supplying power to the heat release resistor plate 37 to heat the internal liquid of the isolation groove 33. A waterproof gasket 38 is fixedly connected to the bottom end of the heat release resistor plate 37. Pre-pressing devices 4 are symmetrically arranged on both sides of the outer surface of the docking tube 31. In the non-working state, the contracted folding connecting pipe 35 will pull the energy storage ring 36 upward, so that the waterproof gasket 38 blocks the top opening of the isolation groove 33 to prevent external liquid from entering the space where the heat release resistor plate 37 is located.

[0017] The control component 21 includes a cluster box 211, and the inner cavity of the cluster box 211 is evenly provided with guide slides 212. The cluster box 211 can slide up and down along the guide slide 212 through the internal roller. The middle part of the inner cavity of the cluster box 211 is slidably connected to the propulsion slide 213, and the front end of the propulsion slide 213 is symmetrically provided with a fine-tuning slide box 214. The fine-tuning slide box 214 can slightly move the control link 215 through its scale slide groove. The inner cavity of the fine-tuning slide box 214 is evenly provided with a control link 215 through the guide slide groove. The front end of the control link 215 is fixedly connected to a sleeve connecting plate 216. The outer surface of the fine-tuning slide box 214 is fixedly connected to a circulation pump 217 on the side away from the propulsion slide 213. The back of the inner cavity of the circulation pump 217 is symmetrically provided with an external circulation pipe 218. The control component 21 as a whole can control the movement of the symmetrical docking tubes 31 on the upper and lower sides, so that the docking tubes 31 can dock with the pretreatment through-ports 12 on the upper and lower sides of the stacked circuit boards 11.

[0018] There are two control components 21. The front end of the inner wall of the sleeve connecting plate 216 engages with the top of the outer surface of the docking sleeve 31 via a snap-fit ​​groove 32. The outer surface of the control link 215 slides into the inner cavity of the fine-tuning slide box 214. There are four external circulation pipes 218, both ends of which extend into the interior of the circulation pump 217. The outer surface of the internal air pump 34 is fixedly connected to the inner cavity of the docking sleeve 31. The outer surface of the energy storage ring 36 slides into the inner cavity of the docking sleeve 31. The bottom end of the heat dissipation resistor plate 37 extends into the interior of the isolation groove 33. The upper surface of the waterproof gasket 38 presses against the top of the inner wall of the isolation groove 33. The bottom end of the docking sleeve 31 presses against the outer surface of the stacked circuit board 11 through the pre-processing through-hole 12. Anchor blocks are fixedly connected to the upper and lower ends of the guide slide 212. The outer surface of the fine-tuning slide box 214 is fixedly connected to the front end of the propulsion slide 213.

[0019] When using the device to silver-plated larger holes in circuit boards, the circuit boards that need to be processed uniformly are stacked together so that their pre-processed through-ports 12 are connected together, and then the four corners of the board are placed on the surrounding guide sheaths 13, as shown in FIG. Figure 3 As shown, the stacked circuit boards are packed together to complete the preparation work.

[0020] The cluster box 211 pushes the sliding plate 213 to push the fine-tuning slide boxes 214 on the upper and lower sides toward the pre-processing through-port 12, so that the docking tubes 31 on the upper and lower sides are respectively aligned with the pre-processing through-port 12, and then the fine-tuning slide box 214 drives the docking tubes 31 at the corresponding position to move toward the outer surface of the bonded circuit board by means of the traction control connecting rod 215 through the sleeve connecting plate 216 until the docking tubes 31 on the upper and lower sides are docked with the pre-processing through-port 12 of the circuit board, thereby blocking the pre-processing through-port 12.

[0021] The circulation pumps 217 on the upper and lower sides start to work, driving the silver nitrate solution inside the external circulation pipe 218 to perform power circulation, that is, the silver nitrate solution circulates inside the external circulation pipe 218, the drainage device 22, the docking sleeve 31 and the pretreatment through-port 12, and the silver nitrate solution can silver-plate the inner wall of the pretreatment through-port 12 of the circuit board when passing through the pretreatment through-port 12. Since the silver nitrate solution will not leak when circulating, the silver nitrate solution will only silver-plate the inner wall of the pretreatment through-port 12 until the pretreatment through-ports 12 of all stacked circuit boards 11 are plated with a thin layer of silver, and the edge position outside the hole wall of the pretreatment through-port 12 will not be silver-plated.

[0022] After the silver plating is completed, the docking tubes 31 on both sides are opened, the stacked circuit board 11 is rotated, and the horizontal movement rod 14 is used to rotate it horizontally, and then the above-mentioned silver plating is performed on the remaining pre-processing through-holes 12. After all the pre-processing through-holes 12 are silver-plated, the stacked circuit board 11 is removed, and then each circuit board is separated. Since the silver layer is thin, the circuit boards can be separated relatively easily. If a thicker silver layer needs to be electroplated on the pre-processing through-holes 12, the silver layer will affect the separation of the stacked circuit boards 11, so each circuit board needs to be silver-plated separately, such as Figure 1 As shown, precise silver plating effect is achieved.

[0023] After the bottom end of the docking sleeve 31 contacts the outer surface of the circuit board, the isolation groove 33 will isolate the edge of the pretreatment through-port 12 from the outside and the hole wall. At this time, the built-in air pump 34 pushes the energy storage ring 36 downward, so that the exothermic resistor plate 37 extends into the interior of the isolation groove 33, and then the exothermic resistor plate 37 heats the interior of the isolation groove 33, so that the moisture at the edge of the pretreatment through-port 12 evaporates and enters the inner cavity of the docking sleeve 31, and then the pretreatment through-port 12 is electroplated, thereby avoiding the edge of the pretreatment through-port 12 from being enhanced in conductivity due to the presence of water, thereby avoiding the silver ions in the silver nitrate solution from being precipitated at the edge of the pretreatment through-port 12 when the circuit board is electroplated, and maintaining the cleanliness of the pretreatment through-port 12.

[0024] Example 2, please refer to Figures 1-8The present invention provides a technical solution: Based on Example 1, the drainage device 22 includes a docking tube 221, the bottom end of which is fixedly connected to a compression tube 222. External connecting tubes 223 are symmetrically provided on both sides of the inner cavity of the docking tube 221 through through-holes. A connecting sleeve 224 is inserted into the top of the inner wall of the docking tube. The external connecting tubes 223 on both sides are separated to add the silver nitrate solution to be circulated into the interior of the docking tube 221. The external connecting tubes 223 on both sides can be engaged with each other through the docking slots at their ends to form a closed annular body. The bottom end of the connecting sleeve 224 is fixedly connected to the top of the docking tube 31. The end of the docking tube 221 away from the connecting sleeve 224 is fixedly connected to the front end of the discharge port of the circulation pump 217. The outer surface of the external connecting tube 223 is slidably connected to the inner cavity of the docking tube 221, and the bottom end of the external connecting tube 223 is fixedly connected to a limiting sleeve.

[0025] The prestressing device 4 includes an external arc plate 41. A pressure-sensing arc plate 42 is fixedly connected to the top of the inner wall of the external arc plate 41. Sensitive springs 43 are evenly distributed on the lower surface of the pressure-sensing arc plate 42. A prestressing plug 44 is fixedly connected to the bottom of the sensitive spring 43, and the bottom of the prestressing plug 44 extends outside the external arc plate 41. The outer surface of the external arc plate 41 is fixedly connected to the outer surface of the docking tube 31, and the bottom of the external arc plate 41 is flush with the bottom of the docking tube 31. The top of the sensitive spring 43 is fixedly connected to the lower surface of the pressure-sensing arc plate 42, and the bottom of the outer surface of the prestressing plug 44 is slidably connected to the bottom of the inner cavity of the external arc plate 41.

[0026] Although the silver nitrate solution can circulate inside the device, the silver ion content of the silver nitrate solution inside is constantly decreasing during electroplating, so the silver nitrate solution needs to be replenished in time. At this time, the external connecting tubes 223 on both sides are opened, and high-concentration silver ion solution is added to the inside of the connecting tube 221 through the external connecting tube 223. Then, under the connection function of the connecting soft sleeve 224 and the external connecting tube 223, the connecting tube 221 is closed so that the silver nitrate solution inside can meet the electroplating requirements.

[0027] Before the docking tube 31 is about to contact the outer surface of the circuit board, the pre-stressing devices 4 located on both sides of the outer surface of the circuit board will contact the edge of the pre-treatment through-hole 12 in advance, and then the pre-stressing soft plug 44 will contact the outer surface of the circuit board in advance, and the pressure of the sensitive spring 43 will trigger the pressure-sensitive arc plate 42. At this time, the pressure-sensitive arc plate 42 sends an electrical signal to make the fine-tuning slide box 214 reduce the sliding speed of the guide slide rod 212 in time, thereby performing fine-tuning work, and finally when the docking tube 31 is docked with the pre-treatment through-hole 12, no strong impact or extrusion marks will be caused to the circuit board.

[0028] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A circuit board electroplating pre-treatment device, comprising a stacking device (1) and a treatment device (2), characterized in that: The stacking device (1) comprises a stacking circuit board (11), the inner cavity of the stacking circuit board (11) is provided with a pre-processing through-hole (12), the outer surface of the stacking circuit board (11) is symmetrically provided with a guide receiving sheath (13), and the lower surface of the guide receiving sheath (13) is fixedly connected to a horizontal moving rod (14); The processing device (2) comprises a control component (21), a drainage device (22) is symmetrically provided on the front of the control component (21), and a docking device (3) is fixedly connected to the front end of the drainage device (22); The docking device (3) comprises a docking tube (31), a clamping groove (32) is provided at the top of the outer surface of the docking tube (31), an isolation groove (33) is provided at the bottom of the inner cavity of the docking tube (31), a built-in air pump (34) is symmetrically provided at the upper part of the inner cavity of the docking tube (31), a folding connecting pipe (35) is fixedly connected to the bottom end of the exhaust port of the built-in air pump (34), an energy storage ring (36) is fixedly connected to the bottom end of the folding connecting pipe (35), a heat release resistor plate (37) is symmetrically provided at the bottom of the inner cavity of the energy storage ring (36), a waterproof gasket (38) is fixedly connected to the bottom end of the heat release resistor plate (37), and pre-pressing devices (4) are symmetrically provided on both sides of the outer surface of the docking tube (31).

2. The circuit board electroplating pretreatment equipment according to claim 1, characterized in that: The control component (21) includes a cluster box (211), the inner cavity of the cluster box (211) is evenly provided with guide slides (212), the middle part of the inner cavity of the cluster box (211) is slidably connected to a propulsion slide (213), the front end of the propulsion slide (213) is symmetrically provided with a fine-tuning slide box (214), the inner cavity of the fine-tuning slide box (214) is evenly provided with control connecting rods (215) through guide slide grooves, the front end of the control connecting rod (215) is fixedly connected to a sleeve connecting plate (216), the outer surface of the fine-tuning slide box (214) is fixedly connected to a circulation pump (217) on a side away from the propulsion slide (213), and the back of the inner cavity of the circulation pump (217) is symmetrically provided with an external circulation pipe (218).

3. The circuit board electroplating pretreatment equipment according to claim 2, characterized in that: The number of the control components (21) is two, the front end of the inner wall of the sleeve connecting plate (216) is clamped with the top of the outer surface of the docking tube (31) through the clamping groove (32), the outer surface of the control connecting rod (215) is slidably connected with the inner cavity of the fine-tuning slide box (214), the number of the external circulation pipes (218) is four, and both ends of the external circulation pipes (218) extend to the interior of the circulation pump (217).

4. The circuit board electroplating pretreatment equipment according to claim 3, characterized in that: The outer surface of the built-in air pump (34) is fixedly connected to the inner cavity of the docking tube (31), the outer surface of the energy storage ring (36) is slidably connected to the inner cavity of the docking tube (31), the bottom end of the heat release resistor plate (37) extends to the inside of the isolation groove (33), and the upper surface of the waterproof gasket (38) and the top of the inner wall of the isolation groove (33) are pressed against each other.

5. The circuit board electroplating pre-treatment equipment according to claim 4, characterized in that: The bottom end of the docking tube (31) is pressed against the outer surface of the stacked circuit board (11) through the pre-processing through-hole (12), the upper and lower ends of the guide slide bar (212) are fixedly connected to anchor blocks, and the outer surface of the fine-tuning slide box (214) is fixedly connected to the front end of the propulsion slide (213).

6. The circuit board electroplating pre-treatment equipment according to claim 1, characterized in that: The drainage device (22) comprises a butt-joint connecting tube (221), the bottom end of the butt-joint connecting tube (221) being fixedly connected to a compression connecting tube (222), external connecting tubes (223) being symmetrically provided on both sides of the inner cavity of the butt-joint connecting tube (221) through through-openings, and a connecting soft sleeve (224) being inserted into the top of the inner wall of the external connecting tube (223).

7. The circuit board electroplating pre-treatment equipment according to claim 6, characterized in that: The bottom end of the connecting soft sleeve (224) is fixedly connected to the top end of the docking tube (31); the end of the docking connecting pipe (221) away from the connecting soft sleeve (224) is fixedly connected to the front end of the liquid discharge port of the circulation pump (217); the outer surface of the external connecting pipe (223) is slidably connected to the inner cavity of the docking connecting pipe (221); and the bottom end of the external connecting pipe (223) is fixedly connected to the limiting sleeve.

8. The circuit board electroplating pre-treatment equipment according to claim 1, characterized in that: The prestressing device (4) comprises an external arc plate (41), the top of the inner wall of the external arc plate (41) is fixedly connected to a pressure-sensitive arc plate (42), the lower surface of the pressure-sensitive arc plate (42) is evenly provided with sensitive springs (43), the bottom end of the sensitive spring (43) is fixedly connected to a prestressing soft plug (44), and the bottom end of the prestressing soft plug (44) extends to the outside of the external arc plate (41).

9. The circuit board electroplating pre-treatment equipment according to claim 8, characterized in that: The outer surface of the external arc plate (41) is fixedly connected to the outer surface of the docking tube (31), and the bottom of the external arc plate (41) is flush with the bottom of the docking tube (31). The top of the sensitive spring (43) is fixedly connected to the lower surface of the pressure-sensitive arc plate (42), and the bottom of the outer surface of the pre-pressing soft plug (44) is slidably connected to the bottom of the inner cavity of the external arc plate (41).

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