Rigid-flex board and preparation method thereof

Abstract

The invention relates to a rigid-flex board and a preparation method thereof. The rigid-flex board comprises a rigid board and a flexible board which are stacked, a stacking area between the rigid board and the flexible board comprises a first welding area and a second welding area, the first welding area covers a first functional area on the rigid board and a second functional area which is located at one end of the flexible board and is aligned with the first functional area, and the second welding area covers a second functional area which is located at the other end of the flexible board and is aligned with the second functional area. Each functional region comprises a functional bonding pad for realizing circuit connection; and the second welding area is closer to a third functional area at the other end of the flexible board than the first welding area. According to the technical scheme, the binding force between the hard boards and the soft boards in the rigid-flex board can be greatly enhanced, and the situation that the soft boards and the hard boards are torn is avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of welding technology, and in particular to a rigid-flex board and a preparation method thereof. Background Art

[0002] With the development of electronic assembly, the demand for PCBA (Printed Circuit Board Assembly) has gradually increased, requiring printed circuit boards to have both flexible and rigid areas. As a result, rigid-flex boards came into being.

[0003] In related technologies, rigid-flex boards are manufactured through processes such as SMT soft soldering, hard soldering, and laser welding. Typically, the functional area on the flexible board is welded to the functional area on the rigid board to create a rigid-flex board. However, the bonding strength between the flexible and rigid boards in the rigid-flex boards manufactured through these processes is weak, and the flexible and rigid boards can easily separate due to pulling, which in turn causes the circuit to become inoperable and renders the rigid-flex board unusable. Summary of the Invention

[0004] The present disclosure provides a rigid-flex board and a method for preparing the same to address deficiencies in the related art.

[0005] According to a first aspect of an embodiment of the present disclosure, a rigid-flexible board is provided, wherein the rigid-flexible board comprises a rigid board and a flexible board stacked together, wherein the stacking area between the rigid board and the flexible board comprises a first welding area and a second welding area, wherein:

[0006] The first welding area covers a first functional area on the rigid board and a second functional area on the flexible board located at one end and aligned with the first functional area, each functional area comprising a functional pad for realizing circuit connection;

[0007] The second welding area is closer to the third functional area located at the other end of the flexible board than the first welding area.

[0008] Optionally, the width of the second welding area is greater than a preset length, and the length of the second welding area is greater than or equal to the length of the first welding area along a second direction intersecting with the first direction, where the first direction is the direction of the first welding area relative to the second welding area.

[0009] Optionally, the distances between the second welding area on the hard board and the first functional area and the edge of the hard board are greater than a distance threshold.

[0010] Optionally, the surface mount layer of the rigid board is made of a steel mesh, and the opening ratio of the steel mesh located in the first welding area is greater than the opening ratio of the steel mesh located in the second welding area.

[0011] Optionally, the hard board further includes auxiliary welding areas provided on both sides of the hard board, and the auxiliary welding areas are used for welding with soft board waste.

[0012] According to a second aspect of an embodiment of the present disclosure, a method for preparing a rigid-flex board is provided, comprising:

[0013] The hard board to be welded and the flexible board to be welded are stacked to form a stacking area, wherein the stacking area covers a first functional area on the hard board to be welded and a second functional area located at one end of the flexible board to be welded, and the first functional area is aligned with the second functional area, and each functional area includes a functional pad for realizing circuit connection; the flexible board to be welded also includes a third functional area located at the other end;

[0014] Welding the first functional area and the second functional area to form a first welding area in the stacking area;

[0015] A second welding area is formed by welding in the stacking area. The second welding area is closer to the third functional area than the first welding area.

[0016] Optionally, the second welding area is provided with a welding pad, and welding in the stacking area to form the second welding area includes: welding the welding pad included in the second welding area.

[0017] Optionally, the second welding areas are connected via solder bridges.

[0018] Optionally, the width of the second welding area is greater than a preset length, and the length of the second welding area is greater than or equal to the length of the first welding area along a second direction intersecting with the first direction, where the first direction is the direction of the first welding area relative to the second welding area.

[0019] Optionally, the distances between the second welding area on the hard board to be welded and the first functional area and the edge of the hard board to be welded are greater than a distance threshold.

[0020] Optionally, the second functional area is covered with a 0.2 mm polyimide film.

[0021] Optionally, the surface mount layer of the hard board to be welded is made of a steel mesh, and the opening ratio of the steel mesh located in the first welding area is greater than the opening ratio of the steel mesh located in the second welding area.

[0022] Optionally, the processing method of the pads on the flexible board to be welded includes at least one of the following: when the distance between two adjacent solder points on the flexible board to be welded is greater than 0.4 mm, the pads on the flexible board to be welded adopt an SMD design and do not require drilling; when the distance between two adjacent solder points on the flexible board to be welded is greater than 0.4 mm and less than 0.7 mm, the pads on the flexible board to be welded are processed by ink solder mask; when the distance between two adjacent solder points on the flexible board to be welded is greater than or equal to 0.7 mm, the pads on the flexible board to be welded are processed by covering film.

[0023] Optionally, the hard plate to be welded further includes auxiliary welding areas provided on both sides of the hard plate to be welded; the method further includes: welding the auxiliary welding areas to soft plate waste.

[0024] According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, comprising the rigid-flex board described in the embodiment of the first aspect.

[0025] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0026] It can be seen from the above embodiments that the hard board and the soft board in the hard-flex board of the present disclosure are stacked on each other, and the stacking area of ​​the hard board and the soft board includes two welding areas - the first welding area and the second welding area. Among them, the first welding area covers the first functional area of ​​the hard board and the second functional area of ​​the soft board. Obviously, compared with the related art in which there is only one welding area between the hard board and the soft board, the present disclosure significantly increases the welding area between the hard board and the soft board, thereby greatly enhancing the bonding force between the hard board and the soft board. Moreover, compared with the first welding area, the second welding area is closer to the third functional area at the other end of the soft board. Therefore, the tensile force applied to the second welding area will be greater than the tensile force applied to the first welding area, which helps to protect the first functional area and the second functional area in the first welding area from being torn, so that the circuit between the first functional area and the second functional area can remain in a conductive state.

[0027] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1The figure is a schematic flow chart of a method for preparing a rigid-flex board according to an embodiment of the present disclosure.

[0030] Figure 2 Schematic diagram of a PCB board made of a rigid substrate and an FPC board made of a flexible substrate according to an embodiment of the present disclosure.

[0031] Figure 3 is a schematic diagram showing a stacking effect according to an embodiment of the present disclosure.

[0032] Figure 4 FIG. 4 is a schematic diagram showing a second welding area according to an embodiment of the present disclosure.

[0033] Figure 5 It is a schematic diagram showing a first direction and a second direction according to an embodiment of the present disclosure.

[0034] Figure 6 FIG. 1 is a schematic diagram showing an auxiliary welding area according to an embodiment of the present disclosure.

[0035] Figure 7 Schematic diagram of a rigid-flex board according to an embodiment of the present disclosure.

[0036] Figure 8 is a schematic block diagram of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0038] The terms used in the embodiments of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the embodiments of the present disclosure. The singular forms "a," "an," and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0039] It should be understood that although the terms first, second, third, etc. may be used to describe various information in the embodiments of the present disclosure, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of the embodiments of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0040] For the purpose of brevity and ease of understanding, the terms "greater than," "less than," "higher than," and "lower than" are used herein to describe size relationships. However, those skilled in the art will understand that the term "greater than" also encompasses the meaning of "greater than or equal to," and "less than" also encompasses the meaning of "less than or equal to," and the term "higher than" also encompasses the meaning of "higher than or equal to," and "lower than" also encompasses the meaning of "lower than or equal to."

[0041] When manufacturing rigid-flex boards through processes such as SMT soft soldering, hard soldering, and laser welding, the functional areas on the flexible board and the functional areas on the rigid board are typically welded together to form a rigid-flex board. However, the bonding strength between the flexible and rigid boards in the rigid-flex boards manufactured through these processes is weak, and the flexible and rigid boards can easily separate due to pulling, which in turn causes the circuit between the flexible and rigid boards to become incontinuous.

[0042] In the related art, glue or tape is usually used to improve the bonding strength between the soft board and the hard board. For example, after soft soldering / hard soldering / laser welding is achieved, the bottom filling glue operation is performed, and the filled glue will diffuse and fill in the gap due to the capillary effect. Then a heat curing operation is performed to enhance the bonding strength between the soft board and the hard board through glue bonding. For another example, a high-temperature resistant tape is pasted on the soft board, and then pressure is applied during soft soldering / hard soldering / laser welding to bond the soft board and the hard board through the high-temperature tape to enhance the bonding strength between the soft board and the hard board. Both of the above methods require additional adhesive materials to achieve the bonding of the soft and hard boards, and the operation is relatively cumbersome. In addition, if the soft and hard combined boards prepared by the above two methods have faults such as board separation, they cannot be repaired and can only be scrapped, resulting in a low utilization rate of the hard board.

[0043] Based on this, the embodiment of the present disclosure proposes a method for preparing a soft-hard combination board, which can improve the bonding strength between the soft board and the hard board through simple preparation operations, and can repair faults such as board separation when they occur, thereby improving the utilization rate of the hard board.

[0044] Next, one or more embodiments of the present disclosure are described in detail.

[0045] Figure 1FIG is a schematic flow chart of a method for preparing a rigid-flex board according to an embodiment of the present disclosure. Figure 1 As shown, the method may include the following steps:

[0046] S101: Stacking the hard board to be welded and the soft board to be welded to form a stacking area, wherein the stacking area covers the first functional area on the hard board to be welded and the second functional area at one end of the soft board to be welded, and the first functional area is aligned with the second functional area, and each functional area includes a functional pad for realizing circuit connection; the soft board to be welded also includes a third functional area at the other end.

[0047] Printed circuit boards (PCBs) are generally categorized as rigid PCBs and flexible PCBs based on the type of substrate they use. Rigid PCBs are made with a rigid substrate, while flexible PCBs are made with a flexible substrate. Compared to rigid PCBs, flexible PCBs offer greater flexibility and bendability, allowing them to adapt to complex curved surfaces or applications requiring folding. Therefore, combining flexible and rigid PCBs can effectively improve product performance.

[0048] Figure 2 Schematic diagram of a PCB board made of a rigid substrate and an FPC board made of a flexible substrate according to an embodiment of the present disclosure. Figure 2 As shown, both the PCB board and the FPC board contain functional areas composed of functional pads. The functional pads refer to pads on the printed circuit board for connecting electronic components and wires or pins, which can be used to achieve circuit connection or electrical connection. The PCB board / FPC board can contain one or more functional areas, and those skilled in the art can design them according to actual needs. In this embodiment, the PCB board is used as the hard board to be welded, and the FPC board is used as the soft board to be welded. In order to combine the PCB board and the FPC board, the PCB board and the FPC board need to be stacked first to form a stacking area. Figure 3 Schematic diagram of a stacking effect according to an embodiment of the present disclosure. Figure 3 The overlapping part of the PCB board and the FPC board is the stacking area, which covers the first functional area on the hard board to be welded and the second functional area at one end of the soft board to be welded, and the first functional area and the second functional area are aligned with each other.

[0049] S102: Welding the first functional area and the second functional area to form a first welding area in the stacking area.

[0050] The first functional area and the second functional area both contain functional pads, and the functional pads of the two functional areas can be connected together by the bonding force of solder paste. Therefore, by welding the functional pads in the two functional areas, the first functional area and the second functional area can be welded together to form a first welding area. Figure 3 shown.

[0051] S103: welding in the stacking area to form a second welding area, where the second welding area is closer to the third functional area than the first welding area.

[0052] Combine Figure 2 The flexible board to be welded also includes a third functional area at the other end, which can be bonded to the other rigid board to be welded. A second welding area is formed by welding in the stacking area of ​​the rigid board to be welded and the flexible board to be welded. The second welding area is closer to the third functional area on the flexible board to be welded than the first welding area. Figure 4 This is a schematic diagram illustrating a second welding area according to an embodiment of the present disclosure. If the area between the second and third functional areas is referred to as the connection area of ​​the flexible board to be welded, then the second welding area can be determined to be closer to the connection area than the first welding area. It should be noted that the rigid board and the flexible board to be welded will have identical and aligned second welding areas.

[0053] The above two steps S102 and S103 can be performed synchronously or asynchronously. The present disclosure does not limit the execution order of the two steps.

[0054] In the above embodiment, two welding areas are formed by welding in the stacking area of ​​the hard board to be welded and the soft board to be welded. Compared with the related art in which only the functional areas of the two boards are welded (i.e., there is only one welding area), the welding area between the hard board to be welded and the soft board to be welded is increased, thereby greatly enhancing the bonding force between the two boards. Moreover, the preparation method of the above embodiment can realize the bonding of the hard board and the soft board without additional operations and consumables, effectively improving the preparation efficiency of the hard-soft board. In addition, when the hard-soft board has a fault such as board separation, a new second welding area can be re-welded in the stacking area, thereby realizing the repair of the hard-soft board, which helps to improve the utilization rate of the hard board.

[0055] In one embodiment, a pad can be provided in the second welding area, that is, a pad can be provided in an area closer to the third functional area than the first welding area, so that the second welding area is formed by welding the pad. The pad can be a non-functional pad in the form of a strip pad or a point pad, that is, the pad is not used to connect electronic components or conduct electricity. Compared with the filling glue and high-temperature resistant tape in the related art, the cost of the pad is lower. Therefore, the preparation of a rigid-flex board using the method of this embodiment can not only improve the preparation efficiency, but also save the preparation cost of the rigid-flex board.

[0056] In one embodiment, the second soldering area between the rigid board to be soldered and the flexible board to be soldered can be connected by a solder bridge. The solder bridge can be made of a wire or solder wire. The solder bridge is placed between the second soldering area of ​​the rigid board to be soldered and the second soldering area of ​​the flexible board to be soldered, and then soldering is performed using a soldering tool, thereby achieving a connection between the rigid board to be soldered and the flexible board to be soldered.

[0057] In one embodiment, the width of the second welding zone is greater than a preset length, and the length of the second welding zone is greater than or equal to the length of the first welding zone along a second direction, where the second direction is a direction intersecting with the first direction, and the first direction is the direction of the first welding zone relative to the welding zone. Figure 5 It is a schematic diagram showing a first direction and a second direction according to an embodiment of the present disclosure. Figure 5 for Figure 4 A partial enlarged view of Figure 5 In the example, the first welding area is located to the left of the second welding area, so the first direction is toward the lower left. The second direction intersects the first direction ( Figure 5 The second direction is merely an example; any direction intersecting the first direction can be defined as the second direction. In this embodiment, the width of the second weld zone is greater than 0.15 mm, and the length of the second weld zone is greater than or equal to the length of the first weld zone along the second direction. This ensures that the length of the second weld zone overlaps the length of the first weld zone. Thus, when pulled, the second weld zone protects the entire first weld zone, preventing the first weld zone from tearing.

[0058] In one embodiment, the distances between the second welding area on the rigid board to be welded and the first functional area and the edge of the rigid board to be welded are greater than a distance threshold. In this embodiment, the distances between the second welding area on the rigid board to be welded and the first functional area and the edge of the rigid board to be welded are all greater than 0.1 mm. Because the first functional area corresponds to the second functional area, and the second welding area on the rigid board to be welded corresponds to the second welding area on the flexible board to be welded, the distance between the second welding area on the flexible board to be welded and the second functional area is also greater than 0.1 mm.

[0059] By setting the distance between the second welding area on the hard board to be welded and the edge of the hard board to be welded to be greater than the distance threshold, it is possible to avoid the second welding area from tearing under a smaller tensile force, thereby increasing the tensile force threshold that the rigid-flexible board can withstand. At the same time, by setting the distance between the second welding area and the first functional area on the hard board to be welded to be greater than the distance threshold, it is possible to avoid the situation where the first welding area tears immediately after the second welding area tears. For example, if the user finds that the second welding area is torn, since the distance between the second welding area and the first functional area on the hard board to be welded is greater than the distance threshold, the first welding area can maintain a connection state for a certain period of time. In this case, the user only needs to re-weld the second welding area to repair the rigid-flexible board.

[0060] In one embodiment, the second functional area of ​​the soft board to be welded can be reinforced with PI. PI reinforcement refers to the use of polyimide material for reinforcement during the manufacturing process of the printed circuit board. Polyimide is a high-temperature, high-performance polymer material with good mechanical strength and heat resistance. In this embodiment, the second functional area is covered with 0.2 mm polyimide. Of course, all functional areas on the soft board to be welded can be reinforced with PI (that is, all functional areas on the soft board to be welded are covered with 0.2 mm polyimide). During the reinforcement process, it is necessary to ensure that the flatness of the welding is less than 0.08 mm. Through PI reinforcement, the mechanical strength of the second functional area can be increased, thereby improving the overall stability of the soft and hard board.

[0061] In one embodiment, a steel mesh can be used to prepare the surface mount layer (SMT) of the hard board to be soldered. The steel mesh is a metal plate with openings that can control the amount of solder paste, position components, and prevent short circuits. In this embodiment, a 0.08 mm steel mesh is used to prepare the SMT layer, and the opening ratio of the steel mesh located in the first soldering area is greater than the opening ratio of the steel mesh located in the second soldering area. For example, the opening ratio of the steel mesh located in the first soldering area can be 90%-110%, and the opening ratio of the steel mesh located in the second soldering area can be 70%-90%. The opening ratio of the steel mesh refers to the ratio of the total area of ​​the openings on the surface of the steel mesh to the area of ​​the entire steel mesh, usually expressed as a percentage. By controlling the opening ratio of the steel mesh, the amount of solder paste can be controlled, thereby ensuring that the solder paste on the solder pad is uniform and accurate. In this embodiment, by controlling the opening ratio of the steel mesh located in the first soldering area to be greater than the opening ratio of the steel mesh located in the second soldering area, the first soldering area can be further protected from being torn, thereby maintaining the conductivity of the circuit in the functional area.

[0062] In one embodiment, the treatment of solder pads on a flexible circuit board to be soldered can be determined based on solder pitch. Solder pitch refers to the distance between two adjacent solder joints on a printed circuit board (PCB). It determines component mounting density and soldering quality, and is a critical parameter in the design and manufacturing of PCBs. If the solder pitch is too small, soldering becomes more difficult, potentially leading to electrical shorts, poor soldering, and other issues. If the solder pitch is too large, it takes up too much space, limiting component mounting density and the functional expansion of the PCB.

[0063] In this embodiment, if the pitch of the solder joint on the flexible board to be soldered is greater than 0.4 mm, the solder pads on the flexible board to be soldered are designed using an SMD design and do not require drilling. At the same time, the solder pad surface is treated with a gold plating treatment. For specific treatment methods, please refer to the relevant content of SMD design and gold plating treatment in the relevant art, which will not be described in detail in this disclosure. Both SMD design and gold plating can improve the conductivity and corrosion resistance of the solder pads, making the solder pads more reliable, thereby preventing the flexible board and rigid board from tearing due to problems with the solder pads themselves.

[0064] If the pitch of the solder joint on the FPC to be soldered is greater than 0.4 mm and less than 0.7 mm, an ink solder mask can be used to treat the surface of the pad on the FPC to be soldered. This ink solder mask uses a special high-temperature and corrosion-resistant organic material (usually a polyurethane resin) to coat the pad. This ink layer protects the pad from the heat and chemicals during soldering, providing excellent insulation and corrosion resistance.

[0065] If the pitch of the solder joint on the FPC to be soldered is greater than or equal to 0.7 mm, a coverlay can be used to treat the surface of the pad. Coverlays are typically made from polymer materials such as acrylates and epoxies, and offer both insulating and corrosion-resistant properties. Applying a coverlay to the pad effectively prevents corrosion and damage from the external environment, chemicals, and humidity, thereby improving the pad's reliability and stability.

[0066] In one embodiment, the hard board to be welded further includes auxiliary welding areas provided on both sides of the hard board to be welded. The auxiliary welding areas can be formed by adding auxiliary welding pads.

[0067] Figure 6 FIG. 1 is a schematic diagram of an auxiliary welding area according to an embodiment of the present disclosure. Figure 6As shown, auxiliary welding areas formed by auxiliary pads are respectively provided on both sides of the hard board to be welded, and the two auxiliary welding areas can form a triangle with the first functional area. In the process of preparing the soft-rigid board, the auxiliary welding areas can be welded to the scrap of the soft board, so that the two auxiliary welding areas can balance the tensile force of the soft board (FPC board) to be welded to the hard board to be welded, avoiding tearing and separation between the soft board to be welded and the hard board to be welded. It should be noted that Figure 6 The position of the auxiliary welding area is only an example. During the implementation of the solution disclosed in the present invention, it is only necessary to make the two auxiliary welding areas and the first functional area on the hard board to be welded form a triangle. The present invention does not limit the specific position of the auxiliary welding area.

[0068] Through any of the above embodiments, a rigid-flex board with strong bonding strength can be prepared (see Figure 4 The rigid-flex board includes a stacked rigid board and a flexible board, wherein the stacked area between the rigid board and the flexible board includes a first welding area and a second welding area. The first welding area covers a first functional area on the rigid board and a second functional area on the flexible board located at one end and aligned with the first functional area. The second welding area is closer to a third functional area on the flexible board at the other end than the first welding area.

[0069] In one embodiment, the width of the second welding area in the rigid-flex PCB is greater than a predetermined width, and the length of the second welding area is greater than or equal to the length of the first welding area along a second direction intersecting the first direction, where the first direction is the direction of the first welding area relative to the second welding area. The configuration method can be found in the previous description and will not be further described here.

[0070] In one embodiment, the distances between the second welding area on the hard plate and the first functional area and the edge of the hard plate are greater than a distance threshold. For example, the distances between the second welding area on the hard plate and the first functional area and the edge of the hard plate are greater than 0.1 mm, thereby further protecting the first functional area from being torn and increasing the tensile force threshold that the second welding area can withstand.

[0071] In one embodiment, the surface mount layer of the rigid board can be made of a steel mesh, with the opening ratio of the steel mesh in the first welding area being greater than that in the second welding area. For example, a 0.08 mm steel mesh can be used to make the SMT layer, with the opening ratio of the steel mesh in the first welding area being controlled to be 90%-110%, and the opening ratio of the steel mesh in the second welding area being controlled to be 70%-90%. This method can further protect the first welding area from tearing, thereby maintaining the continuity of the circuit in the functional area.

[0072] In one embodiment, auxiliary welding areas are provided on both sides of the rigid board in a rigid-flex board. These auxiliary welding areas can be welded to scrap flexible board. These two auxiliary welding areas can balance the tensile force exerted by the flexible board on the rigid board to be welded, thereby preventing the flexible board and the rigid board from tearing or separating.

[0073] In addition, as mentioned above, the third functional area can be welded to other hard plates. Figure 7 FIG is a schematic diagram of a rigid-flex board according to an embodiment of the present disclosure. Figure 7 As shown in FIG, the rigid-flex board includes two rigid boards and one flexible board, and the flexible board connects the two rigid boards. For the rigid board 1, the functional area on the left side of the flexible board is the second functional area, and the functional area on the right side of the flexible board is the third functional area. Therefore, in the stacking area of ​​the rigid board 1 and the flexible board, the first functional area on the rigid board 1 is aligned with the functional area on the left side of the flexible board to form a first welding area, and there is a second welding area ( Figure 7 For the rigid board 2, the functional area on the right side of the flexible board is the second functional area, and the functional area on the left side of the flexible board is the third functional area. Therefore, in the stacking area of ​​the rigid board 2 and the flexible board, the first functional area on the rigid board 2 is aligned with the functional area on the right side of the flexible board to form a first welding area, and there is a second welding area on the left side of the first welding area ( Figure 7 In addition, auxiliary welding areas are provided on both sides of the rigid board 1 to balance the tensile force of the flexible board on the rigid board 1. Auxiliary welding areas are provided on both sides of the rigid board 2 to balance the tensile force of the flexible board on the rigid board 2. Figure 7 There are two welding areas between the soft board and each hard board in the soft-rigid combination board shown, which increases the welding area between the soft board and the hard board, thereby enhancing the bonding force between the soft board and the hard board, avoiding the soft board and the hard board from tearing, and allowing the circuit in the functional area between the soft board and the hard board to remain conductive.

[0074] The rigid-flex board described in any of the above embodiments can be incorporated into an electronic device to achieve corresponding functions through the interaction of electronic functional components on the rigid-flex board. For example, the electronic device 800 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0075] Figure 8 1 is a schematic block diagram of an electronic device according to an embodiment of the present disclosure. Figure 8 , the electronic device 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0076] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 802 may include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0077] The memory 804 is configured to store various types of data to support operations on the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0078] The power supply component 806 provides power to the various components of the electronic device 800. The power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 800.

[0079] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the electronic device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0080] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0081] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as a keyboard, click wheel, buttons, etc. These buttons may include but are not limited to: a home button, volume buttons, a start button, and a lock button.

[0082] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the electronic device 800, the relative positioning of components, such as the display and keypad of the electronic device 800. The sensor assembly 814 can also detect changes in the position of the electronic device 800 or a component of the electronic device 800, the presence or absence of user contact with the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and temperature changes of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0083] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, 4G LTE, 8G NR or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0084] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to execute the method described in any of the above embodiments.

[0085] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the instructions can be executed by the processor 820 of the electronic device 800 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0086] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0087] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A rigid-flex board, characterized in that: The rigid-flex board includes a stacked rigid board and a flexible board, and the stacking area between the rigid board and the flexible board includes a first welding area and a second welding area, wherein: The first welding area covers a first functional area on the rigid board and a second functional area on the flexible board located at one end and aligned with the first functional area, each functional area comprising a functional pad for realizing circuit connection; The second welding area is closer to the third functional area located at the other end of the flexible board than the first welding area.

2. The rigid-flex board according to claim 1, characterized in that: The width of the second welding area is greater than a preset length, and the length of the second welding area is greater than or equal to the length of the first welding area along a second direction intersecting with the first direction, where the first direction is a direction of the first welding area relative to the second welding area.

3. The rigid-flex board according to claim 1, characterized in that: The distances between the second welding area on the hard board and the first functional area and the edge of the hard board are greater than a distance threshold.

4. The rigid-flex board according to claim 1, characterized in that: The surface mounting layer of the rigid board is made of a steel mesh, and the opening ratio of the steel mesh located in the first welding area is greater than the opening ratio of the steel mesh located in the second welding area.

5. The rigid-flex board according to claim 1, characterized in that: The hard board further includes auxiliary welding areas arranged on both sides of the hard board, and the auxiliary welding areas are used for welding with soft board waste.

6. A method for preparing a rigid-flex board, characterized in that: include: The hard board to be welded and the flexible board to be welded are stacked to form a stacking area, wherein the stacking area covers a first functional area on the hard board to be welded and a second functional area located at one end of the flexible board to be welded, and the first functional area is aligned with the second functional area, and each functional area includes a functional pad for realizing circuit connection; the flexible board to be welded also includes a third functional area located at the other end; Welding the first functional area and the second functional area to form a first welding area in the stacking area; A second welding area is formed by welding in the stacking area. The second welding area is closer to the third functional area than the first welding area.

7. The method according to claim 6, characterized in that The second welding area is provided with a welding pad, and welding in the stacking area to form the second welding area includes: welding the welding pad included in the second welding area.

8. The method according to claim 6, characterized in that The second soldering areas are connected via solder bridges.

9. The method according to claim 6, characterized in that The width of the second welding area is greater than a preset length, and the length of the second welding area is greater than or equal to the length of the first welding area along a second direction intersecting with the first direction, where the first direction is a direction of the first welding area relative to the second welding area.

10. The method according to claim 6, characterized in that The distances between the second welding area on the hard board to be welded and the first functional area and the edge of the hard board to be welded are greater than a distance threshold.

11. The method according to claim 6, characterized in that The second functional area is covered with a 0.2 mm polyimide film.

12. The method according to claim 6, characterized in that The surface mount layer of the hard board to be welded is made of a steel mesh, and the opening ratio of the steel mesh located in the first welding area is greater than the opening ratio of the steel mesh located in the second welding area.

13. The method according to claim 6, characterized in that The processing method of the pad on the flexible board to be welded includes at least one of the following: When the distance between two adjacent solder joints on the flexible board to be soldered is greater than 0.4 mm, the solder pads on the flexible board to be soldered adopt an SMD design and do not require drilling; When the distance between two adjacent solder joints on the flexible board to be welded is greater than 0.4 mm and less than 0.7 mm, the solder pads on the flexible board to be welded are treated with ink solder mask; When the distance between two adjacent solder joints on the flexible board to be soldered is greater than or equal to 0.7 mm, the solder pads on the flexible board to be soldered are processed by using a covering film.

14. The method according to claim 6, characterized in that The hard plate to be welded further comprises auxiliary welding areas arranged on both sides of the hard plate to be welded; The method further includes: welding the auxiliary welding area to soft board waste.

15. An electronic device, characterized in that: The invention comprises the rigid-flex board according to any one of claims 1 to 5.

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