Substrate, packaging structure, electronic equipment and preparation method of substrate

Abstract

The embodiment of the invention provides a substrate, a packaging structure, electronic equipment and a preparation method of the substrate, and relates to the technical field of electronic equipment. The substrate comprises a laminated structure, a conductive core, a magnetic piece and a magnetic conducting piece. The laminated structure comprises a plurality of wiring layers and a plurality of dielectric layers, and the wiring layers and the dielectric layers are alternately laminated. The conductive core is embedded in the laminated structure and penetrates through the at least one dielectric layer; at least one end of the conductive core is electrically connected to the wiring layer. The magnetic piece penetrates through at least one dielectric layer and surrounds the side face of the conductive core. The magnetic conductive piece is arranged on at least one end face of the conductive core. According to the substrate provided by the invention, the inductance value of the inductor in the substrate can be greatly improved in a limited design space.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a substrate, a packaging structure, an electronic device, and a method for preparing the substrate. Background Art

[0002] Chip packaging structures have limited design space, requiring each component to be compact. However, inductors, as essential power supply components, occupy a significant portion of the design space. To ensure chip efficiency and enhance chip competitiveness, inductors must maintain high inductance within a compact size.

[0003] Currently, the embedded magnetic process is used to make embedded magnetic inductors inside the substrate, which can effectively reduce the design space occupied by the inductor. However, the embedded magnetic slurry used in the embedded magnetic process usually has a low magnetic permeability, resulting in a low overall inductance. Summary of the Invention

[0004] The embodiments of the present application provide a substrate, a packaging structure, an electronic device, and a method for manufacturing the substrate, the purpose of which is to increase the inductance of the substrate within a limited space.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a substrate is provided, comprising a stacked structure, a conductive core, a magnetic member, and a magnetic conductive member.

[0007] The stacked structure includes multiple wiring layers and multiple dielectric layers, which are alternately stacked. A conductive core is embedded in the stacked structure and extends through at least one dielectric layer; at least one end of the conductive core is electrically connected to the wiring layer. A magnetic element extends through at least one dielectric layer and surrounds the side of the conductive core. The magnetic element is provided on at least one end surface of the conductive core.

[0008] In the substrate provided in the embodiment of the present application, by arranging a magnetic conductive part on the end face of the conductive core, the magnetic dipoles at the end of the magnetic part can be guided and concentrated in the ring of the magnetic part under the magnetic action of the magnetic conductive part, thereby preventing the magnetic dipoles from diffusing outward in large quantities from the end face of the magnetic part, thereby greatly improving the magnetic field strength around the conductive core. When current is transmitted in the conductive core, the inductor can provide a large inductance, effectively optimize the electrical performance of the substrate, and greatly improve the power density of the inductor in the substrate and even the entire packaging structure.

[0009] At the same time, in the embodiment of the present application, by arranging a magnetic conductive part on the end face of the conductive core, the space in the thickness direction of the substrate is utilized, thereby avoiding increasing the design space occupied by the inductor in the direction parallel to the substrate surface, which is conducive to the miniaturization design of the substrate and even the entire packaging structure.

[0010] In a possible implementation of the first aspect, the substrate further includes a connecting member, which is provided on an end surface of the conductive core and electrically connected to the conductive core; and the magnetic conductive member is in contact with the connecting member.

[0011] The connector is used as an electrode to achieve electrical conduction of the conductive core, for example, to achieve electrical connection between the conductive column in the conductive core and the wiring layer, or for example, the connector located at the lower end of the conductive core is used to achieve electrical connection between two adjacent conductive columns.

[0012] The connecting member is in contact with the magnetic conductive member, so that the magnetic field strength around the connecting member for current transmission is also greatly improved, further improving the inductance of the inductor.

[0013] In a possible implementation of the first aspect, the connector contacts an end surface of the conductive core, and the magnetic conductive member is provided on a side of the connector away from the conductive core.

[0014] In a possible implementation of the first aspect, the magnetic conductive member is in contact with an end surface of the conductive core, and the connecting member is provided on a side of the magnetic conductive member away from the conductive core.

[0015] The substrate further includes a first contact member, which passes through the magnetic conductive member. The conductive core is electrically connected to the connecting member through the first contact member.

[0016] In a possible implementation of the first aspect, the magnetic conductive member includes a first sub-portion and a second sub-portion that are stacked, the first sub-portion is in contact with the conductive core, and the connecting member is provided between the first sub-portion and the second sub-portion.

[0017] The substrate further includes a second contact member which passes through the first sub-portion. The conductive core is electrically connected to the connecting member through the second contact member.

[0018] That is, the relative position relationship between the aforementioned connecting part and the magnetic conductive part can be changed differently according to different needs, that is, the connecting part can be set on the surface of the magnetic conductive part (including the upper surface and the lower surface), or the connecting part can also be embedded in the magnetic conductive part. The aforementioned three schemes can all make the surrounding area of ​​the connecting part have a higher magnetic field strength under the influence of the magnetic conductive part, further improve the inductance of the inductor, and optimize the electrical performance of the substrate and even the packaging structure.

[0019] In a possible implementation of the first aspect, the connector includes a first connecting portion, provided on at least one end surface of the conductive core, the first connecting portion being electrically connected to the conductive core and the wiring layer, respectively. The magnetic conductive member is provided on the end surface of the conductive core where the first connecting portion is located. The first connecting portion is used to establish an electrical connection between the conductive core and the wiring layer.

[0020] In a possible implementation of the first aspect, the conductive core includes at least one pair of conductive pillars, with the two conductive pillars in each pair spaced apart. Each conductive pillar extends through at least one dielectric layer, and the magnetic member surrounds a side of the conductive pillar. The connector also includes a second connecting portion, which is provided on end surfaces of the two conductive pillars located on the same side. The ends of the two conductive pillars located on the same side are electrically connected via the second connecting portion.

[0021] In a possible implementation of the first aspect, the magnetic conductive member includes multiple layers of magnetron sputtered metal films and multiple layers of insulating layers, and the magnetron sputtered metal films and the insulating layers are alternately stacked.

[0022] In a possible implementation of the first aspect, the substrate further includes an intermediate layer disposed between the magnetic permeable member and the connector. This prevents the manufacturing processes of the magnetic permeable member and the connector from interfering with each other. For example, after the magnetic permeable member is formed by magnetron sputtering, forming the intermediate layer on the magnetic permeable member prevents damage to the already formed magnetic permeable member during subsequent magnetron sputtering or electroplating processes to form the connector. For example, corrosion of the magnetic permeable member by the acidic plating solution during electroplating can be prevented, thereby facilitating smooth manufacturing of the connector.

[0023] In a possible implementation manner of the first aspect, the material of the magnetic conductive member includes a mixture of magnetic powder and a polymer compound.

[0024] In a possible implementation of the first aspect, the magnetic permeability of the magnetic conductive component is greater than or equal to the magnetic permeability of the magnetic component, thereby increasing the influence of the magnetic conductive component on the magnetic field generated by the magnetic component and further increasing the inductance of the inductor.

[0025] In a second aspect, a packaging structure is provided, comprising a chip and a substrate provided by any one of the embodiments of the first aspect, wherein the chip is packaged on the substrate and electrically connected to the substrate.

[0026] In a third aspect, an electronic device is provided, comprising a circuit board and the packaging structure provided in the embodiment of the second aspect, wherein the circuit board is electrically connected to the packaging structure.

[0027] The technical effects brought about by the packaging structure in the second aspect and the electronic device in the third aspect can be referred to the technical effects brought about by the design method of the substrate in the first aspect, and will not be repeated here.

[0028] In a fourth aspect, a method for preparing a substrate is provided, the method comprising:

[0029] A stacked structure is formed; the stacked structure includes multiple wiring layers and multiple dielectric layers, with the wiring layers and dielectric layers alternately stacked. A first opening is formed through the stacked structure, and a magnetic member is formed on the inner wall of the first opening; the magnetic member is annular. A conductive material is filled within the ring of the magnetic member to form a conductive core; at least one end of the conductive core is electrically connected to the wiring layers. A magnetic conductive member is formed on at least one end surface of the conductive core.

[0030] The preparation method provided in the embodiment of the present application can prepare an inductor that occupies a small design space and has a large inductance, effectively improving the electrical performance of the substrate and the packaging structure.

[0031] In a possible implementation of the fourth aspect, the preparation method further includes: forming a connecting piece; the connecting piece is provided on an end face of the conductive core and is electrically connected to the conductive core.

[0032] Among them, the connecting member is formed before the magnetic conductive member is formed, so that the magnetic conductive member is located on the side of the connecting member away from the conductive core; or, the connecting member is formed after the magnetic conductive member is formed, so that the connecting member is located on the side of the magnetic conductive member away from the conductive core; or, the connecting member is formed after a part of the magnetic conductive member is formed, and then the other part of the magnetic conductive member is formed, so that the connecting member is embedded in the magnetic conductive member.

[0033] In a possible implementation of the fourth aspect, the magnetic conductive member includes multiple layers of magnetron sputtered metal films and multiple layers of insulating layers, which are alternately stacked and formed using a magnetron sputtering process.

[0034] The preparation method further includes: forming an intermediate layer; the intermediate layer is located between the connecting piece and the magnetic conductive piece.

[0035] The technical effects brought about by the preparation method in the fourth aspect can be referred to the technical effects brought about by the design method of the substrate in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0037] Figure 2 A cross-sectional view of an electronic device provided in an embodiment of the present application;

[0038] Figure 3 A cross-sectional view of the packaging structure provided in an embodiment of the present application;

[0039] Figure 4 for Figure 3 The cross-sectional view corresponding to the dotted box A in FIG;

[0040] Figure 5 A three-dimensional diagram of an inductor provided in an embodiment of the present application;

[0041] Figure 6 for Figure 5 A cross-sectional view of the substrate corresponding to the inductor;

[0042] Figure 7 Another perspective view of the inductor provided in an embodiment of the present application;

[0043] Figure 8 for Figure 7 The top view of the inductor in FIG.

[0044] Figure 9 for Figure 7 A cross-sectional view of the substrate corresponding to the inductor;

[0045] Figure 10 Another perspective view of the inductor provided in an embodiment of the present application;

[0046] Figure 11 for Figure 10 The top view of the inductor in FIG;

[0047] Figure 12 for Figure 10 A cross-sectional view of the substrate corresponding to the inductor;

[0048] Figure 13 Another perspective view of the inductor provided in an embodiment of the present application;

[0049] Figure 14 for Figure 13 The top view of the inductor in FIG.

[0050] Figure 15 A structural stereogram of the connecting member and the magnetic conductive member provided in an embodiment of the present application;

[0051] Figure 16 For the Figure 15 A cross-sectional view taken along section line BB';

[0052] Figure 17 For the Figure 15 A cross-sectional view taken along the section line CC';

[0053] Figure 18 For the Figure 15 A cross-sectional view of the section line D-D';

[0054] Figure 19 For the Figure 15 Another cross-sectional view of the section line D-D';

[0055] Figure 20 for Figure 19 The physical diagram corresponding to the structure in ;

[0056] Figure 21 A flow chart of the preparation of a substrate provided in an embodiment of the present application;

[0057] Figures 22 to 29 These are cross-sectional views corresponding to various preparation steps of the substrate provided in the embodiments of the present application. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0059] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0060] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "exemplarily," or "some examples" are intended to indicate that specific features, structures, materials, or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0061] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0062] Connection / connected: can refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which can mean that there is a fastening component (such as a screw, bolt, rivet, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate, wherein A and B can be fixedly connected, detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium.

[0063] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection", which is understood as the direct or indirect physical contact and electrical conduction between components, such as the connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gap between two conductive parts.

[0064] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0065] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0066] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0067] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0068] In addition, the scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. A person of ordinary skill in the art will know that with the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0069] The embodiments of the present application provide an electronic device, which may be, for example, a mobile phone, a tablet computer, a personal digital assistant (PDA), a television, a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a rechargeable small household appliance (e.g., a soymilk maker, a robot vacuum), an unmanned aerial vehicle (UAV), a radar, an aerospace equipment, an on-board device, a vehicle, or other different types of user devices or terminal devices; the electronic device may also be a network device such as a base station. The embodiments of the present application do not impose any special restrictions on the specific form of the electronic device.

[0070] Figure 1 A schematic structural diagram of an electronic device 1000 exemplarily provided in an embodiment of the present application. Figure 2 A cross-sectional view of an electronic device 1000 provided in an embodiment of the present application.

[0071] like Figure 1 and Figure 2 As shown, the electronic device 1000 may include a circuit board 200 .

[0072] Exemplarily, the circuit board 200 may be a printed circuit board (PCB), a flexible circuit board, or a rigid-flex circuit board.

[0073] For example, Figure 1 As shown, the electronic device 1000 may further include an integrated circuit 100 , and the integrated circuit 100 may be disposed on a circuit board 200 .

[0074] For example, Figure 1 As shown, the integrated circuit 100 may include a logic circuit 101 , an analog circuit 102 , a storage circuit 103 , an input / output circuit 104 , and the like.

[0075] It should be understood that the integrated circuit 100 includes but is not limited to a logic circuit 101, an analog circuit 102, a storage circuit 103 and an input / output circuit 104. For example, in addition to the aforementioned four circuits, the integrated circuit 100 may also include circuits of other types or functions, or discrete devices.

[0076] Furthermore, the integrated circuit 100 may include one or more of a logic circuit 101 , an analog circuit 102 , a memory circuit 103 , and an input-output circuit 104 .

[0077] Based on this, the number of logic circuits 101, analog circuits 102, memory circuits 103, and input / output circuits 104 included in the integrated circuit 100 can be set as needed. The integrated circuit 100 may include one or more logic circuits 101. The integrated circuit 100 may also include one or more analog circuits 102. The integrated circuit 100 may also include one or more memory circuits 103. The integrated circuit 100 may also include one or more input / output circuits 104.

[0078] like Figure 1 and Figure 2 As shown, the electronic device 1000 may further include a packaging structure 300 , which is electrically connected to the circuit board 200 .

[0079] For example, see Figure 1 The packaging structure 300 can be integrated into the aforementioned integrated circuit 100. For example, the packaging structure 300 can be integrated into the logic circuit 101 and the storage circuit 103 at the same time, or can also be integrated into one or more other circuits. The embodiment of the present application does not limit the integration position of the packaging structure 300.

[0080] Or, for example, see Figure 2 , the packaging structure 300 can also be directly set on the circuit board 200.

[0081] It is understandable that Figure 1 and Figure 2 The structure of the electronic device 1000 shown in FIG. 1 does not constitute a specific limitation on the electronic device 1000. The electronic device 1000 may include, for example, Figure 1 and Figure 2 More or fewer components may be shown, or combinations thereof may be used. Figure 1 and Figure 2Some of the components shown may be combined with Figure 1 and Figure 2 The components shown are arranged differently. For example, see Figure 2 The electronic device 1000 may further include a power module 201 (Power Module) disposed on the circuit board 200 .

[0082] The embodiment of the present application also provides a packaging structure 300 . Figure 3 A cross-sectional view of the packaging structure 300 provided in an embodiment of the present application.

[0083] like Figure 2 and Figure 3 As shown, the package structure 300 may include a substrate 400 and a chip 500 . The chip 500 is packaged on the substrate 400 .

[0084] The substrate 400 can provide support for the packaging of electrical devices such as the chip 500, and can realize electrical connection of various electrical devices arranged on the substrate 400 through multiple traces in the substrate 400 (see Figure 3 ), or some electrical components provided on the substrate 400 are transferred out, for example, to the circuit board 200 (see Figure 3 ).

[0085] For example, chip 500 may be a logic chip that implements functions such as "AND," "OR," and "NOT." Alternatively, chip 500 may be a memory chip that implements data storage. The embodiments of the present application do not limit the specific type of chip 500. For example, chip 500 may also be a power integrated circuit (PIC) or other type of integrated circuit, or may also be a circuit module.

[0086] For example, see Figure 2 The packaging structure 300 may further include an adapter plate 301 , solder balls 302 or other electrical devices with specific functions.

[0087] Or, for example, see Figure 3 The packaging structure 300 may also include electrical devices such as a DC-DC converter (DC / DC), a voltage regulator module (VRM), and an integrated voltage regulator (IVR). These electrical devices may be disposed on the substrate 400 and electrically connected to the substrate 400.

[0088] It is understood that the package structure 300 may include Figure 2 or Figure 3There may be more or fewer structures shown in the figure, and the embodiments of the present application do not limit this.

[0089] See Figure 2 and Figure 3 The aforementioned chip 500 can be directly soldered on the substrate 400 through the solder balls 302 , or the aforementioned chip 500 can also be connected to the substrate 400 through the adapter board 301 .

[0090] By way of example, the package structure 300 may include one or more substrates 400 , and a chip 500 may be disposed on each substrate 400 .

[0091] For example, the package structure 300 also includes an inductor, which is typically disposed on the surface of the substrate 400. In this case, the inductor needs to be connected to the substrate 400 by routing wires on the outside of the substrate 400, and then connected to the pins of the chip 500 through the wiring and pads on the substrate 400. During this connection process, the wiring is long, resulting in large eddy current losses in the circuit and occupying a large design space. Therefore, buried magnetic inductors, which occupy a smaller design space, are more popular.

[0092] In some embodiments, the magnetic slurry within the inductor embedded within the stacked structure 10 (i.e., an embedded magnetic inductor) has a low magnetic permeability, resulting in a low inductance. To increase the inductance, the size of the entire inductor can be increased, while the magnetic permeability of the magnetic slurry within the inductor can be increased. However, a larger inductor occupies a larger design space, and increasing the size has limited effect on improving the inductance. While increasing the magnetic permeability of the magnetic slurry can effectively increase the inductance, it also results in greater magnetic losses, which can affect the electrical performance of the entire package structure 300, such as the power supply efficiency.

[0093] In order to solve the above technical problems, the embodiment of the present application further provides a substrate 400.

[0094] Figure 4 for Figure 3 The dotted box A in the figure corresponds to the enlarged view of the structure.

[0095] like Figure 3 and Figure 4 As shown, the substrate 400 includes a stacked structure 10 , a conductive core 20 , a magnetic member 30 and a magnetic conductive member 40 .

[0096] Among them, see Figure 3 The stacked structure 10 includes multiple wiring layers 11 and multiple dielectric layers 12 , and the wiring layers 11 and dielectric layers 12 are alternately stacked.

[0097] The dielectric layer 12 has electrical insulation properties and can be disposed around the wiring layer 11 to prevent the wiring layer 11 from having unexpected electrical connections.

[0098] The wiring layer 11 is conductive and can be used as a wiring to realize electrical connection between different structures. Figure 3 Different wiring layers 11 can be electrically connected via conductive plugs penetrating the dielectric layer 12 .

[0099] For example, see Figure 3 , at least one surface of the substrate 400 (such as Figure 3 The upper surface and the lower surface of the substrate 400 may be provided with a plurality of pads, and the substrate 400 is electrically connected to an external device (such as the chip 500) through the pads.

[0100] For example, the plurality of pads may be formed by the outermost wiring layer 11 in the stacked structure 10 .

[0101] See Figure 3 and Figure 4 In the substrate 400 , the conductive core 20 , the magnetic component 30 and the magnetic conductive component 40 are used to form an inductor L.

[0102] See Figure 3 The inductor L can be transferred to the surface of the substrate 400 through the wiring layer 11, so that the inductor L can be electrically connected to other electrical devices through the pads on the surface of the substrate 400.

[0103] Exemplarily, the inductor L has an input terminal and an output terminal (eg Figure 3 and Figure 4 The input and output ends are respectively connected to different pads on the surface of the substrate through the wiring layer to realize the input and output of the electrical signal in the inductor L.

[0104] For example, the input and output terminals can be connected to the same side surface of the substrate 400 (eg Figure 3 and Figure 4 ), or respectively transferred to the two side surfaces of the substrate 400 (as shown in the following Figure 6 shown).

[0105] See Figure 3 and Figure 4 The conductive core 20 is embedded in the stacked structure 10 and penetrates at least one dielectric layer 12 .

[0106] The conductive core 20 is a conductive structure in the inductor L for transmitting current.

[0107] For example, the conductive core 20 may only penetrate a portion of the stacked structure 10 (i.e., penetrate at least one layer of the multi-layer dielectric layer 12). For example, the upper end surface and the lower end surface of the conductive core 20 are both embedded in the stacked structure 10 (e.g., Figure 3As shown), or for example, one of the upper end surface and the lower end surface of the conductive core 20 is embedded in the stacked structure 10, and the other is substantially flush with the surface of the stacked structure 10. Alternatively, the conductive core 20 may completely penetrate the stacked structure 10, for example, the upper end surface of the conductive core 20 is substantially flush with the upper surface of the stacked structure 10, and the lower end surface of the conductive core 20 is substantially flush with the lower surface of the stacked structure 10 (see subsequent Figure 9 ).

[0108] See Figure 3 and Figure 4 , at least one end of the conductive core 20 is electrically connected to the wiring layer 11. For example, see Figure 3 The upper end of the conductive core 20 is electrically connected to the wiring layer 11, wherein the upper left end and the upper right end are electrically connected to the wiring layer 11 as the input end and the output end of the inductor L, respectively. Or for example, refer to the subsequent Figure 6 The upper end and the lower end of the conductive core 20 are electrically connected to the wiring layer 11 as the input end and the output end of the inductor L respectively.

[0109] See Figure 3 and Figure 4 The magnetic component 30 passes through at least one dielectric layer 12 and surrounds the side of the conductive core 20, so that the conductive core 20 transmitting current can be placed in a magnetic field environment, so that the substrate 400 has an inductor function.

[0110] Exemplarily, the material of the magnetic component 30 may include a mixture of magnetic powder and polymer material. The magnetic powder may include a metal material or a ferrite material, such as one or more of carbonyl iron, FeSi, FeSiCr, FeNi, FeNiMo, Fe-based amorphous or Fe-based nanocrystalline powder, manganese-zinc ferrite, nickel-zinc ferrite, and manganese ferrite. The polymer material may include thermoplastic resins and thermosetting resins. Thermoplastic resins include polyethylene, polypropylene, polyamide, polyurethane, etc., while thermosetting resins include polyester resins, epoxy resins, phenolic resins, silicone resins, etc.

[0111] For example, the magnetic powder may be spherical powder, flaky powder, or rod-shaped powder.

[0112] For example, the proportion of polymer materials in the material of the magnetic component 30 is approximately greater than or equal to 10%, so as to ensure that the magnetic component 30 has both good magnetic conductivity and strong structural stability.

[0113] Exemplarily, the magnetic permeability of the magnetic member 30 may be 5 to 10, for example, 5, 6.8, 8.95 or 10.

[0114] Exemplarily, the material of the magnetic member 30 may further include a curing agent, such as imidazole, acid anhydride, amine, etc., so as to achieve curing of the magnetic member 30 .

[0115] Exemplarily, the shape of the magnetic part 30 can be a circular ring, a square ring, a runway shape, etc., so that it can be wrapped around the side of the conductive core 20. It can be understood that other shapes of the magnetic part 30 that can wrap around the conductive core 20 are also within the protection scope of the embodiment of the present application. The embodiment of the present application does not limit the shape of the magnetic part 30.

[0116] See Figure 3 and Figure 4 The magnetic conductive member 40 is provided on at least one end surface of the conductive core 20 .

[0117] It should be noted that the "end surface of the conductive core 20" herein refers to the surface of the conductive core 20 parallel to the dielectric layer 12 and the wiring layer 11, for example, Figure 3 Taking the orientation in FIG. 1 as an example, the end surfaces of the conductive core 20 may refer to the upper surface and the lower surface of the conductive core 20 .

[0118] For example, see Figure 3 and Figure 4 The magnetic conductive member 40 can be provided on the upper end surface and the lower end surface of the conductive core 20. Or for example, refer to the following figure Figure 6 , the magnetic conductive member 40 can be only provided on the lower end surface of the conductive core 20 .

[0119] In the substrate 400 provided in the embodiment of the present application, by arranging the magnetic conductive part 40 on the end face of the conductive core 20, the magnetic dipoles at the end of the magnetic part 30 can be guided and concentrated in the ring of the magnetic part 30 under the magnetic action of the magnetic conductive part 40, thereby preventing the magnetic dipoles from diffusing outward in large quantities from the end face of the magnetic part 30, thereby greatly improving the magnetic field strength around the conductive core 20. When the current is transmitted in the conductive core 20, the inductor L can provide a larger inductance, effectively optimize the electrical performance of the substrate 400, and greatly improve the power density of the inductor in the substrate 400 and even the entire packaging structure 300.

[0120] At the same time, in the embodiment of the present application, by arranging the magnetic conductive part 40 on the end face of the conductive core 20, the space in the thickness direction of the substrate 400 is utilized, thereby avoiding increasing the design space occupied by the inductor L in the direction parallel to the surface of the substrate 400, which is conducive to realizing the miniaturization design of the substrate 400 and even the entire packaging structure 300.

[0121] Furthermore, in the substrate 400 provided in the embodiment of the present application, there is no need to significantly increase the magnetic permeability of the magnetic component 30 , and thus the magnetic loss and inductance loss can be reduced, thereby effectively improving the power efficiency.

[0122] Figure 5 、 Figure 7 、 Figure 10 and Figure 13These are some structural stereoscopic views of the inductor L in the substrate 400 provided in the embodiments of the present application.

[0123] Figure 6 for Figure 5 The corresponding cross-sectional view of the inductor L in the substrate 400, Figure 8 for Figure 7 The top view of the inductor L in the corresponding substrate 400, Figure 9 for Figure 7 The corresponding cross-sectional view of the inductor L in the substrate 400, Figure 11 for Figure 10 The top view of the inductor L in the corresponding substrate 400, Figure 12 for Figure 10 The corresponding cross-sectional view of the inductor L in the substrate 400, Figure 14 for Figure 13 A top view of the inductor L in the corresponding substrate 400 .

[0124] See Figures 3 to 14 The conductive core 20 may include at least one conductive column 20', wherein each conductive column 20' passes through at least a portion of the stacked structure 10, and the magnetic member 30 surrounds the side of the conductive column 20', and the magnetic conductive member 40 is arranged on at least one end face of at least one conductive column 20'.

[0125] For example, see Figure 3 and Figure 4 , the conductive pillar 20' can be a solid conductive structure, or illustratively, see Figure 6 The conductive pillar 20 ′ may include a supporting pillar 21 and a conductive layer 22 surrounding a side of the supporting pillar 21 .

[0126] Exemplarily, the material of the conductive pillar 20 ′ (or the conductive layer 22 ) may include a metal material, such as copper, silver, a metal alloy, or a mixture of metal and other materials.

[0127] For example, the support column 21 may be made of an insulating material such as resin that has a certain supporting force.

[0128] By configuring the conductive core 20 to include at least one conductive column 20', the inductor L can have different structures, for example, the inductor L can be a single-phase inductor, or the inductor L can be a dual-phase inductor. The following embodiments will illustrate some structures of the inductor L.

[0129] In some embodiments, as Figure 5 and Figure 6As shown, in each inductor L, the conductive core 20 may include only one conductive column 20 ′, the upper end and the lower end of the conductive column 20 ′ may serve as the input end and the output end of the inductor L respectively, and be transferred to the surface of the substrate 400 via the wiring layer 11 .

[0130] For example, see Figure 6 The upper end surface of the conductive pillar 20 ′ is connected to the upper surface of the substrate 400 , and the lower end surface of the conductive pillar 20 ′ is connected to the lower surface of the substrate 400 .

[0131] In some embodiments, as Figures 7 to 14 In each inductor L, the conductive core 20 may include at least one pair of conductive pillars 20 ′.

[0132] It can be understood that the aforementioned “a pair of conductive pillars 20 ′” refers to two conductive pillars 20 ′ that are connected.

[0133] See Figures 7 to 14 In each pair of conductive pillars 20 ′, the two conductive pillars 20 ′ are spaced apart from each other, and the end surfaces of the two conductive pillars 20 ′ located on the same side are electrically connected.

[0134] In one embodiment, Figures 7 to 12 As shown, in each inductor L, the conductive core 20 may include two conductive pillars 20 ′, thereby forming a U-shaped inductor.

[0135] See Figure 9 and Figure 12 As shown, the two ends of the two conductive pillars 20' on the same side are electrically connected. For example, the lower ends of the two conductive pillars 20' are electrically connected. In this embodiment, the two upper ends of the two conductive pillars 20' serve as the input and output ends of the inductor L, respectively, and are transferred to the upper surface of the substrate 400 via the wiring layer 11.

[0136] For example, Figure 7 、 Figure 8 and Figure 9 As shown, the magnetic part 30 may include two components, each component corresponding to the side of a conductive column 20'. In this embodiment, the two components are spaced apart. During the preparation process, two corresponding spaced-apart openings can be opened on the stacked structure 10 so that the two components formed inside the openings can be spaced apart.

[0137] For example, Figure 10 、 Figure 11 and Figure 12 As shown, the two components of the magnetic member 30 are integrally arranged. During the preparation process, a corresponding racetrack-shaped opening can be opened on the stacked structure 10 so as to form an integrally arranged magnetic member 30 inside the opening.

[0138] In another embodiment, Figure 13 and Figure 14 As shown, in each inductor L, the conductive core 20 may include four conductive pillars 20 ′.

[0139] Among them, see Figure 13 and Figure 14 The magnetic member 30 surrounds the sides of the four conductive pillars 20 ′.

[0140] It is understandable that Figures 5 to 12 Shown is a single-phase inductor, Figure 13 and Figure 14 The inductor shown is a dual-phase inductor. Figures 5 to 14 The structure and type of the inductor L are exemplarily described as an example, but are not intended to be limiting. For example, a multi-phase inductor may be formed according to the application scenario, or an inductor of other shapes such as a polygon may be formed.

[0141] In some embodiments, as Figure 7 、 Figure 10 and Figure 13 As shown, the substrate 400 may include more than one inductor L. The embodiment of the present application does not limit the number of the inductors L in the substrate 400.

[0142] In some embodiments, as Figure 6 、 Figure 9 and Figure 12 As shown, the substrate 400 further includes a connecting member 50 , which is disposed on an end surface of the conductive core 20 and is electrically connected to the conductive core 20 .

[0143] The connector 50 is used as an electrode to achieve electrical conduction of the conductive core 20, for example, see Figure 6 , realize the electrical connection between the conductive pillar 20' in the conductive core 20 and the wiring layer 11, or for example, refer to Figure 9 The connector 50 located at the lower end of the conductive core 20 is used to achieve electrical connection between two adjacent conductive pillars 20 ′.

[0144] For example, see Figure 4 , the connecting member 50 can be integrally provided with the wiring layer 11 .

[0145] For example, see Figure 4 The connecting member 50 can be provided on the same layer as a wiring layer 11 .

[0146] For example, see Figure 6 , some of the connectors 50 may be connected to the surface of the substrate 400 via the wiring layer 11, or, see Figure 9When the conductive core 20 completely penetrates the substrate 400 , some connectors 50 can also be directly set as pads on the surface of the substrate 400 to achieve direct electrical connection between the inductor L and external devices such as the chip 500 .

[0147] For example, the connector 50 may be prepared by using processes such as magnetron sputtering or electroplating.

[0148] For example, the material of the first connecting member 50 may include conductive metals such as plated copper.

[0149] In some embodiments, as Figure 4 、 Figure 6 、 Figure 9 and Figure 12 As shown, the connector 50 includes a first connecting portion 51 , which is electrically connected to the conductive core 20 and the wiring layer 11 , respectively. That is, the first connecting portion 51 is used to achieve electrical connection between the conductive core 20 and the wiring layer 11 .

[0150] See Figure 4 、 Figure 6 、 Figure 9 and Figure 12 At least one end surface of the conductive core 20 is provided with a first connecting portion 51 .

[0151] For example, see Figure 6 The upper and lower end surfaces of the conductive core 20 are both provided with a first connecting portion 51 so as to serve as the input and output ends of the inductor L to realize the transmission of current in the conductive core 20.

[0152] Or, for example, see Figure 9 and Figure 12 In the case where the conductive core 20 includes multiple conductive pillars 20', two first connecting portions 51 are provided on the upper end surface of a pair of conductive pillars 20'. In the pair of conductive pillars 20', the upper end surface of each conductive pillar 20' is provided with a first connecting portion 51. The two first connecting portions 51 corresponding to the two conductive pillars 20' are insulated from each other. One of the two first connecting portions 51 is used as the input end of the inductor L, and the other first connecting portion 51 serves as the output end of the inductor L.

[0153] In some embodiments, as Figure 4 、 Figure 9 and Figure 12 As shown, in the case where the conductive core 20 includes a plurality of conductive pillars 20 ′, the connector 50 may further include a second connecting portion 52 , and the second connecting portion 52 is used to achieve electrical connection between a pair of conductive pillars 20 ′.

[0154] For example, see Figure 4 、 Figure 9 and Figure 12 The second connecting portion 52 is provided on the end surfaces of the two conductive pillars 20 ′ located on the same side, and the ends of the two conductive pillars 20 ′ located on the same side are electrically connected through the second connecting portion 52 .

[0155] In some embodiments, see Figure 4 、 Figure 6 、 Figure 9 and Figure 12 The aforementioned connecting member 50 is in contact with the magnetic conductive member 40, so that the magnetic field strength around the connecting member 50 for current transmission is also greatly improved, further improving the inductance of the inductor L.

[0156] For example, see Figure 4 The magnetic conductive member 40 can be arranged on the end surface of the conductive core 20 where the first connecting portion 51 is located, or, see Figures 4 to 10 The magnetic conductive member 40 can also be provided on the end face where the second connection portion 52 of the conductive core 20 is located. It is understood that providing the magnetic conductive member 40 on both the end face where the first connection portion 51 and the end face where the second connection portion 52 of the conductive core 20 are located can further increase the inductance of the inductor L.

[0157] The relative positional relationship between the aforementioned connecting member 50 and the magnetic conductive member 40 can be changed according to different needs. The following embodiments will illustrate the relative positional relationship between the two.

[0158] In some embodiments, see Figure 6 , connector 50( Figure 6 The first connecting portion 51) in the connector contacts the end surface of the conductive core 20, and the magnetic conductive member 40 is arranged on the side of the connecting member 50 away from the conductive core 20.

[0159] That is, the magnetic conductive member 40 covers the connecting member 50. For example, see Figure 6 The first connecting portion 51 is formed directly on the end surface of the conductive core 20. For example, the end surface of the conductive core 20 is copper-plated using a magnetron sputtering process to form the first connecting portion 51, so as to achieve electrical connection between the conductive core 20 and the wiring layer 11. Alternatively, for example, the second connecting portion 52 can be formed directly on the end surface of the conductive core 20 to achieve interconnection between the two end surfaces of two adjacent conductive cores 20 located on the same side.

[0160] In some embodiments, see Figure 4 , the magnetic conductive member 40 contacts the end surface of the conductive core 20, and the connecting member 50 (eg Figure 4 The first connecting portion 51 is provided on a side of the magnetic conductive member 40 away from the conductive core 20.

[0161] See Figure 4In this case, the substrate 400 further includes a first contact member 61 , which passes through the magnetic conductive member 40 , and the conductive core 20 and the connecting member 50 are electrically connected via the first contact member 61 .

[0162] In some embodiments, see Figure 4 、 Figure 6 、 Figure 9 and Figure 12 The magnetic conductive member 40 includes a first sub-portion 41 and a second sub-portion 42 that are stacked. The first sub-portion 41 contacts the conductive core 20, and the connecting member 50 (such as the second connecting portion 52 in the figure) is provided between the first sub-portion 41 and the second sub-portion 42. That is, the magnetic conductive member 40 is provided around the connecting member 50.

[0163] See Figure 4 、 Figure 6 、 Figure 9 and Figure 12 In this case, the substrate 400 further includes a second contact member 62 , which passes through the first sub-portion 41 , and the conductive core 20 is electrically connected to the connecting member 50 via the second contact member 62 .

[0164] To sum up, the connector 50 can be arranged on the surface of the magnetic conductive part 40 (including the upper surface and the lower surface), or the connector 50 can also be embedded in the magnetic conductive part 40. The above three schemes can all make the magnetic field strength around the connector 50 higher under the influence of the magnetic conductive part 40, further improve the inductance of the inductor L, and optimize the electrical performance of the substrate 400 and even the packaging structure 300.

[0165] Figure 15 A three-dimensional diagram of the connecting member 50 and the magnetic conductive member 40 provided in an embodiment of the present application. Figure 16 For the Figure 15 The cross-sectional view of the section line BB' in Figure 17 For the Figure 15 A cross-sectional view of the section line C-C' in FIG. Figure 18 and Figure 19 For the Figure 15 Some cross-sectional views along the section line D-D' in Figure 20 for Figure 19 The corresponding enlarged view of the actual object.

[0166] like Figures 15 to 20 As shown, the connecting member 50 can be embedded in the magnetic conductive member 40 to further increase the inductance of the inductor L.

[0167] For example, Figure 15 Can be Figure 7 ,or Figure 10 ,or Figure 13The structural perspective view of the magnetic conductive member 40 and the second connecting portion 52 corresponding to the inductor L in FIG. 4 , that is, the embodiment in which the conductive core 20 includes two conductive pillars 20 'or the embodiment in which the conductive core 20 includes four conductive pillars 20 'can be arranged as follows Figure 15 The magnetic conductive member 40 and the second connecting portion 52 are shown.

[0168] For example, see Figure 15 The magnetic conductive member 40 may include a plurality of components arranged at intervals, each of which may be arranged on the end face of a conductive column 20', thereby finely regulating the magnetic field environment of each conductive column 20' and further optimizing the electrical performance of the substrate 400.

[0169] Or, for example, see Figure 18 The same second connecting portion 52 can correspond to a complete, integrally arranged magnetic conductive member 40 (different from Figure 15 ), so as to reduce the difficulty of preparing the magnetic conductive member 40.

[0170] Or, for example, see Figure 17 The magnetic conductive parts 40 corresponding to the two adjacent second connecting parts 52 can also be provided as a whole (different from Figure 15 ), thus forming Figure 13 The structure shown.

[0171] For example, in other embodiments, the magnetic conductive members 40 corresponding to the plurality of first connection portions 51 may also be arranged at intervals or integrally.

[0172] In some embodiments, the magnetic conductive member 40 includes multiple layers of magnetron sputtered metal films and multiple layers of insulating layers, and the magnetron sputtered metal films and the insulating layers are alternately stacked.

[0173] Exemplarily, both the magnetron sputtered metal film and the insulating layer can be prepared by magnetron sputtering, which is beneficial for forming a negatively coupled inductor and improving saturation characteristics.

[0174] For example, in this embodiment, the magnetic permeability of the magnetic conductive member can reach 100 to 2000, which has a good electromagnetic conversion effect.

[0175] Exemplarily, the material of the magnetron sputtering metal film may include alloys such as CoZrTa, CZTB, FeZrBCu, FeCoB, FeNi, and FeCo, or a nanoparticle film including an alloy, which has better saturation performance than an alloy film, high resistivity, and low high-frequency loss.

[0176] Exemplarily, the material of the insulating layer may include at least one of SiO 2 , SiN, and Al 2 O 3 .

[0177] Exemplarily, the thickness of the insulating layer may be about 10 nm.

[0178] By configuring the magnetic conductive member 40 to include multiple layers of magnetron sputtered metal films and multiple layers of insulating layers, the magnetic conductive member 40 can be prepared using a magnetron sputtering process, thereby obtaining a magnetic conductive member 40 with higher magnetic permeability, effectively improving the inductance of the inductor L.

[0179] For example, in this embodiment, see Figure 16 、 Figure 17 and Figure 18 The substrate 400 further includes an intermediate layer 80, which is disposed between the magnetic conductive member 40 and the connecting member 50. For example, the intermediate layer 80 can wrap the connecting member 50 so that the magnetic conductive member 40 is disposed around the connecting member 50.

[0180] By setting the intermediate layer 80, the preparation processes of the magnetic conductive part 40 and the connecting part 50 can be prevented from affecting each other. For example, after the magnetic conductive part 40 is formed by the magnetron sputtering process, by forming the intermediate layer 80 on the magnetic conductive part 40, damage to the already formed magnetic conductive part 40 can be avoided during the subsequent formation of the connecting part 50 by the magnetron sputtering process or the electroplating process. For example, the acidic plating solution during the electroplating process can be prevented from corroding the magnetic conductive part 40, which is conducive to the smooth preparation of the connecting part 50.

[0181] Exemplarily, the thickness of the intermediate layer 80 may be in the micron level, so that the intermediate layer 80 may also serve as a dielectric layer to prevent unexpected electrical connection between the magnetic conductive member 40 and the connecting member 50 .

[0182] For example, the material of the intermediate layer 80 may include polyimide (PI for short) or the like.

[0183] In some embodiments, see Figure 19 and Figure 20 The material of the magnetic conductive member 40 includes a mixture of magnetic powder and polymer compound. Figure 19 and Figure 20 The magnetic conductive member 40 formed by the magnetic powder and the polymer compound can be directly arranged around the connecting member 50.

[0184] Illustratively, the material composition of the magnetic conductive component 40 may be substantially the same as that of the magnetic component 30 . For the specific material composition, please refer to the description of the magnetic component 30 , which will not be repeated here.

[0185] For example, in this embodiment, the magnetic permeability of the magnetic conductive member 40 may be 10-50.

[0186] For example, in this embodiment, the polymer material (eg, resin) accounts for approximately 2% to 5% of the composition, the resin content is relatively small, and the magnetic conductive component 40 has a relatively high magnetic permeability.

[0187] In some embodiments, the magnetic permeability of the magnetic conductive member 40 is greater than or equal to the magnetic permeability of the magnetic member 30 , thereby increasing the influence of the magnetic conductive member 40 on the magnetic field generated by the magnetic member 30 and further increasing the inductance of the inductor L.

[0188] The embodiment of the present application also provides a method for preparing the substrate 400 .

[0189] Figure 21 This is a flow chart of the preparation of the substrate 400 provided in an embodiment of the present application. Figures 22 to 29 These are cross-sectional views corresponding to various preparation steps of the substrate 400 provided in an embodiment of the present application.

[0190] like Figure 21 As shown, the method for preparing the substrate 400 includes steps S1 to S4:

[0191] S1: See Figure 22 , forming a stacked structure 10.

[0192] See Figure 22 The stacked structure 10 includes multiple wiring layers 11 and multiple dielectric layers 12 , and the wiring layers 11 and the dielectric layers 12 are alternately stacked.

[0193] S2: See Figure 23 and Figure 24 , forming a first opening K1 penetrating the stacked structure 10 , and forming a magnetic member 30 on the inner wall of the first opening K1 .

[0194] See Figure 24 , the magnetic member 30 is annular.

[0195] Exemplarily, step S2 may include:

[0196] S21: See Figure 23 , forming a first opening K1 that penetrates the stacked structure 10 .

[0197] S22: See Figure 24 , magnetic material is filled in the first opening K1.

[0198] S23: See Figure 25 , forming a second opening K2 penetrating the magnetic material. Exemplarily, the second opening K2 and the first opening K1 may have substantially overlapping axes.

[0199] S3: See Figure 26 , a conductive material is filled in the ring of the magnetic member 30 to form a conductive core 20 .

[0200] For example, the conductive core 20 can be made of conductive material as a whole, or Figure 26The conductive core 20 may include a support column 21 and a conductive layer 22 surrounding a side of the support column 21 .

[0201] For example, the conductive core 20 can be formed by copper plating, copper paste filling, or silver paste filling. Copper plating refers to forming a copper layer on the inner wall of the first and second openings K2 using a process such as PVD, chemical plating, or electroplating. Then, a resin paste, silver paste, or copper paste is inserted into the copper layer to form a stable structure with no internal voids. Alternatively, for example, the second opening K2 can be directly filled with silver paste or copper paste to form a structurally stable conductive core 20.

[0202] See Figure 27 At least one end of the conductive core 20 is electrically connected to the wiring layer 11 .

[0203] Exemplarily, in order to achieve electrical connection between the conductive core 20 and the wiring layer 11, the preparation method further includes:

[0204] S5: See Figure 27 , forming a connecting member 50.

[0205] See Figure 27 The connector 50 may cover the end surface of the conductive core 20 and be electrically connected to the conductive core 20. For example, see Figure 27 The first connecting portion 51 of the connecting member 50 covers the upper end surface of the conductive core 20 , and the second connecting portion 52 of the connecting member 50 covers the lower end surface of the conductive core 20 .

[0206] Illustratively, the connecting member 50 may be formed by a magnetron sputtering process.

[0207] For example, after step S5, the following steps may be performed: performing pattern design, for example, referring to Figure 27 , disconnect the connectors 50 corresponding to the upper end surfaces of a pair of conductive pillars 20 ′ so that the upper ends of the two conductive pillars 20 ′ serve as the input end and the output end respectively.

[0208] S4: See Figure 28 A magnetic conductive member 40 is formed on at least one end surface of the conductive core 20 .

[0209] For example, step S5 may be performed before step S4, that is, the connecting member 50 is formed before the magnetic conductive member 40 is formed, so that the magnetic conductive member 40 is located on the side of the connecting member 50 away from the conductive core 20 (see FIG. Figure 28 ).

[0210] Alternatively, in other embodiments, step S5 may be performed after step S4 , that is, the connecting member 50 is formed after the magnetic conductive member 40 is formed, so that the connecting member 50 is located on a side of the magnetic conductive member 40 away from the conductive core 20 .

[0211] Or in other embodiments, step S5 can be performed in an interlaced manner with step S4. For example, after forming a part of the magnetic conductive part 40 (for example, the first sub-part 41 in the previous embodiment), the connecting part 50 is formed, and then another part of the magnetic conductive part 40 (for example, the second sub-part 42 in the previous embodiment) is formed, so that the connecting part 50 is embedded in the magnetic conductive part 40.

[0212] In some embodiments, when the magnetic conductive member 40 includes multiple layers of magnetron sputtered metal films and multiple layers of insulating layers, and the magnetron sputtered metal films and the insulating layers are alternately stacked, the preparation method may further include:

[0213] S6: See Figure 29 , forming an intermediate layer 80.

[0214] See Figure 29 The intermediate layer 80 is located between the connecting member 50 and the magnetic conductive member 40 .

[0215] Step S6 is located between step S4 and step S5 so as to dispose the intermediate layer 80 between the connecting member 50 and the magnetic conductive member 40 .

[0216] Some examples are provided below to illustrate the above preparation method.

[0217] Example 1:

[0218] 1. Provide a stacked structure 10 and open four first openings K1 on the stacked structure 10.

[0219] The diameter of the first opening K1 may be 0.5 mm, the center distance between adjacent first openings K1 may be 0.7 mm, and the thickness of the stacked structure 10 may be 1.5 mm.

[0220] 2. Fill the four first openings K1 with magnetic slurry, and then solidify it to form the magnetic member 30 .

[0221] After the magnetic slurry is solidified into the magnetic member 30 , the portion of the magnetic slurry protruding from the surface of the laminated structure 10 is scraped flat.

[0222] The magnetic slurry includes magnetic powder and resin, and the magnetic powder can be 60 wt.% amorphous FeSiB magnetic powder and 40 wt.% MnZn ferrite magnetic powder.

[0223] The resin used is bisphenol A epoxy resin, and the curing agent is an acid anhydride curing agent. The curing temperature of the magnetic slurry is 150°C and the curing time is 90 minutes.

[0224] 3. Drill a hole in the center of the magnetic part 30 with a diameter of 0.15 mm.

[0225] 4. A 30 μm copper layer is electroplated in the holes of the magnetic component 30 using a copper plating process. The holes inside the copper are filled with plugging resin. After filling, the resin is cured and leveled to form a conductive core 20.

[0226] 5. CoZrTaB is then produced by a sputtering magnetic film process. The thickness of a single layer is 500 nm, and there are 10 layers in total. An insulating layer (ie, a magnetic conductive member 40) is formed by sputtering SiO2 between each magnetic film layer.

[0227] 6. A 2 μm thick PI layer is then formed through a coating process, and then the electroplated copper (conductive core 20) and the bottom copper (wiring layer 11) are connected through etching, exposure and development to form a U-shaped copper wire (i.e., connector 50).

[0228] 7. Make another layer of PI, the shape of the PI is like an arch, and then sputter multiple layers of magnetic film (i.e., the magnetic conductive member 40), similarly to the above, so that the connecting member 50 is embedded in the magnetic conductive member 40.

[0229] Example 2:

[0230] 1. Provide a stacked structure 10 and open two first openings K1 on the stacked structure 10.

[0231] The diameter of the first opening K1 may be 0.3 mm, the center distance between adjacent first openings K1 may be 0.5 mm, and the thickness of the stacked structure 10 may be 0.8 mm.

[0232] 2. Fill the two first openings K1 with magnetic slurry, flatten the portion of the magnetic slurry protruding from the surface of the laminated structure 10 , and then solidify it to form the magnetic member 30 .

[0233] The magnetic slurry includes magnetic powder and resin, and the magnetic powder can be 100 wt.% nanocrystalline magnetic powder FeSiBCuNb.

[0234] Among them, the resin is epoxy resin, and the curing agent is an acid anhydride curing agent.

[0235] The magnetic powder accounts for 80% of the total weight, the viscosity of the magnetic slurry is 50 Pas (5 rpm), the curing temperature of the magnetic slurry is 180° C., and the curing time is 90 minutes.

[0236] 3. Drill a hole in the center of the magnetic part 30 with a diameter of 0.1 mm.

[0237] 4. A 15 μm copper layer is electroplated in the holes of the magnetic component 30 using a copper plating process. The holes inside the copper are filled with plugging resin. After filling, the resin is cured and leveled to form a conductive core 20.

[0238] 5. Then, CoZrTaB is produced by sputtering magnetic films. The thickness of a single layer is 200 nm, and there are 20 layers in total. A CoZrTaO oxide layer is sputtered between each magnetic film layer as an insulating layer (ie, forming the magnetic conductive member 40).

[0239] 6. A 2 μm thick PI layer is then formed through a coating process, and then the electroplated copper (conductive core 20) and the bottom copper (wiring layer 11) are connected through etching, exposure and development to form a U-shaped copper wire (i.e., connector 50).

[0240] 7. Make another layer of PI, the shape of the PI is like an arch, and then sputter multiple layers of magnetic film (i.e., the magnetic conductive member 40), similarly to the above, so that the connecting member 50 is embedded in the magnetic conductive member 40.

[0241] Example 3:

[0242] 1. Provide a stacked structure 10 and open two first openings K1 on the stacked structure 10.

[0243] The diameter of the first opening K1 may be 0.1 mm, the center distance between adjacent first openings K1 may be 1.2 mm, and the thickness of the stacked structure 10 may be 2 mm.

[0244] 2. Fill the two first openings K1 with magnetic slurry, flatten the portion of the magnetic slurry protruding from the surface of the laminated structure 10 , and then solidify it to form the magnetic member 30 .

[0245] The magnetic slurry includes magnetic powder and resin, and the magnetic powder may include 80 wt.% of nanocrystalline magnetic powder FeSiBCuNb and 20 wt.% of carbonyl iron.

[0246] Among them, the resin is epoxy resin, and the curing agent is dicyandiamide curing agent.

[0247] The magnetic powder accounts for 90% of the total weight, the magnetic slurry viscosity is 300 Pas (5 rpm), the magnetic slurry curing temperature is 160° C., and the curing time is 120 min.

[0248] 3. Drill a hole in the center of the magnetic part 30 with a diameter of 0.2 mm.

[0249] 4. A 35 μm copper layer is electroplated in the holes of the magnetic component 30 using a copper plating process. The holes inside the copper are filled with plugging resin. After filling, the resin is cured and leveled to form a conductive core 20.

[0250] 5. Then, a FeNi-SiO2 granular film is produced by sputtering a magnetic film. The thickness of a single layer is 500 nm, and there are 5 layers in total. AlN is sputtered between each magnetic film layer as an insulating layer (ie, forming a magnetic conductive member 40).

[0251] 6. A 2 μm thick PI layer is then formed through a coating process, and then the electroplated copper (conductive core 20) and the bottom copper (wiring layer 11) are connected through etching, exposure and development to form a U-shaped copper wire (i.e., connector 50).

[0252] 7. Make another layer of PI, the shape of the PI is like an arch, and then sputter multiple layers of magnetic film (i.e., the magnetic conductive member 40), similarly to the above, so that the connecting member 50 is embedded in the magnetic conductive member 40.

[0253] The preparation methods provided in Example 1, Example 2, and Example 3 can increase the initial inductance of the inductor L by 3 to 4 times without increasing the design space occupied by the inductor L, and also increase the saturation current to a certain extent.

[0254] Example 4:

[0255] 1. Provide a stacked structure 10 and open two first openings K1 on the stacked structure 10.

[0256] The diameter of the first opening K1 may be 1 mm, the center distance between adjacent first openings K1 may be 1.2 mm, and the thickness of the stacked structure 10 may be 2 mm.

[0257] 2. Fill the two first openings K1 with magnetic slurry, flatten the portion of the magnetic slurry protruding from the surface of the laminated structure 10 , and then solidify it to form the magnetic member 30 .

[0258] The magnetic slurry includes magnetic powder and resin, and the magnetic powder may include 50 wt.% nanocrystalline magnetic powder FeCoPdSiBCuNb, 30 wt.% iron nickel, and 20 wt.% iron silicon chromium.

[0259] Among them, the resin is epoxy resin, and the curing agent is dicyandiamide curing agent.

[0260] The magnetic powder accounts for 90% of the total weight, the magnetic slurry viscosity is 80 Pas (5 rpm), the magnetic slurry curing temperature is 160° C., and the curing time is 120 min.

[0261] 3. Drill a hole in the center of the magnetic part 30 with a diameter of 0.2 mm.

[0262] 4. A 35 μm copper layer is electroplated in the holes of the magnetic component 30 using a copper plating process. The holes inside the copper are filled with plugging resin. After filling, the resin is cured and leveled to form a conductive core 20.

[0263] 5. Then, the cast magnetic film (ie, the magnetic conductive member 40 ) and the laminated structure 10 are pressed together through a lamination process.

[0264] Among them, the cast magnetic film is a semi-cured film formed by mixing magnetic powder, resin and solvent through a casting process. The magnetic powder uses FeSiBCNb nanocrystals, the resin uses epoxy resin, the thickness of a single layer of film is 100um, and two layers of film are laminated at the same time.

[0265] 6. After lamination, the internal coil (ie, the connector 50) is manufactured by sputtering Cu, electroplating Cu, and etching processes, and the coil is connected to the copper wire (ie, the conductive core 20).

[0266] 7. Then, through a secondary lamination process, the cast magnetic film of the same thickness and number of layers is laminated together with the previously laminated cast magnetic film and the internal coil (i.e., the connecting part 50) with no gaps inside, so that the connecting part 50 is embedded in the magnetic conductive part 40.

[0267] The preparation method provided in the fourth embodiment can increase the initial inductance of the inductor L by 2 to 3 times without increasing the design space occupied by the inductor L, while also maintaining a relatively high saturation current.

[0268] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this disclosure should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A substrate, characterized in that include: A stacked structure comprising multiple wiring layers and multiple dielectric layers, wherein the wiring layers and the dielectric layers are alternately stacked; A conductive core is embedded in the stacked structure and passes through at least one dielectric layer; at least one end of the conductive core is electrically connected to the wiring layer; a magnetic member, penetrating the at least one dielectric layer and surrounding a side surface of the conductive core; The magnetic conductive component is provided on at least one end surface of the conductive core.

2. The substrate according to claim 1, wherein Also includes: A connecting piece is provided on the end surface of the conductive core and is electrically connected to the conductive core; and the magnetic conductive piece is in contact with the connecting piece.

3. The substrate according to claim 2, wherein The connecting member contacts the end surface of the conductive core, and the magnetic conductive member is arranged on a side of the connecting member away from the conductive core.

4. The substrate according to claim 2, wherein The magnetic conductive member is in contact with the end surface of the conductive core, and the connecting member is provided on a side of the magnetic conductive member away from the conductive core; The substrate further comprises: A first contact member passes through the magnetic conductive member, and the conductive core is electrically connected to the connecting member through the first contact member.

5. The substrate according to claim 2, wherein The magnetic conductive member includes a first sub-portion and a second sub-portion stacked together, the first sub-portion is in contact with the conductive core, and the connecting member is provided between the first sub-portion and the second sub-portion; The substrate further comprises: The second contact member passes through the first sub-portion, and the conductive core is electrically connected to the connecting member through the second contact member.

6. The substrate according to any one of claims 2 to 5, characterized in that The connector includes a first connecting portion, at least one end surface of the conductive core is provided with the first connecting portion, and the first connecting portion is electrically connected to the conductive core and the wiring layer respectively; The magnetic conductive component is provided on the end surface of the conductive core where the first connecting portion is located.

7. The substrate according to any one of claims 2 to 6, wherein The conductive core includes at least one pair of conductive pillars, and in each pair of conductive pillars, two conductive pillars are arranged at intervals; each conductive pillar passes through the at least one dielectric layer, and the magnetic member surrounds the side of the conductive pillar; The connector further includes a second connecting portion, which is provided on end surfaces of the two conductive pillars located on the same side, and the ends of the two conductive pillars located on the same side are electrically connected via the second connecting portion.

8. The substrate according to any one of claims 2 to 7, wherein The magnetic conductive member includes multiple layers of magnetron sputtering metal films and multiple layers of insulating layers, and the magnetron sputtering metal films and the insulating layers are alternately stacked.

9. The substrate according to claim 8, characterized in that Also includes: An intermediate layer is provided between the magnetic conductive component and the connecting component.

10. The substrate according to any one of claims 1 to 7, wherein The material of the magnetic conductive component includes a mixture of magnetic powder and polymer compound.

11. The substrate according to any one of claims 1 to 10, characterized in that The magnetic permeability of the magnetic conductive component is greater than or equal to the magnetic permeability of the magnetic component.

12. A packaging structure, characterized in that: include: The substrate according to any one of claims 1 to 11; The chip is packaged on the substrate and electrically connected to the substrate.

13. An electronic device, characterized in that: include: The packaging structure according to claim 12; A circuit board is electrically connected to the packaging structure.

14. A method for preparing a substrate, characterized in that: include: forming a stacked structure; the stacked structure includes multiple wiring layers and multiple dielectric layers, wherein the wiring layers and the dielectric layers are alternately stacked; forming a first opening penetrating the stacked structure, and forming a magnetic member on an inner wall of the first opening; the magnetic member is annular; Filling the ring of the magnetic member with a conductive material to form a conductive core; at least one end of the conductive core is electrically connected to the wiring layer; A magnetic conductive member is formed on at least one end surface of the conductive core.

15. The preparation method according to claim 14, characterized in that Also includes: forming a connecting piece; the connecting piece is provided on the end surface of the conductive core and is electrically connected to the conductive core; Wherein, the connecting member is formed before the magnetic conductive member is formed, so that the magnetic conductive member is located on a side of the connecting member away from the conductive core; or, The connecting member is formed after the magnetic conductive member is formed, so that the connecting member is located on a side of the magnetic conductive member away from the conductive core; or The connecting member is formed after forming a part of the magnetic conductive member, and then the other part of the magnetic conductive member is formed, so that the connecting member is embedded in the magnetic conductive member.

16. The preparation method according to claim 15, characterized in that The magnetic conductive member includes multiple layers of magnetron sputtering metal films and multiple layers of insulating layers, and the magnetron sputtering metal films and the insulating layers are alternately stacked; forming the magnetron sputtering metal film and the insulating layer by a magnetron sputtering process; The preparation method further comprises: forming an intermediate layer; The intermediate layer is located between the connecting member and the magnetic conductive member.

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