Wafer clamping device, conveying system and method of use thereof

Abstract

The application relates to the technical field of wafer preparation, and discloses a wafer clamping device, a conveying system and an application method thereof, which comprise a clamp module, a connecting piece and a driving mechanism, wherein the clamp module has two clamp ends, the two clamp ends are connected through a holder, the two clamp ends are arranged in a stacked mode and face the same side, the connecting piece is arranged on the holder and is used for separating or abutting the holder so as to separate or abut the two clamp ends, and the driving mechanism is connected with the clamp module and is used for driving the clamp module to rotate or linearly displace and applying a force for separating or abutting the two clamp ends. The two clamp ends are arranged on the clamp module in a stacked mode, the relative position can be adjusted by separating or abutting the holder, the wafer can be conveniently grabbed from a small space, the miniaturization of related equipment is facilitated, the feeding and discharging can be conveniently realized from the same side, and the miniaturization of the equipment is further facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer preparation, and in particular to a wafer clamping device, a conveying system and an application method thereof. BACKGROUND

[0002] A wafer is a silicon wafer used for making semiconductor circuits, which is made of a silicon crystal rod by purifying polycrystalline silicon, and is made through processes such as photographic plate making, grinding, polishing, slicing, etc. In the wafer preparation process, the residual particles of grinding, polishing and slicing, and the number of particles in the air will affect the quality and reliability of the wafer, so the wafer needs to be cleaned to ensure the application quality and reliability.

[0003] The existing patent application with the application number CN116936410A discloses a kind of semi-automatic wafer cleaning machine and wafer cleaning method, including rack and setting in rack electric control box and man-machine interface, cleaning zone is provided with cleaning mechanism, cleaning mechanism includes cleaning cavity, main shaft assembly, brush swing arm, N2 swing arm and two-fluid swing arm, the rear end of rack is provided with the exhaust pipe that is communicated with the inside of cleaning cavity, the exhaust pipe is connected with water vapor separation mechanism, water vapor separation mechanism includes strong exhaust fan and water vapor separation tank.

[0004] As in the above technical solution, a cleaning mechanism is arranged in the interior of the cleaning machine for the cleaning work of the wafer. The current wafer cleaning machine mostly adopts a double clamp structure, one clamp is used to place the wafer incoming material on the cleaning mechanism, and the other clamp is used to take out the cleaned wafer. This structure makes the wafer cleaning machine bulky. Especially for the cleaning equipment or other processing equipment with the same direction of incoming and outgoing materials, more space is needed to arrange the clamp structure to avoid interference of incoming and outgoing materials. In addition to the wafer clamping and conveying structure, a material pushing device is also needed to push the wafer onto the conveying assembly, which further leads to the overlarge size of the cleaning machine. SUMMARY

[0005] Therefore, the present application provides a wafer clamping device, a conveying system and an application method thereof with compact structure and same direction of incoming and outgoing materials to solve the problem of overlarge size of the wafer cleaning machine due to two sets of clamps and the need of setting a material pushing mechanism.

[0006] The technical solution of the present application is as follows:

[0007] On the one hand, the present application provides a wafer clamping device, which comprises a clamp module, a connecting piece and a driving mechanism, wherein,

[0008] The clamp module has two clamp ends, and the two clamp ends are connected through a retainer;

[0009] The two clamp ends are stacked and face the same side.

[0010] The connecting piece is arranged on the holder, and the connecting piece is used for separating or abutting the holder to separate or abut the two clamp ends;

[0011] The driving mechanism is connected with the clamp module, and the driving mechanism is used for driving the clamp module to rotate or linearly displace and apply a force for separating or abutting the two clamp ends.

[0012] On the basis of the above technical scheme, preferably, the holder comprises a horizontal plate and a connecting rod, and one clamp end is arranged on the horizontal plate and the connecting rod, wherein,

[0013] The horizontal plate is connected with a movable end of the driving mechanism;

[0014] The connecting rod is arranged on the horizontal plate, and two ends of the connecting rod correspond to the horizontal plate;

[0015] Two connecting pieces are arranged on the horizontal plate, the connecting pieces are chucks, the chucks are clamped with the connecting rod, or,

[0016] The connecting pieces are expansion shafts, the expansion shafts are inserted into the connecting rod and expanded.

[0017] On the basis of the above technical scheme, preferably, the clamp end comprises a cylinder body, a movable end, a rudder, an extension arm and a suction cup, wherein,

[0018] The cylinder body is arranged on the horizontal plate and the connecting rod;

[0019] The movable end is in sliding fit with the cylinder body;

[0020] The rudder is arranged on the movable end;

[0021] One end of the extension arm is connected with a main shaft of the rudder, and the suction cup is arranged on the other end of the extension arm.

[0022] On the basis of the above technical scheme, preferably, the driving mechanism comprises a first linear driving piece, a rotary driving piece and a second linear driving piece, wherein,

[0023] A movable end of the first linear driving piece is installed with the rotary driving piece;

[0024] A movable end of the rotary driving piece is installed with the second linear driving piece;

[0025] A movable end of the second linear driving piece is connected with the clamp module.

[0026] On the basis of the above technical scheme, preferably, the first linear driving piece comprises a carrier plate, a slide rail, a slide block, a connecting rod, a bearing seat, an end plate and a rodless cylinder, wherein,

[0027] The slide rail and the slide block in sliding fit are arranged on both side surfaces of the carrier plate;

[0028] Two connecting rods are arranged corresponding to each slider, and the connecting rods are connected with the sliders through bearing seats;

[0029] One end plate is arranged on each end of the connecting rod;

[0030] The rodless cylinder is arranged on the other side of the carrier plate;

[0031] One of the end plates is connected with the movable end of the rodless cylinder, and the rotary driving member is arranged on the other end plate.

[0032] On the basis of the above technical scheme, preferably, the rotary driving member comprises a connecting frame, a locking frame and a motor, wherein,

[0033] The connecting frame is provided with two, each of which is in sliding connection with the two connecting rods, and the two connecting frames are clamped together;

[0034] The locking frame is provided with two, each of which is arranged on the two connecting rods, and the locking frame is detachably connected with the connecting frame;

[0035] The motor is clamped between the two connecting frames, and the main shaft of the motor penetrates the end plate and is connected with the second linear driving member.

[0036] On the basis of the above technical scheme, preferably, the second linear driving member comprises a side plate, a connecting plate, an extension piece and a guide shaft, wherein,

[0037] The side plate is provided with one on each side of the connecting plate, and one of the side plates is connected with the main shaft of the motor;

[0038] The extension piece is arranged on the connecting plate, and the movable end of the extension piece is connected with the clamp module;

[0039] One end of the guide shaft is connected with the clamp module, and the other end is in sliding fit with the connecting plate.

[0040] On the other hand, the present application provides a conveying system comprising the above wafer clamping device, further comprising a support column, a first conveying belt, a cylinder, a second conveying belt, a hanging bracket and a pneumatic clamping jaw, wherein,

[0041] The support column is fixed opposite to the wafer clamping device;

[0042] One end of the first conveying belt is rotatably connected with the support column, and the other end is suspended;

[0043] The cylinder is rotatably connected with the support column, and the movable end of the cylinder is hingedly connected with the first conveying belt;

[0044] The second conveying belt is arranged on the upper side of the first conveying belt, one end of the second conveying belt is connected with the support column, and the other end is connected with the hanging bracket, and the hanging bracket is fixed opposite to the support column;

[0045] The pneumatic clamping jaw is arranged on each side of the second conveying belt, the holder is provided with a butt joint rod, and the pneumatic clamping jaw clamps the butt joint rod.

[0046] On the basis of the above technical scheme, preferably, further comprising a guide plate, a limiting shaft, a spray pipe and a spray head, wherein,

[0047] One end of the guide plate is connected with the first conveying belt, and the other end is a free end, and a guide groove is formed in the guide plate;

[0048] The limiting shaft is arranged on the second conveying belt, and the limiting shaft is in sliding fit with the guide groove;

[0049] The spray pipe is arranged on the end of the guide plate away from the first conveying belt;

[0050] The spray head is connected with the spray pipe in penetration.

[0051] In still another aspect, the application provides a method for using the conveying system as described above, comprising the following steps:

[0052] S1, conveying the uncleaned wafer by the first conveying belt,

[0053] S2, the pneumatic clamping jaw clamps the butt joint rod, the holder is in a separated state, and a part of the holder is fixed with one clamp end on the side of the second conveying belt,

[0054] S3, the other clamp end is actuated to grab the uncleaned wafer,

[0055] S4, the driving mechanism is actuated to overturn the connected clamp end and the uncleaned wafer, and place the uncleaned wafer at a cleaning station,

[0056] S5, the driving mechanism is actuated to overturn the connected clamp end to reset, and then the two parts of the holder are butt jointed,

[0057] S6, after cleaning, the driving mechanism is actuated to overturn the clamp module and the connecting piece, and then the cleaned wafer is grabbed by the clamp end close to the cleaning station,

[0058] S7, the driving mechanism is actuated to overturn the clamp module and the connecting piece to place the cleaned wafer on the second conveying belt;

[0059] S8, the above steps S1-S7 are repeated to realize continuous cleaning work of the wafer;

[0060] When the driving mechanism is actuated to overturn the connected clamp end and the uncleaned wafer, the cylinder is actuated to incline the first conveying belt to avoid interference of components;

[0061] In the first conveying belt is inclined, the second conveying belt transports the cleaned wafer, at the same time, high temperature nitrogen is supplied into the spray pipe and is sprayed out by the spray head to dry the cleaned wafer.

[0062] The wafer clamping device, the conveying system and the application method thereof have the following beneficial effects relative to the prior art:

[0063] (1) Two clamp ends are arranged on the clamp module, which can be used for clamping the uncleaned and cleaned wafers respectively, so that the pollution problem can be avoided. Since the two clamp ends are arranged in layers and can be separated or connected by the holder, the relative position can be adjusted, so that the wafers can be grabbed from a smaller space, which is beneficial to the miniaturization of the related equipment. At the same time, the clamp module can be turned over and linearly displaced by the driving mechanism, so that the wafers can be fed in and out from the same side, which is further beneficial to the miniaturization of the equipment.

[0064] (2) The holder carries one clamp end on the cross plate and the connecting rod respectively, and uses the chuck or the expansion shaft as the connecting piece, so as to conveniently connect or separate the cross plate and the connecting rod, and thus the two clamp ends can be separated, which has the advantages of simple structure and convenient application.

[0065] (3) In the structure of the clamp end, the suction cup is installed on the movable end of the cylinder body through the telescopic arm and the steering machine. In this way, during work, the suction cup can be telescoped and rotated through the telescopic arm and the steering machine, which is convenient for adjusting the suction position of the wafer and also convenient for storage, so as to avoid the interference between the clamp end and other components when the two clamp ends work at the same time.

[0066] (4) In the structure of the driving mechanism, the first linear driving piece is installed with the rotary driving piece through the connecting rod, and the rotary driving piece is detachably connected with the connecting rod through the locking frame. The locking frame is connected with the connecting frame arranged on the connecting rod, so as to facilitate disassembly and maintenance. At the same time, the arrangement of the connecting frame can ensure the relative position stability of the two connecting rods, which is beneficial to the stability and precision of the driving piece.

[0067] (5) In the structure of the conveying system, the first conveying belt and the second conveying belt are arranged in a stacked structure, and the second conveying belt is installed by the air cylinder, so that the second conveying belt can swing. In this way, the two conveying belts can be arranged more compactly. When the clamp module moves, the first conveying belt can swing under the driving of the air cylinder, so as to expand the space, which can avoid the interference problem during wafer transfer, and has the advantage of reasonable structure design.

[0068] (6) the first conveying belt is provided with a guide plate, and the second conveying belt is provided with a limiting shaft, which can ensure the stability of the movement when the first conveying belt swings; meanwhile, the guide plate is provided with a spray pipe and a spray head, and with the swing of the first conveying belt, the spray pipe and the spray head will move towards the cleaned wafer on the second conveying belt under the drive of the guide plate, and nitrogen blowing is carried out, which is beneficial to the rapid drying of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0069] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0070] Figure 1 It is a perspective view of the wafer clamping device of the present application;

[0071] Figure 2 It is an exploded view of the wafer clamping device of the present application;

[0072] Figure 3 It is a front view of the wafer clamping device of the present application;

[0073] Figure 4 It is a back structure perspective view of the wafer clamping device of the present application;

[0074] Figure 5 It is a second linear drive member retraction structure perspective view of the wafer clamping device of the present application;

[0075] Figure 6 It is a perspective view of the driving mechanism of the wafer clamping device of the present application;

[0076] Figure 7 It is a perspective view of the conveying system of the present application;

[0077] Figure 8 It is a front view of the conveying system of the present application;

[0078] Figure 9 It is a side view of the conveying system of the present application;

[0079] Figure 10 It is a driving mechanism swing structure perspective view of the conveying system of the present application;

[0080] Figure 11 It is a wafer incoming structure schematic view of the conveying system of the present application;

[0081] Figure 12 It is a clamp module grasping wafer structure schematic view of the conveying system of the present application;

[0082] Figure 13 The first conveying belt and driving mechanism swing structure of the conveying system of the present application;

[0083] Figure 14 The to-be-cleaned wafer in-place structure of the conveying system of the present application;

[0084] Figure 15 The driving mechanism reset structure of the conveying system of the present application;

[0085] Figure 16 The two gripper end synchronous action structure of the conveying system of the present application;

[0086] Figure 17 The two gripper end synchronous action in-place structure of the conveying system of the present application;

[0087] Figure 18 The wafer cleaning completed wafer transfer to the second conveying belt structure of the conveying system of the present application;

[0088] In the figure: 1, gripper module; 11, gripper end; 111, cylinder body; 112, movable end; 113, steering wheel; 114, telescopic arm; 115, suction cup; 12, holder; 121, cross plate; 122, connecting rod; 123, butt joint rod; 2, connecting piece; 3, driving mechanism; 31, first linear driving piece; 311, carrier plate; 312, slide rail; 313, sliding block; 314, connecting rod; 315, bearing seat; 316, end plate; 317, rodless cylinder; 32, rotary driving piece; 321, connecting frame; 322, locking frame; 323, motor; 33, second linear driving piece; 331, side plate; 332, connecting plate; 333, telescopic piece; 334, guide shaft; 4, support column; 5, first conveying belt; 6, cylinder; 7, second conveying belt; 8, hanging bracket; 9, pneumatic clamping jaw; 10, guide plate; 1001, guide groove; 13, limiting shaft; 14, spray pipe; 15, spray head. DETAILED DESCRIPTION

[0089] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0090] As Figures 1-18As shown, the wafer clamping device of the present application comprises a clamp module 1, a connecting piece 2 and a driving mechanism 3, the conveying system of the present application comprises the above-mentioned wafer clamping device, and further comprises a support column 4, a first conveying belt 5, an air cylinder 6, a second conveying belt 7, a hanger 8, a pneumatic clamping jaw 9, a guide plate 10, a limiting shaft 13, a spray pipe 14 and a spray head 15.

[0091] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11. Figures 1-6 As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0092] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0093] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0094] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0095] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0096] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0097] As shown, the clamp module 1 has two clamp ends 11, and the two clamp ends 11 are connected through a retainer 12; the two clamp ends 11 are arranged in a stacked manner and face the same side; the connecting piece 2 is arranged on the retainer 12, and the connecting piece 2 is used to separate or butt joint the retainer 12 so as to separate or butt joint the two clamp ends 11; the driving mechanism 3 is connected with the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly displace, and to exert a force for separating or butt jointing the two clamp ends 11.

[0098] In the structure, the two clamp ends 11 are stacked, and the relative position can be adjusted by separating or abutting the holder 12, so that the wafer can be grabbed from a small space, and the related equipment can be miniaturized. Meanwhile, the clamp module 1 can be flipped and linearly displaced by the driving mechanism 3, so that the feeding and discharging can be performed from the same side, which further facilitates the miniaturization of the equipment.

[0099] As shown in Figure 1 , the holder 12 includes a horizontal plate 121 and a connecting rod 122, and one clamp end 11 is arranged on the horizontal plate 121 and the connecting rod 122. The horizontal plate 121 is connected to the movable end of the driving mechanism 3. The connecting rod 122 is arranged on the horizontal plate 121, and the two ends of the connecting rod 122 correspond to the horizontal plate 121. Two connecting pieces 2 are arranged on the horizontal plate 121. The connecting piece 2 is a chuck, which clamps the connecting rod 122, or the connecting piece 2 is an expansion shaft, which is inserted into the connecting rod 122 and expanded.

[0100] As described above, the two parts of the holder 12 that can be separated or abutted are the horizontal plate 121 and the connecting rod 122. The driving mechanism 3 is connected to the horizontal plate 121. Thus, when working, the driving mechanism 3 can drive the horizontal plate 121 and one clamp end 11 to move away from the connecting rod 122 and the other clamp end 11, or relatively close to each other.

[0101] When the horizontal plate 121 and the connecting rod 122 are relatively close to each other, the connecting piece 2 is used to abut the connecting rod 122, thereby forming a complete clamp module 1.

[0102] The connecting piece 2 is arranged as a chuck. When the horizontal plate 121 is driven by the driving mechanism 3 to move close to the connecting rod 122, the chuck clamps the end of the connecting rod 122, thereby achieving connection.

[0103] Or, the connecting piece 2 is arranged as an expansion shaft. When the horizontal plate 121 is driven by the driving mechanism 3 to move close to the connecting rod 122, the expansion shaft is inserted into the connecting rod 122, and then expanded and fixed. Also, the complete clamp module 1 can be integrated, which has the advantages of simple structure and convenient application.

[0104] Through the above structure, the shape and volume of the clamp module 1 can be changed, which is convenient for use in a narrow space.

[0105] As shown in Figure 1 , the clamp end 11 includes a cylinder body 111, a movable end 112, a rudder 113, a telescopic arm 114, and a suction cup 115. The cylinder body 111 is arranged on the horizontal plate 121 and the connecting rod 122. The movable end 112 is in sliding cooperation with the cylinder body 111. The rudder 113 is arranged on the movable end 112. One end of the telescopic arm 114 is connected to the main shaft of the rudder 113. The suction cup 115 is arranged on the other end of the telescopic arm 114.

[0106] As the above structure, the clamp end 11 in work, the cylinder body 111 can drive the movable end 112 to carry out or retract, so as to drive the wafer to realize small distance adjustment, then rely on the driving mechanism 3 to drive the clamp module 1 to move, can realize the adjustment of large distance;

[0107] Specifically, when carrying out the work of grabbing or placing, the cylinder body 111 can drive the movable end 112 to approach or away from the wafer, so as to facilitate the distance fine adjustment of wafer grabbing and placing;

[0108] Among them, the clamp end 11, rely on suction cup 115 to grab wafer or wafer carrier, and then drive the wafer to move;

[0109] Specifically, the suction cup 115 adopts ceramic suction cup, which has the advantages of good stability, reliable application, etc., which can avoid the problems such as static interference and impurity affecting the quality of wafer;

[0110] Among them, the suction cup 115 is telescopic and rotated through the telescopic arm 114 and the rudder 113, which is convenient for adjusting the suction position of the wafer, and also convenient for realizing the storage, so as to avoid the interference problem between the clamp end 11 and other components when the two clamp ends 11 work at the same time;

[0111] Specifically as Figure 5 Indicated, when the two clamp ends 11 move synchronously, the telescopic arm 114 of the non-working clamp end 11 is retracted, and the rudder 113 drives the telescopic arm 114 and the suction cup 115 to rotate, so that the telescopic arm 114 is parallel to the horizontal plate 121, thereby reducing the volume, so as to prevent the interference problem; when processing different types of wafers, this structure can also adjust the grabbing range of the clamp end, so as to adapt to the transfer work of different size wafers.

[0112] As Figure 4 Indicated, the driving mechanism 3 includes a first linear driving member 31, a rotary driving member 32 and a second linear driving member 33, wherein the movable end of the first linear driving member 31 is installed with the rotary driving member 32; the movable end of the rotary driving member 32 is installed with the second linear driving member 33; the movable end of the second linear driving member 33 is connected with the clamp module 1;

[0113] As the above structure, the driving mechanism 3 is provided with three driving members, so as to realize the multi-degree of freedom adjustment of the clamp module 1;

[0114] Among them, the first linear driving member 31 is used to drive the clamp module 1 to move linearly, so as to realize the position adjustment of the clamp module 1, which is convenient for the clamp end 11 to place the wafer on the cleaning station or the conveying belt;

[0115] The rotating driving member 32 is used to drive the clamp module 1 to rotate, so as to move the wafer between the cleaning station and the conveying belt. In this way, the clamp module 1 only needs to rotate in place during adjustment, which is beneficial to the miniaturization of the structure and the improvement of the conveying speed.

[0116] The second linear driving member 33 is also used to drive the clamp module 1 to move linearly, so as to adjust the distance between the clamp end 11 and the wafer, and the distance between the wafer and the cleaning station and the feeding and discharging station.

[0117] In addition, the distance between the clamp end 11 and the station can be adjusted, so that the two clamp ends 11 arranged in a stack can selectively clamp the wafer at the same position through any one of them, thereby improving the convenience of application.

[0118] As shown in FIGS. 1, 2 and 3, the first linear driving member 31 comprises a carrier plate 311, a slide rail 312, a slide block 313, a connecting rod 314, a bearing seat 315, an end plate 316 and a rodless cylinder 317. Figure 2 Figure 6 The slide rail 312 and the slide block 313 are arranged on the two side surfaces of the carrier plate 311 in a sliding manner. Two connecting rods 314 are arranged on each slide block 313, and the connecting rod 314 is connected to the slide block 313 through the bearing seat 315. One end plate 316 is arranged on each end of the connecting rod 314. The rodless cylinder 317 is arranged on the other side surface of the carrier plate 311. One end plate 316 is connected to the movable end of the rodless cylinder 317, and the rotating driving member 32 is arranged on the other end plate 316.

[0119] The carrier plate 311 is a support base, which is used to be connected to the rack of the equipment, so as to support the driving mechanism 3, the connecting member 2 and the clamp module 1.

[0120] The connecting rod 314 is connected to the slide rail 312 on the carrier plate 311 through the slide block 313. The end of the connecting rod 314 is provided with the end plate 316. One end plate 316 is connected to the movable end of the rodless cylinder 317 arranged on the carrier plate 311, so that the rodless cylinder 317 can drive the connecting rod 314 to slide.

[0121] The other end of the connecting rod 314 is also provided with the end plate 316, which is used to mount the rotating driving member 32. In this way, under the driving of the rodless cylinder 317, the rotating driving member 32 and the second linear driving member 33 can move, so as to adjust the horizontal position, thereby facilitating the adjustment of the wafer position.

[0122] ​Specifically, the connecting rods 314 are arranged on both sides of the carrier plate 311, and the end plates 316 are connected with the four connecting rods 314, thereby integrating the connecting rods 314, and cooperating with the mounting and fixing of the bearing seats 315 on the sliding blocks 313 to ensure the stability of the overall structure.

[0123] Specifically, the connecting rods 314 and the end plates 316 are connected by bolts and the like fasteners, so as to facilitate disassembly and replacement, and improve the operation convenience.

[0124] As shown in Figure 2 and Figure 6 , the rotary drive 32 includes a connecting frame 321, a locking frame 322 and a motor 323, wherein the connecting frame 321 is provided with two, each connecting frame 321 is connected with two connecting rods 314, and the two connecting frames 321 are clamped; the locking frame 322 is provided with two, each locking frame 322 is arranged on two connecting rods 314, and the locking frame 322 is detachably connected with the connecting frame 321; the motor 323 is clamped between the two connecting frames 321, and the main shaft of the motor 323 penetrates the end plate 316 and is connected with the second linear drive 33.

[0125] As described above, the rotary drive 32 is connected with the connecting rods 314 by the connecting frame 321 and the locking frame 322.

[0126] Among them, two connecting frames 321 are each connected with two connecting rods 314 for sliding fit, so as to facilitate disassembly and replacement on the connecting rods 314, and the connecting frame 321 is used for mounting the motor 323, since the connecting frame 321 is provided with two parts and can be clamped with each other, so as to facilitate the assembly of the motor 323, and has good structural stability at the same time;

[0127] Among them, the locking frame 322 is connected with two connecting rods 314, so as to ensure the relative position stability of the two connecting rods 314, thereby facilitating the stable operation and operation accuracy of the drive;

[0128] At the same time, the locking frame 322 is detachably connected with the connecting frame 321, and is connected and locked by bolts, so as not to interfere with the disassembly of the connecting frame 321 and the motor 323, and facilitate the operation of the operation and maintenance work.

[0129] As shown in Figure 2 and Figure 6 , the second linear drive 33 includes a side plate 331, a connecting plate 332, an extension piece 333 and a guide shaft 334, wherein the side plate 331 is provided with one on both sides of the connecting plate 332, and one of the side plates 331 is connected with the main shaft of the motor 323; the extension piece 333 is arranged on the connecting plate 332, and the movable end of the extension piece 333 is connected with the clamp module 1; one end of the guide shaft 334 is connected with the clamp module 1, and the other end is slidably connected with the connecting plate 332.

[0130] The second linear driving member 33 is used to drive the clamp module 1 to move linearly.

[0131] The connecting plate 332 is used as a carrier, and the telescopic member 333 and the guide shaft 334 are installed on the connecting plate 332. The telescopic member 333 is a multi-stage telescopic cylinder, so that the volume can be reduced and the interference problem during assembly can be avoided.

[0132] During adjustment, the telescopic member 333 drives the clamp module 1 and the wafer to move, so as to transfer between the conveying station and the cleaning station. The guide shaft 334 is synchronously telescoped, so as to play a guiding role, thereby ensuring stable movement.

[0133] The two sides of the connecting plate 332 are provided with side plates 331. One of the side plates 331 is connected with the main shaft of the motor 323, so that the rotary driving member 32 can be driven to rotate. The other side plate 331 is used to connect a supporting component. The supporting component is rotatably connected with the side plate 331, so that the suspended second linear driving member 33 can ensure stable movement.

[0134] Specifically, the supporting component is slidably connected with the equipment rack, so as to avoid interfering with the movement of the first linear driving member 31.

[0135] As shown in Figures 7-18 The support column 4 is fixed relative to the wafer clamping device. One end of the first conveying belt 5 is rotatably connected with the support column 4, and the other end is suspended. The air cylinder 6 is rotatably connected with the support column 4, and the movable end of the air cylinder 6 is hingedly connected with the first conveying belt 5. The second conveying belt 7 is arranged on the upper side of the first conveying belt 5, and one end of the second conveying belt 7 is connected with the support column 4, and the other end is connected with the hanger 8. The hanger 8 is fixed relative to the support column 4. The pneumatic clamping jaw 9 is arranged on both sides of the second conveying belt 7. The retaining frame 12 is provided with a butt joint rod 123, and the pneumatic clamping jaw 9 clamps the butt joint rod 123.

[0136] As shown in the above structure, the support column 4 is used to connect the equipment rack, so as to support the first conveying belt 5 and the second conveying belt 7. The second conveying belt 7 is also connected with the hanger 8, and the hanger 8 is also connected with the equipment rack, so as to realize the installation and fixation of the second conveying belt 7.

[0137] Since one end of the first conveying belt 5 is rotatably connected with the support column 4, the air cylinder 6 is arranged to connect the support column 4 with the first conveying belt 5, so as to fix the position of the first conveying belt 5. During work, the air cylinder 6 can drive the first conveying belt 5 to swing, so as to adjust the distance between the suspended end of the first conveying belt 5 and the second conveying belt 7, which facilitates the taking out of the wafer, thereby avoiding the wafer transfer interference problem.

[0138] Specifically, in operation, the first conveying belt 5 conveys the uncleaned wafer, at this time, the pneumatic clamping jaw 9 on the second conveying belt 7 clamps the butt joint rod 123, so that the connecting rod 122 and one clamp end 11 are fixed on the second conveying belt 7, at this time, the connecting piece 2 is disconnected with the connecting rod 122, then under the driving of the second linear driving piece 33, the cross plate 121 and the other clamp end 11 move, so that the holding frame 12 is separated, then under the driving of the rotary driving piece 32, the clamp end 11 is flipped, so as to facilitate clamping the wafer and sending to the cleaning station;

[0139] In the flipping process, the cylinder 6 synchronously drives the first conveying belt 5 to swing, so as to adjust the distance with the second conveying belt 7, and the second linear driving piece 33 is synchronously retracted, so as to avoid the interference of the wafer with the other clamp end 11 and the first conveying belt 5;

[0140] After the wafer is sent to the cleaning station, the rotary driving piece 32 drives the clamp end 11 to flip and reset, and the cross plate 121 is driven by the second linear driving piece 33 to approach the connecting rod 122, so that the connecting piece 2 is connected with the connecting rod 122 again.

[0141] As shown in Figures 7-10 , one end of the guide plate 10 is connected with the first conveying belt 5, the other end is a free end, and a guide groove 1001 is formed in the guide plate 10; the limiting shaft 13 is arranged on the second conveying belt 7, and the limiting shaft 13 is in sliding fit with the guide groove 1001; the spray pipe 14 is arranged on the end of the guide plate 10 away from the first conveying belt 5; the spray head 15 is connected with the spray pipe 14 in penetration;

[0142] As shown in the above structure, when the cylinder 6 synchronously drives the first conveying belt 5 to swing, the guide plate 10 slides with the limiting shaft 13 through the guide groove 1001, so as to ensure the stability of the action;

[0143] At the same time, since the first conveying belt 5 drives the guide plate 10 to move, the guide plate 10 drives the spray pipe 14 and the spray head 15 to move, so that the spray head 15 approaches the cleaned wafer, at this time, high-temperature nitrogen is supplied into the spray pipe 14, and is sprayed out from the spray head 15, so as to dry the cleaned wafer, which has the advantages of reasonable structure and good function.

[0144] The application method of the conveying system comprises the following steps:

[0145] S1, as shown in Figure 11 , the first conveying belt 5 conveys the uncleaned wafer,

[0146] S2, as shown in Figure 12 , the pneumatic clamping jaw 9 clamps the butt joint rod 123, the holding frame 12 is in a separated state, and part of the holding frame 12 is fixed on the side of the second conveying belt 7 with one clamp end 11,

[0147] S3, the other clamp end 11 acts to grab the unclean wafer,

[0148] S4, as shown in Figure 13 and Figure 14 , the driving mechanism 3 acts to flip the clamp end 11 and the unclean wafer connected thereto, and place the unclean wafer in the cleaning station,

[0149] S5, as shown in Figure 15 , the driving mechanism 3 acts to flip the clamp end 11 connected thereto back to the original position, and then the two parts of the holder 12 are connected,

[0150] S6, as shown in Figure 16 and Figure 17 , after cleaning, the driving mechanism 3 acts to flip the clamp module 1 and the connecting member 2, and then the clamp end 11 near the cleaning station grabs the cleaned wafer, in this process, the clamp end 11 grabbing the unclean wafer does not act, the suction cup 115 is retracted and rotated by the extension arm 114 and the steering mechanism 113 to achieve storage, at the same time, the second linear driving member 33 is retracted to avoid interference problems;

[0151] S7, as shown in Figure 18 , the driving mechanism 3 acts to flip the clamp module 1 and the connecting member 2 to place the cleaned wafer on the second conveying belt 7;

[0152] S8, repeat the above steps S1-S7 to achieve continuous cleaning of the wafer;

[0153] Wherein, when the driving mechanism 3 acts to flip the clamp end 11 and the unclean wafer connected thereto, the cylinder 6 acts to tilt the first conveying belt 5 to avoid component interference;

[0154] Wherein, when the first conveying belt 5 is tilted, the second conveying belt 7 conveys the cleaned wafer, at the same time, high-temperature nitrogen is supplied into the spray pipe 14 and sprayed out by the spray head 15 to dry the cleaned wafer.

[0155] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer clamping device, characterized in that: It includes a clamp module (1), a connector (2), and a drive mechanism (3), wherein, The clamp module (1) has two clamp ends (11), which are connected by a retainer (12); The two clamp ends (11) are stacked and the two clamp ends (11) face the same side; The connector (2) is disposed on the retainer (12) and the connector (2) is used to separate or dock the retainer (12) so that the two clamp ends (11) are separated or docked. The retainer (12) includes a horizontal plate (121) and a connecting rod (122). Each of the horizontal plate (121) and the connecting rod (122) is provided with a clamp end (11). The horizontal plate (121) is connected to the movable end of the drive mechanism (3). The connecting rod (122) is provided on the horizontal plate (121), and the two ends of the connecting rod (122) correspond to the horizontal plate (121). Two connecting members (2) are provided on the horizontal plate (121). The connecting member (2) is a chuck, which clamps the connecting rod (122), or the connecting member (2) is a tensioning shaft, which is inserted into the connecting rod (122) and tensions it. The clamp end (11) includes a cylinder (111), a movable end (112), a servo motor (113), a telescopic arm (114), and a suction cup (115). The cylinder (111) is provided on both the horizontal plate (121) and the connecting rod (122). The movable end (112) is slidably engaged with the cylinder (111). Multiple servo motors (113) are provided on the movable end (112). One end of the telescopic arm (114) is connected to the spindle of the servo motor (113). The suction cup (115) is located on the other end of the telescopic arm (114). The drive mechanism (3) is connected to the clamp module (1). The drive mechanism (3) is used to drive the clamp module (1) to rotate or linearly displace, and to apply force to separate or connect the two clamp ends (11).

2. The wafer clamping device as described in claim 1, characterized in that: The drive mechanism (3) includes a first linear drive member (31), a rotary drive member (32), and a second linear drive member (33), wherein, The rotary drive (32) is mounted on the movable end of the first linear drive (31); The second linear drive (33) is mounted on the movable end of the rotary drive (32); The movable end of the second linear drive (33) is connected to the clamp module (1).

3. The wafer clamping device as described in claim 2, characterized in that: The first linear drive component (31) includes a carrier plate (311), a slide rail (312), a slider (313), a connecting rod (314), a bearing seat (315), an end plate (316), and a rodless cylinder (317), wherein, On both sides of the carrier plate (311), there are slide rails (312) and sliders (313) that are slidably engaged. Each slider (313) is provided with two connecting rods (314), and the connecting rods (314) are connected to the slider (313) through the bearing seat (315); One end plate (316) is provided at each end of the connecting rod (314); The rodless cylinder (317) is located on the other side of the carrier plate (311); One of the end plates (316) is connected to the movable end of the rodless cylinder (317), and the rotary drive (32) is disposed on the other end plate (316).

4. The wafer clamping device as described in claim 3, characterized in that: The rotary drive component (32) includes a connecting frame (321), a locking frame (322), and a motor (323), wherein, Two connecting frames (321) are provided, each connecting frame (321) is slidably connected to two connecting rods (314), and the two connecting frames (321) are engaged with each other; Two locking frames (322) are provided, each locking frame (322) is provided on two connecting rods (314), and the locking frame (322) is detachably connected to the connecting frame (321); The motor (323) is snapped between the two connecting brackets (321), and the main shaft of the motor (323) passes through the end plate (316) and is connected to the second linear drive (33).

5. The wafer clamping device as described in claim 4, characterized in that: The second linear drive component (33) includes a side plate (331), a connecting plate (332), a telescopic component (333), and a guide shaft (334), wherein, One side plate (331) is provided on each side of the connecting plate (332), and one of the side plates (331) is connected to the main shaft of the motor (323); The telescopic component (333) is disposed on the connecting plate (332), and the movable end of the telescopic component (333) is connected to the clamp module (1); One end of the guide shaft (334) is connected to the fixture module (1), and the other end is slidably engaged with the connecting plate (332).

6. A conveying system, characterized in that: The wafer clamping device, as described in any one of claims 1 to 5, further includes a support column (4), a first conveyor belt (5), a cylinder (6), a second conveyor belt (7), a hanger (8), and a pneumatic gripper (9), wherein, The support column (4) is fixed relative to the wafer clamping device; One end of the first conveyor belt (5) is rotatably connected to the support column (4), and the other end is suspended; The cylinder (6) is rotatably connected to the support column (4), and the movable end of the cylinder (6) is hinged to the first conveyor belt (5); The second conveyor belt (7) is disposed on the upper side of the first conveyor belt (5), and one end of the second conveyor belt (7) is connected to the support column (4), and the other end is connected to the hanger (8). The hanger (8) is fixed relative to the support column (4). One pneumatic gripper (9) is provided on each side of the second conveyor belt (7), and a docking rod (123) is provided on the retainer (12), and the pneumatic gripper (9) clamps the docking rod (123).

7. The conveying system as described in claim 6, characterized in that: It also includes a guide plate (10), a limiting shaft (13), a nozzle (14), and a nozzle (15), among which, One end of the guide plate (10) is connected to the first conveyor belt (5), and the other end is a free end. A guide groove (1001) is provided on the guide plate (10). The limiting shaft (13) is disposed on the second conveyor belt (7), and the limiting shaft (13) is slidably engaged with the guide groove (1001); The nozzle (14) is located at one end of the guide plate (10) away from the first conveyor belt (5); The nozzle (15) is connected and penetrates the nozzle pipe (14).

8. An application method of the conveying system as described in claim 7, characterized in that, Includes the following steps: S1. The uncleaned wafers are transported by the first conveyor belt (5). S2, the pneumatic gripper (9) clamps the docking rod (123), the retainer (12) is in a separated state, and a portion of the retainer (12) is fixed to the side of the second conveyor belt (7) with one of the clamping ends (11). S3, the other clamping end (11) moves to grab the uncleaned wafer. S4. The drive mechanism (3) operates, causing the clamp end (11) connected to it and the uncleaned wafer to flip over, placing the uncleaned wafer in the cleaning station. S5. The drive mechanism (3) operates, causing the clamp end (11) connected to it to flip and reset, and then the two parts of the retainer (12) dock together. S6. After cleaning, the drive mechanism (3) is activated, causing the clamp module (1) and the connector (2) to flip. Then, the clamp end (11) near the cleaning station grabs the cleaned wafer. S7. The drive mechanism (3) operates, causing the clamp module (1) and the connector (2) to flip, so as to place the cleaned wafer on the second conveyor belt (7); S8. Repeat steps S1 to S7 above to achieve continuous wafer cleaning. When the drive mechanism (3) is activated, causing the clamp end (11) connected to it and the uncleaned wafer to flip, the cylinder (6) is activated, causing the first conveyor belt (5) to tilt, so as to avoid interference between components. When the first conveyor belt (5) is tilted, the second conveyor belt (7) transports the cleaned wafers. At the same time, high-temperature nitrogen gas is supplied into the nozzle (14) and sprayed out by the nozzle (15) to dry the cleaned wafers.

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