Automatic assembly line for electronic products

Abstract

The invention discloses a method for automatically assembling electronic products. The method comprises the following steps that a speed chain-non-speed chain heterogeneous conveying line device is arranged in the direction of a linear assembly line; the conveying device of the non-speed chain and the speed chain are operated cooperatively to achieve closed-loop recycling of the multiple carrier trays; wherein the carrier tray is used for supporting a bottom cover of an electronic product to be assembled and a PCB (Printed Circuit Board) of the electronic product; on the same side of the speed chain-non-speed chain heterogeneous conveying line device, a plurality of devices which are arranged corresponding to multiple sections of modules of the speed chain-non-speed chain heterogeneous conveying line device and aim at operation of all stations are used for implementing operation of the devices in the direction of the linear assembly line so as to achieve automatic assembly of the electronic products. According to the multi-speed chain-non-multi-speed chain heterogeneous conveying line device, all stations of equipment such as dispensing, feeding and welding are arranged along a straight line, and based on all sections of multi-speed chain-non-multi-speed chain heterogeneous conveying line devices, the sequential arrangement of the multi-speed chain-non-multi-speed chain heterogeneous conveying line devices on the straight line can be conveniently and flexibly adjusted so as to meet the requirements of different assembly procedures.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product assembly, in particular to an automatic assembly line and an assembly method for electronic products. Background Art

[0002] The installation process of electronic products includes setting the bottom cover and implementing processes such as electronic component installation, welding and testing. Some processes in this series of processes are completed automatically with the help of corresponding equipment, while others require manual operation. However, the current quality requirements for electronic products are getting higher and higher. In the production process, even if some workstations rely on manual operation, there will be large fluctuations in quality due to the operating level of the personnel. Moreover, manual operation is also inefficient.

[0003] The information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Summary of the Invention

[0004] In view of the shortcomings or defects of the existing technology, an automatic assembly line for electronic products is provided, which can not only effectively reduce manual operations, but also improve efficiency and assembly quality.

[0005] The purpose of the present invention is achieved through the following technical solutions: An automatic assembly line for electronic products, comprising: The double-speed chain-non-double-speed chain heterogeneous conveyor line device is arranged along the straight line direction, wherein: The double-speed chain-non-double-speed chain heterogeneous conveying line device includes a non-double-speed chain conveying device and a double-speed chain; The double-speed chain is used to carry a plurality of carrier trays, and the carrier trays are used to support the bottom cover of the electronic product to be assembled and the PCB board of the electronic product; The non-speed chain conveying device is a conveying device having lower friction characteristics than the speed chain, and the non-speed chain conveying device and the speed chain operate in coordination to achieve closed-loop recycling of multiple carrier trays, wherein the carrier trays are used to support the bottom covers of electronic products to be assembled and the PCB boards of the electronic products; Along the direction of the straight assembly line, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes multi-section modules with adjustable sequence to achieve workstation position adjustment and match the needs of different processes.

[0006] Preferably, the non-speed chain conveying device is a belt conveyor line, or a magnetic levitation guide rail, or an air float guide rail, and the non-speed chain conveying device is located at the lower layer of the speed chain.

[0007] Preferably, when the non-speed chain conveying device is a belt conveyor line, the speed chain is located on the upper layer and the belt conveyor line is located on the lower layer.

[0008] Preferably, the multi-section module includes modules corresponding to different workstations, wherein: The multi-segment modules can not only adjust the sequence, but also add or delete modules to achieve modular expansion or tailoring to meet the needs of different processes.

[0009] Preferably, the two ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device are respectively provided with a first carrier lifting device and a second carrier lifting device along the direction of the straight line; The multiple carrier pallets are used in a closed loop in the non-speed chain conveying device and the speed chain through the first carrier lifting device, the speed chain-non-speed chain heterogeneous conveying line device and the second carrier lifting device.

[0010] Preferably, the first carrier lifting device and the second carrier lifting device are used to realize vertical lifting and lowering of the carrier pallet to form a closed-loop circulation path between the non-speed chain conveying device and the speed chain.

[0011] Preferably, the automatic assembly line further comprises a plurality of devices for operating at each station. The multiple devices are all located on the same side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the direction of the straight assembly line.

[0012] Preferably, the multi-segment module includes modules corresponding to any of the following multiple segments: dispensing segment, loading segment, detection segment, rejection segment, ultrasonic welding segment, and laser punching segment.

[0013] Preferably, the plurality of devices include a dispensing machine, a feeding machine, a material taking module, a load detection device, an NG rejection device, an ultrasonic welding machine, a flipping device, a laser typewriter and a material receiving device, wherein, A dispensing machine, which includes a robot and a dispensing head mounted on the robot for dispensing glue at fixed points; A loader, which provides the cover of electronic products; a material taking module, used for transferring the top cover to the bottom cover; A load detection device, used to detect NG information of the PCB board; NG rejection device, which is used to remove NG electronic product semi-finished products; Ultrasonic welding machine, which uses high-frequency ultrasonic vibration to generate heat at the contact surface of the bottom cover and the top cover to fuse them into one; A turning device, used to turn the bottom cover over so that the bottom cover faces upward; A laser typewriter, which is used for laser typing on the bottom cover; The material collecting device is used to collect electronic products.

[0014] Preferably, the automatic assembly line further comprises: A blocking cylinder for preventing the carrier pallet from moving in the conveying direction along the straight line direction; The lifting and positioning device is used to temporarily separate the carrier pallet from the speed chain and fix the position of the carrier pallet in the vertical direction.

[0015] In addition, the present invention also discloses an automatic assembly line for electronic products, comprising: A double-speed chain-non-double-speed chain heterogeneous conveyor line device is arranged along the straight line direction and is provided with multiple carrier trays supporting the bottom covers of electronic products to be assembled and their PCB boards; A dispensing machine is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the straight line direction; A loader is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction, and provides the cover of the electronic product; A material taking module is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the straight line direction, and is used to transfer the top cover to the bottom cover; A load detection device is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction and is energized with the contact of the carrier tray to detect NG information of the PCB board; An NG rejection device is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction and is used to clamp out NG electronic product semi-finished products; The ultrasonic welding machine is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction, and is used to generate heat on the contact surface of the bottom cover and the top cover based on the high-frequency vibration of ultrasound to fuse them into one.

[0016] Preferably, the material taking module includes a coating machine for applying glue inside the cover.

[0017] Preferably, the dispensing machine includes a robot and a dispensing head mounted on the robot for dispensing glue at fixed points.

[0018] Preferably, the robot is a horizontal robot.

[0019] Preferably, the electronic product automatic assembly line further includes: A flipping device is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the direction of the straight line, and is used to flip the bottom cover so that the bottom cover faces upward.

[0020] Preferably, the automatic assembly line for electronic products further comprises a laser typewriter, which is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction and is used for laser typing on the bottom cover.

[0021] Preferably, the electronic product automatic assembly line further includes: The material collecting device is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the direction of the straight assembly line, and is used to collect electronic products.

[0022] Preferably, the electronic product automatic assembly line further includes: A blocking cylinder for preventing the carrier pallet from moving in the conveying direction along the straight line direction; The lifting and positioning device is used to temporarily separate the carrier pallet from the speed chain and fix the position of the carrier pallet in the vertical direction.

[0023] Preferably, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes: The upper layer has a double-speed chain and the lower layer has a belt conveyor line. The upper double-speed chain includes a pair of guide rails, which extend straight along the conveying direction.

[0024] Preferably, the carrier tray has a recess adapted to fit the bottom cover.

[0025] Preferably, the loading machine comprises, The material taking module puts the blister box filled with the face cover into the material clamp. Blister box separation mechanism, which separates the multi-layer boxes one by one, A belt servo module is used to transport the cover and perform secondary positioning.

[0026] Preferably, the picking module comprises an XY axis module, which moves the cover to an assembly position in the carrier tray.

[0027] Preferably, the load detection device includes a conductive component for electrically connecting to the carrier tray and a load meter for detecting NG, and the conductive component includes a probe that touches a contact of the carrier tray to energize the probe.

[0028] Preferably, the flipping device includes a clamping claw for clamping the electronic product and a rotary cylinder for rotating 180° to flip the electronic product, and the laser coder is a two-degree-of-freedom laser coder.

[0029] Preferably, the automatic assembly line for electronic products further comprises a display screen for displaying assembly information.

[0030] In addition, the present invention also discloses a method for automatic assembly of electronic products, comprising the following steps: Arrange a double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line; wherein the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes a non-double-speed chain conveyor device and a double-speed chain, and, along the straight line, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes multiple sections of modules with adjustable sequence to achieve station position adjustment and match the requirements of different processes; The non-double-speed chain conveying device and the double-speed chain are operated in coordination to realize closed-loop recycling of multiple carrier pallets; wherein the carrier pallets are used to support the bottom cover of the electronic product to be assembled and the PCB board of the electronic product; On the same side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device, multiple devices for operating at each workstation are set up correspondingly using the multi-section modules of the double-speed chain-non-double-speed chain heterogeneous conveyor line device. The operations of each device are carried out along the direction of the straight assembly line to realize the automatic assembly of electronic products.

[0031] Preferably, The multi-segment modules can not only adjust the sequence, but also add or delete modules to achieve modular expansion or tailoring to meet the needs of different processes.

[0032] Preferably, The multi-segment module includes modules corresponding to any of the following multiple segments: dispensing segment, loading segment, detection segment, rejection segment, ultrasonic welding segment, and laser punching segment.

[0033] Preferably, The two ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device are respectively provided with a first carrier lifting device and a second carrier lifting device along the direction of the straight line; The multiple carrier pallets are used in a closed loop in the non-speed chain conveying device and the speed chain through the first carrier lifting device, the speed chain-non-speed chain heterogeneous conveying line device and the second carrier lifting device.

[0034] Preferably, The first carrier lifting device and the second carrier lifting device are used to realize the vertical lifting and lowering of the carrier pallet to form a closed-loop circulation path between the non-speed chain conveying device and the speed chain.

[0035] Preferably, The multiple devices include a dispensing machine, a loader, a material taking module, a load detection device, an NG rejection device, an ultrasonic welding machine, a flipping device, a laser typewriter and a material receiving device.

[0036] Preferably, the method further comprises the following steps: Use a dispensing machine to dispense glue on the bottom cover and PCB board at fixed points; Load the cover of electronic products through the loader; The surface cover is transferred onto the bottom cover by a material taking module, and the coating machine applies glue inside the surface cover; The contacts of the load detection device and the carrier tray are energized to detect the NG information of the PCB board. If the NG information is displayed, the NG rejection device will clamp out the bottom cover and PCB board with the NG information; The ultrasonic welding machine uses the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into electronic products.

[0037] Preferably, the method further comprises the following steps: Use the turning device to turn the bottom cover upward.

[0038] Preferably, the method further comprises the following steps: Laser marking is performed on the bottom cover using a laser typewriter.

[0039] Preferably, the method further comprises the following steps: The electronic products are sent to the next workstation through the receiving device.

[0040] In addition, the present invention also discloses a method for automatic assembly of electronic products, comprising: The double-speed chain and non-double-speed chain heterogeneous conveyor line devices are arranged in a straight line for assembly line operation. Multiple carrier trays on the assembly line place the bottom covers and PCB boards of electronic products to be assembled. The glue dispensing machine dispenses glue on the bottom cover and PCB board at fixed points; The loader loads the front cover of the electronic product, the material taking module transfers the front cover to the bottom cover, and the coating machine applies glue inside the front cover; The load detection device and the contact of the carrier tray are energized to detect the NG information of the PCB board. If the NG information is displayed, the NG rejection device will clamp out the bottom cover and PCB board with the NG information; The ultrasonic welding machine uses the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into electronic products. The turning device turns the bottom cover upward, and the laser typewriter types on the bottom cover with a laser.

[0041] Compared with the prior art, the present invention has the following characteristics: Regarding the automatic assembly line of electronic products, the present invention proposes a scheme of combining a linear assembly line layout with free adjustment of each section. The speed chain-non-speed chain heterogeneous conveying line device with a linear assembly line layout makes the various equipment stations such as dispensing, loading, welding, etc. arranged along a straight line, and the speed chain-non-speed chain heterogeneous conveying line device based on each section is convenient for flexible adjustment of the order of each on the straight line to adapt to the needs of different assembly processes, thereby reducing manual operation; the speed chain-non-speed chain heterogeneous conveying line device not only uses the speed chain mainly to convey the components to be assembled, but also realizes the recycling of the multiple carrier pallets through the coordinated operation of the non-speed chain conveying device and the speed chain, and in such recycling, the non-speed chain heterogeneous conveying line device has the characteristic of lower friction characteristics than the speed chain, and also overcomes the defects of higher speed chain wear and higher potential speed chain failure rate of the full speed chain solution when all speed chains are used to realize the recycling of multiple carrier pallets due to the widespread existence of high friction in the entire closed loop.

[0042] The above description is only an overview of the technical solution of the present invention. In order to make the technical means of the present invention clearer and easier to understand, so that those skilled in the art can implement it according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are illustrated below. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Various other advantages and benefits of the present invention will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are intended only to illustrate preferred embodiments and are not to be construed as limiting the present invention. It should be understood that the drawings described below are merely examples of the present invention, and that those skilled in the art will be able to derive other drawings from these drawings without inventive effort. Throughout the drawings, identical reference numerals are used to denote identical components.

[0044] In the attached figure: Figure 1 A schematic structural diagram of an automatic assembly line for electronic products according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a double-speed chain and non-double-speed chain heterogeneous conveyor line device for an automatic assembly line of electronic products in one embodiment of the present invention; Figure 3A 、 Figure 3B Structural schematic diagrams of two embodiments of the present invention, respectively, of an automatic assembly line for electronic products without an anti-rebound device and with an additional anti-rebound device; Figure 4 This is a schematic structural diagram of a carrier lifting device for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 5 A schematic structural diagram of a dispensing machine for an automatic assembly line structure of electronic products according to one embodiment of the present invention; Figure 6 A schematic structural diagram of a loader for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 7 This is a structural schematic diagram of a material taking module of an automatic assembly line for electronic products according to one embodiment of the present invention; Figure 8 This is a schematic structural diagram of a load detection device for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 9 This is a schematic structural diagram of an NG rejection device for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 10 A schematic structural diagram of an ultrasonic welding machine for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 11 This is a schematic structural diagram of a turning device for an automatic assembly line of electronic products according to one embodiment of the present invention; Figure 12 A schematic structural diagram of a laser typewriter for an automatic assembly line of electronic products according to an embodiment of the present invention; Figure 13 A schematic structural diagram of a material receiving device of an automatic assembly line for electronic products according to one embodiment of the present invention; Figure 14 1 is a flow chart of a method for automatic assembly of electronic products according to one embodiment of the present invention; The present invention will be further explained below with reference to the accompanying drawings and embodiments.

[0045] The meanings of the reference numerals are as follows: 1- double-speed chain-non-double-speed chain heterogeneous conveyor line device; 2- material receiving trough; 3- load meter; 4- carrier lifting device; 5- display screen; 6- glue dispenser; 7- robot; 8- loader; 9- load detection device; 10- NG rejection device; 11- ultrasonic welding machine; 12- material receiving device; 13- laser typewriter; 14- material taking module; 15- flipping device. DETAILED DESCRIPTION

[0046] The following will refer to the attached Figures 1 to 14 Specific embodiments of the present invention will now be described in greater detail. Although specific embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention may be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to facilitate a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0047] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the difference in the functions of the components as the criterion for distinction. As mentioned throughout the specification and claims, "including" or "comprising" is an open term, so it should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present invention, but the description is based on the general principles of the specification and is not intended to limit the scope of the invention. The scope of protection of the present invention shall be as defined in the attached claims.

[0048] To facilitate understanding of the embodiments of the present invention, several specific embodiments will be further explained below with reference to the accompanying drawings. However, the accompanying drawings do not limit the embodiments of the present invention.

[0049] In one embodiment, the present invention discloses an automatic assembly line for electronic products, comprising: The double-speed chain-non-double-speed chain heterogeneous conveyor line device is arranged along the straight line direction, wherein: The double-speed chain-non-double-speed chain heterogeneous conveying line device includes a non-double-speed chain conveying device and a double-speed chain; The double-speed chain is used to carry a plurality of carrier trays, and the carrier trays are used to support the bottom cover of the electronic product to be assembled and the PCB board of the electronic product; The non-speed chain conveying device is a conveying device having lower friction characteristics than the speed chain, and the non-speed chain conveying device and the speed chain operate in coordination to achieve closed-loop recycling of multiple carrier trays, wherein the carrier trays are used to support the bottom covers of electronic products to be assembled and the PCB boards of the electronic products; Along the direction of the straight assembly line, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes multi-section modules with adjustable sequence to achieve workstation position adjustment and match the needs of different processes.

[0050] For the above embodiment, taking the assembly of electronic products such as power adapters (other electronic products are similar) as an example, the flexible and adjustable assembly line disclosed in this embodiment can obviously overcome the high cost of implementing a set of assembly lines for different models of power adapters (other electronic products are similar); this is due to the linear layout and the flexible adjustment capabilities of each section, which directly improves the production flexibility and reconfiguration capabilities of the equipment; the linear assembly line layout and the circulating conveying carrier pallet and the flexible adjustment of each section module not only significantly shorten the assembly cycle and improve the configuration flexibility, but also a single assembly line can effectively reduce multiple manual operations, and the double-speed chain-non-double-speed chain heterogeneous conveyor line device also reduces the double-speed chain wear and failure rate. It can be understood that these advantages are derived from: This embodiment proposes a solution that combines a linear assembly line layout with free adjustment of each section. The double-speed chain-non-double-speed chain heterogeneous conveyor line device in a linear assembly line layout enables each equipment station, such as dispensing, loading, welding, etc., to be arranged along a straight line. Moreover, based on the double-speed chain-non-double-speed chain heterogeneous conveyor line device of each section, it is convenient to flexibly adjust the order of each on the straight line to meet the requirements of different assembly processes, thereby reducing manual operations. At the same time, each of the electronic product automatic assembly lines after all flexible adjustments is equivalent to realizing a non-standard equipment for different process requirements; The double-speed chain-non-double-speed chain heterogeneous conveyor line device not only utilizes the double-speed chain mainly for conveying the components to be assembled, but also realizes the recycling of the multiple carrier pallets through the coordinated operation of the non-double-speed chain conveying device and the double-speed chain, and in such recycling, the non-double-speed chain heterogeneous conveyor line device has the characteristic of lower friction characteristics than the double-speed chain, and also overcomes the defect of higher double-speed chain wear and higher potential double-speed chain failure rate caused by the widespread existence of higher friction in the entire closed loop when all double-speed chains are used to realize the recycling of multiple carrier pallets. This is because, compared with the double-speed chain-non-double-speed chain heterogeneous conveyor line device of the present invention, if the full-speed chain conveyor line device is used to realize the recycling of carrier pallets, then the full-speed chain conveyor line device will all be directly driven by the chain, and the power loss will be concentrated at any point of the friction between the chain and the guide rail, resulting in the defect of higher double-speed chain wear and higher potential double-speed chain failure rate of the full-speed chain solution.

[0051] In another embodiment, the multi-section module includes modules corresponding to different workstations, wherein: The multi-segment modules can not only adjust the sequence, but also add or delete modules to achieve modular expansion or tailoring to meet the needs of different processes.

[0052] Compared to the embodiment described above, this embodiment further implements the ability to add or delete modules within a multi-segment module to achieve modular expansion or tailoring. It is understood that each time any module within a multi-segment module is added or deleted, the corresponding devices at the corresponding workstation, such as glue dispensers and inspection machines, can be added or deleted to match the needs of different processes. Naturally, such devices as glue dispensers and inspection machines can also be integrated with each segment module to more efficiently achieve modular expansion or tailoring, or adjust the order of the modules within each segment.

[0053] In another embodiment, the non-speed chain conveying device is a belt conveyor line, or a magnetic levitation guide rail, or an air floating guide rail, and the non-speed chain conveying device is located at the lower layer of the speed chain.

[0054] It should be noted that, since the non-speed chain conveying device in the present invention has lower friction characteristics than the speed chain, no matter whether the non-speed chain conveying device is a belt conveyor line, a magnetic levitation guide rail, or an air-floating guide rail, it has the advantages of lower speed chain wear and lower potential failure rate of the speed chain compared to the full-speed chain conveyor line device to achieve the recycling of the carrier pallet. Among them, the cost of the belt conveyor line is lower than that of the magnetic levitation guide rail or the air-floating guide rail, and it is also easier to achieve. Moreover, the belt conveyor line works in conjunction with the speed chain to reduce chain wear while also reducing energy consumption compared to the full-speed chain conveyor line device. When a belt conveyor line is used, the belt conveyor line drives the belt through a servo motor, and works in conjunction with the speed chain to achieve the recycling of the carrier pallet. The magnetic levitation guide rail or the air-floating guide rail has a floating characteristic, so it can also reduce friction compared to the full-speed chain conveyor line device. In this case, the carrier pallet can be transported contactlessly through electromagnetic induction or air film support, and can adapt to high clean environment requirements, with low noise and easy to increase the conveying speed.

[0055] Furthermore, the non-speed chain conveying device is a conveying device based on a robotic arm.

[0056] In this case, while a robotic arm-based conveyor system is more expensive, it can easily grasp the reusable carrier pallet using a multi-degree-of-freedom robotic arm and deliver it directly to the corresponding position in the double-speed chain. Furthermore, it offers high flexibility and can adapt to nonlinear production line layouts. Even if the automated assembly line described in this invention is fixed to the ground, the station sequence can be dynamically adjusted by modifying the robotic arm's program.

[0057] In another embodiment, when the non-speed chain conveying device is a belt conveyor line, the speed chain is located on the upper layer and the belt conveyor line is located on the lower layer.

[0058] In another embodiment, the two ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device are respectively provided with a first carrier lifting device and a second carrier lifting device along the direction of the linear assembly line; The multiple carrier pallets are used in a closed loop in the non-speed chain conveying device and the speed chain through the first carrier lifting device, the speed chain-non-speed chain heterogeneous conveying line device and the second carrier lifting device.

[0059] In another embodiment, the first carrier lifting device and the second carrier lifting device are used to realize vertical lifting and lowering of the carrier pallet to form a closed-loop circulation path between the non-speed chain conveying device and the speed chain.

[0060] In another embodiment, the automatic assembly line further comprises a plurality of devices for operating at each station. The multiple devices are all located on the same side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the direction of the straight assembly line.

[0061] It can be understood that this can shorten the physical distance between multiple devices, avoid repeated lateral movement of the workpiece on different sides, and reduce the complexity and energy consumption of mechanical actions. Exemplarily, the multiple devices operated at each station correspond one-to-one to the multiple-segment modules.

[0062] In another embodiment, the multi-segment module includes modules corresponding to any of the following multiple segments: dispensing segment, loading segment, detection segment, rejection segment, ultrasonic welding segment, and laser punching segment.

[0063] In another embodiment, the plurality of devices include a dispensing machine, a loader, a material taking module, a load detection device, an NG rejection device, an ultrasonic welding machine, a flipping device, a laser typewriter and a material receiving device, wherein, A dispensing machine, which includes a robot and a dispensing head mounted on the robot for dispensing glue at fixed points; Loading machine, which provides the cover of electronic products; a material taking module, used for transferring the top cover to the bottom cover; A load detection device, used to detect NG information of the PCB board; NG rejection device, which is used to remove NG electronic product semi-finished products; Ultrasonic welding machine, which uses high-frequency ultrasonic vibration to generate heat at the contact surface of the bottom cover and the top cover to fuse them into one; A turning device, used to turn the bottom cover over so that the bottom cover faces upward; A laser typewriter, which is used for laser typing on the bottom cover; The material collecting device is used to collect electronic products.

[0064] Exemplarily, the robot selects a horizontal robot, which is used to drive the dispensing head to achieve precise dispensing of electronic components on the PCB board, reducing glue overflow or leakage; typically, the robot can use existing technology to achieve programmable adjustment of the dispensing path to adapt to the structural requirements of different electronic products. This existing technology will not be elaborated on.

[0065] In another embodiment, the automatic assembly line further comprises: A blocking cylinder for preventing the carrier pallet from moving in the conveying direction along the straight line direction; The lifting and positioning device is used to temporarily separate the carrier pallet from the speed chain and fix the position of the carrier pallet in the vertical direction.

[0066] In another embodiment, the automatic assembly line further comprises: The anti-rebound device is used to prevent the carrier pallet from rebounding due to being blocked by the blocking cylinder due to excessively fast transportation, thus ensuring accurate positioning.

[0067] It can be understood that the blocking cylinder and the lifting and positioning device are used to collaboratively achieve two-dimensional positioning of the carrier pallet to enable independent operation of each workstation. The lifting and positioning device and the blocking cylinder are used to precisely control the position of the carrier pallet to avoid assembly errors. This also solves the problems of material positioning deviation and low circulation efficiency in traditional assembly lines, providing two-dimensional positioning guarantees for subsequent processes (such as dispensing and welding). The anti-rebound device further ensures that accurate positioning can still be achieved even if the conveying speed is too fast. When the conveying speed is too fast, if there is no anti-rebound device, the carrier pallet will rebound after being blocked by the blocking cylinder, causing the lifting and positioning device to deviate (for example, the lifting guide shaft in the lifting and positioning device to deviate). If there is an anti-rebound device, since it is used to prevent the carrier pallet from rebounding due to being blocked by the blocking cylinder due to excessive conveying, it can correct the deviation in time by preventing the rebound, ensuring accurate positioning.

[0068] Since the anti-rebound device is used to prevent the carrier tray from rebounding due to being blocked by the blocking cylinder due to excessive transportation, it is better, in another embodiment, The anti-rebound device and the blocking cylinder are located on two opposite sides of the carrier pallet on the double-speed chain.

[0069] It can be understood that the blocking cylinder located on the opposite side of the anti-rebound device causes the carrier pallet to be blocked by the blocking cylinder due to excessive conveying speed. At this time, the carrier pallet moves toward the anti-rebound device due to the blocking of the blocking cylinder.

[0070] By way of example and not limitation, an elastic buffer assembly (e.g., a rubber pad or spring) and a mechanical locking mechanism (e.g., a back-off pawl or a multi-link mechanism) are provided on the side of the anti-rebound device (the side away from the blocking cylinder). When the carrier pallet is suddenly stopped by the blocking cylinder, the elastic buffer assembly absorbs the rebound kinetic energy generated by inertia through compression. In conjunction with the mechanical locking mechanism, this can further prevent the carrier pallet from rebounding due to being blocked by the blocking cylinder due to over-rapid transport. For example, the mechanical locking mechanism, via a back-off pawl or a multi-link mechanism (e.g., a four-link mechanism), can be activated immediately after the elastic buffer assembly is activated, securing the carrier pallet at the target position (e.g., at the corresponding position of the lifting and positioning device, where the lifting and positioning device and the carrier pallet are accurately aligned and the lifting and positioning device will not deflect the carrier pallet), thereby eliminating the risk of inaccurate positioning due to rebound. For example, the blocking cylinder and the anti-rebound device can also share a common air source or hydraulic system, with the locking action of the anti-rebound device triggered by a pressure sensor. For example, upon detecting pressure applied by the blocking cylinder, the anti-rebound device will be activated synchronously.

[0071] In another embodiment, On one side of the carrier pallet, the anti-rebound device includes at least a first and a second anti-rebound device to prevent the carrier pallet from deflecting during the blocking and anti-rebound process. It can be understood that on the opposite side of one side of the carrier pallet, the blocking cylinder can also correspondingly include a first and a second blocking cylinder. In this way, combined with the characteristics that the anti-rebound device and the blocking cylinder are located on two opposite sides of the carrier pallet on the speed chain, this means: on the two opposite sides of the carrier pallet, one side is provided with two blocking cylinders, and the other side is provided with two anti-rebound devices. Even if the carrier pallet rebounds due to being blocked by the blocking cylinders due to excessive transportation, the two blocking cylinders and the two anti-rebound devices can significantly prevent the carrier pallet from deflecting during the blocking and anti-rebound process.

[0072] In another embodiment, the double-speed chain-non-double-speed chain heterogeneous conveyor line device structure can be combined with the non-double-speed chain conveyor device through an upper guide rail (such as an aluminum alloy profile) to ensure stable positioning of the carrier pallet in the height and horizontal directions.

[0073] In another embodiment, the carrier lifting device can realize closed-loop circulation of the carrier through a gear rack combined with a servo module; illustratively, the first and second carrier lifting devices are located at both ends of a double-speed chain-non-double-speed chain heterogeneous conveyor line device, and the carrier pallet is introduced into the carrier lifting device such as a lifting mechanism through a short-stroke belt conveyor, and vertical lifting is achieved with the help of a servo module to lift the carrier pallet from the lower belt conveyor line to the upper double-speed chain, or vice versa.

[0074] In another embodiment, for the loader and the material taking module, the present invention can further realize automatic loading and secondary positioning of the surface cover through the blister box dividing mechanism, wherein the surface cover is accurately transferred to the assembly position of the carrier tray through the XY axis module, avoiding the deviation caused by manual operation and realizing precise material transfer; thus, relying on the linear assembly line layout, the automatic feeding and transfer of materials reduces manual intervention, shortens the assembly cycle, and ensures the alignment accuracy of the surface cover and the bottom cover. Specifically, the blister box sorting mechanism may also include a cylinder for sorting boxes, which transports steam or compressed air to pneumatic actuators (such as cylinders, pneumatic grippers) at different workstations through pipes, and at the same time provides power to the belt servo module, so as to realize automatic loading of the cover through the blister box sorting mechanism, and accurately move the cover to the assembly position of the carrier tray (that is, the position defined by the corresponding X and Y coordinates) through the XY axis module. During this process, it is controlled by a PLC controller and combined with the pressure sensor data of the cylinder to dynamically adjust the operating parameters (such as speed and acceleration) of the belt servo module to avoid overload or energy waste. It can be understood that the components that should be controlled in the present invention can be controlled by a PLC controller or a more advanced existing system, including but not limited to an MES system. The control method can be matched with the specific process of the assembly line. For those skilled in the art, the specific process depends on the assembly process of the specific electronic product. See below. The present invention provides an exemplary method, but it can be understood that the present invention is not limited to a specific method. The technical contribution of the present invention is to propose a new, flexible, adjustable, and convenient automatic assembly line for electronic products for recycling of carrier pallets.

[0075] For better understanding, in another embodiment, Figures 1 to 13 As shown, an automatic assembly line for electronic products includes: The double-speed chain-non-double-speed chain heterogeneous conveyor line device 1 is arranged in a straight line, and the line is provided with a plurality of carrier trays supporting the bottom covers and PCB boards of the electronic products to be assembled; A glue dispensing machine 6 is provided on a first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction, and the glue dispensing machine 6 includes a robot 7 and a glue dispensing head mounted on the robot 7 for dispensing glue at fixed points; A loader 8 is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction, and provides a cover for the power adapter; A material taking module 14 is provided on a first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the linear assembly line direction to transfer the top cover onto the bottom cover. The material taking module 14 includes a coating machine for applying glue inside the top cover. A load detection device 9 is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction and is energized with the contact of the carrier tray to detect NG information of the PCB board; An NG rejection device 10 is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction to clamp out the NG power adapter; The ultrasonic welding machine 11 is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction, so as to utilize the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble the electronic product; A turning device 15 is provided on the first side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line direction to turn the bottom cover upward; The laser typewriter 13 is arranged on the first side of the double-speed chain-non-double-speed chain heterogeneous conveying line device along the straight line direction to laser type on the bottom cover.

[0076] In a preferred embodiment of the electronic product automatic assembly line, a material receiving device 12 is further included, which is arranged on one side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device 1 to deliver the power adapter to the next workstation.

[0077] In a preferred embodiment of the electronic product automatic assembly line, a plurality of double-speed chain-non-double-speed chain heterogeneous conveyor line devices 1 are arranged and extended in a straight line, and the double-speed chain-non-double-speed chain heterogeneous conveyor line devices 1 include: The double-speed chain on the upper level and the belt conveyor on the lower level; The carrier lifting device 4 is located at both ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device 1, connecting the belt conveyor line and the double-speed chain, and is used to realize the circulation operation of the carrier pallet between the double-speed chain and the belt conveyor line; A lifting and positioning device is located on the double-speed chain-non-double-speed chain heterogeneous conveyor line device 1 to position it in the height direction. It can temporarily separate the carrier pallet from the conveyor according to the process requirements to allow each station to operate independently; The blocking cylinder is used to block the carrier tray in the conveying direction and separate the individual workstations.

[0078] It can be understood that, as mentioned above, the lifting and positioning device and the blocking cylinder cooperate to realize the positioning of the carrier pallet in the two dimensions of conveying direction and vertical direction, so that each work station can operate independently and without interfering with the movement of the double-speed chain.

[0079] See also Figure 3A In this embodiment, the automatic assembly line does not need to be equipped with an anti-rebound device. This embodiment is particularly suitable for situations where the carrier pallet is not transported too fast to cause the cylinder to be blocked and cause the carrier pallet to rebound.

[0080] See also Figure 3B In this embodiment, in order to prevent the carrier pallet from rebounding due to the blocking of the cylinder due to the carrier pallet being transported too quickly, the automatic assembly line is additionally provided with an anti-rebound device.

[0081] As mentioned above, the anti-rebound device further ensures accurate positioning even when conveying at excessive speeds. Without an anti-rebound device, the carrier pallet, after being stopped by the blocking cylinder, will rebound during excessive conveying, causing the lifting and positioning device to deflect the carrier pallet (for example, the lifting guide shaft in the lifting and positioning device will deflect the carrier pallet). However, with the anti-rebound device, since it prevents the carrier pallet from rebounding due to the blocking cylinder caused by excessive conveying, it can prevent rebound and promptly correct the deviation, ensuring accurate positioning.

[0082] In a preferred embodiment of the electronic product automatic assembly line, the carrier tray is provided with a tube position adapted to fit the bottom cover.

[0083] In one embodiment, the carrier lifting device 4 is placed at both ends of the double-speed chain and non-double-speed chain heterogeneous conveyor line device 1. The carrier lifting device 4 includes a belt conveyor line and a gear rack servo module. The belt conveyor line acts as a transition, guiding the carrier pallet into the carrier lifting device; the gear rack servo module performs the lifting function.

[0084] See also Figure 6 In the preferred embodiment of the automatic assembly line for electronic products, the feeder 8 includes: A material clip, which stacks the blister boxes filled with face covers in the clip to form a multi-layer box; A blister box separating mechanism separates the multi-layer boxes one by one; illustratively, the blister box separating mechanism includes a box separating cylinder; A belt servo module, which transports the separated blister boxes to a designated location; The material taking module 14 takes the cover out of the separated blister box and performs secondary positioning.

[0085] See further Figure 7 The material taking module 14 includes an XY axis module, which clamps the secondary positioned surface cover through a clamping claw and moves it to the assembly position in the carrier tray through the operation of the screw servo module to achieve the buckling of the surface cover and the bottom cover.

[0086] For example, a blister box sorting mechanism can be described in CN216271711U, a blister box sorting and conveying device, or CN216271997U, a blister box sorting mechanism. Typically, a blister box sorting mechanism includes a separating cylinder that separates multiple blister boxes one by one to obtain separate blister boxes. Similarly, a lifting positioning device can be described in CN203652764U, a lifting positioning device.

[0087] In a preferred embodiment of the electronic product automated assembly line, the load detection device 9 includes a conductive assembly for electrically connecting to the carrier tray and a load meter 3 for detecting failed products. The conductive assembly includes a probe whose contacts, when in contact with the carrier tray, energize the device. It should be noted that the load detection and failed product rejection system of the present invention utilizes the conductive assembly (including the probe) in conjunction with the load meter to detect the electrical properties of the PCB (e.g., short circuits and opens) in real time. This online detection and rejection mechanism significantly improves product yield and reduces rework costs.

[0088] For example, the load detection device detects the electrical performance of the PCB (such as short circuit, open circuit) through a probe. If there is no NG information, the PCB is considered qualified, and the following steps are further implemented through the PLC: The XY axis module grabs the top cover and accurately transfers it to the top of the bottom cover of the carrier tray; The welding head presses the top cover and the bottom cover together, and high-frequency vibration induces melting and fusion to complete the glue-free bonding; The flipping device turns the power adapter 180°, the laser printer marks the product information on the bottom cover, and finally the receiving device sends it to the next workstation.

[0089] In another embodiment, The XY-axis module grasps the face cover using pneumatic grippers or vacuum cups. Specifically, the X-axis (horizontal) and Y-axis (vertical) are linked to move the face cover to the base cover assembly position on the carrier tray. The XY-axis module plans the movement path based on a preset program (such as G-code) to avoid other workstation equipment. If necessary, it can further integrate a vision system (such as a CCD camera) to detect face cover position deviations in real time and dynamically adjust the path using a servo motor. During the face cover movement process, the XY-axis module can be linked to the Z-axis (vertical) lifting mechanism to adjust the face cover height to match the base cover assembly surface.

[0090] In the preferred embodiment of the electronic product automatic assembly line, the flipping device 15 includes a clamping claw for clamping the electronic product and a rotary cylinder for rotating 180° to flip the electronic product, and the laser typewriter 13 is a two-degree-of-freedom laser coder.

[0091] In a preferred embodiment of the electronic product automatic assembly line, a display screen 5 for displaying assembly information is further included, which can display the operating status of the equipment in real time.

[0092] In another embodiment, the lifting and positioning device includes a pair of guide rails, which can guide the carrier pallet in the conveying direction of the double-speed chain and position the carrier pallet to the target position in the vertical direction.

[0093] In another embodiment, the present invention further discloses an assembly method for an automatic assembly line of electronic products, comprising: The double-speed chain-non-double-speed chain heterogeneous conveyor line device 1 is arranged in a straight line for assembly line operation, and multiple carrier trays on the assembly line place the bottom covers and PCB boards of electronic products to be assembled; The glue dispenser 6 dispenses glue at fixed points on the bottom cover and PCB board; The loader 8 loads the cover of the electronic product, the material taking module 14 transfers the cover to the bottom cover, and the coating machine applies glue inside the cover; The load detection device 9 is energized with the contacts of the carrier tray to detect the NG information of the PCB board. If NG information is displayed, the NG rejection device 10 will remove the bottom cover and PCB board or semi-finished electronic product with NG information; The ultrasonic welding machine 11 uses high-frequency ultrasonic vibration to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into an electronic product; The turning device 15 turns the bottom cover upward, and the laser typewriter 13 types on the bottom cover with a laser.

[0094] In one embodiment, the double-speed chain-non-double-speed chain heterogeneous conveyor line device 1 is made of surface-treated extruded aluminum alloy profiles as guide rails, so that the conveying system has very good stability and durability during the conveying process, which is suitable for large-scale continuous production of products. The upper layer includes a double-speed chain, a carrier tray, a lifting and positioning device, and a blocking cylinder, etc. The lower layer uses a belt conveyor line, which forms a closed loop together with the carrier lifting devices 4 on both sides, and the carrier is circulated and utilized. The carrier lifting device 4 is placed at both ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device 1, and is composed of a short-stroke belt conveyor and a gear rack + servo module to realize the circulation and utilization of the carrier. The dispensing head of the dispensing machine 6 is installed on the Z axis of the robot with the debugged program to realize the fixed-point dispensing of electrical components on the PCB board of the power adapter. The loader 8 puts the blister box filled with the cover into the right end material clamp, the cylinder separates the boxes, the lower support plate lifts up to support the bottom box and then falls back, and is transported to the middle position through the belt servo module. The material taking module takes out the product and puts it into the secondary positioning. When the blister box is empty, it will be transported to the left end of the material clamp to be collected together, and will be taken out manually after it is full. The material taking module 14 is composed of an XY axis module. The material is taken out from the secondary positioning and moved to the carrier tray to assemble the lid. In the middle, a self-adhesive sticker should be applied inside the product lid. The load detection device 9 sets the detection parameters on the load meter 3, and the conductive component probe touches the corresponding contact in the carrier tray to be energized. Those detected as NG will be rejected. NG materials flow through the NG rejection device 10, and the clamping claws pick up the items to be rejected and put them into the receiving trough 2 for outflow. The ultrasonic welding machine 11 uses the high-frequency vibration of ultrasound to make the two plastic parts generate heat at the contact surface, thereby fusing them into one. This welding method is fast, clean and efficient. If there is a thin film between the product and the mold to protect the product, the film rolling device can be used to reel in and out. The clamping claws of the flipping device 15 pick up the material and lift the rotary cylinder to rotate 180° to flip the product over. The laser typewriter 13 adjusts the laser head position, determines the product position, and starts typing. The material receiving device 12 takes away the electronic products with typing. It can be understood that after taking them away, they can flow into other subsequent workstations via a belt conveyor line or other conveying system.

[0095] In another embodiment, The conductive component uses a spring-loaded copper alloy probe with a contact pressure of 0.5-1N, a detection voltage of 12V DC, and a detection current range of 0-100mA. In this embodiment, the probe parameters are standardized to ensure the consistency of detection of different batches of PCB boards.

[0096] In another embodiment, The ultrasonic welding machine has an operating frequency of 20 kHz, an amplitude of 50 μm, a welding pressure of 2 kgf, and a welding time of 0.5 s. This embodiment avoids weak welding or material damage caused by parameter deviation.

[0097] In another embodiment, The XY axis module uses a cubic spline interpolation algorithm, with a path speed limit of 0.5m / s and an acceleration limit of 1m / s² to prevent cover deviation caused by high-speed movement. In this embodiment, optimized path planning can reduce vibration during material transfer and improve assembly accuracy.

[0098] In another embodiment, The gripping jaws are silicone-coated, with a clamping force of 3N. The inner surface of the gripping jaws features anti-slip grooves, and the rotational speed of the rotary cylinder is limited to a threshold. In this embodiment, the threshold is designed to prevent damage to electronic products, such as power adapters, during the flipping process while ensuring a smooth transition between the previous and next steps. For example, the threshold is 30° / s.

[0099] In another embodiment, Driven by a rotary cylinder, the gripper first clamps the workpiece. Controlled by a PLC controller, the rotary cylinder rotates the gripper to the target angle, with the rotation speed regulated by a servo motor to ensure that gripping force is maintained during rotation. The gripper's magnetic switch is linked to the rotary cylinder's position sensor (such as a Hall effect sensor) to provide real-time feedback on gripping status and rotation angle, preventing workpiece dropout due to angular deviation. Driven by the rotary cylinder, the gripper rotates the workpiece from its initial position to its target position, with the rotation path also controlled by the PLC controller. If necessary, a vision system can be used for precise positioning. In this way, the flipping mechanism, using the gripper and rotary cylinder, enables 180° flipping of the power adapter, facilitating subsequent bottom cover marking, thus synergizing with the laser printer. The integrated flipping and marking functions reduce the equipment footprint while ensuring consistent marking.

[0100] In another embodiment, Vibration sensors, temperature sensors, current sensors, etc. are deployed in double-speed chain, non-double-speed chain heterogeneous conveyor line devices, cylinders, etc. to monitor the equipment status in real time so that timely maintenance can be carried out when necessary.

[0101] In another embodiment, A rotary cylinder is installed at an appropriate position on the double-speed chain, which further drives the carrier pallet to rotate at a specific angle via a pneumatic motor. A harmonic reducer is used on the rotating axis to further ensure precise control of the rotation angle. In addition, a magnetic encoder (such as a magnetic scale) is embedded in the double-speed chain's guide rail slot. This not only monitors the carrier pallet's position in real time, but also synchronizes the rotation angle of the rotary cylinder to achieve precise dynamic adjustment of the workpiece angle.

[0102] In another embodiment, Both double-speed chain and non-double-speed chain heterogeneous conveyor line devices can be equipped with variable frequency motors. The controller sends speed instructions through the Modbus-TCP protocol, which can achieve adjustment from zero to the target transmission speed.

[0103] In another embodiment, A magnetic attraction block (such as a neodymium iron boron magnet) is installed at the bottom of the carrier pallet, interacting with a limit sensor (such as a Hall effect sensor) on the speed chain. When the carrier pallet approaches the target workstation, the magnetic attraction block triggers the limit sensor, sending a signal to the controller. Combining the limit sensor data with the position of the cylinder's piston rod, the controller uses PID control to control the cylinder's motion trajectory, enabling the lifting and positioning device to vertically position the carrier pallet. At this point, the cylinder can be equipped with a photoelectric encoder to provide real-time feedback on the piston rod position to the controller.

[0104] In addition, see Figure 14 In another embodiment, the present invention further discloses a method for automatic assembly of electronic products, comprising the following steps: Arrange a double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line; wherein the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes a non-double-speed chain conveyor device and a double-speed chain, and, along the straight line, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes multiple sections of modules with adjustable sequence to achieve station position adjustment and match the requirements of different processes; The non-double-speed chain conveying device and the double-speed chain are operated in coordination to realize closed-loop recycling of multiple carrier pallets; wherein the carrier pallets are used to support the bottom cover of the electronic product to be assembled and the PCB board of the electronic product; On the same side of the double-speed chain-non-double-speed chain heterogeneous conveyor line device, multiple devices for operating at each workstation are set up correspondingly using the multi-section modules of the double-speed chain-non-double-speed chain heterogeneous conveyor line device. The operations of each device are carried out along the direction of the straight assembly line to realize the automatic assembly of electronic products.

[0105] Preferably, The multi-segment modules can not only adjust the sequence, but also add or delete modules to achieve modular expansion or tailoring to meet the needs of different processes.

[0106] In another embodiment, The multi-segment module includes modules corresponding to any of the following multiple segments: dispensing segment, loading segment, detection segment, rejection segment, ultrasonic welding segment, and laser punching segment.

[0107] In another embodiment, The two ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device are respectively provided with a first carrier lifting device and a second carrier lifting device along the direction of the straight line; The multiple carrier pallets are used in a closed loop in the non-speed chain conveying device and the speed chain through the first carrier lifting device, the speed chain-non-speed chain heterogeneous conveying line device and the second carrier lifting device.

[0108] In another embodiment, The first carrier lifting device and the second carrier lifting device are used to realize the vertical lifting and lowering of the carrier pallet to form a closed-loop circulation path between the non-speed chain conveying device and the speed chain.

[0109] In another embodiment, The multiple devices include a dispensing machine, a loader, a material taking module, a load detection device, an NG rejection device, an ultrasonic welding machine, a flipping device, a laser typewriter and a material receiving device.

[0110] In another embodiment, the following steps are also included: Use a dispensing machine to dispense glue on the bottom cover and PCB board at fixed points; Load the cover of electronic products through the loader; The surface cover is transferred onto the bottom cover by a material taking module, and the coating machine applies glue inside the surface cover; The contacts of the load detection device and the carrier tray are energized to detect the NG information of the PCB board. If the NG information is displayed, the NG rejection device will clamp out the bottom cover and PCB board with the NG information; The ultrasonic welding machine uses the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into electronic products.

[0111] In another embodiment, the following steps are also included: Use the turning device to turn the bottom cover upward.

[0112] In another embodiment, the following steps are also included: Laser marking is performed on the bottom cover using a laser typewriter.

[0113] In another embodiment, the following steps are also included: The electronic products are sent to the next workstation through the receiving device.

[0114] In addition, in another embodiment, the present invention also discloses a method for automatically assembling electronic products, comprising: The double-speed chain and non-double-speed chain heterogeneous conveyor line devices are arranged in a straight line for assembly line operation. Multiple carrier trays on the assembly line place the bottom covers and PCB boards of electronic products to be assembled. The glue dispensing machine dispenses glue on the bottom cover and PCB board at fixed points; The loader loads the front cover of the electronic product, the material taking module transfers the front cover to the bottom cover, and the coating machine applies glue inside the front cover; The load detection device and the contact of the carrier tray are energized to detect the NG information of the PCB board. If the NG information is displayed, the NG rejection device will clamp out the bottom cover and PCB board with the NG information; The ultrasonic welding machine uses the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into electronic products. The turning device turns the bottom cover upward, and the laser typewriter types on the bottom cover with a laser.

[0115] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0116] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A method for automatic assembly of electronic products, characterized in that: It includes the following steps, Arrange a double-speed chain-non-double-speed chain heterogeneous conveyor line device along the straight line; wherein the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes a non-double-speed chain conveyor device and a double-speed chain, and, along the straight line, the double-speed chain-non-double-speed chain heterogeneous conveyor line device includes multiple sections of modules with adjustable sequence to achieve station position adjustment and match the requirements of different processes; The non-double-speed chain conveying device and the double-speed chain are operated in coordination to realize closed-loop recycling of multiple carrier pallets; wherein, the carrier pallets are used to support the bottom cover of the electronic product to be assembled and the PCB board of the electronic product.

2. The method according to claim 1, wherein Preferably, The multi-segment modules can not only adjust the sequence, but also add or delete modules to achieve modular expansion or tailoring to meet the needs of different processes.

3. The method according to claim 1, wherein The multi-segment module includes modules corresponding to any of the following multiple segments: dispensing segment, loading segment, detection segment, rejection segment, ultrasonic welding segment, and laser punching segment.

4. The method according to claim 1, wherein The two ends of the double-speed chain-non-double-speed chain heterogeneous conveyor line device are respectively provided with a first carrier lifting device and a second carrier lifting device along the direction of the straight assembly line.

5. The method according to claim 1, wherein The first carrier lifting device and the second carrier lifting device are used to realize the vertical lifting and lowering of the carrier pallet to form a closed-loop circulation path between the non-speed chain conveying device and the speed chain.

6. The method according to claim 1, wherein The multiple devices include a dispensing machine, a loader, a material taking module, a load detection device, an NG rejection device, an ultrasonic welding machine, a flipping device, a laser typewriter and a material receiving device.

7. The method according to claim 6, wherein The following steps are also included: Use a dispensing machine to dispense glue on the bottom cover and PCB board at fixed points; Load the cover of electronic products through the loader; The surface cover is transferred onto the bottom cover by a material taking module, and the coating machine applies glue inside the surface cover; The contacts of the load detection device and the carrier tray are energized to detect the NG information of the PCB board. If the NG information is displayed, the NG rejection device will clamp out the bottom cover and PCB board with the NG information; The ultrasonic welding machine uses the high-frequency vibration of ultrasound to generate heat at the contact surface between the bottom cover and the top cover to fuse them into one piece and assemble them into electronic products.

8. The method according to claim 7, wherein It also includes the following steps: Use the turning device to turn the bottom cover upward.

9. The method according to claim 7, wherein It also includes the following steps: Laser marking is performed on the bottom cover using a laser typewriter.

10. The method according to claim 7, wherein: It also includes the following steps: The electronic products are sent to the next workstation through the receiving device.

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