Carrier structure and method for vapor deposition of graphene on surface of powdery substrate

Abstract

The invention relates to the technical field of preparation of graphene composite materials, in particular to a carrier structure and method for vapor deposition of graphene on the surface of a powdery matrix, the carrier structure comprises a carrier body, a first side and a second side, the carrier body is provided with a laying space extending in the first direction, and the first side and the second side are oppositely arranged in the second direction, the first direction is perpendicular to the second direction, the laying space is used for laying a powdery matrix, the carrier body is made of a porous material, the aperture of the carrier body is smaller than the particle size of the powdery matrix, and the first side and / or the second side are / is provided with an airflow space for gas phase deposition gas to circulate, so that the first side and the second side can form an air pressure difference; therefore, the vapor deposition gas can be diffused along the second direction. According to the method, the air pressure difference is formed on the two sides of the powdery matrix, the diffusion effect of gas from one side to the other side is enhanced, all parts of the powdery matrix can make full contact with the gas, uniform coating of graphene is achieved, and the layer number is controllable.

Description

Technical Field

[0001] The present application relates to the technical field of graphene composite material preparation, and in particular to a carrier structure and method for vapor-phase deposition of graphene on the surface of a powdery substrate. Background Art

[0002] In the preparation of copper-graphene composite materials, first a graphene layer is coated on the surface of copper powder, and then the copper powder coated with the graphene layer is pressed, sintered or melted into one, so that the distribution of graphene can be made more uniform, thereby having better electrical conductivity and mechanical properties. At present, vapor deposition is generally adopted in the preparation of graphene-coated copper powder, by passing vapor deposition gas (including carbon-containing gas, inert gas and hydrogen) to the surface of the copper powder laid in the vapor deposition chamber, so that the carbon element in the carbon-containing gas is deposited to form a graphene layer. This method is greatly affected by the laying thickness of copper powder. If the copper powder laid is thicker, the copper powder laid on bottom is not sufficiently in contact with the vapor deposition gas, resulting in a larger deviation of the graphene layer on the surface of the bottom copper powder and the top copper powder surface; if the copper powder laid is thinner, then production efficiency is lower, production cost is higher, and it is impossible to adapt to industrial production needs.

[0003] Therefore, the existing method of coating the copper powder surface with a graphene layer by vapor deposition cannot be mass-produced while ensuring a relatively uniform thickness of the graphene layer, and is difficult to adapt to industrial applications. Summary of the Invention

[0004] The present application aims to provide a carrier structure and method for vapor deposition of graphene on the surface of a powdery substrate, so as to improve the thickness uniformity of the graphene layer on the surface of the powdery substrate under large-scale processing conditions.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, embodiments of the present application provide a support structure for vapor-phase deposition of graphene on the surface of a powdery substrate, comprising:

[0007] The carrier body has a laying space extending along a first direction, and a first side and a second side arranged opposite to each other along a second direction, the first direction is perpendicular to the second direction, the laying space is used to lay a powdered matrix, the carrier body is made of a porous material, the pore size of the carrier body is smaller than the particle size of the powdered matrix, the first side and / or the second side has an air flow space for the circulation of vapor deposition gas, so that a pressure difference can be formed between the first side and the second side, thereby allowing the vapor deposition gas to diffuse along the second direction.

[0008] In one embodiment of the present application, the carrier body includes n porous layers, and the n porous layers are spaced apart along the second direction to form the paving space between two adjacent porous layers. The first porous layer and the nth porous layer respectively form the airflow space on the side facing away from the paving space, where n≥2.

[0009] In one embodiment of the present application, each porous layer is a cylindrical structure extending along the first direction, and n porous layers are sequentially spaced and arranged along the second direction to form (n-1) annular spacing spaces, and at least the central channel of the innermost porous layer and the side of the outermost porous layer facing away from the laying space form the airflow space.

[0010] In one embodiment of the present application, the carrier structure further includes:

[0011] An air flow channel is provided between two adjacent porous layers to introduce vapor deposition gas into the laying space.

[0012] In one embodiment of the present application, the airflow channel is a laminar space;

[0013] Between two adjacent porous layers, the paving space is located on the surface of one of the porous layers, and the air flow channel is located on the surface of the other porous layer.

[0014] In one embodiment of the present application, the airflow channel is a columnar channel extending along the first direction, and a plurality of the airflow channels are arranged at intervals in each of the laying spaces.

[0015] In one embodiment of the present application, the air flow channels of two adjacent laying spaces are staggered with each other.

[0016] In one embodiment of the present application, the carrier body is cross-sectioned along the second direction, and 3-5 airflow channels are provided per unit square decimeter of cross-sectional area.

[0017] In one embodiment of the present application, the carrier structure further includes:

[0018] A ventilation pipe is inserted into the laying space to form the air flow channel.

[0019] In one embodiment of the present application, a tube wall of the ventilation tube is provided with a plurality of first air holes, and the aperture of the first air holes is smaller than the particle diameter of the powdery matrix.

[0020] In one embodiment of the present application, the carrier structure further includes:

[0021] A diverter is located at one end of the carrier body in the first direction. The diverter is provided with a diverter space, an air inlet and a plurality of air outlets. The air inlet and the plurality of air outlets are respectively connected to the diverter space. The air inlet is used to supply gas-phase deposition gas to enter, and the plurality of air outlets are all used to supply gas-phase deposition gas to flow out. The plurality of air outlets are at least connected to the airflow channel.

[0022] In one embodiment of the present application, the air inlet and the plurality of air outlets are respectively arranged on both sides of the diverter, and the plurality of air outlets face the carrier body;

[0023] One of the plurality of air outlets is arranged corresponding to the axial channel of the innermost porous layer, and at least a portion of the remaining plurality of air outlets are respectively communicated with the plurality of air flow channels.

[0024] In one embodiment of the present application, the air inlet and the plurality of air outlets are arranged on the same side of the diverter, and the air inlet and the plurality of air outlets are all facing the carrier body;

[0025] The air inlet is communicated with the axial channel of the innermost porous layer, and at least a portion of the plurality of air outlets are respectively communicated with the plurality of air flow channels.

[0026] In one embodiment of the present application, the carrier structure further includes:

[0027] The flow guide tube is inserted into the axial channel of the innermost porous layer and communicated with the air inlet.

[0028] In one embodiment of the present application, a plurality of second air holes are provided on the wall of the flow guide tube.

[0029] In one embodiment of the present application, one end of the carrier body facing away from the diverter is open.

[0030] In one embodiment of the present application, the ratio of the thickness of the porous layer to the thickness of the paving space is 1:1-1:6.

[0031] In one embodiment of the present application, the pore size of the porous material is 100 nm-100 μm; and / or the porosity of the porous material is 20%-80%.

[0032] In a second aspect, an embodiment of the present application provides a method for vapor-depositing graphene on the surface of a powdery substrate, comprising:

[0033] Providing a support structure for vapor deposition of graphene on a surface of a powdery substrate according to any one of the first aspects;

[0034] Laying the powdery matrix in a first direction on the paving space of the carrier structure;

[0035] The carrier structure has two airflow spaces arranged opposite to each other along a second direction. Vapor deposition gas is introduced into at least one of the airflow spaces to form a pressure difference so that the vapor deposition gas diffuses along the second direction, which is perpendicular to the first direction.

[0036] In one embodiment of the present application, vapor deposition gas is introduced into the two air flow spaces respectively, and the ratio of the flow rates of the two air flow spaces is 1.05-2.

[0037] In one embodiment of the present application, the carrier structure includes at least one porous layer, and the ratio of the thickness of the porous layer to the laying thickness of the powdery matrix is ​​1:1-1:6.

[0038] Beneficial effects:

[0039] The technical solution provided by the present application is that the vapor deposition gas flows on at least one side of the porous carrier body, so that a pressure difference is formed on both sides of the carrier body, which promotes the diffusion of the vapor deposition gas from one side to the other side, so that the vapor deposition gas not only fully contacts the surface of the powdered matrix, but also makes the gas deposition gas more fully contact with the part of the powdered matrix close to the carrier body, that is, the powdered matrix can be fully contacted with the vapor deposition gas in the thickness direction, thereby improving the uniformity of graphene coating and the controllability of thickness.

[0040] Furthermore, when the vapor deposition gas flows on both sides of the powder matrix at the same time, the graphene layers on both sides of the powder matrix can be more uniform, and the diffusion effect of the gas from one side to the other can be enhanced, so that the vapor deposition gas distributed in the thickness direction of the powder matrix is ​​more uniform and more sufficient, further realizing uniform coverage of graphene and controllable number of layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 A single-layer carrier structure provided in an embodiment of the present application;

[0043] Figure 2 Another single-layer carrier structure provided in an embodiment of the present application;

[0044] Figure 3 A multi-layer carrier structure provided in an embodiment of the present application;

[0045] Figure 4 Another multi-layer carrier structure provided in an embodiment of the present application;

[0046] Figure 5 A multi-layer carrier structure having an airflow channel extending along a third direction provided in an embodiment of the present application;

[0047] Figure 6 A layered space is provided for the multi-layer cylindrical carrier structure provided in the embodiment of the present application;

[0048] Figure 7 This is a diagram of the external structure of the diverter and the carrier body provided in an embodiment of the present application;

[0049] Figure 8 A schematic plan view of a diverter provided in an embodiment of the present application;

[0050] Figure 9 A perspective view of a flow diverter provided in an embodiment of the present application and connected to a carrier body in a first connection manner;

[0051] Figure 10 A schematic plan view of another diverter provided in an embodiment of the present application;

[0052] Figure 11 A perspective view of another flow diverter provided in an embodiment of the present application connected to a carrier body in a first connection manner;

[0053] Figure 12 A perspective view of a flow diverter provided in an embodiment of the present application and connected to a carrier body in a second connection manner;

[0054] Figure 13 A perspective view of another diverter provided in an embodiment of the present application connected to a carrier body in a second connection manner.

[0055] Icon: 1000-carrier structure, 100-carrier body, 101-laying space, 102-first side, 103-second side, 104-air flow space, 105-air flow channel, 110-porous layer, 200-ventilation pipe, 300-diverter, 301-diverter space, 302-air inlet, 303-air outlet, 400-flow guide pipe, 500-breathable partition, X-first direction, Y-second direction, Z-third direction. DETAILED DESCRIPTION

[0056] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0058] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0059] In the preparation of copper-graphene composite materials, a graphene layer is first coated on the surface of the copper powder, and then the copper powder coated with the graphene layer is pressed, sintered or melted into one. This can make the distribution of graphene more uniform and have better conductivity and mechanical properties.

[0060] At present, the preparation of graphene coated copper powder generally adopts vapor deposition method, a certain particle size copper powder is laid in vapor deposition chamber, by controlling the process conditions such as the amount of the vapor deposition chamber temperature and the amount of vapor deposition gas (including inert gas, carbon-containing gas and hydrogen), it is realized that the required thickness graphene layer is deposited on the copper powder surface, but the processing effect of the method is greatly affected by the thickness of the copper powder laid. If the copper powder laid is thicker, the copper powder laid on bottom is insufficiently contacted with vapor deposition gas, resulting in the graphene layer thickness on the bottom copper powder surface being thinner or uneven, and the graphene layer on the top copper powder surface being thicker or even too thick to form a graphite layer. If the copper powder laid is thinner, production efficiency is lower, and production cost is higher, and it is impossible to adapt to industrial production demand. Therefore, the existing method of using vapor deposition method to coat graphene layer on copper powder surface cannot be mass-produced, and is difficult to adapt to industrial application.

[0061] Prior art methods have also attempted to rotate and stir the vapor deposition chamber in order to swap the positions of the upper and lower copper powder layers, rotating the upper copper powder to the lower layer and the lower copper powder to the upper layer. However, in actual production, the swapping of the upper and lower copper powder layers is difficult to achieve as designed, and it is impossible to ensure that all the copper powder at the bottom rotates to the upper layer. In practice, the lower copper powder and the upper copper powder often mix to form a new mixed copper powder layer. As a result, the uniformity of the graphene layer remains difficult to ensure, and the number of graphene layers is difficult to control. Furthermore, during the inversion process, the copper powder particles move, making it impossible to provide a relatively stable deposition location, which is not conducive to uniform and orderly deposition, and further leads to uncontrollable number of graphene layers.

[0062] How to achieve full contact between vapor deposition gas and copper powder in large-scale processing to ensure uniform graphene coating and controllable number of layers is still a difficult problem that needs to be solved at this stage.

[0063] In view of this, an embodiment of the present application provides a technical solution, which sets up a carrier structure and method for vapor deposition of graphene on the surface of a powdery matrix. Copper powder is laid on the carrier body to form a powdery matrix. The carrier body is made of porous material. When the vapor deposition gas flows on the surface of the powdery matrix, it can form an air pressure difference on both sides of the carrier body, prompting the vapor deposition gas to diffuse along the thickness direction of the powdery matrix, so that the powdery matrix can be fully in contact with the gas in the thickness direction and on its surface, and the powdery matrix is ​​stable as a whole, and the powdery particles remain basically stable, which can provide a relatively stable deposition position point, which is conducive to uniform and orderly deposition, and realizes uniform coating of graphene with controllable number of layers.

[0064] It should be noted that the technical solution provided in the embodiments of the present application can not only be used to deposit graphene on the surface of copper powder, but can also be used to deposit graphene on the surface of other types of powdery substrates.

[0065] In a first aspect, the present invention provides a carrier structure 1000, such as Figure 1 As shown, the carrier structure 1000 includes a carrier body 100, the carrier body 100 has a laying space 101 extending along a first direction X, and a first side 102 and a second side 103 arranged opposite to each other along a second direction Y, the first direction X is perpendicular to the second direction Y, the laying space 101 is used to lay a powdered matrix, the carrier body 100 is made of a porous material, the pore size of the carrier body 100 is smaller than the particle size of the powdered matrix, the first side 102 and / or the second side 103 has an air flow space 104 for the circulation of vapor deposition gas, so that a pressure difference can be formed between the first side 102 and the second side 103, thereby allowing the vapor deposition gas to diffuse along the second direction Y.

[0066] In the embodiment of the present application, “the first side 102 and / or the second side 103 has an airflow space 104 for the circulation of gas-phase deposition gas” means that the first side 102 has an airflow space 104 for the circulation of gas-phase deposition gas, the second side 103 has an airflow space 104 for the circulation of gas-phase deposition gas, or both the first side 102 and the second side 103 have an airflow space 104 for the circulation of gas-phase deposition gas.

[0067] When both the first side 102 and the second side 103 have an airflow space 104 for the vapor deposition gas to flow, the gas flows on the upper laying surface and the lower laying surface of the powder substrate at the same time, and the graphene layers on both sides of the powder substrate can be more uniform, and the diffusion effect of the gas from one side surface to the other side surface can be enhanced, so that the vapor deposition gas distributed in the thickness direction of the powder substrate is more uniform and more sufficient, further realizing uniform coverage of graphene and controllable number of layers.

[0068] In some embodiments, the laying space 101 may be a surface of the carrier body 100 facing the first side 102 or a surface facing the second side 103 , that is, the laying space 101 is adjacent to the airflow space 104 on one side without separation.

[0069] For example, the carrier body 100 is Figure 1 In the plate-like structure shown, the first direction X is parallel to the plate surface, and the second direction Y is perpendicular to the plate surface. The laying space 101 is located on the surface of the plate-like structure facing the first side 102. By mounting the carrier body 100 within the vapor deposition chamber, both the surface of the carrier body 100 facing the first side 102 and the surface facing the second side 103 are spaced from the inner wall of the vapor deposition chamber, forming two airflow spaces 104. Vapor deposition gas is delivered to each of the two airflow spaces 104 via an external gas source, creating a pressure difference between the two airflow spaces 104.

[0070] For example, Figure 2As shown, the carrier body 100 is enclosed to form a cylindrical structure extending along a first direction X, and a second direction Y is perpendicular to the first direction X. The first side 102 of the carrier body 100 is the inner side, and the second side 103 of the carrier body 100 is the outer side. The paving space 101 is formed on the surface of the carrier body 100 facing the first side 102 (i.e., paved on the inner wall of the carrier body 100). By placing the carrier body 100 inside a vapor deposition chamber, and separating the surface of the second side 103 of the carrier body 100 from the vapor deposition chamber to form an airflow space 104, the internal space of the carrier body 100 other than the paving space 101 is another airflow space 104. The vapor deposition gas is respectively delivered to the two airflow spaces 104 by an external gas source. For example, the external gas source is provided with two pipelines, one pipeline ventilating the central channel of the innermost porous layer 110, and the other pipeline ventilating the outside of the cylindrical structure.

[0071] The ratio of the flow rates of the two air flow spaces 104 is 1.05-2.

[0072] In other embodiments, the laying space 101 is disposed inside the carrier body 100 , ie, spaced apart from the airflow space 104 , to prevent the powder particles from being carried away when the airflow is too strong.

[0073] For example, the carrier body 100 includes n porous layers 110, each porous layer 110 is a plate-like structure, and the n porous layers 110 are spaced apart along the second direction Y to form a paving space 101 between two adjacent porous layers 110. The first porous layer 110 and the nth porous layer 110 respectively form airflow spaces 104 on the side facing away from the paving space 101, where n≥2.

[0074] For example, Figure 3 As shown, the carrier body 100 includes three porous layers 110, and the three porous layers 110 are arranged at intervals along the second direction Y to form two paving spaces 101 located between adjacent porous layers 110, and the first porous layer 110 and the third porous layer 110 form airflow spaces 104 on the side away from the paving space 101 respectively.

[0075] For another example, the carrier body 100 includes n porous layers 110, each porous layer 110 is a cylindrical structure extending along the first direction X, and the n porous layers 110 are sequentially spaced and arranged along the second direction Y to form (n-1) annular paving spaces 101, and at least the central channel of the innermost porous layer 110 and the side of the outermost porous layer 110 facing away from the paving space 101 form an airflow space 104.

[0076] For example, Figure 4As shown, the carrier body 100 includes three porous layers 110, each of which is a cylindrical structure extending along the first direction X. The three porous layers 110 are sequentially spaced and arranged along the second direction Y to form two annular paving spaces 101, wherein the central channel of the innermost porous layer 110 forms an airflow space 104, and the side of the outermost porous layer 110 facing away from the paving space 101 (i.e., the second side 103, or the outer side) forms another airflow space 104.

[0077] It should be noted that the present application does not limit the cross-sectional shape of the tubular structure. That is, the tubular structure can be a cylinder, a square cylinder, etc. The cross-sectional shape of the tubular structure along the second direction Y can be circular, triangular, quadrilateral, pentagonal, etc., as well as irregular shapes. Moreover, the cross-sectional shape of the tubular structure at any position along the first direction X can be the same or different. Similarly, the present application does not limit the shape of the annular paving space 101, as long as two adjacent porous layers 110 are spaced apart. In the embodiments of the present application, cylindrical and annular shapes are used as examples.

[0078] Optionally, the carrier structure 1000 further includes an air flow channel 105 , which is disposed in the laying space 101 to allow the vapor deposition gas to pass therethrough, and the air flow channel 105 is perpendicular to the second direction Y.

[0079] For example, in an embodiment in which the carrier body 100 is a plate-like structure, the carrier body 100 includes n porous layers 110, each of which is a plate-like structure. The n porous layers 110 are spaced apart along the second direction Y to form a paving space 101 between two adjacent porous layers 110. At the same time, an air flow channel 105 is further provided between each two adjacent porous layers 110:

[0080] like Figure 3 As shown, the air flow channel 105 extends along the first direction X to form a cylindrical channel, and the cylindrical channel can be formed by arranging a ventilation tube 200 extending along the first direction X between two adjacent porous layers 110;

[0081] Or, as Figure 5 As shown, the air flow channel 105 extends along the third direction to form a cylindrical channel, and the third direction is perpendicular to the first direction X and the second direction Y, that is, Figure 5 In the direction perpendicular to the paper, the columnar channel can be formed by providing a vent pipe 200 along the third direction between two adjacent porous layers 110;

[0082] Alternatively, the air flow channel 105 is a curved channel (not shown) formed in a direction perpendicular to the second direction Y. The curved channel can be formed by providing a curved vent pipe 200 between two adjacent porous layers 110.

[0083] Or, as Figure 6 As shown, the airflow channel 105 is a layered space perpendicular to the second direction Y. The paving space 101 is located on the surface of one porous layer 110, and the layered space is located between the paving space 101 and the surface of the other porous layer 110. In some cases, the first direction X is horizontal, and a layered space is naturally formed between the surface of the paved copper powder matrix and the surface of the porous layer 110 above. In other cases, the first direction X is not horizontal, and the paving space 101 and the airflow channel 105 are separated by providing parallel air-permeable partitions 500 between two adjacent porous layers 110. The air-permeable partitions 500 are air-permeable partitions or air-permeable membranes.

[0084] For another example, in an embodiment in which the carrier body 100 is a multi-layer cylindrical structure, the carrier body 100 includes n porous layers 110, each of which is a cylindrical structure extending along the first direction X. The n porous layers 110 are sequentially spaced and arranged along the second direction Y to form (n-1) annular paving spaces 101. At the same time, each paving space 101 has an airflow channel 105:

[0085] like Figure 4 As shown, the air flow channel 105 extends along the first direction X to form a cylindrical channel, and the cylindrical channel can be formed by arranging a ventilation tube 200 extending along the first direction X between two adjacent porous layers 110;

[0086] Alternatively, the air flow channel 105 is spirally wound along the wall of the cylindrical structure (not shown in the figure);

[0087] Or, as Figure 6 As shown, the airflow channel 105 is an annular layered space. For example, a breathable partition 500 is provided between two adjacent porous layers 110 to separate the paving space 101 and the airflow channel 105. The breathable partition 500 is a breathable partition or a breathable membrane.

[0088] At least when n≥2, an air flow channel 105 is provided in the laying space 101 to replenish the vapor deposition gas into the laying space 101 so as to make the graphene layer deposited on the surface of the particles in the powder volume in the middle layer more uniform.

[0089] In embodiments where the airflow channels 105 are cylindrical channels, multiple airflow channels 105 are spaced apart within each laying space 101 to achieve more uniform distribution of the vapor deposition gas. Furthermore, when the carrier body 100 is cross-sectioned along the second direction Y, 3-5 airflow channels 105 are provided per square decimeter of cross-sectional area.

[0090] like Figure 4As shown, in the embodiment where the carrier body 100 is a multi-layer cylindrical structure, the area of ​​the annular paving space 101 closer to the outside is larger, and the number of the air flow channels 105 provided is greater.

[0091] Furthermore, the air flow channels 105 of two adjacent laying spaces 101 are staggered with each other.

[0092] As mentioned above, in some cases, the air flow channel 105 is formed by a vent tube 200 inserted into the laying space 101. The vent tube 200 has a plurality of first air holes formed in its wall, and the aperture of the first air holes is smaller than that of the powdered matrix. This allows the vapor deposition gas to flow along the vent tube 200 while diffusing from the plurality of first air holes into the surrounding powdered matrix.

[0093] In some embodiments, as Figure 7 As shown, the carrier structure 1000 also includes a diverter 300, which is located at one end of the carrier body 100 in the first direction X. The diverter 300 is provided with a diverter space 301, an air inlet 302 and a plurality of air outlets 303. The air inlet 302 and the plurality of air outlets 303 are respectively connected to the diverter space 301. The air inlet 302 is used to supply gas-phase deposition gas to enter, and the plurality of air outlets 303 are all used to supply gas-phase deposition gas to flow out. The plurality of air outlets 303 are at least connected to the air flow channel 105.

[0094] Alternatively, as Figure 8 and Figure 9 As shown, an air inlet 302 and a plurality of air outlets 303 are respectively arranged on both sides of the flow dividing member 300, and the plurality of air outlets 303 face the carrier body 100. In an embodiment in which the carrier body 100 has a multi-layer cylindrical structure, one of the plurality of air outlets 303 is arranged corresponding to the axial channel of the innermost porous layer 110, and at least a portion of the remaining plurality of air outlets 303 are respectively connected to the plurality of air flow channels 105. That is, the remaining plurality of air outlets 303 may all be connected to the plurality of air flow channels 105 in a one-to-one correspondence, or a portion of the remaining plurality of air outlets 303 may be connected to the plurality of air flow channels 105 in a one-to-one correspondence, and the remaining portion may directly lead to the paving space 101.

[0095] Alternatively, as Figure 10 and Figure 11As shown, the air inlet 302 and the multiple air outlets 303 are arranged on the same side of the diverter 300, and the air inlet 302 and the multiple air outlets 303 are all facing the carrier body 100. In the embodiment where the carrier body 100 has a multi-layer cylindrical structure, the air inlet 302 is connected to the axial channel of the innermost porous layer 110, and at least a portion of the multiple air outlets 303 are respectively connected to the multiple air flow channels 105, that is, the multiple air outlets 303 can all be connected to the multiple air flow channels 105 in a one-to-one correspondence, or a portion of the multiple air outlets 303 can be connected to the multiple air flow channels 105 in a one-to-one correspondence, and the other portion directly leads to the paving space 101. Optionally, the carrier structure 1000 further includes a flow guide 400, which is inserted into the axial channel of the innermost porous layer 110 and connected to the air inlet 302.

[0096] Optionally, the wall of the flow guide tube 400 is provided with a plurality of second pores. In embodiments where the axial channel of the innermost porous layer 110 is not provided with a powdered matrix, the pore diameter of the second pores is not limited. In embodiments where the axial channel of the innermost porous layer 110 is provided with a powdered matrix, the pore diameter of the second pores is smaller than the particle size of the powdered matrix.

[0097] Taking the embodiment of "at least a portion of the plurality of air outlets 303 are respectively connected to the plurality of air flow channels 105" as the first connection mode of the diverter 300 and the carrier body 100, the present application also provides other embodiments. In other embodiments, the diverter 300 and the carrier body 100 have a second connection mode, such as Figure 12 and Figure 13 As shown, the carrier body 100 does not have an air flow channel 105, and the multiple gas outlets 303 of the diverter 300 lead to the laying space 101, thereby directly replenishing the vapor deposition gas into the laying space 101. Specifically:

[0098] like Figure 12 As shown, the air inlet 302 and the plurality of air outlets 303 are respectively arranged on both sides of the diverter 300, the plurality of air outlets 303 face the carrier body 100, one of the plurality of air outlets 303 is arranged corresponding to the axial channel of the innermost porous layer 110, and at least a part of the plurality of air outlets 303 lead to the laying space 101. In this embodiment, the air pressure and carbon content of the laying space 101 near the diverter 300 are relatively large, and the gas in the axial channel is not easy to diffuse outward from the position near the diverter 300, but is easier to diffuse from the position of the laying space 101 away from the diverter 300, thereby ensuring the carbon content of the gas at one end away from the diverter 300.

[0099] like Figure 13As shown, the air inlet 302 and the multiple air outlets 303 are arranged on the same side of the diverter 300, and the air inlet 302 and the multiple air outlets 303 are all facing the carrier body 100. The air inlet 302 is connected to the axial channel of the innermost porous layer 110, and at least a part of the multiple air outlets 303 are respectively connected to the multiple air flow channels 105. In this embodiment, the vapor deposition gas enters the axial channel of the innermost porous layer 110 of the carrier body 100 from the end away from the diverter 300. The carbon content of the gas in the paving space 101 away from the diverter 300 is relatively large. The vapor deposition gas flowing along the first direction X in the axial channel of the innermost porous layer 110 is collected and refluxed into the paving space 101 under the blocking effect of the diverter 300, thereby improving the utilization rate of the vapor deposition gas, thereby increasing the thickness of the graphene layer at the end away from the diverter 300.

[0100] Optionally, the end of the carrier body 100 facing away from the diverter 300 is open. The open arrangement herein refers to providing a porous material at the end of the carrier body 100 facing away from the diverter 300, or blocking or omitting the airflow channel 105 at the end of the carrier body 100 facing away from the diverter 300, thereby isolating two airflow spaces 104 with different air pressures and allowing some gas to diffuse through the porous material provided at the end of the carrier body 100 facing away from the diverter 300. By providing an open end of the carrier body 100 facing away from the diverter 300, the efficiency of the vapor deposition gas flow renewal along the first direction X is accelerated, resulting in uniform deposition of the graphene layer not only in the second direction Y but also in the first direction X.

[0101] In some embodiments, the ratio of the thickness of the porous layer 110 to the thickness of the paving space 101 is 1:1-1:6. That is, the spacing distance between two adjacent porous layers 110 is greater than or equal to 1:1-1:6, so that the thickness of the porous layer 110 to the thickness of the paving space 101 (i.e., the thickness of the paved powder matrix) can be set to 1:1-1:6. If the spacing distance is greater than the thickness of the paving space 101, the remaining portion can serve as the airflow channel 105. By setting the ratio of the thickness of the porous layer 110 to the thickness of the paved powder matrix to 1:1-1:6, the powder matrix is ​​prevented from being too thick and hindering gas diffusion, so that a uniform graphene layer is deposited on each layer of the powder matrix in the second direction Y.

[0102] In some embodiments, the porous material used in the carrier body 100 has a pore size of 100 nm-100 μm, so that the pore size is smaller than the particle size of the powdered matrix.

[0103] In some embodiments, the porous material used in the carrier body 100 has a porosity of 20%-80% so as to meet the requirement of fully diffusing the vapor deposition gas.

[0104] In a second aspect, an embodiment of the present application further provides a method for vapor-depositing graphene on the surface of a powdery substrate, comprising:

[0105] S1 provides a support structure 1000 for vapor-depositing graphene on a surface of a powdery substrate according to any one of the first aspects;

[0106] S2: laying the powdery matrix along the first direction X in the laying space 101 of the carrier structure 1000;

[0107] The S3 carrier structure 1000 has two airflow spaces 104 arranged opposite to each other along the second direction Y. Vapor deposition gas is introduced into at least one airflow space 104 to form a pressure difference between the two airflow spaces 104, so that the vapor deposition gas diffuses along the second direction Y, and the second direction Y is perpendicular to the first direction X.

[0108] In step S3, when the vapor deposition gas is introduced into the two airflow spaces 104 respectively, the ratio of the flow rates of the two airflow spaces 104 is 1.05-2, and illustratively, is 1.05, 1.1, 1.3, 1.5, 1.7, 1.9 or 2. Optionally, in an embodiment in which the carrier body 100 has a cylindrical structure, the air pressure of the airflow space 104 formed in the axial channel of the innermost porous layer 110 is greater than the air pressure of the airflow space 104 formed on the side of the outermost porous layer 110 facing away from the laying space 101, so that the vapor deposition gas diffuses evenly from the inside to the outside.

[0109] In some embodiments, in step S1, the provided carrier structure 1000 includes at least one porous layer 110. In step S2, the ratio of the layer thickness of the porous layer 110 to the laying thickness of the powder matrix is ​​1:1-1:6 to avoid the powder matrix being too thick and hindering gas diffusion, so that the powder matrix in the second direction Y deposits a uniform graphene layer at each layer.

[0110] In the description of this application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the product of the application is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as a limitation on this application. In addition, if the terms "first", "second", etc. appear in the description of this application, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0111] Furthermore, the use of terms such as "horizontal" and "vertical" in the description of this application does not necessarily imply that a component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical" and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0112] It should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. A person of ordinary skill in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0113] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A carrier structure for vapor deposition of graphene on the surface of a powdery substrate, characterized in that: include: The carrier body has a laying space extending along a first direction, and a first side and a second side arranged opposite to each other along a second direction, the first direction is perpendicular to the second direction, the laying space is used to lay a powdered matrix, the carrier body is made of a porous material, the pore size of the carrier body is smaller than the particle size of the powdered matrix, the first side and / or the second side has an air flow space for the circulation of vapor deposition gas, so that a pressure difference can be formed between the first side and the second side, thereby allowing the vapor deposition gas to diffuse along the second direction.

2. The support structure for vapor deposition of graphene on the surface of a powdery substrate according to claim 1, characterized in that: The carrier body includes n porous layers, which are spaced apart along the second direction to form the paving space between two adjacent porous layers, and the first porous layer and the nth porous layer respectively form the airflow space on the side away from the paving space, where n≥2.

3. The support structure for vapor deposition of graphene on the surface of a powdery substrate according to claim 2, characterized in that: Each porous layer is a cylindrical structure extending along the first direction, and n porous layers are sequentially spaced and arranged along the second direction to form (n-1) annular paving spaces, and at least the central channel of the innermost porous layer and the side of the outermost porous layer facing away from the paving space form the airflow space.

4. The support structure for vapor deposition of graphene on the surface of a powdery substrate according to claim 2 or 3, characterized in that: The carrier structure further comprises: An air flow channel is provided between two adjacent porous layers to introduce vapor deposition gas into the laying space.

5. The carrier structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 4, characterized in that: The air flow channel is a layered space; Between two adjacent porous layers, the paving space is located on the surface of one of the porous layers, and the air flow channel is located on the surface of the other porous layer.

6. The carrier structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 4, characterized in that: The air flow channel is a columnar channel extending along the first direction, and a plurality of the air flow channels are arranged at intervals in each of the laying spaces.

7. The carrier structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 6, characterized in that: The air flow channels of two adjacent laying spaces are staggered with each other.

8. The support structure for vapor deposition of graphene on the surface of a powdery substrate according to claim 6, characterized in that: The carrier body is cross-sectioned along the second direction, and 3-5 air flow channels are provided per unit square decimeter of cross-sectional area.

9. The support structure for vapor deposition of graphene on the surface of a powdery substrate according to claim 6, characterized in that: The carrier structure further comprises: A ventilation pipe is inserted into the laying space to form the air flow channel.

10. The support structure for vapor-phase deposition of graphene on the surface of a powdery substrate according to claim 9, characterized in that: The tube wall of the ventilation tube is provided with a plurality of first air holes, and the aperture of the first air holes is smaller than the particle diameter of the powdery matrix.

11. The carrier structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 6, characterized in that: The carrier structure further comprises: A diverter is located at one end of the carrier body in the first direction. The diverter is provided with a diverter space, an air inlet and a plurality of air outlets. The air inlet and the plurality of air outlets are respectively connected to the diverter space. The air inlet is used to supply gas-phase deposition gas to enter, and the plurality of air outlets are all used to supply gas-phase deposition gas to flow out. The plurality of air outlets are at least connected to the airflow channel.

12. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 11, characterized in that: The air inlet and the plurality of air outlets are respectively arranged on both sides of the diverter, and the plurality of air outlets face the carrier body; One of the plurality of air outlets is arranged corresponding to the axial channel of the innermost porous layer, and at least a portion of the remaining plurality of air outlets are respectively communicated with the plurality of air flow channels.

13. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 11, characterized in that: The air inlet and the plurality of air outlets are arranged on the same side of the diverter, and the air inlet and the plurality of air outlets are all facing the carrier body; The air inlet is communicated with the axial channel of the innermost porous layer, and at least a portion of the plurality of air outlets are respectively communicated with the plurality of air flow channels.

14. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 13, characterized in that: The carrier structure further comprises: The flow guide tube is inserted into the axial channel of the innermost porous layer and communicated with the air inlet.

15. The support structure for vapor-phase deposition of graphene on the surface of a powdery substrate according to claim 14, characterized in that: The pipe wall of the flow guide pipe is provided with a plurality of second air holes.

16. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 11, characterized in that: One end of the carrier body facing away from the diverter is open.

17. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 2, characterized in that: The ratio of the thickness of the porous layer to the thickness of the laying space is 1:1-1:

6.

18. The support structure for vapor-depositing graphene on the surface of a powdery substrate according to claim 1, characterized in that: The pore size of the porous material is 100 nm-100 μm; and / or the porosity of the porous material is 20%-80%.

19. A method for vapor deposition of graphene on the surface of a powdery substrate, characterized in that: include: Providing a carrier structure for vapor-depositing graphene on a surface of a powdery substrate according to any one of claims 1 to 18, wherein the carrier structure has a laying space extending along a first direction; laying a powdery matrix in the laying space of the carrier structure; The carrier structure includes two airflow spaces arranged opposite to each other along a second direction. Vapor deposition gas is introduced into at least one of the airflow spaces to form a pressure difference so that the vapor deposition gas diffuses along the second direction, which is perpendicular to the first direction.

20. The method for vapor deposition of graphene on the surface of a powdery substrate according to claim 19, characterized in that: Vapor deposition gas is introduced into the two air flow spaces respectively, and the ratio of the flow rates of the two air flow spaces is 1.05-2.

21. The method for vapor-depositing graphene on the surface of a powdery substrate according to claim 20, characterized in that: The carrier structure includes at least one porous layer, and the ratio of the layer thickness of the porous layer to the laying thickness of the powdery matrix is ​​1:1-1:6.

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