Electric card heat source assembly and heat exchange system

Abstract

The invention relates to the technical field of refrigeration, and discloses an electrocaloric heat source assembly which comprises a heat exchange shell and an electrocaloric chip. A heat exchange cavity is defined by the heat exchange shell, and the heat exchange shell is provided with a working medium inlet and a working medium outlet which communicate with the heat exchange cavity. The electric card chip comprises an electric card film layer and a substrate layer, the electric card chip is arranged in the heat exchange cavity, a heat exchange working medium flowing in from the working medium inlet exchanges heat with the electric card chip and then flows out from the working medium outlet, and the substrate layer of the electric card chip comprises a framework part. According to the electrocaloric heat source assembly provided by the embodiment of the invention, the heat exchange effect of the heat exchange working medium and the electrocaloric chip is improved, and then the separation effect of the heat exchange working medium on heat and cold generated by the electrocaloric chip is improved. The invention further provides a heat exchange system comprising the electric card heat source assembly.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric card heat source component and a heat exchange system. Background Art

[0002] Traditional vapor compression refrigeration systems consist of four main components: a compressor, a condenser, a throttling device, and an evaporator. These are connected by pipes to form a completely closed system filled with refrigerant. While this technology is relatively mature, it suffers from the large and complex refrigeration system and the environmental hazards of the refrigerant. Therefore, compressor-free refrigeration technology has become a hot topic of research.

[0003] Solid-state refrigeration technologies include electrocaloric cooling, hotspot cooling, magnetic cooling, and elastic cooling. Ferroelectric materials, which exhibit the electrocaloric effect, can be used in electrocaloric cooling. However, ferroelectric materials lack the natural hot-cold separation characteristic of hotspot materials. Therefore, the design of an electrocaloric hot-cold separation system is required for their application in refrigeration technology to achieve effective cooling.

[0004] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0005] The existing cold and heat separation technology has a poor effect on separating the cold and heat of the electric card chip.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] An embodiment of the present disclosure provides an electric card heat source assembly.

[0009] In some embodiments, the electric card heat source assembly includes: a heat exchange shell, which encloses a heat exchange chamber, and the heat exchange shell is provided with a working fluid inlet and a working fluid outlet connected to the heat exchange chamber; and an electric card chip, including an electric card film layer and a substrate layer, and the electric card chip is arranged in the heat exchange chamber, and the heat exchange working fluid flowing in from the working fluid inlet exchanges heat with the electric card chip and then flows out from the working fluid outlet, wherein the substrate layer of the electric card chip includes a skeleton part.

[0010] The setting of the skeleton part reduces the flow resistance of the heat exchange medium during the heat exchange process, and improves the heat exchange efficiency of the heat exchange medium to the electric card chip.

[0011] In some optional embodiments, the electrical card chip includes a front end near the working fluid inlet and a rear end near the working fluid outlet, wherein the skeleton extends from the front end to the rear end. This allows the skeleton to reduce flow resistance throughout the entire process of the heat exchange working fluid flowing along the surface of the electrical card chip.

[0012] In some optional embodiments, the skeleton portion is S-shaped or linear, thereby further improving the fluidity of the heat exchange medium along the skeleton portion.

[0013] In some optional embodiments, the substrate layer includes multiple skeleton portions, and further includes a flow channel portion disposed between two adjacent skeleton portions, wherein the skeleton portion is higher than the flow channel portion. This reduces the distance between the heat exchange medium and the electrical card film layer when a large amount of heat exchange medium flows through the flow channel portion, thereby improving the heat exchange effect between the heat exchange medium and the electrical card chip.

[0014] In some optional embodiments, the width of the skeleton portion is a first width, and the width of the flow channel portion is a second width, wherein the second width is greater than or equal to twice the first width. The skeleton portion occupies a smaller proportion of the substrate layer, while the flow channel portion occupies a larger proportion. This increases the direct heat exchange area between the heat exchange medium and the flow channel portion, thereby improving the heat exchange effect between the heat exchange medium and the electric card chip.

[0015] In some optional embodiments, the heat exchange housing includes a first side plate provided with a working fluid inlet and a second side plate provided with a working fluid outlet. The first side plate is provided with multiple working fluid inlets, with a first mounting position provided between two adjacent working fluid inlets. The second side plate is provided with multiple working fluid outlets, with a second mounting position provided between two adjacent working fluid outlets. The electric card chip is fixedly disposed between the first mounting position and the second mounting position. This improves the installation stability of the electric card chip within the heat exchange housing.

[0016] In some optional embodiments, a first clamp for securing the electrical card chip is provided at the first mounting position, and a second clamp for securing the electrical card chip is provided at the second mounting position. The first clamp and the second clamp are used to secure the electrical card chip at both ends, respectively, thereby improving the stability of the electrical card chip within the heat exchange housing.

[0017] In some optional embodiments, the first side plate and the second side plate are two opposing vertical side plates, wherein the electric card chip is horizontally mounted between the first side plate and the second side plate. This ensures that the heat exchange medium has an equal immersion depth in all parts of the electric card chip, thereby improving the uniformity of heat transfer between the heat exchange medium and the electric card chip.

[0018] The embodiment of the present disclosure also provides a heat exchange system.

[0019] In some embodiments, the heat exchange system includes the aforementioned electric caloric heat source assembly.

[0020] In some optional embodiments, the heat exchange system further includes: a first working fluid flow path, including a first inlet end and a first outlet end, and provided with a hot-end heat exchanger, a first pump body, and a first one-way valve; a second working fluid flow path, including a second inlet end and a second outlet end, and provided with a cold-end heat exchanger, a second pump body, and a second one-way valve; a first liquid separation element, one end of which connects the first outlet end and the second outlet end, and the other end connects to the working fluid inlet of the heat exchange housing; and a second liquid separation element, one end of which connects the first inlet end and the second inlet end, and the other end connects to the working fluid outlet of the heat exchange housing. The first working fluid flow path is used to utilize the heat generated by the electric card chip, and the second working fluid flow path is used to utilize the cooling energy generated by the electric card chip.

[0021] The electric heat source assembly and heat exchange system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0022] The electric card heat source assembly provided by the embodiment of the present disclosure includes a heat exchange shell and an electric card chip. The heat exchange shell encloses a heat exchange chamber, and is provided with a working fluid inlet for the inflow of a heat exchange working fluid and a working fluid outlet for the outflow of the heat exchange working fluid. The electric card chip is arranged in the heat exchange chamber and exchanges heat with the heat exchange working fluid in the heat exchange chamber. When the electric card chip generates heat, the heat exchange working fluid exchanges heat with the electric card chip, and the high-temperature heat exchange working fluid obtained after the heat exchange flows out from the working fluid outlet. When the electric card chip generates cold energy, the heat exchange working fluid exchanges cold energy with the electric card chip, and the low-temperature heat exchange working fluid obtained after the cold energy exchange flows out from the working fluid outlet.

[0023] In the electric heat source assembly provided in the disclosed embodiments, the substrate layer of the electric chip is further provided with a skeleton. This skeleton improves the heat exchange between the heat exchange medium and the electric chip. It also facilitates the flow of the heat exchange medium along the surface of the electric chip, reducing its flow resistance. This further enhances the heat exchange between the heat exchange medium and the electric chip, further improving the separation of heat and cold from the electric chip.

[0024] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices. The drawings do not constitute a scale limitation. In addition,

[0026] Figure 1 is a schematic diagram of an electric card chip provided by an embodiment of the present disclosure;

[0027] Figure 2is a schematic diagram of another electric card chip provided by an embodiment of the present disclosure;

[0028] Figure 3 yes Figure 2 Enlarged view of selected part;

[0029] Figure 4 is a schematic diagram of an electric card heat source assembly provided by an embodiment of the present disclosure;

[0030] Figure 5 is a schematic diagram of another electric card heat source assembly provided by an embodiment of the present disclosure;

[0031] Figure 6 It is a schematic diagram of a heat exchange system provided in an embodiment of the present disclosure.

[0032] Reference numerals:

[0033] 1: electric card chip; 11: substrate layer; 111: skeleton part; 112: flow channel part;

[0034] 2: heat exchange shell; 21: first side plate; 22: second side plate; 211: working fluid inlet; 221: working fluid outlet; 222: second fixture;

[0035] 3: first working medium flow path; 31: first inlet end; 32: first outlet end;

[0036] 4: second working medium flow path; 41: second inlet end; 42: second outlet end;

[0037] 5: hot end heat exchanger;

[0038] 6: Cold end heat exchanger;

[0039] 71: first one-way valve; 72: second one-way valve; 73: first pump body; 74: second pump body; 75: first liquid separation element; 76: second liquid separation element. DETAILED DESCRIPTION

[0040] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0041] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that such terms are interchangeable where appropriate to describe the embodiments of the present disclosure. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0042] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to having a specific orientation, or to being constructed and operated in a specific orientation. Moreover, in addition to being used to indicate orientations or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure may be understood based on the specific circumstances.

[0043] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, components, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0044] Unless otherwise stated, the term "plurality" means two or more.

[0045] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0046] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0047] The electrocaloric effect is a caloric effect in ferroelectric materials caused by an electric field: heat is released when an electric field is applied and heat is absorbed when the field is removed. A high electric field is applied to a ferroelectric thin film through electrodes on either side to stimulate this cyclical electrocaloric effect. Electrocaloric chips are components that utilize this effect, releasing heat when an electric field is applied and absorbing heat when the field is removed.

[0048] The present disclosure provides an electric card heat source component, such as Figures 1 to 5 shown.

[0049] The electric card heat source assembly provided in the disclosed embodiment includes a heat exchange housing 2 and an electric card chip 1. The heat exchange housing 2 encloses a heat exchange chamber, and the heat exchange housing 2 is provided with a working fluid inlet 211 and a working fluid outlet 221 that are connected to the heat exchange chamber. The electric card chip 1 includes an electric card film layer and a substrate layer 11. The electric card chip 1 is disposed in the heat exchange chamber. The heat exchange working fluid flowing in through the working fluid inlet 211 exchanges heat with the electric card chip 1 and then flows out through the working fluid outlet 221. The substrate layer 11 of the electric card chip 1 includes a skeleton portion 111.

[0050] In the electric card heat source assembly provided in the embodiment of the present disclosure, the electric card chip 1 is disposed within a heat exchange housing 2, and the heat exchange housing 2 is provided with a working fluid inlet 211 for the inflow of a heat exchange working fluid and a working fluid outlet 221 for the outflow of the heat exchange working fluid. When an electric field is applied, the electric card chip 1 generates heat, and the heat exchange working fluid flowing in from the working fluid inlet 211 exchanges heat with the electric card chip 1. After the exchange is completed, the high-temperature heat exchange working fluid flows out from the working fluid outlet 221. When the electric field is removed, the electric card chip 1 generates cold energy, and the heat exchange working fluid flowing in from the working fluid inlet 211 exchanges cold energy with the electric card chip 1. After the exchange is completed, the low-temperature heat exchange working fluid flows out from the working fluid outlet 221.

[0051] As can be seen, in the electric card heat source assembly provided by the embodiment of the present disclosure, a heat exchange medium is used to exchange heat with the electric card chip 1 disposed within the heat exchange housing 2. The electric card chip 1 includes an electric card film layer that can directly and alternately generate heat and cold, and a substrate layer 11 of the electric card film layer. The substrate layer 11 is provided with a skeleton portion 111. The provision of the skeleton portion 111 reduces the flow resistance of the heat exchange medium during the heat exchange process, thereby improving the heat exchange efficiency of the heat exchange medium with the electric card chip 1.

[0052] Optionally, the skeleton portion 111 is an etched skeleton portion. The etched skeleton portion can be understood as the skeleton portion 111 obtained by etching the substrate layer 11 of the electric card chip 1. Before etching, the thickness of each part of the substrate layer 11 is equal. After etching the substrate layer 11, an etched portion and an etched skeleton portion left by etching are obtained. Among them, the skeleton portion 111 can reduce the flow resistance of the heat exchange medium, and the etched portion can reduce the distance between the heat exchange medium flowing from the surface of the substrate layer 11 and the electric card film layer, thereby improving the sufficiency of heat exchange between the electric card chip 1 and the heat exchange medium, and improving the heat and cold exchange effect of the electric card chip 1.

[0053] The surface of the electric card chip is charged. Optionally, the heat exchange medium includes an insulating heat-conducting liquid, such as a single-phase fluorinated liquid, a phase-change fluorinated coolant, or transformer insulating heat-conducting oil. For experimental or industrial applications, transformer insulating heat-conducting oil is preferred for heat exchange and hot-cold separation.

[0054] Optionally, an insulating layer, such as an aluminum nitride layer or an aluminum oxide layer, may be deposited on the surface of the electric card chip. In this case, the heat exchange medium may include a non-insulating heat-conducting liquid, such as water.

[0055] Optionally, the electrical card chip 1 includes an electrical card front end close to the working medium inlet 211 and an electrical card rear end close to the working medium outlet 221 , wherein the skeleton portion 111 extends from the electrical card front end to the electrical card rear end.

[0056] The skeleton portion 111 extends from the front end of the electric card chip 1 to the rear end of the electric card. It can be understood that the skeleton portion 111 extends along the direction of the heat exchange medium flow. Optionally, a complete skeleton portion 111 includes a skeleton front end and a skeleton rear end that are continuously connected, wherein the skeleton front end is located at the front end of the electric card and the skeleton rear end is located at the rear end of the electric card. Figure 2 In this way, when the heat exchange medium flows along the surface of the electric card chip 1, the skeleton part 111 can play the effect of reducing the flow resistance during the entire process of the heat exchange medium flowing.

[0057] Optionally, the skeleton portion 111 is S-shaped or linear.

[0058] like Figure 2 As shown, the S-shaped skeleton portion includes alternating crests and troughs. The distance between the front end of the electric card and the rear end of the electric card is defined as the length of the electric card chip, and the number of crests and troughs in a single S-shaped skeleton can be set according to the length of the electric card chip. Optionally, the substrate layer 11 is provided with a plurality of adjacent S-shaped skeleton portions. The two adjacent S-shaped skeleton portions include a first skeleton portion and a second skeleton portion, wherein the first skeleton portion and the second skeleton portion are equidistantly arranged. The equidistant arrangement can be understood as the spacing between each part of the first skeleton portion and the second skeleton portion being equal. In this way, the fluidity of the heat exchange medium along the skeleton portion 111 is further improved.

[0059] Optionally, the skeleton portion 111 may also be linear. Optionally, a plurality of linear skeleton portions are parallel to each other.

[0060] Optionally, the substrate layer 11 includes a plurality of skeleton parts, and the substrate layer 11 further includes a flow channel part 112 arranged between two adjacent skeleton parts, wherein the height of the skeleton part 111 is higher than the height of the flow channel part 112 .

[0061] It can be understood that when the skeleton portion 111 is obtained by etching, the flow channel portion 112 is the same as the aforementioned etched portion.

[0062] The substrate layer 11 includes a first substrate surface that is in close contact with the electrocard film layer, and a second substrate surface that is provided with a skeleton portion 111 and is opposite the first substrate surface. The height of the flow channel portion 112 can be understood as the height of the flow channel portion 112 calculated with the first substrate surface as the base point. Similarly, the height of the skeleton portion 111 can be understood as the height of the skeleton portion 111 calculated with the first substrate surface as the base point.

[0063] In the embodiment of the present disclosure, the height of the skeleton portion 111 is higher than the height of the flow channel portion 112. In this way, when more heat exchange medium flows through the flow channel portion 112, the distance between the heat exchange medium and the electric card film layer is reduced, thereby improving the heat exchange effect between the heat exchange medium and the electric card chip 1.

[0064] Optionally, the width of the skeleton portion 111 is a first width, and the width of the flow channel portion 112 is a second width, wherein the second width is greater than or equal to twice the first width.

[0065] like Figure 3 As shown, the width of the skeleton portion 111 is a first width H1, and the width of the flow channel portion 112 is a second width H2. The second width H2 is greater than or equal to twice the first width H1. That is, the skeleton portion 111 occupies a smaller proportion of the substrate layer 11, while the flow channel portion 112 occupies a larger proportion. This increases the direct heat exchange area between the heat exchange medium and the flow channel portion 112, thereby improving the heat exchange effect between the heat exchange medium and the electric card chip 1.

[0066] Optionally, the heat exchange shell 2 includes a first side plate 21 provided with a working fluid inlet 211, and a second side plate 22 provided with a working fluid outlet 221, wherein the first side plate 21 is provided with multiple working fluid inlets 211, and a first mounting position is provided between two adjacent working fluid inlets 211, the second side plate 22 is provided with multiple working fluid outlets 221, and a second mounting position is provided between two adjacent working fluid outlets 221, and the electric card chip 1 is fixedly provided between the first mounting position and the second mounting position.

[0067] Optionally, the setting heights of the multiple working fluid inlets 211 on the first side plate 21 are L1, L2, L3...Ln, respectively, and correspondingly, the setting heights of the multiple working fluid outlets 221 on the second side plate 22 are also L1, L2, L3...Ln, respectively, that is, each working fluid inlet 211 corresponds to a working fluid outlet 221 at the same height, thereby improving the parallel flow of the heat exchange working fluid on the surface of the electric card chip 1.

[0068] The front end of the electric card chip 1 is fixedly set at the first mounting position, and the rear end of the electric card chip 1 is fixedly set at the second mounting position. In this way, the heat exchange working fluid flowing in from the working fluid inlet 211 flows along the front end of the electric card to the rear end of the electric card, and after completing the heat exchange, flows out from the working fluid outlet 221 of the heat exchange shell 2.

[0069] In the electric card heat source assembly provided in the embodiment of the present disclosure, the electric card chip 1 in the heat exchange housing 2 exchanges heat with the heat exchange medium in an immersed manner, that is, the electric card chip 1 exchanges heat with the heat exchange medium in the form of being immersed in the heat exchange medium. It can be understood that the immersion of the electric card chip 1 in the heat exchange medium does not conflict with the flow of the heat exchange medium along the electric card chip 1. In the embodiment of the present disclosure, the heat exchange medium flowing on the surface of the electric card chip 1 can immerse at least a portion of the electric card chip 1, or the heat exchange medium can stay on the surface of the electric card chip for a certain period of time, thereby improving the heat exchange effect between the electric card chip 1 and the heat exchange medium.

[0070] Optionally, the first installation position is provided with a first clamp for fixing the electric card chip 1 , and the second installation position is provided with a second clamp 222 for fixing the electric card chip 1 .

[0071] The first clamp is used to secure the front end of the electrical card chip 1, and the second clamp 222 is used to secure the rear end of the electrical card chip 1. In the disclosed embodiment, the first clamp and the second clamp 222 are respectively used to clamp and secure the two ends of the electrical card chip 1, thereby improving the stability of the electrical card chip 1 in the heat exchange housing 2.

[0072] Optionally, the first side plate 21 and the second side plate 22 are two opposite vertical side plates, wherein the electric card chip 1 is horizontally installed between the first side plate 21 and the second side plate 22 .

[0073] The first side plate 21 and the second side plate 22 are two vertical side plates arranged opposite to each other in the heat exchange housing 2. The electric card chip 1 is installed horizontally between the first side plate 21 and the second side plate 22. Figure 5 In this way, the immersion depth of the heat exchange medium in each part of the electric card chip 1 is equal, thereby improving the heat exchange uniformity of the heat exchange medium to the electric card chip 1.

[0074] Optionally, a plurality of electric card chips 1 are arranged side by side in the longitudinal direction in the heat exchange housing 2, such as Figure 5 shown.

[0075] The embodiment of the present disclosure also provides a heat exchange system.

[0076] The heat exchange system provided in the embodiments of the present disclosure includes the aforementioned electric heat source assembly. The heat exchange system can utilize the heat and cooling capacity of the electric heat source assembly, for example, using the heat from the electric heat source assembly to heat a room, or using the cooling capacity from the electric heat source assembly to cool a room or a cabinet. Household appliances incorporating the heat exchange system provided in the embodiments of the present disclosure may include air conditioners, refrigerators, freezers, display cabinets, and other refrigeration equipment.

[0077] Optionally, the aforementioned heat exchange system also includes a first working fluid flow path 3, a second working fluid flow path 4, a first liquid separation element 75 and a second liquid separation element 76. The first working fluid flow path 3 includes a first inlet end 31 and a first outlet end 32, and the first working fluid flow path 3 is provided with a hot end heat exchanger 5, a first pump body 73 and a first one-way valve 71. The second working fluid flow path 4 includes a second inlet end 41 and a second outlet end 42, and the second working fluid flow path 4 is provided with a cold end heat exchanger 6, a second pump body 74 and a second one-way valve 72. One end of the first liquid separation element 75 is connected to the first outlet end 32 and the second outlet end 42, and the other end is connected to the working fluid inlet 211 of the heat exchange shell. One end of the second liquid separation element 76 is connected to the first inlet end 31 and the second inlet end 41, and the other end is connected to the working fluid outlet 221 of the heat exchange shell. As shown Figure 6 shown.

[0078] The first working fluid flow path 3, the first liquid separation element 75, the second liquid separation element 76, and the electric card heat source assembly form a first closed loop, and the first working fluid flow path 3 is provided with a hot end heat exchanger 5. When the electric card chip 1 is applied with an electric field, it releases heat. At this time, the heat exchange working fluid flowing in from the working fluid inlet 211 exchanges heat with the electric card chip 1. After completing the heat exchange, the high-temperature heat exchange working fluid flows to the first working fluid flow path 3 through the working fluid outlet 221. The high temperature in the high-temperature heat exchange working fluid is utilized or dissipated through the hot end heat exchanger 5 of the first working fluid flow path 3. Similarly, when the electric card chip 1 is removed from the electric field, it absorbs heat. At this time, the heat exchange working fluid flowing in from the working fluid inlet 211 exchanges cold energy with the electric card chip 1. After completing the cold energy exchange, the low-temperature heat exchange working fluid flows to the second working fluid flow path 4 through the working fluid outlet 221. The low temperature in the low-temperature heat exchange working fluid is utilized or dissipated through the cold end heat exchanger 6 of the second working fluid flow path 4.

[0079] Optionally, one end of the first liquid separation element 75 includes two liquid separation branches respectively connected to the first outlet end 32 and the second outlet end 42, and the other end of the first liquid separation element 75 includes multiple liquid separation branches respectively connected to the working medium inlet 211, such as Figure 6 Similarly, one end of the second liquid separation element 76 includes two liquid separation branches respectively connected to the first inlet end 31 and the second inlet end 41, and the other end of the second liquid separation element 76 includes multiple liquid separation branches respectively connected to the working medium outlet 221, as shown. Figure 6 shown.

[0080] Optionally, a first solenoid valve is provided at one end of the first working fluid path 3 near the second liquid separation element 76, and a second solenoid valve is provided at one end of the second working fluid path 4 near the second liquid separation element 76. When the electric card chip 1 generates heat, the first solenoid valve is controlled to open and the second solenoid valve is controlled to close, allowing the high-temperature heat exchange working fluid obtained after heat exchange to flow into the first working fluid path 3. When the electric card chip 1 generates cold air, the second solenoid valve is controlled to open and the first solenoid valve is controlled to close, allowing the low-temperature heat exchange working fluid obtained after heat exchange to flow into the second working fluid path 4.

[0081] Optionally, the first working medium flow path 3 is further provided with a first pump body 73 to drive the heat exchange working medium to flow in the first closed loop; similarly, the second working medium flow path 4 is further provided with a second pump body 74 to drive the heat exchange working medium to flow in the second closed loop.

[0082] The heat exchange system provided in the embodiment of the present disclosure further includes a control unit, which includes a temperature acquisition module and a working medium adjustment module.

[0083] a temperature acquisition module configured to acquire a first surface temperature of the electric card chip when generating heat and a second surface temperature of the electric card chip when generating cold;

[0084] The working medium regulating module is configured to regulate the amount of hot end return working medium entering the heat exchange shell according to the first surface temperature, or to regulate the amount of cold end return working medium entering the heat exchange shell according to the second surface temperature.

[0085] Among them, the hot end reflux working medium is the heat exchange working medium after heat exchange in the hot end heat exchanger, and the cold end reflux working medium is the heat exchange working medium after heat exchange in the cold end heat exchanger.

[0086] The first surface temperature of the electric card chip when generating heat is detected in real time, and the amount of hot-end return fluid entering the heat exchange housing is adjusted based on this first surface temperature. When an electric field is applied, the electric card chip releases heat, causing its surface temperature to rise. As the heat exchange medium and the electric card chip exchange heat, the surface temperature of the electric card chip gradually decreases. In this embodiment, the numerical change in the first surface temperature characterizes the progress of the heat exchange medium's exchange of heat generated by the electric card chip, and based on this, the amount of hot-end return fluid entering the heat exchange housing is adjusted. This improves the accuracy of the heat exchange medium's heat exchange, thereby enhancing the heat exchange efficiency of the heat exchange medium.

[0087] Furthermore, the second surface temperature of the electric card chip during cooling is detected in real time, and the amount of cold-end return fluid entering the heat exchange housing is adjusted based on the second surface temperature. When the electric field is removed, the electric card chip absorbs heat, causing its surface temperature to drop. As the heat exchange fluid exchanges cooling energy with the electric card chip, the surface temperature of the electric card chip gradually increases. In this embodiment, the numerical change in the second surface temperature characterizes the cooling energy exchange process generated by the heat exchange fluid to the electric card chip, and based on this, the amount of cold-end return fluid entering the heat exchange housing is adjusted. This improves the accuracy of the cooling energy exchanged by the heat exchange fluid, thereby enhancing the cooling efficiency of the heat exchange fluid.

[0088] Optionally, regulating the amount of the hot-end reflux medium entering the heat exchange shell according to the first surface temperature includes controlling the hot-end reflux medium to stop entering the heat exchange shell when the first surface temperature is less than or equal to a first temperature threshold.

[0089] When the first surface temperature is less than or equal to the first temperature threshold, it is considered that the heat exchange medium has completed the heat exchange with the heat generated by the electric card chip. At this time, the hot end reflux medium is controlled to stop entering the heat exchange shell, so that when the electric card chip generates cold energy subsequently, there will be no crossover of the heat exchange medium with the heat exchange process, thereby improving the heat exchange effect on the electric card chip.

[0090] Similarly, regulating the amount of the cold-end return medium entering the heat exchange shell according to the second surface temperature includes controlling the cold-end return medium to stop entering the heat exchange shell when the second surface temperature is greater than or equal to a second temperature threshold.

[0091] When the second surface temperature is greater than or equal to the second temperature threshold, it is considered that the heat exchange medium has completed the cold exchange with the cold energy generated by the electric card chip. At this time, the cold end reflux medium is controlled to stop entering the heat exchange shell, so that when the electric card chip generates heat subsequently, there will be no crossover of the heat exchange medium with the cold exchange process, thereby improving the cold exchange effect on the electric card chip.

[0092] Optionally, regulating the amount of the hot-end reflux medium entering the heat exchange shell according to the first surface temperature includes regulating a pumping speed of the hot-end reflux medium by the first pump body according to a decreasing rate of the first surface temperature.

[0093] When the rate of decrease of the first surface temperature is less than or equal to the first rate, and the temperature of the hot medium at the medium outlet of the heat exchange housing is greater than or equal to the third temperature threshold, it is considered that the heat exchange of the heat exchange medium with the electric card chip is at its peak heat exchange period in the first half of the cycle. Furthermore, the heat exchange medium currently entering the heat exchange housing is slow, reducing the heat exchange efficiency with the electric card chip. In this case, the pumping speed of the first pump body for the hot end return medium can be increased to increase the heat exchange rate with the electric card chip. Furthermore, the temperature of the heat exchange medium at the second liquid separation element is obtained. When the temperature of the heat exchange medium at the second liquid separation element is less than the preset heat absorption temperature, the opening of the first solenoid valve is reduced to increase the residence time of the heat exchange medium in the heat exchange housing, thereby increasing the immersion time of the heat exchange medium in the electric card chip and improving the heat exchange efficiency of the heat exchange medium with the electric card chip. Optionally, the preset heat absorption temperature can be understood as the lowest temperature of the heat exchange medium after absorbing the heat generated by the electric card chip. When the temperature of the heat exchange medium at the second liquid separation element is lower than the preset heat absorption temperature, it is considered that the heat exchange medium has not completely absorbed heat from the electric card chip. At this time, the residence time of the heat exchange medium in the heat exchange shell can be appropriately increased.

[0094] Adjusting the amount of the cold-end reflux medium entering the heat exchange shell according to the second surface temperature includes adjusting the pumping speed of the cold-end reflux medium by the second pump body according to the rising rate of the second surface temperature.

[0095] When the rate of increase of the second surface temperature is less than or equal to the second rate, and the temperature of the cold working medium at the working medium outlet of the heat exchange housing is less than or equal to the fourth temperature threshold, it is considered that the heat exchange working medium is exchanging cold energy with the electric card chip at its peak in the first half of the cold exchange period. The heat exchange working medium currently entering the heat exchange housing is slow, reducing the heat exchange efficiency with the electric card chip. In this case, the pumping speed of the second pump body for the cold end return working medium can be increased to increase the cold exchange rate with the electric card chip. Furthermore, the temperature of the heat exchange working medium at the second liquid separation element is obtained. When the temperature of the heat exchange working medium at the second liquid separation element is greater than the preset cold absorption temperature, the opening of the second solenoid valve is reduced to increase the residence time of the heat exchange working medium in the heat exchange housing, thereby increasing the immersion time of the heat exchange working medium in the electric card chip and improving the heat exchange effect of the heat exchange working medium on the electric card chip. Optionally, the preset cold absorption temperature can be understood as the highest temperature of the heat exchange working medium after absorbing the cold energy generated by the electric card chip. When the temperature of the heat exchange medium at the second liquid separation element is greater than the preset heat and cold absorption temperature, it is considered that the heat exchange medium has not completely absorbed the cold of the electric card chip. At this time, the residence time of the heat exchange medium in the heat exchange shell can be appropriately increased.

[0096] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card heat source component, characterized in that: include: A heat exchange shell encloses a heat exchange chamber, and the heat exchange shell is provided with a working medium inlet and a working medium outlet communicated with the heat exchange chamber; and, The electric card chip includes an electric card film layer and a substrate layer, and the electric card chip is arranged in the heat exchange chamber. The heat exchange medium flowing in from the working medium inlet exchanges heat with the electric card chip and then flows out from the working medium outlet. The substrate layer of the electric card chip includes a skeleton portion.

2. The electric heat source assembly according to claim 1, characterized in that: The electric card chip includes an electric card front end close to the working fluid inlet and an electric card back end close to the working fluid outlet. The skeleton part extends from the front end of the electric card to the rear end of the electric card.

3. The electric card heat source assembly according to claim 2, characterized in that: The skeleton is S-shaped or straight.

4. The electric heat source assembly according to claim 1, characterized in that: The substrate layer includes a plurality of skeleton parts and a flow channel part arranged between two adjacent skeleton parts. The height of the skeleton portion is higher than the height of the flow channel portion.

5. The electric heat source assembly according to claim 4, characterized in that: The width of the skeleton portion is the first width, and the width of the flow channel portion is the second width. The second width is greater than or equal to twice the first width.

6. The electric heat source assembly according to any one of claims 1 to 5, characterized in that: The heat exchange shell includes a first side plate provided with a working medium inlet, and a second side plate provided with a working medium outlet. Among them, the first side plate is provided with multiple working fluid inlets, and a first installation position is provided between two adjacent working fluid inlets; the second side plate is provided with multiple working fluid outlets, and a second installation position is provided between two adjacent working fluid outlets; and the electric card chip is fixedly provided between the first installation position and the second installation position.

7. The electric heat source assembly according to claim 6, characterized in that: The first installation position is provided with a first clamp for fixing the electric card chip, and the second installation position is provided with a second clamp for fixing the electric card chip.

8. The electric heat source assembly according to claim 7, characterized in that: The first side panel and the second side panel are two opposite vertical side panels. The electric card chip is horizontally installed between the first side plate and the second side plate.

9. A heat exchange system, characterized in that: It comprises the electric card heat source assembly as described in any one of claims 1 to 8.

10. The heat exchange system according to claim 9, characterized in that: Also includes: A first working fluid flow path includes a first inlet end and a first outlet end, and the first working fluid flow path is provided with a hot end heat exchanger, a first pump body and a first one-way valve; The second working fluid flow path includes a second inlet end and a second outlet end, and the second working fluid flow path is provided with a cold end heat exchanger, a second pump body and a second one-way valve; A first liquid separation element, one end of which is connected to the first outlet end and the second outlet end, and the other end of which is connected to the working medium inlet of the heat exchange shell; and The second liquid separation element has one end connected to the first inlet end and the second inlet end, and the other end connected to the working medium outlet of the heat exchange shell.

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