Turntable structure for wafer processing and turntable machine with same

Abstract

The invention relates to the field of chip wafer processing, and particularly discloses a turntable structure for wafer processing and a turntable machine with the same, the turntable structure for wafer processing comprises a mounting seat, the mounting seat is provided with a turntable for positioning a wafer and a U-axis driving part for driving the turntable to stably rotate, and the U-axis driving part is provided with a rotating shaft for driving the turntable to rotate. The table top of the rotary table is horizontally arranged, the table top of the rotary table and a wafer are coaxially arranged, the U-shaft driving part comprises a driving motor and a bearing, one end of the bearing is coaxially connected to an output shaft of the driving motor, and the other end of the bearing is coaxially connected to the rotary table. According to the invention, the method is beneficial to reducing the chipping of the chamfered corners of the wafer, thereby increasing the typesetting number and density of the chips on the wafer, improving the utilization rate, and reducing the cost of wafer production.

Description

Technical Field

[0001] The present application relates to the field of chip wafer processing, and in particular to a turntable structure for wafer processing and a turntable machine with the structure. Background Art

[0002] In today's era of rapid technological advancement, one of the metrics for measuring a country's strength is its level of technological development. Chip technology, in particular, is becoming increasingly important. Chip applications have penetrated numerous key sectors, including consumer electronics, communications, automotive electronics, industrial control, medical equipment, material networks, data centers, artificial intelligence, and aerospace. They have become an indispensable cornerstone of modern information technology, powerfully driving technological innovation and intelligent upgrades across various industries.

[0003] The chip manufacturing process is extremely complex and meticulous, encompassing multiple steps, including mask production, wafer fabrication, packaging, and testing. It also utilizes highly complex processes such as photolithography, etching, doping, and thin-film deposition. The creation of a single chip often requires hundreds of steps and weeks of meticulous polishing. Wafers, the cornerstone of chip manufacturing, undergo an exceptionally delicate and complex machining process. Among the many steps in wafer manufacturing, a grinding machine uses precision X-, Y-, and Z-axis drives to grind and chamfer the outer edges of the sliced ​​wafers. However, during the driving process of the X-axis and Y-axis for precision carving, the wafer shape accuracy is difficult to control. Both the X-axis and Y-axis have mechanical errors, and the maximum accuracy of a single axis can only reach between 0.01-0.02mm. At the same time, the X-axis and Y-axis co-motion superposition accuracy and the roundness of the wafer are guaranteed to be 0.03mm, and the chip chipping of the chamfered edge of the wafer reaches 0.2mm. The chip utilization layout must avoid the peripheral chipping position of the wafer, resulting in a reduction in the number of chips on the wafer, a reduction in layout density, and a decrease in utilization, thereby increasing the cost of the wafer. This problem urgently needs to be improved. Summary of the Invention

[0004] In order to help reduce the chipping of the chamfered corners of the wafer, thereby increasing the number and density of chip layouts on the wafer, improving utilization and reducing the cost of wafer production, the present application provides a turntable structure for wafer processing and a turntable machine with the structure.

[0005] The present application provides a turntable structure for wafer processing and a turntable machine with the structure, which adopts the following technical solutions: A turntable structure for wafer processing includes a mounting seat, on which is provided a turntable for positioning the wafer and a U-axis drive for driving the turntable to rotate stably. The table top of the turntable is horizontally arranged, and the table top of the turntable is coaxially arranged with the wafer. The U-axis drive includes a drive motor and a bearing, one end of the bearing is coaxially connected to the output shaft of the drive motor, and the other end of the bearing is coaxially connected to the turntable.

[0006] By adopting the above technical solution, the mounting base supports the turntable and the U-shaped drive component. The drive motor in the U-axis drive component drives the turntable to rotate horizontally through the bearing to drive the wafer positioned on the turntable to rotate. The U-axis rotation process of the wafer replaces the linear movement process of the X-axis and Y-axis. The U-axis rotation rigidity is greater and no superimposed precision error will be generated. The precision error of the bearing is within 0.002mm, which is higher than the maximum precision of the X-axis and Y-axis, which can only reach 0.01-0.02mm. It has higher stability and precision, so that the roundness accuracy can be controlled at 0.002mm, and the chipping of the chamfered edge is controlled at 0.002mm, which greatly reduces the chipping of the chamfered edge of the wafer, thereby increasing the number and density of chip layouts on the wafer, improving utilization and reducing the cost of wafer production.

[0007] Preferably, one end of the bearing connected to the turntable is arranged in an inverted cone shape.

[0008] By adopting the above technical solution, this setting allows the U-axis rigidity to be adjusted by the output torque parameters of the drive motor, ensuring that the output shaft and bearing of the drive motor are stable and controllable, and is conducive to improving the stability of the connection between the bearing and the turntable.

[0009] A turntable machine has the above-mentioned turntable structure for wafer processing, and also includes a frame, the turntable structure is arranged on the frame, and the frame is provided with a grinder for grinding the wafer on the turntable and a Z-axis drive for driving the grinder to move vertically up and down.

[0010] By adopting the above technical solution, the frame supports the turntable structure. When the wafer needs to be ground, the turntable structure drives the wafer on the turntable to rotate and the Z-axis drive drives the grinder to move vertically up and down to cooperate with the grinding operation of the grinder to realize the processing of the wafer, which is beneficial to improve the grinding accuracy.

[0011] Preferably, a material placing rack is provided on the frame, and a transfer mechanism for transferring the wafers in the material placing rack to the turntable is also provided on the frame.

[0012] By adopting the above technical solution, the transfer mechanism transfers the wafers in the material rack to the turntable for grinding operations, which has a high degree of automation and is conducive to improving the processing efficiency of the wafers.

[0013] Preferably, the transfer mechanism includes a suction cup and a transfer drive assembly, and the transfer drive assembly is arranged on the frame for driving the suction cup to move back and forth between the material rack and the turntable and flip the suction cup, and the suction cup is used to adsorb wafers.

[0014] By adopting the above technical solution, wafers are usually arranged vertically at intervals in the material rack to facilitate material retrieval. When the wafers need to be transferred to the turntable for processing, the transfer drive component drives the suction cup to approach the material rack and suck up a wafer. Then the transfer drive component drives the suction cup with the wafer to move to the turntable and flip the wafer 90° so that the wafer can be placed horizontally on the turntable, which is simple and convenient.

[0015] Preferably, the transfer drive assembly includes a transfer frame, an X-axis linear drive module, a Y-axis linear drive module, a Z-axis linear drive module and a flip drive component. The X-axis linear drive module is arranged on the frame to drive the Y-axis linear drive module to move horizontally back and forth along the X-axis direction. The Y-axis linear drive module is arranged on the X-axis linear drive module to drive the Z-axis linear drive module to move horizontally back and forth along the Y-axis direction. The X-axis direction and the Y-axis direction are perpendicular to each other. The Z-axis linear drive module is arranged on the Y-axis linear drive module to drive the transfer frame to move vertically back and forth along the Z-axis direction. The flip drive component is arranged on the transfer frame to drive the suction cup to flip.

[0016] By adopting the above technical solution, the X-axis linear drive module drives the Y-axis linear drive module to drive the transfer frame to move back and forth horizontally along the X-axis direction, the Y-axis linear drive module drives the Z-axis linear drive module to drive the transfer frame to move back and forth horizontally along the Y-axis direction, and the Z-axis linear drive module drives the transfer frame to move back and forth vertically along the Z-axis direction to realize the movement of the transfer frame, thereby realizing the transfer operation of the wafer adsorbed by the suction cup on the transfer frame. When the wafer is transferred to the top of the turntable through the suction cup, the flip drive drives the suction cup to flip 90° so that the wafer is placed in a horizontal state on the turntable.

[0017] Preferably, a slide is provided on the frame, and a turntable structure is provided on the slide, and the slide is used to drive the turntable to move back and forth between the grinding position of the grinder and the transfer position of the wafer on the material rack on the turntable.

[0018] By adopting the above technical solution, when the wafers on the material rack need to be placed on the turntable, the slide drives the turntable to move toward the material rack so that the transfer mechanism can transfer the wafers in the material rack to the turntable. When the wafers are positioned on the turntable, the slide drives the turntable to move to the grinding position of the grinder to perform grinding operations on the wafers to prevent the transfer mechanism from interfering with the spatial nature of the grinding operation.

[0019] Preferably, a positioning plate is provided on the frame between the turntable and the material discharging rack, and the positioning plate is provided with a V-shaped groove toward the side wall of the turntable, and the two groove walls of the V-shaped groove are symmetrically arranged relative to the turntable.

[0020] By adopting the above technical solution, when the wafer is placed on the turntable, the X-axis linear drive module, the Y-axis linear drive module and the Z-axis linear drive module drive the wafer to move so that the edge of the wafer simultaneously abuts against the two groove walls of the V-groove, thereby realizing the positioning operation of the wafer on the turntable.

[0021] Preferably, an adjusting drive member is provided on the frame, and the adjusting drive member drives the positioning plate to move back and forth along the Y-axis direction.

[0022] By adopting the above technical solution, the driving member is adjusted to drive the positioning plate to move back and forth along the Y-axis direction, so that the position of the positioning plate can be adjusted to adjust the positioning plate to accurately position the wafer on the turntable. It can also be applied to positioning operations of wafers of different specifications and sizes, and has strong applicability.

[0023] Preferably, the adjusting drive member includes a guide rail and a rodless cylinder, the guide rail is arranged along the Y-axis direction, the rodless cylinder is slidably connected to the guide rail, and the positioning plate is fixedly connected to the rodless cylinder.

[0024] By adopting the above technical solution, the rodless cylinder moves on the guide rail to drive the positioning plate to move along the Y-axis direction, thereby realizing the adjustment of the positioning plate position, which is convenient and quick.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting up a U-shaped drive member and a turntable, the drive motor in the U-axis drive member drives the turntable to rotate horizontally through the bearing, thereby driving the wafer positioned on the turntable to rotate. The U-axis rotation process of the wafer replaces the linear movement process of the X-axis and Y-axis. The U-axis rotation rigidity is greater and no superimposed precision error will be generated. The precision error of the bearing is within 0.002mm. Compared with the maximum precision of the X-axis and Y-axis, which can only reach 0.01-0.02mm, it has higher stability and precision, so that the roundness accuracy can be controlled within 0.002mm, and the chipping of the chamfered edge is controlled within 0.002mm, which greatly reduces the chipping of the wafer chamfered edge, thereby increasing the number and density of chip layouts on the wafer, improving utilization and reducing the cost of wafer production.

[0026] 2. By setting one end of the bearing connected to the turntable in an inverted cone shape, the rigidity of the U-axis can be adjusted by the output torque parameter of the drive motor, ensuring that the output shaft and bearing of the drive motor are stable and controllable, and is conducive to improving the stability of the connection between the bearing and the turntable.

[0027] 3. By setting up suction cups and transfer drive components, wafers are usually arranged in vertical intervals in the material rack to facilitate material retrieval. When the wafer needs to be transferred to the turntable for processing, the transfer drive component drives the suction cup close to the material rack and picks up a wafer. Then the transfer drive component drives the suction cup with the wafer to move to the turntable and flip the wafer 90° so that the wafer can be placed horizontally on the turntable. It is simple and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of the turntable structure in an embodiment of the present application.

[0029] Figure 2 It is a structural diagram of the turntable machine in the embodiment of the present application.

[0030] Figure 3 It is a structural diagram of the transfer mechanism in an embodiment of the present application.

[0031] Figure 4 yes Figure 3 Enlarged view of part A in the middle.

[0032] Figure 5 It is a structural schematic diagram of the turntable machine from another perspective in the embodiment of the present application.

[0033] Figure 6 yes Figure 5 Enlarged view of part B in the middle.

[0034] Description of reference numerals: 1. Mounting base; 2. Turntable; 3. U-axis drive; 4. Frame; 5. Z-axis drive; 6. Unloading rack; 7. Transfer mechanism; 71. Suction cup; 72. Transfer drive assembly; 721. Transfer rack; 722. X-axis linear drive module; 723. Y-axis linear drive module; 724. Z-axis linear drive module; 725. Flip drive; 8. Slide; 9. Positioning plate; 10. V-groove; 11. Adjustment drive; 111. Guide rail; 112. Rodless cylinder; 12. Grinder. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-6 This application is described in further detail.

[0036] The embodiment of the present application discloses a turntable structure for wafer processing, referring to Figure 1, including a mounting base 1, which is arranged in a vertical cylindrical shape. The mounting base 1 is provided with a turntable 2 for positioning the wafer and a U-axis drive component 3 for driving the turntable 2 to rotate stably. The table top of the turntable 2 is arranged horizontally, and the table top of the turntable 2 is arranged coaxially with the wafer. It should be noted that the table top of the turntable 2 is provided with adsorption holes for adsorbing and fixing the wafer, and the adsorption holes are connected to the vacuum suction system. When the wafer is positioned on the turntable 2, the vacuum suction system is turned on and the wafer is adsorbed and fixed on the table top of the turntable 2 through the adsorption holes to improve the stability of the wafer during processing. It is worth mentioning that the U-axis drive component 3 includes a drive motor and a bearing. One end of the bearing is coaxially connected to the output shaft of the drive motor, and the other end of the bearing is coaxially connected to the turntable 2. At the same time, the end of the bearing connected to the turntable 2 is arranged in an inverted cone shape. Compared with the X-axis and Y-axis, which can only reach a maximum accuracy of 0.01-0.02mm, the U-axis rotation has higher stability and precision, so that the roundness accuracy can be controlled at 0.002mm, and the chipping of the chamfered edge is controlled at 0.002mm, which greatly reduces the chipping of the chamfered edge of the wafer, thereby increasing the number and density of chip layouts on the wafer, improving utilization to reduce the cost of wafer production. At the same time, the rigidity of the U-axis can be adjusted by the output torque parameters of the drive motor to ensure that the output shaft and bearing of the drive motor are stable and controllable, and it is beneficial to improve the stability of the connection between the bearing and the turntable 2. In this embodiment, the drive motor is selected as a servo motor and the bearing is selected as an angular contact ball bearing.

[0037] The embodiment of the present application also discloses a turntable machine, including the above-mentioned turntable structure for wafer processing, referring to Figure 2 , further comprising a frame 4, a turntable structure disposed on the frame 4, and a grinder 12 for grinding the wafer on the turntable 2, and a Z-axis drive 5 for driving the grinder 12 to move vertically up and down. When processing the wafer, the wafer is horizontally fixed on the turntable 2, which drives the wafer to rotate, and the Z-axis drive 5 drives the grinder 12 vertically up and down to grind and chamfer the outer circle of the wafer. In this embodiment, the Z-axis drive 5 uses a motor screw structure to drive the grinder 12 vertically up and down, which will not be described in detail here.

[0038] Reference Figure 2 and Figure 3 Before processing the wafers, they need to be loaded. A discharge rack 6 is provided on the frame 4. The frame 4 is also provided with a transfer mechanism 7 for transferring the wafers from the discharge rack 6 to the turntable 2. It should be noted that the wafers are typically arranged vertically and spaced apart in the discharge rack 6, which facilitates access and prevents adjacent wafers from colliding with each other.

[0039] Reference Figure 2 and Figure 3The transfer mechanism 7 includes a suction cup 71 and a transfer drive assembly 72. The transfer drive assembly 72 is arranged on the frame 4 and is used to drive the suction cup 71 to move back and forth between the material rack 6 and the turntable 2 and flip the suction cup 71. The suction cup 71 is used to absorb the wafer. When the wafer needs to be transferred from the material rack 6 to the turntable 2, the transfer drive assembly 72 first drives the suction cup 71 to move to the position of the material rack 6 and sucks the wafer into a vertical state through the suction cup 71. Then, the transfer drive assembly 72 drives the suction cup 71 with the wafer adsorbed to move to the turntable 2. Then, the transfer drive assembly 72 drives the suction cup 71 to flip 90° so that the wafer is adjusted to a horizontal state and placed on the turntable 2, thereby realizing automatic loading and transfer of the wafer, with a high degree of automation.

[0040] Reference Figure 3 and Figure 4 The transfer drive assembly 72 includes a transfer frame 721, an X-axis linear drive module 722, a Y-axis linear drive module 723, a Z-axis linear drive module 724 and a flip drive member 725. The X-axis linear drive module 722 is arranged on the frame 4 to drive the Y-axis linear drive module 723 to move back and forth horizontally along the X-axis direction. When the Y-axis linear drive module 723 and the Z-axis linear drive module 724 are not in action, the X-axis linear drive module 722 drives the transfer frame 721 to move linearly along the X-axis direction. The Y-axis linear drive module 723 is arranged on the X-axis linear drive module 722 to drive the Z-axis linear drive module 724 to move back and forth horizontally. Drive module 724 reciprocates horizontally along the Y-axis. When X-axis linear drive module 722 and Z-axis linear drive module 724 are inactive, Y-axis linear drive module 723 drives transfer frame 721 to move linearly along the Y-axis, with the X-axis and Y-axis directions being perpendicular to each other on the horizontal plane. Z-axis linear drive module 724, mounted on Y-axis linear drive module 723, drives transfer frame 721 to reciprocate vertically along the Z-axis. The X-axis linear drive module 722, Y-axis linear drive module 723, and Z-axis linear drive module 724 work together to drive transfer frame 721 in all directions. Simultaneously, flip drive 725, mounted on transfer frame 721, flips suction cup 71, thereby changing the wafer from a vertical to a horizontal position. In this embodiment, the X-axis linear drive module 722, the Y-axis linear drive module 723 and the Z-axis linear drive module 724 are all driven to move by motor screws, and the flip drive component 725 is driven to flip by a motor rotating rod, which will not be described in detail here.

[0041] Reference Figure 3 and Figure 5 When the wafer is transferred to the turntable 2 and is in a horizontal state, in order to improve the position accuracy of the wafer fixed on the turntable 2, a positioning plate 9 is horizontally provided on the frame 4 between the turntable 2 and the unloading rack 6. Figure 6, and the positioning plate 9 is provided with a V-shaped groove 10 on the side wall facing the turntable 2. The two groove walls of the V-shaped groove 10 are symmetrically arranged relative to the turntable 2, and the two groove walls of the V-shaped groove 10 form an angle to position the wafer. The specific operation is as follows: the X-axis linear drive module 722, the Y-axis linear drive module 723, and the Z-axis linear drive module 724 cooperate to transfer the wafer to the top of the turntable 2, and then the flip drive component 725 flips the wafer to a horizontal state. Subsequently, the X-axis linear drive module 722, the Y-axis linear drive module 723, and the Z-axis linear drive module 724 cooperate to adjust the position of the wafer again so that the side of the wafer abuts against the two groove walls of the V-shaped groove 10. At this time, the wafer and the turntable 2 are arranged coaxially.

[0042] Reference Figure 5 and Figure 6 When the grinding position of the wafer needs to be adjusted, the position of the positioning plate 9 must also be adjusted accordingly. Therefore, an adjustment drive 11 is provided on the frame 4. The adjustment drive 11 drives the positioning plate 9 to move back and forth along the Y-axis direction so that the position of the positioning plate 9 is adapted to the grinding position of the wafer. Specifically, the adjustment drive 11 includes a guide rail 111 and a rodless cylinder 112. The guide rail 111 is provided along the Y-axis direction. The rodless cylinder 112 is slidably connected to the guide rail 111. The positioning plate 9 is fixedly connected to the rodless cylinder 112, so that the movement of the rodless cylinder 112 along the Y-axis direction drives the positioning plate 9 to adjust its position.

[0043] Reference Figure 2 The frame 4 is provided with a slide 8, and the turntable structure is provided on the slide 8. The slide 8 is used to drive the turntable 2 to move back and forth between the grinding position of the grinder 12 and the transfer position of the wafer on the unloading rack 6 on the turntable 2. When the wafer on the unloading rack 6 needs to be placed on the turntable 2, the slide 8 drives the turntable 2 to move closer to the unloading rack 6, so that the transfer mechanism 7 can transfer the wafer in the unloading rack 6 to the turntable 2. After the wafer is positioned on the turntable 2, the slide 8 drives the turntable 2 to move to the grinding position of the grinder 12 to perform the grinding operation on the wafer, so as to prevent the transfer mechanism 7 from interfering with the spatial interference of the grinding operation. In this embodiment, the slide 8 slides in the form of a motor screw.

[0044] The implementation principle of a turntable structure for wafer processing and a turntable machine with the same in the embodiment of the present application is as follows: when the wafer needs to be ground, the X-axis linear drive module 722, the Y-axis linear drive module 723, and the Z-axis linear drive module 724 cooperate to drive the suction cup 71 to transfer the wafer from the material rack 6 to the top of the turntable 2, and then the flip drive component 725 flips the wafer to a horizontal state, and then the X-axis linear drive module 722, the Y-axis linear drive module 723 and the Z-axis linear drive module 724 cooperate to adjust the position of the wafer again so that the side edges of the wafer abut against the two groove walls of the V-groove 10. At this time, the wafer and the turntable 2 are coaxially arranged, and after the suction cup 71 releases the wafer, the adsorption holes on the turntable 2 form negative pressure through the vacuum suction system to fix the wafer horizontally on the turntable 2, and then the turntable structure moves the wafer to the grinding position of the grinder 12 through the slide rail, and the turntable 2 rotates under the drive of the drive motor and the bearing. The U-axis rotation process of the wafer replaces the linear movement process of the X-axis and Y-axis. The U-axis rotation rigidity is greater and no superimposed precision error will be generated. The precision error of the bearing is within 0.002mm, which is higher than the maximum precision of the single axis of the X-axis and Y-axis which can only reach 0.01-0.02mm. It has higher stability and precision, so that the roundness accuracy can be controlled within 0.002mm, and the chipping of the chamfered edge is controlled within 0.002mm, which greatly reduces the chipping of the chamfered edge of the wafer, thereby increasing the number and density of chip layouts on the wafer, improving utilization rate and reducing the cost of wafer production.

[0045] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A turntable structure for wafer processing, characterized by: The invention comprises a mounting seat (1), a turntable (2) for positioning a wafer and a U-axis driving member (3) for driving the turntable (2) to rotate stably, the turntable (2) having a table top arranged horizontally and the turntable (2) coaxially arranged with the wafer, the U-axis driving member (3) comprising a driving motor and a bearing, one end of the bearing being coaxially connected to the output shaft of the driving motor, and the other end of the bearing being coaxially connected to the turntable (2).

2. The wafer processing turntable structure and the turntable (2) machine with the structure according to claim 1 are characterized in that: One end of the bearing connected to the turntable (2) is arranged in an inverted cone shape.

3. A turntable machine having a turntable structure for wafer processing according to any one of claims 1 to 2, characterized in that: The invention also includes a frame (4), a turntable structure is arranged on the frame (4), and a grinder (12) for grinding the wafer on the turntable (2) and a Z-axis driving member (5) for driving the grinder (12) to move vertically up and down are arranged on the frame (4).

4. The turntable machine according to claim 3, characterized in that: A material placing rack (6) is provided on the frame (4), and a transfer mechanism (7) for transferring wafers in the material placing rack (6) to the turntable (2) is also provided on the frame (4).

5. The turntable machine according to claim 4, characterized in that: The transfer mechanism (7) includes a suction cup (71) and a transfer drive assembly (72). The transfer drive assembly (72) is arranged on the frame (4) and is used to drive the suction cup (71) to move back and forth between the material placement rack (6) and the turntable (2) and to flip the suction cup (71). The suction cup (71) is used to absorb wafers.

6. The turntable machine according to claim 5, characterized in that: The transfer drive assembly (72) includes a transfer frame (721), an X-axis linear drive module (722), a Y-axis linear drive module (723), a Z-axis linear drive module (724) and a flip drive component (725). The X-axis linear drive module (722) is arranged on the frame (4) to drive the Y-axis linear drive module (723) to move horizontally back and forth along the X-axis direction. The Y-axis linear drive module (723) is arranged on the X-axis linear drive module (722) to drive the Z-axis linear drive module (724) to move horizontally back and forth along the Y-axis direction. The X-axis direction and the Y-axis direction are perpendicular to each other. The Z-axis linear drive module (724) is arranged on the Y-axis linear drive module (723) to drive the transfer frame (721) to move vertically back and forth along the Z-axis direction. The flip drive component (725) is arranged on the transfer frame (721) to drive the suction cup (71) to flip.

7. The turntable machine according to claim 4, characterized in that: A slide (8) is provided on the frame (4), and a turntable structure is provided on the slide (8). The slide (8) is used to drive the turntable (2) to move back and forth between the grinding position of the grinder (12) and the transfer position of the wafer on the material rack (6) on the turntable (2).

8. The turntable machine according to claim 4, characterized in that: A positioning plate (9) is provided on the frame (4) between the turntable (2) and the material unloading rack (6), and a V-shaped groove (10) is provided on the positioning plate (9) toward the side wall of the turntable (2), and the two groove walls of the V-shaped groove (10) are symmetrically arranged relative to the turntable (2).

9. The turntable machine according to claim 8, characterized in that: An adjusting drive member (11) is provided on the frame (4), and the adjusting drive member (11) drives the positioning plate (9) to move back and forth along the Y-axis direction.

10. The turntable machine according to claim 9, characterized in that: The adjusting drive member (11) comprises a guide rail (111) and a rodless cylinder (112), wherein the guide rail (111) is arranged along the Y-axis direction, the rodless cylinder (112) is slidably connected to the guide rail (111), and the positioning plate (9) is fixedly connected to the rodless cylinder (112).

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