Copper mold manufacturing method
Through laser thinning and chemical etching technology, the problem of uniform reduction of the photoresist layer thickness was solved, and high-precision embossed holographic pattern formation on the copper mold surface was achieved, improving the uniformity and precision of mold manufacturing.
Patent Information
- Application Number
- CN202410311406.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-09-19
AI Technical Summary
In existing mold manufacturing methods, it is difficult to uniformly reduce the thickness of the photoresist layer, resulting in limitations in mold manufacturing.
Laser light is used to thin the photoresist layer to form a photoresist film with a thickness ranging from 0.25 microns to 0.35 microns. Chemical etching is then used to form an embossed holographic pattern, which is then processed in conjunction with optical photoresist forming equipment.
The photoresist layer is uniformly thinned, and an imprinted holographic pattern with a line width and line spacing of less than 0.5 microns can be formed, which improves the precision and uniformity of mold manufacturing.
Smart Images
Figure CN120669472A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a mold manufacturing method, in particular to a copper mold manufacturing method. Background Art
[0002] Existing mold manufacturing methods typically form a photoresist layer on the mold's outer surface through coating. However, this coating method has limitations (e.g., difficulty in uniformly reducing the thickness), which has led to a stagnation in related technical research. The inventors, believing these limitations can be addressed, have conducted intensive research and applied scientific principles to develop a rationally designed and effective solution to these limitations. Summary of the Invention
[0003] An embodiment of the present invention provides a copper mold manufacturing method, which can effectively improve the defects that may occur in existing mold manufacturing methods.
[0004] An embodiment of the present invention discloses a copper mold manufacturing method, comprising: a photoresist forming step: forming a photoresist layer with a thickness between 3 and 5 microns on the outer surface of a copper mold; a thinning step: reciprocatingly irradiating the photoresist layer with laser light to thin the photoresist layer until the thickness of the photoresist layer is between 0.25 and 0.35 microns, defining a photoresist film; a patterning step: passing exposure light through an interference or photomask to form a default holographic pattern layer on the photoresist film; and a chemical etching step: chemically etching the outer surface of the copper mold to form an embossed holographic pattern; wherein the embossed holographic pattern has a depth between 0.25 and 0.35 microns.
[0005] Preferably, in the patterning step, a portion of the outer surface of the copper mold exposed outside the default holographic pattern layer is defined as a first forming area; the chemical etching step further includes: a copper etching sub-step of chemically etching the outer surface of the copper mold to form a plurality of grooves in the first forming area; wherein the shapes of the plurality of grooves together form an intermediate three-dimensional pattern; and a forming etching sub-step of chemically etching the intermediate three-dimensional pattern to remove the default holographic pattern layer and form an embossed holographic pattern in the outer surface of the copper mold.
[0006] Preferably, the intensity of the laser light is between 1 W and 2 W, and the wavelength of the laser light is 405 nanometers.
[0007] Preferably, the line width and line spacing of the embossed holographic pattern are each no greater than 0.5 microns.
[0008] Preferably, the copper mold manufacturing method further comprises a build-up step after the chemical etching step: forming a chrome plating layer on the copper mold, which covers the entire embossed holographic pattern.
[0009] Preferably, the copper mold manufacturing method further comprises a build-up step after the chemical etching step: forming a fluorine polymer coating on the copper mold, which covers the entire embossed holographic pattern.
[0010] Preferably, the copper mold manufacturing method further includes, before the photoresist forming step, a preparation step of providing an optical photoresist forming device, wherein the optical photoresist forming device includes: a processing stage for setting the copper mold; a displacement mechanism installed on the processing stage and capable of moving relative to the copper mold; a photoresist sprayer for forming a photoresist layer during the photoresist forming step; and a laser emitter installed on the displacement mechanism so as to be movable relative to the copper mold through the displacement mechanism; wherein the laser emitter is used to emit laser light during the thinning step.
[0011] Preferably, the optical photoresist forming apparatus further comprises a baking mechanism for curing the photoresist layer formed by the photoresist sprayer during the photoresist forming step.
[0012] Preferably, the photoresist sprayer is mounted on a displacement mechanism so as to be movable relative to the copper mold via the displacement mechanism.
[0013] Preferably, the copper mold is in the shape of a roller, and the processing platform is fixed to both ends of the copper mold and can rotate the copper mold at a constant speed with its center line as the axis.
[0014] In summary, the copper mold manufacturing method disclosed in the embodiment of the present invention can implement the thinning of the photoresist layer by optical means (such as the laser light), so that the outer surface of the copper mold can be formed with the photoresist film having a thickness as thin as a default value and having better uniformity, thereby facilitating the formation of the embossed holographic pattern.
[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 1 is a schematic flow chart of the steps of a method for manufacturing a copper mold according to an embodiment of the present invention.
[0017] Figure 2 for Figure 1 Schematic diagram of the preparation steps and photoresist shaping steps.
[0018] Figure 3 for Figure 1 A partial cross-sectional schematic diagram of the photoresist forming step.
[0019] Figure 4 for Figure 3 Schematic cross-sectional view along section line IV-IV.
[0020] Figure 5 for Figure 1 Schematic diagram of the thinning steps.
[0021] Figure 6 for Figure 1 A schematic partial cross-sectional view of the thinning step.
[0022] Figure 7 for Figure 6 Schematic cross-sectional view along section line VII-VII.
[0023] Figure 8 for Figure 1 Schematic diagram of the patterning steps.
[0024] Figure 9 for Figure 1 Schematic diagram of the copper etching sub-step.
[0025] Figure 10 for Figure 1 Schematic diagram of the shaping etching sub-step.
[0026] Figure 11 for Figure 1 Schematic diagram of the layer-building steps. DETAILED DESCRIPTION
[0027] The following is an explanation of the implementation methods of the "copper mold manufacturing method" disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
[0028] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.
[0029] See also Figures 1 to 11 , which is an embodiment of the present invention. This embodiment discloses a copper mold manufacturing method S100, which is suitable for forming an embossed holographic pattern H on the outer surface 11 of a copper mold 1. In other words, any mold manufacturing method not applied to copper molds is different from the copper mold manufacturing method S100 referred to in this embodiment.
[0030] In this embodiment, the copper mold manufacturing method S100 sequentially includes or implements a preparation step S110, a photoresist forming step S120, a thinning step S130, a patterning step S140, a chemical etching step S150, and a build-up step S160. The following will describe the specific implementation of the above-mentioned multiple steps, but they can also be adjusted and varied based on design requirements. For example, in other embodiments not shown in the present invention, the copper mold manufacturing method S100 can omit at least one of the preparation step S110 and the build-up step S160 based on design requirements.
[0031] The preparation step S110: Figure 1 and Figure 2 As shown, an optical photoresist shaping apparatus 100 is provided. In this embodiment, the optical photoresist shaping apparatus 100 includes a processing stage 101, a displacement mechanism 102 mounted on the processing stage 101, a photoresist sprayer 103 and a laser emitter 104 mounted on the displacement mechanism 102, and a baking mechanism 105 mounted on the processing stage 101, but the present invention is not limited thereto. For example, in other embodiments not shown, the photoresist sprayer 103 and / or the baking mechanism 105 may be omitted based on design requirements.
[0032] Furthermore, the processing platform 101 is used to place the copper mold 1, and the copper mold 1 is in the form of a roller in this embodiment. Therefore, the structure of the processing platform 101 is capable of being fixed to both ends of the copper mold 1 and can rotate the copper mold 1 at a constant speed about its centerline, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the copper mold 1 can also be a flat sheet structure, and the structure of the processing platform 101 is to place the copper mold 1 thereon.
[0033] The displacement mechanism 102 is mounted on the processing stage 101 and can be used to move relative to the copper mold 1. In this embodiment, the photoresist sprayer 103 and the laser emitter 104 are both mounted on the displacement mechanism 102 so that they can each move relative to the copper mold 1 via the displacement mechanism 102. However, the present invention is not limited to this. For example, in other embodiments not shown, the photoresist sprayer 103 can also be arranged corresponding to the processing stage 101 and not mounted on the displacement mechanism 102.
[0034] It should be noted that in this embodiment, the copper mold manufacturing method S100 utilizes the optical photoresist shaping apparatus 100 to implement the photoresist shaping step S120 and the thinning step S130, but the present invention is not limited thereto. For example, in other embodiments not shown, the photoresist shaping step S120 and the thinning step S130 may also be implemented using other photoresist shaping apparatuses having structures different from those of this embodiment.
[0035] The photoresist forming step S120: Figures 1 to 4 As shown, a photoresist layer 2a with a thickness between 3 and 5 microns is formed on the outer surface 11 of the copper mold 1. In the photoresist forming step S120 of this embodiment, the copper mold 1 is rotated at a constant speed by the processing stage 101, and the photoresist sprayer 103 forms the photoresist layer 2a of uniform thickness on the copper mold 1. Furthermore, the baking mechanism 105 is used to cure the photoresist layer 2a formed by the photoresist sprayer 103 during the photoresist forming step S120.
[0036] The thinning step S130: Figure 1 ,and Figures 5 to 7As shown, laser light L is reciprocally irradiated onto the photoresist layer 2a to thin the photoresist layer 2a until the thickness of the photoresist layer 2a is between 0.25 microns and 0.35 microns, thereby forming a photoresist film 2b. In the thinning step S130 of this embodiment, the copper mold 1 is rotated at a constant speed by the processing stage 101, and the laser emitter 104 is used to reciprocate the laser light L toward the photoresist layer 2a via the displacement mechanism 102, thereby thinning the photoresist layer 2a to a thickness between 0.25 microns and 0.35 microns, thereby forming the photoresist film 2b.
[0037] The laser emitter 104 can be configured to emit the laser light L having a wavelength of 405 nanometers (nm) to effectively thin the photoresist layer 2a. Furthermore, the laser emitter 104 can be configured to emit the laser light L having an intensity between 1W and 2W to rapidly thin the photoresist layer 2a.
[0038] Accordingly, in this embodiment, the copper mold manufacturing method S100 can implement thinning of the photoresist layer 2a by optical means (e.g., the laser light L), so that the outer surface 11 of the copper mold 1 can be formed with the photoresist film 2b having a thickness as thin as a default value and having better uniformity, thereby facilitating the subsequent patterning step S140 and the chemical etching step S150, and forming the imprinted holographic pattern H.
[0039] That is, any method or device that does not use laser light to thin the photoresist layer 2 a is different from the copper mold manufacturing method S100 or the optical photoresist shaping device 100 defined in this embodiment.
[0040] The patterning step S140: Figure 1 、 Figure 7 ,and Figure 8 As shown, exposure light is passed through an interference or mask to form a default holographic pattern layer 2c on the photoresist film 2b. Part of the outer surface 11 of the copper mold 1 is exposed outside the default holographic pattern layer 2c and is defined as a first forming area 111, while the remaining outer surface 11 of the copper mold 1 is covered by the default holographic pattern layer 2c and is defined as a second forming area 112.
[0041] The chemical etching step S150: Figure 1 ,and Figures 8 to 10As shown, the outer surface 11 of the copper mold 1 is chemically etched to form the embossed holographic pattern H. The embossed holographic pattern H has a depth between 0.25 μm and 0.35 μm, and the line width and line spacing of the embossed holographic pattern H are each no greater than 0.5 μm. In this embodiment, the chemical etching step S150 sequentially includes or implements a copper etching sub-step S151 and a forming etching sub-step S152. The two sub-steps are described below.
[0042] The copper etching sub-step S151: Figure 1 、 Figure 8 ,and Figure 9 As shown, the outer surface 11 of the copper mold 1 is chemically etched so that the copper mold 1 is concavely formed with a plurality of grooves 111a in the first forming area 111. The shapes of the plurality of grooves 111a together form an intermediate three-dimensional pattern M.
[0043] The forming etching sub-step S152: Figure 1 、 Figure 9 ,and Figure 10 As shown, chemical etching is performed on the intermediate 3D pattern M to remove the default holographic pattern layer 2c, and the outer surface 11 of the copper mold 1 is recessed to form the embossed holographic pattern H, which corresponds to (e.g., is substantially the same as) the intermediate 3D pattern M. The copper mold 1 has a portion of the second forming area 112 formed by the chemical etching, and its appearance corresponds to (e.g., is substantially the same as) the default holographic pattern layer 2c.
[0044] The layer-adding step S160: Figure 1 and Figure 11 As shown, a protective layer 3 (such as a chrome plating or a fluorine polymer coating) is formed on the copper mold 1, which covers the entire embossed holographic pattern H. The protective layer 3 is used to prevent the copper mold 1 from being oxidized and facilitates the separation of the copper mold 1 from the optical film (not shown in the figure) on which it is rolled.
[0045] [Technical Effects of the Embodiments of the Invention]
[0046] In summary, the copper mold manufacturing method (or optical photoresist forming equipment) disclosed in the embodiment of the present invention can implement thinning of the photoresist layer by optical means (such as the laser light), so that the outer surface of the copper mold can be formed with a photoresist film having a thickness as thin as a default value and good uniformity, which is conducive to the patterning step and the chemical etching step to form the imprinted holographic pattern.
[0047] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.
Claims
1. A method for manufacturing a copper mold, characterized in that: The copper mold manufacturing method comprises: a photoresist forming step: forming a photoresist layer having a thickness between 3 μm and 5 μm on the outer surface of a copper mold; a thinning step of reciprocatingly irradiating the photoresist layer with a laser beam to thin the photoresist layer until the thickness of the photoresist layer is between 0.25 micrometers and 0.35 micrometers, thereby forming a photoresist film; a patterning step: exposing light through an interference or mask to form a default holographic pattern layer on the photoresist film; and A chemical etching step is performed to chemically etch the outer surface of the copper mold to form an embossed holographic pattern; wherein the embossed holographic pattern has a depth between 0.25 microns and 0.35 microns.
2. The copper mold manufacturing method according to claim 1, characterized in that: In the patterning step, the portion of the outer surface of the copper mold exposed outside the default holographic pattern layer is defined as a first forming area; and the chemical etching step further includes: a copper etching sub-step: chemically etching the outer surface of the copper mold to form a plurality of grooves in the first forming area of the copper mold; wherein the shapes of the plurality of grooves together form an intermediate three-dimensional pattern; and A forming etching sub-step: performing the chemical etching on the intermediate three-dimensional pattern to remove the default holographic pattern layer and to form the embossed holographic pattern in a concave shape on the outer surface of the copper mold.
3. The copper mold manufacturing method according to claim 1, characterized in that: The intensity of the laser light is between 1W and 2W, and the wavelength of the laser light is 405 nanometers.
4. The copper mold manufacturing method according to claim 1, characterized in that: The line width and line spacing of the embossed holographic pattern are each no greater than 0.5 microns.
5. The copper mold manufacturing method according to claim 1, characterized in that: The copper mold manufacturing method further comprises a layer-building step after the chemical etching step: forming a chrome plating layer on the copper mold, which covers the entire embossed holographic pattern.
6. The copper mold manufacturing method according to claim 1, characterized in that: The copper mold manufacturing method further comprises a layer-building step after the chemical etching step: forming a fluorine polymer coating on the copper mold, which covers the entire embossed holographic pattern.
7. The copper mold manufacturing method according to claim 1, characterized in that: The copper mold manufacturing method further comprises, before the photoresist forming step: A preparation step: providing an optical photoresist shaping device, the optical photoresist shaping device comprising: a processing platform for placing the copper mold; a displacement mechanism mounted on the processing platform and capable of moving relative to the copper mold; a photoresist sprayer, used to form the photoresist layer in the photoresist forming step; and A laser emitter is installed on the displacement mechanism so as to be movable relative to the copper mold through the displacement mechanism; wherein the laser emitter is used to emit the laser light during the thinning step.
8. The copper mold manufacturing method according to claim 7, characterized in that: The optical photoresist forming equipment further comprises a baking mechanism for curing the photoresist layer formed by the photoresist sprayer during the photoresist forming step.
9. The copper mold manufacturing method according to claim 7, characterized in that: The photoresist sprayer is installed on the displacement mechanism so as to be movable relative to the copper mold through the displacement mechanism.
10. The copper mold manufacturing method according to claim 7, characterized in that: The copper mold is in the shape of a roller. The processing platform is fixed at both ends of the copper mold and can rotate the copper mold at a constant speed with its center line as the axis.