Electric card heat exchange device and electric card heat exchange system

Abstract

The invention relates to the technical field of refrigeration, and discloses an electrocaloric heat exchange device which comprises a spraying shell, a first heat exchanger, a second heat exchanger, a third heat exchanger and a fourth heat exchanger. The electrocaloric spraying heat exchange assembly is arranged in the spraying cavity, the electrocaloric spraying heat exchange assembly comprises an electrocaloric refrigeration element and a spraying element for spraying a heat exchange working medium to the electrocaloric refrigeration element, the electrocaloric refrigeration element comprises an electrocaloric film layer and a substrate film layer, and the substrate film layer is provided with a hydrophobic structure. According to the electrocaloric heat exchange device provided by the embodiment of the invention, the separation effect of heat and cold of the electrocaloric refrigeration element is improved. The invention further provides an electric card heat exchange system comprising the electric card heat exchange device.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric heat exchange device and an electric heat exchange system. Background Art

[0002] Compressor refrigeration products use fluorinated refrigerants, which contribute to the greenhouse effect during production and use, and pose the risk of environmental pollution from leaks. With the development of modern society, the increasing demand for refrigeration has exacerbated environmental issues such as the global energy crisis and extreme heat waves. Therefore, a new refrigeration technology is urgently needed to replace existing ones.

[0003] Among the many compressor-free refrigeration methods, the new solid-state refrigeration technology based on the electrocaloric effect is the technology most likely to surpass compressor refrigeration, thermoelectric refrigeration, magnetic refrigeration, and elastic caloric refrigeration. However, ferroelectric materials based on the electrocaloric effect do not have the natural hot and cold separation characteristics of thermoelectric materials. Therefore, it is necessary to design an electrocaloric recycling system to achieve hot and cold separation, and then realize refrigeration applications.

[0004] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0005] Electric card cooling elements alternately generate heat and cold, which requires separation of the heat and cold generated by the electric card cooling element to achieve a cooling effect. However, existing electric card cooling elements have poor separation of heat and cold.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] An embodiment of the present disclosure provides an electric card heat exchange device.

[0009] In some embodiments, the electric card heat exchange device includes: a spray shell, which encloses a spray chamber, and the spray shell is provided with a working fluid inlet and a working fluid outlet connected to the spray chamber; an electric card spray heat exchange component, which is arranged in the spray chamber, and the electric card spray heat exchange component includes an electric card cooling element and a spray element that sprays the heat exchange working fluid onto the electric card cooling element, wherein the electric card cooling element includes an electric card film layer and a substrate film layer, and the substrate film layer is provided with a hydrophobic structure.

[0010] In some optional embodiments, the substrate film layer includes a support layer in close contact with the electric card film layer, and a hydrophobic layer opposite to the support layer, wherein the hydrophobic structure is provided in the hydrophobic layer.

[0011] In some optional embodiments, the hydrophobic structure includes a plurality of hydrophobic protrusions arranged in an array.

[0012] In some optional embodiments, the spray element includes a spray plate, and a spray inlet arranged on the spray plate and connected to the working medium inlet, wherein the spray inlet is connected to the spray distribution cavity inside the spray plate, and a spray port connected to the spray distribution cavity is arranged on the surface of the spray plate.

[0013] In some optional embodiments, the angle between the electric card cooling element and the horizontal plane is a first angle, and the angle between the spray plate and the horizontal plane is a second angle, wherein the first angle is greater than 0° and less than or equal to 90°; and / or the second angle is greater than 0° and less than or equal to 90°; and / or the first angle is less than or equal to the second angle.

[0014] In some optional embodiments, the spray port of the spray plate is arranged toward the hydrophobic layer of the substrate film layer, and the spray plate includes a spray portion provided with a plurality of spray ports, wherein the area of ​​the spray portion is greater than or equal to the area of ​​the hydrophobic layer.

[0015] In some optional embodiments, the distance between the spray port and the hydrophobic layer of the electric card cooling element is less than or equal to a first preset distance; and / or, the spray plate includes a front spray plate provided with a spray port, and a spray back plate opposite to the front spray plate, and the distance between the front spray plate and the spray back plate is less than or equal to a second preset distance.

[0016] In some optional embodiments, a plurality of electric card spray heat exchange components are provided in the spray chamber, and the plurality of electric card spray heat exchange components include an adjacent first electric card spray heat exchange component and a second electric card spray heat exchange component, the first electric card spray heat exchange component includes a first electric card cooling element and a first spray element, and the second electric card spray heat exchange component includes a second electric card cooling element and a second spray element, wherein the first spray element includes a first spray part for spraying a heat exchange medium onto the first electric card cooling element and a second spray part for spraying a heat exchange medium onto the second electric card cooling element.

[0017] The disclosed embodiment also provides an electric card heat exchange system.

[0018] In some embodiments, the electric heat exchange system includes the electric heat exchange device as described above.

[0019] In some optional embodiments, the electric card heat exchange system also includes: a first working fluid circulation pipeline, including a first inlet end and a first outlet end, and the first working fluid circulation pipeline is provided with a first valve body and a hot end heat exchanger; a second working fluid circulation pipeline, including a second inlet end and a second outlet end, and the second working fluid circulation pipeline is provided with a second valve body and a cold end heat exchanger; a first connecting pipeline, one end of which is connected to the first inlet end and the second inlet end, and the other end is connected to the working fluid outlet of the spray shell; and, a second connecting pipeline, one end of which is connected to the first outlet end and the second outlet end, and the other end is connected to the working fluid inlet of the spray shell.

[0020] The electric heat exchange device and electric heat exchange system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0021] The electrocaloric heat exchange device provided in the disclosed embodiments includes a spray housing and an electrocaloric spray heat exchange assembly disposed within a spray chamber of the spray housing. The spray housing encloses the spray chamber and is provided with a working fluid inlet and a working fluid outlet communicating with the spray chamber. The electrocaloric spray heat exchange assembly includes an electrocaloric cooling element and a spray element for spraying a heat exchange working fluid onto the electrocaloric cooling element. The substrate membrane layer of the electrocaloric cooling element is provided with a hydrophobic structure.

[0022] In the electric heat exchange device provided by the embodiment of the present disclosure, the substrate film layer of the electric cooling element is provided with a hydrophobic structure, and the heat exchange medium is sprayed onto the electric cooling element through the spray element. After the heat exchange medium completes the heat exchange, it can quickly flow down along the electric cooling element, thereby improving the heat exchange efficiency between the heat exchange medium and the electric cooling element, and thereby improving the separation effect of the heat and cooling capacity of the electric cooling element.

[0023] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices. The drawings do not constitute a scale limitation. In addition,

[0025] Figure 1 is a schematic diagram of an electric card cooling element provided by an embodiment of the present disclosure;

[0026] Figure 2 yes Figure 1 Enlarged view of selected part;

[0027] Figure 3 is a schematic diagram of a substrate film layer provided by an embodiment of the present disclosure;

[0028] Figure 4is a schematic diagram of a spray element provided by an embodiment of the present disclosure;

[0029] Figure 5 is a schematic diagram of an electric card heat exchange device provided by an embodiment of the present disclosure;

[0030] Figure 6 It is a schematic diagram of an electric card heat exchange system provided in an embodiment of the present disclosure.

[0031] Reference numerals:

[0032] 11: first electrocardioid cooling element; 101: electrocardioid film layer; 102: fixture; 103: substrate film layer; 104: support layer; 12: second electrocardioid cooling element; 1031: hydrophobic protrusion;

[0033] 21: first spray element; 201: spray plate; 202: spray inlet; 22: second spray element; 2011: spray port;

[0034] 301: spray shell; 302: working fluid inlet; 303: working fluid outlet;

[0035] 310: second connecting pipe; 311: pump;

[0036] 320: first connecting pipe; 321: one-way valve;

[0037] 410: first working medium circulation pipeline; 411: first inlet end; 412: first outlet end;

[0038] 510: second working medium circulation pipeline; 511: second inlet end; 512: second outlet end;

[0039] 610: hot end heat exchanger; 611: first valve body;

[0040] 710: cold end heat exchanger; 711: second valve body. DETAILED DESCRIPTION

[0041] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0042] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that such terms are interchangeable where appropriate to describe the embodiments of the present disclosure. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0043] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to having a specific orientation, or to being constructed and operated in a specific orientation. Moreover, in addition to being used to indicate orientations or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure may be understood based on the specific circumstances.

[0044] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, components, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0045] Unless otherwise stated, the term "plurality" means two or more.

[0046] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0047] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0048] The electrocaloric effect is a cooling and heating effect in ferroelectric materials under an electric field: heat is released when an electric field is applied and heat is absorbed when the field is removed. A high electric field is applied to a ferroelectric thin film through electrodes on either side to stimulate this cyclical electrocaloric effect. Electrocaloric cooling elements utilize this effect, releasing heat when an electric field is applied and absorbing heat when the field is removed.

[0049] The embodiment of the present disclosure provides an electric card heat exchange device, such as Figures 1 to 5 shown.

[0050] The electrocaloric heat exchange device provided in the embodiment of the present disclosure includes a spray housing 301 and an electrocaloric spray heat exchange assembly. The spray housing 301 encloses a spray chamber, and the spray housing 301 is provided with a working fluid inlet 302 and a working fluid outlet 303 connected to the spray chamber. The electrocaloric spray heat exchange assembly is disposed in the spray chamber and includes an electrocaloric cooling element and a spray element for spraying a heat exchange working fluid onto the electrocaloric cooling element. The electrocaloric cooling element includes an electrocaloric film layer 101 and a substrate film layer 103, and the substrate film layer 103 is provided with a hydrophobic structure.

[0051] In the electric heat exchange device provided by the embodiment of the present disclosure, the substrate film layer 103 of the electric cooling element is provided with a hydrophobic structure. When the heat exchange medium is sprayed onto the surface of the electric cooling element, the setting of the hydrophobic structure enables the heat exchange medium to flow rapidly downward along the surface of the electric cooling element after completing the heat exchange, thereby improving the dryness of the surface of the electric cooling element after completing a single spraying, thereby avoiding the crossover of heat and cold when using the heat exchange medium to exchange heat and cold on the electric cooling element, and improving the separation effect of heat and cold on the electric cooling element.

[0052] Optionally, the working medium inlet 302 of the spray housing 301 is connected to the spray element, so that the heat exchange working medium entering from the working medium inlet 302 of the spray housing 301 can first enter the spray element and then spray to the electric card refrigeration element through the spray element.

[0053] When an electric field is applied to the electro-cooling element, the heat exchange medium, entering through the medium inlet 302 of the spray housing 301, first enters the spray element before being sprayed onto the surface of the electro-cooling element, exchanging heat with the heat exchange medium. Due to the hydrophobic structure of the electro-cooling element's substrate film layer 103, the heat exchange medium rapidly flows off the surface of the electro-cooling element after heat exchange. This keeps the surface of the electro-cooling element drier after heat exchange, preventing any residual heat exchange medium and facilitating subsequent cooling.

[0054] Similarly, when the electric field is removed, the electro-cooling element absorbs heat. At this point, the heat exchange medium entering through the medium inlet 302 of the spray housing 301 first enters the spray element and is then sprayed onto the surface of the electro-cooling element, exchanging cold with the heat exchange medium. Due to the hydrophobic structure of the electro-cooling element's substrate film layer 103, the heat exchange medium, after completing the cold exchange, quickly flows off the surface of the electro-cooling element. This keeps the surface of the electro-cooling element drier after the cold exchange, preventing any residual heat exchange medium and facilitating subsequent heat exchange.

[0055] Optionally, the bottom of the spray chamber is in a funnel shape, which is convenient for collecting or gathering the heat exchange medium after completing the heat or cold exchange and flowing out from the medium outlet 303. Figure 5 shown.

[0056] The surface of the electric card cooling element is electrically charged. Optionally, the heat exchange medium includes an insulating heat-conducting liquid, such as a single-phase fluorinated liquid, a phase-change fluorinated coolant, or transformer insulating heat-conducting oil. For experimental or industrial applications, transformer insulating heat-conducting oil is preferred for heat exchange and hot / cold separation.

[0057] Optionally, an insulating layer, such as an aluminum nitride layer or an aluminum oxide layer, may be deposited on the surface of the electric card refrigeration element. In this case, the heat exchange medium may include a non-insulating heat-conducting liquid, such as water.

[0058] Optionally, the substrate film layer 103 includes a support layer in close contact with the electric card film layer 101 and a hydrophobic layer opposite to the support layer, wherein the hydrophobic structure is provided in the hydrophobic layer.

[0059] The substrate film layer 103 includes two opposite surfaces, wherein the surface in close contact with the electric card film layer 101 is the support layer, and the surface opposite to the support layer is the hydrophobic layer. The hydrophobic structure is provided on the hydrophobic layer of the substrate film layer 103 .

[0060] The hydrophobic structure is provided on the hydrophobic layer of the substrate film layer 103, and the hydrophobic layer is a surface layer in direct contact with the heat exchange medium, thus increasing the speed at which the heat exchange medium flows down the surface of the electric card refrigeration element after heat exchange.

[0061] Optionally, the hydrophobic structure includes a plurality of hydrophobic protrusions 1031 arranged in an array.

[0062] When the electric card heat exchange device is installed and used, the multiple array-arranged hydrophobic protrusions 1031 form multiple vertical channels, which improve the hydrophobic effect of the hydrophobic protrusions 1031 on the heat exchange medium. It can be understood that the hydrophobic protrusions 1031 include an upper row of hydrophobic protrusions located in the uppermost row and a lower row of hydrophobic protrusions located in the lowermost row. The upper row of hydrophobic protrusions and the lower row of hydrophobic protrusions can also include multiple middle rows of hydrophobic protrusions. The upper row of hydrophobic protrusions, the middle row of hydrophobic protrusions and the lower row of hydrophobic protrusions together form multiple vertical channels, such as Figure 3 shown.

[0063] Optionally, the spray element includes a spray plate 201, and a spray inlet 202 arranged on the spray plate 201 and connected to the working medium inlet 302, wherein the spray inlet 202 is connected to the spray distribution cavity inside the spray plate 201, and a spray port 2011 connected to the spray distribution cavity is arranged on the surface of the spray plate 201.

[0064] The spray element includes a spray plate 201, which has a spray distribution cavity disposed therein for temporarily accommodating a heat exchange medium. This allows the heat exchange medium flowing into the spray element to be distributed by the spray distribution cavity before exiting through spray ports 2011. Optionally, the spray plate 201 is provided with multiple spray ports 2011, which are evenly arranged in an array on the surface of the spray plate 201. This improves the uniformity of the heat exchange medium exiting from the different spray ports 2011. Optionally, the spray ports 2011 have a relatively small diameter, such as micropores. For example, the diameter of the spray ports 2011 is greater than or equal to 1 mm and less than or equal to 5 mm. This allows the heat exchange medium exiting through the spray ports 2011 to be sprayed or atomized onto the surface of the electric card cooling element, thereby improving the heat or cooling exchange between the heat exchange medium and the electric card cooling element. Optionally, the electric card refrigeration element is in a straight plate shape, and similarly, the spray plate 201 is also in a straight plate shape, which also improves the spraying effect of the spray element on the electric card refrigeration element.

[0065] Optionally, the angle between the electric card cooling element and the horizontal plane is a first angle, and the angle between the spray plate 201 and the horizontal plane is a second angle, wherein the first angle is greater than 0° and less than or equal to 90°; and / or the second angle is greater than 0° and less than or equal to 90°; and / or the first angle is less than or equal to the second angle.

[0066] The electric card cooling element and the spray element are arranged in the spray chamber, wherein the angle between the electric card cooling element and the horizontal plane is a first angle, and the first angle is greater than 0° and less than or equal to 90°. It can be understood that the electric card cooling element is not arranged in a horizontal state in the spray chamber, but has a certain inclination angle with the horizontal plane. When the first angle is 90°, the electric card cooling element is arranged in a vertical state in the spray chamber. Similarly, the angle between the spray plate 201 of the spray element and the horizontal plane is a second angle, and the second angle is greater than 0° and less than or equal to 90°. It can be understood that the spray plate 201 is not arranged in a horizontal state in the spray chamber, but has a certain inclination angle with the horizontal plane. When the second angle is 90°, the spray plate 201 is arranged in a vertical state in the spray chamber.

[0067] Optionally, the first angle may be equal to the second angle, that is, the electric card cooling element and the spray plate 201 are parallel to each other.

[0068] Optionally, the spray port 2011 of the spray plate 201 is arranged toward the hydrophobic layer of the substrate film layer 103 , and the spray plate 201 includes a spray portion provided with a plurality of spray ports 2011 , wherein the area of ​​the spray portion is greater than or equal to the area of ​​the hydrophobic layer.

[0069] The spray plate 201 includes a spray portion with multiple spray ports 2011. The spray portion can also be understood as the effective spraying area of ​​the spray plate 201. The area of ​​the spray portion is greater than or equal to the area of ​​the hydrophobic layer. This ensures that the hydrophobic layer of the electric card cooling element can be sprayed with the heat exchange medium, thereby improving the heat or cooling exchange efficiency of the electric card cooling element.

[0070] Optionally, the area of ​​the spray portion is greater than or equal to the area of ​​the electric card cooling element; or, the spray port 2011 of the spray plate 201 can also face the electric card film layer 101 of the electric card cooling element, and the area of ​​the spray portion is greater than or equal to the area of ​​the electric card film layer 101.

[0071] Optionally, the distance between the spray port 2011 and the hydrophobic layer of the electric card cooling element is less than or equal to a first preset distance; and / or, the spray plate 201 includes a front spray plate provided with the spray port 2011, and a spray back plate opposite to the front spray plate, and the distance between the front spray plate and the spray back plate is less than or equal to a second preset distance.

[0072] When the spray port 2011 is facing the hydrophobic layer of the electric card cooling element, the distance between the spray port 2011 and the hydrophobic layer of the electric card cooling element is less than or equal to the first preset distance. This allows the heat exchange medium sprayed from the spray port 2011 to quickly reach the surface of the electric card cooling element with a minimum falling distance, thereby improving the spray accuracy of the spray element on the electric card cooling element and increasing the speed at which the heat exchange medium reaches the surface of the electric card cooling element, allowing it to quickly flow down after completing the heat exchange. Similarly, when the spray port 2011 is facing the electric card film layer 101 of the electric card cooling element, the distance between the spray port 2011 and the electric card film layer 101 of the electric card cooling element is also less than or equal to the first preset distance.

[0073] The distance between the front spray plate and the spray back plate of the spray plate 201 is less than or equal to the second preset distance. In this way, the heat exchange medium flowing into the working medium inlet 302 of the spray shell 301 does not need to stay in the spray plate 201 for too long, and can be quickly sprayed out through the spray port 2011, thereby increasing the flow rate of the heat exchange medium flowing out of the spray port 2011.

[0074] Optionally, multiple electric card spray heat exchange components are arranged in the spray chamber, and the multiple electric card spray heat exchange components include adjacent first electric card spray heat exchange components and second electric card spray heat exchange components, the first electric card spray heat exchange component includes a first electric card cooling element 11 and a first spray element 21, and the second electric card spray heat exchange component includes a second electric card cooling element 12 and a second spray element 22, wherein the first spray element 21 includes a first spray part for spraying heat exchange medium onto the first electric card cooling element 11 and a second spray part for spraying heat exchange medium onto the second electric card cooling element 12.

[0075] The spray chamber within the spray housing 301 can be equipped with multiple electric heat exchange components, thereby increasing the total heat exchange capacity of the electric heat exchange device. The first electric heat exchange component and the second electric heat exchange component are arranged adjacent to each other, which can also be understood as the first electric heat exchange component and the second electric heat exchange component being arranged side by side in a horizontal direction.

[0076] Optionally, the first electric cooling element 11, the first spray element 21, the second electric cooling element 12, and the second spray element 22 are arranged side by side in a horizontal sequence. In this case, the first spray element 21 is arranged between the first electric cooling element 11 and the second electric cooling element 12. The first spray element 21 includes both a first spray portion and a second spray portion to spray the first electric cooling element 11 and the second electric cooling element 12, respectively. Simultaneously, the second spray element 22 can also spray the second electric cooling element 12, thereby improving the heat or cold exchange efficiency of the second electric cooling element 12. Optionally, the first spray element 21 and the second spray element 22 spray different surfaces of the second electric cooling element 12, respectively. Optionally, the first spray portion and the second spray portion are respectively arranged on two opposing surfaces of the first spray element 21.

[0077] It is understood that the working medium inlet 302 of the spray housing 301 is connected to the first spray element 21 and the second spray element 22, so that the heat exchange working medium entering through the working medium inlet 302 can be distributed to the first spray element 21 and the second spray element 22. Optionally, a liquid separation valve is provided between the working medium inlet 302 and the first spray element 21 and the second spray element 22 to improve the uniformity of the heat exchange working medium in the first spray element 21 and the second spray element 22.

[0078] The embodiment of the present disclosure provides a method for preparing an electric card cooling element, which adopts the sol-gel method. (1) First, a 280nm thick silicon oxide is obtained on the surface of a silicon wafer as a support layer 104 by magnetron sputtering. (2) A lower electrode is plated. A Pt lower electrode is prepared on the silicon oxide by magnetron sputtering, electron beam evaporator or thermal evaporator. (3) Spin coating. Since the silicon substrate is relatively thin, it is easy to break under the action of centrifugal force during spin coating. Therefore, a silicon wafer is used as a support and placed under the silicon substrate. The two are fixed using a clamp 102, such as Figure 1 and 2As shown. During spin coating, the precursor solution is applied to the substrate, the speed is set to 3500 rpm, and the time is 30 seconds. (4) Remove the support and dry: temperature 200℃, time 5 minutes. (5) Cracking, temperature 400℃, time 30 minutes; (6) Crystallization, temperature 600℃, time 60 minutes. (7) Repeat steps 3-6 to prepare a multilayer film until the film thickness reaches 3μm. The film material includes but is not limited to lead zirconate titanate (PZT), lead tantalate scandate (PST), and lead lanthanum zirconate titanate (PLZT). (8) Top electrode plating: prepare a Pt top electrode on the film using magnetron sputtering or electron beam evaporator or thermal evaporator. (9) Use wire cutting to cut the wafer into 3cm*6cm rectangles.

[0079] Optionally, an etching method may be used to obtain the hydrophobic structure of the electrocaloric refrigeration element.

[0080] The disclosed embodiment also provides an electric card heat exchange system.

[0081] The electric heat exchange system provided in the embodiments of the present disclosure includes the aforementioned electric heat exchange device. The electric heat exchange system can utilize the heat and cooling capacity of the electric heat exchange device. For example, the heat from the electric heat exchange device can be used to heat a room, or the cooling capacity can be used to cool a room or a cabinet. Household appliances incorporating the electric heat exchange system provided in the embodiments of the present disclosure may include air conditioners, refrigerators, freezers, display cabinets, and other refrigeration equipment.

[0082] Optionally, the aforementioned electric heat exchange system further includes a first working fluid circulation pipeline 410, a second working fluid circulation pipeline 510, a first connecting pipeline 320, and a second connecting pipeline 310. The first working fluid circulation pipeline 410 includes a first inlet end 411 and a first outlet end 412, and is provided with a first valve body 611 and a hot end heat exchanger 610; the second working fluid circulation pipeline 510 includes a second inlet end 511 and a second outlet end 512, and is provided with a second valve body 711 and a cold end heat exchanger 710; one end of the first connecting pipeline 320 is connected to the first inlet end 411 and the second inlet end 511, and the other end is connected to the working fluid outlet 303 of the spray shell 301; one end of the second connecting pipeline 310 is connected to the first outlet end 412 and the second outlet end 512, and the other end is connected to the working fluid inlet 302 of the spray shell 301.

[0083] The first working fluid circulation pipeline 410, the first connecting pipeline 320, and the second connecting pipeline 310 form a first closed loop, and the first working fluid circulation pipeline 410 is provided with a hot-end heat exchanger 610. When the electric field is applied, the electrocardioid refrigeration element releases heat. At this time, the heat exchange working fluid entering through the working fluid inlet 302 exchanges heat with the electrocardioid refrigeration element. After completing the heat exchange, the high-temperature heat exchange working fluid flows through the working fluid outlet 303 to the first working fluid circulation pipeline 410 and is utilized in the hot-end heat exchanger 610 of the first working fluid circulation pipeline 410. Similarly, when the electric field is removed, the electrocardioid refrigeration element absorbs heat. At this time, the heat exchange working fluid entering through the working fluid inlet 302 exchanges cold with the electrocardioid refrigeration element. After completing the cold exchange, the low-temperature heat exchange working fluid flows through the working fluid outlet 303 to the second working fluid circulation pipeline 510 and is utilized in the cold-end heat exchanger 710 of the second working fluid circulation pipeline 510.

[0084] The electric heat exchange system provided in the embodiment of the present disclosure further includes a control unit, which includes a temperature acquisition module and a working fluid adjustment module.

[0085] a temperature acquisition module configured to acquire a first surface temperature of the electric card refrigeration element when generating heat and a second surface temperature of the electric card refrigeration element when generating cold;

[0086] The working medium regulating module is configured to regulate the amount of hot end return working medium entering the spray shell according to the first surface temperature, or to regulate the amount of cold end return working medium entering the spray shell according to the second surface temperature.

[0087] Among them, the hot end reflux working medium is the heat exchange working medium after heat exchange in the hot end heat exchanger, and the cold end reflux working medium is the heat exchange working medium after heat exchange in the cold end heat exchanger.

[0088] The first surface temperature of the electric card cooling element when generating heat is detected in real time, and the amount of hot-end return fluid entering the spray shell is adjusted based on this first surface temperature. When an electric field is applied, the electric card cooling element releases heat, causing its surface temperature to rise. As the heat exchange medium and the electric card cooling element exchange heat, the surface temperature of the electric card cooling element gradually decreases. In this embodiment, the numerical change in the first surface temperature represents the progress of the heat exchange medium's exchange of heat generated by the electric card cooling element, and based on this, the amount of hot-end return fluid entering the spray shell is adjusted. This improves the accuracy of the heat exchange medium's heat exchange, thereby enhancing the heat exchange efficiency of the heat exchange medium.

[0089] Furthermore, the second surface temperature of the electric card cooling element surface when generating cooling is detected in real time, and the amount of cold-end return fluid entering the spray shell is adjusted based on the second surface temperature. When the electric field is removed, the electric card cooling element absorbs heat, and its surface temperature decreases. As the heat exchange medium exchanges cooling energy with the electric card cooling element, the surface temperature of the electric card cooling element gradually increases. In this embodiment, the numerical change in the second surface temperature characterizes the process of the heat exchange medium exchanging cooling energy generated by the electric card cooling element, and based on this, the amount of cold-end return fluid entering the spray shell is adjusted. This improves the accuracy of the heat exchange medium's cooling energy exchange, thereby improving the cooling energy exchange effect of the heat exchange medium.

[0090] Optionally, regulating the amount of the hot end reflux medium entering the spray housing according to the first surface temperature includes controlling the hot end reflux medium to stop entering the spray housing when the first surface temperature is less than or equal to a first temperature threshold.

[0091] When the first surface temperature is less than or equal to the first temperature threshold, it is considered that the heat exchange medium has completed the heat exchange with the heat generated by the electric card refrigeration element. At this time, the hot end reflux medium is controlled to stop entering the spray shell, so that the electric card refrigeration element does not cross the heat exchange process when generating cold energy subsequently, thereby improving the heat exchange effect of the electric card refrigeration element.

[0092] Similarly, regulating the amount of the cold-end return medium entering the spray shell according to the second surface temperature includes controlling the cold-end return medium to stop entering the spray shell when the second surface temperature is greater than or equal to a second temperature threshold.

[0093] When the second surface temperature is greater than or equal to the second temperature threshold, it is considered that the heat exchange medium has completed the cold exchange with the cold energy generated by the electric card refrigeration element. At this time, the cold end reflux medium is controlled to stop entering the spray shell, so that the electric card refrigeration element does not cross the heat exchange process when generating heat subsequently, thereby improving the cold exchange effect on the electric card refrigeration element.

[0094] When the first surface temperature is less than or equal to the first temperature threshold, the first liquid level value of the spray shell is obtained. When the first liquid level value is less than or equal to the liquid level threshold, the electric card refrigeration element is controlled to be powered off, so that the electric card refrigeration element switches to generating cold energy.

[0095] When the first surface temperature is less than or equal to the first temperature threshold, the heat exchange medium is deemed to have completed heat exchange with the heat generated by the electric card cooling element. Subsequently, a first liquid level value at the working medium outlet of the spray housing is detected. When the first liquid level value at the working medium outlet is less than or equal to the liquid level threshold, the hot working medium in the spray housing is deemed to have been drained, i.e., heat exchange with the electric card cooling element has been completed. At this point, the electric card cooling element can be powered off, switching it to generating cooling for subsequent cooling exchange. In this embodiment, the next cooling exchange step is performed only after the hot working medium in the spray housing is completely drained, thereby improving the separation of heat exchange and cooling exchange with the electric card cooling element.

[0096] When the second surface temperature is greater than or equal to the second temperature threshold, the second liquid level value of the spray shell is obtained. When the second liquid level value is less than or equal to the liquid level threshold, the electric card cooling element is controlled to be energized so that the electric card cooling element switches to generate heat.

[0097] When the second surface temperature is greater than or equal to the second temperature threshold, the heat exchange medium is deemed to have completed the cold exchange with the cooling energy generated by the electric card refrigeration element. Subsequently, a second liquid level value at the working medium outlet of the spray shell is detected. When the second liquid level value at the working medium outlet is less than or equal to the liquid level threshold, the cold working medium in the spray shell is deemed to have been drained, i.e., the cooling energy exchange with the electric card refrigeration element has been completed. At this point, the electric card refrigeration element can be energized to switch to generating heat for subsequent heat exchange. In this embodiment, the next step of heat exchange is performed after the cold working medium in the spray shell is completely drained, thereby improving the separation of heat exchange and cooling energy exchange with the electric card refrigeration element.

[0098] Optionally, adjusting the amount of the hot-end reflux medium entering the spray housing according to the first surface temperature includes adjusting a spraying speed of the spray element on the hot-end reflux medium according to a decreasing rate of the first surface temperature.

[0099] When the rate of decrease of the first surface temperature is less than or equal to the first rate, and the temperature of the hot working medium at the working medium outlet of the spray shell is greater than or equal to the third temperature threshold, it is considered that the heat exchange of the heat exchange working medium with the electric card refrigeration element is in the peak period of heat exchange in the first half of the period, and the heat exchange working medium of the current spray element enters the spray shell slowly, which reduces the heat exchange efficiency of the electric card refrigeration element. At this time, the spray speed of the spray element to the hot end reflux working medium can be increased to improve the heat exchange rate with the electric card refrigeration element.

[0100] Adjusting the amount of the cold end return medium entering the spray shell according to the second surface temperature includes adjusting the spraying speed of the spray element on the cold end return medium according to the rising rate of the second surface temperature.

[0101] It is understandable that the spraying speed can be adjusted by adjusting the pump 311 provided on the second connecting pipe 310 .

[0102] When the rising rate of the second surface temperature is less than or equal to the second rate, and the temperature of the cold working medium at the working medium outlet of the spray shell is less than or equal to the fourth temperature threshold, it is considered that the cold exchange of the heat exchange working medium to the electric card refrigeration element is in the peak period of cold exchange in the first half of the period, and the heat exchange working medium currently entering the spray shell by the spray element is slow, which reduces the heat exchange efficiency of the electric card refrigeration element. At this time, the spray speed of the spray element to the cold end return working medium can be increased to improve the cold exchange rate to the electric card refrigeration element.

[0103] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card heat exchange device, characterized in that: include: The spray shell encloses a spray chamber, and the spray shell is provided with a working fluid inlet and a working fluid outlet connected to the spray chamber; The electric card spray heat exchange component is arranged in the spray chamber. The electric card spray heat exchange component includes an electric card refrigeration element and a spray element that sprays heat exchange medium to the electric card refrigeration element. The electric card refrigeration element includes an electric card film layer and a substrate film layer, and the substrate film layer is provided with a hydrophobic structure.

2. The electric card heat exchange device according to claim 1, characterized in that: The substrate film layer includes a support layer that is in close contact with the electric card film layer, and a hydrophobic layer opposite to the support layer. Wherein, the hydrophobic structure is arranged in the hydrophobic layer.

3. The electric card heat exchange device according to claim 2, characterized in that: The hydrophobic structure includes a plurality of hydrophobic protrusions arranged in an array.

4. The electric card heat exchange device according to claim 1, characterized in that: The spray element includes a spray plate and a spray inlet provided on the spray plate and connected to the working medium inlet. The spray inlet is connected to the spray distribution cavity inside the spray plate, and the surface of the spray plate is provided with a spray port connected to the spray distribution cavity.

5. The electric card heat exchange device according to claim 4, characterized in that: The angle between the electric card cooling element and the horizontal plane is the first angle, and the angle between the spray plate and the horizontal plane is the second angle, wherein, The first angle is greater than 0° and less than or equal to 90°; and / or, The second angle is greater than 0° and less than or equal to 90°; and / or, The first angle is less than or equal to the second angle.

6. The electric card heat exchange device according to claim 4, characterized in that: The spray port of the spray plate is arranged toward the hydrophobic layer of the substrate film layer, and the spray plate includes a spray portion provided with a plurality of spray ports. The area of ​​the spray portion is greater than or equal to the area of ​​the hydrophobic layer.

7. The electric card heat exchange device according to claim 6, characterized in that: The distance between the spray port and the hydrophobic layer of the electric card refrigeration element is less than or equal to a first preset distance; and / or, The spray plate includes a front spray plate provided with a spray port, and a spray back plate opposite to the front spray plate, and the distance between the front spray plate and the spray back plate is less than or equal to a second preset distance.

8. The electric card heat exchange device according to any one of claims 1 to 7, characterized in that: A plurality of electric card spray heat exchange components are arranged in the spray chamber, and the plurality of electric card spray heat exchange components include a first electric card spray heat exchange component and a second electric card spray heat exchange component adjacent to each other. The first electric card spray heat exchange component includes a first electric card cooling element and a first spray element, and the second electric card spray heat exchange component includes a second electric card cooling element and a second spray element. The first spray element includes a first spray portion for spraying the heat exchange medium onto the first electric card refrigeration element and a second spray portion for spraying the heat exchange medium onto the second electric card refrigeration element.

9. An electric card heat exchange system, characterized in that: It comprises the electric card heat exchange device according to any one of claims 1 to 8.

10. The electric card heat exchange system according to claim 9, characterized in that: Also includes: A first working medium circulation pipeline includes a first inlet end and a first outlet end, and the first working medium circulation pipeline is provided with a first valve body and a hot end heat exchanger; A second working medium circulation pipeline includes a second inlet end and a second outlet end, and the second working medium circulation pipeline is provided with a second valve body and a cold end heat exchanger; a first connecting pipe, one end of which is connected to the first inlet end and the second inlet end, and the other end of which is connected to the working medium outlet of the spray shell; and, The second communicating pipeline has one end connected to the first outlet end and the second outlet end, and the other end connected to the working medium inlet of the spray shell.

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