Refrigerator and control method of water dispenser of refrigerator

Abstract

The invention discloses a refrigerator and a control method of a water dispenser of the refrigerator, and the refrigerator comprises a refrigerator body, a water dispenser, a water dispenser and a control device, the water dispenser comprises a water storage tank arranged in the storage chamber; the semiconductor module is provided with a first surface and a second surface which are opposite to each other, and the first surface is in contact with the outer side wall of the water storage tank; the power supply module is used for supplying power to the semiconductor module; when the semiconductor module is electrified in a forward direct current mode, the first surface forms a refrigerating surface, the second surface forms a heating surface, and when the semiconductor module is electrified in a reverse direct current mode, the first surface forms a heating surface, and the second surface forms a refrigerating surface. According to the water dispenser, the water tank of the water dispenser is refrigerated or heated through the semiconductor module, drinking water meeting the set temperature of a user is provided, and the use experience of the user is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of household appliances, and in particular to a refrigerator and a control method for a water dispenser of the refrigerator. Background Art

[0002] With scientific advancements and socioeconomic development, people's living standards are improving, and refrigerators have become a must-have appliance in almost every household. Currently, there are more and more types of refrigerators on the market, with different appearances and increasingly diverse functions. Refrigerators with water dispensers are becoming increasingly popular, allowing users to drink cold water and beverages at any time, greatly satisfying their needs.

[0003] Current refrigerators with water dispensers typically only dispense chilled water. Without a separate cooling system for the dispenser, the water temperature typically matches the refrigerator compartment temperature, failing to meet user needs. To provide hot water above room temperature, a separate heating system is required in addition to the cooling system, increasing the load on the control panel. Furthermore, heating the water by the heating system increases the load on the cooling system. Summary of the Invention

[0004] The purpose of the embodiment of the present invention is to provide a control method for a refrigerator and a water dispenser of the refrigerator, which uses a semiconductor module to realize cooling or heating of the water tank of the water dispenser, providing drinking water that meets the temperature set by the user, and effectively improving the user experience.

[0005] To achieve the above object, an embodiment of the present invention provides a refrigerator, comprising:

[0006] The box body has a storage compartment inside;

[0007] a water dispenser, comprising a water tank disposed within the storage compartment;

[0008] a semiconductor module having a first surface and a second surface opposite to each other, the first surface being in contact with an outer sidewall of the water storage tank;

[0009] A power module is used to supply power to the semiconductor module; when forward DC power is applied to the semiconductor module, the first surface forms a cooling surface and the second surface forms a heating surface; when reverse DC power is applied to the semiconductor module, the first surface forms a heating surface and the second surface forms a cooling surface.

[0010] As an improvement to the above solution, the refrigerator further includes a controller connected to the power module, and the controller is configured to:

[0011] When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment.

[0012] As an improvement to the above solution, the controller is further configured to:

[0013] When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

[0014] As an improvement to the above solution, the refrigerator further includes a temperature sensor, which is disposed in the water tank and is used to detect the actual water temperature in the water tank; the controller is also connected to the temperature sensor, and is further used to:

[0015] Get the user-set water temperature;

[0016] Obtaining the actual water temperature detected by the temperature sensor;

[0017] When the actual water temperature is greater than the user-set water temperature, it is determined that the cooling demand for the water storage tank is currently met;

[0018] When the actual water temperature is lower than the user-set water temperature, it is determined that the heating demand for the water tank is currently met.

[0019] As an improvement to the above solution, the controller is further configured to:

[0020] Calculating the difference between the user-set water temperature and the actual water temperature as the water temperature difference;

[0021] According to a preset correspondence between the water temperature difference and the current value, determining the current value corresponding to the current water temperature difference as the target current value;

[0022] The power supply module is controlled to supply a current to the semiconductor module to reach the target current value.

[0023] As an improvement to the above solution, the controller is further configured to:

[0024] When the actual water temperature is equal to the user-set water temperature, the power supply module is controlled to cut off the power supply to the semiconductor module.

[0025] As an improvement to the above-mentioned solution, the semiconductor module includes a first insulator and a second insulator arranged opposite to each other, an N-type semiconductor element and a P-type semiconductor element are arranged between the first insulator and the second insulator, and the N-type semiconductor element and the P-type semiconductor element are connected by a metal conductor, and the metal conductor is used to connect the power module.

[0026] As an improvement to the above solution, a heat-conducting layer is coated on the outer surfaces of the first insulator and the second insulator.

[0027] As an improvement to the above solution, the water tank is further provided with a water inlet, a water inlet pipe and a water inlet valve. The water inlet of the water tank is connected to an external water source through the water inlet pipe. The water inlet valve is connected to the water inlet pipe and the water inlet to control the opening or closing of the water inlet.

[0028] The water storage tank is also provided with a water outlet pipe and a water outlet valve. The water outlet valve is provided on the water outlet pipe and is used to control the opening or closing of the water outlet pipe.

[0029] An embodiment of the present invention further provides a method for controlling a water dispenser of a refrigerator, wherein the refrigerator is any one of the refrigerators described above; the method comprises:

[0030] When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment;

[0031] When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

[0032] Compared to existing technologies, the control method for a refrigerator and its water dispenser disclosed in this invention employs a semiconductor module installed within the refrigerator. By applying a DC current in either the forward or reverse direction to the semiconductor module, the surface in contact with the water tank is controlled to form a cooling or heating surface, thereby cooling or heating the water tank. This ensures that the water temperature within the tank reaches the user's desired drinking water temperature, providing drinking water at the desired temperature. This embodiment of the invention replaces separate cooling and heating systems with a single semiconductor module, resolving the existing issues of requiring both a cooling and heating system, significantly increasing the load on the control panel and complicating the refrigerator structure. This effectively improves the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1This is a first structural schematic diagram of a refrigerator provided by an embodiment of the present invention;

[0034] Figure 2 This is a second structural diagram of a refrigerator according to an embodiment of the present invention.

[0035] Figure 3 1 is a schematic structural diagram of a refrigeration system of a refrigerator according to an embodiment of the present invention;

[0036] Figure 4 is a third structural schematic diagram of a refrigerator according to an embodiment of the present invention;

[0037] Figure 5 is a fourth structural schematic diagram of a refrigerator according to an embodiment of the present invention;

[0038] Figure 6 is a schematic structural diagram of the functional system of a refrigerator in an embodiment of the present invention;

[0039] Figure 7 1 is a schematic diagram of the working process of the controller of the refrigerator in an embodiment of the present invention;

[0040] Figure 8 is a schematic structural diagram of a water dispenser and a semiconductor module in an embodiment of the present invention;

[0041] Figure 9 Schematic diagram of the principle of the semiconductor module under forward DC power supply in an embodiment of the present invention;

[0042] Figure 10 Schematic diagram of the principle of the semiconductor module under reverse DC power supply in an embodiment of the present invention. DETAILED DESCRIPTION

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0044] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0045] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0047] See also Figure 1 , is a first structural schematic diagram of a refrigerator provided by an embodiment of the present invention. The refrigerator 10 of this embodiment is approximately rectangular in shape and includes a housing 11 defining a storage space and a plurality of doors 12 disposed at the housing opening. The doors include a door shell located outside the housing, a door liner located inside the housing, an upper end cover, a lower end cover, and an insulation layer located between the door shell, the door liner, the upper end cover, and the lower end cover. Typically, the insulation layer is filled with foam. The housing is provided with a chamber, wherein the chamber includes a component storage cavity for placing components in the refrigerator, such as a compressor compartment, and also includes storage space for storing food, etc.

[0048] See also Figure 2 , is a second structural diagram of a refrigerator in an embodiment of the present invention. The storage space can be divided into multiple storage compartments 13. Storage compartments can be configured as refrigerators and freezers according to different uses. They can also include variable temperature rooms, vacuum drawers, moisturizing drawers, etc. Each storage compartment corresponds to one or more doors, for example, Figure 2 The upper storage compartment has a double-door body. The door can be pivotally mounted at the opening of the refrigerator body and can also be opened like a drawer to enable drawer-style storage. The refrigerator door is equipped with a display screen for displaying prompts and receiving user touch operations.

[0049] See also Figure 3 , Figure 3The schematic diagram of the structure of the refrigeration system of the refrigerator in the embodiment of the present invention, the refrigerator performs refrigeration operation through the refrigeration system 14, provides cold energy to be transmitted to the storage chamber, so that the storage chamber is maintained at a constant low temperature state. The refrigeration system includes a compressor 141, an evaporator 142, a drying filter (not shown in the figure), a capillary tube 143, a condenser 144 and a gas-liquid separator (not shown in the figure). The working process of the refrigeration system includes a compression process, a condensation process, a throttling process and an evaporation process. Among them, the compression process is: when the power cord of the refrigerator is plugged in, when there is a cooling demand for the cabinet, the compressor 141 starts to work, and the low-temperature, low-pressure refrigerant is sucked into the compressor 141, and is compressed into a high-temperature, high-pressure superheated gas in the cylinder of the compressor 141 and then discharged to the condenser 144; the condensation process is: the high-temperature, high-pressure refrigerant gas dissipates heat through the condenser 144, the temperature continues to drop, and is gradually cooled to a saturated vapor at room temperature and high pressure, and further cooled to a saturated liquid, and the temperature no longer drops. The temperature at this time is called the condensation temperature, and the pressure of the refrigerant remains almost unchanged during the entire condensation process; the throttling process is as follows: The process is as follows: the saturated refrigerant liquid after condensation is filtered out of moisture and impurities through a drying filter and then flows into the capillary tube 143, through which it is throttled and depressurized, and the refrigerant becomes wet steam at room temperature and low pressure; the evaporation process is as follows: the wet steam at room temperature and low pressure begins to absorb heat and vaporize in the evaporator 142, which not only reduces the temperature of the evaporator 142 and its surroundings, but also turns the refrigerant into a low-temperature, low-pressure gas. The refrigerant coming out of the evaporator 142 passes through the gas-liquid separator and returns to the compressor 141 again, repeating the above process to transfer the heat in the refrigerator to the air outside the box, thereby achieving the purpose of refrigeration.

[0050] See also Figure 4 and Figure 5 , Figure 4 is a third structural diagram of a refrigerator according to an embodiment of the present invention, Figure 5 This is a fourth structural diagram of a refrigerator in an embodiment of the present invention. The refrigerator 10 further includes a water dispenser 15. The water dispenser 15 includes a water tank 151. The water tank 151 is used to store pure water. The water tank 151 is arranged in the storage compartment 13.

[0051] Preferably, the water tank 151 is further provided with a water inlet 152, a water inlet pipe 153, and a water inlet valve 154. The water inlet 152 of the water tank 151 is connected to an external water source via the water inlet pipe 153. The water inlet valve 154 connects the water inlet pipe 153 and the water inlet 152 to control the opening or closing of the water inlet 152. The water inlet 152, the water inlet pipe 153, and the water inlet valve 154 control the addition of water from the external water source to the water tank 151.

[0052] Optionally, one end of the water inlet pipe 153 is connected to the water purification system, and the other end is connected from the outside of the refrigerator through the refrigerator hinge cover, through the hinge axis, and through the door foam layer to the water inlet valve 154. When the water inlet valve 154 is opened, purified water enters the water tank. It is understood that the pipe water inlet method is not limited to the above-mentioned structural position and method, and can enter from the bottom through the foam layer, or manually add water to the water tank.

[0053] Water tank 151 is also equipped with a water outlet pipe 155 and a water outlet valve 156. The water outlet valve 156 is located on the water outlet pipe 155 and is used to control the opening and closing of the water outlet pipe 155. The water outlet pipe 155 is connected to the water outlet on the refrigerator door. Through the water outlet pipe 155 and the water outlet valve 156, water is controlled to flow out of the water tank 151 for drinking by the user. When the water temperature reaches the required level and the user begins to draw water, the water outlet valve 156 opens, filling the user's cup.

[0054] The refrigerator 10 also includes a semiconductor module 16 having a first surface and a second surface opposing each other, with the first surface contacting the outer wall of the water tank 151. When powered on, the semiconductor module 16 can provide cooling or heating to the outside through the first surface or the second surface, thereby cooling or heating the water tank 151.

[0055] Preferably, the first surface is in fixed contact with the bottom of the water tank 151 .

[0056] Preferably, the water tank 151 and the semiconductor module 16 are disposed within the foam layer inside the door 12. The water tank 151 is fixedly mounted between the door foam layer and the semiconductor module 16. The water inlet 152 is located at the top of the water tank 151, through which water enters. The bottom of the water tank 151 contacts the first surface of the semiconductor module.

[0057] The refrigerator 10 also includes a power supply module for supplying power to the semiconductor module 16; when forward DC power is supplied to the semiconductor module 16, the first surface forms a cooling surface and the second surface forms a heating surface; when reverse DC power is supplied to the semiconductor module 16, the first surface forms a heating surface and the second surface forms a cooling surface.

[0058] Using the technical means of the embodiments of the present invention, a semiconductor module is installed in the refrigerator. By supplying a DC current in the forward or reverse direction to the semiconductor module, the surface in contact with the water tank is controlled to form a cooling or heating surface, thereby cooling or heating the water tank. This allows the water in the tank to reach the user's desired drinking water temperature, providing drinking water that meets the user's set temperature. The embodiments of the present invention replace separate cooling and heating systems with a single semiconductor module, resolving the existing problem of requiring a separate cooling and heating system, which significantly increases the load on the control board and complicates the refrigerator structure. This effectively improves the user experience.

[0059] As a preferred embodiment, the refrigerator 10 further includes a controller, see Figure 6 , is a structural diagram of the functional system of the refrigerator in an embodiment of the present invention, wherein the controller is connected to various functional modules, such as the refrigeration system 14, the semiconductor module 16, the power module, the water inlet valve 154, the water outlet valve 156, the control display panel of the refrigerator, etc.

[0060] See also Figure 7 , is a schematic diagram of the workflow of the controller of the refrigerator in an embodiment of the present invention, wherein the controller is configured to perform the following steps:

[0061] When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment.

[0062] When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

[0063] In an embodiment of the present invention, a working demand on the water storage tank is detected, and the working demand is a cooling demand or a heating demand.

[0064] When there is a need to cool the water tank 151, the power module is controlled to supply forward DC power to the semiconductor module 16. The first surface of the semiconductor module 16 forms a cooling surface, which absorbs heat from the water tank 151 to reduce the temperature of the water in the water tank 151, thereby achieving the purpose of cooling the water in the water tank 151. The second surface of the semiconductor module 16 forms a heating surface. Since the internal temperature of the storage compartment 13 of the refrigerator is relatively low, the semiconductor module 16 can dissipate heat through the storage compartment 13, solving the problem of heat dissipation at the hot end. There is no need to additionally set up a heat sink and a heat dissipation fan, which does not affect the service life of the semiconductor module 16.

[0065] When there is a need to heat the water tank 151, the power module is controlled to supply reverse DC power to the semiconductor module 16. The first surface of the semiconductor module 16 forms a heating surface to heat the water tank 151, thereby increasing the temperature of the water in the water tank 151 and achieving the purpose of heating the water in the water tank 151. The second surface of the semiconductor module 16 forms a cooling surface to provide additional cooling to the storage compartment 13 of the refrigerator. This cooling energy can be used to meet the cooling demand of the refrigerator compartment, thereby fully utilizing the cooling energy and reducing energy consumption.

[0066] When the cooling demand and the heating demand for the water tank are not met at the same time, the power supply module is controlled to cut off the power supply to the semiconductor module.

[0067] As a preferred embodiment, the refrigerator further includes a temperature sensor 17, which is disposed within the water tank 151 and is configured to detect the actual water temperature Tr within the water tank. The controller is also connected to the temperature sensor 17. In this embodiment of the present invention, the actual water temperature Tr detected by the temperature sensor 17 is used to determine whether the water tank 151 requires cooling or heating.

[0068] Specifically, the controller is further configured to:

[0069] Get the user-set water temperature;

[0070] Obtaining the actual water temperature detected by the temperature sensor;

[0071] When the actual water temperature is greater than the user-set water temperature, it is determined that the cooling demand for the water storage tank is currently met;

[0072] When the actual water temperature is lower than the user-set water temperature, it is determined that the heating demand for the water tank is currently met.

[0073] When the actual water temperature is equal to the user-set water temperature, the power supply module is controlled to cut off the power supply to the semiconductor module.

[0074] In the embodiment of the present invention, the controller first obtains the user-set water temperature Ts, where the user-set water temperature Ts is used to represent the user's temperature requirement for drinking water.

[0075] Preferably, the refrigerator further includes a control display panel, and the controller obtains the user-set water temperature Ts input by the user through the control display panel. Of course, the user-set water temperature Ts input by the user can also be obtained through other methods such as a voice module, a button, etc., which does not affect the beneficial effects achieved by the present invention.

[0076] Furthermore, the controller obtains the actual water temperature Tr collected by the temperature sensor 17 in real time or periodically, and compares the size relationship between the user-set water temperature Ts and the actual water temperature Tr.

[0077] When the actual water temperature is greater than the user-set water temperature, that is, Tr>Ts, it indicates that there is a demand for cooling the water tank at this moment. The power module is controlled to supply forward DC power to the semiconductor module 16. The first surface of the semiconductor module 16 forms a cooling surface, absorbing heat from the water tank 151 to reduce the temperature of the water in the water tank 151, thereby achieving the purpose of cooling the water in the water tank 151. The second surface of the semiconductor module 16 forms a heating surface. Since the internal temperature of the storage compartment 13 of the refrigerator is relatively low, the semiconductor module 16 can dissipate heat through the storage compartment 13.

[0078] When the actual water temperature is lower than the user-set water temperature, that is, Tr<Ts, it indicates that there is a need to heat the water tank at this moment. The power module is controlled to supply reverse DC power to the semiconductor module 16. The first surface of the semiconductor module 16 forms a heating surface to heat the water tank 151, so that the temperature of the water in the water tank 151 is increased, thereby achieving the purpose of heating the water in the water tank 151. The second surface of the semiconductor module 16 forms a cooling surface to provide additional cooling to the storage compartment 13 of the refrigerator.

[0079] When the actual water temperature equals the user-set water temperature, that is, Tr = Ts, indicating that there is no cooling or heating demand at this moment, the power module is controlled to disconnect the power supply to the semiconductor module. In addition, the controller can also issue a corresponding prompt message through the control display panel to remind the user to connect the water directly.

[0080] It should be noted that the user-set water temperature can be the water temperature that the water in the water tank needs to reach under the default state set by the user. Therefore, the controller controls the power on and off and current direction of the power module in real time by comparing the size relationship between the user-set water temperature and the actual water temperature.

[0081] In addition, the user-set water temperature may also be the water temperature that the water in the water tank needs to reach at the current moment, which is set by the user. When receiving the user's adjustment of the user-set water temperature, the controller is further configured to:

[0082] Calculating the difference between the user-set water temperature and the actual water temperature as the water temperature difference;

[0083] According to a preset correspondence between the water temperature difference and the current value, determining the current value corresponding to the current water temperature difference as the target current value;

[0084] The power supply module is controlled to supply a current to the semiconductor module to reach the target current value.

[0085] In this embodiment of the present invention, if a user demands drinking water at a different set temperature within a short period of time, upon receiving a request to adjust the user-set water temperature, the water dispenser is required to quickly adjust the water temperature in the water tank 151 to the user-set water temperature Ts. Assuming the adjustment duration is a fixed value, defaulted to t, a table of correspondences between water temperature differences and current values ​​is constructed based on prior knowledge or experimental testing. This table records the current required to increase or decrease the current actual water temperature Tr to the user-set water temperature Ts within the default adjustment duration t. In this case, the greater the water temperature difference, the greater the current value, and therefore the greater the output power of the power module.

[0086] In actual use, when a user adjusts the user-set water temperature, the difference ΔT = |Ts-Tr| between the user-set water temperature and the actual water temperature is calculated as the water temperature difference. The corresponding relationship table is retrieved to find the target current value corresponding to the current water temperature difference, and the power module is controlled to supply the semiconductor module with a current that reaches the target current value. Specifically, if the cooling demand for water tank 151 is currently met, the power module is controlled to supply forward DC power to the semiconductor module, and the current reaches the target current value. If the heating demand for water tank 151 is currently met, the power module is controlled to supply reverse DC power to the semiconductor module, and the current reaches the target current value.

[0087] By adopting the technical means of the embodiments of the present invention, the current actual water temperature of the water tank is detected in real time and compared with the user-set temperature to control the on / off state, current direction and current value of the power module, thereby realizing cooling or heating of the water tank, so that the water temperature in the water tank reaches the drinking water temperature required by the user, providing drinking water that meets the user-set temperature, and effectively improving the user experience.

[0088] Preferably, a water level sensor 18 is further installed in the water tank 151. The water level sensor 18 is used to detect the amount of water in the water tank 151. The controller is also connected to the water level sensor 18 and is further used to:

[0089] Obtaining the water volume detected by the water temperature sensor;

[0090] When the water volume is less than a preset water volume threshold, the water inlet valve is controlled to open to replenish water into the water tank.

[0091] By adopting the technical means of the embodiment of the present invention, the current water volume of the water tank is detected by a water level sensor, thereby achieving timely water replenishment of the water tank and preventing dry burning.

[0092] As a preferred embodiment, the embodiment of the present invention is further implemented in real time based on any of the above embodiments. Figure 8 , is a schematic diagram of the structure of a water dispenser and semiconductor module in an embodiment of the present invention. The semiconductor module 16 comprises a first insulator 161 and a second insulator 162 arranged opposite each other. A semiconductor element 163 is disposed between the first insulator 161 and the second insulator 162. The semiconductor element 163 comprises an N-type semiconductor element and a P-type semiconductor element. The N-type and P-type semiconductor elements are connected via a metal conductor 164, which is used to connect to the power module. The first insulator 161 forms the first surface of the semiconductor module 16, and the second insulator 162 forms the second surface of the semiconductor module 16.

[0093] Preferably, a heat conductive layer 165 is coated on the outer surfaces of the first insulator 161 and the second insulator 162. The first surface of the semiconductor module 16 is fixedly contacted with the water tank 151 through the heat conductive layer, and the second surface is fixedly contacted with the door liner through the heat conductive layer.

[0094] Optionally, the heat-conducting layer is thermally conductive silicone grease, which is used to improve the cooling and heat conduction capabilities of the semiconductor module 16 and increase the speed of cooling or heating the water in the water tank 151.

[0095] See also Figure 9 and Figure 10 , Figure 9 Schematic diagram of the principle of the semiconductor module under forward DC power supply in an embodiment of the present invention. Figure 10 This is a schematic diagram of the principle of a semiconductor module under reverse direct current in an embodiment of the present invention. In this embodiment of the present invention, semiconductor cooling is thermoelectric cooling, also known as thermoelectric cooling. This cooling method is based on the thermoelectric phenomenon and utilizes the Peltier effect, the reverse reaction of the Seebeck effect, to achieve cooling. The Seebeck effect refers to the phenomenon that in a closed circuit composed of two dissimilar metals, if the two contact points are kept at different temperatures, a potential difference, known as contact electromotive force, is generated between the two contact points, and a current flows through the closed circuit, which is called thermoelectric current. Conversely, if direct current is applied to a closed circuit composed of two dissimilar metals, one contact point becomes colder and the other becomes hotter. This is known as the Peltier effect, also known as the thermoelectric phenomenon. The internal structural characteristics of semiconductor materials determine that the thermoelectric phenomenon they produce is much more significant than that of other metals. Therefore, direct thermoelectric cooling always uses semiconductor cooling materials, namely semiconductor cooling.

[0096] In the semiconductor module, a P-type semiconductor element and an N-type semiconductor element are connected to form a semiconductor thermocouple. The carriers (holes) in the P-type semiconductor and the carriers (electrons) in the N-type semiconductor move under the influence of an external electric field. Several pairs of semiconductor thermocouples are connected in series in the circuit, but in parallel for heat transfer, forming a common cooling thermopile.

[0097] See also Figure 9 When an N-type semiconductor element is connected to the positive terminal of a power supply and a P-type semiconductor element to the negative terminal, that is, when forward DC current is applied, the current direction at the upper junction is NP, and the current direction at the lower junction is PN. Electron-hole pairs are generated near the upper junction, reducing internal energy and temperature, and absorbing heat to the environment. This junction is called the cold junction. The other end, due to the recombination of electron-hole pairs, increases internal energy, increases temperature, and releases heat to the environment. This junction is called the hot junction.

[0098] See also Figure 10 If the power supply is reversed, the temperature at the junction changes in the opposite direction. When an N-type semiconductor element is connected to the negative terminal of the power supply and a P-type semiconductor element to the positive terminal, that is, when the DC power supply is connected, the current direction at the upper junction is PN, and the current direction at the lower junction is NP. Electron-hole pairs are generated near the lower junction, reducing the internal energy, lowering the temperature, and absorbing heat to the environment. This junction is called the cold junction. The upper junction, due to the recombination of electron-hole pairs, increases the internal energy, increases the temperature, and releases heat to the environment. This junction is called the hot junction.

[0099] By adopting the technical means of the embodiments of the present invention, a PN junction composed of special semiconductor materials is used to form a thermocouple pair. By changing the polarity of the DC current, cooling or heating is determined on the same refrigeration plate. A semiconductor refrigeration device can replace separate cooling and heating systems, solving the problem of the need to install a cooling system and a heating system in the prior art, which significantly increases the control board load and complicates the refrigerator structure, and effectively improves the user experience.

[0100] An embodiment of the present invention further provides a method for controlling a water dispenser of a refrigerator, wherein the refrigerator is a refrigerator as described in any of the above embodiments. The method includes:

[0101] When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment;

[0102] When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

[0103] Preferably, the method further comprises:

[0104] Get the user-set water temperature;

[0105] Obtaining the actual water temperature detected by the temperature sensor;

[0106] When the actual water temperature is greater than the user-set water temperature, it is determined that the cooling demand for the water storage tank is currently met;

[0107] When the actual water temperature is lower than the user-set water temperature, it is determined that the heating demand for the water tank is currently met.

[0108] When the actual water temperature is equal to the user-set water temperature, the power supply module is controlled to cut off the power supply to the semiconductor module.

[0109] Preferably, the method further comprises:

[0110] Calculating the difference between the user-set water temperature and the actual water temperature as the water temperature difference;

[0111] According to a preset correspondence between the water temperature difference and the current value, determining the current value corresponding to the current water temperature difference as the target current value;

[0112] The power supply module is controlled to supply a current to the semiconductor module to reach the target current value.

[0113] By adopting the technical means of the embodiments of the present invention, a semiconductor module is set in the refrigerator. By passing a DC current in the forward or reverse direction through the semiconductor module, the surface of the semiconductor module in contact with the water tank is controlled to form a cooling surface or a heating surface. By detecting the current actual water temperature of the water tank in real time and comparing it with the user-set temperature, the on / off state, current direction and current value of the power module are controlled, thereby realizing cooling or heating of the water tank, so that the water temperature in the water tank reaches the drinking water temperature required by the user, providing drinking water that meets the user-set temperature, and effectively improving the user experience.

[0114] It should be noted that the control method of a refrigerator water dispenser provided in an embodiment of the present invention is identical to all process steps executed by a refrigerator controller in the above embodiment, and the working principles and beneficial effects of the two correspond one to one, so they will not be repeated here.

[0115] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing related hardware through a computer program. The program can be stored in a computer-readable storage medium, and when executed, the program can include the processes in the above-described method embodiments. The storage medium can be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0116] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A refrigerator, characterized in that: include: The box body has a storage compartment inside; a water dispenser, comprising a water tank disposed within the storage compartment; a semiconductor module having a first surface and a second surface opposite to each other, the first surface being in contact with an outer sidewall of the water storage tank; A power module is used to supply power to the semiconductor module; when forward DC power is applied to the semiconductor module, the first surface forms a cooling surface and the second surface forms a heating surface; when reverse DC power is applied to the semiconductor module, the first surface forms a heating surface and the second surface forms a cooling surface.

2. The refrigerator according to claim 1, wherein The refrigerator further includes a controller connected to the power module, and the controller is configured to: When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment.

3. The refrigerator according to claim 2, wherein: The controller is also used for: When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

4. The refrigerator according to claim 3, wherein The refrigerator further includes a temperature sensor, which is disposed in the water tank and is used to detect the actual water temperature in the water tank; the controller is also connected to the temperature sensor, and is further used to: Get the user-set water temperature; Obtaining the actual water temperature detected by the temperature sensor; When the actual water temperature is greater than the user-set water temperature, it is determined that the cooling demand for the water storage tank is currently met; When the actual water temperature is lower than the user-set water temperature, it is determined that the heating demand for the water tank is currently met.

5. The refrigerator according to claim 4, wherein: The controller is also used for: Calculating the difference between the user-set water temperature and the actual water temperature as the water temperature difference; According to a preset correspondence between the water temperature difference and the current value, determining the current value corresponding to the current water temperature difference as the target current value; The power supply module is controlled to supply a current to the semiconductor module to reach the target current value.

6. The refrigerator according to claim 4, wherein: The controller is also used for: When the actual water temperature is equal to the user-set water temperature, the power supply module is controlled to cut off the power supply to the semiconductor module.

7. The refrigerator according to any one of claims 1 to 6, characterized in that: The semiconductor module includes a first insulator and a second insulator arranged opposite to each other, an N-type semiconductor element and a P-type semiconductor element are arranged between the first insulator and the second insulator, and the N-type semiconductor element and the P-type semiconductor element are connected by a metal conductor, and the metal conductor is used to connect the power module.

8. The refrigerator according to claim 7, wherein: A heat-conducting layer is coated on the outer surfaces of the first insulator and the second insulator.

9. The refrigerator according to claim 1, wherein The water tank is also provided with a water inlet, a water inlet pipe and a water inlet valve. The water inlet of the water tank is connected to an external water source through the water inlet pipe. The water inlet valve is connected to the water inlet pipe and the water inlet to control the opening or closing of the water inlet. The water storage tank is also provided with a water outlet pipe and a water outlet valve. The water outlet valve is provided on the water outlet pipe and is used to control the opening or closing of the water outlet pipe.

10. A method for controlling a water dispenser of a refrigerator, characterized in that: The refrigerator is the refrigerator according to any one of claims 1 to 9; the method comprises: When the cooling demand for the water tank is met, the power module is controlled to supply forward DC power to the semiconductor module, so that the first surface forms a cooling surface to cool the water tank, and the second surface forms a heating surface to dissipate heat through the storage compartment; When the heating demand for the water tank is met, the power module is controlled to supply reverse DC power to the semiconductor module, so that the first surface forms a heating surface to heat the water tank, and the second surface forms a cooling surface to supplement the cooling of the storage compartment.

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