Wafer sampling, recovering and cleaning system and wafer sampling, recovering and cleaning method using wafer sampling, recovering and cleaning system

Abstract

The invention relates to a system for sampling a wafer, recovering a sampling solution and cleaning the remaining sampling solution. According to the wafer sampling, recovering and cleaning system and the wafer sampling, recovering and cleaning method using the wafer sampling, recovering and cleaning system of the present invention, the precision of wafer sampling processing is increased by including a cleaning unit which cleans the surface of a recovery unit. The recovery unit recovers the sampling solution of the wafer.

Description

Technical Field

[0001] The present invention relates to a system for sampling a wafer, recovering the sampled solution, and then cleaning up the remaining sampled solution. Background Art

[0002] A variety of hazardous gases are used throughout the core processes of the semiconductor and display industries. These include acidic gases such as fluorine, chlorine, bromine, nitric acid, and sulfuric acid; alkaline gases such as ammonia and amines; organic compounds; metal materials such as Cu, Al, and Si; and dopant materials such as P and B. These materials are often toxic and have strong oxidizing properties, leading to pattern anomalies or surface overoxidation, resulting in product defects.

[0003] In semiconductors, a wafer typically refers to a silicon wafer, a thin slab of silicon that serves as the foundation for semiconductor integrated circuits. Wafers are made by slicing thin sheets of 99.9999999% pure single-crystal silicon and smoothing the surface. The wafer surface must be free of defects and contamination and must also be highly flat, as this affects the accuracy of the circuits. Recently, disc-shaped wafers with a thickness of 0.3 mm and a diameter of 15 to 30 mm have come into use.

[0004] After the wafers are assembled and fully inspected, they are cut into individual chips and used as complete integrated circuits. Before being used as integrated circuits, the wafers undergo patterning, etching, ion implantation, and other processes. They are then placed in a shipping package and transported for further processing or stored for future use. However, due to the large amounts of chemicals used during these processes, the wafers are subject to chemical contamination, and the contaminated wafers may contaminate the interior of the shipping package.

[0005] When wafers are stored for extended periods of time inside contaminated shipping containers and the container becomes contaminated beyond a certain concentration, the wafers can be negatively impacted, leading to product defects. Therefore, to improve wafer production quality, a sampling process that quickly and accurately measures not only the contamination within the shipping container but also the extent of contamination on the wafer surface is crucial.

[0006] Therefore, the prior art has adopted a method of spraying a sampling solution onto the surface of a wafer and then recovering and analyzing the sampled solution to inspect for contaminants on the wafer surface. However, this method has the following problem: during the recovery of the sampled solution, some contaminants may remain in the recovery device that collects and stores the sampled solution and contaminate the recovery device itself. In this case, the accuracy of wafer sampling is severely compromised, and a method to overcome this problem has emerged. Summary of the Invention

[0007] Technical issues

[0008] The purpose of the present invention is to provide a chip solution recovery and cleaning system and a chip solution recovery and cleaning method using the chip solution recovery and cleaning system. The chip solution recovery and cleaning system can improve the accuracy of chip sampling processing by including a cleaning unit, and the cleaning unit cleans the surface of the recovery unit. The recovery unit is used to recover the sampling solution of the chip.

[0009] Technical Solution

[0010] In one general aspect, a wafer sampling solution recovery and cleaning system for a wafer sampling solution device is provided. The wafer sampling solution device includes a seating portion and a sampling nozzle. The seating portion allows a wafer to sit on one surface thereof and rotate the wafer. The sampling nozzle sprays a sampling solution onto the surface of the wafer. The wafer sampling solution recovery and cleaning system includes: a recovery unit fixed to the seating portion and disposed on an outer portion of the wafer to recover the sampling solution on the upper surface of the wafer; and a discharge unit receiving the sampling solution from the recovery unit and discharging the received sampling solution to the outside.

[0011] In addition, the recovery unit may include: a sampling solution storage portion, which is a space located at a predetermined depth and stores the sampling solution; and a first shell provided on one side of the sampling solution storage portion and including a blocking wall extending from the sampling solution storage portion in a vertical direction.

[0012] In addition, the chip sampling solution recovery and cleaning system may further include: a cleaning unit, which sprays the cleaning solution on the recovery unit to clean the remaining sampling solution, wherein the cleaning unit includes a cleaning solution storage part and a second shell, the cleaning solution storage part is a space formed at a predetermined depth in the first shell, and the second shell is connected to the upper part of the first shell, wherein the second shell includes a covering part, which is formed to cover the entire upper surface of the cleaning solution storage part.

[0013] In addition, the second housing may include a cleaning flow regulating portion extending from the covering portion, surrounding an upper end portion of the barrier wall, and spaced apart from the upper end portion of the barrier wall by a predetermined distance.

[0014] In addition, the second housing may include a height adjusting portion which adjusts the height of the cleaning flow rate adjusting portion, and the height adjusting portion is a bolt passing through the second housing and the first housing.

[0015] In addition, the barrier wall may be provided so that one surface of the barrier wall faces the wafer and the sampling solution storage portion, and the one surface of the barrier wall may be formed to be inclined at a predetermined angle with respect to the vertical direction.

[0016] In addition, the other side portion of the sampling solution storage portion may be connected to the discharge unit, and the other side surface may be inclined at a predetermined angle with respect to the vertical direction.

[0017] In addition, the cleaning unit may include at least one wall cleaning nozzle that supplies the cleaning solution to the barrier wall, and the wall cleaning nozzle sprays the cleaning solution directly to the barrier wall.

[0018] In addition, the cleaning unit may include at least one wall cleaning nozzle supplying a cleaning solution to the barrier wall, and the wall cleaning nozzle may spray the cleaning solution onto an outermost surface of the wafer.

[0019] In addition, the spray direction of the wall cleaning nozzle may not be perpendicular to the spray direction of the sampling nozzle but may form a predetermined angle.

[0020] In another general aspect, a wafer sampling solution recovery and cleaning method using a wafer sampling solution recovery and cleaning system includes: (a) receiving a wafer sampling solution through a recovery unit; (b) cleaning a barrier wall of the recovery unit through a cleaning unit; and (c) discharging the sampling solution to the outside through a discharge unit.

[0021] In addition, (b) may include at least one of the following: (b1) determining the spray direction of the cleaning solution; and (b2) determining the spray intensity of the cleaning solution, and (b) may include (b3) supplying the cleaning solution to the blocking wall, wherein (b3) is after (b1) or (b2).

[0022] Additionally, (b1) may include: (b11) including at least one wall cleaning nozzle that supplies a cleaning solution to the barrier wall; (b12) when an estimated adhesion strength of particles on the barrier wall is higher than a predetermined reference adhesion strength, adjusting a spraying direction of the wall cleaning nozzle toward the barrier wall; and (b13) when the estimated adhesion strength of particles on the barrier wall is lower than or equal to the predetermined reference adhesion strength, adjusting a spraying direction of the wall cleaning nozzle toward the wafer.

[0023] In addition, (b2) may include: (b21) fastening the second shell to the upper portion of the first shell; (b22) injecting a cleaning solution into the cleaning solution storage portion and supplying the cleaning solution mainly to the blocking wall; and (b23) when the sampling solution of the blocking wall is maintained above a reference value, downwardly adjusting the height of the second shell through the height adjustment portion.

[0024] Beneficial effects

[0025] The wafer sampling solution recovery and cleaning system and the wafer sampling solution recovery and cleaning method using the same according to the above configuration of the present invention include a cleaning unit that cleans the surface of the recovery unit that recovers the wafer sampling solution, thereby improving the accuracy of the wafer sampling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the wafer sampling solution recovery and cleaning system of the present invention.

[0027] Figure 2 is a schematic diagram illustrating a first exemplary embodiment of a cleaning unit of the present invention.

[0028] Figure 3 is a schematic diagram illustrating a second exemplary embodiment of the cleaning unit of the present invention.

[0029] Figure 4 is a schematic diagram illustrating a third exemplary embodiment of the cleaning unit of the present invention.

[0030] Figure 5 FIG. 1 is a flow chart illustrating a wafer sampling solution recovery and cleaning method according to the present invention.

[0031] Figure 6 is a flow chart illustrating detailed operations of the barrier wall cleaning operation of the present invention.

[0032] Figure 7 is a flow chart illustrating detailed operations of the cleaning solution direction determination operation of the present invention.

[0033] Figure 8 is a flow chart illustrating detailed operations of the cleaning solution strength determination operation of the present invention. DETAILED DESCRIPTION

[0034] Hereinafter, preferred exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Before the description, it should be understood that the terms used in the specification and the appended claims should not be interpreted as limited to the general meaning and dictionary meaning, but should be interpreted based on the meaning and concept corresponding to the technical aspects of the present disclosure on the basis of the principle that the inventor is allowed to define the terms.

[0035] In the following, reference will be made to Figure 1 The basic configuration of the wafer sampling solution recovery and cleaning system 1000 of the present invention is described.

[0036] The present invention relates to a wafer sampling solution recovery and cleaning system 1000. The wafer sampling solution recovery and cleaning system 1000 is applied to a wafer W sampling device. The wafer W sampling device includes a seating portion C that allows a wafer W to be seated on one surface thereof and rotates the wafer W; and a sampling nozzle N that sprays a sampling solution onto the surface of the wafer W. The wafer sampling solution recovery and cleaning system 1000 of the present invention includes a recovery unit 100 that recovers the solution that has been sampled from the surface of the wafer W. The recovery unit 100 can be fixed to the seating portion C and rotate together with the seating portion C as it rotates. Alternatively, the recovery unit 100 can be fixed to the seating portion C, but the seating portion C can be configured as a separate portion from the portion that rotates the wafer W and can remain fixed regardless of the rotation of the wafer W. The recovery unit 100 is positioned along the outer edge of the wafer W and can recover the sampling solution dispersed by centrifugal force on the upper surface of the wafer W as the wafer W rotates.

[0037] The recovery unit 100 may include a first housing 110, which includes a sample solution storage portion 111, which is a space having a predetermined depth and storing a sample solution; and a barrier wall 112, which is provided on one side of the sample solution storage portion 111 and extends vertically from the sample solution storage portion 111. The sample solution storage portion 111 and the barrier wall 112 may be constructed as a single component. The maximum vertical height of the barrier wall 112 may be higher than the height of the wafer W attached to the seating portion C. Therefore, sample solution droplets dispersed from the outer portion of the wafer W may hit the barrier wall 112 and be contained in the sample solution storage portion 111.

[0038] In addition, the wafer sample solution recovery and cleaning system 1000 of the present invention may include a discharge unit 200. The discharge unit 200 may receive the sample solution from the recovery unit 100 and discharge the sample solution to the outside. The discharged sample solution may be analyzed to determine the presence or absence of contaminants on the surface of the wafer W. Preferably, the sample solution is stored in the recovery unit 100 before being discharged to the outside through the discharge unit 200.

[0039] In addition, the wafer sampling solution recovery and cleaning system 1000 of the present invention may include a cleaning unit 300. The cleaning unit 300 may spray a cleaning solution onto the recovery unit 100 to clean up the remaining sampling solution in the recovery unit 100. The cleaning solution may be ultrapure water or hot ultrapure water (UPW). By including the cleaning unit 300, the surface of the recovery unit 100 may be kept clean, thereby improving the accuracy of analyzing the sampling solution. In more detail, when the contaminants contained in the sampling solution are deposited in the sampling solution storage portion 111 or the sampling solution splashes and adheres to the barrier wall 112, the cleaning unit 300 may clean the surface of the recovery unit 100, thereby improving the accuracy of the sampling solution analysis.

[0040] Furthermore, the barrier wall 112 may be arranged so that one surface thereof faces the wafer W and the sample solution storage portion 111. Therefore, when the sample solution is dispersed from the surface of the wafer W, the sample solution may strike the barrier wall 112 and be collected by the sample solution storage portion 111. Furthermore, in more detail, one surface of the barrier wall 112 may be formed to be inclined at a predetermined angle relative to the vertical direction. Therefore, the sample solution that has struck the barrier wall 112 may be guided to flow along the inclined surface into the sample solution storage portion 111.

[0041] In addition, the other side portion of the sampling solution storage portion 111 may be connected to the discharge unit 200, and the other side surface may be formed to be inclined at a predetermined angle relative to the vertical direction. Figure 1 As shown, the inner cross-sectional area of ​​the sampling solution storage portion 111 may be designed to increase vertically from the bottom to the top of the sampling solution storage portion 111. Therefore, precipitation of contaminants contained in the sampling solution on the lower surface of the sampling solution storage portion 111 may be minimized.

[0042] In the following, reference will be made to Figure 2 A first exemplary embodiment of the cleaning unit 300 of the present invention will be described in more detail.

[0043] exist Figure 2 In the first exemplary embodiment of the cleaning unit 300 shown, the cleaning unit 300 may include a cleaning solution storage portion 310, which is a space formed at a predetermined depth in the first housing 110, and a second housing 320, which is coupled to the upper portion of the first housing 110. The second housing 320 may include a cover portion 321 formed to cover the entire upper surface of the cleaning solution storage portion 310. Thus, the cleaning solution may be accommodated in the space surrounded by the cleaning solution storage portion 310, the cover portion 321, and the barrier wall 112. The cleaning solution storage portion 310 may be connected to a pump that supplies the cleaning solution.

[0044] In addition, the second housing 320 may include a cleaning flow regulating portion 322 that extends from the cover portion 321, surrounds the upper end portion of the barrier wall 112, and is spaced apart from the upper end portion of the barrier wall 112. Therefore, when a cleaning solution is injected into the cleaning solution storage portion 310 using a pump or the like and the cleaning solution fills the space surrounded by the cleaning solution storage portion 310, the cover portion 321, and the barrier wall 112, the overflowed cleaning solution can leak through the gap between the cleaning flow regulating portion 322 and the barrier wall 112 to clean the barrier wall 112.

[0045] In addition, the second housing 320 may include a height adjustment portion 323 that adjusts the height of the cleaning flow adjustment portion 322, and the height adjustment portion 323 may be a bolt that passes through the second housing 320 and the first housing 110. When the height of the second housing 320 is adjusted by the height adjustment portion 323, the distance between the cleaning flow adjustment portion 322 and the barrier wall 112 can be adjusted, and the flow rate of the cleaning solution can be determined accordingly. That is, assuming that the cleaning solution is injected at a constant flow rate by a pump or the like, as the distance between the cleaning flow adjustment portion 322 and the barrier wall 112 is longer, the flow rate may be slower, and as the distance between the cleaning flow adjustment portion 322 and the barrier wall 112 is shorter, the flow rate may be faster. (The spray intensity may increase.)

[0046] In the following, reference will be made to Figure 3 A second exemplary embodiment of the cleaning unit 300 is described in more detail.

[0047] like Figure 3 As shown, the cleaning unit 300 may include at least one wall cleaning nozzle 330 that supplies a cleaning solution to the barrier wall 112. In a second exemplary embodiment of the cleaning unit 300, the wall cleaning nozzle 330 may spray the cleaning solution directly onto the barrier wall 112. Thus, contaminants adhering to the surface of the barrier wall 112 may be directly removed using the cleaning solution. In this case, the cleaning intensity may be easily adjusted by adjusting the spray intensity of the wall cleaning nozzle 330.

[0048] In the following, reference will be made to Figure 4 A third exemplary embodiment of the cleaning unit 300 will be described in more detail.

[0049] like Figure 4As shown, the cleaning unit 300 may include at least one wall cleaning nozzle 330 that supplies a cleaning solution to the barrier wall 112. In the third exemplary embodiment of the cleaning unit 300, the wall cleaning nozzle 330 may spray the cleaning solution onto the outermost surface of the wafer W. Thus, the sampling solution and the cleaning solution on the wafer W may be dispersed together by centrifugal force to clean the barrier wall 112. As a result, damage to the barrier wall 112 may be minimized and contaminants on the barrier wall 112 may be removed.

[0050] At this time, the spraying direction of the wall cleaning nozzle 330 may form a predetermined angle, rather than being perpendicular to the spraying direction of the sampling nozzle N. In the case of the sampling nozzle N, the sampling solution is mainly sprayed in a direction perpendicular to the surface of the wafer W, and in order to maximize the dispersion efficiency or by considering the arrangement of the nozzle and the pump, the wall cleaning nozzle 330 may spray the cleaning solution in a direction having a predetermined tilt angle, rather than being perpendicular to the surface of the wafer W. Therefore, the cleaning efficiency can be maximized.

[0051] In the following, reference will be made to Figures 5 to 8 The wafer sampling solution recovery and cleaning method of the present invention is described.

[0052] like Figure 5 As shown, a wafer sample solution recovery and cleaning method using a wafer sample solution recovery and cleaning system 1000 may include: operation (a) of receiving a sample solution from a wafer W via the recovery unit 100; operation (b) of cleaning the barrier wall 112 of the recovery unit 100 via the cleaning unit 300; and operation (c) of discharging the sample solution to the outside via the discharge unit 200. In operation (a), the recovery unit 100 may be positioned along the outer portion of the wafer W to recover the sample solution dispersed by centrifugal force on the upper surface of the wafer W as the wafer W rotates. Furthermore, in operation (c), the discharge unit 200 may be connected to the sample solution storage portion 111 so that, when a predetermined sample solution or more of the sample solution is contained in the sample solution storage portion 111, the discharge unit 200 may receive the sample solution and discharge it to the outside. The discharged sample solution may be analyzed to determine the presence or absence of contaminants on the surface of the wafer W. Preferably, the sample solution is stored in the recovery unit 100 until it is discharged to the outside via the discharge unit 200.

[0053] At this time, if Figure 6 As shown, operation (b) may include at least one of operation (b1) of determining the spray direction of the cleaning solution and operation (b2) of determining the spray intensity of the cleaning solution, and may include operation (b3) of supplying the cleaning solution to the blocking wall 112, and here, operation (b3) may be after operation (b1) or operation (b2).

[0054] In more detail, Figure 7 As shown, operation (b1) may include operation (b11), operation (b11) including supplying a cleaning solution to at least one wall cleaning nozzle 330 of the barrier wall 112, and operation (b1) may include operation (b12) of adjusting the spray direction of the wall cleaning nozzle 330 toward the barrier wall 112 when the estimated adhesion strength of particles on the barrier wall 112 is higher than a predetermined reference adhesion strength. Therefore, contaminants adhered to the surface of the barrier wall 112 can be directly cleaned using the cleaning solution. At this time, the cleaning strength can be easily adjusted by adjusting the spray strength of the wall cleaning nozzle 330.

[0055] In addition, operation (b1) may include the following operation (b13): when the estimated adhesion strength of the particles on the barrier wall 112 is lower than or equal to a predetermined reference adhesion strength, adjusting the spray direction of the wall cleaning nozzle 330 toward the wafer W. Therefore, the sampling solution and the cleaning solution on the wafer W can be dispersed together by centrifugal force to clean the barrier wall 112. Therefore, damage to the barrier wall 112 can be minimized and contaminants on the barrier wall 112 can be removed. At this time, the spray direction adjustment method of the wall cleaning nozzle 330 in operations (b12) and (b13) can be manual or can be an automatic adjustment method connected to a controller.

[0056] In addition, if Figure 8 As shown, operation (b2) may include an operation (b21) of fastening the second housing 320 to the upper portion of the first housing 110, and an operation (b22) of injecting a cleaning solution into the cleaning solution storage portion 310 and supplying the cleaning solution mainly to the barrier wall 112. In more detail, when the cleaning solution is injected into the cleaning solution storage portion 310 using a pump or the like and the cleaning solution fills the space surrounded by the cleaning solution storage portion 310, the covering portion 321, and the barrier wall 112, the overflowed cleaning solution may leak through the gap between the cleaning flow regulating portion 322 and the barrier wall 112 to clean the barrier wall 112.

[0057] At this time, if the sampling solution of the barrier wall 112 remains higher than the reference value after operation (b22), the concentration of the cleaning solution may be too low, and therefore, operation (b2) may include operation (b23) of downwardly adjusting the height of the second housing 320 through the height adjustment portion 323. The height adjustment portion 323 may be a bolt passing through the second housing 320 and the first housing 110. Therefore, the distance between the cleaning flow adjustment portion 322 and the barrier wall 112 can be shortened, so that the flow rate can be increased (the spray intensity can be increased).

[0058] The present invention should not be construed as being limited to the exemplary embodiments described above. The present invention can be applied to a variety of fields and can be modified in various ways by those skilled in the art without departing from the scope of the invention as claimed in the claims. Therefore, it will be apparent to those skilled in the art that these variations and modifications fall within the scope of the present invention.

Claims

1. A wafer sampling solution recovery and cleaning system, the wafer sampling solution recovery and cleaning system being applied to a wafer sampling solution device, the wafer sampling solution device comprising a seating portion and a sampling nozzle, the seating portion allowing a wafer to sit on a surface of the seating portion and rotate the wafer, the sampling nozzle spraying a sampling solution onto the surface of the wafer, the wafer sampling solution recovery and cleaning system comprising: a recovery unit fixed to the seating portion and provided on an outer portion of the wafer to recover the sampling solution on the upper surface of the wafer; as well as a discharge unit receiving the sampling solution from the recovery unit and discharging the received sampling solution to the outside.

2. The wafer sampling solution recovery and cleaning system according to claim 1, wherein: The recovery unit comprises: a sampling solution storage portion, the sampling solution storage portion being a space located at a predetermined depth in which the sampling solution is stored; and A first housing is provided on one side of the sampling solution storage portion and includes a blocking wall extending from the sampling solution storage portion in a vertical direction.

3. The wafer sampling solution recovery and cleaning system according to claim 2, further comprising: a cleaning unit, which sprays a cleaning solution onto the recovery unit to clean the remaining sampling solution; wherein the cleaning unit includes a cleaning solution storage portion which is a space formed at a predetermined depth in the first housing and a second housing coupled to an upper portion of the first housing, The second housing includes a covering portion formed to cover the entire upper surface of the cleaning solution storage portion.

4. The wafer sampling solution recovery and cleaning system according to claim 3, wherein: The second housing includes a cleaning flow regulating portion extending from the covering portion, surrounding an upper end portion of the barrier wall, and spaced apart from the upper end portion of the barrier wall by a predetermined distance.

5. The wafer sampling solution recovery and cleaning system according to claim 4, wherein: The second housing includes a height adjustment portion that adjusts the height of the cleaning flow rate adjustment portion, and The height adjustment portion is a bolt passing through the second housing and the first housing.

6. The wafer sampling solution recovery and cleaning system according to claim 2, wherein: The barrier wall is provided so that one surface of the barrier wall faces the wafer and the sampling solution storage portion, and The one surface of the barrier wall is formed to be inclined at a predetermined angle with respect to the vertical direction.

7. The wafer sampling solution recovery and cleaning system according to claim 2, wherein: The other side portion of the sampling solution storage portion is connected to the discharge unit, and The other side surface is inclined at a predetermined angle with respect to the vertical direction.

8. The wafer sampling solution recovery and cleaning system according to claim 2, wherein: The cleaning unit comprises at least one wall cleaning nozzle for supplying a cleaning solution to the barrier wall, and The wall cleaning nozzle sprays the cleaning solution directly onto the barrier wall.

9. The wafer sampling solution recovery and cleaning system according to claim 2, wherein: The cleaning unit comprises at least one wall cleaning nozzle for supplying a cleaning solution to the barrier wall, and The wall cleaning nozzle sprays the cleaning solution onto the outermost surface of the wafer.

10. The wafer sampling solution recovery and cleaning system according to claim 9, wherein: The spray direction of the wall cleaning nozzle is not perpendicular to the spray direction of the sampling nozzle but forms a predetermined angle.

11. A wafer sample solution recovery and cleaning method using a wafer sample solution recovery and cleaning system, the wafer sample solution recovery and cleaning method comprising: (a) receiving a wafer sampling solution through a recovery unit; (b) cleaning the barrier wall of the recovery unit by a cleaning unit; as well as (c) discharging the sample solution to the outside through a discharge unit.

12. The wafer sampling solution recovery and cleaning method according to claim 11, wherein: (b) include at least one of the following: (b1) determining the spray direction of the cleaning solution; as well as (b2) determining the spray intensity of the cleaning solution, and (b) includes (b3): ​​supplying the cleaning solution to the barrier wall, wherein (b3) is after (b1) or (b2).

13. The wafer sampling solution recovery and cleaning method according to claim 12, wherein: (b1) Includes: (b11) comprising at least one wall cleaning nozzle for supplying the cleaning solution to the barrier wall; (b12) when the estimated adhesion strength of particles on the barrier wall is higher than a predetermined reference adhesion strength, adjusting the spraying direction of the wall cleaning nozzle toward the barrier wall; and (b13) When the estimated adhesion strength of particles on the barrier wall is lower than or equal to the predetermined reference adhesion strength, adjusting the ejection direction of the wall cleaning nozzle toward the wafer.

14. The wafer sampling solution recovery and cleaning method according to claim 12, wherein: (b2) including: (b21) fastening the second housing to the upper portion of the first housing; (b22) injecting the cleaning solution into a cleaning solution storage portion and supplying the cleaning solution mainly to the barrier wall; and (b23) When the sampling solution of the barrier wall is maintained above a reference value, the height of the second housing is downwardly adjusted by a height adjusting portion.

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