Wafer positioning device

Abstract

The invention discloses a wafer positioning device, which comprises a positioning platform and a driving mechanism, and is characterized in that the positioning platform comprises an accommodating platform for placing a wafer and at least three positioning mechanisms, the positioning mechanisms are uniformly arranged around the accommodating platform, and each positioning mechanism comprises a clamping assembly for abutting against and positioning the wafer; the driving mechanism drives the clamping assembly to move in the direction towards the center of the containing platform. The driving mechanism comprises a first driving module, a transmission control module and a second driving module, the transmission control module is connected with the first driving module and the second driving module, and the transmission control module transmits power generated by the first driving module to the second driving module so as to drive the second driving module to move. The second driving module drives all the clamping assemblies to move so as to abut against and position the wafer. When the clamping assembly abuts against the positioning wafer, the transmission control module disconnects power transmission between the first driving module and the second driving module. By adopting the scheme, the wafer can be positioned and can be protected.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor automation control equipment, and in particular to a wafer positioning device for wafers of any size. Background Art

[0002] The current mainstream wafer positioning method includes the three-point positioning method. The three-point positioning method digs several holes in each circle of sizes such as 2 inches, 3 inches, 4 inches, 6 inches, and 8 inches, and is equipped with three movable positioning pins. When in use, these three positioning pins are buckled and placed in the position corresponding to the wafer size to achieve wafer positioning. Other common positioning methods, although their principles vary, are basically based on mechanical positioning, optical positioning, and other ideas, and use specific devices or systems to determine the position of the wafer.

[0003] The existing three-point positioning method has limitations. For example, the accuracy of the positioning pin position is difficult to guarantee. When there is a deviation in the positioning pin position, it will directly affect the accuracy of wafer positioning; the actual contact area of ​​the "point" in the three-point positioning is large, which interferes with the positioning accuracy; for some non-standard wafer sizes, such as the standard 2-inch wafer has a diameter of 50.8mm, while the wafers produced by some manufacturers have a diameter of 50mm, the existing positioning method is fixed to the positioning hole position corresponding to the standard size, and cannot flexibly adapt to non-standard sizes, resulting in positioning deviation. Summary of the Invention

[0004] The object of the present invention is to provide a wafer positioning device to solve the problem in the prior art that it is not flexible enough to be applied to the positioning of non-standard size wafers.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] The present invention provides a wafer positioning device, comprising:

[0007] A positioning platform, the positioning platform comprising a receiving platform for placing a wafer and at least three positioning mechanisms, all of the positioning mechanisms being evenly arranged around the receiving platform, each of the positioning mechanisms comprising a clamping assembly for abutting and positioning the wafer;

[0008] a drive mechanism disposed below the positioning platform and configured to drive all of the clamping assemblies to move toward the center of the accommodating platform; the drive mechanism comprising a first drive module, a transmission control module, and a second drive module, the transmission control module being connected to the first drive module and the second drive module, respectively; the transmission control module being configured to transmit power generated by the first drive module to the second drive module to drive the second drive module to move; and the second drive module being configured to drive all of the clamping assemblies to move to abut and position the wafer.

[0009] When the clamping assembly abuts against the wafer to position it, the transmission control module disconnects the power transmission between the first driving module and the second driving module.

[0010] As a further improvement of an embodiment of the present invention, the transmission control module includes a first structure and a second structure that cooperate with each other, the first structure is connected to the first driving module, the second structure is connected to the second driving module, and the first driving module is used to drive the first structure and the second structure to move simultaneously;

[0011] When the clamping assembly abuts against the wafer to position it, the first structure moves in a direction away from the second structure.

[0012] As a further improvement of an embodiment of the present invention, the driving mechanism further includes a pressure sensing module, a control module, and a power supply module, wherein the pressure sensing module and the power supply module are electrically connected to the control module respectively, the pressure sensing module is arranged below the transmission control module, the power supply module is connected to the first driving module, and the power supply module is used to supply power to the first driving module; the control module is used to control the power supply module to be turned on to drive the first driving module to move;

[0013] When the clamping assembly abuts against the wafer to position it, the first structure moves in a direction away from the second structure and contacts the pressure sensing module, and the pressure sensing module generates pressure change information; the control module can also be used to control the shutdown of the power module when receiving the pressure change information sent by the pressure sensing module.

[0014] As a further improvement of an embodiment of the present invention, a conductive gasket is provided on a surface of the first structure close to the pressure sensing module, and when the first structure contacts the pressure sensing module, the pressure sensing module contacts the conductive gasket;

[0015] And / or, the driving mechanism also includes a first connecting member and an elastic mechanism arranged on the side of the first structure away from the second structure, the first connecting member connects the first structure and the first driving module, and the elastic mechanism is wrapped and fixed on the first connecting member and connected to the first structure; when the clamping assembly abuts and positions the wafer, the first structure compresses the elastic mechanism in a direction away from the second structure, and the elastic mechanism is used to apply a force to the first structure toward the second structure after the first driving module stops moving, so that the first structure is coupled with the second structure.

[0016] As a further improvement of one embodiment of the present invention, the driving mechanism also includes a second connecting member, the first driving module includes a first driving gear and a second driving gear that are meshed with each other, the first driving gear is connected to the power module through the second connecting member, and the second driving gear is connected to the first structure through the first connecting member; wherein the size of the second driving gear is larger than the size of the first driving gear.

[0017] As a further improvement to one embodiment of the present invention, the second drive module includes a third drive gear and a fourth drive gear that mesh with each other, the third drive gear is connected to the second structure, and the fourth drive gear is connected to the positioning mechanism; a plurality of fourth drive gears are provided, and the fourth drive gears are connected to the positioning mechanism in a one-to-one correspondence, and all the fourth drive gears are meshed with the third drive gear, so that the third drive gear synchronously drives all the fourth drive gears to rotate;

[0018] And / or, the transmission control module is configured as a ratchet structure, the first structure is a pawl, and the second structure is a ratchet gear.

[0019] As a further improvement of an embodiment of the present invention, the power module includes a power converter, a drive circuit and a motor electrically connected in sequence;

[0020] The motor is connected to the first driving gear through the second connecting member, and is used to drive the first driving gear to rotate, thereby driving the second driving gear to rotate;

[0021] The driving circuit is electrically connected to the control module, and the control module is used to control the driving circuit to drive the motor to operate; wherein, when the control module receives the pressure change information, the control module is also used to control the driving circuit to stop driving the motor to operate.

[0022] As a further improvement of one embodiment of the present invention, the positioning platform further includes a support column arranged at the center of the lower surface of the accommodating platform, the support column and the accommodating platform are integrally formed, and the lower surface of the support column is connected to the third drive gear, and the plurality of fourth drive gears are arranged close to the circumferential surface of the support column;

[0023] Each of the positioning mechanisms further comprises a sliding track connected to the corresponding fourth drive gear and a conveying device installed in the sliding track, the clamping assembly is fixedly connected to the conveying device, the fourth drive gear is connected to the conveying device in a one-to-one correspondence, and the fourth drive gear is used to drive the conveying gear to move the clamping assembly in the sliding track;

[0024] Each of the sliding rails is provided with a blocking portion at the outermost side away from the center of the accommodating platform, and the blocking portion is used to prevent the clamping assembly from falling off the positioning platform when the clamping assembly moves in a direction away from the center of the accommodating platform.

[0025] As a further improvement of one embodiment of the present invention, the transmission device is configured as a screw, and the screw is meshed with the fourth drive gear; the clamping assembly includes a slider mounted on the transmission device and a clamping structure fixed above the slider, the slider is fixed on the transmission device, and the interior of the slider is configured as a threaded structure that cooperates with the transmission device;

[0026] And / or, a mounting groove is provided on the upper surface of the slider, the clamping structure includes a mounting portion and a protruding portion connected to each other, the mounting portion is detachably mounted in the mounting groove, the protruding portion protrudes from the upper surface of the accommodating platform and is used to abut and fix the wafer; the protruding portion is configured as a cylindrical structure, a rectangular parallelepiped structure or an arc surface structure;

[0027] And / or, the clamping structure is configured as a rubber soft claw.

[0028] As a further improvement of one embodiment of the present invention, the wafer positioning device further includes a first switch, a second switch, and a third switch disposed on the positioning platform, and a fourth switch disposed between the power converter and the drive circuit, wherein the first switch, the second switch, the third switch, and the fourth switch are electrically connected to the control module respectively;

[0029] When the first switch is in the on state, the control module controls the fourth switch to be turned on and controls the drive circuit to drive the motor to rotate forward, so that the clamping assembly moves toward the center of the accommodating platform;

[0030] When the second switch is in the on state, the control module controls the fourth switch to be turned on and controls the drive circuit to drive the motor to reverse, so that the clamping assembly moves in a direction away from the center of the accommodating platform;

[0031] When the third switch is in the on state, the control module controls the fourth switch to be turned off to cut off the electrical connection between the power converter and the driving circuit.

[0032] Compared with the prior art, the beneficial effects of the present invention include at least: the wafer positioning device includes: a positioning platform and a driving mechanism, the positioning platform includes a accommodating platform for placing wafers and at least three positioning mechanisms, all positioning mechanisms are evenly arranged around the accommodating platform, each positioning mechanism includes a clamping assembly, and the clamping assembly is used to abut the positioning wafer; the driving mechanism is arranged below the positioning platform, and is used to drive all clamping assemblies to move in the direction toward the center of the accommodating platform; the driving mechanism includes a first driving module, a transmission control module and a second driving module, the transmission control module is respectively connected to the first driving module and the second driving module, the transmission control module is used to transmit the power generated by the first driving module to the second driving module to drive the second driving module to move, and the second driving module is used to drive all clamping assemblies to move to abut the positioning wafer; wherein, when the clamping assembly abuts the positioning wafer, the transmission control module disconnects the power transmission between the first driving module and the second driving module. In the solution provided by the present invention, under the drive of the driving mechanism, all clamping components move until all clamping components simultaneously abut the wafer and fix the wafer. Since all clamping components are evenly arranged around the accommodating platform, the center of the wafer corresponds to the center of the accommodating platform when it is fixed. The wafer positioning device of the present invention can be flexibly applied to the positioning of non-standard wafers, and the wafer can be fixed for operation without introducing vacuum access, and the structure is simple. At the same time, when the wafer is fixed by all clamping components, the transmission control module will automatically disconnect the power transmission between the first drive module and the second drive module, that is, the second drive module will stop continuing to drive the clamping components, which can avoid the wafer from being excessively squeezed by the clamping components to cause edge cracking, surface scratches or internal stress accumulation, thereby protecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic structural diagram of a positioning platform in one embodiment of the present invention;

[0034] Figure 2 is a schematic structural diagram of a wafer positioning device in one embodiment of the present invention;

[0035] Figure 3 is a schematic structural diagram of a driving mechanism in one embodiment of the present invention;

[0036] Figure 4 is a structural diagram of the relative positional relationship between the transmission control module and the pressure sensing module in one embodiment of the present invention;

[0037] Figure 5 corresponds to Figure 2 Schematic diagram of the cross-sectional structure of the middle S region from another perspective;

[0038] Figure 6 It is a structural schematic diagram of three different embodiments of the clamping structure of the present invention.

[0039] In the figure: 100, positioning platform; 110, accommodating platform; 120, positioning mechanism; 121, clamping assembly; 122, sliding track; 123, conveying device; 124, slider; 125, clamping structure; 126, mounting portion; 127, protruding portion; 128, blocking portion; 130, supporting column; 140, first switch; 150, second switch; 160, third switch; 170, fourth switch; 200, driving mechanism; 210, first driving module; 211, first driving gear; 212. Second drive gear; 220. Transmission control module; 221. First structure; 222. Second structure; 223. Conductive gasket; 230. Second drive module; 231. Third drive gear; 232. Fourth drive gear; 240. Pressure sensing module; 250. Control module; 260. Power module; 261. Power converter; 262. Drive circuit; 263. Motor; 270. First connecting member; 280. Elastic mechanism; 290. Second connecting member; 300. Housing. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the drawings represent identical or similar structures, and thus repeated descriptions thereof will be omitted.

[0041] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but can be modified as needed, and all such modifications are within the scope of protection of the present invention.

[0042] Please refer to Figures 1 to 6 The present invention provides a wafer positioning device, which includes a positioning platform 100 and a driving mechanism 200.

[0043] See also Figure 1 The positioning platform 100 includes a receiving platform 110 for placing a wafer (not shown in the figure) and at least three positioning mechanisms 120. All positioning mechanisms 120 are evenly arranged around the receiving platform 110. Each positioning mechanism 120 includes a clamping component 121, which is used to abut the wafer.

[0044] Specifically, the accommodating platform 110 is a circular platform, and the center of the accommodating platform 110 is the center of the circle of the accommodating platform 110. All positioning mechanisms 120 are distributed in a circular array around the same center of the circle, and the center of the circular array of all positioning mechanisms 120 coincides with the center of the accommodating platform 110 in the vertical direction, that is, the distance between the clamping components 121 in all positioning mechanisms 120 and the center of the accommodating platform 110 is equal, ensuring that when the clamping components 121 on all positioning mechanisms 120 abut against the wafer at the same time, the center of the wafer coincides with the center of the accommodating platform 110 in the vertical direction, realizing wafer positioning, which can be flexibly applied to the positioning of wafers of non-standard sizes, and at this time, the force applied to the wafer by each clamping component 121 is equal, that is, multiple force points on the circumference of the wafer are evenly distributed, forming multi-directional balanced pressure. Of course, the accommodating platform 110 can also be a square structure or other structures, as long as all the positioning mechanisms 120 are distributed in a circular array around the same center, and the clamping components 121 in all the positioning mechanisms 120 are equidistant from the center of the accommodating platform 110. The thickness direction of the wafer is parallel to the vertical direction.

[0045] For example, see Figure 1 The positioning platform 100 includes a circular accommodating platform 110 and three positioning mechanisms 120 evenly arranged around the accommodating platform 110. The centers of the three positioning mechanisms 120 arranged in a circular array coincide with the center of the accommodating platform 110 in the vertical direction. The three positioning mechanisms 120 are evenly arranged around the center of the accommodating platform 110, that is, the angle between the line connecting two adjacent positioning mechanisms 120 and the center of the accommodating platform 110 is 120°, and the angle between the line connecting two adjacent clamping assemblies 121 and the center of the accommodating platform 110 is also 120°. When the three clamping assemblies 121 abut the wafer at the same time, the force points on the circumference of the wafer are evenly distributed at 120°, forming a three-way balanced pressure.

[0046] See also Figure 2 The drive mechanism 200 is disposed below the positioning platform 100 and is used to drive all clamping assemblies 121 to move toward the center of the accommodating platform 110. The drive mechanism 200 includes a first drive module 210, a transmission control module 220, and a second drive module 230. The transmission control module 220 is connected to the first drive module 210 and the second drive module 230, respectively. The transmission control module 220 is used to transmit the power generated by the first drive module 210 to the second drive module 230 to drive the second drive module 230 to move; the second drive module 230 is used to drive all clamping assemblies 121 to move to abut and position the wafer.

[0047] Furthermore, when the clamping assembly 121 abuts the wafer for positioning, the transmission control module 220 disconnects the power transmission between the first drive module 210 and the second drive module 230. That is, when all the clamping assemblies 121 abut against the wafer and achieve wafer positioning, the transmission control module 220 disconnects the power transmission between the first drive module 210 and the second drive module 230, i.e., the second drive module 230 stops driving the clamping assembly 121. All the clamping assemblies 121 are only in a state of fixing the wafer and no longer apply a clamping force to the wafer. This can prevent the wafer from being excessively squeezed by the clamping assembly 121, resulting in edge cracking, surface scratches, or internal stress accumulation, thereby preventing damage to the wafer while positioning the wafer.

[0048] In one embodiment, the wafer positioning device further includes a housing 300 , and the housing 300 is used to accommodate the positioning platform 100 and the driving mechanism 200 .

[0049] See also Figure 2 and Figure 3 The transmission control module 220 includes a first structure 221 and a second structure 222 that cooperate with each other. The first structure 221 is connected to the first driving module 210, and the second structure 222 is connected to the second driving module 230. The first driving module 210 is used to drive the first structure 221 and the second structure 222 to move simultaneously to drive the second driving module 230 to move, so that all the clamping components 121 move simultaneously to abut and position the wafer.

[0050] Specifically, in the initial state, the first structure 221 and the second structure 222 are coupled and connected; when the clamping assembly 121 abuts against the positioning wafer, the first structure 221 moves in a direction away from the second structure 222. Since the first structure 221 and the second structure 222 are separated from each other, the driving force of the first driving module 210 cannot be transmitted to the first structure 221 via the second structure 222 to drive the second driving module 230 to move, and the transmission control module 220 achieves the effect of disconnecting the power transmission between the first driving module 210 and the second driving module 230.

[0051] In one embodiment, the transmission control module 220 is configured as a ratchet structure, with the first structure 221 being a pawl and the second structure 222 being a ratchet gear. Initially, the first structure 221 and the second structure 222 are in a meshed state. When the first drive module 210 indirectly drives the clamping assembly 121 to abut against the wafer for positioning, all clamping assemblies 121 cease to move due to mechanical obstruction by the wafer. Accordingly, the positioning mechanism 120, the second drive module 230 connected thereto, and the second structure 222 connected thereto also cease movement. However, the first structure 221, driven by the first drive module 210, remains in motion. When the pawl (i.e., the first structure 221) continues to rotate, and the ratchet gear (i.e., the second structure 222) stops rotating due to being restrained, the force applied to the pawl exceeds the friction or engagement retention force between the pawl and the ratchet teeth, causing the pawl to be unable to continue to maintain engagement with the ratchet teeth, and thus will disengage from the ratchet teeth to a certain extent to achieve overload protection. That is to say, as mentioned above, when the clamping component 121 abuts against the positioning wafer, the first structure 221 will separate from the second structure 222, disconnecting the power transmission between the first drive module 210 and the second drive module 230, preventing the wafer from being excessively squeezed by the clamping component 121, resulting in edge cracking, surface scratches, or internal stress accumulation.

[0052] In other embodiments, the transmission control module 220 may also be a similar overload protection structure such as a magnetic coupling transmission mechanism, a safety coupling, and a friction clutch. For example, when the transmission control module 220 is set to a magnetic coupling transmission mechanism, the magnetic coupling mechanism will play a role similar to a ratchet structure. When the clamping assembly 121 abuts against the positioning wafer, relative sliding will occur between the magnets. The safety coupling may be a shear pin type safety coupling or a spring type safety coupling. When the transmission control module 220 is set to a shear pin type safety coupling, under normal conditions, it transmits torque by connecting the active shaft and the driven shaft through a pin. When the clamping assembly 121 abuts against the positioning wafer, the pin will be cut off, separating the active shaft and the driven shaft and cutting off the power transmission. When the transmission control module 220 is set to a shear pin type safety coupling, the pin will be cut off, separating the active shaft and the driven shaft and cutting off the power transmission. When 0 is set to a spring-type safety coupling, it uses the elastic deformation of the spring to limit the transmitted torque. When the torque is too large (that is, when the clamping component 121 abuts the positioning wafer), the spring will be compressed or deformed, causing the two parts of the coupling to have relative displacement, thereby playing an overload protection role; when the transmission control module 220 is set to a friction clutch, it transmits torque through the friction force between the friction plates. When the clamping component 121 abuts the positioning wafer, relative sliding will occur between the friction plates, thereby limiting the transmitted torque and playing an overload protection role. When the overload situation disappears, the friction clutch can automatically restore the connection.

[0053] Further, see Figure 3The driving mechanism 200 further includes a pressure sensing module 240, a control module 250, and a power module 260. The pressure sensing module 240 and the power module 260 are electrically connected to the control module 250. That is, the pressure sensing module 240 and the power module 260 are both connected to the control module 250 via a signal line (dashed line in the figure).

[0054] Specifically, the power module 260 is also connected to the first driving module 210, and the power module 260 is used to supply power to the first driving module 210; the control module 250 is used to control the opening or closing of the power module 260 to drive the first driving module 210 to move or stop moving; the pressure sensing module 240 is also electrically connected to the power module 260.

[0055] More specifically, the pressure sensing module 240 is positioned below the drive control module 220, specifically below the first structure 221. When the clamping assembly 121 abuts against the wafer, the first structure 221 moves away from the second structure 222 and contacts the pressure sensing module 240, generating pressure change information. Because the control module 250 is electrically connected to the pressure sensing module 240, upon receiving the pressure change information from the pressure sensing module 240, the control module 250 controls the power module 260 to shut down, effectively stopping the movement of the first drive module 210 and the first structure 221.

[0056] Of course, the relative position distance between the pressure sensing module 240 and the first structure 221 needs to be reasonably set. When the clamping assembly 121 abuts against the positioning wafer, the first structure 221 moves away from the second structure 222 to ensure that the first structure 221 touches the pressure sensing module 240.

[0057] The pressure sensing module 240 may be specifically configured as a pressure sensor, and the control module 250 may be specifically configured as an integrated chip.

[0058] See Figure 4 A conductive gasket 223 is provided on the surface of the first structure 221 close to the pressure sensing module 240. When the first structure 221 contacts the pressure sensing module 240, the pressure sensing module 240 contacts the conductive gasket 223, thereby achieving conduction between the conductive gasket 223 and the pressure sensing module 240. The pressure sensing module 240 generates pressure change information and sends it to the control module 250.

[0059] Continue to see Figure 2 and Figure 3The drive mechanism 200 further includes a first connector 270 and an elastic mechanism 280, which are disposed on the side of the first structure 221 facing away from the second structure 222. The first connector 270 connects the first structure 221 and the first drive module 210, and the elastic mechanism 280 is wrapped around and fixed to the first connector 270 and connected to the first structure 221. When the clamping assembly 121 abuts against the positioning wafer, the first structure 221 compresses the elastic mechanism 280 away from the second structure 222. After the first drive module 210 stops moving, the elastic mechanism 280 is used to apply a force to the first structure 221 toward the second structure 222, thereby coupling the first structure 221 with the second structure 222.

[0060] The first connecting member 270 may be a cylindrical structure. When the power module 260 drives the first driving module 210 , the driving force of the first driving module 210 may be transmitted to the first structure 221 through the first connecting member 270 , so that the first driving module 210 and the first structure 221 move synchronously.

[0061] The elastic mechanism 280 may be a spring rotatably wound around the circumference of the first connecting member 270 , and the spring is connected to the lower surface of the first structure 221 (ie, the surface of the first structure 221 facing the first driving module 210 ). When the clamping assembly 121 abuts against the positioning wafer, the first structure 221 and the second structure 222 slip and separate, and the first structure 221 moves away from the second structure 222 to compress the spring. At this time, the conductive gasket 223 on the first structure 221 is conductively connected to the pressure sensing module 240, and the pressure sensing module 240 generates pressure change information and sends it to the control module 250; the control module 250 controls the shutdown of the power module 260, and the first driving module 210, the first connecting member 270 and the first structure 221 all stop moving; since the spring is in a deformed state when the first structure 221 and the second structure 222 slip and separate, when the first structure 221 also stops moving, due to the spring's own elastic force, a force is applied to the first structure 221 toward the second structure 222, causing the first structure 221 to move toward the second structure 222 and couple with the second structure 222, and the transmission control module 220 returns to its initial state.

[0062] Furthermore, the drive mechanism 200 further includes a second connector 290. The first drive module 210 includes a first drive gear 211 and a second drive gear 212 that mesh with each other. The first drive gear 211 is connected to the power module 260 via the second connector 290, and the second drive gear 212 is connected to the first structure 221 via the first connector 270. The second connector 290 can be a cylindrical structure. When the power module 260 is turned on, power can be transmitted to the first drive gear 211 via the second connector 290.

[0063] The second drive gear 212 is arranged below the transmission control module 220, that is, the second drive gear 212 is arranged below the first structure 221, and one end of the first connecting member 270 passes through the center of the second drive gear 212 to achieve the matching and fixation between the first connecting member 270 and the second drive gear 212; the other end of the first connecting member 270 is connected to the lower surface of the first structure 221 to achieve the matching and fixation between the first connecting member 270 and the first structure 221.

[0064] The first drive gear 211 is positioned partially around the circumference of the second drive gear 212 and meshes with the second drive gear 212, enabling the first drive gear 211 to rotate and drive the second drive gear 212. One end of the second connector 290 extends through the center of the first drive gear 211, securing the second connector 290 to the first drive gear 212. The other end of the second connector 290 is connected to the power module 260.

[0065] Specifically, the second drive gear 212 is larger than the first drive gear 211. The relatively large second drive gear 212 can slow down the rotational speed of the power module 260 output to the first drive gear 211, thereby avoiding the risk of the clamping assembly 121 moving too fast and causing the wafer to be crushed.

[0066] Continue to see Figure 3 The power module 260 includes a power converter 261, a drive circuit 262, and a motor 263, which are electrically connected in sequence. The power converter 261 is used to convert the received AC power into DC power and provide the required DC power to the drive circuit 262 and the motor 263. The drive circuit 262 is electrically connected to the control module 250. The control module 250 is used to control the drive circuit 262 to control the operation of the drive motor 263, including controlling the drive circuit 262 to drive the motor 263 forward and reverse. The power converter 261, the drive circuit 262, and the motor 263 are connected by a power line (solid line in the figure), and the drive circuit 262 and the control module 250 are connected by a signal line (dashed line in the figure).

[0067] The motor 263 is connected to the first drive module 210 and is used to drive the first drive module 210 to move. That is, the other end of the second connecting member 290 is connected to the motor 263. The motor 263 is connected to the first drive gear 211 through the second connecting member 290, and is used to drive the first drive gear 211 to rotate, thereby driving the second drive gear 212 to rotate. When the control module 250 controls the drive circuit 262 to drive the motor 263 to rotate forward, the power transmission between the first drive module 210, the transmission control module 220, and the second drive module 230 can cause the clamping assembly 121 to move toward the center of the accommodating platform 110. When the control module 250 controls the drive circuit 262 to drive the motor 263 to rotate reversely, the power transmission between the first drive module 210, the transmission control module 220, and the second drive module 230 can cause the clamping assembly 121 to move away from the center of the accommodating platform 110.

[0068] When the control module 250 receives pressure change information, i.e., when the clamping mechanism 121 contacts and positions the wafer, the control module 250 is further configured to control the drive circuit 262 to stop the operation of the drive motor 263. Of course, the control module 250 is also configured to control the rotational speed of the motor 263 when the motor 263 is in operation, thereby controlling the movement speed of the clamping assembly 121.

[0069] Of course, the power converter 261 is also electrically connected to the control module 250 and the pressure sensing module 240 through power lines, so as to provide the control module 250 and the pressure sensing module 240 with the required direct current.

[0070] For example, the motor 263 involved in this embodiment is a standard 24V motor, and can be controlled by the power converter 261 to output 5V DC power to the ports connected to the control module 250 and the pressure sensor module 240, and to output 24V DC power to the port connected to the drive circuit 262. The voltage output to the port connected to the drive circuit 262 is related to the standard specifications of the motor 263. For motors 263 of different specifications, the power converter 261 can be controlled to output different DC power levels. In other embodiments, the motor 263 can also be a standard 5V or 12V motor, and the power converter 261 can be controlled to output 5V or 12V DC power to the port connected to the drive circuit 262 accordingly.

[0071] See also Figure 2 and Figure 3The second drive module 230 includes a third drive gear 231 and a fourth drive gear 232 that mesh with each other. The third drive gear 231 is connected to the second structure 222, and the fourth drive gear 232 is connected to the positioning mechanism 120. When the control module 250 controls the drive circuit 262 to drive the motor 263 to operate, the operation of the motor 263 drives the first drive gear 211, the second drive gear 212, the first structure 221, and the second structure 222 to operate in sequence, thereby driving the third drive gear 231 and the fourth drive gear 232 to operate in sequence. The operation of the fourth drive gear 232 drives the positioning mechanism 120 to operate.

[0072] There are multiple fourth drive gears 232 , and each of the fourth drive gears 232 is connected to the positioning mechanism 120 in a one-to-one correspondence. All fourth drive gears 232 are engaged with the third drive gear 231 , so that the third drive gear 231 synchronously drives all fourth drive gears 232 to rotate.

[0073] The positioning platform 100 also includes a support column 130 arranged at the center of the lower surface of the accommodating platform 110. The support column 130 and the accommodating platform 110 are integrally formed, and the lower surface of the support column 130 is connected to the third drive gear 231. Multiple fourth drive gears 232 are arranged close to the circumferential surface of the support column 130 and are respectively engaged with the third drive gear 231.

[0074] Specifically, the third drive gear 231 is configured as an open "umbrella"-shaped structure. The lower surface of the support column 130 is connected to the top surface of the "umbrella" of the third drive gear 231. The second structure 222 is connected to the "umbrella" handle of the third drive gear 231. The outer surface of the "umbrella" of the third drive gear 231 serves as a gear surface. The gear surface of the fourth drive gear 232 meshes with the gear surface of the third drive gear 231. The third drive gear 231 and the fourth drive gear 232 can each be a bevel gear.

[0075] Combine Figure 1 、 Figure 2 and Figure 5 Each positioning mechanism 120 further includes a slide rail 122 connected to a corresponding fourth drive gear 232 and a conveyor 123 mounted within the slide rail 122. The clamping assembly 121 is fixedly connected to the conveyor 123. Each fourth drive gear 232 is connected to a conveyor 123 in a one-to-one correspondence. The fourth drive gear 232 is used to drive the conveyor 123 to move the clamping assembly 121 within the slide rail 122 to abut and position the wafer. When the clamping assembly 121 stops moving, the position of the clamping assembly 121 can remain fixed.

[0076] In one embodiment, the transmission device 123 is configured as a screw rod, which is meshed with the fourth driving gear 232 .

[0077] Of course, the transmission device 123 can also be configured as other structural components that can cooperate with the fourth driving gear 232, such as a gear rack, a ball screw, etc.

[0078] The clamping assembly 121 includes a slider 124 mounted on the conveying device 123 and a clamping structure 125 fixed above the slider 124. The slider 124 is fixed to the conveying device 123, and the interior of the slider 124 is provided with a threaded structure that cooperates with the conveying device 123. In this embodiment, the slider 124 is fixed to the screw rod, and the interior of the slider 124 is provided with a threaded structure that cooperates with the screw rod.

[0079] It should be noted that the present invention does not limit the specific shape of the slider 124, and it can be set to a rectangular structure, a circular structure or a structure of other shapes.

[0080] Specifically, the upper surface of the slider 124 is provided with a mounting groove (not shown in the figure). Figure 5 The clamping structure 125 includes a mounting portion 126 and a protrusion 127 that are interconnected. The mounting portion 126 is detachably mounted within the mounting slot. The slider 124 and the mounting portion 126 are both disposed within the sliding track 122. The protrusion 127 protrudes from the upper surface of the accommodating platform 110 and is used to abut and secure the wafer. In other words, when the fourth drive gear 232 drives the conveyor 123 to operate, it drives the slider 124 to move within the sliding track 122, causing the protrusion 127 to move on the upper surface of the accommodating platform 110 to abut and position the wafer placed on the accommodating platform 110. Furthermore, the mounting portion 126 and the slider 124 are detachably connected. If the protrusion 127 becomes deformed or damaged after repeated use over a long period of time, the corresponding accessory can be promptly replaced.

[0081] The present invention does not limit the specific shapes of the mounting portion 126 and the protrusion 127. The mounting portion 126 can be configured to be coupled with the mounting groove on the upper surface of the slider 124, and the protrusion 127 can be configured to be a cylindrical protrusion 127a (such as Figure 6 (a)), the protruding portion 127b of the rectangular parallelepiped structure (such as Figure 6 (b)) or the protrusion 127c of the arc surface structure (such as Figure 6 In (c), when the protrusion 127 is configured as an arc-shaped protrusion 127c, the size of the arc is related to the curvature of the wafer to be fixed and positioned.

[0082] In a specific embodiment of the present invention, the clamping structure 125 is configured as a rubber soft claw to further protect the wafer from being damaged.

[0083] In order to prevent the control module 250 from controlling the driving circuit 262 to drive the motor 263 to reverse, and the clamping assembly 121 from moving too long in the direction away from the center of the accommodating platform 110, causing the clamping assembly 121 to fall off from the positioning platform 100, in this embodiment, each sliding rail 122 is provided with a blocking portion 128 at the outermost side away from the center of the accommodating platform 110. The blocking portion 128 is used to prevent the clamping assembly 121 from falling off from the positioning platform 100 when the clamping assembly 121 moves in the direction away from the center of the accommodating platform 110.

[0084] Furthermore, the blocking portion 128 can be a structural member fixed to the outermost side of each sliding track 122 away from the center of the accommodating platform 110. The blocking portion 128 can be set in the space of the sliding track 122 to block the slider 124 from continuing to move outward, thereby blocking the clamping structure 125 from continuing to move outward. Figure 2 As shown, the blocking portion 128 can also be provided on the outer circumference of the upper surface of the accommodating platform 110 away from the center of the accommodating platform 110, and correspond one-to-one with the sliding rail 122 to directly block the clamping structure 125 from further outward movement. Of course, the blocking portion 128 can also be directly a shell portion of the positioning platform 100 connected to the outermost end of the sliding rail 122 on its circumferential side. The distance between all blocking portions 128 and the center of the accommodating platform 110 is equal.

[0085] Specifically, when the control module 250 controls the driving circuit 262 to drive the motor 263 to reverse, the clamping assembly 121 moves away from the center of the accommodating platform 110 and abuts the blocking portion 128. Due to the restriction of the blocking portion 128, the clamping assembly 121, the conveying device 123, the fourth driving gear 232, the third driving gear 231 and the second structure 222 will stop moving in sequence. At this time, since the motor 263 is still driving, the first structure 221 continues to operate, the first structure 221 and the second structure 222 slip and separate, and the first structure 221 The compression elastic mechanism 280 is moved in a direction away from the second structure 222 and contacts the pressure sensing module 240; the control module 250 receives the pressure change information sent by the pressure sensing module 240, and then controls the drive circuit 262 to stop the drive motor 263 from running, and the first drive gear 211, the second drive gear 212 and the first structure 221 stop running in turn; the first structure 221 moves toward the second structure 222 under the action of the elastic force of the elastic mechanism 280 itself and contacts the second structure 222, and the transmission control module 220 returns to its initial state.

[0086] Furthermore, see also Figure 1 and Figure 3The wafer positioning device further includes a first switch 140, a second switch 150, a third switch 160 disposed on the positioning platform 100, and a fourth switch 170 disposed between the power converter 261 and the drive circuit 262. The first switch 140, the second switch 150, the third switch 160, and the fourth switch 170 are electrically connected to the control module 250 via signal lines. Of course, the first switch 140, the second switch 150, the third switch 160, and the fourth switch 170 are also electrically connected to the power converter 261 via power lines.

[0087] The control logic between the first switch 140, the second switch 150, the third switch 160 and the fourth switch 170 and the various components of the device is specifically manifested as follows: when the first switch 140 is in the on state, the control module 250 controls the fourth switch 170 to be turned on and controls the drive circuit 262 to drive the motor 263 to rotate forward, so that the clamping assembly 121 moves toward the center of the accommodating platform 110; when the second switch 150 is in the on state, the control module 250 controls the fourth switch 170 to be turned on and controls the drive circuit 262 to drive the motor 263 to rotate reversely, so that the clamping assembly 121 moves toward the direction away from the center of the accommodating platform 110; when the third switch 160 is in the on state, the control module 250 controls the fourth switch 170 to be turned off to cut off the electrical connection between the power converter 261 and the drive circuit 262, cut off the power supply to the motor 263, and cause the motor 263 to stop running.

[0088] Exemplarily, the first switch 140 is set to a "tight" button, the second switch 150 is set to a "loose" button, the third switch 160 is set to an "emergency stop" button, and the fourth switch 170 is set to a single-pole single-throw switch. When it is necessary to position the wafer placed on the accommodating platform 110, the "tight" button can be pressed. At this time, the control module 250 controls the single-pole single-throw switch to close, and controls the drive circuit 262 to drive the motor 263 to rotate forward, so that the clamping assembly 121 moves toward the center of the accommodating platform 110. When the clamping assembly 121 abuts the positioning wafer, the control module 250 receives the pressure change information sent by the pressure sensing module 240, controls the drive circuit 262 to stop the drive motor 263 from running, and blocks the signal that is sent again by pressing the "tight" button to drive the motor 263 to rotate forward (that is, even if the "tight" button is pressed again at this time, the motor 263 will not restart). When the operation is completed, press "loose" word button, now control module 250 still controls single-pole single-throw switch closure, and controls drive circuit 262 to drive motor 263 counter-rotation, so that clamping assembly 121 moves towards the direction away from the center of accommodating platform 110.When clamping assembly 121 abuts blocking portion 128, control module 250 receives the pressure change information that pressure sensing module 240 sends, controls drive circuit 262 to stop drive motor 263 and runs, now shielding presses the signal that drives motor 263 counter-rotation that "loose" word button sends again, removes the shielding of the signal that drives motor 263 forward rotation that "tight" word button sends.When emergency occurs (such as wafer is stuck etc.), can press "emergency stop" word button, control module 250 controls single-pole single-throw switch to disconnect, to cut off the electrical connection between power converter 261 and drive circuit 262, stop motor 263 and run immediately.

[0089] To sum up, all the clamping components provided by the present invention move under the drive of the driving mechanism until all the clamping components simultaneously abut the wafer and fix the wafer. Since all the clamping components are evenly arranged around the accommodating platform, the center of the wafer corresponds to the center of the accommodating platform when it is fixed. The wafer positioning device of the present invention can be flexibly applied to the positioning of non-standard wafers, and the wafer can be fixed for operation without introducing vacuum access, and the structure is simple; at the same time, when the wafer is fixed by all the clamping components, the transmission control module will automatically disconnect the power transmission between the first drive module and the second drive module, that is, the second drive module will stop continuing to drive the clamping components, which can avoid the wafer from being excessively squeezed by the clamping components to cause edge cracking, surface scratches or internal stress accumulation, thereby protecting the wafer.

[0090] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limiting the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes shall fall within the scope of protection of the claims of the present invention.

Claims

1. A wafer positioning device, characterized in that: include: A positioning platform, the positioning platform comprising a receiving platform for placing a wafer and at least three positioning mechanisms, all of the positioning mechanisms being evenly arranged around the receiving platform, each of the positioning mechanisms comprising a clamping assembly for abutting and positioning the wafer; a drive mechanism disposed below the positioning platform and configured to drive all of the clamping assemblies to move toward the center of the accommodating platform; the drive mechanism comprising a first drive module, a transmission control module, and a second drive module, the transmission control module being connected to the first drive module and the second drive module, respectively; the transmission control module being configured to transmit power generated by the first drive module to the second drive module to drive the second drive module to move; and the second drive module being configured to drive all of the clamping assemblies to move to abut and position the wafer. When the clamping assembly abuts against the wafer to position it, the transmission control module disconnects the power transmission between the first driving module and the second driving module.

2. The wafer positioning device according to claim 1, characterized in that: The transmission control module includes a first structure and a second structure that cooperate with each other, the first structure is connected to the first driving module, and the second structure is connected to the second driving module, and the first driving module is used to drive the first structure and the second structure to move simultaneously; When the clamping assembly abuts against the wafer to position it, the first structure moves in a direction away from the second structure.

3. The wafer positioning device according to claim 2, characterized in that: The driving mechanism further includes a pressure sensing module, a control module, and a power module. The pressure sensing module and the power module are electrically connected to the control module respectively. The pressure sensing module is arranged below the transmission control module. The power module is connected to the first driving module and is used to supply power to the first driving module. The control module is used to control the power module to be turned on to drive the first driving module to move. When the clamping assembly abuts against the wafer to position it, the first structure moves in a direction away from the second structure and contacts the pressure sensing module, and the pressure sensing module generates pressure change information; the control module can also be used to control the shutdown of the power module when receiving the pressure change information sent by the pressure sensing module.

4. The wafer positioning device according to claim 3, characterized in that: A conductive gasket is provided on a surface of the first structure close to the pressure sensing module, and when the first structure contacts the pressure sensing module, the pressure sensing module contacts the conductive gasket; And / or, the driving mechanism also includes a first connecting member and an elastic mechanism arranged on the side of the first structure away from the second structure, the first connecting member connects the first structure and the first driving module, and the elastic mechanism is wrapped and fixed on the first connecting member and connected to the first structure; when the clamping assembly abuts and positions the wafer, the first structure compresses the elastic mechanism in a direction away from the second structure, and the elastic mechanism is used to apply a force to the first structure toward the second structure after the first driving module stops moving, so that the first structure is coupled with the second structure.

5. The wafer positioning device according to claim 4, characterized in that: The driving mechanism also includes a second connecting member, the first driving module includes a first driving gear and a second driving gear that are meshed with each other, the first driving gear is connected to the power module through the second connecting member, and the second driving gear is connected to the first structure through the first connecting member; wherein the size of the second driving gear is larger than that of the first driving gear.

6. The wafer positioning device according to claim 3, characterized in that: The second drive module includes a third drive gear and a fourth drive gear that mesh with each other, the third drive gear is connected to the second structure, and the fourth drive gear is connected to the positioning mechanism; a plurality of fourth drive gears are provided, and the fourth drive gears are connected to the positioning mechanism in a one-to-one correspondence, and all the fourth drive gears are meshed with the third drive gear, so that the third drive gear synchronously drives all the fourth drive gears to rotate; And / or, the transmission control module is configured as a ratchet structure, the first structure is a pawl, and the second structure is a ratchet gear.

7. The wafer positioning device according to claim 5, characterized in that: The power module includes a power converter, a drive circuit and a motor electrically connected in sequence; The motor is connected to the first driving gear through the second connecting member, and is used to drive the first driving gear to rotate, thereby driving the second driving gear to rotate; The driving circuit is electrically connected to the control module, and the control module is used to control the driving circuit to drive the motor to operate; wherein, when the control module receives the pressure change information, the control module is also used to control the driving circuit to stop driving the motor to operate.

8. The wafer positioning device according to claim 6, wherein: The positioning platform further includes a support column disposed at the center of the lower surface of the accommodating platform, the support column and the accommodating platform being integrally formed, and the lower surface of the support column is connected to the third driving gear, and the plurality of fourth driving gears are disposed close to the circumferential surface of the support column; Each of the positioning mechanisms further comprises a sliding track connected to the corresponding fourth drive gear and a conveying device installed in the sliding track, the clamping assembly is fixedly connected to the conveying device, the fourth drive gear is connected to the conveying device in a one-to-one correspondence, and the fourth drive gear is used to drive the conveying gear to move the clamping assembly in the sliding track; Each of the sliding rails is provided with a blocking portion at the outermost side away from the center of the accommodating platform, and the blocking portion is used to prevent the clamping assembly from falling off the positioning platform when the clamping assembly moves in a direction away from the center of the accommodating platform.

9. The wafer positioning device according to claim 8, characterized in that: The transmission device is provided as a screw, and the screw is meshed with the fourth driving gear; the clamping assembly includes a slider mounted on the transmission device and a clamping structure fixed above the slider, the slider is fixed on the transmission device, and the interior of the slider is provided with a threaded structure that cooperates with the transmission device; And / or, a mounting groove is provided on the upper surface of the slider, the clamping structure includes a mounting portion and a protruding portion connected to each other, the mounting portion is detachably mounted in the mounting groove, the protruding portion protrudes from the upper surface of the accommodating platform and is used to abut and fix the wafer; the protruding portion is configured as a cylindrical structure, a rectangular parallelepiped structure or an arc surface structure; And / or, the clamping structure is configured as a rubber soft claw.

10. The wafer positioning device according to claim 7, wherein: The wafer positioning device further includes a first switch, a second switch, and a third switch disposed on the positioning platform, and a fourth switch disposed between the power converter and the drive circuit, wherein the first switch, the second switch, the third switch, and the fourth switch are electrically connected to the control module respectively; When the first switch is in the on state, the control module controls the fourth switch to be turned on and controls the drive circuit to drive the motor to rotate forward, so that the clamping assembly moves toward the center of the accommodating platform; When the second switch is in the on state, the control module controls the fourth switch to be turned on and controls the drive circuit to drive the motor to reverse, so that the clamping assembly moves in a direction away from the center of the accommodating platform; When the third switch is in the on state, the control module controls the fourth switch to be turned off to cut off the electrical connection between the power converter and the driving circuit.

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