High-precision wire bonder for semiconductor manufacturing

Abstract

The application discloses a high-precision wire bonding machine for semiconductor manufacturing and belongs to the technical field of semiconductor manufacturing equipment, comprising a mounting box arranged at the lower part, a plurality of ultrasonic driving plates and a set of cooling mechanisms are arranged in the mounting box, an industrial computer is further arranged in the mounting box, the cooling mechanism comprises two sets of cooling assemblies, a blowing assembly, two sets of gas conveying assemblies and a driving assembly. The cooling mechanism in the application is provided with two sets of cooling assemblies and driving assemblies, the driving assembly drives the two sets of cooling assemblies to operate when running, and then the hot air in the mounting box is quickly discharged, and the heat generated during the operation of the ultrasonic driving plate is timely taken away, so that the performance attenuation, component aging or failure of the ultrasonic driving plate caused by the excessively high temperature are avoided.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and particularly relates to a high-precision wire bonding machine for semiconductor manufacturing. Background Technology

[0002] In the semiconductor manufacturing field, wire bonders are one of the key pieces of equipment, and their performance directly affects the quality and reliability of semiconductor devices. With the rapid development of semiconductor technology, higher demands are being placed on the precision, stability, and efficiency of wire bonders. High-precision wire bonders for semiconductor manufacturing, as core equipment in semiconductor packaging processes, have evolved from traditional thermocompression bonding to ultrasonic bonding. Traditional thermocompression bonding technology connects the wire to the pad through heating and pressure, but it has drawbacks such as a large heat-affected zone and susceptibility to chip damage. Ultrasonic bonding technology, on the other hand, utilizes the energy generated by high-frequency vibrations to achieve welding, offering advantages such as a small heat-affected zone, high weld strength, and suitability for micro-wire bonding. Therefore, it has gradually become the mainstream bonding technology in high-precision semiconductor manufacturing.

[0003] However, existing ultrasonic wire bonding machines still have the following shortcomings: First, the ultrasonic drive board is the core energy component of the ultrasonic wire bonding machine. When the ultrasonic drive board is running, it generates a lot of heat due to power conversion loss and mechanical vibration. Traditional heat dissipation methods mostly use a single fan or heat sink, which has low heat dissipation efficiency and cannot achieve rapid replacement of hot air, resulting in the continuous rise of the ultrasonic drive board temperature, affecting the stability of welding energy, and even causing component aging and failure.

[0004] Secondly, the semiconductor manufacturing environment has high requirements for cleanliness. Particles and contaminants generated during the welding process need to be removed in a timely manner, otherwise they will affect the performance and reliability of semiconductor devices. However, the welding worktable of existing ultrasonic wire bonding machines relies heavily on manual cleaning, which is not only slow, but also makes it easy to leave new contaminants on the welding worktable. Summary of the Invention

[0005] The purpose of this invention is to provide a high-precision wire bonding machine for semiconductor manufacturing, which solves the problems in the prior art.

[0006] Traditional wire bonding machines often use a single fan or heat sink for heat dissipation, which has low heat dissipation efficiency and cannot achieve rapid replacement of hot air. This leads to a continuous increase in the temperature of the ultrasonic drive board, affecting the stability of welding energy and even causing technical problems such as component aging and failure.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A high-precision wire bonding machine for semiconductor manufacturing includes a mounting box located at the bottom. The mounting box houses multiple ultrasonic drive boards and a cooling mechanism. The cooling mechanism includes: two sets of cooling components, both installed inside the mounting box, for conveying air from inside the mounting box to the outside; a purging component for purging the welding worktable of the wire bonding machine with gas; two sets of gas supply components for supplying gas to the purging components; and a drive component for simultaneously operating the two sets of cooling components and the two sets of gas supply components.

[0009] Preferably, the cooling mechanism further includes a drying component, which includes: a drying box placed inside the mounting box, having two first connecting pipes and one second connecting pipe, the first connecting pipes being used to connect to the gas supply component; multiple drying plates, staggeredly installed inside the drying box, with airflow channels formed between the multiple drying plates; and a slot formed on the drying box.

[0010] Preferably, the purging assembly includes: an air storage tank installed inside the mounting box, with a second connector mounted on one side of the tank, the second connector being detachably connected to a second connecting pipe; a bend installed on one side of the air storage tank, with a valve mounted thereon; a fixed cylinder installed at the upper end of the bend; a flexible hose fixedly connected to and communicating with the fixed cylinder; a vertical pipe fixedly connected to and communicating with the flexible hose; and an air nozzle installed at the upper end of the vertical pipe, facing the welding worktable of the wire welding machine.

[0011] Preferably, the cooling mechanism further includes: a guide box, installed on the welding workbench of the wire bonding machine; a first guide groove, formed on one side of the guide box, with the air nozzle slidably connected to the first guide groove; and a second guide groove, formed on the bottom surface of the guide box, with the vertical pipe slidably connected to the second guide groove.

[0012] Preferably, the cooling mechanism further includes a reciprocating assembly, which includes: a reciprocating screw mounted on the top surface of the air storage tank via two vertical plates, one end of which is rotatably connected to the fixed cylinder; a screw nut sleeved on the reciprocating screw and fixedly connected to the lower end of the vertical pipe; a second bevel gear located inside the fixed cylinder and fixedly connected to the reciprocating screw; a rotating rod mounted on the inner wall of the fixed cylinder via a second fixing bracket; a first bevel gear fixedly sleeved on the rotating rod and meshing with the second bevel gear; and a second fan blade mounted on the first bevel gear.

[0013] Preferably, the cooling component includes: a cylinder, which is installed through the bottom surface of the mounting box; a rotating shaft, which is rotatably installed inside the cylinder; a second pulley, which is fixedly sleeved on the rotating shaft; and a first fan blade, which is installed on the rotating shaft.

[0014] Preferably, the gas delivery assembly includes: a first fixed frame, installed on the inner bottom surface of the mounting box; a piston cylinder, installed on the first fixed frame, with a piston plate slidably connected inside, a piston rod installed on the piston plate, the piston rod slidably connected to the piston cylinder, an air extraction pipe and a gas delivery pipe installed on the bottom surface of the piston cylinder, the gas delivery pipe being detachably connected to a first connecting pipe; a push plate, fixedly connected to the upper end of the piston rod, with an arc-shaped groove on its top surface; and a spring, with its two ends respectively connected to the piston cylinder and the push plate.

[0015] Preferably, the drive assembly includes: a drive motor mounted on the inner bottom surface of the mounting box; a shaft fixedly connected to the power output shaft of the drive motor; a first pulley fixedly sleeved on the shaft, the first pulley being connected to two second pulleys respectively via two transmission belts; a cross plate mounted on the upper end of the shaft; and two arc-shaped plates, both mounted on the bottom surface of the cross plate and matching the arc-shaped groove.

[0016] Preferably, the bottom surface of the mounting box is equipped with four sets of support components, each support component including: a threaded post, which is fixedly connected to the bottom surface of the mounting box; a base, which is threadedly connected to the threaded post; a mounting plate, which is sleeved on the threaded post and threadedly connected to the threaded post, and is inserted into the slot; and a caster wheel, which is mounted on the bottom surface of the mounting plate.

[0017] Preferably, the mounting box is hinged with two doors, and air intake grilles are provided on both sides of the mounting box.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0019] 1. The cooling mechanism in this invention is provided with two sets of cooling components and a driving component. When the driving component is running, it will drive the two sets of cooling components to run, thereby quickly expelling the hot air in the installation box and taking away the heat generated by the ultrasonic drive board during operation, so as to avoid the performance degradation, component aging or failure of the ultrasonic drive board due to excessive temperature.

[0020] 2. The cooling mechanism in this invention is equipped with a purging component, two sets of gas supply components, and a drying component. When the driving component is running, it drives the gas supply component to deliver gas into the drying box. After the gas is dried, it enters the gas storage tank for storage. After the valve is opened, the gas in the gas storage tank will enter the gas nozzle through the bend pipe, hose, and vertical pipe, and then be discharged through the gas nozzle. This will purge the welding worktable, remove dust, metal shavings, and other impurities from the welding worktable, prevent impurities from affecting the bonding between the welding wire and the welding surface, reduce welding defects, and improve the quality and reliability of welding in the semiconductor manufacturing process.

[0021] 3. The reciprocating assembly in this invention comprises a reciprocating screw, a screw nut, a second bevel gear, a rotating rod, a first bevel gear, a rotating rod, a first bevel gear, and a second fan blade. When gas enters the fixed cylinder through the bend, it drives the second fan blade to rotate. The first and second bevel gears then drive the reciprocating screw to rotate, which in turn causes the screw nut to drive the vertical pipe and the air nozzle to move horizontally back and forth. This expands the coverage area of ​​the gas blown out by the air nozzle, improves the comprehensiveness of cleaning, further ensures the cleanliness of the welding environment, and provides a guarantee for high-precision welding.

[0022] 4. The cooling mechanism in this invention is equipped with a drive component. The drive component uses a drive motor to drive the shaft to rotate. The shaft and the first fan blade of the cooling component are driven to run through the first pulley, the transmission belt and the second pulley. At the same time, the rotation of the shaft drives the horizontal plate and the arc plate, which pushes the push plate to make the piston cylinder of the gas delivery component reciprocate to deliver gas. This allows heat dissipation and gas delivery to be carried out simultaneously, improving production efficiency and energy utilization. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This invention provides a three-dimensional representation of a high-precision wire bonding machine for semiconductor manufacturing. Figure 1 ;

[0025] Figure 2 This invention provides a three-dimensional representation of a high-precision wire bonding machine for semiconductor manufacturing. Figure 2 ;

[0026] Figure 3 This invention provides a three-dimensional representation of a high-precision wire bonding machine for semiconductor manufacturing. Figure 3 ;

[0027] Figure 4 In this invention Figure 3 Enlarged schematic diagram of part A;

[0028] Figure 5 This is a perspective view of the cooling mechanism in this invention;

[0029] Figure 6 This is a schematic diagram of the assembly structure of the drive motor, rotating shaft, first pulley, second pulley and first fan blade in this invention;

[0030] Figure 7 This is a schematic diagram of the assembly structure of the driving component, gas conveying component and drying component in this invention;

[0031] Figure 8 This is a schematic diagram of the interior of the drying box in this invention;

[0032] Figure 9 This is a schematic diagram of the assembly structure of the purging component and the reciprocating component in this invention;

[0033] Figure 10 This is a schematic diagram of the assembly structure of the reciprocating component and the guide box in this invention;

[0034] Figure 11 In this invention Figure 10 Enlarged schematic diagram of part B;

[0035] Reference numerals: 100, wire bonding machine; 101, mounting box; 102, box door; 103, industrial computer; 104, ultrasonic drive board; 111, threaded column; 112, base; 113, mounting plate; 114, caster wheel; 211, cylinder; 212, shaft; 213, second pulley; 214, first fan blade; 221, drive motor; 222, shaft; 223, first pulley; 224, transmission belt; 225, cross plate; 226, arc plate; 231, first fixing frame; 232, piston cylinder; 233, piston rod; 234, push plate; 235, arc groove; 236, spring; 237, exhaust pipe; 238, gas supply. 241. Pipe; 242. Drying box; 243. First connecting pipe; 244. Second connecting pipe; 245. Drying plate; 246. Airflow channel; 247. Slot; 251. Air storage box; 252. Second connector; 253. Bend; 254. Valve; 255. Fixed cylinder; 256. Hose; 257. Vertical pipe; 258. Air nozzle; 259. Pressure relief valve; 261. Guide box; 262. First guide groove; 263. Second guide groove; 271. Reciprocating screw; 272. Vertical plate; 273. Screw nut; 274. Second bevel gear; 275. Rotating rod; 276. Second fixed frame; 277. First bevel gear; 278. Second fan blade. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0039] This invention is described in detail with reference to the accompanying drawings. When detailing the embodiments of this invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not to scale. Furthermore, the accompanying drawings are merely examples and should not be construed as limiting the scope of protection of this invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0040] Furthermore, it should be noted in the description of this invention that the terms "first," "second," or "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] Unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" in this invention should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; similarly, they can refer to mechanical connections, electrical connections, or direct connections, or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0042] Example 1: As Figure 1 , Figure 2 and Figures 5-9 As shown, a high-precision wire bonding machine for semiconductor manufacturing includes a mounting box 101 located at the bottom. Multiple ultrasonic drive boards 104 and a cooling mechanism are installed inside the mounting box 101. An industrial control computer 103 is also installed inside the mounting box 101. The cooling mechanism includes two sets of cooling components, a purging component, two sets of gas supply components, and a drive component.

[0043] Two hinged doors 102 are mounted on the mounting box 101, and air intake grilles are provided on both sides of the mounting box 101. Both sets of cooling components are installed inside the mounting box 101. The cooling components are used to transport the air inside the mounting box 101 to the outside of the mounting box 101. The purging component is used to purge the welding worktable of the wire bonding machine 100 with gas. Two sets of gas supply components are used to supply gas into the purging component. The drive component is used to drive the two sets of cooling components and the two sets of gas supply components to operate simultaneously.

[0044] Specifically, when the ultrasonic drive board 104 is running, the ultrasonic vibrations it generates cause high-frequency friction between the bonding wire and the welding surface (such as copper foil or silicon chip electrode), which damages the surface oxide layer. At the same time, through plastic deformation, atomic-level bonding is formed between metal atoms, and welding can be completed without additional solder.

[0045] However, the ultrasonic drive board 104 generates heat during operation, and the temperature of the ultrasonic drive board 104 itself and the inside of the wire bonding machine 100 will rise. Therefore, it is necessary to cool down the ultrasonic drive board 104 and the inside of the wire bonding machine 100.

[0046] When it is necessary to cool down the ultrasonic drive board 104, the drive assembly is activated to drive the two sets of cooling components, thereby transporting the hot air inside the mounting box 101 to the outside of the mounting box 101, allowing outside air to enter the mounting box 101 through the air intake grille, accelerating the air circulation speed inside the mounting box 101, improving the heat dissipation efficiency of the ultrasonic drive board 104, and thus facilitating the cooling of the ultrasonic drive board 104.

[0047] Furthermore, when the drive component is running, gas is also supplied to the purging component through the gas supply component. When it is necessary to clean the welding worktable of the wire bonding machine 100, the gas can be discharged through the purging component to purge the welding worktable of the wire bonding machine 100, thereby improving the cleanliness of the welding worktable of the wire bonding machine 100.

[0048] like Figure 7 and Figure 8 As shown, the cooling mechanism also includes a drying assembly, which includes a drying box 241, multiple drying plates 244, and a slot 246. The drying box 241 is placed inside the mounting box 101. The drying box 241 has two first connecting pipes 242 and one second connecting pipe 243. The first connecting pipes 242 are used to connect to the gas supply assembly. The multiple drying plates 244 are staggered inside the drying box 241, and airflow channels 245 are formed between the multiple drying plates 244. The slot 246 is formed on the drying box 241.

[0049] Specifically, the drying plate 244 is an activated carbon adsorption plate. Gas enters the drying box 241 through the first connecting pipe 242, and after contacting the multiple drying plates 244 via the airflow channel 245, the gas is finally discharged through the second connecting pipe 243. As the gas passes through the drying box 241, the multiple drying plates 244 reduce the humidity of the gas.

[0050] like Figures 9-11As shown, the purging assembly includes an air tank 251, a bend 253, a fixing cylinder 255, a hose 256, a vertical pipe 257, and an air nozzle 258. The air tank 251 is installed inside the mounting box 101 and has multiple reinforcing ribs to improve its pressure resistance. A second connector 252 is installed on one side of the air tank 251, which is detachably connected to the second connecting pipe 243. A one-way valve is installed inside the second connector 252 to prevent gas from entering the drying box 241 through the air tank 251. A pressure relief valve 259 is installed on the air tank 251; when the pressure inside the air tank 251 exceeds a preset value, it will automatically release pressure.

[0051] A bend 253 is installed on one side of the air storage tank 251, and a valve 254 is installed on the bend 253; a fixed cylinder 255 is installed at the upper end of the bend 253; a hose 256 is fixedly connected to and communicates with the fixed cylinder 255; a vertical pipe 257 is fixedly connected to and communicates with the hose 256; an air nozzle 258 is installed at the upper end of the vertical pipe 257, and the air nozzle 258 faces the welding worktable of the wire welding machine 100.

[0052] Specifically, the gas supplied by the gas delivery assembly to the drying box 241 enters the gas storage tank 251 through the second connector 252 and is stored there. As gas continuously enters the gas storage tank 251, the gas pressure inside the tank increases. When it is necessary to clean the welding workbench of the wire bonding machine 100, the gas in the gas storage tank 251 is delivered to the vertical pipe 257 through the bend pipe 253 and the hose 256 by opening the valve 254, and then discharged through the air nozzle 258. The gas discharged from the air nozzle 258 will purge the welding workbench of the wire bonding machine 100, thereby improving the cleanliness of the welding workbench.

[0053] like Figure 10 As shown, the cooling mechanism also includes a guide box 261, a first guide groove 262, and a second guide groove 263. The guide box 261 is installed on the welding workbench of the wire bonding machine 100; the first guide groove 262 is formed on one side of the guide box 261, and the air nozzle 258 is slidably connected to the first guide groove 262; the second guide groove 263 is formed on the bottom surface of the guide box 261, and the vertical pipe 257 is slidably connected to the second guide groove 263.

[0054] Specifically, by setting the guide box 261, the vertical tube 257 and the air nozzle 258 can move horizontally along the guide box 261, thereby facilitating the improvement of the coverage range of the gas blown out by the air nozzle 258.

[0055] like Figures 9-11As shown, the cooling mechanism also includes a reciprocating assembly, which includes a reciprocating screw 271, a screw nut 273, a second bevel gear 274, a rotating rod 275, a first bevel gear 277, and a second fan blade 278.

[0056] Two vertical plates 272 are installed on the top surface of the gas storage box 251. A reciprocating screw 271 passes through the two vertical plates 272 and is rotatably connected to the two vertical plates 272. One end of the reciprocating screw 271 passes through the fixed cylinder 255 and is rotatably connected to the fixed cylinder 255.

[0057] A lead screw nut 273 is sleeved on a reciprocating lead screw 271, and the lead screw nut 273 can move horizontally back and forth along the reciprocating lead screw 271. The lead screw nut 273 is fixedly connected to the lower end of the vertical tube 257. The second bevel gear 274 is located inside the fixed cylinder 255 and is fixedly connected to the reciprocating lead screw 271. The rotating rod 275 is mounted on the inner wall of the fixed cylinder 255 through the second fixed bracket 276. The first bevel gear 277 is fixedly sleeved on the rotating rod 275 and meshes with the second bevel gear 274. The second fan blade 278 is mounted on the first bevel gear 277.

[0058] Specifically, when valve 254 is opened, the gas in the gas storage tank 251 enters the fixed cylinder 255 through the bend pipe 253, and then exits from the fixed cylinder 255 through the hose 256. When the gas enters the fixed cylinder 255 through the bend pipe 253, it drives the second fan blade 278 to rotate, which in turn drives the rotating rod 275 and the first bevel gear 277 to rotate, which in turn meshes and drives the second bevel gear 274 to rotate, which in turn drives the reciprocating screw 271 to rotate. When the reciprocating screw 271 rotates, the screw nut 273 moves horizontally back and forth along the reciprocating screw 271.

[0059] like Figure 6 As shown, the cooling assembly includes a cylinder 211, a rotating shaft 212, a second pulley 213, and a first fan blade 214. The cylinder 211 is installed through the bottom surface of the mounting box 101; the rotating shaft 212 is rotatably installed inside the cylinder 211; the second pulley 213 is fixedly sleeved on the rotating shaft 212; and the first fan blade 214 is installed on the rotating shaft 212.

[0060] Specifically, when the shaft 212 rotates, it will drive the first fan blade 214 to rotate. The rotating first fan blade 214 will blow air downwards, thereby quickly transporting the air inside the mounting box 101 to the outside of the mounting box 101.

[0061] like Figure 7As shown, the gas delivery assembly includes a first fixed frame 231, a piston cylinder 232, a push plate 234, and a spring 236. The first fixed frame 231 is installed on the inner bottom surface of the mounting box 101; the piston cylinder 232 is installed on the first fixed frame 231, and a piston plate is slidably connected inside the piston cylinder 232. A piston rod 233 is installed on the piston plate and slidably connected to the piston cylinder 232. An air extraction pipe 237 and a gas delivery pipe 238 are installed on the bottom surface of the piston cylinder 232. The gas delivery pipe 238 is detachably connected to a first connecting pipe 242 through a first connector. The first connector is rotatably connected to the gas delivery pipe and threadedly connected to the first connecting pipe 242. One-way valves are installed in both the air extraction pipe 237 and the gas delivery pipe 238, so that the air in the piston cylinder 232 can only be discharged in one direction through the gas delivery pipe 238. Both the first connector and the second connector 252 are equipped with hand-tightening plates, allowing the first connector to be connected to or disconnected from the first connecting pipe 242, and the second connector to be connected to or disconnected from the second connecting pipe 243, without the aid of tools. The second connector 252 is rotatably connected to the air inlet pipe of the air storage tank 251, and the second connector 252 is threadedly connected to the second connecting pipe 243.

[0062] The push plate 234 is fixedly connected to the upper end of the piston rod 233, and the top surface of the push plate 234 is provided with an arc groove 235; the two ends of the spring 236 are respectively connected to the piston cylinder 232 and the push plate 234.

[0063] Specifically, when the push plate 234 is pressed down, it causes the piston rod 233 and piston plate to move downwards, thereby delivering air from the piston cylinder 232 to the drying box 241 via the air supply pipe 238. When the push plate 234 is moved upwards, it causes the piston rod 233 and piston plate to move upwards, thereby allowing outside air to enter the piston cylinder 232 via the air extraction pipe 237. By intermittently pressing the push plate 234 and cooperating with the spring 236, air can be continuously delivered into the drying box 241 through the piston cylinder 232.

[0064] like Figures 5-7 As shown, the drive assembly includes a drive motor 221, a shaft 222, a first pulley 223, a cross plate 225, and two arc-shaped plates 226.

[0065] The drive motor 221 is installed on the inner bottom surface of the mounting box 101; the shaft 222 is fixedly connected to the power output shaft of the drive motor 221; the first pulley 223 is fixedly sleeved on the shaft 222, and the first pulley 223 is connected to two second pulleys 213 respectively through two transmission belts 224; the horizontal plate 225 is installed on the upper end of the shaft 222; the two arc plates 226 are both installed on the bottom surface of the horizontal plate 225, and the arc plates 226 match the arc groove 235.

[0066] Specifically, when the drive motor 221 is running, it will drive the shaft 222 to rotate, which in turn drives the first pulley 223 to rotate, which in turn drives the two second pulleys 213 to rotate via the two transmission belts 224, which in turn drives the two rotating shafts 212 and the two first fan blades 214 to rotate. The rotating first fan blades 214 will blow air downwards, thereby quickly transporting the air inside the mounting box 101 to the outside of the mounting box 101.

[0067] When the shaft 222 rotates, it will also drive the horizontal plate 225 and the two arc plates 226 to rotate. When the arc plate 226 contacts the push plate 234, it will push the push plate 234 to move downward. When the arc plate 226 separates from the push plate 234, the rebound force of the spring 236 will push the push plate 234 to move upward.

[0068] Working principle: In practical use, when it is necessary to cool down the ultrasonic drive board 104 and industrial computer 103 inside the mounting box 101, the drive motor 221 is started, which drives the shaft 222 to rotate, thereby driving the first pulley 223 to rotate, which in turn drives the two second pulleys 213 to rotate via the two transmission belts 224, which in turn drives the two rotating shafts 212 and the two first fan blades 214 to rotate. The rotating first fan blades 214 blow air downwards, thereby quickly transporting the air inside the mounting box 101 to the outside of the mounting box 101, allowing outside air to enter the mounting box 101 through the air intake grille, accelerating the air circulation speed inside the mounting box 101, improving the heat dissipation efficiency of the ultrasonic drive board 104, and thus facilitating the cooling of the ultrasonic drive board 104.

[0069] Furthermore, when the shaft 222 rotates, it will also drive the horizontal plate 225 and the two arc plates 226 to rotate. When the arc plate 226 contacts the push plate 234, it will push the push plate 234 to move downward. When the arc plate 226 separates from the push plate 234, the rebound force of the spring 236 will push the push plate 234 to move upward.

[0070] With the cooperation of the rotating arc plate 226 and the spring 236, the piston cylinder 232 continuously supplies air into the drying box 241 through the air supply pipe 238. After entering the drying box 241, the air passes through the airflow channel 245, contacts multiple drying plates 244, and is discharged through the second connecting pipe 243. The air discharged through the second connecting pipe 243 enters the air storage box 251 for storage. As air continuously enters the air storage box 251, the air pressure inside the air storage box 251 increases.

[0071] When the welding worktable of the wire bonding machine 100 needs to be cleaned, the air in the air storage tank 251 is delivered to the vertical pipe 257 through the bend pipe 253 and the hose 256 by opening the valve 254, and then discharged through the air nozzle 258. The air discharged from the air nozzle 258 will blow and clean the welding worktable of the wire bonding machine 100, removing dust, metal shavings and other impurities from the welding worktable, preventing impurities from affecting the bonding between the wire and the welding surface, reducing welding defects, and improving the quality and reliability of welding in the semiconductor manufacturing process.

[0072] Furthermore, when air enters the fixed cylinder 255 through the bend 253, it drives the second fan blade 278 to rotate, which in turn drives the rotating rod 275 and the first bevel gear 277 to rotate, which in turn meshes with and drives the second bevel gear 274 to rotate, which in turn drives the reciprocating screw 271 to rotate. When the reciprocating screw 271 rotates, the screw nut 273 will move horizontally back and forth along the reciprocating screw 271, which in turn drives the vertical rod and the air nozzle 258 to move horizontally back and forth. This facilitates the improvement of the coverage of the air blown out by the air nozzle 258, ensuring that all areas of the welding workbench can be effectively cleaned, improving the comprehensiveness of cleaning, further ensuring the cleanliness of the welding environment, and providing a guarantee for high-precision welding.

[0073] When the gas passes through the drying box 241, the drying plate 244 inside the drying box 241 will reduce the humidity of the gas, thereby ensuring that the gas entering the gas storage box 251 and used for purging is dry, avoiding the condensation of humid gas on the welding workbench or affecting the metal surface, and preventing welding defects caused by moisture.

[0074] Example 2: As Figure 3 , Figure 4 and Figure 7 As shown, while all other parts are the same as in Example 1, the difference between this example and Example 1 is that:

[0075] Four support components are mounted on the bottom surface of the mounting box 101. These components include threaded posts 111, a base 112, a mounting plate 113, and casters 114. The threaded posts 111 are fixedly connected to the bottom surface of the mounting box 101; the base 112 is threadedly connected to the threaded posts 111; the mounting plate 113 is fitted onto and threadedly connected to the threaded posts 111; and the mounting plate 113 engages with the slots 246 on the drying box 241. The casters 114 are mounted on the bottom surface of the mounting plate 113.

[0076] Specifically, when the ground is uneven, the position of the base 112 on the threaded post 111 is changed by rotating the corresponding base 112, thereby adjusting the height of one corner of the mounting box 101, so that the device can be placed stably on the ground.

[0077] Working principle: In actual use, when it is necessary to move this device, open the box door 102 to separate the first connector from the first connecting pipe 242 and the second connector 252 from the second connecting pipe 243, so that the drying box 241 is unrestricted, and then take the drying box 241 out of the installation box 101.

[0078] The slot 246 on the drying box 241 is fitted onto the mounting plate 113. By rotating the drying box 241, the mounting plate 113 is rotated, causing the mounting plate 113 to move downwards along the threaded post 111. This causes the casters 114 on the mounting plate 113 to contact the ground, separating the base 112 from the ground. Because the connection between the drying box 241 and the mounting plate 113 increases the lever arm, it is easier to rotate the drying box 241 onto the mounting plate 113.

[0079] Repeat the above operation to bring the other three casters 114 into contact with the ground, thereby making the device easier to push and improving its flexibility.

[0080] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0081] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision wire bonding machine for semiconductor manufacturing, comprising a mounting box located at the bottom, wherein multiple ultrasonic drive boards and a cooling mechanism are installed inside the mounting box, characterized in that... The cooling mechanism includes: Both sets of cooling components are installed inside the mounting box to transport the air inside the mounting box to the outside of the mounting box; A purging assembly for purging the welding worktable of the wire bonding machine with gas; Two sets of gas delivery components are used to deliver gas into the purging component; A drive assembly is used to drive the two sets of cooling assemblies and the two sets of gas supply assemblies to operate simultaneously. The purging assembly includes: A gas storage tank is installed inside the mounting box, and a second connector is installed on one side of the tank. The second connector is detachably connected to a second connecting pipe. A bend is installed on one side of the gas storage tank, and a valve is mounted on it; A fixed cylinder is installed at the upper end of the bend; The hose is fixedly connected to and communicates with the fixed cylinder; A vertical pipe is fixedly connected to and communicates with the flexible hose; An air nozzle is installed at the upper end of the vertical pipe, facing the welding worktable of the wire bonding machine; The cooling mechanism also includes: A guide box is installed on the welding worktable of the wire bonding machine; A first guide groove is formed on one side of the guide box, and the air nozzle is slidably connected to the first guide groove; The second guide groove is formed on the bottom surface of the guide box, and the vertical tube is slidably connected to the second guide groove; The cooling mechanism further includes a reciprocating component, the reciprocating component comprising: A reciprocating lead screw is mounted on the top surface of the gas storage tank via two vertical plates, and one end of the screw is rotatably connected to the fixed cylinder. A lead screw nut is fitted onto the reciprocating lead screw and is fixedly connected to the lower end of the vertical pipe; The second bevel gear is located inside the fixed cylinder and is fixedly connected to the reciprocating lead screw. The rotating rod is mounted on the inner wall of the fixed cylinder via a second fixing bracket; The first bevel gear is fixedly sleeved on the rotating rod and meshes with the second bevel gear. The second blade is mounted on the first bevel gear; The cooling component includes: A cylindrical tube is installed through the bottom surface of the mounting box; The rotating shaft is rotatably mounted inside the cylinder; The second pulley is fixedly sleeved on the rotating shaft; The first blade is mounted on the rotating shaft; The gas delivery assembly includes: The first fixing bracket is installed on the inner bottom surface of the mounting box; A piston cylinder is mounted on the first fixed frame, and a piston plate is slidably connected inside it. A piston rod is mounted on the piston plate and slidably connected to the piston cylinder. An air extraction pipe and an air delivery pipe are mounted on the bottom surface of the piston cylinder, and the air delivery pipe is detachably connected to the first connecting pipe. A push plate is fixedly connected to the upper end of the piston rod, and an arc-shaped groove is provided on its top surface; A spring, the two ends of which are connected to the piston cylinder and the push plate, respectively; The driving component includes: The drive motor is installed on the inner bottom surface of the mounting box; The shaft is fixedly connected to the power output shaft of the drive motor; The first pulley is fixedly sleeved on the shaft, and the first pulley is connected to two second pulleys respectively through two transmission belts; A horizontal plate is installed at the upper end of the shaft; Two arc-shaped plates are installed on the bottom surface of the horizontal plate and match the arc-shaped groove.

2. The high-precision wire bonding machine for semiconductor manufacturing according to claim 1, characterized in that, The cooling mechanism further includes a drying component, which includes: A drying box, placed inside the mounting box, has two first connecting pipes and one second connecting pipe, the first connecting pipes being used to connect to the gas delivery assembly; Multiple drying plates are staggered and installed inside the drying box, forming airflow channels between the multiple drying plates; A card slot is provided on the drying box.

3. The high-precision wire bonding machine for semiconductor manufacturing according to claim 2, characterized in that, The bottom surface of the mounting box is equipped with four sets of support components, the support components including: A threaded post is fixedly connected to the bottom surface of the mounting box; The base is threadedly connected to the threaded post; The mounting plate is sleeved on the threaded post and threadedly connected to the threaded post, and is inserted into the slot. The casters are mounted on the bottom surface of the mounting plate.

4. The high-precision wire bonding machine for semiconductor manufacturing according to claim 1, characterized in that, The mounting box is hinged with two doors, and air intake grilles are provided on both sides of the mounting box.

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